JP2002190385A - Transfer material for manufacturing electroluminescence element, and method for manufacturing the electroluminescence element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a transfer material for easy manufacturing of an electroluminescence element at a high degree of design freedom, and to provide a method for manufacturing the electroluminescence element. SOLUTION: A peeling layer, an illuminant layer, a dielectrics layer, and an adhesive layer are laminated sequentially on a support body, with the support body being allowed to detach from the illuminant layer, thus providing the transfer material for manufacturing the electroluminescent element. The transfer material for manufacturing the electroluminescent element is stacked on an electrode formed on a substrate, so that the adhesive layer abuts against it. Heat is applied in a desired pattern from the support body side of the transfer material. Then, the support body is detached to transfer a pattern laminate comprising the adhesive layer, dielectrics layer, and illuminant layer onto the electrode. Then, a transparent substrate, on which a transparent electrode is formed is fitted so that the transparent electrode abuts against the illuminant layer of the pattern laminate, and the electroluminescent element is thus manufactured.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a transfer material for manufacturing an electroluminescent device, particularly an AC type electroluminescent device used for a display device, and a method of manufacturing the electroluminescent device.

[0002]

2. Description of the Related Art Electroluminescent (EL) elements have the advantages of high visibility due to self-coloration, being all solid-state displays unlike liquid crystal displays, being less affected by temperature changes, and having a large viewing angle. In recent years, practical application as a pixel of a display device and a back light source of a liquid crystal display has been advanced.

[0003] EL elements are mainly classified into AC type and DC type. In an AC type EL device, a light emitting layer and a dielectric layer are generally disposed between two electrodes. In this structure, a transparent electrode typified by an indium tin oxide (ITO) electrode is used, and a base material, a counter electrode, a dielectric layer, a luminescent layer, a transparent electrode, and a transparent base material are laminated in this order, and a counter electrode and a transparent base material are laminated. This is for applying an alternating current in a vertical direction to the base material between the electrodes.

The above-mentioned AC type EL element has a structure in which a dielectric layer and a light emitting layer are laminated. Conventionally, formation of these two layers is mainly performed by screen printing suitable for coating a thick film. Has been used for

[0005]

However, in the formation of an EL element using screen printing, it is possible to form a pattern only in a shape provided in advance on a screen plate. Multiple screen versions are required. For this reason, there has been a problem that the manufacturing cost is increased, and the degree of freedom in designing the EL element and the manufacturing cost are contradictory.

The present invention has been made in view of such circumstances, and provides a transfer material for easily manufacturing an electroluminescent element with a high degree of design freedom, and a method for manufacturing the electroluminescent element. Aim.

[0007]

In order to achieve the above object, a transfer material for producing an electroluminescent device according to the present invention comprises a support, a release layer sequentially laminated on the support, and a luminescent material. A layer, a dielectric layer and an adhesive layer,
The structure was such that it could be peeled off between the support and the luminescent layer.

In another preferred embodiment of the transfer material for producing an electroluminescent element according to the present invention, the luminous layer and the dielectric layer are each formed of at least one of a hot-melt resin, a thermo-softening resin and a wax as a binder. It was configured to contain seeds.

In the method of manufacturing an electroluminescent element according to the present invention, the transfer material for manufacturing an electroluminescent element is superposed on the electrode on a substrate on which the electrode is formed so that the adhesive layer is in contact with the transfer material. Heat is applied in a desired pattern shape from the support side of the transfer material, and then, the support is peeled off to form a pattern laminate comprising an adhesive layer, a dielectric layer, and a luminescent layer in the pattern shape on the electrode. Then, the transparent substrate on which the transparent electrode was formed was fixed so that the transparent electrode was in contact with the luminescent layer of the pattern laminate.

In another preferred embodiment of the method for manufacturing an electroluminescent device of the present invention, the transfer material for manufacturing an electroluminescent device described above is processed into a desired pattern shape, and an electrode formed on a base material is formed on the transfer material. The processed transfer material is overlapped so that the adhesive layer abuts, heat is applied from the support side of the transfer material, and then the support is peeled off to form the adhesive layer and the dielectric layer in the pattern shape. And transferring the pattern laminate comprising the luminescent layer onto the electrode, and then fixing the transparent substrate on which the transparent electrode is formed such that the transparent electrode is in contact with the luminescent layer of the pattern laminate. And

[0011] In another preferred embodiment of the transfer material for producing an electroluminescent element of the present invention, a support,
A light-emitting layer, a dielectric layer, an adhesive layer, and an electrode were sequentially laminated on the support, and the structure was such that the support could be separated from the light-emitting layer.

In the method for manufacturing an electroluminescent element according to the present invention, the transfer material for manufacturing an electroluminescent element is overlapped on a base material such that the electrode is in contact with the transfer material, and a desired material is applied from the support side of the transfer material. Applying heat in a pattern shape, and then transferring the pattern laminate including the electrode, the adhesive layer, the dielectric layer, and the light emitting layer in the pattern shape onto the base material by peeling the support, and then, The transparent substrate on which the transparent electrode was formed was configured to be fixed so that the transparent electrode was in contact with the light emitting layer of the pattern laminate.

In another preferred embodiment of the method for manufacturing an electroluminescent device according to the present invention, the transfer material for manufacturing an electroluminescent device is processed into a desired pattern shape, and the processed transfer material is formed on a substrate. Are overlapped so that the electrodes are in contact with each other, heat is applied from the support side of the transfer material, and then the support is peeled off so that the electrodes, the adhesive layer, the dielectric layer, and the luminescent layer in the pattern shape are peeled off. The pattern laminate was transferred onto the substrate, and then the transparent substrate on which the transparent electrode was formed was fixed so that the transparent electrode was in contact with the light emitting layer of the pattern laminate.

In another preferred embodiment of the transfer material for producing an electroluminescent device of the present invention, a support,
A release layer, a transparent electrode, a light-emitting layer, a dielectric layer, and an adhesive layer were sequentially laminated on the support, and the structure was such that the support could be separated from the transparent electrode.

In the method of manufacturing an electroluminescent element according to the present invention, the transfer material for manufacturing an electroluminescent element is superimposed on the electrode on a substrate on which the electrode is formed so that the adhesive layer comes into contact with the transfer material. Heat is applied in a desired pattern shape from the support side of the transfer material, and then, by peeling the support, a pattern laminate including an adhesive layer, a dielectric layer, a light emitting layer, and a transparent electrode is formed in the pattern shape. The pattern was transferred onto the electrode, and then the transparent substrate was fixed so as to be in contact with the transparent electrode of the pattern laminate.

In another preferred embodiment of the method for manufacturing an electroluminescent device according to the present invention, the transfer material for manufacturing an electroluminescent device described above is processed into a desired pattern shape, and an electrode formed on a base material is formed on the transfer material. The processed transfer material is overlapped so that the adhesive layer abuts, heat is applied from the support side of the transfer material, and then the support is peeled off to form the adhesive layer and the dielectric layer in the pattern shape. Then, a pattern laminate comprising a light-emitting body layer and a transparent electrode was transferred onto the electrode, and then a transparent substrate was fixed so as to be in contact with the transparent electrode of the pattern laminate.

As another preferred embodiment of the transfer material for producing an electroluminescent device of the present invention, a support,
A structure in which a release layer, a transparent electrode, a luminescent layer, a dielectric layer, an adhesive layer, and an electrode are sequentially stacked on the support, and the support and the transparent electrode can be separated. did.

In the method of manufacturing an electroluminescent element according to the present invention, the transfer material for manufacturing an electroluminescent element is overlapped on a base material so that the electrode is in contact with the transfer material, and a desired material is provided from the support side of the transfer material. Heat is applied in a pattern shape, and then, by peeling the support, a pattern laminate composed of an electrode, an adhesive layer, a dielectric layer, a luminescent layer, and a transparent electrode is transferred onto the substrate in the pattern shape. Thereafter, the transparent base material is fixed so as to be in contact with the transparent electrode of the pattern laminate.

In another preferred embodiment of the method for manufacturing an electroluminescent device according to the present invention, the transfer material for manufacturing an electroluminescent device is processed into a desired pattern shape, and the processed transfer material is formed on a substrate. The electrodes are overlapped so that the electrodes are in contact with each other, heat is applied from the support side of the transfer material, and then, the support is peeled off, and the electrodes, the adhesive layer, the dielectric layer, and the light emitting layer are patterned in the pattern shape. The pattern laminate composed of the transparent electrode was transferred onto the substrate, and then the transparent substrate was fixed so as to be in contact with the transparent electrode of the pattern laminate.

In another preferred embodiment of the transfer material for producing an electroluminescent device of the present invention, a support,
A release layer, a transparent electrode, a luminescent layer, a dielectric layer, and an adhesive layer sequentially laminated on the support are provided, and the support is peelable between the support and the transparent electrode, and the support is transparent. It was configured to be a substrate.

In the method for manufacturing an electroluminescent element according to the present invention, the transfer material for manufacturing an electroluminescent element is superposed on the electrode on a substrate on which the electrode is formed so that the adhesive layer comes into contact with the transfer material. The structure was such that heat was applied from the support side of the transfer material.

As another preferred embodiment of the transfer material for producing an electroluminescent device of the present invention, a support,
A release layer, a transparent electrode, a light-emitting layer, a dielectric layer, and an adhesive layer sequentially laminated on the support are provided, and can be peeled between the support and the transparent electrode, and on the adhesive layer An electrode was provided, and the support was configured to be a transparent substrate.

In the method for manufacturing an electroluminescent element according to the present invention, the transfer material for manufacturing an electroluminescent element is overlapped on a substrate so that the electrodes are in contact with each other, and heat is applied from the support side of the transfer material. It was configured to apply voltage.

According to the present invention, since a desired pattern can be transferred by using a transfer material, it is easy to manufacture an electroluminescent element by various designs.

[0025]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the drawings.

[0026] A conversion element for manufacturing an electroluminescence element.
Copy material Figure 1 is a schematic sectional view showing an example of an electroluminescent (EL) transfer material for device fabrication of the present invention. In FIG. 1, a transfer material 1 for manufacturing an EL element comprises a support 2
And a luminescent layer 4 formed on the support 2 via a release layer 3, a dielectric layer 5 laminated on the luminescent layer 4, and an adhesive layer 6.

FIG. 2 is a schematic sectional view showing another example of a transfer material for manufacturing an EL element. In FIG. 2, EL
A transfer material 11 for manufacturing an element includes a support 12 and a light-emitting layer 14 formed on the support 12 with a release layer 13 interposed therebetween.
And the dielectric layer 1 sequentially laminated on the light emitting layer 14
5, an adhesive layer 16, and an electrode 17.

FIG. 3 is a schematic sectional view showing another example of a transfer material for manufacturing an EL element. In FIG. 3, EL
A transfer material 21 for manufacturing an element includes a support 22 and a transparent electrode 28 formed on the support 22 with a release layer 23 interposed therebetween.
And the luminescent layer 2 sequentially laminated on the transparent electrode 28
4, a dielectric layer 25 and an adhesive layer 26.

FIG. 4 is a schematic sectional view showing another example of a transfer material for producing an EL element. In FIG.
The transfer material 31 for manufacturing the L element is composed of a support 32 and a transparent electrode 3 formed on the support 32 via a release layer 33.
8 and the luminescent layer 3 sequentially laminated on the transparent electrode 38.
4, a dielectric layer 35, an adhesive 36, and an electrode 37.

The transfer materials 1, 11, and
21 and 31 are the adhesive layers 6 and 26 or
The electrodes 17, 37 are adhered and the supports 2, 12, 22, 32
Is peeled off, a laminate composed of the adhesive layer 6, the dielectric layer 5, and the luminous layer 4, a laminated body composed of the electrode 17, the adhesive layer 16, the dielectric layer 15, and the luminous layer 14, the adhesive layer 26, and the dielectric A laminate composed of the body layer 25, the light-emitting layer 24, and the transparent electrode 28, or a laminate composed of the electrode 37, the adhesive layer 36, the dielectric layer 35, the light-emitting layer 34, and the transparent electrode 38 can be transferred. For example, when manufacturing an EL element as a back light source of a liquid crystal display, it can be transferred in a predetermined shape, and in the manufacture of an EL element used for a display device such as a character or a symbol, the corresponding character or symbol can be transferred. It can be transferred in a pattern. Further, fine pixels of the display device can be easily formed. The transfer method may be any transfer method such as thermal transfer, light transfer, pressure transfer, and the like.

Hereinafter, the components of the transfer materials 1, 11, 21, 31 for manufacturing the EL element will be described. As the supports 2, 12, 22, 32 constituting the transfer materials 1, 11, 21, 31 for manufacturing the EL element of the present invention, for example, polyester, polypropylene, cellophane, polycarbonate, cellulose acetate, polyethylene, polyvinyl chloride , Polystyrene, polyamide, polyimide, polyvinylidene chloride, polyvinyl alcohol, fluororesin, chlorinated rubber, plastics such as ionomers, condenser paper, papers such as paraffin paper, nonwoven fabrics and the like, and a composite film obtained by combining these. Can also be used. The thickness of the supports 2, 12, 22, and 32 can be appropriately set according to the material so that the strength and the thermal conductivity are appropriate, and can be set, for example, in the range of 3 to 50 μm.

Further, a transparent base material may be used as the supports 22 and 32 constituting the transfer materials 21 and 31 for manufacturing the EL element of the present invention. Thereby, the support members 22 and 32 can be used as a transparent substrate of the EL element without peeling. The transparent base material to be used can be formed of a glass material, a resin material, or a composite material having a light transmitting property. When performing thermal transfer using a thermal head in transfer, the supports 2, 12,
A heat-resistant material may be mixed in 22, 22 or a heat-resistant material layer may be formed on the back surfaces of the supports 2, 12, 22, 32.

The release layers 3, 13, 23, and 33 of the transfer materials 1, 11, 21, and 31 of the present invention use a material such as a low-molecular-weight resin or wax alone or in combination of two or more. Specific examples of the material include carnauba wax, rice wax, montan wax, paraffin wax, polyisoprene rubber, styrene butadiene rubber, polyolefin, and polychlorinated olefin. This release layer 3,
13, 23, 33 have a thickness of, for example, 0.05 to 3 μm.
Can be set in the range. Such a release layer 3,
Depending on the transfer conditions and the material used, the transfer layers 13, 23, and 33 remain on the support side without being transferred when they are delaminated in the release layer and partially transferred, when they are transferred from the support. There are cases.

The light-emitting layers 4, 14, 24, and 34 of the transfer materials 1, 11, 21, and 31 of the present invention may be any material that emits light by energy obtained by recombination of holes and electrons. Although not limited, generally a metal compound can be used. Specifically, as the metal compound, Z
n _1-x Mg _x S: Mn, SrS: Ce, SrS: Ce, M
n, SrS: Ce, Mn, Ag, ZnS: Mn / Sr
S: Ce, ZnGa ₂ O ₃ : Mn, Ga ₂ O ₃ : Mn, Ga
₂ O ₃ : Eu, Ga ₂ O ₃ : Sn, ZnS: Cu and the like can be mentioned, and these can be used alone or in combination of two or more.

The light emitting layers 4, 14, 24, 34 are
The above-mentioned luminescent material may be held by a binder. As the binder, a heat-meltable or heat-softening resin or wax can be used, and examples thereof include microcrystalline wax, carnauba wax, and paraffin wax. Furthermore, Fischer-Tropsch wax, various low molecular weight polyethylenes,
Wood wax, beeswax, whale wax, Ibota wax, wool wax, shellac wax, candelilla wax, petrolactam, polyester wax, partially modified wax, fatty acid ester, fatty acid amide, etc., various waxes, ethylene-vinyl acetate copolymer, Ethylene-acrylate copolymer, polyethylene, polystyrene, polypropylene, polybutene, petroleum resin, vinyl chloride resin, vinyl chloride-vinyl acetate copolymer, polyvinyl alcohol, vinylidene chloride resin, methacrylic resin, polyamide, polycarbonate, fluorine resin, Resins such as polyvinyl formal, polyvinyl butyral, acetylcellulose, nitrocellulose, polyvinyl acetate, polyisobutylene, ethyl cellulose or polyacetal, and these alone, It can be used in combination of two or more thereof. Such luminous body layers 4, 14, 24,
The thickness of 34 can be set, for example, in the range of 5 to 40 μm.

The dielectric layers 5, 15, 25, and 35 of the transfer materials 1, 11, 21, and 31 of the present invention are formed using a material that is dielectrically polarized by application of energy and has a film-forming property and is suitable for transfer. can do. As such a material, a metal oxide is generally used, and specifically, barium titanate, strontium titanate, titanium oxide,
Examples thereof include lead titanate, lead zirconate titanate, and calcium stannate, and these can be used alone or in combination of two or more.

The dielectric layers 5, 15, 25, 35
The above materials may be held by a binder. Examples of the binder include the binders described above. The thickness of the dielectric layers 5, 15, 25, 35 can be set, for example, in the range of 5 to 40 μm.

The adhesive layers 6, 16, 26, and 36 of the transfer materials 1, 11, 21, and 31 of the present invention may be the same as the transfer materials 1 and 21 except for the dielectric layers 5 and 25 or less. At 31, the electrodeposition layers 17, 37 and the dielectric layer 15,
This is for surely transferring 35 or less layers to the transfer target. The adhesive layers 6, 16, 26, and 36 may be made of a material such as a heat-meltable resin, a heat-softening resin, and a wax, which are listed as binders for the luminescent material of the luminescent layer, or may be two or more kinds. And the thickness can be set, for example, in the range of 0.5 to 3 μm.

The electrodes 17 of the transfer materials 11 and 31 of the present invention,
For 37, a metal material is generally used, but a conductive ink in which a metal material is mixed in an organic binder may be used. Examples of metal materials include gold, silver, copper, magnesium alloys (MgAg, etc.), aluminum alloys (AlLi, Al
Ca, AlMg, etc.), metallic calcium and the like.

The electrodes 17 and 37 can be formed by any method such as a vacuum film forming method such as vapor deposition and sputtering, a plating method, and a printing method using a conductive ink. A film forming method is preferred. Also, electrode 1
The thickness of 5, 35 is 2 when formed by a vacuum film forming method.
0 to 200 nm, when formed by a coating method, 2 to 4
It can be set in a range of about 0 μm.

The transparent electrodes 2 of the transfer materials 21 and 31 of the present invention
Reference numerals 8 and 38 are formed by using a conductive material such as indium tin oxide (ITO), indium oxide, zinc oxide, and stannic oxide by a vacuum film forming method such as evaporation and sputtering. The thickness of the transparent electrodes 28 and 38 is 20
It can be set in the range of about 200 nm.

The manufacturing method of the electroluminescent device will be described a manufacturing method of the electroluminescent (EL) device of the present invention. FIG. 5 is a process chart showing an example of a method for manufacturing an EL device of the present invention. First, electrode 5
The transfer material 1 for manufacturing an EL element of the present invention is superimposed on the base material 52 provided with the adhesive layer 6 so that the adhesive layer 6 is in contact with the transfer material 1, and heat is applied in a desired pattern from the transfer material 1 side (FIG. 5).
(A)). The base material 52 is made of a resin material, a glass material, a metal material, a ceramic material, a composite material thereof, or the like.
In addition, for the electrode 55, generally, a metal material is used, and a conductive ink in which a metal material is mixed in an organic binder may be used. Examples of metal materials include gold, silver, copper, magnesium alloys (MgAg, etc.), aluminum alloys (AlL
i, AlCa, AlMg, etc.), metallic calcium and the like. The electrode 55 can be formed by a vacuum film forming method such as vapor deposition or sputtering, a plating method, a printing method using a conductive ink, or the like. In the illustrated example, the electrodes are all solid, but have a desired pattern. It may be an electrode.

In the illustrated example, a desired heat application pattern is indicated by a region A.
It can be performed by a thermal head, laser beam irradiation, heat press, or the like. By such heat application, the region A
At this time, the adhesive layer 6 adheres to the electrode 55.

Next, by peeling the support 2, the adhesive layer 6, the dielectric layer 5, and the luminous layer 4 are formed in the above-mentioned pattern shape.
Is transferred onto the electrode 55 (FIG. 5B).

Next, the transparent substrate 5 having the transparent electrode 56
The EL element 51 is obtained by fixing 7 on the pattern laminate P1 (FIG. 5C). The transparent substrate 57 can be formed of a light-transmitting glass material, a resin material, or a composite material thereof. The transparent electrode 56 is a transparent electrode formed using a conductive material such as indium tin oxide (ITO), indium oxide, zinc oxide, and stannic oxide by a vacuum film forming method such as evaporation and sputtering. The transparent electrode 56 can be formed according to the intended use of the EL element, such as a solid electrode or a desired pattern electrode. According to such an EL element manufacturing method of the present invention, a pattern laminate including a dielectric layer and a light emitting layer can be transferred in a desired pattern using the transfer material of the present invention.

In the method of manufacturing an EL device according to the present invention,
The transfer material 1 of the present invention is processed in advance into a desired pattern shape, and then the processed transfer material 1 is overlaid on the electrode 55 provided on the base material 52 so that the electrode 55 and the adhesive layer 6 are in contact with each other. And heat the entire surface from the transfer material 1 side.
By peeling the support 2, a pattern laminate P composed of the adhesive layer 6, the dielectric layer 5, and the light emitting layer 4 is formed in a pattern shape.
1 may be transferred onto the electrode 55. The above processing of the transfer material 1 can be performed by cutting plotter, die cutting, cutting with a cutter or scissors, or the like. Also,
The entire surface can be heated by a heat press using a hot plate, a hot roller, or the like.

FIG. 6 is a process chart showing another example of the method for manufacturing an EL device of the present invention. First, the electrode 1 is placed on the substrate 62.
The transfer material 11 for manufacturing an EL element of the present invention is overlapped so that the contact 7 comes into contact, and heat is applied in a desired pattern from the transfer material 11 side (FIG. 6A). The base material 62 is made of a resin material, a glass material, a metal material, a ceramic material, a composite material thereof, or the like.

In the illustrated example, a desired heat application pattern is indicated by a region A, and heat application of the pattern shape can be performed by a thermal head, laser beam irradiation, heat press, or the like. By such heat application, in the region A,
The electrode 17 adheres to the substrate 62.

Next, by peeling the support 12,
The pattern laminate P2 including the electrode 17, the adhesive layer 16, the dielectric layer 15, and the light emitting layer 14 is transferred to the base 62 in the above pattern shape (FIG. 6B). Next, the transparent electrode 6
6 with the pattern laminate P2
The EL element 61 is obtained by being fixed on the upper surface (FIG. 6C). The transparent electrode 66 and the transparent substrate 67 are the same as the transparent electrode 56 and the transparent substrate 57 described above.

According to the EL device manufacturing method of the present invention, a pattern laminate including an electrode, a dielectric layer, and a light emitting layer can be transferred in a desired pattern using the transfer material of the present invention.

In the method of manufacturing an EL element according to the above-described embodiment, the transfer material 11 of the present invention is processed into a desired pattern in advance, and the processed transfer material 11 is then transferred to the substrate 62.
The transfer material 1 is overlaid so that the electrode 17 is in contact with the
By heating the entire surface from the first side and then peeling off the support 12, the pattern laminate P including the electrode 17, the adhesive layer 16, the dielectric layer 15, and the light emitting layer 14 in a pattern shape is formed.
2 can be transferred onto the substrate 62.

FIG. 7 is a process chart showing another example of the method for manufacturing an EL device of the present invention. First, the transfer material 21 for manufacturing an EL element of the present invention is overlaid on the base material 72 provided with the electrodes 75 so that the adhesive layer 26 is in contact with the transfer material 21, and heat is applied from the transfer material 21 side in a desired pattern ( (FIG. 7 (A)). The base material 72 and the electrode 75 are the same as the base material 52 and the electrode 55 described above. In the illustrated example, a desired heat application pattern is indicated by a region A, and heat application in such a pattern shape can be performed by a thermal head, laser beam irradiation, heat press, or the like. By such heat application, the adhesive layer 26 adheres to the electrode 75 in the region A.

Next, by peeling off the support 22,
The pattern laminate P3 including the adhesive layer 26, the dielectric layer 25, the light emitting layer 24, and the transparent electrode 28 is transferred onto the electrode 75 in the above pattern shape (FIG. 7B). Next, the EL element 71 is obtained by fixing the transparent substrate 77 on the pattern laminate P3 (FIG. 7C). The transparent substrate 77 is the same as the above-described transparent substrate 57.

According to such an EL element manufacturing method of the present invention, a pattern laminate comprising a dielectric layer, a light emitting layer and a transparent electrode can be transferred in a desired pattern using the transfer material of the present invention. Also, in the above embodiment,
The transfer material 21 of the present invention is processed in advance into a desired pattern shape, and then the processed transfer material 21 is overlaid on the electrode 75 provided on the base material 72 so that the electrode 75 and the adhesive layer 26 are in contact with each other. Then, the entire surface is heated from the transfer material 21 side, and then the support 22 is peeled off, so that the pattern laminate P3 including the adhesive layer 26, the dielectric layer 25, the light emitting layer 24, and the transparent electrode 28 in a pattern shape is formed. It can be transferred onto the electrode 75. When a transparent substrate is used as the support 22 constituting the transfer material 21 for manufacturing an EL element of the present invention, the support 22 is used as the transparent substrate 77 of the EL element without peeling the support 22 without peeling. be able to.

FIG. 8 is a process chart showing another example of the method for manufacturing an EL device of the present invention. First, the electrode 3 is placed on the base material 82.
The transfer material 31 for manufacturing an EL element of the present invention is overlapped so that 7 comes into contact, and heat is applied in a desired pattern from the transfer material 31 side (FIG. 8A). The substrate 82 is the same as the above-described substrate 62. In the illustrated example, a desired heat application pattern is indicated by a region A, and heat application of the pattern shape can be performed by a thermal head, laser beam irradiation, heat press, or the like. The electrode 37 adheres to the base material 82 in the region A by such heat application.

Next, by peeling the support 32,
The pattern laminate P4 including the electrode 37, the adhesive layer 36, the dielectric layer 35, the light emitting layer 34, and the transparent electrode 38 is transferred to the substrate 82 in the above pattern shape (FIG. 8B). Next, the EL element 81 is obtained by fixing the transparent substrate 87 on the pattern laminate P4 described above.
(C)). The transparent base material 87 is the same as the transparent base material 57 described above.

According to the EL device manufacturing method of the present invention, a pattern laminate including an electrode, a dielectric layer, a light emitting layer and a transparent electrode can be transferred in a desired pattern using the transfer material of the present invention. . Also in the method for manufacturing an EL element of the above embodiment, the transfer material 31 of the present invention is processed into a desired pattern shape in advance, and then the processed transfer material 31 is brought into contact with the electrode 37 on the base material 82. Then, the entire surface is heated from the transfer material 31 side, and then the support 32 is peeled off.
The pattern laminate P4 including the layer 7, the adhesive layer 36, the dielectric layer 35, the light emitting layer 34, and the transparent electrode 38 can be transferred onto the substrate 82. When a transparent substrate is used as the support 32 of the transfer material 31 for manufacturing an EL element of the present invention, the support 32 is used as a transparent substrate 87 of the EL element without peeling the support 32 without peeling. be able to.

[0058]

Next, the present invention will be described in more detail with reference to examples. Preparation of Transfer Material First, as a support, a polyethylene terephthalate (PET) film (F-57 manufactured by Toray Industries, Inc.) provided with a heat-resistant active layer on the back side for preventing heat fusion during thermal transfer by a thermal head and improving slipperiness. (Thickness: 6 μm)).
A composition for a release layer having the following composition is applied to the surface of this PET film by a bar coater (application thickness: 0.1 g / m ² ).
And dried to form a release layer. (Composition for release layer) Carnauba wax 10 parts by weight Water / isopropyl alcohol (weight ratio 1/1) 90 parts by weight

Next, a green luminescent material composition having the following composition was applied on the above-mentioned release layer by a bar coater (coating thickness: 10 μm).
m) and dried to form a green light-emitting layer. (Light emitting composition)-Green light emitting material ... 50 parts by weight (ANE430 manufactured by OSRAM Sylvania)-Binder (Byron V700 manufactured by Toyobo Co., Ltd.) ... 15 parts by weight-Toluene ... 35 parts by weight

Next, the following dielectric composition was applied on the above-mentioned light emitting layer by a bar coater (coating thickness: 10 μm).
And dried to form a dielectric layer. Further, a composition for an adhesive layer having the following composition was applied on the dielectric layer by a bar coater (coating thickness: 10 μm), and dried to form an adhesive layer. Thus, a transfer material was obtained. (Dielectric composition) Dielectric material (BT-SA manufactured by Kyoritsu Ceramics Co., Ltd.) 50 parts by weight Binder (Byron V700 manufactured by Toyobo Co., Ltd.) 15 parts by weight Toluene 35 parts by weight (for adhesive layer) Composition) Resem EU-2 (manufactured by Chukyo Yushi Co., Ltd.) 50 parts by weight Water / isopropyl alcohol (weight ratio 1/1) 50 parts by weight

A 6 μm thick PET film ( manufactured by Toray Industries, Inc.)
F-57) was prepared, and an electrode (thickness: 30 nm) made of aluminum was formed on the substrate by a vacuum evaporation method. Next, the above-mentioned transfer material was superimposed on this electrode so that the adhesive layer was in contact with the electrode, and heat was applied to the pattern (20 mJ / mm ² ) using a thermal head. Thereafter, the support was peeled off, and a pattern laminate composed of the adhesive layer, the dielectric layer, and the green light-emitting layer was transferred onto the electrode.

Next, a PET film (Lumirror T60 manufactured by Toray Industries, Inc.) having a thickness of 150 μm was used as a transparent substrate, and an indium tin oxide (ITO) electrode having a thickness of 30 nm was formed on the transparent substrate by vacuum evaporation. . Next, this transparent substrate was fixed so that the ITO electrode covered the above-mentioned pattern laminate, thereby producing an EL element.

Evaluation of EL Element When energy was applied from an external AC power supply at 240 V and 1 kHz, the luminous efficiency of the EL element was 8 lumen / W.

[0064]

As described in detail above, according to the present invention, a pattern laminate comprising an adhesive layer, a dielectric layer, and a light emitting layer, or an electrode, an adhesive layer, a dielectric layer, and a light emitting layer are formed using a transfer material. A pattern laminate composed of a body layer, or a pattern laminate composed of an adhesive layer, a dielectric layer, a luminescent layer, and a transparent electrode,
Alternatively, a pattern laminate composed of electrodes, an adhesive layer, a dielectric layer, a luminescent layer, and a transparent electrode can be transferred in a desired pattern. The efficiency is greatly improved, and electroluminescent elements with various designs can be easily manufactured.

[Brief description of the drawings]

FIG. 1 is a schematic cross-sectional view showing one embodiment of a transfer material for producing an electroluminescent element of the present invention.

FIG. 2 is a schematic cross-sectional view showing another embodiment of a transfer material for producing an electroluminescent element of the present invention.

FIG. 3 is a schematic cross-sectional view showing another embodiment of a transfer material for producing an electroluminescent element of the present invention.

FIG. 4 is a schematic cross-sectional view showing another embodiment of the transfer material for producing an electroluminescent element of the present invention.

FIG. 5 is a process chart showing one embodiment of a method for manufacturing an electroluminescence element of the present invention.

FIG. 6 is a process chart showing another embodiment of the method for manufacturing an electroluminescent element of the present invention.

FIG. 7 is a process chart showing another embodiment of the method for manufacturing an electroluminescent element of the present invention.

FIG. 8 is a process chart showing another embodiment of the method for manufacturing an electroluminescent element of the present invention.

[Description of Signs] 1,11, 21, 31: Transfer material for producing an electroluminescent element 2, 12, 22, 32: Support 3, 13, 23, 33: Release layer 4, 14, 24, 34: Light emission Body layers 5, 15, 25, 35 Dielectric layers 6, 16, 26, 36 Adhesive layers 17, 37 Electrodes 28, 38 Transparent electrodes 51, 61, 71, 81 Electroluminescent elements 52, 62, 72 , 82 ... base material 55, 75 ... electrode 56, 66 ... transparent electrode 57, 67, 77, 87 ... transparent base material P1, P2, P3, P4 ... pattern laminate

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 3K007 AB18 CA01 CA05 CA06 CB01 DA04 DA05 DB01 DB02 DC01 DC02 DC04 EA02 EA03 EB00 FA01

Claims (17)

[Claims] 1. A light-emitting device comprising: a support; and a release layer, a luminescent layer, a dielectric layer, and an adhesive layer sequentially laminated on the support, wherein the support and the luminescent layer are peelable. A transfer material for manufacturing an electroluminescent element, wherein the transfer material is provided. 2. The light-emitting body layer and the dielectric layer contain at least one of a hot-melt resin, a thermo-softening resin and a wax as a binder.
3. The transfer material for producing an electroluminescent device according to 1.). 3. The transfer material for manufacturing an electroluminescent element according to claim 1, wherein an electrode is provided on the adhesive layer. 4. A support comprising: a support; a release layer, a transparent electrode, a luminescent layer, a dielectric layer, and an adhesive layer sequentially laminated on the support; and a separation between the support and the transparent electrode. A transfer material for producing an electroluminescent element, which is capable of being used. 5. The transfer material for manufacturing an electroluminescent element according to claim 4, wherein an electrode is provided on the adhesive layer. 6. The transfer material for producing an electroluminescent device according to claim 4, wherein the support is a transparent substrate. 7. The transfer material for producing an electroluminescent element according to claim 5, wherein the support is a transparent substrate. 8. The transfer material for producing an electroluminescent element according to claim 1 is superimposed on the electrode on a substrate on which the electrode is formed so that the adhesive layer is in contact with the transfer material. Heat is applied in a desired pattern shape, and thereafter, the pattern laminate composed of the adhesive layer, the dielectric layer, and the light emitting layer is transferred on the electrode in the pattern shape by peeling the support, and then, transparent. A method for manufacturing an electroluminescent device, comprising: fixing a transparent substrate on which an electrode is formed so that the transparent electrode is in contact with a light emitting layer of the pattern laminate. 9. The transfer material for manufacturing an electroluminescent element according to claim 1 is processed into a desired pattern shape, and the transfer material after the processing is applied to an electrode formed on a substrate by the adhesive layer. The pattern stack composed of an adhesive layer, a dielectric layer, and a luminous layer in the pattern shape is peeled off by applying heat from the support side of the transfer material, and then peeling off the support, so that the electrode laminates the electrode. The method of manufacturing an electroluminescent device, comprising: transferring a transparent substrate on which a transparent electrode is formed, and then fixing the transparent substrate so that the transparent electrode is in contact with the light emitting layer of the pattern laminate. 10. A transfer material for producing an electroluminescent element according to claim 3 is superimposed on a base material so that the electrodes are in contact with each other, and heat is applied in a desired pattern from the support side of the transfer material. After that, a pattern laminate composed of an electrode, an adhesive layer, a dielectric layer, and a light emitting layer is transferred onto the substrate in the pattern shape by peeling the support, and then, a transparent substrate on which a transparent electrode is formed is formed. A method for manufacturing an electroluminescent device, comprising: fixing a material so that the transparent electrode is in contact with a light emitting layer of the pattern laminate. 11. The transfer material for producing an electroluminescent element according to claim 3 is processed into a desired pattern shape, and the processed transfer material is superimposed on a base material so that the electrode is in contact with the transfer material. Heat is applied from the support side of the transfer material, and then, by peeling off the support, a pattern laminate composed of an electrode, an adhesive layer, a dielectric layer, and a light emitting layer is transferred onto the substrate in the pattern shape. ,afterwards,
A method for manufacturing an electroluminescent device, comprising: fixing a transparent substrate on which a transparent electrode is formed so that the transparent electrode is in contact with the light emitting layer of the pattern laminate. 12. The transfer material for producing an electroluminescent element according to claim 4 is superimposed on the electrode on a substrate on which the electrode is formed so that the adhesive layer is in contact with the transfer material. Applying heat in a desired pattern shape, and then transferring a pattern laminate composed of an adhesive layer, a dielectric layer, a luminescent layer and a transparent electrode on the electrode in the pattern shape by peeling the support, afterwards,
A method for manufacturing an electroluminescent device, comprising: fixing a transparent substrate so as to be in contact with a transparent electrode of the pattern laminate. 13. The transfer material for producing an electroluminescent element according to claim 4 is processed into a desired pattern shape, and the transfer material after the processing is applied to an electrode formed on a base material by the adhesive layer. A pattern laminate composed of an adhesive layer, a dielectric layer, a luminescent layer, and a transparent electrode in the pattern shape by applying heat from the support side of the transfer material, and then peeling the support, so that they are in contact with each other. Is transferred onto the electrode, and then a transparent substrate is fixed so as to be in contact with the transparent electrode of the pattern laminate. 14. A transfer material for producing an electroluminescent element according to claim 5 is superimposed on a base material such that the electrodes are in contact with each other, and heat is applied in a desired pattern from the support side of the transfer material. Then, a pattern laminate comprising electrodes, an adhesive layer, a dielectric layer, a luminescent layer and a transparent electrode is transferred onto the substrate in the pattern shape by peeling the support, and then the transparent substrate is removed. A method of manufacturing an electroluminescent device, comprising fixing the pattern laminate so as to be in contact with a transparent electrode. 15. The transfer material for producing an electroluminescent element according to claim 5 is processed into a desired pattern shape, and the processed transfer material is superimposed on a substrate such that the electrode is in contact with the transfer material. Heat is applied from the support side of the transfer material, and then the support is peeled off to form a pattern laminate comprising electrodes, an adhesive layer, a dielectric layer, a luminescent layer, and a transparent electrode in the pattern shape on the base material. And then fixing the transparent substrate so as to be in contact with the transparent electrode of the pattern laminate. 16. The transfer material for producing an electroluminescent element according to claim 6, which is superimposed on the electrode of the base material on which the electrode is formed so that the adhesive layer is in contact with the transfer material. A method for manufacturing an electroluminescent device, comprising applying heat. 17. A transfer material for producing an electroluminescent element according to claim 7, which is overlaid on a base material so that the electrode is in contact with the transfer material, and heat is applied from the support side of the transfer material. A method for manufacturing an electroluminescence element.