JP2002177759A - Vacuum treatment device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a vacuum treatment device in which high-precision high- efficiency treatment can be carried out while the treatment work is simplified and done in a short time. SOLUTION: A cooling plate 13A is housed in housing space 8U by moving a chuck 7 grasping a work holder 8 from the first position T1 to the second position T2. After the chuck 7 releases the holder 8, a bellows 132 is drawn according to the pressure increase of a cooling medium to be introduced into the inside so that an opposite plate 131A is brought into contact with the internal wall surface 8H. Three actions of rotation, application of bias voltage and cooling are exerted on a work W attached to the holder 8 at the same time by using a cooling pipe 12A and the plate 13A.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vacuum processing apparatus for performing various processes such as film formation on an object to be processed (hereinafter, simply referred to as "work") such as a semiconductor wafer in a vacuum environment. About.

[0002]

2. Description of the Related Art In general, vacuum processing apparatuses having various structures and functions have been devised and used for performing various processes on a workpiece such as a semiconductor wafer in a vacuum environment. Here, the above-mentioned “various processes” include, for example, a film forming process for forming a thin film or the like on the surface of the work, an etching process for processing the work into a desired shape, and ion implantation into the work. Such as ion implantation.

FIGS. 18 and 19 show a configuration example of a conventional film forming apparatus 100 for performing a film forming process on a work, for example. FIG. 18 illustrates an external configuration of the film forming apparatus 100, and FIG. 19 illustrates an internal configuration of the film forming apparatus 100.

[0004] On one surface of the vacuum chamber 101, for example, a plurality of positions for emitting ions to perform a film forming process corresponding to a plurality of positions (processing positions A, B, C, D) on the same circumference. (For example, four) of ion sources 102 (102A, 10A)
2B, 102C, and 102D). Each of these ion sources can form a thin film made of a material different from each other, for example. An exhaust pipe 103 is provided on another surface of the vacuum chamber 101, and the exhaust pipe 103 is connected to a vacuum pump or the like. Vacuum chamber 10
1 can be opened and closed by a vacuum chamber door 104.

[0005] Inside the vacuum chamber 101, a carrier 106 having, for example, a long plate-like structure and being rotatable about a rotation shaft 105 (line P1) is provided. For example, a plurality of (for example, two) works W (W100, W200) are mounted on the carrier 106 so as to sandwich the rotation shaft 105. By rotating the carrier 106, the workpiece W moves along the line E1, and is located at one of a plurality of processing positions.
Note that FIG. 19 shows a case where the work W100 is located at the processing position A and the work W200 is located at the processing position C, for example.

In the film forming apparatus 100, for example, first,
After the work W100 is mounted on the carrier 106 by the operator, the vacuum pump is operated to remove the gas (for example, air) filled in the vacuum chamber 101 into the exhaust pipe 103.
And the inside of the vacuum chamber 101 is evacuated. Subsequently, the work W100 is moved to a predetermined processing position (for example, the processing position A) by rotating the carrier 106. Subsequently, the ion source 102 (for example, the ion source 102A) corresponding to the position of the work W100 (processing position A) is operated to perform a film forming process on the work W100. Thereby, a thin film is formed on the surface of the work W100.

[0007] If the apparatus configuration of the film forming apparatus 100 is used, an ion source for etching the work W into a desired shape is mounted instead of the ion source 102 for performing the film forming process. In addition to this, it is possible to construct an etching apparatus, and it is also possible to construct an ion implantation apparatus by mounting an ion source for implanting ions into the work W.

[0008]

By the way, for example, in order to perform the film forming process on the work W with high accuracy and high efficiency, the inside of the vacuum chamber 101 is evacuated and the work W is formed during the film forming process. On the other hand, it is necessary to set the following processing conditions. (1) The work W is rotated in order to suppress film formation unevenness (thickness unevenness). (2) A bias voltage (for example, a negative DC voltage) is applied to the work W in order to efficiently guide the ions emitted from the ion source 102 to the work W. (3) The work W is cooled in order to suppress the temperature rise of the work W.

However, the conventional film forming apparatus 100
It has only a function of setting some processing conditions among the above (1) to (3). That is, for example, although a function of applying a bias voltage to the work W is provided,
For example, those not having the function of cooling or rotating the work W are provided. This is because, generally, when all the functions (1) to (3) are to be provided in a single film forming apparatus 100, the apparatus configuration and the operation mechanism of the film forming apparatus 100 become complicated, and the film forming apparatus 100 is formed. This is because it was considered that the manufacturing cost of the device 100 would increase. For this reason, conventionally, (1)
In order to set all the processing conditions of (1) to (3), for example, a plurality of film forming apparatuses each having the functions of (1) to (3) must be used separately, which makes the film forming operation complicated. There is a problem that it becomes longer and longer.

[0010] Such a problem occurs in the film forming apparatus 100.
Not only in the case of the above, but also in the case of the above-described etching apparatus or ion implantation apparatus, the same occurs.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a vacuum processing apparatus capable of performing highly accurate and highly efficient processing while simplifying and shortening the processing operation. It is in.

[0012]

A vacuum processing apparatus according to the present invention is provided with a plurality of processing units corresponding to a plurality of processing positions on the same circumference of a vacuum chamber. A moving shaft that is provided and is movable in the longitudinal direction, a carrier member that is rotatable about the moving shaft, and a rotating member that is provided corresponding to a plurality of processing positions and rotates and applies a bias voltage to the object to be processed. And an operation member for performing at least one operation of temperature adjustment, and an object to be processed, which can be moved to any one of a plurality of processing positions by rotation of the carrier member, and A holding member movable from a first position farther from the action member to a second position closer to the action member by movement, and a detachable member connected to the carrier member and capable of detaching the holding member. is there.

In the vacuum processing apparatus according to the present invention, first, in a state where the holding member is gripped by the detachable member, the carrier held by the holding member is rotated by the carrier member rotating about the rotation axis, so that the object to be processed held by the holding member is vacuum chamber. Is moved to any one of a plurality of processing positions on the same circumference. Subsequently, as the moving shaft moves in the longitudinal direction, the detachable member gripping the holding member moves from the first position farther from the operation member to the second position closer to the action member.
Subsequently, when the attaching / detaching member releases the holding member, it becomes possible to perform at least one of the rotation, the application of the bias voltage, and the temperature adjustment from the operation member to the object.

[0014]

Embodiments of the present invention will be described below in detail with reference to the drawings.

FIGS. 1 to 3 show a schematic configuration of a film forming apparatus 10 as a "vacuum processing apparatus" according to an embodiment of the present invention. FIG. 1 shows an external configuration of a film forming apparatus 10 and FIG.
3 and FIG. 3 show the internal configuration of the film forming apparatus 10, respectively. For convenience of explanation, in FIG. 2, the side of the vacuum chamber 1 where the ion source 2 is provided is partially omitted,
3, the carrier 6 and the like are further omitted from the state shown in FIG. In the following description, in particular, the side of the vacuum chamber 1 where the ion source 2 is provided is referred to as “front (or front)”, and the opposite side is referred to as “rear (or rear)”. Shall be.

The vacuum chamber 1 is made of, for example, a metal such as iron, aluminum, and stainless steel, and has a rectangular parallelepiped structure (see FIG. 1). This vacuum chamber 1 is, for example,
It can be opened and closed by a vacuum chamber door 4. On the front surface of the vacuum chamber 1, for example, a plurality of (for example, four) ion sources 2 (2A, 2B, 2C, 2D) for ionizing a cathode material and releasing generated ions to perform a film forming process. )
Are arranged. Each ion source 2 has a plurality of (for example, four) processing positions (processing positions A,
B, C, D), for example, so that thin films made of different materials can be formed. An exhaust pipe 3 is provided on the lower surface of the vacuum chamber 1, and the exhaust pipe 3 is connected to a pressure reducing device 66 (see FIG. 14) described later. Here, the ion source 2 corresponds to a specific example of the “processing unit” in the present invention.

A rotary shaft 5 is introduced into the vacuum chamber 1 through the vacuum chamber 1 (see FIG. 2). This rotating shaft 5
Of these, an inner end of the vacuum chamber 1 is connected to one end of a carrier 6 having, for example, a long plate-like structure, while an outer end is connected to a driving device A62 described later (see FIG. 14). ) And connected. By the driving device A62, the rotating shaft 5 is moved in the longitudinal direction along the line P2 (the direction of the arrow Y1 in the drawing)
, And the carrier 6 is rotated by the rotation shaft 5 (line P
It is rotatable around 2). The rotating shaft 5 and the carrier 6 are formed of a metal such as iron, aluminum, and stainless steel. Here, the rotating shaft 5 corresponds to a specific example of “moving shaft” in the present invention.

A chuck 7 is connected to one end of the carrier 6 opposite to one end connected to the rotating shaft 5, and a work holder 8 is held by the chuck 7. The chuck 7 has a mechanism that allows the work holder 8 to be attached to and detached from (attached to and detached from) the cooling plate 13 (see FIG. 3) described later. For example, a metal such as stainless steel, iron, aluminum, or copper is used. Is formed.
The work holder 8 is provided with a work W (not shown in FIG.
), And is made of, for example, a metal such as iron or stainless steel. The structure of the chuck 7 and the work holder 8 and the mechanism for attaching and detaching the work holder 8 to and from the cooling plate 13 by the chuck 7 will be described later. Here, the chuck 7 corresponds to a specific example of the “detachable member” in the present invention, and the work holder 8 corresponds to a specific example of the “holding member” in the present invention.

A plurality of (for example, four) introduction ports 11 are provided on the rear surface of the vacuum chamber 1 corresponding to the respective processing positions. For example, four cooling pipes 12 (12A, 12B,
12C, 12D) are introduced (see FIG. 3). Among the cooling pipes 12 (12A to 12D), the ends on the inner side of the vacuum chamber 1 are cooling plates 13 (13A, 13B, 13C, 13C).
D). The cooling plate 13 is adapted to rotate, apply a bias voltage, and adjust the temperature of the work W (see FIG. 4) mounted on the work holder 8 by coming into contact with the work holder 8. The structure of the cooling plate 13 will be described later. The centers of the cooling pipe 12 and the cooling plate 13 coincide with each other. On the other hand, an end of the cooling pipe 12 on the outer side of the vacuum chamber 1 is connected to a driving device B63, a bias voltage applying device 64, and a temperature adjusting device 65 (see FIG. 14) described later. The cooling plate 13 is rotatable around the cooling pipe 12 by the driving device B63. The cooling pipe 12 and the cooling plate 13 are formed of, for example, a metal such as iron, copper, aluminum, and stainless steel. In addition, introduction port 11
Among them, an insulating sealing material for sealing the gap and electrically isolating the cooling pipe 12 from the vacuum chamber 1 is embedded in a gap around the cooling pipe 12. Here, the cooling plate 13 is an “acting member” in the present invention.
Corresponds to one specific example.

Next, the detailed structure of the chuck 7, the work holder 8, and the cooling plate 13A will be described with reference to FIGS. FIG. 4 shows the chuck 7, the work holder 8,
It shows a sectional configuration of the cooling plate 13A and the like. In FIG. 4, for convenience of explanation, the chuck 7, the work holder 8,
This shows a state where the cooling plates 13A and the like are separated from each other. The cooling plates 13B to 14D have the same structure as the cooling plate 13A, for example.

The chuck 7 has, for example, a disk-shaped support plate 71 connected to one end of the carrier 6 and a plurality of (for example, 4) disposed near the end of the surface of the support plate 71 opposite to the carrier 6. ), And a plurality (for example, four) of chuck parts 73 (73) fitted into the rail 72.
A, 73B, 73C, 73D). The four rails 72 are radially arranged, for example, such that the angle between the longitudinal directions of the two adjacent rails 72 is substantially 90 °. Each chuck part 73A ~
73D is a rail 7 extending away from or near the center (line P3) of the support plate 71 (in the direction of arrow Y2 in the figure).
2 can be slid. In the following description, in particular, each of the chuck parts 73A to 73D
The operation of sliding away from the center (line P3) of 1 is referred to as “chuck 7 opens”, while the operation of sliding in the approaching direction is referred to as “chuck 7 closes”. When the chuck 7 is moved to the side approaching the work holder 8, the work holder 8 can be “grabbed” by closing the chuck 7, while the work holder 8 is “released” by opening the chuck 7. It has become possible.

The work holder 8 has, for example, one of a pair of opposing surfaces (the surface closer to the cooling plate 13A) opened, and the other surface (the chuck 7) on which the work W can be mounted.
Has a closed cylindrical structure. A storage space 8U for storing the cooling plate 13A is formed inside the work holder 8. In the work holder 8, at positions corresponding to the chuck parts 73 (73 </ b> A to 73 </ b> D), for example, a plurality of (for example, four) openings 8 </ b> K having a rectangular opening shape are provided. In the opening 8K, a holder claw 82 rotatable around the holder claw rotation shaft 81 in the direction of arrow Y3 in the figure is provided. The holder claw 82 has, for example, a crank-like structure, and has one end (claw portion 82T) bent toward the storage space 8U and the other end (head 82M) bent toward the opposite side to the storage space 8U. It is comprised including. The head 82M of the holder nail 82 is the chuck part 73
In the state where it is not pressed by (73A to 73D),
For example, due to the elastic force of an elastic member (not shown) (for example, a spring or the like), the claw portion 82T of the holder claw 82 moves the storage space 8U.
It is designed to protrude.

The work W is formed of, for example, a metal, a semiconductor, an insulating material, or the like, and has a disk-like, rectangular parallelepiped, cubic, or other structure. With the chuck 7 gripping the work holder 8, the work W mounted on the work holder 8 moves along the line E2 as the carrier 6 rotates, and any one of the plurality of processing positions is processed. (See FIG. 2).

The cooling plate 13A includes, for example, a pair of opposed disk-like opposed plates 131 (131A, 131B) and a bellows 132 disposed between the opposed plates 131A, 131B. A hollow area is formed inside the cooling plate 13A and the cooling pipe 12A. For example, a cooling medium B is introduced into the hollow area. The bellows 132 is capable of expanding and contracting according to a change in pressure of the cooling medium B. That is, the extension of the bellows 132 causes the opposing plate 131A to move away from the opposing plate 131B, while the contraction of the bellows 132 allows the opposing plate 131A to move toward the opposing plate 131B.

Next, a mechanism for attaching and detaching the work holder 8 to and from the cooling plate 13 by the chuck 7 will be described with reference to FIGS. In the following, the processing position A
The case where the work holder 8 located at the position (1) is mounted on the cooling plate 13A will be described. FIGS. 5 to 13 illustrate a mechanism for attaching / detaching the work holder 8 to / from the cooling plate 13A by the chuck 7, and FIGS. 5, 7, 9 and 11, and FIG.
2 is an enlarged view of the internal configuration of the film forming apparatus 10 when the work holder 8 is mounted on the cooling plate 13A, and FIGS. 6, 8, 10, and 13 are FIGS. 5, 7, 9, 9, and 11, respectively. 13 illustrates a cross-sectional configuration corresponding to FIG.

In the state before the film forming process, as shown in FIGS. 5 and 6, the work holder 8 on which the work W is mounted is mounted.
Are separated from the cooling plate 13A in a state where they are gripped by the chuck 7, for example. In this state, the chuck 7 is closed, and is located at the first position T1 away from the cooling plate 13A. Chuck 7 is work holder 8
In this state, the head 82M of the holder claw 82 is pressed by the chuck part 73, and the holder claw 82 is rotated about the holder claw rotation shaft 81 in the direction of arrow Y3 in the drawing, so that the claw portion 82T is stored in the storage space 8U. Have been evacuated. In this state, the carrier 6 is freely rotatable.

When the work holder 8 is mounted on the cooling plate 13A, first, as shown in FIGS. 7 and 8, the rotating shaft 5 is moved along the line P2 in the longitudinal direction (the direction of arrow Y1 in the drawing). Go to As a result, the chuck 7 holding the work holder 8 moves to the second position T2 on the side closer to the cooling plate 13A, and the cooling plate 13 is stored in the storage space 8U of the work holder 8.
A is stored. At this time, for example, the opposite plate 131A of the cooling plate 13A is attached to the work holder 8 in the storage space 8U.
Is not in contact with the inner wall surface 8H. In this state, the carrier 6 cannot rotate.

Subsequently, as shown in FIGS. 9 and 10, the chuck 7 is opened, that is, the chuck part 73 is opened.
(73A, 73B, 73C, 73D) are arrows Y2 in the figure.
By sliding along the rail 72 in the direction of
The work holder 8 is released from the chuck 7. At this time,
From the state of being pressed by the chuck part 73, the holder claw 82
Is released, the holder claw 82 rotates about the holder claw rotation shaft 8 in the direction of arrow Y3 in the figure. As a result, the head 82M of the holder claw 82 protrudes outside the opening 8K, and the claw 82T protrudes inside (the storage space 8U side) from the opening 8K.
A wraps around the opposite plate 131B at A.

Subsequently, as shown in FIG.
/ Cm ^{2 at} a pressure of cooling medium B (FIG. 4).
Is circulated inside the cooling pipe 12A and the cooling plate 13A, so that the bellows 132 extends in accordance with an increase in the pressure of the cooling medium B. Thereby, the opposing plate 131
A moves to the side approaching the work holder 8, and the inner wall surface 8H of the work holder 8 and the opposing plate 131A come into contact. Since the bellows 132 extends in a state where the claw portion 82T of the holder claw 82 goes around behind the opposing plate 131B,
The cooling plate 13 </ b> A and the inner wall surface 8 </ b> H of the work holder 8 come into close contact with each other according to the pressure of the cooling medium B. Thus, the attachment of the work holder 8 to the cooling plate 13A by the chuck 7 is completed. It is preferable that the surfaces of the cooling plate 13A and the inner wall surface 8H be flat in order to bring the cooling plate 13A and the inner wall surface 8H into close contact with each other.

After the mounting of the work holder 8 is completed, as shown in FIGS. 12 and 13, the rotating shaft 5 moves along the line P2 in the direction of the arrow Y1 in the figure. This allows
The carrier 6 can freely rotate again. Thereafter, the carrier 6 is rotated, and the chuck 7 is moved to an arbitrary processing position (for example, the processing position B) other than the processing position A, so that the ion source 2 is ready for film formation.

The removal of the work holder 8 from the cooling plate 13A by the chuck 7 can be executed by reversing the above-described series of mounting operations of the work holder 8.

FIG. 14 shows an example of a block configuration of the film forming apparatus 10. FIG. 14 shows a series of components that operate in response to an instruction signal output from the control device 61. The film forming apparatus 10 is, for example, a film forming apparatus 10
A control device 61 for controlling the whole system, a drive device A62 for moving and rotating the rotary shaft 5, a drive device B63 for rotating the cooling plate 13, and a bias voltage for applying a bias voltage to the cooling plate 13. Bias voltage applying device 64
A temperature adjusting device 65 for cooling the cooling plate 13;
A pressure reducing device 66 for reducing the pressure inside the vacuum chamber 1. The operating states of the ion source 2 and the chuck 7 are also controlled by the control device 61. Here, the driving device A62 and the driving device B63 correspond to a specific example of “driving means” in the present invention.

The control device 61 includes, for example, a CPU (Central Processing Unit) and outputs an instruction signal mainly to the above-mentioned series of components. It controls the operation state of each component device. The content of the instruction signal output from the control device 61 to each component device corresponds to, for example, a film forming condition input by an operator or the like via an input device such as a keyboard. The film forming conditions include, for example, the movement and rotation conditions (movement speed, movement direction, rotation speed, rotation direction, etc.) of the rotating shaft 5 by the driving device A62, and the rotation conditions (rotation speed, rotation speed, etc.) of the cooling plate 13 by the driving device B63. Rotation direction, etc.), bias voltage application conditions (selection of DC or AC, bias voltage value, etc.) by the bias voltage application device 64, cooling conditions (cooling temperature, etc.) of the cooling plate 13 by the temperature adjustment device 65, and pressure reduction devices 66 The conditions include reduced pressure inside the vacuum chamber 1.

The driving device A62 includes, for example, a motor and the like, and moves and rotates the carrier 6 via the rotating shaft 5. Drive B63
Is for rotating the cooling plate 13, for example. The bias voltage applying device 64 includes, for example, a power supply device, and applies a DC or AC bias voltage to the cooling plate 13 and the like. The temperature adjusting device 65 cools the cooling plate 13 by circulating a cooling medium B (see FIG. 4) sealed inside the cooling plate 13 and the like, for example. The pressure reducing device 66 includes, for example, a vacuum pump and the like, and reduces the pressure inside the vacuum chamber 1 until a predetermined pressure is reached.

Next, the operation of the film forming apparatus 10 will be described with reference to FIGS. In the following, for example, a case will be described in which a workpiece W1 located at an arbitrary processing position other than the processing position A is moved to the processing position A, and a film forming process is performed on the workpiece W by the ion source 2A.

Before performing the film forming process, an operator or the like
The following preparation work is performed. That is, first, after the work W is washed, the vacuum chamber door 4 is opened, and the work W is mounted on the work holder 8. Subsequently, after the vacuum chamber door 4 is closed and the sealed state of the vacuum chamber 1 is confirmed,
A series of film forming conditions (selection of ion source 2 to be used (for example, ion source 2A), moving condition, rotation condition, bias voltage applying condition, cooling condition, depressurizing condition, etc.) are input via an input device such as a keyboard. You.

In a state before performing the film forming process (see FIGS. 5 and 6), the chuck 7 is closed and the cooling plate 1 is closed.
The work holder 8 on which the work W is mounted is located at the first position T1 distant from 3A, and is held by the chuck 7. In a state in which the chuck 7 grips the work holder 8, the holder claws 82 (the head 8
2M) is pressed, and the claw portion 82T is retracted from the storage space 8U of the work holder 8. In this state, the carrier 6 can freely rotate about the rotation shaft 5.

In the film forming apparatus 10, after the above-described preparation work is completed, first, the pressure reducing device 66 is operated to exhaust gas (for example, air) filling the inside of the vacuum chamber 1 through the exhaust pipe 3. (See FIGS. 1-3). Due to this evacuation process, the inside of the vacuum chamber 1 is kept in a predetermined pressure state (for example, about 1
(Pa or less), and a vacuum state is obtained.
The vacuum state inside the vacuum chamber 1 is maintained during the film forming process. Subsequently, the drive device A62 is operated to rotate the carrier 6 about the rotation axis 5 (line P2), thereby moving the work W mounted on the work holder 8 to the processing position A.

Subsequently, the drive device A62 is operated to move the rotary shaft 5 along the line P2 in the direction of the arrow Y1 in the drawing, so that the chuck 7 holding the work holder 8 is moved along the line P3. It is moved from the first position T1 to the side closer to the cooling plate 13A (second position T2) (see FIGS. 7 and 8). Thereby, the cooling plate 13A is stored in the storage space 8U of the work holder 8 so that the opposed plate 131A of the cooling plate 13A does not contact the inner wall surface 8H of the work holder 8 in the storage space 8U. In this state, the carrier 6 cannot rotate.

Subsequently, the chuck parts 73 (73A to 73A)
3D) is slid along the rail 72 in the direction of arrow Y2 in the figure to open the chuck 7 (FIGS. 9 and 1).
0), and release the work holder 8 from the chuck 7. When the chuck 7 releases the work holder 8, the holder claw 82 is released from the pressing state by the chuck part 73, and the holder claw 82 rotates around the holder claw rotation shaft 81 in the direction of the arrow Y <b> 3 in the drawing. As a result, the head 82M of the holder claw 82 projects outward from the opening 8K, and the claw 82T projects inside (storage space 8U) from the opening 8K.
Wrap around behind B

Subsequently, the temperature control device 65 is operated, and the cooling medium B is kept under a pressure of several kgf / cm ^2.
(See FIG. 4) is circulated inside the cooling pipe 12A and the cooling plate 13A (see FIG. 11). When the bellows 132 extends in response to the increase in the pressure of the cooling medium B, the opposing plate 131A of the cooling plate 13A moves toward the work holder 8, and the opposing plate 131A comes into contact with the inner wall surface 8H.
The bellows 132 extends in a region between the inner wall surface 8H of the work holder 8 and the claw portion 82T of the holder claw 82, so that the surface of the cooling plate 13A and the inner wall surface 8H are pressed by the pressure of the cooling medium B (the opposing plate Pressing strongly against the inner wall surface 8H). Thereby, the kinetic energy is transmitted from the cooling plate 13A to the work holder 8 by using the frictional force at the contact surface between the two, and the thermal energy (here, the cooling action) is transmitted through the contact surface between the two.
And electric energy (here, bias voltage) can be transmitted. By circulating the cooling medium B, the cooling pipe 12A and the cooling plate 13A (hereinafter simply referred to as “the cooling plate 13
A) is cooled, and the work W mounted on the work holder 8 is cooled. Thus, the attachment of the work holder 8 to the cooling plate 13A by the chuck 7 is completed.

Subsequently, the chuck 7 is moved from the second position T2 to the first position T1 by operating the driving device A62 and moving the rotary shaft 5 along the line P2 in the direction of the arrow Y1 in the figure. It is moved (see FIGS. 12 and 13). In this state, the carrier 6 can rotate again. Subsequently, the drive unit A62 is operated to rotate the carrier 6 about the rotation axis 5 (line P2), thereby moving the work holder 8 to an arbitrary processing position other than the processing position A (for example, the processing position B). . As a result, the film is ready for film formation by the ion source 2 (2A).

Subsequently, the bias voltage is applied to the work W by operating the bias voltage applying device 64 and applying a bias voltage (eg, a negative DC voltage) to the cooling plate 13A and the like. Subsequently, the drive device B63 is operated, and the work W is similarly rotated by rotating the cooling plate 13A and the like about the line P3. continue,
In a state where three processing conditions of cooling, application of a bias voltage, and rotation of the work W are set, the ion source 2A is operated to perform a film forming process on the work W. Thereby, ions are released from the ion source 2A to the work W, and a thin film is formed on the surface of the work W. During the film forming process, the temperature rise of the work W is suppressed by cooling the work W, and the damage of the work W in an excessively heated state is avoided. Further, by applying a negative DC bias voltage to the work W,
The ions emitted from the ion source 2A are efficiently guided to the surface of the work W, and the film forming efficiency is improved. further,
The rotation of the work W suppresses the unevenness of the film formation and makes the formed thickness of the thin film uniform.

After the completion of the film forming process, the pressure reducing device 66 is operated, and the gas containing ions filled in the vacuum chamber 1 is exhausted through the exhaust port 3. The work W1 on which the thin film is formed is removed from the work holder 8 by an operator or the like in a state where the pressure inside the vacuum chamber 1 is substantially equal to the external pressure.

In the film forming apparatus 10, not only the three processing conditions of cooling, bias voltage application, and rotation are set simultaneously for the work W, but also, for example, only some of the three processing conditions. It is also possible to set (for example, cooling and rotation of the work W). In addition to forming a thin film made of a single material on the surface of the work W using one ion source 2 (for example, ion source 2A), for example, two or more ion sources 2 (for example, ion sources 2A and 2B, etc.) ), A thin film made of two or more different materials can be formed on the surface of the work W. In such a case, after performing the mounting operation of the work holder 8 on the cooling plate 13A by the chuck 7 described above, an operation (demounting operation) that reverses the series of mounting operations is performed, and a plurality of works W are formed. Then, the film formation process is sequentially performed at each processing position by moving to the processing position. Of course, one ion source 2 (for example, ion source 2A) at one processing position (for example, processing position A)
Can be repeated to increase the thickness of the thin film made of a single material.

The operation mechanism of the cooling pipe 12A, the cooling plate 13A, the ion source 2A, and the like includes other cooling pipes (12B to 12D) and other cooling plates (13B to 1B).
The same applies to 3D) and other ion sources (2B to 2D).

As described above, according to the film forming apparatus 10 of the present embodiment, since the apparatus configuration and the operating mechanism as described above are provided, the rotation of the work W, the work W
, And the three processing conditions of cooling the work W can be simultaneously set in one film forming apparatus 10, and the film forming processing can be performed with high accuracy and high efficiency. In addition, since the apparatus configuration and operation mechanism of the film forming apparatus 10 are relatively simple, the manufacturing cost of the film forming apparatus 10 is relatively low. Therefore,
Unlike the conventional case where a plurality of film forming apparatuses had to be used to set the above three processing conditions,
By using the film forming apparatus 10, the film forming process can be simplified and shortened.

In the present embodiment, the chuck 7 and the work holder 8 are separated from each other during the film forming process, so that they are electrically separated from each other. It is possible to ensure the safety of an operator or the like during the film forming process. That is, the conventional film forming apparatus 100
When performing a film forming process using (see FIGS. 18 and 19), the work W, the carrier 106, the rotating shaft 105, and the vacuum chamber 101 are in an electrically conductive state, and a bias voltage is applied to the work W. When the voltage is applied, the influence of the voltage application at this time may reach the vacuum chamber 101. In such a case, there is a danger that the vacuum chamber 101 will be charged and the operator will receive an electric shock. On the other hand, in the present embodiment, the cooling pipe 1
When the chuck 7 and the work holder 8 are separated from each other in a state where the vacuum chamber 1 and the vacuum chamber 1 are electrically separated by the insulating sealing material, the cooling plate 13 serving as a bias voltage application source is separated.
A and the like do not come into contact with a portion such as the carrier 6 where voltage application is not required, and the influence of voltage application to the work W does not reach the vacuum chamber 1. Therefore, the vacuum chamber 1 is not charged when the bias voltage is applied.

Further, in the present embodiment, the work W is selectively cooled by bringing the cooling plate 13A into contact with the work holder 9, and therefore, the consumption required for cooling the work W for the following reasons. Electric power can be reduced. That is, when the work W is cooled in the conventional film forming apparatus 100, for example, the entire inside of the vacuum chamber 101 must be cooled, so that the power consumption required for cooling the work W increases. On the other hand, in the present embodiment, only a small amount of power consumption for selectively cooling the cooling plate 13A and the like is required.

Further, in the present embodiment, a series of processing conditions (rotation, bias voltage application, cooling) are set in one film forming apparatus 10, and the work W is damaged for the following reasons. Can also be avoided.
That is, in the conventional case where a plurality of film forming apparatuses are used to set a series of processing conditions, one film forming apparatus (for example, one having only a cooling function) is replaced with another film forming apparatus (for example, only a rotating function is used) Each time the workpiece W is transferred to the workpiece W, the workpiece W is exposed to a large pressure change between the vacuum state and the atmospheric pressure state. In such a case, the work W may be damaged due to a large pressure change. In contrast, in the present embodiment, since a series of processing conditions are set in one vacuum environment, the workpiece W may be exposed to a large pressure change except at the start and end of the film forming process. Absent. Of course, damage to the thin film formed on the surface of the work W is also avoided.

The structure of the chuck 7 in the present embodiment is not necessarily limited to the above-described structure. The structure of the chuck 7 is not limited as long as the work holder 8 can be attached to and detached from the cooling plate 13A. It can be changed freely.

Further, in the present embodiment, the film forming apparatus 10 provided with the cooling pipe 12 and the cooling plate 13 for cooling the work W has been described, but the present invention is not limited to this. For example, a heating pipe and a heating plate capable of heating the work W may be provided instead of the cooling pipe 12 and the cooling plate 13. Of course, both the heating function and the cooling function may be provided.

In the present embodiment, the work W is mounted by opening and closing the vacuum chamber door 4, but the present invention is not limited to this. FIGS. 15, 16, and 17 show a configuration of a film forming apparatus 90 as a modification of the film forming apparatus 10 of the present embodiment.
These correspond to FIGS. 1, 12, and 13, respectively.

The film forming apparatus 90 includes, for example, the film forming apparatus 1
At a position where the ion source 2A is disposed at 0 (see FIG. 1), an exchange jig 91 having an exchange chamber 92 therein is provided instead of the ion source 2A. Exchange room 92
Communicates with the inside of the vacuum chamber 1 through the processing hole 30. The exchange jig 91 is provided with an exchange lid 93 that can be opened and closed. When the exchange lid 93 is closed, the exchange chamber 9 is closed.
2 can be sealed. The film forming process is performed with the exchange lid 93 closed. The ion source 2A and the exchange jig 91 can be exchanged, for example, as needed.

In place of the replacement jig 91 (processing position A), instead of the cooling pipe 12A and the cooling plate 13A,
Cooling pipe 22A having the same structure as a general-purpose introduction terminal
And a cooling plate 23A (hereinafter simply referred to as “cooling plate 23A or the like”). The cooling plate 23A and the like can be moved by the driving device B63 in the direction of arrow Y4 in the figure along the line P3. The other structure and operation mechanism of the cooling plate 23A are the same as, for example, the cooling plate 13A and the like in the above embodiment.

In the film forming apparatus 90, the work W after the film forming process is located at the processing position A (see FIGS. 12 and 13).
When taking out from the inside of the vacuum chamber 1, for example, first,
By operating the driving device B63 and moving the cooling plate 13A from the third position T3 (see FIG. 13) farther from the exchange jig 91 to a fourth position (see FIG. 17) closer thereto, the work holder The work W mounted on the work 8
Guide to. At this time, a packing sheet 94 made of a rubber material such as Viton is provided in a region sandwiched between the work holder 8 and the inner wall surface of the vacuum chamber 1, and the work holder 8 is brought into close contact with the packing sheet 94. Thereby, the inside of the vacuum chamber 1 and the exchange chamber 92 are separated from each other. The packing sheet 94 has, for example, a ring shape and is attached to the inner wall surface of the vacuum chamber 1. Due to the presence of the packing sheet 94, the pressure state inside the vacuum chamber 1 does not change even when the replacement lid 93 is opened, and the work W can be taken out while maintaining the vacuum state inside the vacuum chamber 1. In such a case, after replacing the inside of the vacuum chamber 1 from the vacuum state to the atmospheric pressure state, the work of replacing the work W is simplified as compared with the case where the vacuum chamber door 4 is opened and the work W1 is taken out. And the time required for the replacement operation can be reduced. Here, the cooling plate 23A corresponds to a specific example of the “moving member” in the present invention, and the packing sheet 94 corresponds to a specific example of the “airtight member” in the present invention.

Although the case where the exchange jig 91 is provided in place of the ion source 2A has been described above, the present invention is not limited to this.
The location and number of replacement jigs 91 can be freely changed. Other configurations, operations, functions, effects, and the like of the film forming apparatus 90 are the same as those of the film forming apparatus 10 in the above embodiment.

As described above, the present invention has been described with reference to the embodiments. However, the present invention is not limited to the above embodiments, and various modifications are possible. For example, in the above-described embodiment, the ion source 2 for performing the film forming process is provided as a processing unit for the work W. However, the present invention is not limited to this. An ion source for performing an etching process and an ion source for implanting ions into the work W may be provided. Of course, two or more processing units having different processing functions (for example, an ion source for performing a film formation process and an etching source for performing an etching process) may be provided in parallel. In such a case, the same effect as in the above embodiment can be obtained.

[0059]

As described above, according to the vacuum processing apparatus of any one of claims 1 to 9,
An operation member for performing at least one of rotation, application of a bias voltage, and temperature adjustment to the object held by the holding member is provided, so that rotation of the object and bias to the object are performed. The three processing conditions of voltage application and cooling of the object to be processed can be simultaneously set in one vacuum processing apparatus, and the processing of the object to be processed can be performed with high accuracy and high efficiency. Moreover, since the device configuration and operation mechanism of this vacuum processing apparatus are relatively simple, the manufacturing cost of the vacuum processing apparatus is relatively low. Therefore, unlike the conventional case in which a plurality of vacuum processing apparatuses must be used to set the above three processing conditions, the use of this vacuum processing apparatus simplifies the film forming process and shortens the film forming process. Can be interspersed.

In particular, according to the vacuum processing apparatus of the sixth aspect, further, there is provided an exchange jig having an exchange chamber communicating with the inside of the vacuum chamber, and an exchange jig farther from the exchange jig and closer to the third position. Since the moving member movable between the fourth position and the airtight member separating the inside of the vacuum chamber from the exchange chamber is provided, the object to be processed is maintained while maintaining the pressure state inside the vacuum chamber. Can be replaced. Therefore, it is possible to simplify the replacement of the object to be processed and to shorten the time required for the replacement operation.

[Brief description of the drawings]

FIG. 1 is a perspective view illustrating an appearance of a film forming apparatus according to an embodiment of the present invention.

FIG. 2 is a perspective view illustrating an internal configuration of the film forming apparatus illustrated in FIG.

FIG. 3 is a perspective view illustrating an internal configuration of the film forming apparatus illustrated in FIG.

FIG. 4 is a cross-sectional view illustrating a cross-sectional configuration of a carrier, a work holder, a cooling plate, and the like.

FIG. 5 is a perspective view for explaining a mechanism for mounting a work holder on a cooling plate by a chuck.

6 is a cross-sectional view illustrating a cross-sectional configuration corresponding to the perspective configuration illustrated in FIG.

FIG. 7 is a perspective view for explaining a wearing mechanism continued from FIG. 5;

8 is a cross-sectional view illustrating a cross-sectional configuration corresponding to the perspective configuration illustrated in FIG.

FIG. 9 is a perspective view for explaining a wearing mechanism continued from FIG. 7;

10 is a cross-sectional view illustrating a cross-sectional configuration corresponding to the perspective configuration illustrated in FIG.

FIG. 11 is a cross-sectional view illustrating a cross-sectional configuration for explaining the wearing mechanism continued from FIG.

FIG. 12 is a perspective view illustrating a perspective configuration for describing a wearing mechanism continued from FIG. 11;

13 is a cross-sectional view illustrating a cross-sectional configuration corresponding to the perspective configuration illustrated in FIG.

14 is a block diagram illustrating a schematic configuration of the film forming apparatus illustrated in FIG.

FIG. 15 is a perspective view illustrating an appearance of a film forming apparatus as a modification example of the film forming apparatus according to one embodiment of the present invention.

FIG. 16 is a perspective view for explaining a workpiece exchange mechanism in the film forming apparatus as a modification shown in FIG.

17 is a cross-sectional view illustrating a cross-sectional configuration corresponding to the perspective configuration illustrated in FIG.

FIG. 18 is a perspective view illustrating an appearance of a conventional film forming apparatus.

19 is a perspective view illustrating an internal configuration of the conventional film forming apparatus illustrated in FIG.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... vacuum chamber, 2 (2A, 2B, 2C, 2D) ... ion source, 3 ... exhaust pipe, 4 ... vacuum chamber door, 5 ... rotating shaft, 6 ... carrier, 7 ... chuck, 8 ... work holder, 8H ... Inner wall surface, 8K ... opening, 8U ... storage space, 10, 90 ... film forming apparatus, 11 ... introduction port, 12 (12A, 12B, 12)
C, 12D) ... cooling pipe, 13 (13A, 13B, 13)
C, 13D) cooling plate, 30 processing hole, 61 control device, 62 driving device A, 63 driving device B, 64 bias voltage applying device, 65 temperature adjusting device, 66 pressure reducing device, 71 Support plate, 72 ... rail, 73 (73A, 73
B, 73C, 73D) ... chuck parts, 81 ... holder claw rotating shaft, 82 ... holder claw, 82M ... head, 82T
.., Claws 91, replacement jigs 92, replacement chambers 93, replacement lids 94, packing sheets 131 (131A, 131)
B): opposed plate, 132: bellows, B: cooling medium, T1
1st position, T2 2nd position, T3 3rd position, T4 4th position, W ... workpiece.

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H01L 21/3065 H01L 21/302 B F-term (Reference) 4K029 AA06 AA24 CA13 DA08 DE00 FA04 KA02 4K030 CA04 CA12 DA04 GA12 KA26 5F004 AA06 BA11 BB20 BB24 BB25 BC05 CA05 DB01 DB03 EA06 FA01 5F103 AA02 BB33 BB36 BB38 BB41 BB49 HH03 HH05 HH10

Claims (9)

[Claims] 1. A vacuum processing apparatus provided with a plurality of processing units corresponding to a plurality of processing positions on the same circumference of a vacuum chamber, wherein the processing unit is disposed at the center of the same circle and moves in a longitudinal direction. A movable axis, a carrier member rotatable around the axis of movement, and a carrier member arranged corresponding to the plurality of processing positions, and rotation of the workpiece, application of a bias voltage, and temperature adjustment. An operation member for performing at least one operation, holding the object to be processed, being movable to any one of the plurality of processing positions by rotation of the carrier member, and being moved by the movement axis. A holding member movable from a first position farther from the action member to a second position closer to the action member; and a detachable member connected to the carrier member and capable of attaching and detaching the holding member. Characteristic true Empty processing equipment. 2. The vacuum processing apparatus according to claim 1, wherein the operation member is made of a conductive material, and simultaneously performs the operations of rotating, applying a bias voltage, and adjusting the temperature of the object to be processed. apparatus. 3. The vacuum processing apparatus according to claim 1, wherein the operation member includes an expansion member that can expand and contract according to a change in pressure of the temperature adjustment medium introduced therein. apparatus. 4. A driving unit for moving the moving shaft and rotating the carrier member; a temperature adjusting unit for adjusting the temperature of the operating member; and applying a bias voltage to the operating member. 2. The vacuum processing apparatus according to claim 1, further comprising a bias voltage applying unit for applying the voltage. 5. The vacuum processing apparatus according to claim 1, further comprising a decompression means for decompressing the inside of the vacuum chamber. 6. An exchange jig which is exchangeable with a part of the plurality of processing units and has an exchange chamber communicating with the inside of the vacuum chamber, and an arrangement of the exchange jig. A movable member disposed corresponding to the installation position and movable between a third position farther from the exchange jig and a fourth position closer to the replacement jig; and disposed on an inner wall surface of the vacuum chamber. The vacuum processing apparatus according to claim 1, further comprising an airtight member that separates the inside of the vacuum chamber and the exchange chamber when the moving member is moved to the fourth position. 7. The vacuum processing apparatus according to claim 1, wherein the processing unit performs a film forming process on the object. 8. The vacuum processing apparatus according to claim 1, wherein the processing section performs an etching process on the object to be processed. 9. The vacuum processing apparatus according to claim 1, wherein the processing section performs an ion implantation process on the object to be processed.