CN108907971A - A kind of method for fine finishing of small size sphere - Google Patents

A kind of method for fine finishing of small size sphere Download PDF

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Publication number
CN108907971A
CN108907971A CN201810848644.4A CN201810848644A CN108907971A CN 108907971 A CN108907971 A CN 108907971A CN 201810848644 A CN201810848644 A CN 201810848644A CN 108907971 A CN108907971 A CN 108907971A
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CN
China
Prior art keywords
circular plate
plate retainer
small size
fine finishing
retaining ring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201810848644.4A
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Chinese (zh)
Inventor
袁巨龙
熬雪梅
张万辉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hangzhou Zhi Gu Seiko Co Ltd
Original Assignee
Hangzhou Zhi Gu Seiko Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hangzhou Zhi Gu Seiko Co Ltd filed Critical Hangzhou Zhi Gu Seiko Co Ltd
Priority to CN201810848644.4A priority Critical patent/CN108907971A/en
Publication of CN108907971A publication Critical patent/CN108907971A/en
Pending legal-status Critical Current

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B11/00Machines or devices designed for grinding spherical surfaces or parts of spherical surfaces on work; Accessories therefor
    • B24B11/02Machines or devices designed for grinding spherical surfaces or parts of spherical surfaces on work; Accessories therefor for grinding balls
    • B24B11/04Machines or devices designed for grinding spherical surfaces or parts of spherical surfaces on work; Accessories therefor for grinding balls involving grinding wheels

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

A kind of method for fine finishing of small size sphere, when processing, retaining ring bias is placed on lower millstone, and is limited by limiter, can do rotation, but axle center will not be mobile relative to the axis of rotation of lower millstone;Circular plate retainer and upper millstone are sequentially placed in the retaining ring from top to bottom;The thickness of the circular plate retainer is less than spherical work-piece thickness, which is provided with through-hole, spherical work-piece is placed in the through-hole on circular plate retainer;Compression weight is placed with one heart on the upper millstone;The lower millstone rotates under the drive of the drive, retaining ring rotation in the case where the friction of lower millstone drives.This method efficiently solves the problems, such as under the limit-type the processing of sphere mode of both the above two o'clock that circular plate retainer is also easy to produce polishing fluid between deformation, circular plate retainer and polishing pad and circulates unsmooth, and mechanical structure is simple, and processing quality is good.

Description

A kind of method for fine finishing of small size sphere
Technical field
The invention belongs to Ultra-precision Turning field, especially a kind of method for fine finishing of small size sphere.
Background technique
With the promotion of manufacturing industry integral level, electronic product constantly develops to miniaturization, precise treatment direction, such as high-precision Micro Milling Machine, hard disc of computer and micromotor etc., rotating moving part are required using high-performance micro bearing.Therefore, Microspheres of the diameter in 0~3mm obtain the huge market demand as one of the element of most critical in miniature bearing.
Currently, there are mainly two types of modes for the finishing of microspheres:(1) the limit-type the processing of sphere method of two o'clock;(2) three points Limit-type the processing of sphere method, wherein it is most commonly used or 3 points it is limit-type in traditional V-groove lapping mode.But using biography System V-groove lapping mode, the grinding track of spherical surface are one group of parallel concentric circles, and the machining accuracy of sphere is low and criticizes consistency Difference;In the limit-type the processing of sphere method of two o'clock, patent:200610155411.3 planetary type precise sphere milling apparatus is disclosed, But this method exists following insufficient:(1) structure is complicated, needs additionally to apply the transmission mechanism of secondary motion;(2) microspheres are processed When, since circular plate retainer is in lamellar, be connected by pawl disk with circular plate retainer come transfer of torque it is easy so that Circular plate retainer generates biggish deformation, and spherical work-piece is caused to roll out from retaining hole.Patent:102554762 A of CN is public The processing method for having opened a kind of precision spherical parts, but this method has the following disadvantages:(1) when processing microspheres, circular slab Part retainer is in lamellar, and circular plate retainer needs engage with centre wheel and ring gear gear respectively, due to centre wheel with The different rotating speeds of ring gear gear combine so that circular plate retainer bear the different radial force in two sizes, directions, Deformation is easily generated when the force of periphery, therefore very high to the material performance requirement of circular plate retainer, considerably increase cost; (2) since microspheres quality is small, inertia force is small, more sensitive to the concentricity of upper lower burrs, and under such processing method, it is difficult to Guarantee upper lower burrs rotating shaft concentricity with higher, to influence batch consistency of processing;In addition to this, with both the above When the limit-type the processing of sphere method of two o'clock processes microspheres, very due to the gap between circular plate retainer and polishing pad It is small, it circulates unsmooth situation so being easy to produce polishing fluid.
Summary of the invention
The purpose of the method for the present invention is that proposes a kind of method for fine finishing of small size sphere, for existing sphere Processing method is unable to satisfy the demand of microspheres finishing, and this method efficiently solves the limit-type sphere of both the above two o'clock and adds Circular plate retainer is also easy to produce polishing fluid between deformation, circular plate retainer and polishing pad and circulates unsmooth ask under work mode Topic, and mechanical structure is simple, and processing quality is good.
In order to solve the above technical problems, the present invention provides following technical solutions:When processing, retaining ring bias is placed in lower mill It on disk, and is limited by limiter, rotation can be done, but axle center will not be mobile relative to the axis of rotation of lower millstone;In the retaining ring Circular plate retainer and upper millstone are sequentially placed from top to bottom;It is thick that the thickness of the circular plate retainer is less than spherical work-piece Degree, which is provided with through-hole, spherical work-piece is placed in the through-hole on circular plate retainer;Pressurization is placed on the upper millstone with one heart Counterweight;The lower millstone rotates under the drive of the drive, retaining ring rotation in the case where the friction of lower millstone drives.
Compared with prior art, for method of the invention in processing, circular plate retainer is mainly by from retaining ring The radial force and spherical work-piece that inside acts on it are to the power of through hole wall effect thereon, in process, circular retainer It is not easy to be destroyed, and spherical work-piece is in lower abrasive disk, the collaboration work of circular plate retainer and the upper polishing disk to be pressurizeed by counterweight Under, there is specific motion profile, studies have shown that the uniform full packet of the processing of sphere track may be implemented in method of the invention Network, to realize the uniform removal of material, machining accuracy is high, and batch consistency is good.
Further, when processing, the centre of sphere of spherical work-piece is located in the through-hole of the circular plate retainer.Experiments have shown that The matched well of through-hole and spherical work-piece not only helps circular plate retainer to the control ability of spherical work-piece, can also increase Big spherical work-piece and circular plate retainer inner wall contact rate, are conducive to being fully rotatable for ball, obtain higher polishing efficiency.
Further, the circular plate retainer includes substrate and several pads for being uniformly distributed on substrate downside surface Piece.Studies have shown that gasket can not only reduce the abrasion of circular plate retainer, the good circulation of polishing fluid is additionally aided, from And improve polishing efficiency.
Further, the hardness of the substrate is less than the hardness of the spherical work-piece.It the advantage is that:Circular plate retainer It is unlikely to deform in the tangential force and load that receiving spherical work-piece applies it.
Further, the through-hole on the circular plate retainer is cylindrical hole, the through-hole and the spherical shape to be processed Workpiece matches;Helically threadiness is uniformly distributed on circular plate retainer the through-hole.Experiment shows through-hole helically line Shape, which is uniformly distributed, is conducive to circular plate retainer uniform stressed, slows down the deformation of circular plate retainer.It (is uniformly distributed and refers to The distance of adjacent two through hole is definite value)
Further, several radial type trench, ditch are evenly distributed on the surface that the retaining ring is contacted with the lower millstone The height of slot is less than the thickness of circular plate retainer.Studies have shown that the height of the groove of retaining ring bottom is less than circular plate It when the thickness of retainer, can not only guarantee the good circulation of polishing fluid, but also can guarantee that retaining ring medial surface and circular plate are protected The Maximum Contact area of frame lateral surface is held, to be conducive to the rotation of circular plate retainer.
Further, the ratio in the distance between the axle center of the retaining ring and the axle center of the lower millstone and lower millstone radius No more than 0.5.Studies have shown that when retaining ring axle center and the lower millstone axle center between eccentricity and lower millstone radius it Between ratio when being not more than 0.5, it is ensured that the ball load of a disk is maximum, improves output, at the same material removal speed also compared with Fastly, high production efficiency.
Further, the diameter of the upper millstone is bigger than the diameter of the circular plate retainer, and upper millstone diameter and circle The difference of shape plate retainer diameter is no more than the one third of circular plate retainer diameter.By inventor's repetition test, this When can be improved in whole process and stablize, is reliable, while all spherical spherical work-pieces in through-hole are contacted with upper millstone always, Be conducive to the consistency of processing.
Further, in polishing fluid used in the method for fine finishing, the silica solution comprising 4.0wt%, 1.0wt%'s is double Oxygen water, the amion acetic acid of 0.75wt% and the benzotriazole of 0.12wt%.Polishing fluid formula after test of many times is improved most It determines eventually, experiments have shown that, the polishing fluid possesses better circulation.
Detailed description of the invention
Fig. 1 is the schematic diagram of the method for fine finishing of small size sphere;
Fig. 2 is Fig. 1 top view;
Fig. 3 is the cross section view in the face B-B of Fig. 2;
Fig. 4 is to maintain the structural schematic diagram of ring;
Fig. 5 is the floor map of circular plate retainer.
Label in attached drawing be:1, lower millstone;2, lower polishing pad;3, retaining ring;4, limiter;5, circular plate is kept Frame;6, through-hole;7, gasket;8, upper polishing pad;9, upper millstone;10, pressurizing device;11, radial type trench.
Specific embodiment
With reference to the accompanying drawings and detailed description (embodiment) the present invention is further illustrated, but be not intended as pair The foundation that the present invention limits.
Referring to Fig.1~Fig. 5, a kind of method for fine finishing of small size sphere, 3 bias of retaining ring be placed on lower millstone 1 and by Limiter 4 limits, and circular plate retainer 5 is placed in retaining ring 3, and the circular plate retainer 5 includes substrate and several pads Piece 7;The substrate preferred material is polymethyl methacrylate or alloy cast iron;The material of the gasket 7 should have it is acidproof, The characteristics of alkali, high intensity, high-wearing feature, preferably polymethyl methacrylate, chromium carbide compounded material.Spherical work-piece is placed in through-hole In 6, the distribution of the through-hole 6 can be concentric circles, radial, zigzag shape, it is latticed in any one, preferably spiral shell Spin line shape.Upper millstone 9 is placed in spherical work-piece, last opposite upper millstone 9 places compression weight 10 with one heart.
The lower millstone 1 is driven by driving device, and revolving speed is ω 1;Retaining ring 3 lower polishing pad 2 friction drive under with 2 rotation of ω;The side of circular plate retainer 5 and the side of upper polishing disk 9 in the actual processing process respectively with retaining ring 3 Inside is contacted in line, forms friction pair, and circular plate retainer 5 is protected by the friction pair with lower polishing pad 2 in conjunction with circular plate The friction pair for holding 5 side of frame and the formation of 3 interior side contacts point of retaining ring, so that 5 rotation of circular plate retainer, upper millstone 9 are being protected The friction of support ring 3 drives lower rotation;Spherical work-piece is driven by circular plate retainer 5, upper millstone 9 with the movement of specific track, real The full envelope of existing machining locus obtains higher processing quality to uniformly be removed to material.
The specification of the spherical work-piece can be single 50~100g of ball, and the lower millstone 1 can be with 10~15r/min's Rotation speed operation;Every 4~6 minutes addition stock removal polishing liquid.
Embodiment:
The lower millstone 1 is made of lower mill basal disc and the lower polishing pad 2 adhered to it, diameter 300mm, the upper mill Disk 9 is made of upper mill basal disc and the upper polishing pad 8 adhered to it, diameter 110mm.
The circular plate retainer 5 is diameter 95mm, and the acrylic thin plate of thickness 1.5mm, the through-hole 6 is uniformly distributed On the concentric circles that diameter is followed successively by 40mm, 60mm, 80mm, 16 through-holes, the diameter of the through-hole 6 are uniformly distributed on each circle Slightly larger than single sphere diameter 2.3810mm, the through-hole diameter is specially 2.5mm, in the one side of the circular plate retainer 5, is in It is 5mm that cyclic annular 120 degree of spacing, which adhere to 3 diameters, with a thickness of the circular gasket 7 of 0.5mm.
The axle center of the retaining ring 3 relative to the lower millstone 1 axle center be in 80mm bias;The retaining ring 3 it is straight Diameter is 140mm, and side is uniform-distribution with wide 3mm, the radial type trench 11 of high 1.5mm and fluting side and connects with the polishing pad 2 Touching;The shape of groove is rectangular channel (U-lag can also with).
In the polishing fluid, the silica solution comprising 4.0wt%, the hydrogen peroxide of 1.0wt%, the amion acetic acid of 0.75wt% With the benzotriazole of 0.12wt%.That is the silica solution containing 4g in 100g polishing fluid, the hydrogen peroxide of 1g, the amino second of 0.75g The benzotriazole of acid and 0.12g.Experiments have shown that by the processing of 60min, the surface roughness of 2.3810 sphere of Φ from 15.9nm being reduced to 5.8nm.
Although the present invention is described so that diameter is the bearing steel ball of 2.3810mm as an example, the present invention is not limited, One of ordinary skilled in the art according to the present invention can instruct to carry out the throwing of other ball materials, other sized-balls Light.
The above-mentioned generality to invention involved in the application is described and be should not be understood to the description of its specific embodiment For be to the inventive technique scheme constitute limitation.Those skilled in the art can not disobey according to disclosure herein Under the premise of invention constituent element involved in carrying on the back, to above-mentioned general description or/and specific embodiment (including embodiment) In public technology feature increased, reduced or combined, formed and belong to other technical sides within the application protection scope Case.

Claims (9)

1. a kind of method for fine finishing of small size sphere, it is characterised in that:When processing, retaining ring bias is placed on lower millstone, and It is limited by limiter, rotation can be done, but axle center will not be mobile relative to the axis of rotation of lower millstone;In the retaining ring from top to bottom Sequentially place circular plate retainer and upper millstone;The thickness of the circular plate retainer is less than spherical work-piece thickness, thereon Equipped with through-hole, spherical work-piece is placed in the through-hole on circular plate retainer;Compression weight is placed with one heart on the upper millstone;Institute It states lower millstone to rotate under the drive of the drive, retaining ring rotation in the case where the friction of lower millstone drives.
2. a kind of method for fine finishing of small size sphere as described in claim 1, it is characterised in that:When processing, spherical work-piece The centre of sphere be located in the through-hole of the circular plate retainer.
3. a kind of method for fine finishing of small size sphere as claimed in claim 2, it is characterised in that:The circular plate is kept Frame includes substrate and several gaskets for being uniformly distributed on substrate downside surface.
4. a kind of method for fine finishing of small size sphere as claimed in claim 3, it is characterised in that:The hardness of the substrate is small In the hardness of the spherical work-piece.
5. a kind of method for fine finishing of small size sphere as described in claim 1, it is characterised in that:The circular plate is kept Through-hole on frame is cylindrical hole;Helically threadiness is uniformly distributed on circular plate retainer the through-hole.
6. a kind of method for fine finishing of small size sphere as described in claim 1, it is characterised in that:The retaining ring with it is described Several radial type trench are evenly distributed on the surface of lower millstone contact, the height of groove is less than the thickness of circular plate retainer Degree.
7. a kind of method for fine finishing of small size sphere as described in claim 1, it is characterised in that:The axle center of the retaining ring The distance between axle center of the lower millstone and the ratio of lower millstone radius are not more than 0.5.
8. a kind of method for fine finishing of small size sphere as described in claim 1, it is characterised in that:The diameter of the upper millstone Diameter than the circular plate retainer is big, and the difference of upper millstone diameter and circular plate retainer diameter is no more than circular slab The one third of part retainer diameter.
9. a kind of method for fine finishing of small size sphere as described in claim 1 to 8 any claim, it is characterised in that: In used polishing fluid, the silica solution comprising 4.0wt%, the hydrogen peroxide of 1.0wt%, the amion acetic acid of 0.75wt% and The benzotriazole of 0.12wt%.
CN201810848644.4A 2018-07-28 2018-07-28 A kind of method for fine finishing of small size sphere Pending CN108907971A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110153839A (en) * 2019-06-06 2019-08-23 中国工程物理研究院激光聚变研究中心 Unified polishing immersion element processing unit (plant), processing method and polishing machine

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002205252A (en) * 2001-01-09 2002-07-23 Advantest Corp Working method for sphere and jig therefor
CN201012468Y (en) * 2006-12-31 2008-01-30 深圳市百泰珠宝首饰有限公司 Sand-rolling machine
CN101554707A (en) * 2009-04-16 2009-10-14 武汉金凰珠宝股份有限公司 Automatic sand nailing device
CN202062282U (en) * 2011-04-20 2011-12-07 豪雅光电科技(苏州)有限公司 Glass grinding device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002205252A (en) * 2001-01-09 2002-07-23 Advantest Corp Working method for sphere and jig therefor
CN201012468Y (en) * 2006-12-31 2008-01-30 深圳市百泰珠宝首饰有限公司 Sand-rolling machine
CN101554707A (en) * 2009-04-16 2009-10-14 武汉金凰珠宝股份有限公司 Automatic sand nailing device
CN202062282U (en) * 2011-04-20 2011-12-07 豪雅光电科技(苏州)有限公司 Glass grinding device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110153839A (en) * 2019-06-06 2019-08-23 中国工程物理研究院激光聚变研究中心 Unified polishing immersion element processing unit (plant), processing method and polishing machine
CN110153839B (en) * 2019-06-06 2023-12-26 中国工程物理研究院激光聚变研究中心 Full-caliber polishing immersed element processing device, processing method and polishing machine

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