JP2002224872A - レーザ切断方法、電気光学装置の製造方法、電気光学装置、電子機器およびレーザ切断装置 - Google Patents
レーザ切断方法、電気光学装置の製造方法、電気光学装置、電子機器およびレーザ切断装置Info
- Publication number
- JP2002224872A JP2002224872A JP2001023347A JP2001023347A JP2002224872A JP 2002224872 A JP2002224872 A JP 2002224872A JP 2001023347 A JP2001023347 A JP 2001023347A JP 2001023347 A JP2001023347 A JP 2001023347A JP 2002224872 A JP2002224872 A JP 2002224872A
- Authority
- JP
- Japan
- Prior art keywords
- panel
- cutting
- electro
- laser
- optical device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000000034 method Methods 0.000 title claims abstract description 44
- 238000003698 laser cutting Methods 0.000 title claims abstract description 38
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 21
- 239000000758 substrate Substances 0.000 claims abstract description 152
- 238000005520 cutting process Methods 0.000 claims abstract description 78
- 239000004973 liquid crystal related substance Substances 0.000 claims abstract description 52
- 239000011521 glass Substances 0.000 claims abstract description 19
- 230000001678 irradiating effect Effects 0.000 claims abstract description 13
- 238000001514 detection method Methods 0.000 claims description 19
- 239000000463 material Substances 0.000 claims description 11
- 238000010030 laminating Methods 0.000 claims description 5
- 230000015572 biosynthetic process Effects 0.000 description 16
- 239000003566 sealing material Substances 0.000 description 16
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 12
- 239000010408 film Substances 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- 239000011159 matrix material Substances 0.000 description 7
- 229910002092 carbon dioxide Inorganic materials 0.000 description 6
- 239000001569 carbon dioxide Substances 0.000 description 6
- 238000007789 sealing Methods 0.000 description 6
- 230000008646 thermal stress Effects 0.000 description 6
- 239000004020 conductor Substances 0.000 description 4
- 238000006073 displacement reaction Methods 0.000 description 3
- 230000010365 information processing Effects 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- 101001024616 Homo sapiens Neuroblastoma breakpoint family member 9 Proteins 0.000 description 1
- 102100037013 Neuroblastoma breakpoint family member 9 Human genes 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- RHZWSUVWRRXEJF-UHFFFAOYSA-N indium tin Chemical compound [In].[Sn] RHZWSUVWRRXEJF-UHFFFAOYSA-N 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
- C03B33/093—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam using two or more focussed radiation beams
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
- C03B33/076—Laminated glass comprising interlayers
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Thermal Sciences (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Liquid Crystal (AREA)
- Laser Beam Processing (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001023347A JP2002224872A (ja) | 2001-01-31 | 2001-01-31 | レーザ切断方法、電気光学装置の製造方法、電気光学装置、電子機器およびレーザ切断装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001023347A JP2002224872A (ja) | 2001-01-31 | 2001-01-31 | レーザ切断方法、電気光学装置の製造方法、電気光学装置、電子機器およびレーザ切断装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002224872A true JP2002224872A (ja) | 2002-08-13 |
| JP2002224872A5 JP2002224872A5 (enExample) | 2005-02-24 |
Family
ID=18888645
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001023347A Withdrawn JP2002224872A (ja) | 2001-01-31 | 2001-01-31 | レーザ切断方法、電気光学装置の製造方法、電気光学装置、電子機器およびレーザ切断装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002224872A (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7426883B2 (en) | 2002-11-22 | 2008-09-23 | Mitsuboshi Diamond Ind Co Ltd | Substrate-cutting system, substrate-producing apparatus, substrate-scribing method, and substrate-cutting method |
| CN120516227A (zh) * | 2025-05-28 | 2025-08-22 | 浙江求是半导体设备有限公司 | 一种切割方法和切割装置 |
-
2001
- 2001-01-31 JP JP2001023347A patent/JP2002224872A/ja not_active Withdrawn
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7426883B2 (en) | 2002-11-22 | 2008-09-23 | Mitsuboshi Diamond Ind Co Ltd | Substrate-cutting system, substrate-producing apparatus, substrate-scribing method, and substrate-cutting method |
| CN100519121C (zh) * | 2002-11-22 | 2009-07-29 | 三星钻石工业股份有限公司 | 基板分断系统、基板制造装置 |
| CN120516227A (zh) * | 2025-05-28 | 2025-08-22 | 浙江求是半导体设备有限公司 | 一种切割方法和切割装置 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20040325 |
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| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20040325 |
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| RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20051024 |
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| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20060124 |
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| A761 | Written withdrawal of application |
Free format text: JAPANESE INTERMEDIATE CODE: A761 Effective date: 20060315 |