JP2002229057A - Method of manufacturing electro-optical device, the electro-optical device, electronic apparatus and thermocompression bonding equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of manufacturing an electro-optical device which is capable of aligning the terminals of a transparent substrate and the terminals of electronic components, then electrically connecting the terminals to each other without deteriorating electro-optical materials, an electro-optical device, electronic apparatus and thermocompression bonding equipment. SOLUTION: In manufacturing the electro-optical device, a transparent substrate 20 for holding liquid crystals 3 is first irradiated with light through a translucent stage 110 in the state of arranging the transparent substrate 20 in the upper position of the translucent stage 110, by which the observation of the positional relations between the transparent terminals of the transparent substrate and the terminals of a flexible substrate 40 is carried out, and the alignment of the terminals to each other is carried out according to the result of the observation. The transparent substrate 20 and the flexible substrate 40 are then compression bonded across anisotropic conductive materials on the translucent stage 110, by which the terminals are electrically connected to each other. Since a light-shielding section 111 for preventing irradiation of the liquid crystals 3 with the light is formed on the translucent stage 110, deterioration of the liquid crystals 3 by the UV rays included in the light will not occur.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing an electro-optical device in which electronic components are mounted on a transparent substrate holding an electro-optical material by using an anisotropic conductive material, an electro-optical device manufactured by this method, The present invention relates to an electronic apparatus having an electro-optical device and a crimping device for mounting an electronic component on a transparent substrate.

[0002]

2. Description of the Related Art Electronic components such as a flexible substrate and a face-down bonding type IC are formed on an anisotropic conductive film (Anisotropic conductive film).
The method of mounting on a substrate using an anisotropic conductive material such as an ilm) or an anisotropic conductive agent can be applied to fine pitches and allows multiple contacts to be electrically connected collectively. In an electro-optical device such as a device, it is suitable for mounting electronic components on a substrate holding an electro-optical material.

Among electro-optical devices in which such mounting is performed, those using a liquid crystal as an electro-optical material are shown in FIG.
As shown in FIG.
The liquid crystal 3 is held in a region defined by the sealing material 30. Here, an electrode pattern (not shown) for driving the liquid crystal 3 is formed of a transparent ITO film on a surface of each of the pair of transparent substrates 10 and 20 facing each other.

In the electro-optical device 1, at least one of the pair of transparent substrates 10, 20 protrudes from the edge of the other transparent substrate 10, and is flexible with respect to the protruding region 25. Terminals (not shown) for mounting electronic components such as the substrate 40 are formed, and such terminals (not shown) are also made of a transparent ITO film.

In manufacturing such an electro-optical device 1, when the flexible substrate 40 is mounted on the terminal of the transparent substrate 20, the transparent substrate 20 is connected to the transparent stage 11.
By irradiating white light from the light source unit 120 through the translucent stage 110 in a state where the terminals are disposed on the transparent substrate 20, the positions of the transparent terminals formed on the transparent substrate 20 and the terminals formed on the flexible substrate 40 are changed. Relationship between the imaging device 13
0, and after positioning the terminals based on the observation result, the pressure bonding head 180 is lowered, and the flexible substrate 40 and the transparent substrate 20 are sandwiched between the flexible substrate 40 and the transparent substrate 20 on the translucent stage 110. The terminals are electrically connected by crimping.

Here, the light source unit 120 includes a first light source 121 that irradiates white light from directly below the transparent substrate 20 via the translucent stage 110, and a translucent stage from obliquely below the transparent substrate 20. And a second light source 122 for allowing white light to be incident on the light source 110.
2, the second light source 122 emits white light having higher power than the first light source 121. The first light source 121 and the second light source 122 emit white light via the flexible cables 124 and 125 and the projection lens optical systems 126 and 127, respectively.

[0007]

However, when the flexible substrate 40 is mounted by the method described with reference to FIG. 9, the light emitted from the light source unit 120 also irradiates the liquid crystal 3 via the translucent stage 110. As a result, there is a problem that the display quality is deteriorated, for example, the liquid crystal 3 is deteriorated and the display becomes uneven. That is, the liquid crystal 3 has a wavelength of 40.
The white light emitted from the light source unit 120 contains ultraviolet light having a wavelength of 400 nm to 430 nm, although it tends to be deteriorated by ultraviolet light of 0 nm to 430 nm.

[0008] In view of the above problems, an object of the present invention is to provide:
A method of manufacturing an electro-optical device capable of electrically connecting terminals after positioning a terminal of a transparent substrate and a terminal of an electronic component without deteriorating an electro-optical material, and an electro-optical device manufactured by the method. It is an object of the present invention to provide a device, an electronic apparatus including the electro-optical device, and a crimping device for mounting an electronic component on a transparent substrate.

[0009]

In order to solve the above-mentioned problems, according to the present invention, a transparent substrate holding an electro-optical material is disposed above a light-transmitting stage and the transparent substrate is passed through the light-transmitting stage. Manufacturing an electro-optical device having an alignment step of aligning a transparent terminal of the transparent substrate with a terminal of an electronic component mounted on the transparent substrate by irradiating light to an electronic component mounting area of the substrate. The method is characterized in that the light-transmitting stage is provided with light-blocking means for preventing the light from being irradiated on the electro-optical material.

In the present invention, first, in a positioning step, a transparent substrate holding an electro-optical material is placed on a light-transmitting stage, and is mounted on an electronic component mounting area of the transparent substrate via the light-transmitting stage. By irradiating light,
After observing the positional relationship between the transparent terminal formed on the transparent substrate and the terminal of the electronic component mounted on the transparent substrate, and performing positioning of the terminals based on the observation result, pressure bonding In the step, terminals are electrically connected by pressing the electronic component and the transparent substrate on the translucent stage with an anisotropic conductive material interposed therebetween. At this time, since the light-transmitting stage is provided with a light-blocking means for preventing the light from irradiating the electro-optical material, the electro-optical material does not cause light deterioration, so that a high-quality display is performed. It can be performed.

In the present invention, in the positioning step, for example, a first white light applied to the transparent substrate from directly below the transparent substrate via the translucent stage;
A second white light irradiating the transparent substrate through the translucent stage from obliquely below the transparent substrate is used, and the light shielding unit includes the first white light and the second white light. At least the second white light of the white light is prevented from being irradiated on the electro-optical material. Since the terminals formed on the transparent substrate are made of a transparent material, it is necessary to irradiate high-power light from a position below the transparent substrate. In addition, it is possible to prevent the electro-optical material from being deteriorated by ultraviolet light included in the light.

In the present invention, it is preferable that the second white light is irradiated from a side of the transparent substrate on which the electro-optical material is arranged toward a substrate edge of the transparent substrate. With this configuration, it is possible to more reliably prevent the second white light from irradiating the electro-optical material.

In the present invention, the electro-optical material is, for example, a liquid crystal held on a pair of transparent substrates. Among various electro-optical materials, liquid crystals are particularly vulnerable to ultraviolet rays, so if the present invention is applied to an electro-optical device using liquid crystals,
A remarkable effect can be obtained as compared with the case where another electro-optical material is used.

In the present invention, the electronic component is mounted in an overhanging area of one of the pair of transparent substrates which overhangs the other substrate.

In the present invention, the electronic component is, for example, a flexible substrate.

The electro-optical device manufactured by such a method can be used, for example, as a display unit of a mobile phone.

A pressure bonding apparatus for manufacturing an electro-optical device according to the present invention includes a light-transmitting stage on which a transparent substrate for holding an electro-optical material is disposed, and an electronic device of the transparent substrate passing through the light-transmitting stage. A light source unit that irradiates light to a component mounting area, an imaging device for observing a positional relationship between a transparent terminal of the transparent substrate and a terminal of an electronic component mounted on the transparent substrate, and the transparent substrate; A drive device that adjusts the position of the electronic component to align the terminals with each other, and a pressure bonding head that presses the electronic component and the transparent substrate on the translucent stage with an anisotropic conductive material interposed therebetween. The light-transmitting stage includes a light-blocking unit configured to prevent light emitted from the light source unit from being irradiated on the electro-optical material.

In the present invention, the light source unit is, for example,
A first light source that emits first white light applied to the transparent substrate through the translucent stage from directly below the transparent substrate, and the translucent stage that is obliquely below the transparent substrate. A second light source that emits a second white light that is applied to the transparent substrate through the light source. In such a case, the light shielding unit includes the first white light and the second white light. At least the second white light of the second white light may be prevented from being applied to the electro-optical material.

In the present invention, it is preferable that the second light source emits the second white light from a side of the transparent substrate on which the electro-optical material is arranged toward a substrate edge of the transparent substrate. .

In the present invention, the translucent stage comprises:
It is made of quartz. Quartz has a high light transmittance, so that it is suitable for optically confirming the position of the terminal, and has hardness and heat resistance enough to withstand pressure bonding.

In the present invention, the light shielding means can be composed of a light shielding material embedded in the translucent stage, and for example, lead can be used as the light shielding material.

[0022]

Embodiments of the present invention will be described with reference to the drawings.

(Overall Structure) FIGS. 1 and 2
1A and 1B are a perspective view and an exploded perspective view of an electro-optical device to which the present invention has been applied. FIGS. 3A and 3B are explanatory diagrams of terminals formed on a second transparent substrate and terminals formed on a flexible substrate, respectively.

FIG. 2 schematically shows only the electrode patterns and terminals and the like. In an actual electro-optical device, a larger number of electrode patterns and terminals are formed.

Referring to FIGS. 1 and 2, the electro-optical device 1 of the present embodiment includes a passive matrix type color liquid crystal panel 2 made of rectangular glass or the like bonded by a sealing material 30 through a predetermined gap. A liquid crystal enclosing area 35 is defined by a sealing material 30 between the pair of transparent substrates 10 and
Liquid crystal 3 as an electro-optical material is sealed in 5. Here, of the pair of transparent substrates 10 and 20,
The substrate on which the plurality of columns of the first electrode patterns 12 extending in the vertical direction in the liquid crystal sealing region 35 is formed is referred to as a first transparent substrate 10, and the plurality of rows of the first column The substrate on which the second electrode pattern 22 is formed is referred to as a second transparent substrate 20.

The electro-optical device 1 shown here is of a transmissive type, and performs a predetermined display using an illumination device (not shown) as a backlight. For this reason, a polarizing plate (not shown) is attached to each of the outer surfaces of the first transparent substrate 10 and the second transparent substrate 20. Although not shown, red, green, and blue color filters are formed on the second transparent substrate 20 in a region corresponding to an intersection between the first electrode pattern 12 and the second electrode pattern 22. An insulating flattening film (not shown), a second electrode pattern 22, and an alignment film (not shown) are formed in this order on the surface side of these color filters. On the other hand, the first transparent substrate 10 has a first electrode pattern 12 and an alignment film (not shown).
Are formed in this order.

In the electro-optical device 1, the first electrode pattern 12 and the second electrode pattern 22 are both transparent because they are formed of an ITO film.

The electro-optical device 1 is formed on each of the first transparent substrate 10 and the second transparent substrate 20 for both inputting and outputting signals to and from the outside and conducting between the substrates. Terminal forming regions 16, 26, and 27 are used. As the second transparent substrate 20, a substrate larger than the first transparent substrate 10 is used.
The driving ICs 51 and 52 are respectively provided on portions 251 and 252 where the second transparent substrate 20 protrudes from the substrate side of the first transparent substrate 10 when the second transparent substrate 20 and the second transparent substrate 20 are bonded to each other.
(Semiconductor chip) mounting areas 510 and 520 are formed, and drive ICs 51 and 52 are COG mounted by face-down bonding.

Further, in each of the portions 251 and 252 where the second transparent substrate 20 projects from the substrate side of the first transparent substrate 10, the respective ends 41 and 42 of the flexible substrate 40 are formed of an anisotropic conductive film. Board mounting areas 410, 42 to be mounted via
0 is formed. These substrate mounting areas 410, 4
20 has a basic similar configuration. For example, a plurality of terminals 411 are formed on the second transparent substrate 20 in the substrate mounting area 410 as shown in FIG. And
Each of these terminals 411 is made of an ITO film formed simultaneously with the electrode pattern 22. Therefore, the terminal 411
Is transparent like the electrode pattern 22. On the other hand, as shown in FIG. 3B, a plurality of terminals 4 each having a width smaller than the
12 are formed, and these terminals 412 are obtained by applying gold plating to a copper foil pattern formed on a plastic film.

In the electro-optical device 1 according to the present embodiment,
The flexible substrate 40 and the driving ICs 51 and 52 are both mounted on the second transparent substrate 20 and are not mounted on the first transparent substrate 10. Nevertheless, in this embodiment,
In the terminal formation region 26 of the second transparent substrate 20, a plurality of inter-substrate conduction terminals 28 are formed from the driving IC 51 toward the liquid crystal enclosing region 35 to a position where the terminals 28 overlap the first transparent substrate 10. On the other hand, in the first transparent substrate 10, the end of the first electrode pattern 12 extends to a position overlapping the inter-substrate conduction terminal 28 as the inter-substrate conduction terminal 18. For this reason, the first transparent substrate 10 and the second transparent substrate 20 are bonded together with a sealant 30 containing an inter-substrate conducting agent, and the inter-substrate conducting terminals 18 and 28 are electrically connected to each other. A driving IC 51 is provided on the transparent substrate 20,
After the mounting of the flexible substrate 40 and the flexible substrate 40, if a predetermined signal is input to the driving ICs 51 and 52 via the flexible substrate 40, the signals output from the driving ICs 51 and 52 are output to the first electrode pattern 12. And the second electrode pattern 22, the pixel corresponding to the intersection of the first electrode pattern 12 and the second electrode pattern 22 can be driven.

(Mounting Structure of Flexible Substrate 40) In manufacturing the electro-optical device 1 having such a structure,
The driving ICs 51 and 52 and the flexible substrate 40 are sequentially mounted on the second transparent substrate 20. Referring to FIGS. 4 and 5, the end 41 of the flexible substrate 40 is connected to the second transparent substrate 20. An example in which the present invention is applied to a step of mounting the substrate mounting area 410 will be described.

FIGS. 4A and 4B are explanatory views showing the configuration of the main part of the crimping apparatus to which the present invention is applied, and the state in which a light-shielding portion is formed on a light-transmitting stage of the crimping apparatus. FIG. FIG. 5 is an explanatory view showing a state in which a flexible substrate is mounted on a second transparent substrate using this crimping device.

In FIG. 4A and FIG. 5, a liquid crystal 3 as an electro-optical material is provided between a first transparent substrate 10 and a second transparent substrate 20 in a pressure bonding apparatus 100 used in the present embodiment. A first chuck 150 for sucking and holding the held liquid crystal panel 2 and a second chuck 160 for sucking and holding the flexible substrate 40 are configured. In addition, in the second transparent substrate 20 of the liquid crystal panel 2, a translucent stage 110 made of quartz is arranged at a position below the substrate mounting area 410 where the end 41 of the flexible substrate 40 is mounted.

The first chuck 150 is indicated by an arrow, and is driven by the first chuck 150 in the X direction to adjust the position of the liquid crystal panel 2 in the X direction. By driving X1 and the first chuck 150 in the Y direction,
Panel-side drive device Y for adjusting position in direction
1 and a third panel-side driving device Z1 that adjusts the orientation of the liquid crystal panel 2 by rotating and driving the first chuck 150 in the XY plane. Also, the second chucks 160 are indicated by arrows, respectively,
The first substrate-side driving device X2 that adjusts the position of the flexible substrate 40 in the X direction by driving the chuck 160 in the X direction, and the Y of the flexible substrate 40 by driving the second chuck 160 in the Y direction. A second substrate-side driving device Y2 that adjusts the position in the direction and a third substrate-side driving device Z2 that adjusts the direction of the flexible substrate 2 by rotating and driving the second chuck 160 in the XY plane. It is configured.

Further, the pressure bonding apparatus 100 is connected to the substrate mounting area 4 of the second transparent substrate 10 through the translucent stage 110.
A light source unit 120 for irradiating light to the light source 10;
Transparent substrate 20 based on the reflected light of the light emitted from
Terminal 41 formed in the substrate mounting area 410
1 (see FIG. 3 (A)) and an imaging device 130 for observing the positional relationship between the terminal 421 (see FIG. 3 (B)) of the flexible substrate 40 and observation using the imaging device 130 Based on the result, each of the driving devices X1, Y1,
The positions of the second transparent substrate 20 and the flexible substrate 40 are adjusted by Z1, X2, Y2, and Z2, and the terminals 411,
In a state where 412 are aligned with each other, the end 41 of the flexible substrate 40 and the second
And a pressure bonding head 180 for electrically connecting the terminals 411 and 412 to each other by pressing the transparent substrate 20 with the anisotropic conductive material therebetween.

Here, the light source section 120 is formed of a halogen lamp that emits the first white light that is applied to the second transparent substrate 20 through the translucent stage 110 from directly below the second transparent substrate 20. The first light source 121 and the second transparent substrate 20 are irradiated with the second transparent substrate 20 through the translucent stage 110 with a larger power than the first white light from obliquely below the second transparent substrate 20. And a second light source 122 composed of a halogen lamp for emitting two white lights.

In the present embodiment, the second light source 122 is disposed so as to irradiate the second white light obliquely from a position directly below the liquid crystal sealing region 35 toward the substrate edge.

The first light source 121 and the second light source 122 are connected to flexible cables 124 and 12 respectively.
5, and emits white light through the projection lens optical systems 126 and 127.

In the crimping apparatus 100 configured as described above, in the present embodiment, the light source unit 1 is
A light-shielding portion 111 for preventing the first white light and the second white light emitted from 20 from irradiating the liquid crystal 3 is formed over the hatched region in FIG. In the embodiment, in forming such a light-shielding portion 111, a step is formed such that the upper surface of a portion of the quartz translucent stage 110 overlapping the liquid crystal sealing region 35 is one step lower than other regions. Then, lead 112 as a light shielding material is embedded in the lowered portion.

In order to mount the end portion 41 of the flexible substrate 40 on the second transparent substrate 20 using the crimping apparatus 100 configured as described above, first, the substrate 41 of the second transparent substrate 20 of the liquid crystal panel 2 is mounted. After applying or overlaying the anisotropic conductive material on the mounting area 410, the liquid crystal panel 2 and the flexible substrate 40 are sucked and held by the first chuck 150 and the second chuck 160 of the crimping device 100, respectively.

Next, a positioning step is performed. In this alignment step, first, the first light source 121 that irradiates the first white light from directly below the second transparent substrate 20 is turned on, and the second transparent substrate 20 is formed by the reflected light. An alignment mark (not shown) is observed via the imaging device 130, and based on the observation result, the first chuck 150 is driven in a predetermined direction to perform alignment of the liquid crystal panel 2.

Next, the second light source 122 for irradiating the second white light from obliquely below the second transparent substrate 20 is turned on,
With the reflected light, an alignment mark (not shown) formed on the second transparent substrate 20 is observed through the imaging device 130, and the terminal 411 formed on the second transparent substrate 20 and the flexible substrate The positional relationship between the terminals 411 and 412 is determined by observing the positional relationship between the terminals 411 and 412 on the basis of the observation results.

After the positioning of the terminals 411 and 412 is completed in this way, the pressure bonding head 180 is lowered, and the end portion 41 of the flexible substrate 40 and the second transparent substrate 20 are placed on the translucent stage 110. Are crimped across an anisotropic conductive material to electrically connect the terminals 411 and 412 to each other (crimping step).

When the flexible substrate 40 is positioned and mounted on the second transparent substrate 20 in this manner, white light contains ultraviolet light having a wavelength of 400 nm to 430 nm,
In addition, even if there is a problem that the liquid crystal 3 is deteriorated when the liquid crystal 3 is irradiated with the ultraviolet light, in the present embodiment, the light-transmitting stage 110 is used to prevent the liquid crystal 3 from being irradiated with white light. Since the portion 111 is formed, ultraviolet rays are not irradiated on the liquid crystal 3. Therefore, after the terminals 411 of the second transparent substrate 20 and the terminals 412 of the flexible substrate 40 are optically aligned without deteriorating the liquid crystal 3, the terminals 411 and 412 can be electrically connected to each other. Therefore, in the electro-optical device 1 according to the embodiment, the display quality does not deteriorate due to the deterioration of the liquid crystal due to the ultraviolet light.

In this embodiment, the second transparent substrate 2
Even if the second white light is irradiated from obliquely below 0, the second white light is irradiated obliquely from directly below the liquid crystal enclosing area 35 of the liquid crystal panel 2 in the opposite direction (substrate edge), and Since the light-shielding portion 111 is formed directly below the liquid crystal enclosing region 35 in the translucent stage 110, it is possible to surely prevent the liquid crystal 3 from being irradiated with the second white light having high power.

Further, in this embodiment, the translucent stage 110 is made of quartz, and if it is quartz, it has a high light transmissivity, so that it is suitable for optically confirming the positions of the terminals 411 and 412. In addition, it has hardness and heat resistance that can withstand pressure bonding.

(Other Embodiments) In the above embodiment, an example is shown in which a flexible substrate is mounted on a transparent substrate. However, the present invention may be applied to mounting a driving IC or the like on a transparent substrate. .

In the above embodiment, the light emitted from the first light source and the second light source is shielded by the light-shielding part 111. Deterioration can be sufficiently prevented.

Further, in the above embodiment, a passive matrix type liquid crystal device has been described as an example of an electro-optical device. However, the present invention is not limited to this. For example, in an active matrix type liquid crystal device, a flexible substrate or a driving The present invention may be applied to mounting a semiconductor IC.

Furthermore, in the above embodiment, since the inter-substrate conduction structure is employed, an example in which the flexible substrate is mounted on one of the two transparent substrates holding the liquid crystal as the electro-optical material has been described. The present invention may be applied to mounting a flexible substrate or a driving IC on each of the transparent substrates.

(Embodiment of Electronic Apparatus) FIG. 6 shows an embodiment in which the electro-optical device (liquid crystal device) according to the present invention is used as a display device of various electronic apparatuses. The electronic device shown here includes a display information output source 70, a display information processing circuit 71, a power supply circuit 72, and a timing generator 7.
3, and a liquid crystal device 74. The liquid crystal device 74
Has a liquid crystal display panel 75 and a drive circuit 76. As the liquid crystal device 74 and the liquid crystal display panel 75, the above-described electro-optical device 1 and liquid crystal panel 2 can be used.

The display information output source 70 is a ROM (Read Onl
y, a memory such as a random access memory (RAM), a storage unit such as a disk, a tuning circuit for synchronizing and outputting a digital image signal, and the like. Based on various clock signals generated by the timing generator 73, a predetermined Display information such as an image signal in a format is supplied to the display information processing circuit 71.

The display information processing circuit 71 includes various known circuits such as a serial-parallel conversion circuit, an amplification / inversion circuit, a rotation circuit, a gamma correction circuit, and a clamp circuit, and executes processing of input display information. , And supplies the image signal to the drive circuit 76 together with the clock signal CLK. The driving circuit 76 is a general term for a scanning line driving circuit, a data line driving circuit, an inspection circuit, and the like. The power supply circuit 72 supplies a predetermined voltage to each component.

FIG. 7 shows a mobile personal computer which is an embodiment of the electronic apparatus according to the present invention. The personal computer shown here has a main body 82 having a keyboard 81 and a liquid crystal display unit 83. The liquid crystal display unit 83 includes the electro-optical device 1 described above.

FIG. 8 shows a mobile phone as another embodiment of the electronic apparatus according to the present invention. The mobile phone 90 shown here has a plurality of operation buttons 91 and the electro-optical device 1 including a liquid crystal device.

[0056]

As described above, according to the present invention, in a state where the transparent substrate holding the electro-optical material is placed on the translucent stage, light is applied to the electronic component mounting area of the transparent substrate via the translucent stage. To observe the positional relationship between the transparent terminal of the transparent substrate and the terminal of the electronic component, and based on the observation result, when aligning the terminals, light is transmitted to the translucent stage. Since the light shielding means for preventing the optical material from being irradiated is configured, the ultraviolet light included in the light is not irradiated to the electro-optical material. Therefore, it is possible to prevent a decrease in display quality due to the deterioration of the electro-optical material due to the ultraviolet rays.

[Brief description of the drawings]

FIG. 1 is a perspective view of an electro-optical device to which the present invention is applied.

FIG. 2 is an exploded perspective view of the electro-optical device shown in FIG.

FIGS. 3A and 3B are diagrams illustrating a terminal formed on a second transparent substrate and a terminal formed on a flexible substrate, respectively.

FIGS. 4A and 4B are explanatory views showing a configuration of a main part of a crimping apparatus to which the present invention is applied, and an explanatory view showing a state in which a light-shielding portion is formed on a translucent stage of the crimping apparatus. It is.

FIG. 5 is an explanatory view showing a state in which a flexible substrate is mounted on a second transparent substrate using the pressure bonding apparatus shown in FIG. 4;

FIG. 6 is a block diagram illustrating a configuration of various electronic apparatuses using the electro-optical device according to the invention.

FIG. 7 is an explanatory diagram showing a mobile personal computer as an embodiment of an electronic apparatus using the electro-optical device according to the invention.

FIG. 8 is an explanatory diagram of a mobile phone as one embodiment of an electronic apparatus using the electro-optical device according to the invention.

FIG. 9 is an explanatory view showing a state in which a flexible substrate is mounted on a second transparent substrate using a conventional pressure bonding apparatus.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 electro-optical device 2 liquid crystal panel 3 liquid crystal 10, 20 transparent substrate 12, 22 electrode pattern 16, 26, 27 terminal formation region 18, 28 terminal for substrate conduction 30 sealant 35 liquid crystal sealing region 41, 42 end of flexible substrate 51, 52 Driving IC 100 Crimping device 110 Light-transmitting stage 111 Light-shielding part (light-shielding means) of light-transmitting stage 112 Lead (light-shielding material) 120 Light source part 121 First light source 122 Second light source 124, 125 Flexible cable 126, 127 Projection lens optical system 130 Image pickup device 150, 160 Chuck 180 Crimping head 251, 252 Part where transparent substrate overhangs 410, 420 Substrate mounting area 411 Terminal on transparent substrate 412 Terminal on flexible substrate 510, 520 Driving IC Mounting area X1 First panel side drive Apparatus Y1 second panel side driver device Z1 third panel side driving device X2 first substrate side drive Y2 second substrate side drive Z2 third substrate side driving device

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2H088 FA16 HA06 2H092 GA45 GA48 GA50 MA35 NA30 PA09 5E319 AA03 AA07 AB01 AC04 BB16 CC61 CD04 CD25 GG09 GG20 5E344 AA02 AA22 BB02 BB04 BB07 BB12 CC23 CD04 DD10 DD14 EE06

Claims (17)

[Claims] 1. A method according to claim 1, further comprising: irradiating the electronic component mounting area of the transparent substrate with light through the translucent stage in a state where the transparent substrate holding the electro-optical material is disposed above the translucent stage. In a method of manufacturing an electro-optical device having an alignment step of aligning a transparent terminal of a transparent substrate with a terminal of an electronic component mounted on the transparent substrate, wherein the light is transmitted to the translucent stage. A method for manufacturing an electro-optical device, comprising a light-shielding unit configured to prevent irradiation of the electro-optical material. 2. The method according to claim 1, wherein in the positioning step, the first white light applied to the transparent substrate from directly below the transparent substrate via the translucent stage, and A second white light that is applied to the transparent substrate from the obliquely downward through the translucent stage, and the light blocking unit is configured to output at least one of the first white light and the second white light. A method for manufacturing an electro-optical device, comprising: preventing a second white light from being irradiated on the electro-optical material. 3. The transparent substrate according to claim 2, wherein the second white light is emitted from a side of the transparent substrate on which the electro-optical material is arranged toward a substrate edge of the transparent substrate. A method for manufacturing an electro-optical device. 4. The method according to claim 1, wherein
The method of manufacturing an electro-optical device, wherein the electro-optical material is a liquid crystal held on a pair of transparent substrates. 5. An electro-optical device according to claim 4, wherein said electronic component is mounted in an overhanging area of one of said pair of transparent substrates which extends from said other substrate. Method. 6. The method according to claim 1, wherein
The method for manufacturing an electro-optical device, wherein the electronic component is a flexible substrate. 7. The method according to claim 1, wherein
The method for manufacturing an electro-optical device, wherein the translucent stage is made of quartz. 8. The method according to claim 1, wherein
The method of manufacturing an electro-optical device, wherein the light shielding unit is made of a light shielding material embedded in the translucent stage. 9. The method according to claim 7, wherein the light-shielding material is lead. 10. An electro-optical device manufactured by the method according to claim 1. Description: 11. An electronic apparatus using the electro-optical device defined in claim 10 as a display unit. 12. A light-transmitting stage on which a transparent substrate holding an electro-optical material is disposed, a light source unit for irradiating light to an electronic component mounting area of the transparent substrate through the light-transmitting stage, and An imaging device for observing the positional relationship between the transparent terminals of the substrate and the terminals of the electronic components mounted on the transparent substrate; and adjusting the positions of the transparent substrate and the electronic components to position the terminals. A driving device to be combined, a pressure bonding head for pressing the electronic component and the transparent substrate on the light transmitting stage with an anisotropic conductive material interposed therebetween, and the light source unit is provided on the light transmitting stage. And a light-blocking device configured to prevent light emitted from the device from being irradiated on the electro-optical material. 13. The light source unit according to claim 12,
A first light source that emits first white light applied to the transparent substrate through the translucent stage from directly below the transparent substrate, and the translucent stage that is obliquely below the transparent substrate. A second light source that emits a second white light applied to the transparent substrate through the light source, wherein the light blocking unit is configured to output at least a second light from the first white light and the second white light. A crimping apparatus for preventing white light from being applied to the electro-optical material. 14. The second light source according to claim 13, wherein the second light source emits the second white light from a side of the transparent substrate on which the electro-optical material is arranged toward a substrate edge of the transparent substrate. A crimping device characterized by the above-mentioned. 15. The crimping apparatus according to claim 12, wherein the light-transmitting stage is made of quartz. 16. The crimping apparatus according to claim 12, wherein the light shielding unit is made of a light shielding material embedded in the light transmitting stage. 17. The crimping apparatus according to claim 16, wherein the light shielding material is lead.