JP2002219329A - Noxious gas detoxifying apparatus - Google Patents
Noxious gas detoxifying apparatusInfo
- Publication number
- JP2002219329A JP2002219329A JP2001018122A JP2001018122A JP2002219329A JP 2002219329 A JP2002219329 A JP 2002219329A JP 2001018122 A JP2001018122 A JP 2001018122A JP 2001018122 A JP2001018122 A JP 2001018122A JP 2002219329 A JP2002219329 A JP 2002219329A
- Authority
- JP
- Japan
- Prior art keywords
- liquid
- gas
- circulation path
- liquid tank
- mixing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】この発明は、半導体製造装置
や液晶製造装置等から排出される有害ガスを除害、回収
するための有害ガスの除害装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a harmful gas abatement apparatus for removing and collecting harmful gases discharged from a semiconductor manufacturing apparatus, a liquid crystal manufacturing apparatus and the like.
【０００２】[0002]
【従来の技術】半導体製造ラインや液晶製造ラインから
排出されるガスには、SiO2やWO3等の微細な粉体と同時
に有害なガスが含まれているので、そのまま大気中に放
出することができない。そこで、従来、次の様な方法で
除害している。 (1)パンチングプレートの開口を通過させ、微細化す
る、いわゆる湿式のハ゛フ゛リンク゛方式、(2)充填物の表面に
形成された水膜と、ガスとの慣性衝突、微細粒子の拡散
付着によってダストの捕集を行う、いわゆる充填材方
式、(3)燃焼方式や加熱方式若しくは乾式による処理、2. Description of the Related Art Gases discharged from a semiconductor production line or a liquid crystal production line contain harmful gases at the same time as fine powders such as SiO 2 and WO 3. Can not. Therefore, conventionally, the harm is removed by the following method. (1) The so-called wet-type of a hot-water-filling method, which passes through the opening of the punching plate and makes it finer. So-called filler method, which performs collection, (3) treatment by combustion method, heating method or dry method,
【０００３】しかし、前記（１）（２）の方式では、除
害効率が悪く、特に塩素ではアルカリの添加が必要である。
しかし、この様な薬剤を用いると、安全性環境性などに
おいて問題が発生するので、好ましくない。前記(3)の
方式では、多くの電力を必要としたり、燃焼用のガスの
配管が必要で、火種があること等、欠点も多い。又、乾
式においてもランニングコストが高いという欠点を有し
ている。[0003] However, in the methods (1) and (2), the abatement efficiency is poor. Particularly, chlorine requires the addition of an alkali.
However, the use of such a drug is not preferable because it causes problems in safety and environment. The method (3) requires a large amount of electric power, requires piping for a gas for combustion, and has many drawbacks such as the presence of a fire. In addition, there is a disadvantage that the running cost is high even in the dry type.
【０００４】本発明は、上記事情に鑑み、安全に効率よ
く除害することを目的とする。[0004] In view of the above circumstances, an object of the present invention is to safely and efficiently remove harm.
【０００５】[0005]
【課題を解決するための手段】本発明は、有毒ガスを水
に混入せしめて除害する装置において、処理液を貯溜す
る液体槽と、該液体槽に連通する循環路と、該循環路に
配設され、吸気管から吸入された有毒ガスを処理液と混
合攪拌し微細な気泡にする気液混合・攪拌装置と、該循
環路に設けられ、処理液を強制循環せしめるポンプと、
を備えたことを特徴とする。According to the present invention, there is provided an apparatus for removing harmful gas by mixing toxic gas into water, a liquid tank for storing a processing liquid, a circulation path communicating with the liquid tank, A gas-liquid mixing / stirring device which is disposed and mixes and agitates the toxic gas sucked from the suction pipe with the processing liquid to form fine bubbles, and a pump provided in the circulation path for forcibly circulating the processing liquid,
It is characterized by having.
【０００６】この発明は、有毒ガスを水に混入せしめて
除害する装置において、処理液を貯溜する液体槽と、該
液体槽に連通する循環路と、該循環路に配設され、吸気
管から吸入された有毒ガスを処理液と混合攪拌し微細な
気泡にする気液混合・攪拌装置と、該循環路に設けら
れ、処理液を強制循環せしめるポンプと、該液体槽内の
処理液の使用限界を検出する監視手段と、該監視手段に
連動し、処理液を調整する給排手段と、を備えているこ
とを特徴とする。According to the present invention, there is provided an apparatus for removing harmful gas by mixing toxic gas into water, a liquid tank for storing a processing liquid, a circulation path communicating with the liquid tank, and an intake pipe provided in the circulation path. A gas-liquid mixing / stirring device which mixes and agitates the toxic gas sucked from the processing liquid with the processing liquid to form fine bubbles, a pump provided in the circulation path for forcibly circulating the processing liquid, and a processing liquid in the liquid tank. It is characterized by comprising a monitoring means for detecting a usage limit, and a supply / discharge means for adjusting a processing liquid in conjunction with the monitoring means.
【０００７】この発明は、半導体製造装置や液晶製造装
置に使用される有毒ガスを除害する装置において、液体
槽の外部に接続した循環路に気液混合・攪拌装置を介装
し、該循環路に前記製造装置から排気される有毒ガスを
導入するための吸気管を設け、該循環路に設けたポンプ
#により、該液体槽内の液を該循環路に循環させると共
に該吸気管より前記製造装置から排気される有毒ガスを
導入せしめ、該気液混合・攪拌装置により有毒ガスと液
を混合せしめて該液体槽に戻す機構と、該液体槽内の液
を入れ替えるための給液機構と排液機構と、処理後のガ
スを排気するための排気機構と、を有することを特徴と
する。The present invention relates to a device for removing toxic gas used in a semiconductor manufacturing apparatus or a liquid crystal manufacturing apparatus, wherein a gas-liquid mixing / stirring device is interposed in a circulation path connected to the outside of a liquid tank, and the circulation is performed. A suction pipe for introducing toxic gas exhausted from the manufacturing apparatus into a passage, and a pump provided in the circulation passage
With #, the liquid in the liquid tank is circulated to the circulation path, and at the same time, the toxic gas exhausted from the manufacturing apparatus is introduced from the suction pipe, and the toxic gas and the liquid are mixed by the gas-liquid mixing / stirring device. It is characterized by having a mechanism for returning to the liquid tank, a liquid supply mechanism and a drainage mechanism for replacing the liquid in the liquid tank, and an exhaust mechanism for exhausting the gas after processing.
【０００８】[0008]
【発明の実施の形態】本発明者は、水だけで除害効率を
上げ、塩素やアンモニア等の除害が可能になれば、前記諸問
題は解決するものと考えた。そこで、処理液を貯溜する
液体槽に循環路を連結し、該循環路にポンプと気液混合
・撹拌装置とを設け、該気液混合・攪拌装置に有毒ガス
を供給して混合し、除害効率を測定した。その結果、従
来方式の塩素除害効率は２０％ 前後であるのに対し、
本発明では99.999％以上の初期除害能力があり、従来の
方式に比べ、除害効率が飛躍的に向上することがわかっ
た。本発明は、上記研究結果に基づくものである。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present inventor has considered that the above-mentioned problems will be solved if the abatement efficiency is increased by using only water and the abatement of chlorine, ammonia and the like becomes possible. Therefore, a circulation path is connected to a liquid tank for storing the processing liquid, and a pump and a gas-liquid mixing / stirring device are provided in the circulation path, and a toxic gas is supplied to the gas-liquid mixing / stirring device for mixing and removal. The harm efficiency was measured. As a result, the chlorine removal efficiency of the conventional method is around 20%,
The present invention has an initial abatement capacity of 99.999% or more, and it has been found that the abatement efficiency is dramatically improved as compared with the conventional system. The present invention is based on the above research results.
【０００９】[0009]
【実施例】本発明の第１実施例を図１〜図４に基づいて
説明する。図１は、本発明の一実施例のフロー図であ
る。液体槽１には、処理液、例えば、水Ｗが貯溜されて
いる。この液体槽１には、その外部に液体槽１内の液Ｗ
を循環させるための循環路５が配置され、循環路５には
ポンプ３、圧力計PIA-1、流量計F-2並びに気液混合・攪
拌装置４が介装されている。ホ゜ンフ゜３は、インハ゛ーターIVの設
定値により回転数が可変出来、流量及び圧力が調整でき
るように構成されている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a flowchart of one embodiment of the present invention. In the liquid tank 1, a processing liquid, for example, water W is stored. This liquid tank 1 has a liquid W
A circulation path 5 for circulating water is disposed, and the circulation path 5 is provided with a pump 3, a pressure gauge PIA-1, a flow meter F-2, and a gas-liquid mixing / stirring device 4. The horn 3 is configured such that the number of revolutions can be varied according to the set value of the inverter IV, and the flow rate and the pressure can be adjusted.
【００１０】液体槽１には、液量が一定量、例えば、１
００リットル、を越えると、排液するようにオーバーフ
ロー管９と、給水ライン８と、が設けられている。給水
ライン８には、電磁弁１０が介装され、通常は閉じてい
るが、ｐＨ計７により検出される液体槽１内のｐＨ値に
より電磁弁１０が開き液体槽１内に給水するように構成
されている。In the liquid tank 1, a fixed amount of liquid, for example, 1
An overflow pipe 9 and a water supply line 8 are provided so as to drain the liquid when the volume exceeds 00 liters. An electromagnetic valve 10 is interposed in the water supply line 8 and is normally closed. However, the electromagnetic valve 10 is opened according to the pH value in the liquid tank 1 detected by the pH meter 7 so that water is supplied into the liquid tank 1. It is configured.
【００１１】気液混合・攪拌装置４には、半導体製造装
置や液晶製造装置からの排気を吸気するための吸気管１
３が接続されている。吸気管１３には、圧力計PIA-1
と、吸気量を調整するためのダイヤフラムバルブ１５、
吸気の負圧を補助するためのファン１２及び洗浄機構６
が介装されている。The gas-liquid mixing / stirring device 4 has an intake pipe 1 for taking in exhaust gas from a semiconductor manufacturing device or a liquid crystal manufacturing device.
3 are connected. The intake pipe 13 has a pressure gauge PIA-1
And a diaphragm valve 15 for adjusting the intake air amount,
Fan 12 and cleaning mechanism 6 for assisting negative pressure of intake air
Is interposed.
【００１２】洗浄機構６には、給水ライン８から分岐し
て電磁弁１１を介して給水ができるように給水パイプ１
６が接続されている。液体槽１には、気液混合・攪拌装
置４により混合攪拌されて液体槽１に達し、除害された
カ゛スを排気するための排気口１４が設けられており、生
産ラインの排気管と接続できるように構成されている。The water supply pipe 1 is connected to the cleaning mechanism 6 so that water can be supplied from the water supply line 8 via a solenoid valve 11.
6 is connected. The liquid tank 1 is provided with an exhaust port 14 for exhausting the gas that has been mixed and stirred by the gas-liquid mixing / stirring device 4 to reach the liquid tank 1 and has been harmed, and is connected to an exhaust pipe of a production line. It is configured to be able to.
【００１３】気液混合・攪拌装置４は、図２に示すよう
に、円筒ケーシンク゛１７と、一対の二つ割り楕円盤１８、１
９と、下流側に配置された突起群２０と、から構成さ
れ、二つ割り楕円盤１８、１９の弦側側縁１８ａ，１９
ａを交差させ、一対の二つ割り楕円盤１８、１９の円弧
側側縁１８ｂ、１９ｂを円筒ケーシンク゛１７の内壁に接する
ように構成されている。As shown in FIG. 2, the gas-liquid mixing / stirring device 4 comprises a cylindrical casing sink # 17, a pair of split elliptical plates 18,
9 and a projection group 20 arranged on the downstream side, and the chord side edges 18a, 19 of the split ellipsoids 18, 19
a are crossed so that the arc-side edges 18b and 19b of the pair of split elliptical discs 18 and 19 are in contact with the inner wall of the cylindrical casing # 17.
【００１４】カ゛ス導入パイプ２１は、図３に示す様に、
気液混合・撹拌装置４に接続されている。ホ゜ンフ゜３によ
り気液混合・攪拌装置４に液体槽１内の液Ｗが送られ、
前記二つ割り楕円盤１８、１９の作用により液が螺旋流
を起こしカ゛ス導入パイプ２１からのカ゛スと混合されるが、
突起群２０の作用でカ゛スは微細に砕かれ、液Ｗと混合す
るように構成されている。The gas introduction pipe 21 is, as shown in FIG.
It is connected to a gas-liquid mixing / stirring device 4. The liquid W in the liquid tank 1 is sent to the gas-liquid mixing / stirring device 4 by the horn 3,
Due to the action of the split elliptical discs 18 and 19, the liquid causes a spiral flow and is mixed with the gas from the gas introduction pipe 21.
The gas is finely crushed by the operation of the projection group 20 and is mixed with the liquid W.
【００１５】図４は、吸気管１３の詳細図であり、製造
装置からのカ゛スの排気続する接続口２３の下流には、圧
力計Ｐが設けられ、吸気圧力が監視できるようになって
いる。更に下流には、ダイヤフラムバルブ１５が介装さ
れ、ファン１２に流入するカ゛ス量を調整できるようにな
っている。本実施例では、ファン１２を用いているが、
気液混合・攪拌装置４に液Ｗを流すことにより気液混合
・攪拌装置４内に負圧が生じ、その作用だけでカ゛スを吸
引することも可能で、処理するカ゛ス量によってはファン
を設けなくても良い。FIG. 4 is a detailed view of the intake pipe 13. A pressure gauge P is provided downstream of the connection port 23 to which the gas from the manufacturing apparatus is connected, so that the intake pressure can be monitored. . Further downstream, a diaphragm valve 15 is interposed so that the amount of gas flowing into the fan 12 can be adjusted. In this embodiment, the fan 12 is used.
By flowing the liquid W through the gas-liquid mixing / stirring device 4, a negative pressure is generated in the gas-liquid mixing / stirring device 4, and the gas can be sucked by the action alone. A fan may be provided depending on the amount of gas to be processed. You don't have to.
【００１６】ファン１２の下流側には、洗浄機構６が配
置され、給水パイプ１６からの給水により開口６ａに水
が回り、スリット６ｂから水Ｗが流出し、下流の管壁６
ｃを洗浄できるように構成されている。洗浄機構６近傍
の配管には、ヒーター２４が巻かれており、配管上部を
保温している。On the downstream side of the fan 12, a cleaning mechanism 6 is disposed. Water is supplied to the opening 6a by water supplied from the water supply pipe 16, and water W flows out of the slit 6b.
It is configured to be able to wash c. A heater 24 is wound around the pipe near the cleaning mechanism 6 to keep the upper part of the pipe warm.
【００１７】次に、本実施例の作動について説明する。
起動ボタン（図示せず）をオンすると、ホ゜ンフ゜３が起動
し液体槽１内の液Ｗを循環路５に回し始め、循環路５内
の流量が略一定となる。その後、ファン１２が起動し製
造装置の排気管より導かれた有毒ガスを循環系路内に送
り込む。気液混合・攪拌装置４内に送り込まれた液Ｗと
カ゛スＧは、前述の作用により混合・攪拌され、カ゛スは微細
な気泡、例えば、直径0.5〜3.0μmの気泡、となって液
体槽１に戻され、除害される。Next, the operation of this embodiment will be described.
When a start button (not shown) is turned on, the horn 3 is started and the liquid W in the liquid tank 1 starts to be circulated to the circulation path 5, and the flow rate in the circulation path 5 becomes substantially constant. Thereafter, the fan 12 is activated and sends the toxic gas guided from the exhaust pipe of the manufacturing apparatus into the circulation path. The liquid W and the gas G sent into the gas-liquid mixing / stirring device 4 are mixed and stirred by the above-mentioned action, and the gas is turned into fine bubbles, for example, bubbles having a diameter of 0.5 to 3.0 μm, and becomes a liquid tank 1. It is returned and is harmed.
【００１８】上記作用により、時間の経過と共に液体槽
１内のカ゛スの溶解濃度が増加していく。即ち、液体槽１
内の液量は、１００リットルに設定されており、塩素を
２００ｃｃ／分の割合で処理した場合、約２０分後には
ｐＨ値が４以下となり徐々に除害効率が落ちてしまう。
そのため、液体槽１内のｐＨ値をｐＨ計７で監視し、予
め設定されたｐＨ値を維持するように、給水ライン８に
介装された電磁弁１０を流量計F-1を見ながらオン・オ
フし、給水制御を行っている。By the above operation, the dissolved concentration of the gas in the liquid tank 1 increases with time. That is, the liquid tank 1
The amount of the liquid inside is set to 100 liters, and when chlorine is treated at a rate of 200 cc / min, the pH value becomes 4 or less after about 20 minutes, and the abatement efficiency gradually decreases.
For this reason, the pH value in the liquid tank 1 is monitored by the pH meter 7, and the solenoid valve 10 interposed in the water supply line 8 is turned on while watching the flow meter F-1 so as to maintain a preset pH value.・ Turn off and control water supply.
【００１９】給水が開始されると、液体槽１内の液量が
増加し、オーバーフロー管９より１００リットルを越え
た液は排液されるようになっている。かかる給排水機構
の作用で時間が経過しても一定の除害効率が維持できる
ようになっている。When water supply is started, the amount of liquid in the liquid tank 1 increases, and liquid exceeding 100 liters from the overflow pipe 9 is drained. By the operation of the water supply / drainage mechanism, a constant detoxification efficiency can be maintained even after a lapse of time.
【００２０】本実施例では、ｐＨ値によって給排水を制
御しているが、予め処理するカ゛スの量が判っている場合
には、タイマー設定により液の入れ替えを実施しても良い。
又、給水・排水の機構は、ここに開示されたものに限ら
ず、液体槽１の下部に電磁弁３１を介した排液管３９を
設け、液面センサーＬによる制御で排液後に給液を行っ
ても良い。In this embodiment, the supply and drainage is controlled by the pH value. However, if the amount of gas to be treated is known in advance, the liquid may be replaced by setting a timer.
The water supply / drainage mechanism is not limited to the one disclosed here. A drainage pipe 39 is provided below the liquid tank 1 via an electromagnetic valve 31, and is controlled by a liquid level sensor L to supply water after drainage. May be performed.
【００２１】上記の作用によって本実施例では、時間が
経過しても、安定してカ゛スを除害することができ、除害
されたカ゛スは、液体槽１上部に設けられた排気口１４よ
り排気されるようになっている為、水溶性のカ゛スであれ
ば、きわめて効率よくカ゛スの除害を行うことができる。
更に、本実施例は、カ゛スだけでなく、半導体製造ライン
や液晶製造ラインでよく問題になっている粉体に対して
も有用である。According to the present embodiment, the gas can be stably harmed even after a lapse of time in the present embodiment, and the harmed gas is discharged from the exhaust port 14 provided in the upper portion of the liquid tank 1. Since the gas is exhausted, the gas can be removed very efficiently if the gas is water-soluble.
Further, the present embodiment is useful not only for gas, but also for powders that are often problematic in semiconductor production lines and liquid crystal production lines.
【００２２】製造装置から排出されるガスには、微細な
粉体が含まれている場合があり、その粉体が配管のつま
り等を生じせしめる事がある。粉体は、冷却された部分
に付着しやすいため、本実施例では配管の保温と共に定
期的に給水パイプ１６から水を流して、湿度が高いため
に管壁に付着した粉を洗い流し気液混合・攪拌装置４に
送り込み、その攪拌作用によって粉をトラップし、排気
口に流入する粉を最小限に押さえる作用も持っている。In some cases, the gas discharged from the manufacturing apparatus contains fine powder, and the powder may cause clogging of the piping. In the present embodiment, water is periodically flowed from the water supply pipe 16 while the pipe is kept warm, and the powder adhered to the pipe wall is washed away due to high humidity, and the gas-liquid mixture is performed. -The powder is sent to the stirring device 4, and the powder is trapped by the stirring action, and also has the function of minimizing the powder flowing into the exhaust port.
【００２３】この発明の第２実施例を図５により説明す
る。この実施例と第１実施例との相違点は、旋回流発生
手段として、気液混合・撹拌装置４に一対の堕円板を設
ける代わりに、螺旋状のガイドベーン１８Ａを設けたこ
とである。A second embodiment of the present invention will be described with reference to FIG. The difference between this embodiment and the first embodiment is that a spiral guide vane 18A is provided as a swirling flow generating means instead of providing a pair of fallen disks in the gas-liquid mixing / stirring device 4. .
【００２４】この発明の第３実施例を図６により説明す
る。この実施例と第１実施例との相違点は、円筒状の液
体槽１内にパンチングプレート２２を配設したことであ
る。液体槽１の周壁１ａは、円筒形に形成され、その中
には、楕円状のパンチングプレート２２が上下方向に傾
斜して配設されている。A third embodiment of the present invention will be described with reference to FIG. The difference between this embodiment and the first embodiment is that a punching plate 22 is provided in the cylindrical liquid tank 1. The peripheral wall 1a of the liquid tank 1 is formed in a cylindrical shape, in which an elliptical punching plate 22 is disposed inclined in the vertical direction.
【００２５】このパンチングプレート２２には、下面と
上面とを連通させる複数の開口２２ａが設けられ、その
外周縁は液体槽１の内面に接するように斜めに配置され
ている。この開口２２ａの直径は、微細な気泡の直径と
同径、例えば、直径2mm、に形成されている。ホ゜ンフ゜３へ
の液の導入口５ａは、パンチングプレート２２の上端２
２ｂ近傍でパンチングプレート２２の下面側になるよう
に配置され、吐出口５ｂは、パンチングプレート２２の
下端２２ｃ近傍でパンチングプレート２２の下面側にな
るように配置されている。吐出口５ｂは、周壁１ａに対
して接線方向に設けられているので、該吐出口５ｂから
排出された処理液は周壁１ａに沿って旋回するようにな
る。The punching plate 22 is provided with a plurality of openings 22 a for communicating the lower surface and the upper surface, and the outer peripheral edge thereof is obliquely arranged so as to contact the inner surface of the liquid tank 1. The diameter of the opening 22a is the same as the diameter of the fine bubble, for example, 2 mm in diameter. The liquid inlet 5a to the horn 3 is located at the upper end 2 of the punching plate 22.
The discharge port 5b is disposed so as to be on the lower surface side of the punching plate 22 near 2b, and the discharge port 5b is disposed on the lower surface side of the punching plate 22 near the lower end 22c of the punching plate 22. Since the discharge port 5b is provided tangentially to the peripheral wall 1a, the processing liquid discharged from the discharge port 5b turns along the peripheral wall 1a.
【００２６】このようにパンチングプレート２２を設け
ると、十分に微細化されなかった気泡はパンチングプレ
ート２２の開口２２ａを抜けて上昇せずにパンチングプ
レート２２に沿って上昇し、ホ゜ンフ゜３への導入口５ａよ
り再度循環路５に吸引され微細化されることとなる。
尚、実験によると、循環路５の液流量の略３０％のカ゛ス
量であれば気液混合・攪拌装置４の作用で十分に微細化
されるため、カ゛ス処理量によってはパンチングプレート
２２は設置する必要がない。When the punching plate 22 is provided in this manner, the air bubbles which have not been sufficiently miniaturized rise along the punching plate 22 without passing through the opening 22a of the punching plate 22 and rise to the inlet to the phon 3. From 5a, it is sucked into the circulation path 5 again to be miniaturized.
According to an experiment, if the gas volume is approximately 30% of the liquid flow rate in the circulation path 5, the gas-liquid mixing / stirring device 4 can sufficiently reduce the size, so that the punching plate 22 may be installed depending on the gas processing volume. No need to do.
【００２７】液体槽１を円筒形にすることにより、微細
化されたカ゛スの気泡が液体槽１内を螺旋状に回転しなが
ら上昇していくため長時間液体槽１内に滞留するので、
溶解効率を高めることができる。By forming the liquid tank 1 into a cylindrical shape, the gas bubbles of the micronized gas rise while rotating in the liquid tank 1 in a helical manner, and stay in the liquid tank 1 for a long time.
Dissolution efficiency can be increased.
【００２８】[0028]
【発明の効果】この発明は、以上のように構成したの
で、有毒ガスが水と混合攪拌され、微細な気泡となるの
で、安全に、かつ、効率よく除害することができる。ま
た、液体槽内の処理液の使用限界を監視し、処理液の性
能を調整できるので、効率よく除害することができる。According to the present invention, the toxic gas is mixed and stirred with water to form fine bubbles, so that the harmful gas can be safely and efficiently removed. In addition, since the use limit of the processing liquid in the liquid tank can be monitored and the performance of the processing liquid can be adjusted, the harm can be efficiently eliminated.
【図１】本発明の第１実施例を示すフローチャートであ
る。FIG. 1 is a flowchart showing a first embodiment of the present invention.
【図２】気液混合・攪拌装置の斜視図である。FIG. 2 is a perspective view of a gas-liquid mixing / stirring device.
【図３】気液混合・攪拌装置の縦断面図である。FIG. 3 is a longitudinal sectional view of a gas-liquid mixing / stirring device.
【図４】吸気管の縦断面図である。FIG. 4 is a longitudinal sectional view of an intake pipe.
【図５】本発明の第２実施例を示す縦断面図で、図３に
対応する図である。FIG. 5 is a longitudinal sectional view showing a second embodiment of the present invention, and is a view corresponding to FIG.
【図６】本発明の第３実施例を示す縦断面図で、液体槽
の斜視図である。FIG. 6 is a longitudinal sectional view showing a third embodiment of the present invention, and is a perspective view of a liquid tank.
１ 液体槽 １ ポンプ ４ 気液混合、撹拌装置 ５ 循環路 １２ 吸気管 DESCRIPTION OF SYMBOLS 1 Liquid tank 1 Pump 4 Gas-liquid mixing and stirring device 5 Circulation path 12 Intake pipe
Claims (8)
において、 処理液を貯溜する液体槽と、 該液体槽に連通する循環路と、 該循環路に配設され、吸気管から吸入された有毒ガスを
処理液と混合攪拌し微細な気泡にする気液混合・攪拌装
置と、 該循環路に設けられ、該処理液を強制循環せしめるポン
プと、 を備えたことを特徴とする有害ガスの除害装置。1. A device for removing harmful gas by mixing toxic gas into water, a liquid tank for storing a processing liquid, a circulation path communicating with the liquid tank, and disposed in the circulation path and sucked from an intake pipe. A gas-liquid mixing / stirring device that mixes and stirs the toxic gas with the processing liquid to form fine bubbles, and a pump that is provided in the circulation path and forcibly circulates the processing liquid. Gas abatement equipment.
において、 処理液を貯溜する液体槽と、 該液体槽に連通する循環路と、 該循環路に配設され、吸気管から吸入された有毒ガスを
処理液と混合攪拌し微細な気泡にする気液混合・攪拌装
置と、 該循環路に設けられ、処理液を強制循環せしめるポンプ
と、 該液体槽内の処理液の使用限界を検出する監視手段と、 該監視手段に連動し、処理液を調整する給排手段と、 を備えていることを特徴とする有害ガスの除害装置。2. An apparatus for removing harmful gas by mixing toxic gas into water, comprising: a liquid tank for storing a processing liquid; a circulation path communicating with the liquid tank; A gas-liquid mixing / stirring device for mixing and agitating the toxic gas with the processing liquid to form fine bubbles, a pump provided in the circulation path for forcibly circulating the processing liquid, and a use limit of the processing liquid in the liquid tank A harmful gas elimination device, comprising: a monitoring means for detecting the pressure; and a supply / discharge means for adjusting the processing liquid in conjunction with the monitoring means.
る有毒ガスを除害する装置において、 液体槽の外部に接続した循環路に気液混合・攪拌装置を
介装し、該循環路に前記製造装置から排気される有毒ガ
スを導入するための吸気管を設け、該循環路に設けたポ
ンプにより、該液体槽内の液を該循環路に循環させると
共に該吸気管より前記製造装置から排気される有毒ガス
を導入せしめ、該気液混合・攪拌装置により有毒ガスと
液を混合せしめて該液体槽に戻す機構と、 該液体槽内の液を入れ替えるための給液機構と排液機構
と、 処理後のガスを排気するための排気機構と、 を有することを特徴とする有毒ガスの除害装置。3. A device for removing toxic gas used in a semiconductor manufacturing apparatus or a liquid crystal manufacturing apparatus, wherein a gas-liquid mixing / stirring device is interposed in a circulation path connected to the outside of a liquid tank, and the circulation path is connected to the circulation path. An intake pipe for introducing toxic gas exhausted from the production apparatus is provided, and a pump provided in the circulation path circulates the liquid in the liquid tank to the circulation path and from the production apparatus through the intake pipe. A mechanism for introducing the toxic gas to be exhausted, mixing the toxic gas and the liquid by the gas-liquid mixing / stirring device, and returning the mixed liquid to the liquid tank; a liquid supply mechanism and a drainage mechanism for replacing the liquid in the liquid tank And an exhaust mechanism for exhausting the gas after the treatment.
筒内で液に回転を生じせしめるベーンと、ベーンの下流
側の円筒内壁に設けた突起と、を備えていることを特徴
とする請求項３記載の有害ガスの除害装置。4. A gas-liquid mixing / stirring device comprising: a cylindrical casing; a vane for causing liquid to rotate in the cylinder; and a projection provided on a cylindrical inner wall downstream of the vane. The harmful gas abatement apparatus according to claim 3.
パンチングプレートを設け、該パンチングプレートを斜
めに円筒内部に接するように配置せしめ、ホ゜ンフ゜への給
液側を上部に吐出側を下部に配置したことを特徴とする
請求項３、又は、４記載の有害ガスの除害装置。5. The liquid tank has a cylindrical shape, a punching plate is provided inside the cylindrical shape, and the punching plate is disposed so as to be obliquely in contact with the inside of the cylindrical shape, and the liquid supply side to the horn is on the upper side and the discharge side is on the upper side. The harmful gas abatement apparatus according to claim 3, wherein the harmful gas abatement apparatus is arranged at a lower part.
構を有していることを特徴とする請求項３、４、又は、
５記載の有害ガスの除害装置。6. The air intake pipe has a mechanism for cleaning the deposits on the inner wall of the pipe.
5. The harmful gas removing device according to 5.
のファンと、処理量を調整するためのバルブと、を備え
ていることを特徴とする請求項３、４、３、又は、５記
載の有害ガスの除害装置。7. An air intake pipe comprising a fan for introducing exhaust gas from a manufacturing apparatus and a valve for adjusting a processing amount. 5. The harmful gas removing device according to 5.
定されたｐＨ値を保つように給排液を制御するようにし
たことを特徴とする請求項3、4、５、６、又は、７記載
の有害ガスの除害装置。8. The method according to claim 3, wherein a pH value in the liquid tank is measured, and supply / drainage is controlled so as to maintain a preset pH value. 8. The harmful gas abatement apparatus according to claim 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001018122A JP4805463B2 (en) | 2001-01-26 | 2001-01-26 | Toxic gas abatement equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001018122A JP4805463B2 (en) | 2001-01-26 | 2001-01-26 | Toxic gas abatement equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002219329A true JP2002219329A (en) | 2002-08-06 |
| JP4805463B2 JP4805463B2 (en) | 2011-11-02 |
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ID=18884182
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001018122A Expired - Lifetime JP4805463B2 (en) | 2001-01-26 | 2001-01-26 | Toxic gas abatement equipment |
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| Country | Link |
|---|---|
| JP (1) | JP4805463B2 (en) |
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|---|---|
| JP4805463B2 (en) | 2011-11-02 |
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