JP2000267058A - Production of liquid crystal device, and liquid crystal device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a liquid crystal device in which a failure in connection or the like in mounted parts due to glass particles is prevented by sealing a liquid crystal in each panel region, mounting the parts in the respective specified positions in each panel, and dividing a pair of substrates into a plurality of panels. SOLUTION: The liquid crystal device is formed in a strip of paper state having a plurality of panel regions continuously formed like a belt (ST201). A liquid crystal is injected in each display region through a liquid crystal injection holes (ST202). Each liquid crystal injection hole is sealed with a sealing material to seal each panel region (ST203). Each panel corresponding to the panel region is inspected for lighting (ST204). ICs for driving the liquid crystal are mounted in a COG process (ST205). The pair of substrates in a stick state are divided as secondary division into a plurality of panels (ST206). The secondary division is carried out by a non-contact method, preferably by using laser light. Thus, production of microcracks can be prevented, and further, deposition of glass particles on the panel can be prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method for manufacturing a liquid crystal device and a liquid crystal device. In particular, the present invention relates to a liquid crystal device manufacturing method and a liquid crystal device in which components are mounted on a pair of substrates in a so-called strip state.

[0002]

2. Description of the Related Art Various kinds of electronic parts are manufactured by COG (Chip O).
In a liquid crystal display device mounted with n glass, a liquid crystal is sandwiched between two glass substrates on which circuit patterns such as electrodes are formed, the periphery thereof is surrounded by a seal member, and a driver IC is mounted on an overhanging portion of one of the glass substrates. And electronic components such as capacitors.

Conventionally, in the process of manufacturing a liquid crystal display device having such a configuration, liquid crystal is sealed between a pair of glass substrates divided into, for example, about eight panel regions in a line via a sealing member. Then, the glass substrate is divided into panels by, for example, dicing. After that, various electronic components as described above are mounted on the overhang portion of each divided glass substrate, an optical film such as a polarizing plate is attached, an FPC (Flexible Printed Circuit) substrate or a TCP (Ta)
pe Carrier Package) is connected.

In mounting such components, the glass substrates are mounted on, for example, an XY stage for each divided glass substrate. Next, the positioning mark provided at a predetermined position on the glass substrate is image-recognized, the glass substrate is aligned based on the image recognition result, the component mounting position is calculated, and the component is mounted at the predetermined position. That is being done.

[0005]

However, in such a conventional method of manufacturing a liquid crystal display device, when glass powder generated during dicing adheres to a component mounting position and then the component is mounted at that position. And a connection failure occurs.

Further, since the work of placing a glass substrate on an XY stage is generally performed manually, performing such work for each divided glass substrate requires a considerable amount of work time in total. This has the problem of having a large effect on the manufacturing cost.

Furthermore, since the alignment of the glass substrate and the positioning for component mounting are also performed for each divided glass substrate, there is a problem that the total processing time required for mounting is considerably long.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-described problems, and an object of the present invention is to provide a method of manufacturing a liquid crystal device and a liquid crystal device in which mounted components do not cause connection failure due to glass powder or the like. Make it an issue.

It is still another object of the present invention to provide a reasonable liquid crystal device manufacturing method and a liquid crystal device which can reduce the number of steps for mounting a substrate on an XY stage or the like.

It is another object of the present invention to provide a method of manufacturing a liquid crystal device and a liquid crystal device which can shorten a processing time for mounting components on a substrate before dividing into individual panels. I do.

[0011]

According to the present invention, there is provided a method of manufacturing a liquid crystal device, wherein (a) a liquid crystal is sealed in each of the panel regions between a pair of substrates divided into a plurality of panel regions via a sealing member. And (b) after the step (a), mounting components at predetermined positions corresponding to the respective panel regions; and (c) after the step (b), a plurality of the pair of substrates are provided. And a step of dividing into panels.

According to such a manufacturing method of the present invention, the components are mounted on the substrate in a so-called strip state before the pair of substrates are divided into the unit of the panel area, and then the plurality of panels formed on the substrate are formed. Is divided into individual panels, so that glass powder or the like generated at the time of division does not adhere to the component mounting position or the like, and connection failure or the like does not occur due to glass powder or the like generated at the time of division. . Further, in the present invention, when component mounting is performed, the board is placed in a so-called strip state before dividing the pair of boards into a plurality of panels.
Since the substrate may be placed on the -Y stage or the like, the number of steps can be reduced as compared with the conventional method in which the substrate divided into each panel is placed on the XY stage or the like. Further, in the present invention, the alignment of the substrate and the positioning for mounting the components can be performed in a strip state, so that the processing time for mounting the components on the substrate can be further shortened.

Therefore, the method for manufacturing a liquid crystal device according to the present invention comprises:
The component mounted in the step (b) may include at least one of a driving semiconductor device, a capacitor, a flexible substrate, and a polarizing plate, and in the step (b), at least one of the pair of substrates It is preferable to perform the alignment of the substrate and the mounting of the component at a predetermined position based on the positioning mark provided at one place.

In the method of manufacturing a liquid crystal device according to the present invention, the step (b) includes an inspection of a bonding state at a bonding portion of the mounted components. In particular, according to such a manufacturing method, when inspecting the bonding state at the bonding portion of the mounted components, the inspection can be performed in a so-called strip state before the pair of substrates is divided into a plurality of panels. The number of times of setting for inspection can be reduced.

In the method of manufacturing a liquid crystal device according to the present invention, in the step (c), the pair of substrates is divided by a non-contact method. In particular, according to such a manufacturing method, it is possible to prevent the occurrence of microcracks at the time of division and to prevent glass powder and the like from adhering to the panel. The liquid crystal device of the present invention manufactured by the method of the present invention includes:
In a liquid crystal device in which liquid crystal is sealed between a pair of substrates,
At least one side of the substrate is cut by a non-contact method.

The method for manufacturing a liquid crystal device according to the present invention may further comprise, before the step (b), a step of forming a groove on a division line on one surface of the pair of substrates, and in the step (c), The substrate is divided by irradiating a laser beam onto a division line on the other surface of the pair of substrates. In particular, according to such a manufacturing method, the energy of the laser light required for dividing the substrate can be extremely reduced, and the equipment of the laser device can be simplified. The liquid crystal device of the present invention manufactured by the method of the present invention is characterized in that the cut surface cut by the non-contact method includes a portion that is mechanically cut off.

According to the method of manufacturing a liquid crystal device of the present invention, (a) a pair of substrates are arranged to face each other, and are divided into two panel regions in the X direction and n panel regions in the Y direction between these substrates, and are substantially divided in the X direction. Forming a sealing member having a liquid crystal injection line for injecting liquid crystal into each panel region in the center in the Y direction; and (b) injecting liquid crystal into each panel region through the liquid crystal injection line. (C) temporarily sealing the liquid crystal injection line; (c) after the step (b), mounting components at predetermined positions corresponding to the respective panel regions; and (d) the step ( After c), the method includes a step of dividing the pair of substrates into a plurality of panels, and a step of (e) sealing each of the panels after the step (d).

According to such a manufacturing method of the present invention, as in the above-described manufacturing method, a connection failure or the like does not occur due to glass powder or the like generated at the time of division, and man-hours can be reduced. In addition to shortening the processing time for mounting components on the substrate, it is possible to process a larger number of panels in a strip state.

In the method of manufacturing a liquid crystal device according to the present invention, the step (c) includes a step of mounting a flexible substrate at a predetermined position corresponding to each panel region from both sides in the X direction. . According to such a manufacturing method, it is possible to mount the flexible substrate in a strip state particularly on a larger number of panels.

[0020]

Embodiments of the present invention will be described below with reference to the drawings.

(Configuration of Liquid Crystal Display) First, an example of a liquid crystal display manufactured by the method for manufacturing a liquid crystal device according to the present invention will be described with reference to FIG.

Here, FIG. 1 shows a liquid crystal display device 12 having a structure in which a liquid crystal driving IC 21 which is a driving semiconductor device is mounted on a chip on glass (COG). LCD drive I
C21 is a transparent electrode formed by wiring such as ITO,
And / or a semiconductor device having a function of outputting a scanning signal and a data signal to a plurality of electrodes 16a and 16b, which are electrodes formed of a metal such as aluminum, tantalum, and chromium. On the side surface), there are provided a plurality of bumps 2 for making an electrical connection to the plurality of electrodes and an electrical connection for supplying and receiving signals such as various control signals and a power supply to and from an external circuit. Can be
The bump arrangement of the liquid crystal driving IC 21 is not limited to the arrangement shown in the figure, but may be provided on two sides of the liquid crystal driving IC 21 or may be a staggered arrangement.

In the liquid crystal display device 12 shown in FIG. 1, a liquid crystal panel having a structure in which liquid crystal is sandwiched between a pair of substrates 13a and 13b via a seal member 14 formed on the outer periphery is formed. In this liquid crystal panel, one of the substrates 13a protrudes outside the outer shape of the other substrate 13b, and a protruding portion 47 that does not overlap two-dimensionally is formed on both substrates that are arranged to face each other. An IC mounting area A for mounting the liquid crystal driving IC 21 on the overhang 47, and connection of an FPC board 37 (or a TCP board 36) for connection to an external circuit at the end of the board 13a of the overhang 47 A connection board mounting area 48 for mounting a board is provided.
The electrode 16a formed on the substrate 13a extends with a direct portion to the overhang portion 47 of the substrate 13a, and its tip is an IC.
It is a land in the mounting area A. The electrode 16b formed on the substrate 13b is connected to the substrate 13b and the substrate 13b.
a via a conductive material (not shown) disposed between
3b and the electrode 16a of the substrate 13a
Are electrically connected to each other and are connected to a conductive line formed on the overhang 47. The ends of these conductive lines are lands in the IC mounting area A.

When bonding the liquid crystal driving IC 21 to the IC mounting area A of the overhanging portion of the substrate 13a, the ACF (Anisotr
The ACF 8 is sandwiched between the liquid crystal driving IC 21 and the substrate 13a.
Is heated and pressed. The ACF 8 is mainly composed of an adhesive of heat or UV (ultraviolet) curable resin and conductive particles, and is heated and pressed at the time of bonding to form a gap between the bump 2 of the liquid crystal driving IC 21 and the land of the substrate 13a. A
The conductive particles included in the CF are bonded to each other by intervening to ensure good conduction.

On each surface of the pair of substrates 13a and 13b, polarizing plates 12a and 12b are arranged, respectively.

(Method of Manufacturing Liquid Crystal Display) Next, as one embodiment of the present invention, a method of manufacturing the liquid crystal display shown in FIG. 1 will be described.

FIG. 2 shows a manufacturing process diagram in this embodiment.

In this embodiment, as shown in FIG. 3, a plurality of, for example, 8.times.8 liquid crystal display devices 12 (see FIG. 1) are provided from a mother glass substrate 30 in which a pair of glass substrates are opposed to each other via a sealing member. ) Can be obtained by dividing.

Here, first, the mother glass substrate 30 shown in FIG. 3 is firstly divided for each column (or for each row) by, for example, dicing, and a plurality of panel regions 40 are formed in a 1 × 8 so-called strip shape. It is set as a strip state (step 201). FIG. 4 shows a glass substrate in such a strip state. In each panel region 40, a display region 31 is defined between a pair of substrates 13a and 13b with a seal member 14 interposed therebetween. Except for the substrate side 46 where each panel region 40 is connected and adjacent to each other in the strip-shaped glass substrate, an overhang portion 47 of the substrate 13a is formed on one substrate side of each panel region 0, and is opposite to this. A liquid crystal injection hole 32 for injecting liquid crystal into the display area 31 is provided on the other substrate side.
Similarly, each overhanging portion 47 of the plurality of panel regions 40 provided on the strip-shaped glass substrate is arranged on the same substrate side, and the same substrate side facing the substrate side on which each overhanging portion 47 is formed. Each liquid crystal injection hole 32 is arranged on the side.

Next, liquid crystal is injected into the display area 31 through the liquid crystal injection hole 32 (step 202). This corresponds to, for example, the display area 3 surrounded by the seal member 14.
1 is evacuated, and each liquid crystal injection hole 32 provided on the strip-shaped glass substrate is immersed in the liquid crystal from that state, whereby the liquid crystal can be drawn into the display area 31 through the liquid crystal injection hole 32. As a result, the liquid crystal is simultaneously injected into the plurality of display areas 31 provided on the strip-shaped glass substrate at the same time.

Next, each liquid crystal injection hole 32 is closed with a sealing material to seal the inside of each panel region 31 (step 203). Next, the lighting inspection of the panel corresponding to each panel area 31 is performed (step 204). Next, the liquid crystal driving IC 21 is
G (Chip On Glass) is mounted (Step 205).

Step 205 will be described in further detail.

First, a pair of substrates 13a, 13 in a strip state
b is washed with pure water (step 2051), and then washed with plasma (step 2052).

Next, as shown in FIG. 5, a pair of substrates 13a and 13b in a strip state is placed on an XY stage 33. Next, a positioning mark 34 provided at a predetermined position on the pair of strip-shaped substrates 13a and 13b is image-recognized by an image recognition device (not shown), and a pair of strip-shaped substrates is determined based on the image recognition result. The alignment of the substrates 13a and 13b and the liquid crystal driving I
The mounting position 35 of C21 is calculated.

An ACF 8 is first formed at each of the calculated mounting positions 35 (step 2053), and then the liquid crystal driving IC 21 is temporarily crimped to each of the mounting positions 35 (step 20).
54) Then, the liquid crystal driving IC 21 is fully press-bonded (step 2055). In this example, the liquid crystal driving IC 21 is mounted on each panel.
The PC board 37 may be mounted on the connection board mounting area 48 formed at the end of the overhang 47. Alternatively, instead of mounting the liquid crystal driving IC 21 on the mounting position 35 of each overhang portion 47, as shown in FIG. 6, for example, the liquid crystal driving IC 21 is mounted on each panel of the pair of substrates 13a and 13b in a strip shape. The mounted TCP board 36 may be mounted on a connection board mounting area 48 formed at the end of the overhang portion 47, or each of a pair of boards 13a and 13b in a strip state as shown in FIG. The connection board mounting area 48 formed at the end of the overhang 47 in the panel area
The PC board 37 may be mounted, or the FPC board 37 on which the liquid crystal driving IC 21 is mounted may be mounted. When mounting an FPC board, as shown in FIG. 8, the FPC 38 arranged in a strip state is mounted on a pair of boards 13a and 13b in a strip state, and a pair of boards 13a and 13b are mounted on each panel as described later. At the time of division, the FPC 38 in a strip state may be divided at the same time.

Thereafter, the bonding state at the bonding portion of the liquid crystal driving IC 21 at each mounting position 35 is visually inspected, for example (step 2056). Normally, the inspection is performed with the inspection object placed on the inspection table. Since the inspection can be performed in a strip state, the number of times of setting on the inspection table can be reduced.

Next, the capacitors are mounted at the mounting positions of the capacitors (not shown) for the respective panels calculated in the same manner as the mounting of the liquid crystal driving IC 21 described above (step 2057). As with the mounting of the liquid crystal driving IC 21, electronic components such as capacitors may be formed by first forming an ACF on each land, temporarily compressing the electronic component to each land, and then completely compressing the electronic component. Thus, electronic components such as capacitors can be mounted in the same process as the liquid crystal driving IC 21.

Next, a pair of substrates 13a, 13 in a strip state
The polarizing plates 12a and 12b are attached to the front and back of each panel in b (step 2058).

Then, as shown in FIG. 9, the pair of substrates 13a and 13b in a strip state is secondarily divided into a plurality of panels 39 (step 206). Such a secondary division is preferably performed by a non-contact method, for example, using a laser beam.
Thereby, generation of micro cracks can be prevented, and glass powder and the like can be prevented from adhering to the panel.

As described above, according to the method of manufacturing the liquid crystal display device according to this embodiment, components such as the liquid crystal driving IC 21 and the capacitors are mounted on the pair of substrates 13a and 13b in a strip shape. A pair of substrates 13a,
Since the panel 13b is divided into a plurality of panels 39, the glass powder or the like generated at the time of division does not adhere to the component mounting position or the like, and a connection failure or the like is caused by the glass powder or the like generated at the time of division. Is gone. In the present invention, the liquid crystal driving IC 2 is mounted on the pair of substrates 13a and 13b.
When mounting components such as 1 and capacitors, X
Since it is only necessary to mount on the -Y stage 33, the man-hour required for setting can be reduced. Furthermore, alignment to the pair of substrates 13a and 13b and the pair of substrates 1
Since the positioning for mounting components such as the liquid crystal driving IC 21 and the capacitor on the 3a and 13b can be performed in a strip state, the processing time required for mounting can be shortened.

(Other Embodiments) A method of manufacturing a liquid crystal display according to another embodiment of the present invention will be described.

In this embodiment, for example, in step 201 of FIG. 2, when the mother glass substrate 30 is primarily divided into columns by dicing, for example, to form 1 × 8 so-called strips, first, as shown in FIG. The groove 4 is formed in the row direction, that is, on the division line 41 divided at the time of the secondary division.
2 is provided. As shown in FIG. 11, the groove 42 is provided on the surface 45 opposite to the substrate surface 44 to which the laser beam 43 is irradiated during the secondary division. Then, in step 206,
The laser beam 43 is irradiated from the substrate surface 44 to perform secondary division.

According to this embodiment, since the focal point of the laser beam 43 is almost one point, if the laser beam 43 is melted to a position far from the focal point with the energy of the laser beam 43, a considerably large energy is required. The thickness of the substrate to be melted by the laser beam 43 is substantially reduced by the groove 42 provided as described above, and the energy of the laser beam 43 required for dividing the substrate can be extremely reduced. Thereby, the equipment of the laser device can be simplified.

Next, a method for manufacturing a liquid crystal display device according to still another embodiment of the present invention will be described.

FIG. 12 is a view showing a manufacturing process according to this embodiment, which is mainly applied to a medium-sized and small-sized liquid crystal display device. First, the mother glass substrate 30 shown in FIG. 3 is primarily divided into, for example, 2 × 8 strips (step 1201). FIG. 13 shows a glass substrate in the form of a strip that is divided into primary parts, two in the X direction and Y in the X direction.
Eight panel regions 40 are arranged on the strip-shaped glass substrate in the direction, and each of the panel regions 40 is provided with a display region 3 via a seal member 14 between a pair of substrates 13a and 13b.
1 is classified. In the strip-shaped glass substrate, two panel regions 40 arranged in the X direction are provided.
The sealing member 14 is formed such that the liquid crystal injection holes 32 are arranged so as to face each other substantially at the center of the width in the X direction, and the liquid crystal injection holes 32 in each panel region 40 arranged in the Y direction are connected to each other. Have been. Therefore, the liquid crystal injection holes 32 of a plurality of panels arranged and formed on the strip-shaped glass substrate at substantially the center of the width in the X direction are commonly connected, and a liquid crystal injection line 51 extending in the Y direction is formed. You. Each display area 31 surrounded by the seal member 14
The liquid crystal is injected through the liquid crystal injection line 51. The liquid crystal injection line 51 has a liquid crystal injection hole 52 at one end in the Y direction and is connected to each display region 31 via the liquid crystal injection hole 32 of each panel.

Next, each display area 31 is passed through the liquid crystal injection hole 52, the liquid crystal injection line 51 and each liquid crystal injection hole 32.
A liquid crystal is injected into the inside (step 1202).

Next, the liquid crystal injection hole 52 is closed with a sealing material (step 1203). Next, the lighting inspection of the panel corresponding to each panel area 31 is performed (step 1204).

Next, washing or the like is performed, the TAB 53 is mounted at a predetermined position corresponding to each panel region 31 from both sides in the X direction (step 1205), a connection state inspection is performed, and a polarizing plate is attached.

Then, a pair of substrates 13a, 1
3b is subdivided into a plurality of panels 39 (step 120).
6) The liquid crystal injection holes 32 of each panel are closed with a sealing material (step 1207).

In the present embodiment, it is possible to process a larger number of panels in a strip state as compared with the first embodiment.

(Electronic Equipment to which the Present Invention is Applied) Next, electronic equipment to which the present invention is applied will be described with reference to FIG.

FIG. 14A is a perspective view showing a mobile phone. 1000 indicates a mobile phone body, of which 1001
Denotes a liquid crystal display unit using the liquid crystal display device according to the present invention.

FIG. 14B is a perspective view showing a wristwatch type electronic device. Reference numeral 1100 denotes a watch body, of which 11
Reference numeral 01 denotes a liquid crystal display unit using the liquid crystal display device according to the present invention.

FIG. 14C shows a portable information processing apparatus such as a word processor or a personal computer. Reference numeral 1200 denotes an information processing apparatus; 1202, an input unit such as a keyboard;
Reference numeral 206 denotes a liquid crystal display unit using the liquid crystal display device according to the present invention, and 1204 denotes an information processing device main body.

By using the liquid crystal display device according to the present invention for these electronic devices, connection failures and the like can be reduced, and the product cost can be further reduced.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view of a liquid crystal display device according to an embodiment of the present invention.

FIG. 2 is a manufacturing process diagram in this embodiment.

FIG. 3 is a plan view of a mother substrate used in a manufacturing process according to the embodiment.

FIG. 4 is a plan view of a substrate in a strip state in this embodiment.

FIG. 5 is an explanatory diagram at the time of component mounting in this embodiment.

FIG. 6 is an explanatory view (part 1) of component mounting in another example.

FIG. 7 is an explanatory diagram (part 2) of mounting components in another example.

FIG. 8 is an explanatory view (part 3) of component mounting in another example.

FIG. 9 is an explanatory diagram at the time of secondary division in this embodiment.

FIG. 10 is a plan view of a substrate according to another embodiment of the present invention.

FIG. 11 is a cross-sectional view of the substrate according to the embodiment.

FIG. 12 is a process chart according to still another embodiment of the present invention.

FIG. 13 is a plan view of a substrate according to this embodiment.

FIG. 14 is a diagram illustrating an electronic device to which the present invention is applied.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 12 Liquid crystal display device 12a, 12b Polarizer 13a, 13b Substrate 14 Seal member 21 Liquid crystal drive IC 31 Panel area 32 Liquid crystal injection hole

Claims (10)

[Claims] (A) enclosing a liquid crystal in each of the panel regions between a pair of substrates divided into a plurality of panel regions via a sealing member; and (b) after the step (a), (C) mounting components at predetermined positions corresponding to the respective panel regions; and (c) after the step (b),
Dividing the pair of substrates into a plurality of panels. 2. The component mounted in the step (b) includes:
The method for manufacturing a liquid crystal device according to claim 1, wherein at least one of a driving semiconductor device, a capacitor, a flexible substrate, and a polarizing plate is included. 3. In the step (b), alignment of the substrates and mounting of components at predetermined positions are performed based on positioning marks provided at least at one position of the pair of substrates. 3. The method for manufacturing a liquid crystal device according to claim 1 or claim 2. 4. The liquid crystal according to claim 1, wherein the step (b) includes an inspection of a bonding state at a bonding portion of the mounted component. Device manufacturing method. 5. The method of manufacturing a liquid crystal device according to claim 1, wherein in the step (c), the pair of substrates is divided by a non-contact method. 6. The method according to claim 6, further comprising, before the step (b), providing a groove on a division line on one surface of the pair of substrates, and in the step (c), forming a groove on the other surface of the pair of substrates. The method of manufacturing a liquid crystal device according to claim 1, wherein the division is performed by irradiating a laser beam onto the division line. 7. (a) A pair of substrates are arranged to face each other, and are divided into two panel regions in the X direction and n panel regions in the Y direction between these substrates. Forming a seal member so as to have a liquid crystal injection line for injecting liquid crystal into the panel region; and (b) injecting liquid crystal into each of the panel regions through the liquid crystal injection line, and temporarily setting the liquid crystal injection line. A sealing step; (c) after the step (b), mounting components at predetermined positions corresponding to the respective panel regions; and (d) after the step (c), A method for manufacturing a liquid crystal device, comprising: a step of dividing a substrate into a plurality of panels; and (e) a step of sealing each of the panels after the step (d). 8. The liquid crystal device according to claim 7, wherein the step (c) includes a step of mounting a flexible substrate at a predetermined position corresponding to each panel region from both sides in the X direction. Manufacturing method. 9. A liquid crystal device in which liquid crystal is sealed between a pair of substrates, wherein at least one side of the substrate is cut by a non-contact method. 10. The liquid crystal device according to claim 9, wherein the cut surface cut by the non-contact method includes a portion that is mechanically cut off.