JP2002184649A - Method of manufacturing laminated electronic component for surface mounting - Google Patents
Method of manufacturing laminated electronic component for surface mountingInfo
- Publication number
- JP2002184649A JP2002184649A JP2000383304A JP2000383304A JP2002184649A JP 2002184649 A JP2002184649 A JP 2002184649A JP 2000383304 A JP2000383304 A JP 2000383304A JP 2000383304 A JP2000383304 A JP 2000383304A JP 2002184649 A JP2002184649 A JP 2002184649A
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- Prior art keywords
- green sheet
- sheet layer
- layer
- sheet
- lowermost
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- Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
- Ceramic Capacitors (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、携帯電話、デジタ
ルカメラ等に用いられる表面搭載用積層電子部品の製造
方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a surface-mounted laminated electronic component used for a cellular phone, a digital camera and the like.
【０００２】[0002]
【従来の技術】図４に示す如く、従来の表面搭載用積層
電子部品の製造方法は、同図（Ａ）のようにセットテー
ブル１に形成した最下外装グリーンシート層２を、同図
（Ｂ）のように吸引搬送板３で搬送し、吸引解除で同図
（Ｃ）の圧着テーブル４上の正位置に搭載した後、前記
セットテーブル１上に印刷等で形成した内部電極層５を
有するグリーンシート層６を前記吸引搬送板３で搬送し
て前記最下外装グリーンシート層２上の正位置に重層
し、これを順次繰り返して前記グリーンシート層６を必
要枚数だけ前記圧着テーブル４上で積層して同図（Ｄ）
のようにグリーンシート積層体層７を形成する。そして
最後に最上外装グリーンシート層８を前記吸引搬送板３
で搬送して前記グリーンシート積層体層７上の正位置に
重層して後、同図（Ｅ）のように加圧１０ｔ［４０kgf
／cm２］の加熱プレス（図示せず）で前記圧着テーブル
４と圧着金型９で前記グリーンシート積層体層７及び最
上外装グリーンシート層８を加熱圧着してグリーンシー
ト積層体１０を形成する。前記圧着テーブル４と圧着金
型９から取り外された前記グリーンシート積層体１０は
周知の如く、所定の大きさに複数個切断（図に示さず）
してチップ部品化し、焼成炉で焼成後、夫々外部電極を
設けてチップインダクタやチップコンデンサ等々の表面
搭載用積層電子部品を製造している。2. Description of the Related Art As shown in FIG. 4, a conventional method for manufacturing a surface-mounted laminated electronic component includes the steps of forming a lowermost exterior green sheet layer 2 formed on a set table 1 as shown in FIG. B) As shown in FIG. 3B, after being conveyed by the suction conveyance plate 3 and mounted at the correct position on the pressure bonding table 4 in FIG. The green sheet layer 6 having the green sheet layer 6 is conveyed by the suction conveyance plate 3 and is superposed on the lowermost exterior green sheet layer 2 at the correct position. (D)
The green sheet laminate layer 7 is formed as described above. Finally, the uppermost outer green sheet layer 8 is transferred to the suction transport plate 3.
And then overlaid on the green sheet laminated body layer 7 at the correct position, and then pressurized for 10 t [40 kgf] as shown in FIG.
/ Cm 2 ], the green sheet laminate layer 7 and the outermost green sheet layer 8 are thermocompressed with the crimping table 4 and the crimping die 9 to form a green sheet laminate 10. . As is well known, the green sheet laminate 10 removed from the crimping table 4 and the crimping die 9 is cut into a plurality of pieces having a predetermined size (not shown).
Then, after firing in a firing furnace, external electrodes are respectively provided to manufacture multilayer electronic components for surface mounting such as chip inductors and chip capacitors.
【０００３】上記製法であると、最下外装グリーンシー
ト層２は１回の加熱圧着のために、図５（Ａ）及びその
要部を拡大した同図（Ｂ）に示す如く、クリーンシート
積層体の断面写真より最下外装グリーンシート層２は乾
燥密度が低いため熱圧着をしたときにグリーンシート積
層体断面の複数積層された内部電極層群１１、１２間の
間隙部分となるグリーンシート層群１３に最下外装グリ
ーンシート層２の一部が押しだされて盛上り１４が生
じ、前記間隙部分１３に巣１５（空隙）が発生し構造欠
陥の原因となり、所望の電気的特性が得難く品質、歩留
が安定しない欠点を有している。According to the above-mentioned manufacturing method, the lower outermost green sheet layer 2 is laminated by a clean sheet as shown in FIG. 5A and its enlarged main part in FIG. From the photograph of the cross section of the body, the lower outermost green sheet layer 2 has a low dry density, so that when subjected to thermocompression bonding, the green sheet layer which becomes a gap between the plurality of laminated internal electrode layer groups 11 and 12 in the cross section of the green sheet laminate A part of the lowermost exterior green sheet layer 2 is extruded into the group 13 to form a swelling 14, and a cavity 15 (void) is generated in the gap portion 13 to cause a structural defect and obtain desired electrical characteristics. It has the drawback that it is difficult and the quality and yield are not stable.
【０００４】なお、上記以外の従来技術としては特開平
２−２０８９１２号公報や特開平３−６２５０９号公報
に示すものがあるが、前記巣（空隙）に起因する構造欠
陥を解消する技術は開示していない。[0004] As a prior art other than the above, there are those disclosed in JP-A-2-208912 and JP-A-3-62509, but a technique for eliminating a structural defect caused by the cavity (void) is disclosed. I haven't.
【０００５】[0005]
【発明が解決しようとする課題】本発明は、上述等の欠
点を解消し、絶縁不良や接続不良等がなく、電気特性の
安定を阻害する構造欠陥を少なくし、歩留がよく均一な
品質が維持確保でき、安価に大量生産が可能な表面搭載
用積層電子部品の製造方法を提供することを目的として
いる。SUMMARY OF THE INVENTION The present invention solves the above-mentioned drawbacks, has no insulation failure or connection failure, reduces structural defects that hinder the stability of electrical characteristics, and has a good yield and uniform quality. It is an object of the present invention to provide a method for manufacturing a surface-mounted laminated electronic component that can maintain and secure the electronic component and can be mass-produced at low cost.
【０００６】本発明のその他の目的や新規な特徴は後述
の実施の形態において明らかにする。[0006] Other objects and novel features of the present invention will be clarified in embodiments described later.
【０００７】[0007]
【課題を解決するための手段】上記目的を達成するため
に、本願請求項１の発明に係る表面搭載用積層電子部品
の製造方法は、最下外装シート層を熱加圧する工程と、
熱加圧された前記最下外装シート層上に内部電極層を設
けたシート層を複数重層してシート積層体層を形成する
工程と、該シート積層体層上に最上外装シート層を重層
形成した後に、前記最下外装シート層と前記シート積層
体層と前記最上外装シート層とを加熱圧着する工程とを
備えることを特徴としている。In order to achieve the above object, a method for manufacturing a surface-mounted laminated electronic component according to the invention of claim 1 of the present application comprises a step of heat-pressing a lowermost exterior sheet layer;
Forming a sheet laminate layer by stacking a plurality of sheet layers provided with internal electrode layers on the lowermost heat-pressed outer sheet layer, and forming an uppermost outer sheet layer on the sheet laminate layer; Then, a step of thermocompression bonding the lowermost exterior sheet layer, the sheet laminate layer, and the uppermost exterior sheet layer is provided.
【０００８】本願請求項２の発明に係る表面搭載用積層
電子部品の製造方法は、最下外装シート層を熱加圧する
工程と、内部電極層を設けたシート層を複数重層してシ
ート積層体層を形成する工程と、該シート積層体層上に
最上外装シート層を重層形成した後に、前記シート積層
体層と前記最上外装シート層とを加熱圧着して圧着体を
形成する工程と、前記熱加圧された最下外装シート層に
前記圧着体を重層して再加熱圧着する行程とを備えるこ
とを特徴としている。According to a second aspect of the present invention, there is provided a method of manufacturing a surface-mounted laminated electronic component, comprising: a step of thermally pressing a lowermost outer sheet layer; and a step of laminating a plurality of sheet layers provided with internal electrode layers. Forming a layer, and after forming an uppermost outer sheet layer on the sheet laminate layer, forming a press-bonded body by heat-pressing the sheet laminate layer and the uppermost outer sheet layer; and A step of laminating the press-bonded body on the lowermost exterior sheet layer that has been hot-pressed and performing re-heat press bonding.
【０００９】本願請求項３の発明に係る表面搭載用積層
電子部品の製造方法は、請求項１又は２において、前記
シート層はグリーンシート層であることを特徴してい
る。[0009] The method for manufacturing a surface-mounted laminated electronic component according to the third aspect of the present invention is characterized in that, in the first or second aspect, the sheet layer is a green sheet layer.
【００１０】本願請求項４の発明に係る表面搭載用積層
電子部品の製造方法は、請求項３において前記グリーン
シート層は誘電体材料を含んで構成されていることを特
徴としている。According to a fourth aspect of the present invention, there is provided a method for manufacturing a surface-mounted laminated electronic component, wherein the green sheet layer is configured to include a dielectric material.
【００１１】[0011]
【発明の実施の形態】以下、本発明に係る表面搭載用積
層電子部品の製造方法の実施の形態を図面に従って説明
する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a method for manufacturing a surface-mounted laminated electronic component according to the present invention will be described below with reference to the drawings.
【００１２】図１は本発明に係る表面搭載用積層電子部
品の製造方法の第１の実施の形態を示す。この図１は主
要部の製造工程説明図であり、同図（Ａ）のように吸引
搬送板３で搬送した最下外装グリーンシート層２を圧着
テーブル４に載置した後、前記吸引搬送板３は移動し、
前記圧着テーブル４上に圧着金型９が配置され、この圧
着金型９と圧着テーブル４で前記最下外装グリーンシー
ト層２を熱加圧（加熱と共に加圧）して密度を高める
（最下外装グリーンシート層熱加圧工程）。FIG. 1 shows a first embodiment of a method of manufacturing a laminated electronic component for surface mounting according to the present invention. FIG. 1 is an explanatory view of a main part of the manufacturing process. As shown in FIG. 1A, after the lowermost exterior green sheet layer 2 conveyed by a suction conveyance plate 3 is placed on a pressure bonding table 4, the suction conveyance plate 3 moves,
A crimping die 9 is arranged on the crimping table 4, and the lowermost exterior green sheet layer 2 is hot-pressed (pressed with heating) by the crimping die 9 and the crimping table 4 to increase the density (lowermost). Exterior green sheet layer hot pressing process).
【００１３】次に、図１（Ｂ）のようにセットテーブル
１に、内部電極層５を印刷形成したグリーンシート層６
を、同図（Ｃ）のように吸引搬送板３で前記圧着テーブ
ル４に形成している圧着された最下外装グリーンシート
層２上に幾層も重層し（グリーンシート層重層工程）、
これにより図１（Ｄ）ように前記圧着テーブル４上にグ
リーンシート積層体層７を形成する。そして、このグリ
ーンシート積層体層７上に最上外装グリーンシート層８
を吸引搬送板３ににより重層する（最上外装グリーンシ
ート層重層工程）。なお、各グリーンシート層は誘電体
材料を含む未焼成シート層である。Next, as shown in FIG. 1B, a green sheet layer 6 having the internal electrode layer 5 printed thereon is set on the set table 1.
As shown in FIG. 2C, several layers are stacked on the lowermost exterior green sheet layer 2 which is formed on the compression table 4 by the suction conveyance plate 3 and is pressed (green sheet layer overlapping step).
Thus, a green sheet laminate layer 7 is formed on the pressure bonding table 4 as shown in FIG. Then, on the green sheet laminated body layer 7, the uppermost exterior green sheet layer 8 is formed.
Is layered on the suction conveyance plate 3 (the uppermost exterior green sheet layer overlapping step). Each green sheet layer is a green sheet layer containing a dielectric material.
【００１４】その後、図１（Ｅ）のように圧着金型９が
吸引搬送板３に代って配置され、この圧着金型９と圧着
テーブル４で加熱圧着してグリーンシート積層体１０を
得る（積層体加熱圧着工程）。このために最下外装グリ
ーンシート層２は再度加熱圧着される。Thereafter, as shown in FIG. 1 (E), a crimping die 9 is arranged in place of the suction / transport plate 3, and the crimping die 9 and the crimping table 4 are heated and crimped to obtain a green sheet laminate 10. (Laminated body heat compression bonding step). For this purpose, the lowermost exterior green sheet layer 2 is heated and pressed again.
【００１５】この時の加熱圧着力は、積層数や内部電極
層を有するグリーンシート層の厚み及び両外装グリーン
シート層の厚みにより異なるが、一般には温度２５℃〜
１００℃、圧力２.０〜１７kgf／cm２の範囲で施すと良
い。The heat-compression force at this time varies depending on the number of layers, the thickness of the green sheet layer having the internal electrode layers, and the thickness of both exterior green sheet layers.
It is preferable to apply at 100 ° C. and a pressure of 2.0 to 17 kgf / cm 2 .
【００１６】尚、温度２５℃未満であると、グリーンシ
ート層は硬化せず、圧力を負荷すると形態が崩れ、温度
１００℃を超えるとグリーンシート層のバインダーや溶
剤が急激に変質してしまい構造欠陥が生じる。また、圧
力については、２.０〜１７kgf／cm２の範囲外である
と、従来法と同等であったり、温度条件との関係で積層
体の形態が崩れ構造欠陥が多発することになる。When the temperature is lower than 25 ° C., the green sheet layer does not cure, and when pressure is applied, the shape is collapsed. Defects occur. If the pressure is out of the range of 2.0 to 17 kgf / cm 2 , the laminate may have the same shape as that of the conventional method, or the shape of the laminate may be collapsed due to the temperature condition, and structural defects may occur frequently.
【００１７】前記圧着テーブル４と圧着金型９から取り
外された前記グリーンシート積層体１０は周知の如く、
所定の大きさに複数個切断（図に示さず）してチップ部
品化し、焼成炉で焼成後、夫々外部電極を設けてチップ
インダクタやチップコンデンサ等々の表面搭載用積層電
子部品を製造する。As is well known, the green sheet laminate 10 removed from the crimping table 4 and the crimping die 9 is as follows.
A plurality of chips are cut into a predetermined size (not shown) to form chip components. After firing in a firing furnace, external electrodes are provided to manufacture multilayer electronic components for surface mounting such as chip inductors and chip capacitors.
【００１８】この第１の実施の形態の製造方法の場合、
図３（Ａ）及びその要部を拡大した同図（Ｂ）に示す如
く、最上外装グリーンシート層８と最下外装グリーンシ
ート層２の厚みは略同等になると共に、従来のような巣
１５の発生が抑制されるので構造欠陥が少なくなり究極
的に品質の向上が図られる。なお、図３中、図５と同じ
部分には同一符号を付して説明を省略する。In the case of the manufacturing method according to the first embodiment,
As shown in FIG. 3 (A) and FIG. 3 (B) in which main parts thereof are enlarged, the thicknesses of the uppermost outer green sheet layer 8 and the lowermost outer green sheet layer 2 become substantially equal, and the conventional nest 15 Is suppressed, so that structural defects are reduced and the quality is ultimately improved. Note that, in FIG. 3, the same portions as those in FIG.
【００１９】従って、この第１の実施の形態によれば、
圧着テーブルに吸引搬送板で最下外装シート層を載置形
成する工程と、前記最下外装シート層上に吸引搬送板で
内部電極層を有するシート層を複数重層してシート積層
体層を形成する工程と、前記シート積層体層上に最上外
装シート層を吸引搬送板で重層形成した後に、圧着テー
ブルと圧着金型で加熱圧着してシート積層体を形成する
工程を含有する表面搭載用積層電子部品の製造方法にお
いて、圧着テーブルと圧着金型で予め加熱圧着された前
記最下外装シート層上に前記内部電極層を有するシート
層を複数重層した工程を有しており、各シートはグリー
ンシート層で誘電体材料を含んで構成されている表面搭
載用積層電子部品の製造方法であるから、絶縁不良や接
続不良等がなく、電気特性の安定を阻害する構造欠陥を
少なくし、歩留がよく均一な品質が維持確保でき、安価
に大量生産が可能となる効果がある。Therefore, according to the first embodiment,
A step of mounting and forming the lowermost exterior sheet layer on the pressure-bonding table with a suction transport plate, and forming a sheet laminate layer by stacking a plurality of sheet layers having internal electrode layers on the lowermost exterior sheet layer with the suction transport plate And a step of forming a sheet laminate by forming an uppermost outer sheet layer on the sheet laminate layer by a suction conveyance plate and then applying heat and pressure with a compression table and a compression mold to form a sheet laminate. The method for manufacturing an electronic component includes a step of stacking a plurality of sheet layers each having the internal electrode layer on the lowermost outer sheet layer which has been pre-heated and pressed by a pressing table and a pressing mold, and each sheet is green. Since this is a method for manufacturing a surface-mounted laminated electronic component that is formed by including a dielectric material in a sheet layer, there is no insulation failure or connection failure, etc. But Ku uniform quality can be ensured maintained, there is an effect that it is possible to inexpensively mass-produced.
【００２０】図２は本発明の第２の実施の形態を示す。
この図２は主要部の製造工程説明図であり、同図（Ａ）
のようにセットテーブル１上に載置した、内部電極層５
を形成したグリーンシート層６を吸引搬送板３で吸着し
て搬送し、第１圧着テーブル４に装着する。この動作工
程を図２（Ｂ）のように所定回数繰り返して重層し、前
記第１圧着テーブル４上にグリーンシート積層体層７を
形成し、更に、同図（Ｃ）のように、このグリーンシー
ト積層体層７上に最上外装グリーンシート層８を前記吸
引搬送板３で搬送して積層した後、同図（Ｄ）のように
第１圧着金型９と前記第１圧着テーブル４とで熱加圧し
て圧着体７１を形成する（圧着体作製工程）。FIG. 2 shows a second embodiment of the present invention.
FIG. 2 is an explanatory view of a manufacturing process of a main part, and FIG.
The internal electrode layer 5 placed on the set table 1 as shown in FIG.
The green sheet layer 6 on which is formed is suctioned and conveyed by the suction conveyance plate 3 and mounted on the first pressure bonding table 4. This operation process is repeated a predetermined number of times as shown in FIG. 2 (B) to form a green sheet laminate layer 7 on the first pressure bonding table 4, and further, as shown in FIG. After the uppermost green sheet layer 8 is conveyed and laminated on the sheet laminate layer 7 by the suction conveyance plate 3, the first crimping die 9 and the first crimping table 4 as shown in FIG. The pressurized body 71 is formed by applying heat and pressure (pressed body manufacturing step).
【００２１】一方、図２（Ｅ）に示すように、第２圧着
テーブル４１に最下外装グリーンシート層２１を載置
し、第２圧着テーブル４１上に配置された第２圧着金型
９１により前記最下外装グリーンシート層２１を予め熱
加圧して密度を高めておく（最下外装グリーンシート層
熱加圧工程）。On the other hand, as shown in FIG. 2E, the lowermost exterior green sheet layer 21 is placed on the second pressure bonding table 41, and the second pressure bonding mold 91 disposed on the second pressure bonding table 41 is used. The density of the lowermost exterior green sheet layer 21 is increased by hot pressing in advance (lowest exterior green sheet layer hot pressing step).
【００２２】そして、図２（Ｆ）のように前記圧着体７
１を前記吸引搬送板３で搬送し、同図（Ｇ）のように既
に第２圧着テーブル４１に搭載され、第２圧着金型９１
により熱加圧されて形成された密度が高い最下外装グリ
ーンシート層２１上に前記圧着体７１を積層した後、同
図（Ｈ）のように前記第２圧着テーブル４１と第２圧着
金型９１で再加熱圧着してグリーンシート積層体１０を
得る（積層体加熱圧着工程）。Then, as shown in FIG.
1 is conveyed by the suction conveyance plate 3 and is already mounted on the second crimping table 41 as shown in FIG.
After the pressure-bonding body 71 is laminated on the lowermost outermost green sheet layer 21 having a high density formed by hot pressing, the second pressure-bonding table 41 and the second pressure-bonding die are formed as shown in FIG. The green sheet laminate 10 is obtained by reheating and pressing at 91 (lamination heating and pressing step).
【００２３】このために第２の実施の形態においても第
１の実施の形態と同様に最下外装グリーンシート層２は
再度加熱圧着される。また、この時の加熱圧着力も第１
の実施の形態と同様である。For this reason, in the second embodiment, the lowermost exterior green sheet layer 2 is again heat-pressed as in the first embodiment. In addition, the heat pressing force at this time is also the first.
This is the same as the embodiment.
【００２４】この第２の実施の形態の製造方法の場合
も、図３（Ａ）及びその要部を拡大した同図（Ｂ）に示
す如く、最上外装グリーンシート層８と最下外装グリー
ンシート層２１の厚みは略同等になると共に、従来のよ
うな巣１５の発生が抑制されるので構造欠陥が少なくな
り究極的に品質の向上が図られる。Also in the case of the manufacturing method according to the second embodiment, as shown in FIG. 3A and FIG. The thickness of the layer 21 becomes substantially equal, and the occurrence of the nests 15 as in the prior art is suppressed, so that structural defects are reduced and the quality is ultimately improved.
【００２５】従って、この第２の実施の形態によれば、
圧着テーブルに吸引搬送板で最下外装シート層を載置形
成する工程と、前記最下外装シート層上に吸引搬送板で
内部電極層を有するシート層を複数重層してシート積層
体層を形成する工程と、前記シート積層体層上に最上外
装シート層を吸引搬送板で重層形成した後に、前記圧着
テーブルと圧着金型で加熱圧着してシート積層体を形成
する工程を含有する表面搭載用積層電子部品の製造方法
において、圧着テーブルと圧着金型で予め熱加圧された
前記最下外装シート層上に、前記内部電極層を設けたシ
ート層を複数重層して最上外装グリーンシート層と共に
加熱圧着したシート積層体層を載置し再加熱圧着して前
記シート積層体を形成する工程を有しており、各シート
層はグリーンシート層で誘電体材料を含んで構成されて
いる表面搭載用積層電子部品の製造方法であるから、絶
縁不良や接続不良等がなく、電気特性の安定を阻害する
構造欠陥を少なくし、歩留がよく均一な品質が維持確保
でき、安価に大量生産が可能となる効果がある。Therefore, according to the second embodiment,
A step of placing and forming a lowermost exterior sheet layer on the pressure-bonding table with a suction transport plate, and forming a sheet laminate layer by stacking a plurality of sheet layers having internal electrode layers on the lowermost exterior sheet layer with the suction transport plate And a step of forming a sheet laminate by forming an uppermost outer sheet layer on the sheet laminate layer by a suction conveyance plate and then applying heat and pressure with the compression table and a compression mold to form a sheet laminate. In the method for manufacturing a laminated electronic component, a plurality of sheet layers provided with the internal electrode layers are stacked on the lowermost exterior sheet layer which has been previously hot-pressed with a compression table and a compression mold together with an uppermost external green sheet layer. A step of mounting the heat-pressed sheet laminate layer and reheating and press-bonding to form the sheet laminate, wherein each sheet layer is a green sheet layer and includes a dielectric material. Product Since it is a method of manufacturing electronic components, there is no insulation failure or connection failure, structural defects that hinder the stability of electrical characteristics are reduced, uniform yields can be maintained and ensured, and mass production is possible at low cost. There is an effect.
【００２６】以上本発明の実施の形態について説明して
きたが、本発明はこれに限定されることなく請求項の記
載の範囲内において各種の変形、変更が可能なことは当
業者には自明であろう。Although the embodiments of the present invention have been described above, it is obvious to those skilled in the art that the present invention is not limited to the embodiments and various modifications and changes can be made within the scope of the claims. There will be.
【００２７】[0027]
【発明の効果】以上説明したように、本発明に係る表面
搭載用積層電子部品の製造方法は、予め最下外装シート
層を熱加圧して密度を上げておき、その密度を上げた最
下外装シート層上に内部電極層を設けたシート層を複数
重層したシート積層体層及び最上外装シート層を重層し
て加熱圧着する工程を備えているから、絶縁不良や接続
不良等がなく、電気特性の安定を阻害する構造欠陥を少
なくし、歩留がよく均一な品質が維持確保でき、安価に
大量生産が可能となる効果がある。As described above, in the method of manufacturing a surface-mounted laminated electronic component according to the present invention, the lowermost exterior sheet layer is heated and pressurized in advance to increase the density. Since there is a step of laminating a sheet laminated body layer in which a plurality of sheet layers each having an internal electrode layer provided on an exterior sheet layer and an uppermost exterior sheet layer and performing thermocompression bonding, there is no insulation failure, connection failure, etc. There is an effect that the number of structural defects that hinder the stability of characteristics is reduced, the yield is good, uniform quality can be maintained and mass production can be performed at low cost.
【図１】本発明に係る表面搭載用積層電子部品の製造方
法の第１の実施の形態であって、主要な製造説明工程図
である。FIG. 1 is a first embodiment of a method for manufacturing a surface-mounted laminated electronic component according to the present invention, and is a main manufacturing explanatory process diagram.
【図２】本発明の第２の実施の形態であって、主要な製
造説明工程図である。FIG. 2 is a second embodiment of the present invention and is a main manufacturing explanatory process diagram.
【図３】第１及び第２の実施の形態におけるグリーンシ
ート積層体の部分断面及び部分拡大断面構造説明写真図
である。FIG. 3 is a partial cross-sectional and partially enlarged cross-sectional structural explanatory photograph of the green sheet laminate according to the first and second embodiments.
【図４】従来の表面搭載用積層電子部品の製造方法の主
要な製造説明工程図である。FIG. 4 is a main manufacturing explanatory process chart of a conventional method of manufacturing a surface-mounted laminated electronic component.
【図５】従来の場合のグリーンシート積層体の部分断面
及び部分拡大断面構造説明写真図である。FIG. 5 is a partial cross-sectional and partially enlarged cross-sectional structural explanatory photograph of a conventional green sheet laminate.
１ セットテーブル ２，２１ 最下外装グリーンシート層 ３ 吸引搬送板 ４，４１ 圧着テーブル ５ 内部電極層 ６ グリーンシート層 ７ グリーンシート積層体層 ８ 最上外装グリーンシート層 ９，９１ 圧着金型 １０ グリーンシート積層体 １１，１２ 内部電極層群 １３ グリーンシート層群 １４ 盛上り １５ 巣 Reference Signs List 1 set table 2, 21 lowermost exterior green sheet layer 3 suction transport plate 4, 41 pressure bonding table 5 internal electrode layer 6 green sheet layer 7 green sheet laminate layer 8 uppermost exterior green sheet layer 9, 91 pressure bonding mold 10 green sheet Laminates 11, 12 Internal electrode layer group 13 Green sheet layer group 14 Crest 15 nest
フロントページの続き (72)発明者 佐藤 孝司 秋田県由利郡仁賀保町平沢字前田151ティ ーディーケイ エムシーシー株式会社内 Ｆターム(参考） 4G055 AA08 AC09 BA22 BA42 5E001 AB03 AC00 AD00 AE00 AH01 AH05 AJ01 AJ02 5E082 AA01 AB03 BC32 EE03 EE11 EE23 EE35 FF05 FG06 FG26 FG46 FG54 GG10 JJ03 JJ15 JJ23 KK01 LL02 MM13 MM22Continuing on the front page (72) Inventor Koji Sato 151 T. Maeda, Hirasawa, Nikaho-cho, Yuri-gun, Akita FDC term in MCDC Corporation 4G055 AA08 AC09 BA22 BA42 5E001 AB03 AC00 AD00 AE00 AH01 AH05 AJ01 AJ02 5E082 AA01 AB03 BC32 EE03 EE11 EE23 EE35 FF05 FG06 FG26 FG46 FG54 GG10 JJ03 JJ15 JJ23 KK01 LL02 MM13 MM22
Claims (4)
けたシート層を複数重層してシート積層体層を形成する
工程と、 該シート積層体層上に最上外装シート層を重層形成した
後に、前記最下外装シート層と前記シート積層体層と前
記最上外装シート層とを加熱圧着する工程とを備えるこ
とを特徴とする表面搭載用積層電子部品の製造方法。1. A step of heat-pressing a lowermost exterior sheet layer, and forming a sheet laminate layer by stacking a plurality of sheet layers provided with an internal electrode layer on the hot-pressed lowermost exterior sheet layer. A step of, after forming an uppermost outer sheet layer on the sheet laminate layer, heating and pressing the lowermost outer sheet layer, the sheet laminate layer, and the uppermost outer sheet layer. The manufacturing method of the laminated electronic component for surface mounting.
体層を形成する工程と、 該シート積層体層上に最上外装シート層を重層形成した
後に、前記シート積層体層と前記最上外装シート層とを
加熱圧着して圧着体を形成する工程と、 前記熱加圧された最下外装シート層に前記圧着体を重層
して再加熱圧着する行程とを備えることを特徴とする表
面搭載用積層電子部品の製造方法。2. A step of heat-pressing the lowermost exterior sheet layer, a step of forming a sheet laminate layer by stacking a plurality of sheet layers provided with internal electrode layers, and an uppermost exterior sheet on the sheet laminate layer. After forming layers, a step of heat-pressing the sheet laminate layer and the uppermost outer sheet layer to form a press-bonded body, and laminating the press-pressed body on the hot-pressed lowermost outer sheet layer And a step of re-heating and pressure bonding.
ことを特徴とする請求項１又は２記載の表面搭載用積層
電子部品の製造方法。3. The method according to claim 1, wherein the sheet layer is a green sheet layer.
んで構成されている請求項３記載の表面搭載用積層電子
部品の製造方法。4. The method according to claim 3, wherein the green sheet layer includes a dielectric material.
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|---|---|---|---|
| JP2000383304A JP3740013B2 (en) | 2000-12-18 | 2000-12-18 | Manufacturing method of surface mount multilayer electronic components |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000383304A JP3740013B2 (en) | 2000-12-18 | 2000-12-18 | Manufacturing method of surface mount multilayer electronic components |
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| JP3740013B2 JP3740013B2 (en) | 2006-01-25 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009252783A (en) * | 2008-04-01 | 2009-10-29 | Murata Mfg Co Ltd | Production method of ceramic multilayer substrate, and method for adjusting amount of warpage of ceramic multilayer substrate |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009252783A (en) * | 2008-04-01 | 2009-10-29 | Murata Mfg Co Ltd | Production method of ceramic multilayer substrate, and method for adjusting amount of warpage of ceramic multilayer substrate |
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| JP3740013B2 (en) | 2006-01-25 |
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