JP2002205252A - Working method for sphere and jig therefor - Google Patents

Working method for sphere and jig therefor

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Publication number
JP2002205252A
JP2002205252A JP2001001545A JP2001001545A JP2002205252A JP 2002205252 A JP2002205252 A JP 2002205252A JP 2001001545 A JP2001001545 A JP 2001001545A JP 2001001545 A JP2001001545 A JP 2001001545A JP 2002205252 A JP2002205252 A JP 2002205252A
Authority
JP
Japan
Prior art keywords
polishing
polishing machine
machine
guide ring
spherical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2001001545A
Other languages
Japanese (ja)
Other versions
JP4159751B2 (en
Inventor
Masao Fujino
昌男 藤野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advantest Corp
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Priority to JP2001001545A priority Critical patent/JP4159751B2/en
Publication of JP2002205252A publication Critical patent/JP2002205252A/en
Application granted granted Critical
Publication of JP4159751B2 publication Critical patent/JP4159751B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)

Abstract

PROBLEM TO BE SOLVED: To polish a spherical work with high sphericity using a general-purpose surface polishing machine without introducing a V polishing machine. SOLUTION: A fixture 31, which is mounted with a V-abrasive disk 33, having V-grooves 34 formed on its circumference, attached on the bottom surface of a guide ring 32, is mounted on an abrasive disk 11 of a general-purpose surface polishing machine, with its movement regulated in the circumference direction. A peripheral speed difference acting upon by rotating the abrasive disk 11 rotates the V-abrasive disk 33. A plurality of works 16 are disposed at the V-grooves 34 on the V-abrasive disk 33, and an upper abrasive disk 15 is mounted on the tops of the workpieces 16. The workpieces 16 are supported at three points, thereby conducting polishing with high sphericity.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】この発明は球状被加工物の球
面研磨加工を行う方法及びその方法に用いる治具に関す
る。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for performing spherical polishing of a spherical workpiece and a jig used in the method.

【0002】[0002]

【従来の技術】例えば磁性体共振器において使用される
YIG(イットリウム鉄ガーネット)球などのフェリ磁
性体の単結晶球の研磨加工においては、材料が硬くても
ろく、また加工歪が残留しないようにする必要があるこ
とから、研磨盤を使用して球面研磨加工を行うといった
方法が採用されている。図3はこのような球状被加工物
の研磨加工の従来例として、平面研磨機を使用する構成
を示したものである。
2. Description of the Related Art For example, in polishing a single crystal sphere made of a ferrimagnetic material such as a YIG (yttrium iron garnet) sphere used in a magnetic resonator, the material is hard and brittle so that processing strain does not remain. Therefore, a method of performing spherical polishing using a polishing machine has been adopted. FIG. 3 shows a configuration using a plane polisher as a conventional example of polishing such a spherical workpiece.

【0003】研磨盤(下研磨盤)11の周上に搭載され
たガイドリング12は円筒状をなし、その外周面が支持
アーム13によって支持されている。支持アーム13は
図示しない筐体から延長されたアーム部13aと、その
先端に取り付けられた円弧状をなす支持部13bと、そ
の支持部13bの両端に取り付けられたベアリング13
cとよりなり、両ベアリング13cがガイドリング12
の外周面と接触する構造となっている。ガイドリング1
2はこのような支持アーム13によって支持されること
により、研磨盤11上で回転自在(自転自在)とされ、
また研磨盤11の回転に伴い、その回転方向に動かない
ように研磨盤11の周方向の動きが規制されている。
A guide ring 12 mounted on the periphery of a polishing machine (lower polishing machine) 11 has a cylindrical shape, and its outer peripheral surface is supported by a support arm 13. The support arm 13 includes an arm portion 13a extending from a housing (not shown), an arc-shaped support portion 13b attached to a tip of the arm portion 13a, and bearings 13 attached to both ends of the support portion 13b.
c, and both bearings 13c are
And the outer peripheral surface is contacted. Guide ring 1
2 is rotatable (rotatable) on the polishing plate 11 by being supported by such a support arm 13.
Further, with the rotation of the polishing board 11, the circumferential movement of the polishing board 11 is restricted so as not to move in the rotating direction.

【0004】ガイドリング12内には円板状をなすキャ
リア14と上研磨盤(荷重盤)15とが収容されてい
る。キャリア14の周上には例えば6つの収容孔14a
が等角間隔で形成されており、これら収容孔14aに研
磨すべき被加工物16がそれぞれ可動自在に配置され
る。上研磨盤15はこれら被加工物16上に積載されて
おり、この上研磨盤15によって各被加工物16に所要
の荷重が付加される。上記のような構成を有する平面研
磨機においては、研磨盤11を回転させると、作用する
周速差によってガイドリング12及び被加工物16を保
持したキャリア14が研磨盤11上で回転(自転)し、
被加工物16が研磨盤11と上研磨盤15とに挟まれた
状態でころがりながら動くため、その表面が研磨される
ものとなる。なお、この際、支持アーム13は矢印17
で示したように、適宜往復運動される。図中、18は研
磨盤11を回転させる回転シャフトを示す。
[0004] A disc-shaped carrier 14 and an upper polishing machine (loading machine) 15 are accommodated in the guide ring 12. On the periphery of the carrier 14, for example, six accommodation holes 14a
Are formed at equiangular intervals, and workpieces 16 to be polished are movably arranged in the accommodation holes 14a. The upper polishing machine 15 is mounted on these workpieces 16, and a required load is applied to each workpiece 16 by the upper polishing machine 15. In the planar polishing machine having the above-described configuration, when the polishing disk 11 is rotated, the carrier 14 holding the guide ring 12 and the workpiece 16 is rotated on the polishing disk 11 (rotation) by the difference in peripheral speed acting on the polishing disk. And
Since the workpiece 16 moves while rolling while being sandwiched between the polishing board 11 and the upper polishing board 15, the surface thereof is polished. At this time, the support arm 13 is indicated by an arrow 17.
Reciprocating motion is performed as shown in FIG. In the figure, reference numeral 18 denotes a rotating shaft for rotating the polishing machine 11.

【0005】[0005]

【発明が解決しようとする課題】ところで、上述したよ
うな平面研磨機を使用した研磨加工においては、球状被
加工物16が研磨盤11と上研磨盤15とによって2点
支持された構造となっているため、研磨加工の進行に伴
い、被加工物16がいわゆる三角おむすびのような形状
になる傾向があり、真球度の良好な球が得られないとい
った問題がある。一方、研磨加工において、真球度の良
い球を得る方法として、図4に示したような構成を有す
るV研磨機を使用する方法がある。
By the way, in the polishing process using the above-mentioned plane polishing machine, the spherical workpiece 16 is supported at two points by the polishing disk 11 and the upper polishing disk 15. Therefore, there is a problem that the workpiece 16 tends to have a so-called triangular shape with the progress of the polishing process, and a sphere having good sphericity cannot be obtained. On the other hand, as a method of obtaining a sphere having good sphericity in the polishing process, there is a method of using a V polishing machine having a configuration as shown in FIG.

【0006】このV研磨機は上研磨盤21と、いわゆる
V研磨盤と称される下研磨盤22とが対向配置されたも
ので、下研磨盤22にはその対向面の円周上にV溝23
が形成されている。上研磨盤21と下研磨盤22とはそ
れぞれ回転シャフト24,25に取り付け支持されてお
り、また上研磨盤21とその回転シャフト24とは例え
ば上下方向に移動可能とされ、かつ所要の荷重を付加で
きる構造となっている。このV研磨機においては、被加
工物16をV溝23に必要数配置し、それら被加工物1
6に上研磨盤21を接触させ、荷重を付加した状態で、
上研磨盤21と下研磨盤22とを例えば逆方向に回転さ
せることによって、被加工物16がV溝23上をころが
りながら動き、これによって被加工物16が研磨される
ものとなっており、この際、被加工物16は3点支持さ
れた構造となっているため、真球度の良好な球が得られ
るものとなっている。
In this V polishing machine, an upper polishing disk 21 and a lower polishing disk 22 called a so-called V polishing disk are arranged to face each other. Groove 23
Are formed. The upper polishing plate 21 and the lower polishing plate 22 are mounted and supported on rotating shafts 24 and 25, respectively. The upper polishing plate 21 and the rotating shaft 24 are movable, for example, in the vertical direction, and apply a required load. It has a structure that can be added. In this V polishing machine, a required number of workpieces 16 are arranged in V grooves 23, and
6 and the upper polishing plate 21 is brought into contact with a load,
By rotating the upper polishing plate 21 and the lower polishing plate 22 in, for example, opposite directions, the workpiece 16 moves while rolling on the V-groove 23, whereby the workpiece 16 is polished. At this time, since the workpiece 16 has a structure supported at three points, a sphere having good sphericity can be obtained.

【0007】このようにV研磨機を使用すれば、真球度
の良好な球を得ることができるものの、そのためには新
たにV研磨機を導入しなければならず、導入コストがか
かり負担の大きいものとなっていた。この発明の目的は
この問題に鑑み、新たにV研磨機を導入することなく、
汎用の平面研磨機を使用して真球度の良好な球を得られ
るようにした球加工方法を提供することにあり、さらに
その方法に用いる治具を提供することにある。
[0007] If a V grinder is used as described above, a ball with good sphericity can be obtained. However, for that purpose, a new V grinder must be introduced, and the introduction cost and burden are increased. It was big. In view of this problem, an object of the present invention is to introduce a new V polishing machine without introducing a new V polishing machine.
It is an object of the present invention to provide a ball processing method that can obtain a sphere having good sphericity by using a general-purpose surface polishing machine, and to provide a jig used for the method.

【0008】[0008]

【課題を解決するための手段】請求項1の発明によれ
ば、円周上にV溝が形成されたV研磨盤のV溝に複数の
球状被加工物を配置し、それら被加工物上に上研磨盤を
積載して、その上研磨盤に対してV研磨盤を相対的に回
転させることにより、被加工物の球面研磨を行う加工方
法において、V研磨盤を円筒状ガイドリングの底面に取
り付けて固定し、そのガイドリングを平面研磨機の研磨
盤の周上に、その周方向の動きを規制して搭載し、上記
研磨盤を回転させることにより、V研磨盤に作用する周
速差によって、上記球面研磨を行うためのV研磨盤の上
記回転を得るものとする。
According to the first aspect of the present invention, a plurality of spherical workpieces are arranged in a V-groove of a V-grinding machine having a V-groove formed on a circumference thereof. In the processing method of performing the spherical polishing of the workpiece by mounting the upper polishing machine on the upper polishing machine and rotating the V polishing machine relatively to the upper polishing machine, the V polishing machine is mounted on the bottom surface of the cylindrical guide ring. The guide ring is mounted on the periphery of the polishing machine of the plane polishing machine with its movement in the circumferential direction regulated. By rotating the polishing machine, the peripheral speed acting on the V polishing machine is fixed. By the difference, the rotation of the V polishing machine for performing the spherical polishing is obtained.

【0009】請求項2の発明によれば、平面研磨機の回
転する研磨盤の周上に、支持アームによってその周方向
の動きが規制され、かつ回転自在に支持されて搭載さ
れ、研磨盤の回転により作用する周速差によって研磨盤
上で回転する構造とされた治具は、円筒状ガイドリング
と、そのガイドリングの底面に取り付け固定されたV研
磨盤とよりなり、V研磨盤はその内面側に、円周上に形
成されたV溝を具備しているものとされる。
According to the second aspect of the present invention, the movement of the polishing machine in the circumferential direction is regulated by the supporting arm on the periphery of the rotating polishing machine of the plane polishing machine, and the support is rotatably supported and mounted. A jig having a structure rotating on a polishing machine by a peripheral speed difference caused by rotation is composed of a cylindrical guide ring and a V polishing machine attached and fixed to the bottom surface of the guide ring. The inner surface is provided with a V-groove formed on the circumference.

【0010】[0010]

【発明の実施の形態】この発明の実施の形態を図面を参
照して実施例により説明する。図1はこの発明による球
加工用治具の一実施例の構成を断面図で示したものであ
る。この例では治具31は円筒状をなすガイドリング3
2と、そのガイドリング32に取り付け固定されたV研
磨盤33とよりなるものとされる。V研磨盤33は円周
上に形成されたV溝34を具備しており、このV溝34
形成面が内面側とされてガイドリング32の底面に、そ
の開口を蓋するように取り付けられている。
Embodiments of the present invention will be described with reference to the accompanying drawings. FIG. 1 is a sectional view showing a configuration of an embodiment of a ball processing jig according to the present invention. In this example, the jig 31 is a cylindrical guide ring 3.
2 and a V polishing machine 33 attached and fixed to the guide ring 32. The V polishing machine 33 has a V groove 34 formed on the circumference.
The inner surface of the guide ring 32 is formed on the bottom surface of the guide ring 32 so as to cover the opening.

【0011】上記のような構成とされた治具31は図3
におけるガイドリング12と同様に、平面研磨機の研磨
盤の周上に、支持アームによってその周方向の動きが規
制され、かつ回転自在(自転自在)に支持されて搭載さ
れるものとされる。図2Aはこの治具31が平面研磨機
の研磨盤の周上に搭載された状態を示したものであり、
図3と対応する部分には同一符号を付してある。研磨盤
11を回転させると、支持アーム13によって支持され
ている治具31はV研磨盤33に作用する周速差によっ
て研磨盤11上で回転する。従って、V溝34に研磨す
べき球状被加工物16を所要数図2Bに示したように配
置し、それら被加工物16上に上研磨盤15を積載して
所要の荷重を付加することによって、被加工物16の球
面研磨加工が行われるものとなる。
The jig 31 configured as described above is shown in FIG.
As in the case of the guide ring 12, the support arm restricts the movement in the circumferential direction and is supported rotatably (rotatably) on the periphery of the polishing plate of the plane polishing machine. FIG. 2A shows a state in which this jig 31 is mounted on the periphery of a polishing plate of a flat surface polishing machine,
Parts corresponding to those in FIG. 3 are denoted by the same reference numerals. When the polishing machine 11 is rotated, the jig 31 supported by the support arm 13 rotates on the polishing machine 11 due to a difference in peripheral speed acting on the V polishing machine 33. Therefore, the required number of spherical workpieces 16 to be polished are arranged in the V-grooves 34 as shown in FIG. 2B, and the upper polishing plate 15 is loaded on the workpieces 16 and a required load is applied. Then, the workpiece 16 is subjected to spherical polishing.

【0012】被加工物16はV溝34と上研磨盤15と
によって3点支持されているため、真球度の良好な球を
得ることができ、即ちこのような加工方法を採用するこ
とにより、平面研磨機で真球度良く、球状被加工物16
の球面研磨加工を行えるものとなる。図2A中、35は
支持アーム13に固定されている研磨液供給管を示し、
この研磨液供給管35を介して研磨液が治具31内に供
給されるものとなっている。なお、上研磨盤15に対し
てV研磨盤33が相対的に良好に回転して被加工物16
がV溝34上を良好にころがるように、つまり上研磨盤
15がV研磨盤33の回転に連動して回転しないよう
に、上研磨盤15は固定しておくのが好ましい。固定は
図には示していないが支持アーム13を利用して行うこ
とができる。
Since the workpiece 16 is supported at three points by the V-groove 34 and the upper polishing plate 15, a sphere having good sphericity can be obtained. That is, by adopting such a processing method, Spherical workpiece 16
Can be polished. 2A, reference numeral 35 denotes a polishing liquid supply pipe fixed to the support arm 13,
The polishing liquid is supplied into the jig 31 through the polishing liquid supply pipe 35. Note that the V polishing machine 33 rotates relatively favorably with respect to the upper polishing machine 15 and
It is preferable that the upper polishing plate 15 be fixed so that the upper polishing plate 15 can be satisfactorily rolled on the V groove 34, that is, the upper polishing plate 15 does not rotate in conjunction with the rotation of the V polishing plate 33. Although not shown in the drawing, the fixing can be performed by using the support arm 13.

【0013】[0013]

【発明の効果】以上説明したように、この発明による球
加工方法によれば、新たにV研磨機を導入することな
く、汎用の平面研磨機を使用して真球度良く、球状被加
工物の球面研磨加工を行うことができる。また、この発
明による球加工用治具によれば、上記のような平面研磨
機を使用した球面研磨加工を簡易に行えるものとなる。
As described above, according to the ball machining method according to the present invention, a spherical work piece can be obtained with good sphericity using a general-purpose plane grinder without newly introducing a V grinder. Spherical polishing can be performed. Further, according to the ball processing jig according to the present invention, it is possible to easily perform the spherical polishing using the above-mentioned plane polishing machine.

【図面の簡単な説明】[Brief description of the drawings]

【図1】この発明による球加工用治具の実施例を示す断
面図。
FIG. 1 is a sectional view showing an embodiment of a ball processing jig according to the present invention.

【図2】この発明による球加工方法を説明するための
図。
FIG. 2 is a diagram for explaining a ball machining method according to the present invention.

【図3】平面研磨機を使用した従来の球加工方法を説明
するための図。
FIG. 3 is a view for explaining a conventional ball processing method using a plane polishing machine.

【図4】V研磨機を使用した従来の球加工方法を説明す
るための図。
FIG. 4 is a view for explaining a conventional ball processing method using a V polishing machine.

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 円周上にV溝が形成されたV研磨盤のV
溝に複数の球状被加工物を配置し、それら被加工物上に
上研磨盤を積載して、その上研磨盤に対してV研磨盤を
相対的に回転させることにより、被加工物の球面研磨を
行う加工方法であって、 上記V研磨盤を円筒状ガイドリングの底面に取り付けて
固定し、 そのガイドリングを平面研磨機の研磨盤の周上に、その
周方向の動きを規制して搭載し、 上記研磨盤を回転させることにより、上記V研磨盤に作
用する周速差によって、上記球面研磨を行うためのV研
磨盤の上記回転を得ることを特徴とする球加工方法。
1. The V of a V polishing machine having a V groove formed on the circumference.
A plurality of spherical workpieces are arranged in the grooves, an upper polishing machine is mounted on the workpieces, and the V polishing machine is rotated relative to the upper polishing machine to thereby obtain a spherical surface of the workpiece. A polishing method in which the V polishing machine is attached to and fixed to the bottom surface of a cylindrical guide ring, and the guide ring is placed on the periphery of the polishing machine of a flat-surface polishing machine while regulating the movement in the circumferential direction. A ball processing method comprising: mounting and rotating the polishing machine to obtain the rotation of the V polishing machine for performing the spherical polishing by a peripheral speed difference acting on the V polishing machine.
【請求項2】 平面研磨機の回転する研磨盤の周上に、
支持アームによってその周方向の動きが規制され、かつ
回転自在に支持されて搭載され、研磨盤の回転により作
用する周速差によって研磨盤上で回転する構造とされた
治具であって、 円筒状ガイドリングと、 そのガイドリングの底面に取り付け固定されたV研磨盤
とよりなり、 上記V研磨盤はその内面側に、円周上に形成されたV溝
を具備していることを特徴とする球加工用治具。
2. On the periphery of a rotating polishing machine of a plane polishing machine,
A jig having a structure in which its movement in the circumferential direction is regulated by a support arm, and is rotatably supported and mounted, and is configured to rotate on the polishing board by a difference in peripheral speed acting by rotation of the polishing board; A V-shaped polishing ring attached to and fixed to the bottom surface of the guide ring, wherein the V-shaped polishing disk is provided with a V-shaped groove formed on the inner surface of the V-shaped polishing ring. Jig for ball processing.
JP2001001545A 2001-01-09 2001-01-09 Sphere processing method and jig used in the method Expired - Fee Related JP4159751B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001001545A JP4159751B2 (en) 2001-01-09 2001-01-09 Sphere processing method and jig used in the method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001001545A JP4159751B2 (en) 2001-01-09 2001-01-09 Sphere processing method and jig used in the method

Publications (2)

Publication Number Publication Date
JP2002205252A true JP2002205252A (en) 2002-07-23
JP4159751B2 JP4159751B2 (en) 2008-10-01

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* Cited by examiner, † Cited by third party
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CN101841312A (en) * 2010-05-07 2010-09-22 中国电子科技集团公司第九研究所 YIG harmonic oscillator, YIG oscillator and manufacturing methods thereof
CN108608274A (en) * 2018-06-12 2018-10-02 常州市润昌光电科技有限公司 A kind of ultra-precision continuous polishing machine
CN108907971A (en) * 2018-07-28 2018-11-30 杭州智谷精工有限公司 A kind of method for fine finishing of small size sphere
CN110340742A (en) * 2019-07-18 2019-10-18 浙江科惠医疗器械股份有限公司 A kind of double rubbing head polishing processing devices of bioceramic spherical surface

Cited By (5)

* Cited by examiner, † Cited by third party
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CN101841312A (en) * 2010-05-07 2010-09-22 中国电子科技集团公司第九研究所 YIG harmonic oscillator, YIG oscillator and manufacturing methods thereof
CN108608274A (en) * 2018-06-12 2018-10-02 常州市润昌光电科技有限公司 A kind of ultra-precision continuous polishing machine
CN108907971A (en) * 2018-07-28 2018-11-30 杭州智谷精工有限公司 A kind of method for fine finishing of small size sphere
CN110340742A (en) * 2019-07-18 2019-10-18 浙江科惠医疗器械股份有限公司 A kind of double rubbing head polishing processing devices of bioceramic spherical surface
CN110340742B (en) * 2019-07-18 2021-08-27 浙江科惠医疗器械股份有限公司 Biological ceramic sphere double-polishing-head polishing device

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