JP2002183236A - System for automatically detecting overlapping of copper foil solid pattern - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a new system for automatically detecting the overlapping of copper foil solid patterns capable of automatically and quickly detecting the violation of overlapping constraint of the copper foil solid patterns in each layout layer of printed circuit board layout design composition of a plurality of layers. SOLUTION: An error file 133 defining the overlapping violation of the copper foil solid patterns is automatically outputted by using a detecting means 103 for detecting the violation of overlapping constraint of the copper foil solid patterns from the layout information 111 of a printed circuit board developed in a main storage device 110 and the information 112 of the overlapping constraint of a copper foil solid pattern.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an automatic copper foil solid pattern overlapping detection method, and more particularly, to an automatic copper foil solid pattern detecting method capable of automatically detecting an overlap constraint violation of a copper solid pattern in each layout layer in a printed circuit board layout design. Related to

More specifically, in the present invention, in FIG. 1, layout information of a printed circuit board developed in a memory (main storage device) 110 (information on a printed circuit board layout).
Using the detecting means (copper foil solid pattern overlap detecting means) 103 for detecting the copper foil solid pattern overlapping constraint violation from the overlapping constraint information (copper foil solid pattern overlapping constraint information) 112 with the copper foil solid pattern overlapping constraint 112, The present invention relates to a copper foil solid pattern overlapping automatic detection method which enables automatic output of a defined file (copper foil solid pattern overlapping error file) 133.

[0003]

2. Description of the Related Art Conventionally, in the manufacture of a printed circuit board having a plurality of layers, if copper foil solid patterns overlap at the same position, the total thickness of the copper foil becomes large.

[0004] In the press process of manufacturing printed circuit boards,
If the difference in thickness is large, the material of the printed circuit board is distorted and cracks occur in the layer. To avoid this layer cracking,
It is necessary to accurately detect the degree of overlap of copper foil solid patterns.

In order to repeatedly change the layout and review the overlap detection, it is necessary to perform a check quickly.

[0006]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned circumstances, and an object of the present invention is to provide a printed circuit board layout design comprising a plurality of layers, the copper foil solid pattern in each layout layer. It is an object of the present invention to provide a novel copper foil solid pattern automatic detection method capable of automatically and quickly detecting an overlap constraint violation.

[0007]

In order to achieve the above object, an automatic copper foil solid pattern overlapping detection method according to the present invention is applied to a printed circuit board developed in a main storage device in a layout design of a printed circuit board composed of a plurality of layers. And a copper foil solid pattern overlap constraint violation detecting means for detecting the copper foil solid pattern overlap constraint violation on the basis of the layout information and the copper foil solid pattern overlap constraint information.

The automatic copper foil solid pattern overlap detection method according to the present invention also includes a central processing unit that operates under program control and a printed circuit board layout diagram that defines printed circuit board layout information in the layout design of a printed circuit board composed of a plurality of layers. An external storage device that stores a file and a copper foil solid pattern overlap constraint value file defining copper foil solid pattern overlap constraint values and a copper foil solid pattern overlap error file that defines a copper foil solid pattern overlap violation, and printed circuit board layout information and copper A main storage device for performing information processing under the control of the foil solid pattern and information of the copper foil solid pattern overlapping error that is information that the overlap of the copper foil solid pattern is violated, and an input / output processing for input / output processing of each of the information. Output device and printed circuit board layout information A printed circuit board layout diagram input means for inputting the printed circuit board layout diagram file, and a copper foil solid pattern overlap constraint input means for input processing the copper solid pattern overlap constraint value file defining the copper solid pattern overlap constraint value, The copper foil solid pattern overlap detection means for detecting a copper foil solid pattern overlap constraint violation from the copper foil solid pattern overlap constraint value information, and the copper foil solid pattern overlap definition defining the copper foil solid pattern overlap violation as a result of detection by the copper foil solid pattern overlap detection means. And a means for outputting a copper foil solid pattern overlap detection result output as an error file.

The overlapping constraint value of the copper foil solid pattern can be arbitrarily specified.

The overlapping constraint value of the copper foil solid pattern is a constraint value of the size of the copper foil solid pattern.

The overlapping constraint value of the copper foil solid pattern is also a constraint value of the number of overlapping layers of the copper foil solid pattern.

The copper foil solid pattern overlap detecting means judges whether or not the side of the copper solid pattern of the layout layer to be inspected currently exceeds the overlap constraint length. As a result of the judgment, the copper foil solid pattern overlap within the overlap constraint length is determined. If so, the same determination as the above determination is performed for another copper foil solid pattern of the same layout layer or a copper foil solid pattern of another layout layer, and when the result of the determination is out of the range of the overlap constraint length, an error signal is output. Is output.

The copper foil solid pattern overlap detecting means also determines whether or not the copper foil solid pattern of the layout layer to be inspected currently overlaps the copper foil solid pattern of another layout layer. If the solid patterns do not overlap, the above determination is repeated for the copper foil solid patterns of the other layout layers. If both copper foil solid patterns overlap, as a result of the judgment, an overlap signal is detected and the overlap signal is counted. An error signal is output when the overlap count exceeds the overlap constraint number in the copper foil solid pattern overlap constraint value file.

[0014]

Next, a preferred embodiment of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a block diagram showing an embodiment according to the present invention.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Referring to FIG. 1, one embodiment of an automatic copper foil solid pattern overlapping detection system according to the present invention is as follows.
A computer (central processing unit) 100 operated by program control, and a file (printed circuit board layout diagram file) 1 defining printed circuit board layout information
Disk (external storage) storing a file (copper foil solid pattern overlapping constraint value file) 132 defining an overlapping constraint value 31 and a copper foil solid pattern overlapping file and a file (copper foil solid pattern overlapping error file) 133 defining a copper foil solid pattern overlapping violation Device) 130, printed circuit board layout information (printed circuit board layout diagram information) 111, copper foil solid pattern overlap constraint information (copper foil solid pattern overlap constraint information) 112, and copper foil solid pattern overlap information (copper) Foil solid pattern overlapping error information) 113
(Main storage device) 110 for performing information processing by program control, and their information 111, 112, 113
(Input / output device) 120 for input / output processing of the input and input means (printed circuit board layout drawing input means) 101 for inputting a file (printed board layout drawing file) 131 defining layout information of the printed circuit board
Input means (copper foil solid pattern overlap constraint value input means) 102 for inputting a file (copper foil solid pattern overlap constraint value file) 132 defining copper foil solid pattern overlap constraint values, and copper foil Detecting means (copper foil solid pattern overlapping detecting means) 103 for detecting solid pattern overlapping constraint violation, and a file (copper foil solid pattern overlapping error file) 133 which defines the copper foil solid pattern overlapping violation detection result of the copper foil solid pattern overlapping detecting means 103 Output means (copper foil solid pattern overlap detection result output means) 104.

[0017]

Next, the overall operation of this embodiment will be described in detail with reference to the flowcharts of FIGS.

First, in step A1 of FIG. 2, the main storage device (memory) 110
A file (printed circuit board layout diagram file) 131 defining printed circuit board layout information is read into the memory (main storage device) 110 by the MA.

Next, a file (copper foil solid pattern overlapping constraint value file) 132 defining copper foil solid pattern overlapping constraint values is read into the memory (main storage device) 110 (step A2 in FIG. 2).

Next, in step A3 of FIG. 2, the same processing is looped (repeated) for each layout layer of the printed circuit board.

Next, the processing is looped for the number of solid copper foil patterns existing in one layout layer (step A in FIG. 2).
4).

Next, in step A5, the copper foil solid pattern overlap detecting means 103 determines whether or not the side of the copper foil solid pattern exceeds the overlapping constraint length.

As a result of the determination in step A5, if the size of the copper foil solid pattern does not exceed the overlapping constraint value of the copper foil solid pattern, the process proceeds to the next copper foil solid pattern (ie, returns to step A4).

Next, the process is looped for the number of layout layers other than the layout layer to be inspected (step A6 in FIG. 2).

Next, in step A7, the copper foil solid pattern overlap detecting means 103 determines whether the copper solid pattern overlaps with the copper solid pattern of another layout layer.

If the result of the determination in step A7 is that the copper foil solid pattern does not overlap the copper foil solid pattern of another layout layer, the process proceeds to the next other layout layer.

Next, in step A8, the copper foil solid pattern overlap detecting means 103 determines whether or not the overlap count of the copper foil solid pattern exceeds the overlap restriction number.

If the result of determination in step A8 is that the number of overlapping copper foil solid patterns does not exceed the constraint value, the process proceeds to the next other layout layer.

Finally, as a result of the determination in step A8, if the number of overlapping copper foil solid patterns exceeds the constraint value (Yes)
), Copper foil solid pattern overlap detection result output means 10
4, the overlap constraint error information of the copper foil solid pattern is output as a file (copper foil solid pattern overlap error file) 133 in which a copper foil solid pattern overlap violation is defined (step A9 in FIG. 2).

Next, an embodiment of the present invention will be described using a specific example.

As shown in FIGS. 3, 4 and 5, when the size of the copper foil solid pattern B1 of the first layout layer is 25 mm or more (C1 in FIG. 4), which is the size restriction of the copper foil solid pattern. Check the overlapping of the copper foil solid patterns of the other layout layers in order. In this example, since the copper foil solid patterns of the second to fifth layout layers all overlap, the number of overlapping layers is five.

Since the number of overlapping layers of the copper foil solid pattern is five or more (C2 in FIG. 4), it is detected as an error and output as an error message (D1 in FIG. 5) to the copper foil solid pattern overlapping error file 133. Is done.

The overlapping constraint value of the copper foil solid pattern (C in FIG. 4)
1 and C2) can be arbitrarily specified.

[0034]

The present invention is constructed and operates as described above. Therefore, according to the present invention, the following effects can be obtained.

The first effect is that it is possible to accurately detect an overlap constraint violation of a copper foil solid pattern.

The reason is that the layout information of the printed circuit board can be accurately analyzed by the overlap detecting means of the copper foil solid pattern.

The second effect is that since the overlapping constraint value of the copper foil solid pattern can be arbitrarily specified, it is possible to flexibly cope with the manufacturing conditions such as the number of layers and the thickness of the printed circuit board.

The reason is that the overlapping constraint value of the copper foil solid pattern is set to (copper foil solid pattern overlapping constraint information input means) 102.
To allow external capture.

[Brief description of the drawings]

FIG. 1 is a block diagram showing an embodiment according to the present invention.

FIG. 2 is a flowchart (flow chart) for explaining the operation of the embodiment according to the present invention;

FIG. 3 is a perspective view showing overlapping copper foil solid patterns on a printed circuit board according to an embodiment of the present invention.

FIG. 4 is a diagram showing a copper foil solid pattern overlap constraint value file according to an embodiment of the present invention.

FIG. 5 is a diagram showing a copper foil solid pattern overlapping error file according to an embodiment of the present invention.

[Explanation of symbols]

 100 central processing unit 101 printed board layout diagram input means 102 copper foil solid pattern overlap constraint information input means 103 copper foil solid pattern overlap detection means 104 copper light solid pattern overlap detection result output means 110 main storage device 111 printed circuit board Layout diagram information 112 ... Copper foil solid pattern overlapping constraint information 113 ... Copper foil solid pattern overlapping error information 120 ... I / O device 130 ... External storage device 131 ... Printed circuit board layout drawing file 132 ... Copper foil solid pattern overlapping constraint value file 133 ... Copper foil solid pattern Overlap error file

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Katsuyuki Seino Inventor F-term (reference) in NEC Communication Systems Co., Ltd. 4-28 Mita, Minato-ku, Tokyo 5B046 AA08 BA04 JA02

Claims (7)

[Claims] In a layout design of a printed circuit board composed of a plurality of layers, a violation of the overlapping constraint of the copper foil solid pattern is determined based on the layout information of the printed circuit board developed in the main storage device and the information of the overlapping restriction of the copper foil solid pattern. An automatic copper foil solid pattern overlap detection method, comprising a copper foil solid pattern overlap constraint violation detecting means. 2. In a layout design of a printed circuit board composed of a plurality of layers, a central processing unit that operates under program control, a printed circuit board layout drawing file defining layout information of the printed circuit board, and an overlapping constraint value of a copper foil solid pattern are defined. An external storage device that stores the copper foil pattern overlap constraint value file and the copper foil pattern overlap error file that defines the copper foil pattern overlap violation, the layout information of the printed circuit board, the information of the copper foil pattern overlap constraint, and the copper foil pattern A main storage device that processes information on the copper foil solid pattern overlapping error information, which is information where the overlap is violated, under program control, an input / output device that performs input / output processing of the information, and layout information of a printed circuit board are defined. Input processing of the PCB layout drawing file A printed circuit board layout diagram input means, a copper foil solid pattern overlap constraint value input means for inputting a copper solid pattern overlap constraint value file defining copper foil solid pattern overlap constraint values, and copper from the copper foil solid pattern overlap constraint value information. Copper foil solid pattern overlap detection means for detecting a violation of the foil solid pattern overlap constraint, and copper foil solid pattern overlap detection for outputting a detection result by the copper foil solid pattern overlap detection means as the copper foil solid pattern overlap error file defining the copper foil solid pattern overlap violation A copper foil solid pattern overlapping automatic detection system comprising a result output means. 3. The automatic copper foil solid pattern overlapping detection method according to claim 1, wherein the overlap constraint value of the copper foil solid pattern can be arbitrarily specified. 4. The automatic copper foil solid pattern overlapping detection method according to claim 3, wherein the overlapping restriction value of the copper foil solid pattern is a restriction value of the size of the copper foil solid pattern. 5. The automatic copper foil solid pattern overlap detection method according to claim 3, wherein the copper foil solid pattern overlap constraint value is a constraint value of the number of overlapping layers of the copper foil solid pattern. 6. The copper foil solid pattern overlap detecting means,
It is determined whether or not the sides of the copper foil solid pattern of the layout layer currently being inspected exceed the overlap constraint length. If the result of the determination is within the range of the overlap constraint length, another copper foil solid pattern of the same layout layer is determined. 2. The method according to claim 1, further comprising: executing a determination similar to the determination for the copper foil solid pattern of another layout layer, and outputting an error signal when the determination result indicates that the pattern is outside the range of the overlap constraint length. Or the copper foil solid pattern overlap automatic detection system according to any one of the above items 2 and 3. 7. The copper foil solid pattern overlap detecting means,
It is determined whether or not the copper foil solid pattern of the layout layer currently being inspected overlaps with the copper foil solid pattern of the other layout layer. The above determination is repeated for the foil solid pattern, and when both the copper foil solid patterns overlap, the overlap signal is detected and the overlap signal is counted when the both copper foil solid patterns overlap, and the overlap count is set to the copper foil solid pattern overlap constraint. 3. The automatic copper foil solid pattern overlapping detection method according to claim 1, further comprising outputting an error signal when the number of overlapping constraints of the value file is exceeded.