JP2006349789A - Optoelectronic apparatus, method for manufacturing optoelectronic apparatus, and electronic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optoelectronic apparatus capable of preventing light rays from being leaked from a back face side of a light source, thereby visualizing a bright image, and to provide a method for manufacturing the optoelectronic apparatus and an electronic apparatus. <P>SOLUTION: In the optoelectronic apparatus to which a flexible circuit board packaged with the light source is connected and in which an optoelectronic material is held, a wiring pattern is formed in the periphery of packaging area of the light source in the flexible circuit board, and a light shielding member is provided at least in a position corresponding to a gap of the wiring pattern on the back side of the packaging face of the light source in the flexible circuit board. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an electro-optical device, a method for manufacturing the electro-optical device, and an electronic apparatus. In particular, the present invention relates to an electro-optical device to which a flexible circuit board on which a light source is mounted is connected, a method for manufacturing such an electro-optical device, and an electronic apparatus.

Conventionally, as one aspect of an electro-optical device, a pair of substrates each having an electrode formed thereon are arranged to face each other, and a voltage applied to a plurality of pixels that are intersecting regions of the electrodes is selectively turned on and off. There is a liquid crystal device that modulates light passing through a liquid crystal material of the pixel and displays an image such as an image or a character.
In such a liquid crystal device, in order to enable so-called transmissive display, a light guide plate is disposed on the side opposite to the display surface of the liquid crystal panel, and a light source such as an LED or a fluorescent tube is disposed at one end thereof. It is configured. And while irradiating light from a light source, the said light is entered into a liquid crystal panel through a light-guide plate, and an image is displayed by making it pass to the display surface side.
Such a light source may be mounted on a flexible circuit board in order to facilitate electrical connection with a liquid crystal panel and to reduce the thickness and size of the liquid crystal device.

Here, if part of the light leaks outside the liquid crystal panel before the light emitted from the light source enters the liquid crystal panel through the light guide plate, the luminance in the displayed image is lowered and the display quality is lowered. There is a problem of doing. Therefore, a liquid crystal display device has been proposed in which light leakage of light emitted from the light source is reduced and visibility is improved. More specifically, as shown in FIG. 7, it is composed of a liquid crystal panel 509 and an illuminating device 510 that is a planar light source. Is a two-lamp type edge light type liquid crystal display device 509 in which a plate-like light reflecting material 514 is disposed on one main surface of a light guide plate 511 and covers each long cylindrical fluorescent lamp 512. A liquid crystal display device 509 provided with a reflector 515 made of aluminum (Al) or the like is disclosed (for example, see Patent Document 1).
JP-A-8-95074 (FIG. 1)

  However, the liquid crystal display device described in Patent Document 1 has a configuration in which a reflector is disposed around a long cylindrical fluorescent lamp having a certain size, and a light source is a relatively small LED mounted on a flexible substrate. In such a case, it is difficult to obtain the same configuration. That is, in the case of the LED light source having such a configuration, a flexible substrate having a relatively thin thickness exists on the lower side, and the LED can be covered, but the back side of the LED, that is, the flexible substrate. There is a problem that light leaks from the back side of the LED mounting area. Accordingly, there has been a problem that the brightness of the displayed image is lowered and the display quality is lowered.

Accordingly, the inventors of the present invention have made diligent efforts and arranged a light shielding member at a predetermined position on the back side of the mounting surface of the light source in the flexible circuit board, so that light from the back side of the mounting surface of the LED in the flexible circuit board can be obtained. The present invention has been completed by finding that such problems can be solved by preventing leakage.
That is, the present invention provides a predetermined light-shielding member on the back side of the light source mounting surface of the flexible substrate, thereby reducing light leakage of light emitted from the light source and preventing a decrease in luminance in the display image. An object is to provide an optical device. Another object of the present invention is to provide a method for manufacturing such an electro-optical device and an electronic apparatus.

According to the present invention, an electro-optical device to which a flexible circuit board on which a light source is mounted is connected and which holds an electro-optical material, on the back side of the mounting surface of the light source on the flexible circuit board, at least of the light source An electro-optical device including a light shielding member at a position corresponding to the mounting region is provided, and the above-described problems can be solved.
That is, by providing a light shielding member at a predetermined location, light leakage from the back side of the flexible circuit board on which the light source is mounted can be prevented, and a reduction in the amount of light incident on the electro-optic panel can be effectively prevented. Can do. Therefore, the brightness of the displayed image can be increased and the visibility can be improved.

In configuring the electro-optical device of the present invention, it is preferable that a plurality of light sources are mounted on the flexible circuit board as light sources, and a light shielding member is provided at a position corresponding to a gap between the plurality of light sources.
By comprising in this way, the light leakage from the gap | interval of a some light source in the case of providing a some light source can be prevented effectively, and the visibility of the image displayed can be improved.

In configuring the electro-optical device of the present invention, a plurality of wiring patterns are formed around the light source mounting region of the flexible circuit board, and a light shielding member is provided at a position corresponding to a gap between the plurality of wiring patterns. Is preferred.
With this configuration, it is possible to effectively prevent light leakage from the gaps between the plurality of wiring patterns and improve the visibility of the displayed image.

In configuring the electro-optical device of the present invention, the light shielding member is preferably a light reflective light shielding member.
With this configuration, the light emitted from the light source can be prevented from leaking, and the light can be effectively utilized by reflecting the light efficiently, so that the brightness of the displayed image is further increased. can do.

In configuring the electro-optical device of the present invention, it is preferable to set the bending elastic modulus of the light shielding member to a value in the range of 1.5 to 3.0 × 10 ⁴ MPa.
By comprising in this way, intensity | strength can be raised as a base | substrate of the light source in a flexible circuit board, preventing the light leakage of the light irradiated from a light source.
The bending elastic modulus of the light shielding member means a bending elastic modulus measured according to JIS K7171.

In constructing the electro-optical device of the present invention, the light shielding member is preferably made of a heat resistant material.
By comprising in this way, it will not be damaged by the heat which generate | occur | produces from a light source, but durability can be improved.

In constructing the electro-optical device of the present invention, the light shielding member is preferably made of an electrically insulating material.
With this configuration, the light shielding member can be disposed without causing a short circuit even when a wiring pattern or a through hole connected to the wiring pattern exists on the flexible circuit board.

In configuring the electro-optical device of the present invention, it is preferable that a white sheet made of glass epoxy resin is attached as a light shielding member.
By comprising in this way, while being excellent in insulation, it can be set as the light-shielding member provided with functions, such as rigidity, light-shielding property, and reflectivity.

In configuring the electro-optical device of the present invention, it is preferable that an insulating resin material is applied as a light shielding member.
With this configuration, it is possible to easily provide light shielding even after the flexible circuit board is manufactured.

In configuring the electro-optical device of the present invention, it is preferable that the light shielding member is made of a conductive material.
By comprising in this way, the heat which generate | occur | produces from a light source or a wiring pattern can be thermally radiated efficiently.

In configuring the electro-optical device of the present invention, it is preferable that a metal plate is attached as a light shielding member.
By comprising in this way, while being excellent in heat dissipation, it can be set as the light-shielding member provided with functions, such as rigidity, light-shielding property, and reflectivity.

In configuring the electro-optical device of the present invention, it is preferable that a metal material is applied as a light shielding member.
By comprising in this way, the light-shielding member excellent in heat dissipation can be easily formed even after manufacture of a flexible circuit board.

Another aspect of the present invention is a method for manufacturing an electro-optical device in which a flexible circuit board mounted with a light source is connected and an electro-optical material is held,
Mounting a light source on a flexible substrate;
A step of disposing a light shielding member on the back side of the mounting surface of the light source on the flexible substrate, at least in a position corresponding to the mounting region of the light source;
A method for manufacturing an electro-optical device.
That is, by including a step of arranging a light shielding member at a predetermined position of the flexible circuit board, light leakage from the back side of the light source in the flexible circuit board can be prevented, and the brightness of the displayed image is improved for visual recognition. An electro-optical device excellent in performance can be efficiently manufactured.

Still another embodiment of the present invention is an electronic apparatus including any of the electro-optical devices described above.
That is, since the electro-optical device in which light leakage from the back side of the light source in the flexible circuit board is reduced is provided, the luminance of the displayed image is improved and an electronic device with excellent visibility can be provided. .

  Hereinafter, embodiments of the electro-optical device, the method for manufacturing the electro-optical device, and the electronic apparatus according to the present invention will be specifically described with reference to the drawings. However, this embodiment shows one aspect of the present invention and does not limit the present invention, and can be arbitrarily changed within the scope of the present invention.

[First Embodiment]
In the first embodiment, a flexible circuit board on which a light source is mounted is connected and an electro-optical device holding an electro-optical material is provided on the back side of the light source mounting surface of the flexible circuit board, and at least a light source mounting region The electro-optical device is provided with a light shielding member at a position corresponding to.
Hereinafter, an active matrix liquid crystal device including a TFT element (Thin Film Transistor) will be described as an example of the electro-optical device of the present embodiment. However, the present invention includes not only a liquid crystal device having a TFT element but also an active matrix liquid crystal device having a TFD element (Thin Film Diode) and a passive matrix liquid crystal device having no switching element. The present invention can be applied to various electro-optical devices.
In the following description, a liquid crystal panel refers to a state in which a liquid crystal material is injected between a pair of substrates bonded with a sealing material, and a flexible circuit board, an electronic component, a light source, and the like are included in the liquid crystal panel. The attached state is referred to as a liquid crystal device. Furthermore, in each figure, the same code | symbol is attached | subjected about the same member and it abbreviate | omits description suitably, while a one part member is abbreviate | omitted suitably in each figure.

1. Basic Configuration of Liquid Crystal Device First, the basic configuration of the liquid crystal device according to the present embodiment will be described. Here, FIG. 1 shows a cross-sectional view of the liquid crystal device 10.
As shown in FIG. 1, in the liquid crystal device 10, the counter substrate 30 and the element substrate 60 are bonded together with a sealant (not shown) at their peripheral portions, and the counter substrate 30, the element substrate 60, and A liquid crystal material 21 is enclosed in a gap surrounded by a sealing material.

The counter substrate 30 is formed of glass, plastic, or the like, and on the counter substrate 30, a color filter, that is, colored layers 37r, 37g, and 37b, and a counter layer formed on the colored layers 37r, 37g, and 37b. An electrode 33 and an alignment film 45 formed on the counter electrode 33 are provided. In addition, an insulating layer 41 for optimizing retardation is provided between the colored layers 37r, 37g, and 37b and the counter electrode 33 in the reflective region R.
Here, the counter electrode 33 is a planar electrode formed over the entire surface of the counter substrate 30 with ITO (indium tin oxide) or the like. In addition, the colored layers 37r, 37g, and 37b are disposed at positions facing the pixel electrode 63 on the element substrate 60 side, such as R (red), G (green), B (blue), or C (cyan), M (magenta), and Y. A color filter element of any color such as (yellow) is provided. A black mask or black matrix, that is, a light shielding film 39 is provided next to the colored layers 37 r, 37 g, and 37 b and at a position that does not face the pixel electrode 63.

The element substrate 60 facing the counter substrate 30 is formed of glass, plastic, or the like. On the element substrate 60, a TFT element 69 as an active element functioning as a switching element and a transparent insulating film 81 are sandwiched. And the pixel electrode 63 formed in the upper layer of the TFT element 69.
Here, the pixel electrode 63 is formed as a light reflection film 79 (63a) for performing reflective display in the reflective region R, and is formed as a transparent electrode 63b with ITO or the like in the transmissive region T. . The light reflection film 79 as the pixel electrode 63a is formed of a light reflective material such as Al (aluminum) or Ag (silver). An alignment film 85 made of a polyimide-based polymer resin is formed on the pixel electrode 63, and a rubbing process as an alignment process is performed on the alignment film 85.

  Further, a phase difference plate 47 is formed on the outer surface (that is, the upper side in FIG. 1) of the counter substrate 30, and a polarizing plate 49 is further formed thereon. Similarly, a retardation film 87 is formed on the outer surface (that is, the lower side of FIG. 1) of the element substrate 60, and a polarizing plate 89 is further formed thereunder. Further, a backlight unit (not shown) is disposed below the element substrate 60.

The TFT element 69 includes a gate electrode 71 formed on the element substrate 60, a gate insulating film 72 formed on the entire area of the element substrate 60 on the gate electrode 71, and the gate insulating film 72 interposed therebetween. A semiconductor layer 70 formed above the gate electrode 71, a source electrode 73 formed on one side of the semiconductor layer 70 via a contact electrode 77, and a contact electrode 77 on the other side of the semiconductor layer 70. And a drain electrode 66 formed through the electrode.
The gate electrode 71 extends from the gate bus wiring (not shown), and the source electrode 73 extends from the source bus wiring (not shown). Further, a plurality of gate bus lines extend in the horizontal direction of the element substrate 60 and are formed in parallel in the vertical direction at equal intervals, and the source bus lines cross the gate bus lines with the gate insulating film 72 interposed therebetween. A plurality of lines extending in the vertical direction are formed in parallel in the horizontal direction at equal intervals.
Such a gate bus wiring is connected to a liquid crystal driving IC (not shown) and functions as, for example, a scanning line, while a source bus wiring is connected to another driving IC (not shown), for example, a signal line. Acts as
The pixel electrode 63 is formed in a region excluding a portion corresponding to the TFT element 69 in a rectangular region defined by the gate bus wiring and the source bus wiring intersecting each other.

  Here, the gate bus wiring and the gate electrode can be formed of chromium, tantalum, or the like, for example. The gate insulating film is formed of, for example, silicon nitride (SiNx), silicon oxide (SiOx), or the like. Further, the semiconductor layer can be formed of, for example, doped a-Si, polycrystalline silicon, CdSe, or the like. Further, the contact electrode can be formed of, for example, a-Si, and the source electrode and the source bus wiring and the drain electrode integrated therewith can be formed of, for example, titanium, molybdenum, aluminum, or the like.

The organic insulating film 81 is formed over the entire area of the element substrate 60 so as to cover the gate bus lines, the source bus lines, and the TFT elements. However, a contact hole 83 is formed in a portion corresponding to the drain electrode 66 of the organic insulating film 81, and the pixel electrode 63 and the drain electrode 66 of the TFT element 69 are electrically connected at the contact hole 83.
In addition, in the organic insulating film 81, a resin film having a concavo-convex pattern composed of a regular or irregular repetitive pattern of peaks and valleys is formed as a scattering shape in a region corresponding to the reflective region R. Has been. As a result, the light reflection film 79 (63a) laminated on the organic insulating film 81 also has a light reflection pattern composed of an uneven pattern. However, this uneven pattern is not formed in the transmission region T.

In the liquid crystal device 10 having the above-described structure, during reflective display, external light such as sunlight or indoor illumination light enters the liquid crystal device 10 from the counter substrate 30 side, and the colored layers 37r, 37g, 37b, the liquid crystal material 21, and the like, reach the light reflection film 79, reflected there, and again pass through the liquid crystal material 21, the colored layers 37r, 37g, 37b, etc., and then exit from the liquid crystal device 10 to be reflected. Display is performed.
On the other hand, in the transmissive display, a backlight unit (not shown) is turned on, and light emitted from the backlight unit passes through the translucent transparent electrode 63b, and the colored layers 37r, 37g, The transmissive display is performed by passing through the liquid crystal material 21 and the like 37b and going out of the liquid crystal device 10.

2. In the liquid crystal device 10, as shown in FIG. 2A, the element substrate 60 has a substrate overhanging portion 60T that projects outward from the outer shape of the counter substrate 30. An external connection terminal (not shown) is formed on the protruding portion 60T, and a flexible circuit board 93 is connected to the external connection terminal.
Examples of such a flexible circuit board include a flexible circuit board for driving a light source on which a light source such as an LED or a fluorescent tube is mounted, a flexible circuit board for driving a panel on which a driving semiconductor element is mounted, and the like. These flexible circuit boards are formed with wiring patterns for electrically connecting the element substrate and other flexible circuit boards to the light source and the semiconductor element.
Moreover, these flexible circuit boards are incorporated in the housing in a bent state. For example, as shown in FIGS. 2A to 2B, a flexible circuit board 93 for driving a light source connected to an external connection terminal (not shown) of the element substrate 60 is bent at a predetermined position. By being incorporated, the liquid crystal device 10 is reduced in thickness and size.
2A is a schematic view of the liquid crystal device 10 of the present embodiment, and FIG. 2B is a plan view of the liquid crystal device 10 of FIG. ing.

3. Here, as shown in FIG. 2B, the liquid crystal device as the electro-optical device of the present invention is on the back side of the mounting surface of the light source 11 in the flexible circuit board 93 and at least the mounting region of the light source 11. The light shielding member 13 is provided at a position corresponding to the above. That is, by providing the light shielding member 13, it is possible to prevent light leakage from the back side of the flexible circuit board 93 when the light source 11 is turned on. Accordingly, it is possible to reduce the decrease in the amount of light incident on the liquid crystal panel, and to prevent the luminance of the displayed image from being lowered.
The flexible substrate serving as the base of such a flexible circuit substrate is, for example, a flexible substrate made of polyimide or the like, and a relatively thin substrate is used from the viewpoint of reducing the thickness of the liquid crystal device. For this reason, when the mounted light source is turned on, light leaks from the back side of the mounting surface, and the amount of light incident on the liquid crystal panel tends to decrease. Therefore, such light leakage is prevented by arranging a light shielding member at least in a position corresponding to the gap of the wiring pattern on the back side of the mounting surface of the light source.

Here, with respect to the arrangement position of the light shielding member, in order to prevent light leakage from the back side of the mounting surface of the light source in the flexible circuit board, as shown in FIGS. A light shielding member 13 is provided on the back side of the mounting surface and at least in a position corresponding to the mounting region of the light source 11. Thereby, it can prevent that the light radiate | emitted from a light source leaks from the back side of a flexible circuit board other than entering toward a light-guide plate.
When a plurality of light sources are mounted as the light source, it is preferable to further include a light shielding member 13 at a position corresponding to the gap between the plurality of light sources 11 as shown in FIG. This is because light leakage from not only the position corresponding to the light source mounting region but also the position corresponding to the gap between the plurality of light sources can be effectively prevented. Therefore, more light can be made incident on the light guide plate than in the case where only the light source mounting region is shielded.

Further, when a plurality of wiring patterns are formed around the light source mounting region on the flexible circuit board, the light shielding member 13 is provided at a position corresponding to the gap between the plurality of wiring patterns 15 as shown in FIG. It is preferable to further provide. This is because light leakage from the gaps between the plurality of wiring patterns can be further prevented.
Therefore, as shown in FIG. 4, the position corresponding to the mounting area of the light source 11, the position corresponding to the gap between the plurality of light sources 11, and the position corresponding to the gap between the plurality of wiring patterns 15 on the flexible circuit board 93. It is the most preferable aspect that the light shielding member 11 is disposed in the entire region including all of the above. As a result, a light-shielding member can be easily formed, the light-shielding property is remarkably enhanced, light leakage from the back side of the mounting surface of the light source can be reliably prevented, and a liquid crystal device capable of displaying a brighter image is provided. can do.
This wiring pattern electrically connects a light source and a semiconductor element mounted on the element substrate or a panel driving flexible circuit board connected to the element substrate, and turns on the light source based on the drive signal. It is a wiring pattern for making it happen.

Moreover, regarding the light shielding member to be arranged, it is preferable to use a light reflective light shielding member.
The reason for this is that light emitted from the light source and traveling toward the back side of the flexible circuit board can be reflected and incident on the liquid crystal panel through the light guide plate. This is because the luminance of the displayed image can be improved by increasing the amount.
In order to obtain such a light-reflective light-shielding member, a metal plate such as aluminum or silver, or a colored glass epoxy or acrylic resin can be used.

Moreover, regarding the light shielding member to be arranged, it is preferable that the bending elastic modulus of the light shielding member measured according to JIS K7171 is set to a value within the range of 1.5 to 3.0 × 10 ⁶ MPa.
The reason for this is to prevent the flexible circuit board from being bent in the light source mounting area, to accurately place the light source at a predetermined position in relation to the light guide plate, and to use light efficiently. .
Therefore, the bending elastic modulus of the light shielding member is more preferably set to a value within the range of 1.7 to 2.8 × 10 ⁶ MPa, and is set to a value within the range of 2.0 to 2.5 × 10 ⁶ MPa. More preferably.
In order to obtain a light shielding member having such a value of bending elastic modulus, for example, when a light shielding member using the above-described material is used, a desired bending elastic modulus can be provided by adjusting the thickness thereof. .

Moreover, it is preferable that this light shielding member consists of a heat resistant material.
The reason for this is to prevent the light shielding member from being bent or thermally damaged by the heat generated from the light source.
Therefore, for example, even when it is used for a long time, the light source can be arranged at an appropriate position with respect to the light guide plate, so that the irradiated light can be used efficiently.

Moreover, it is preferable that this light shielding member consists of an insulating material.
This is because it is possible to prevent a short circuit from occurring through the light shielding member even when the wiring pattern is exposed in the region where the light shielding member is arranged on the flexible circuit board.
More specifically, the material of the light shielding member made of such an insulating material is not particularly limited as long as it is a light-impermeable material. For example, the above-described material is colored white. Glass epoxy resin can be used. This is because such a light-shielding member has insulating properties and can be a light-shielding member having desired light reflectivity and bending elastic modulus by adjusting the thickness and white density.

  In addition, when a light-shielding member made of glass epoxy is used, it can be pasted into a predetermined position on a flexible circuit board with an adhesive or the like, or it can be cured after applying a glass epoxy resin. Also, the light shielding member can be formed. For example, when a sheet-shaped light shielding member is used, the light shielding member can be accurately arranged in a desired region because the sheet-shaped light shielding member can be formed in advance with a predetermined thickness and size corresponding to the formation location. On the other hand, when the light shielding material is applied to form the light shielding member, the work efficiency can be improved because it can be formed by appropriately applying to a desired position.

On the other hand, it is also preferable that the light shielding member is made of a conductive material.
This is because the conductive material has a high thermal conductivity and can efficiently dissipate the heat generated from the light source, so that the flexible circuit board can be prevented from being bent or thermally damaged.
Therefore, for example, since the light source can be disposed at an appropriate position with respect to the light guide plate, it is possible to efficiently use the light to be irradiated.
More specifically, the light-shielding member made of such a conductive material is not particularly limited as long as it is light-impermeable, but for example, the above-described material may be a metal plate such as aluminum or silver. Further, it is possible to use a glass epoxy resin colored in white and dispersed conductive particles. In addition, as described above, a previously molded conductive light shielding material may be affixed, or a light shielding member may be formed by directly applying to a predetermined position of the flexible circuit board.

Moreover, the material which can be used as a light shielding member as described above can be used alone, or a plurality of materials may be used in combination.
For example, as shown in FIGS. 5A to 5B, a light shielding member 19 that holds a light shielding material 17 using a sheet 18 made of glass epoxy resin as a base may be used. With such a light shielding member, it is possible to reliably shield light from a predetermined portion of the flexible circuit board while ensuring the strength of the light source as a base.

[Second Embodiment]
The second embodiment is a method of manufacturing the electro-optical device according to the first embodiment, and includes a step of mounting a light source on a flexible substrate, and a light shielding member is disposed on the back side of the mounting surface of the light source mounting region on the flexible substrate. And a process for manufacturing the electro-optical device.
Hereinafter, as a method for manufacturing the electro-optical device according to the present embodiment, the method for manufacturing the liquid crystal device according to the first embodiment will be described as an example.

1. Manufacture of a liquid crystal panel First, a liquid crystal panel including an element substrate and a color filter substrate as a counter substrate arranged to face each other is manufactured.
An element substrate constituting such a liquid crystal panel is obtained by laminating various members on a glass substrate or the like as a substrate of the element substrate, so that a TFT element, a predetermined pattern scanning line, a predetermined pattern data line, an external connection terminal, etc. Are formed as appropriate. Next, after laminating a transparent conductive film such as ITO by sputtering or the like, pixel electrodes are formed in a matrix in the display region by photolithography and etching. Further, an alignment film made of polyimide is formed on the substrate surface on which the pixel electrode is formed. In this way, an element substrate on which various resin films and conductive films are formed is manufactured.

  Next, by laminating various members on a glass substrate or the like as a base constituting a color filter substrate as a counter substrate, a colored layer or a light shielding film is appropriately formed. Next, after laminating a transparent conductive film such as ITO by sputtering or the like, a counter electrode over the entire display region is formed by photolithography and etching. Further, an alignment film made of polyimide is formed on the substrate surface on which the counter electrode is formed. In this way, a color filter substrate on which various resin films and conductive films are formed is manufactured.

  Next, the color filter substrate and the element substrate are bonded to each other through a sealing material to form a cell structure, and a liquid crystal material is injected into the cell structure. Then, a liquid crystal panel can be manufactured by sticking a polarizing plate or the like on the outer surfaces of the color filter substrate and the element substrate.

2. Production of flexible circuit board Next, a flexible circuit board to be connected to the liquid crystal panel is prepared. In such a flexible circuit board, a wiring pattern made of a metal material such as aluminum or tantalum or a transparent conductive material such as ITO (indium tin oxide) is formed on the surface of an insulating flexible board made of polyimide or the like as a base. It can be manufactured by mounting an LED or the like as a light source. Moreover, in order to ensure the insulation of the formed wiring pattern, an insulating protective film can be attached to a region other than the connection terminal portion with the light source or the like.

3. Arrangement of light shielding member Next, the light shielding member is arranged on the back side of the mounting surface of the light source on the flexible circuit board, at least in a position corresponding to the mounting region of the light source.
For example, a light shielding member made of an insulating or conductive light shielding material as described in the first embodiment, and having a predetermined light reflectivity and bending elasticity, a light shielding member on the back side of the mounting surface of the light source. Place in position. At this time, the light shielding member previously formed into a sheet shape may be stuck using an adhesive or the like, or may be cured after directly applying the light shielding material.
In addition, in any of the forming methods, it is preferable to provide a light shielding member on the entire back side of the light source mounting region from the viewpoint of easy formation and prevention of light leakage.

4). Assembly Next, the flexible circuit board on which the light source is mounted is electrically connected to the external connection terminals formed on the projecting portion of the element substrate in the liquid crystal panel.
Thereafter, the flexible circuit board for driving the light source is bent and fixed so that the light source is disposed in the vicinity of the end portion on the side opposite to the display surface of the liquid crystal panel.
Next, the liquid crystal device can be manufactured by incorporating the liquid crystal panel, to which the flexible circuit board is connected, into the housing together with the light guide plate and the like constituting the lighting device.
In the liquid crystal device manufactured as described above, when the light source is turned on in order to provide a predetermined light-shielding member on the back side of the light source mounting surface in the flexible circuit board, the flexible circuit board from the back side of the light source. Since the light can be prevented from leaking through the light, the brightness of the displayed image can be prevented from being lowered and a bright image can be visually recognized.

[Third Embodiment]
3rd Embodiment of this invention is an electronic device provided with the liquid crystal device of 1st Embodiment.
FIG. 6 is a schematic configuration diagram showing the overall configuration of the electronic apparatus of the present embodiment. The electronic apparatus includes a liquid crystal panel 20 provided in the liquid crystal device and a control unit 200 for controlling the liquid crystal panel 20. In FIG. 6, the liquid crystal panel 20 is conceptually divided into a panel structure 20 </ b> A and a drive circuit 20 </ b> B composed of a semiconductor element (IC) or the like. The control means 200 also includes a display information output source 201, a display processing circuit 202, a power supply circuit 203, and a timing generator 204.
The display information output source 201 includes a memory composed of a ROM (Read Only Memory), a RAM (Random Access Memory), etc., a storage unit composed of a magnetic recording disk, an optical recording disk, etc., and a tuning that outputs a digital image signal in a synchronized manner. And is configured to supply display information to the display processing circuit 202 in the form of an image signal having a predetermined format based on various clock signals generated by the timing generator 204.

The display processing circuit 202 includes various well-known circuits such as a serial-parallel conversion circuit, an amplification / inversion circuit, a rotation circuit, a gamma correction circuit, and a clamp circuit, and executes processing of input display information to display the image. Information is supplied together with the clock signal CLK to the drive circuit 20B. Furthermore, the drive circuit 20B can include a first electrode drive circuit, a second electrode drive circuit, and an inspection circuit. Further, the power supply circuit 203 has a function of supplying a predetermined voltage to each of the above-described components.
If the electronic device of this embodiment includes a liquid crystal device in which a light shielding member is disposed at a predetermined position of the flexible circuit board, a bright image can be visually recognized by preventing a decrease in luminance of the displayed image. Electronic device.

  According to the present invention, it is possible to provide an electro-optical device that can prevent a light emitted from a light source from leaking from the back side of the light source through the flexible circuit board and visually recognize a bright image. Accordingly, electro-optical devices and electronic devices such as liquid crystal devices equipped with TFD elements, such as mobile phones and personal computers, liquid crystal televisions, viewfinder type / direct monitor type video tape recorders, car navigation devices, pagers, etc. , Electrophoresis device, electronic notebook, calculator, word processor, workstation, video phone, POS terminal, electronic device with touch panel, device with electron emission element (FED: Field Emission Display or SCEED: Surface-Conduction Electron-Emitter It can be widely applied to Display).

It is a figure which shows the basic composition of the liquid crystal device of this embodiment. (A)-(b) is a figure provided in order to demonstrate the light-shielding member in the liquid crystal device of this embodiment. It is a figure which shows the example which further arrange | positioned the light shielding member in the position corresponded to the clearance gap between several light sources. It is a figure which shows the example which further arrange | positioned the light shielding member in the position corresponded to the clearance gap between several wiring patterns. (A)-(b) is a figure which shows an example of a structure of the light-shielding member. It is a block diagram which shows schematic structure of the electronic device of 3rd Embodiment. It is a figure which shows the conventional light source light-shielded by the circumference | surroundings.

Explanation of symbols

10: liquid crystal device, 11: light source, 12: light guide plate, 13: light shielding member, 15: wiring pattern, 17: light shielding material, 18: glass epoxy resin, 19: light shielding member, 30: counter substrate, 60: element substrate, 93: Flexible circuit board

Claims (14)

In an electro-optical device that is connected to a flexible circuit board mounted with a light source and holds an electro-optical material,
An electro-optical device comprising a light shielding member at a position corresponding to a mounting region of the light source on the back side of the mounting surface of the light source in the flexible circuit board.   The electro-optical device according to claim 1, wherein a plurality of light sources are mounted on the flexible circuit board as the light source, and the light shielding member is provided at a position corresponding to a gap between the plurality of light sources.   3. A plurality of wiring patterns are formed around a mounting region of the light source on the flexible circuit board, and the light shielding member is provided at a position corresponding to a gap between the plurality of wiring patterns. The electro-optical device according to 1.   The electro-optical device according to claim 1, wherein the light shielding member is a light reflective light shielding member. 5. The electro-optical device according to claim 1, wherein the light blocking member has a bending elastic modulus in a range of 1.5 to 3.0 × 10 ⁶ MPa.   The electro-optical device according to claim 1, wherein the light shielding member is made of a heat resistant material.   The electro-optical device according to claim 1, wherein the light shielding member is made of an electrically insulating material.   The electro-optical device according to claim 1, wherein a white sheet made of glass epoxy resin is pasted as the light shielding member.   The electro-optical device according to claim 1, wherein a light shielding material is applied as the light shielding member.   The electro-optical device according to claim 1, wherein the light shielding member is made of a conductive material.   The electro-optical device according to claim 10, wherein a metal plate is attached as the light shielding member.   The electro-optical device according to claim 10, wherein a metal material is applied as the light shielding member. In the manufacturing method of the electro-optical device in which the flexible circuit board mounted with the light source is connected and the electro-optical material is held,
Mounting a light source on a flexible substrate;
A step of disposing a light shielding member on the back side of the mounting surface of the light source in the flexible substrate, at least in a position corresponding to the mounting region of the light source;
A method for manufacturing an electro-optical device.   An electronic apparatus comprising the electro-optical device according to claim 1.

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