JP2002193444A - Feeding method and feeder - Google Patents

Abstract

PROBLEM TO BE SOLVED: To supply a metal base circuit board and an intermediate body to carry-in parts of various devices without adhesion of dust and damage. SOLUTION: This feeding method for a plate-like body to be fed includes a process of arranging a body to be fed with the main surface pointed in the horizontal direction, a process of fixing a vacuum chuck A on one main surface of the body to be fed and moving the vacuum chuck A to bring a part of the body to be fed into contact with a guide part, a process of fixing the body to be fed by another chuck B fixed to the guide part and movable integrally with the guide part, moving the vacuum chuck B to bring one main surface of the body to be fed into contact with the guide part in plane, and then detaching the vacuum chuck A, a process of moving the guide part with the body to be fed and the vacuum chuck B fixed to move the body to be fed and set the same in a desired position, and a process of detaching the vacuum chuck B and moving the body to be fed while being slid along the guide part surface to a desired device.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement in a method of transporting a metal-based circuit board for mounting a semiconductor used in electric equipment, communication equipment, automobiles and the like.

[0002]

2. Description of the Related Art Circuit boards on which semiconductor elements and various electric components are mounted are known in a wide range of fields such as electric equipment, communication equipment, and automobiles. Circuit boards have attracted attention and are being used.

A metal-based circuit board has a structure in which a circuit is provided on one main surface of a metal plate excellent in heat dissipation through an insulating layer, and iron and aluminum are often used for the metal plate. The insulating layer is made of a resin such as an epoxy resin containing an inorganic filler such as aluminum oxide, and the circuit is formed of various metal foils, usually made of copper, aluminum, or a composite material of copper and aluminum. It is heavily used.

[0004] Generally, a metal-based circuit board is formed by applying a resin layer to be an insulating layer on a metal plate, and pressing and heating a laminate in which a metal foil is placed on the resin layer. After the layer is cured, an etching resist is provided on a desired portion of the metal foil, the metal foil is etched, and the etching resist is removed.

[0005] Metal-based circuit boards are mass-produced to be applied to various uses, and in the above-mentioned manufacturing process, an operation of providing a resin layer on a metal plate, an operation of laminating a metal foil, and pressing a laminate are performed. An operation of curing a resin layer by heating, an operation of providing an etching resist, an operation of etching a metal foil, an operation of removing an etching resist,
Further, operations such as processing as necessary are continuously processed in a considerable part.

[0006] A transfer device such as a conveyor is used for movement between the devices for performing the above operations. However, depending on the configuration of the device, it is necessary to direct the main surface of the metal plate vertically or horizontally. It is often provided before and after the transfer device, particularly in a transfer portion provided immediately before the device.

For example, Japanese Patent Application Laid-Open No. 7-101545 discloses that
Without damaging the substrate or attaching dust,
A supply device for mounting a substrate for a printed wiring board on a transfer device for transferring a substrate from a rack storage device to a next device is disclosed.

[0008]

However, according to the study of the present inventor, when the above-mentioned device is applied to a metal-based circuit board, it is necessary to place an uncured (B stage) resin layer on a metal plate. When applying the above-described apparatus to a metal base circuit board intermediate in which a metal foil is integrated, peeling of the metal foil due to contact of a charging device member, displacement, and in severe cases, the metal foil may be torn and obtained. It has been found that there is a problem that the electrical characteristics of the metal-based circuit board are deteriorated, and as a result, the yield of products is significantly reduced.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide various devices which do not attach dust to or damage a metal base circuit board and an intermediate body. An object of the present invention is to provide a supply method and a supply device for supplying a metal base circuit board and an intermediate thereof to a carry-in section.

[0010]

That is, the present invention provides (1) a step of arranging a plate-shaped object to be supplied such that a normal line of a main surface of the object to be supplied is substantially horizontal. A step of fixing a vacuum chuck (A) to one main surface of the supplied object and moving the vacuum chuck (A) to bring a part of the supplied object into contact with a guide portion; (3) the guide portion The supply target is fixed by a vacuum chuck (B) that is fixed to the guide portion and is movable integrally with the guide portion, and the (B) vacuum chuck is moved,
A step of removing the vacuum chuck (A) after one main surface of the supplied object is brought into planar contact with the guide portion; and (4) the step of fixing the supplied object and the vacuum chuck (B). Moving the guide to move the object to be set at a desired position by moving the guide; (5) removing the vacuum chuck (B) and sliding the object along the surface of the guide; Moving the supplied object to a desired device, and a method for supplying a flat-shaped supplied object,
Preferably, in the step (4), the guide section and the vacuum chuck (B) are rotated to move. Wherein the apparatus is a conveyor, wherein the flat plate-shaped object is a circuit board intermediate. Supply method, more preferably,
The method according to the above, wherein the circuit board intermediate is obtained by bonding a metal foil to a metal plate via a B-stage insulating layer.

[0011] The present invention also provides a supply storage unit capable of laying out a stack of flat plate-like supplies in a direction in which the normal to the main surface of the supply is substantially horizontal. A vacuum chuck (A) that can move while being fixed to the main surface of the supply object located at the outermost position of the laminate, a guide portion that can contact one main surface of the supply object, and the guide portion. A vacuum chuck (B) that is fixed and movable while pressing the supplied object against the guide portion, wherein the guide portion and the vacuum chuck (B) rotate and move together with the supplied object, and the guide portion rotates A feeding device for a flat feeder, wherein the flat feeder forms a part of a flat portion of the conveyor after the movement, and the feeder can gradually move to the conveyor while sliding on the guide portion.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to the drawings.

FIG. 1 is a diagram showing an example of a supply method and a supply device according to the present invention. The supply target of the present invention has a thickness of 2-1.
The present invention can be applied to any flat plate having a thickness of about 0 mm, but can be preferably applied to a circuit board and its intermediate body, especially a metal base circuit board and its intermediate body.

In the present invention, the objects to be supplied are stacked and arranged such that the normal line of the main surface thereof is substantially horizontal (see FIG. 1).
(A)). The arrangement may be such that all the members face the same direction on the front surface or the rear surface, or may face different directions, depending on the operation received by the device into which the supply target is put. When the supply target is a metal-based circuit board intermediate, it is preferable to arrange the exposed surface of the metal plate so as to face the vacuum chucks (A) and (B) described later. If there is an exposed surface where the metal foil is not provided partially on the surface on which the metal foil is provided, the vacuum chuck can be disposed so as to face the exposed surface. Further, the angle between the horizontal direction of the main surface of the supply target and the horizontal direction only needs to be substantially horizontal.
Degrees, preferably 0 to 10 degrees.

In the next step of the present invention, a vacuum chuck (A) is fixed to one main surface of the object to be supplied, and a part of the object to be supplied is guided by moving the vacuum chuck (A). (See FIG. 1B). The vacuum chuck (A) may be fixed so as not to move together with the guide portion. In FIG. 1, the vacuum chuck (A) can move in the front-rear direction through a gap provided at the lower portion of the guide portion, and comes into contact with the supply target in this step.

In the next step of the present invention, the object to be supplied is fixed by a vacuum chuck (B) fixed to the guide portion and movable integrally with the guide portion, and the (B) vacuum chuck is moved. This is a step of removing the vacuum chuck (A) after bringing one main surface of the supply target into planar contact with the guide section, which is the most characteristic step in the present invention.

That is, in the present invention, the vacuum chuck (B) is fixed to the guide so that it can move together with the guide. In this step, the supply target temporarily fixed by the vacuum chuck (A) is firmly fixed at a different portion of the supply target by the vacuum chuck (B), and the supply target is planarly mounted on the guide portion. Then, the vacuum of the vacuum chuck (A) is broken, and the vacuum chuck (A) is removed from the supply target (see FIG. 1C). In this case, the positions of the vacuum chuck (B) and the chuck portion of the vacuum chuck (A) are previously the same as the surface of the guide portion which receives the supply target, or the chuck portions of the vacuum chucks (A, B) are supplied with the guide portion. By adjusting in advance so that it is about 1 to 3 mm from the surface holding the body, it is possible to further prevent the supplied body from being impacted.

In the next step of the present invention, the guide is moved while the feeder and the vacuum chuck (B) are fixed, so that the feeder is moved to a desired position. This is the step of performing As described above, since the vacuum chuck (B) is fixed to the guide portion so as to be able to move together with the guide portion, the above operation is easily achieved. FIG. 1D exemplifies a state after the present step in a case where the guide portion can be rotated and moved. The material to be supplied is rotated while being pressed against the guide portion by the vacuum chuck (B), and is moved onto the conveyor corresponding to the supply portion of the apparatus without being damaged and without attaching dust. .

The last step of the present invention is a step of removing the vacuum chuck (B) and moving the supplied object to a desired device while sliding along the surface of the guide portion. FIG.
In (d), the feed placed on the conveyor is:
The material is conveyed in a desired direction of the apparatus by an extruder or a driving roller provided on the conveyor. During this time, it is needless to say that the positions of the guide portion and the chuck portion of the vacuum chuck (B) are below the surface of the conveyor on which the supply target moves.

[0020]

EXAMPLES [Examples and Comparative Examples] In order to achieve the supply method of the present invention, the inventor of the present invention prepared a laminate composed of a plate-shaped supply object by using a method in which the normal line of the main surface of the supply object was substantially the same. A supply storage unit that can be stacked and arranged so as to face in a horizontal direction, and a vacuum chuck (A) that moves the supply object located at the outermost position of the stack of the supply objects to be fixed to the main surface thereof, A guide portion to which one main surface of the supply target can come into contact; and a vacuum chuck (B) fixed to the guide portion and movable while pressing the supply target against the guide portion. And the vacuum chuck (B) are rotationally moved together with the object to be supplied, and the guide portion forms a plane portion of the conveyor after the rotational movement, and the object is gradually moved to the conveyor while sliding on the guide portion. Characterized by the fact that The charging device was fabricated.

Using this apparatus, a transport test was conducted on 1,000 intermediate metal-base circuit boards. No abnormalities such as scratches on the metal plate, peeling of the metal foil and wrinkles were found, and the results were good. .

Using a device disclosed in Japanese Patent Application Laid-Open No. 7-101545, a transfer test was performed on 1,000 metal-base circuit board intermediates. 87 were found.

[0023]

When the supply method and the supply apparatus of the present invention are used, the occurrence of defects such as scratches on the metal plate, peeling of the metal foil and wrinkles can be prevented, and as a result, a high-quality metal-based circuit board can be obtained at a high yield. And is very useful industrially.

[Brief description of the drawings]

1A and 1B are diagrams illustrating a supply method according to the present invention, wherein FIG. 1A shows a state in which objects to be supplied are arranged, and FIG. 1B shows a vacuum chuck (A).
Then, after the supply target is fixed, the vacuum chuck (B) is further in contact with the supply target, and (c) is a state in which the supply target is pressed against the guide portion by the vacuum chuck (B) and fixed. The state where the vacuum chuck (A) is fixed to the supply target is shown. Further, (d) shows a state in which the guide portion is rotated and moved together with the vacuum chuck (B), and the supply target is placed on the conveyor.

[Explanation of symbols]

 1: Object to be supplied (metal-based circuit board intermediate) 2: Loading section (conveyor) of apparatus 3: Guide section 4: Vacuum chuck (A) 5: Vacuum chuck (B)

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 3F030 AA04 AB04 3F081 AA10 BA01 BE03 BE08 CA13 CA48 3F343 FA13 FB19 FC01 GA04 GB01 GC04 GD04 HA12 JB02 JB17 LA04 LA15 LD26 5E315 AA01 BB01 CC27 DD29 GG22

Claims (6)

[Claims] (1) a step of arranging a plate-shaped object to be supplied such that a normal to a main surface of the object to be supplied is oriented substantially in a horizontal direction;
(2) a step of fixing a vacuum chuck (A) to one main surface of the supplied body and moving the vacuum chuck (A) to bring a part of the supplied body into contact with a guide portion; (3) The object to be supplied is fixed by a vacuum chuck (B) fixed to the guide portion and movable integrally with the guide portion, and the main surface of the object to be supplied is moved by moving the vacuum chuck (B). Removing the vacuum chuck (A) after making planar contact with the guide portion; (4) moving the guide portion while keeping the supply target and the vacuum chuck (B) fixed, Moving the supply target and setting it at a desired position;
(5) removing the vacuum chuck (B) and moving the supplied object to a desired device while sliding the supplied object along the surface of the guide portion; . 2. The method according to claim 1, wherein, in the step (4), the guide portion and the vacuum chuck (B) rotate. 3. The method according to claim 1, wherein in the step (5), the desired device is a conveyor.
The supply method of the flat-plate-shaped supply target of the description. 4. The method according to claim 1, wherein the plate-shaped object is a circuit board intermediate. 5. The circuit board intermediate body according to claim 1, wherein a metal foil is bonded to a metal plate via a B-stage insulating layer. Item 4
The supply method of the flat-plate-like supply target of the description. 6. A supply storage section capable of arranging a stack of flat plate-like supplies in a direction in which the normal line of the main surface of the supply is substantially horizontal, and a laminate of the supplies. A vacuum chuck (A) that can move while being fixed to the main surface of the supply object located at the outermost part of the supply object, a guide portion that can contact one main surface of the supply target object, and is fixed to the guide portion; In addition, the vacuum chuck (B) is movable while pressing the supplied object against the guide section, and the guide section and the vacuum chuck (B) are rotated with the supplied object, and the conveyor is rotated after the guide section is rotated. Forming a part of the plane part of
The supply device of a flat plate-shaped supply member, wherein the supply target is gradually movable to a conveyor while sliding on the guide portion.