JP2002185196A - Cut and clinch method of electronic component lead wire and electronic component insertion apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method and apparatus of cut and clinch without causing any operational failure. SOLUTION: The method of cut and clinch for cutting and clinching a lead wire of an electronic component inserted in a hole of a printed circuit board with a fixed blade fixed to a cut and clinch head and a movable blade movably attached to the cut and clinch head comprises the steps of: inserting the lead wire of the electronic component into the hole of the printed circuit board in guiding it with an insertion guide; placing the moving blade just under the hole of the printed circuit board when inserting the lead wire; receiving the tip of the lead wire with upper surface of the moving blade; withdrawing the insertion guide; moving down the electronic component to the prescribed position by opening the moving blade; and cutting and clinching the lead wire with the fixed blade and the moving blade.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device for inserting electronic components with leads, which cuts the leads of the electronic components inserted into the printed circuit board and bends the leads along the bottom surface of the printed circuit board (cut and cut). The present invention relates to a lead wire cut-and-clinch device for clinching and an electronic component insertion device having such a cut-and-clinch device.

[0002]

2. Description of the Related Art When inserting a lead wire of an electronic component into a mounting hole of a printed circuit board, an electronic component insertion device presses the electronic component with a push rod from above while holding the lead wire with an insertion guide and guiding it to a correct position. It is inserted into the mounting hole of the substrate from above the substrate. Thereafter, the electronic component is further pushed down to a predetermined final position by retracting (or retracting) the insertion guide from above the substrate. Thereafter, the lead wire projecting to the lower side of the substrate is cut into a predetermined length by using a cut-and-clinch device, and is bent along the bottom surface of the substrate.

In the above process, the direction in which the insertion guide is retracted from above the substrate is obliquely upward with respect to the substrate. At this time, since the insertion guide is in contact with the lead wire of the electronic component, the insertion guide is retracted. In some cases, electronic components may be tilted or pulled down. Alternatively, the speed at which the electronic component is lowered by being pushed by the push rod may be too fast to retract the insertion guide in time, and the insertion guide may interfere with the electronic component and damage the electronic component.

[0004] In order to prevent the above situation, there has been proposed a method of providing a structure for holding the leading end of a lead wire under the substrate, and retracting the insertion guide while holding the leading end of the lead wire. ing.

As one example of such a device, Japanese Patent Application No. 2000-95902 filed by the same applicant discloses a lead wire clamper for holding a lead wire in the center of a clinch head for cutting and clinching the lead wire and guiding the lead wire in a vertical direction. Is provided. The structure is shown in FIG.

FIG. 4 shows a state in which the lead wire 204 of the electronic component 202 is inserted into the substrate 210 and the insertion guide 206 is retracted upward. The leading end of the lead wire 204 inserted into the insertion hole of the board 210 is inserted into the insertion guide groove 2 of the lead wire clamper 226 of the clinch head 230 on the lower side of the board.
26a and is held. The lead wire clamper 226 is fixed to an elevating shaft 228 that moves up and down the hollow interior of the clinch head 230, and moves up and down between the fixed blade 222 and the movable blade 224 of the clinch head. When the insertion guide 206 is retracted, the electronic component 202 and its lead wire 204 are held between the push rod 212 and the lead wire clamper 226. There is no. After the insertion guide is separated from the lead wire, the lead wire clamper 226 is lowered together with the lifting shaft 228 to release the holding of the lead wire. Thereafter, the movable blade 224 moves to cut off the leading end of the lead wire, make the lead wire an appropriate length, and bend the remaining lead wire so as to be parallel to the bottom surface of the substrate.

[0007]

In the apparatus described above, when cutting a lead wire, the lead wire clamper descends and is located below the fixed blade and the movable blade. Therefore, the end of the lead wire that has been cut off by these blades and dropped is formed by the guide groove 226a of the lead wire clamper 226.
Or it may be caught on the lead wire clamper, which may hinder the operation of the device. Also, the lead wire clamper and its associated elevating shaft occupy the space below the fixed blade and the movable blade without having to be caught on the clamper. There is a problem that it is difficult to do.

[0008]

In order to solve the above problems, a lead wire cut and clinch method according to the present invention uses a fixed blade fixed to a cut and clinch head and a movable blade movable with respect to the fixed blade. This is a cut-and-clinch method that cuts and bends the lead wire of an electronic component inserted into a hole in a printed circuit board. Position it directly below the hole in the board, receive the tip of the lead wire on the upper surface of the movable blade, retract the insertion guide in that state, then open the movable blade, lower the electronic component to the predetermined position, and move the electronic component to the fixed blade. The cutting and bending operation of the lead wire by the blade is performed.

Preferably, when retracting the insertion guide,
The electronic component is held between a push rod that presses the top of the electronic component and a movable blade that receives the tip of a lead wire of the electronic component.

Further, in the electric component inserting apparatus of the present invention, the lead wire of the electronic component is inserted into the hole of the printed board from the one side (usually the upper side) of the board, and the lead is inserted at the opposite side (usually the lower side) of the board. An electronic component insertion device that cuts and bends a lead wire, the insertion guide being disposed on the one side of the board and holding a lead wire of the electronic board and guiding it to a hole in a printed board,
A push rod for pressing a top of an electronic component, which is disposed on the one side of the substrate, and a cut and clinch head for performing a cutting and bending operation of a lead wire, which is disposed on the opposite side of the substrate; A cutting and clinch head having a fixed blade fixed during operation, and a movable blade for cutting and bending the lead wire in cooperation with the fixed blade by moving with respect to the fixed blade during the cutting and bending operation; an insertion guide; Control means for controlling the operation of the rod and the cut-and-clinch head, wherein the control means guides the lead wire of the electronic component by an insertion guide while inserting the top of the electronic component into the hole of the printed circuit board with a push rod. Position the movable blade directly below the hole in the printed circuit board, receive the tip of the lead wire on the upper surface of the movable blade, retract the insertion guide in that state, and then move the movable blade Open lowers the electronic component to a predetermined position, and wherein said controlling the insertion guide and cut-and-clinch heads so as to cut bending operation of the lead wire due to the fixed blade and the movable blade.

Preferably, when the insertion guide is retracted by this device, the electronic component is held between a push rod that presses the top of the electronic component and a movable blade that receives the tip of a lead wire of the electronic component.

In the cut-and-clinch method and the electronic component insertion apparatus of the present invention as described above, the movable blade inherent to the cut-and-clinch head is used to receive the leading end of the lead wire below the substrate. No additional equipment such as a lead clamper for receiving or holding the lead wire at the lower part of the head and an additional drive system therefor are not required, and the structure can be simplified.

Further, since there is no additional equipment such as a lead wire clamper, the above-described problem that the cut piece of the lead wire is caught by such equipment does not occur, and the cut piece of the cut lead wire is not removed. By providing a space between the movable blade and the fixed blade, it is possible to discharge through the space and below the cut and clinch head.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of an electronic component insertion device having a lead wire cut and clinch device according to the present invention will be described below with reference to the drawings. FIG. 3 is a perspective view schematically showing an example of an electronic component insertion device in which an electronic component with a lead wire is inserted into a mounting hole of a printed circuit board, and the lead wire is cut and bent (that is, cut and clinched).

The apparatus generally comprises an insertion head section 110 located above the printed circuit board 9 and a cut and clinch section 120 located below the printed circuit board. Note that the substrate 9 in FIG. 3 is merely drawn to schematically show the vertical position, and does not reflect the actual size.

The insertion head unit 110 is a mechanism for holding the electronic component and carrying it to a predetermined mounting hole of the printed circuit board, and for pushing the lead of the electronic component into the mounting hole. The cut-and-clinch unit 120 is a mechanism for cutting the lead of the electronic component, which is inserted into the mounting hole of the printed board and protrudes downward from the board, into an appropriate length and bends it along the board surface.

Referring to FIG. 3, the insertion head 110 receives the electronic component with a lead wire supplied from a component supply unit (not shown) and transfers it to the insertion guide 5.
One. The insertion guide 5 is for guiding a lead wire of the electronic component to a mounting hole of the printed circuit board 9 while holding the lead wire. The insertion head 110 has a push rod 31 for pushing the top of the electronic component downward and inserting it into the printed circuit board 9. These transfer heads, insertion heads and push rods are driven by motors M1 and M2 as drive sources for mechanisms 114 and 11 respectively.
6 and is driven under the control of the device control system.

The cut-and-clinch unit 120 has a cut-and-clinch head 10 for cutting the leads of the electronic component to an appropriate length and bending the leads along the substrate surface. The cut and clinch head 10 is driven by the motors M3 and M4 as drive sources via mechanisms 122 and 124 under the control of the device control system.

Since FIG. 3 is a diagram schematically showing only the overall configuration of the apparatus, the configuration of the cut-and-clinch head 10 in the present embodiment will be understood with reference to FIGS. 1A and 1B described below. Should.

FIGS. 1A and 1B are front views showing the cut-and-clinch head 10 in a partial cross section. In these figures, the body member 12 of the cut and clinch head is shown.
(Shown in cross section) is mounted on the elevating shaft 30, and is movable up and down with respect to the printed circuit board 9 as the elevating shaft 30 moves up and down. The main body member 12 is hollow having a cavity 13 at its center.

A fixed blade member 14 and a movable blade member 16 are mounted on the main body member 12. A movable blade 18 is provided above the movable blade member. The rear side of the movable blade 18 (the back side in the direction perpendicular to the plane of the drawing) has a plate shape 18b in order to maintain the strength of the movable blade.

The movable blade member 16 has one end pivotally mounted about a shaft 26 fixed to the main body member 12. The other end of the movable blade member 16 is pivotally connected to one end of a link member 20 via a shaft 24. The other end of the link member 20 is connected to the drive ring 18 via a shaft 22. The drive ring 18 is mounted around the outer periphery of the main body member 12 and vertically moved by a drive system (not shown), that is, in the axial direction of the main body member 12.
When the drive ring 19 moves up and down, the movable blade member 16 is moved.
Moves between the position shown in FIG. 1A and the position shown in FIG. 1B, and opens and closes the movable blade 18 with respect to the fixed blade 14.

FIG. 1a shows the drive ring 19 at its lowermost position, and FIG. 1b shows the drive ring 19 at its uppermost position. When the drive ring 19 is moved upward from the lowermost position shown in FIG. 1A, the movable blade 18 is closed with the movement of the movable blade member 16 and finally the distal end portion 18 of the movable blade is moved.
a rides on the tip of the fixed blade 14. In this process, the electronic component lead wire sandwiched between the movable blade 18 and the fixed blade is cut and clinched (cut and bent). The cut and clinch itself is well known and will not be described in detail here.

Since FIGS. 1A and 1B are views as viewed from one direction, only one set of fixed and movable blades of the cut-and-clinch head is shown. One cut and clinch head has a plurality of similar pairs of fixed blades and movable blades. As a result, two or more lead wires such as a capacitor and a transistor are cut and clinched simultaneously.

Next, the operation of the apparatus at the time of component insertion will be described with reference to FIGS. 2A to 2G. 2a to 2
g indicates the operation of the component insertion head (upper side of the printed circuit board 9) and the cut-and-clinch head 10 (lower side of the printed circuit board 9) in order in one cycle of component insertion. Note that only the insertion guide 5 for guiding the component lead wires and the push rod 31 for pressing the top of the component are shown on the insertion head side.

FIG. 2A shows a standby state before the insertion operation starts. At this time, the electronic component 2 is positioned above the printed circuit board with its lead wire held by the insertion guide 5, and the cut and clinch head 10 is at the standby position below the printed circuit board. At this time, the drive ring 19 of the cut and clinch head 10 is at the uppermost position with respect to the main body member 12, and accordingly, the movable blade 18 is in a completely closed state, that is, in a state of riding on the fixed blade 14. ing.

Next, FIG. 2B shows a point in time when the insertion operation starts, and the insertion guide 5 guides the lead wire of the electronic component 2 to the mounting hole of the printed circuit board. The cut-and-clinch head has been raised to a position immediately below the printed circuit board by raising the elevating shaft 30 (FIG. 1B). At this time, the drive ring 19 is at a position lower than the state shown in FIG.
As a result, the movable blade 18 is slightly opened from the state shown in FIG. 2A, and its tip is located immediately below the mounting hole, that is, immediately below the lead wire.

In this state, the insertion guide 5 releases the grip of the lead wire of the electronic component 2. As a result, the electronic component 2 is pushed by the push rod or descends by its own weight, and the lead wire is further pushed in from the state of FIG. 2B, and its tip comes into contact with the upper surface of the movable blade 18 as shown in FIG. 2C. In other words, the tip of the lead wire is supported by the upper surface of the movable blade 18. At this time, since the push bar 31 is pushing the electronic component downward with a predetermined force, the electronic component is sandwiched and held between the push bar 31 and the movable blade 18. At this time, the insertion guide 5 starts retreating diagonally upward to enable the component to be pushed further. In the present invention, when the insertion guide is retracted, the electronic component is held between the push rod 31 and the upper surface of the movable blade 18, so that the electronic component does not tilt or fall.

Subsequently, after the insertion guide 5 is retracted to a position where it does not interfere with the components, the drive ring of the cut and clinch head is lowered, and the movable blade 18 is opened. Thereby, the support of the electronic component lead wire by the upper surface of the movable blade is released, and the electronic component 2 is lowered to the lowest point by the pushing force of the push rod and / or its own weight, and the insertion of the component is completed. This state is the state shown in FIG. 2D. At this time, the lead wire of the electronic component is located between the fixed blade 14 and the movable blade 18 of the cut and clinch head.

Thereafter, a normal cut-and-clinch is performed in accordance with the operations shown in FIGS. 2e to 2g. That is, by driving the drive ring 19 upward with respect to the main body member 12, the movable blade 18 closes, and in the state shown in FIG. 2E, the tip of the movable blade comes into contact with the side surface of the lead wire to deform the lead wire. Begins. Subsequently, as shown in FIG. 2F, the lead wire is sandwiched between the fixed blade 14 and the movable blade 18, and the cutting of the lead wire is started. When the drive ring is further raised, the movable blade 18 is further closed, and the lead wire is completely cut and bent along the substrate (clinch). This is the state shown in FIG. 2g, which completes the cut and clinch. The cut end of the lead wire falls down through the cavity 13 (FIG. 1a) in the main body member 12, so that the operation of the cut-and-clinch mechanism is not caused. In this case, preferably, the elevating shaft 30 is also hollow.

The operation of the apparatus as described above, that is, the operation of the insertion guide, the push rod, and the cut and clinch head is controlled by control means (not shown) such as a CPU.
Synchronize.

In the example shown in the figure and described above, FIG.
In the state where the insertion guide is gripping the lead wire as shown in b, the tip of the lead wire is not in contact with the upper surface of the movable blade, and the electronic component is lowered by releasing the grip of the insertion guide. And the lead wire is in contact with the movable blade. However, the present invention is not limited to this, and it is easily understood that the present invention is effective even when the lead wire of the electronic component is configured to abut on the upper surface of the movable blade while being held by the insertion guide. Will be understood.

[0033]

According to the cut-and-clinch method and the electronic component mounting apparatus of the present invention, the movable blade inherent to the cut-and-clinch head is used to receive the leading end of the lead wire under the substrate. Therefore, no additional equipment such as a lead wire clamper for receiving or holding the lead wire and an additional drive system therefor are not required, and the configuration can be simplified.

Moreover, since there is no additional equipment such as a lead wire clamper, the cut piece of the lead wire is not caught by such equipment, and the cut piece of the cut lead wire is located between the movable blade and the fixed blade. By providing a space in the cut and clinch head, the air can be discharged through the space.

[Brief description of the drawings]

FIG. 1a is a front view, partially in section, of a cut and clinch head according to an embodiment of the present invention, showing a state in which a movable blade is open.

FIG. 1b is a view similar to FIG. 1a, showing a state in which the movable blade is closed. FIGS. 2A to 2G are diagrams for sequentially explaining the operation of the electronic component insertion device as one embodiment of the present invention,

FIG. 2a shows a state in which the cut and clinch head is at a standby position.

FIG. 2b shows a state in which the cut and clinch head is in a raised position.

FIG. 2C shows a state in which the tip of the lead wire is received on the upper surface of the movable blade to prevent the component from dropping.

FIG. 2D shows a state in which insertion of a component has been completed.

FIG. 2e shows a state where the movable blade has begun to close and the deformation of the lead wire has started.

FIG. 2f shows a state where the movable blade is further closed and the cutting of the lead wire has started.

FIG. 2g shows a state where the movable blade is further closed and the lead wire is cut and bent.

FIG. 3 is a perspective view schematically showing a configuration of an electronic component insertion device.

FIG. 4 is a diagram showing a configuration of a cut-and-clinch head having a lead wire clamper.

[Explanation of symbols]

 2 electronic component 5 insertion guide 9 printed board 10 cut and clinch head 12 cut and clinch head main body member 13 cavity 14 fixed blade member 16 movable blade member 18 movable blade 19 drive ring 20 link member 30 elevating shaft 31 push rod 110 insertion head section 111 Delivery Head 114, 116 Drive Mechanism of Insertion Head Section 120 Cut and Clinch Section 122, 124 Drive Mechanism of Cut and Clinch Section

 ────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Toshinobu Miyakoshi 1-13-1 Nihonbashi, Chuo-ku, Tokyo FDC term in TDK Corporation (reference) 5E313 AA06 AA11 CE04 CE06 CE11

Claims (6)

[Claims] 1. A cut and clinch method for cutting and bending a lead wire of an electronic component inserted into a hole of a printed circuit board using a fixed blade fixed to a cut and clinch head and a movable blade movable with respect to the fixed blade. When inserting the lead wire of the electronic component into the hole of the printed circuit board while guiding the lead wire by the insertion guide, the movable blade is positioned immediately below the hole of the printed circuit board, and the tip of the lead wire is received on the upper surface of the movable blade, In this state, the insertion guide is retracted, then the movable blade is opened, the electronic component is lowered to a predetermined position, and the cutting and bending operation of the lead wire is performed by the fixed blade and the movable blade. Clinch way. 2. The electronic component is held between a push rod that presses a top portion of the electronic component and a movable blade that receives a tip of a lead wire of the electronic component when the insertion guide is retracted. The method for cutting and clinching a lead wire according to claim 1. 3. The cut-and-clinch head has a space between the fixed blade and the movable blade, which penetrates the cut-and-clinch head, and cuts a cut end of the lead wire through the space to a lower portion of the cut-and-clinch head. 3. The method according to claim 1, wherein the liquid is discharged to the outside. 4. An electronic component insertion device for inserting a lead wire of an electronic component into a hole of a printed board from one side of the board, and cutting and bending the lead wire on the opposite side of the board, wherein the one side of the board is provided. An insertion guide for holding the lead wire of the electronic board and guiding it to the hole of the printed board; a push rod for pressing the top of the electronic component, which is arranged on the one side of the board; A cut-and-clinch head arranged on the opposite side for performing a cutting and bending operation of a lead wire, wherein the fixed blade is fixed during the cutting and bending operation, and is fixed by moving with respect to the fixed blade during the cutting and bending operation. A cut-and-clinch head having a movable blade that cuts and bends a lead wire in cooperation with a blade; and controls operations of the insertion guide, the push rod, and the cut-and-clinch head. The control means controls the movable blade when the electronic component is inserted into the hole of the printed board by pushing the top of the electronic component with a push rod while guiding the lead wire of the electronic component by the insertion guide. Positioned immediately below the hole in the board, receive the tip of the lead wire on the upper surface of the movable blade, retract the insertion guide in that state, then open the movable blade to lower the electronic component to a predetermined position, and An electronic component insertion device, wherein the insertion guide and the cut-and-clinch head are controlled so as to perform a cutting and bending operation of a lead wire by a movable blade. 5. When the insertion guide is retracted, the electronic component is held between a push rod that presses a top of the electronic component and a movable blade that receives a tip of a lead wire of the electronic component. The electronic component insertion device according to claim 4. 6. The cut-and-clinch head has a space between the fixed blade and the movable blade, which penetrates the cut-and-clinch head, and a cut end of the cut lead wire passes through the space and a lower portion of the cut-and-clinch head. The electronic component insertion device according to claim 4, wherein the electronic component is discharged to the device.