JP2002176268A - Resin board, method of manufacturing the same, connection intermediate product, circuit board and manufacturing method therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a circuit board having small connection resistance and superior connection stability. SOLUTION: A compression function layer 60 is disposed on at least one surface of the board. The compression function layer 60 gives a function for compression by receiving pressurization in the direction of board thickness to a resin substrate 10 including the layer. Thus, sufficient pressure is applied to a conductor 14.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to the present invention. The present invention relates to a resin substrate used for a circuit board, a connection intermediate, a method for manufacturing a connection intermediate, a circuit board, and a method for manufacturing a circuit board.

[0002]

2. Description of the Related Art In recent years, as electronic devices have become smaller and lighter and have higher functions and higher performance, multilayer circuit boards on which semiconductor chips such as LSIs can be mounted at a high density have been widely used not only for industrial applications but also for consumer devices. There is a strong demand for inexpensive supplies.

In order to meet such market demands, a resin multilayer circuit board which can be supplied at a lower cost than a ceramic multilayer board has been attracting attention instead of a conventional ceramic multilayer board. Technology development has been carried out to make substrates suitable for high-density mounting.

[0004] As a resin multilayer circuit board developed in this manner, an all-layer IVH structure (any layer inner via hole construct) disclosed in Japanese Patent Application Laid-Open No. 06-268345 is disclosed.
ction) circuit board. Since this circuit board is a resin multilayer board using a composite material of an aramid nonwoven fabric reinforcing material and an epoxy resin for the insulating layer, it can be supplied at relatively low cost. Furthermore, this circuit board is made of all layers IVH
Since the structure, that is, an interstitial via hole connection structure in which an arbitrary position of a wiring layer can be connected by a conductive paste is adopted, it is suitable for high-density mounting.

[0005]

A circuit board having an all-layer IVH structure having the above characteristics cannot be constructed without using a prepreg having a nonwoven fabric impregnated with a resin and having a void inside. That is, this circuit board has a structure that can be realized only by using a specific material.

[0006] However, recent market demands are as follows in addition to the increase in mounting density. In other words, the market demands are low-permittivity circuit boards suitable for high-speed networks,
Alternatively, there are a wide variety of circuit boards with high heat resistance. Therefore, it is required to realize a circuit board having physical properties suitable for each demand and suitable for high-density mounting.

Accordingly, it is a main object of the present invention to provide a circuit board which can realize low connection resistance and excellent connection stability.

[0008]

In order to achieve the above-mentioned object, the present invention provides a resin substrate used for an insulating layer of a circuit board or a connection intermediate, comprising a compression function layer on at least one substrate surface. Provided. The compression function layer is characterized in that it gives a resin substrate or an intermediate connector a function of being compressed by receiving a pressure in its thickness direction.

According to the present invention, it is possible to obtain a circuit board which is not limited to a combination of materials but is provided with a function of compressing by giving a characteristic to a surface to realize a low via connection resistance and excellent connection stability. Can be

[0010] The compression functional layer is preferably a porous layer. Then, by controlling the degree of penetration of the resin component of the resin substrate into the porous layer, it is possible to provide the resin substrate with a function of receiving pressure in the thickness direction and compressing the resin substrate.

The porous layer has a group of holes, and the group of holes is preferably composed of a plurality of holes communicating with each other, and both ends of the group of holes are preferably opened on both sides of the porous layer. Then, the air accumulated in the holes can be discharged to the outside by pressurization in the thickness direction of the substrate. This makes it easier for the resin component of the resin substrate to penetrate the porous layer, and the amount of the resin component penetrating the porous layer can be easily controlled by adjusting the pressure.

[0012] The compression functional layer may be formed of a layer of insulating particles provided on the resin substrate or the connection intermediate so as to protrude from the substrate surface. In this case, the insulating particles protruding from the substrate surface are pressed into the resin substrate under the pressure in the thickness direction of the substrate, whereby a function of compressing the resin substrate can be provided.

It is preferable that at least the surface on which the compression function layer is disposed of the resin substrate is in a semi-cured state. Then, since the substrate material is in a semi-cured state, there are the following advantages.
That is, in the compression function layer formed of the porous layer, the resin component easily enters the porous layer. Further, in the compression function layer formed of the layer of insulating particles, the insulating particles can be easily pushed into the resin substrate.

It is preferable that the resin substrate is provided with a protective film layer removably above the compression function layer. Then, it is possible to prevent dust from adhering to the compression functional layer from the outside during the manufacturing process of the circuit board using the resin substrate and the connection intermediate. Further, the thickness of the resin substrate and the entire connection intermediate can be adjusted through attachment and detachment of the protective film layer. This makes it possible to add a compression margin when compressing a conductor provided to penetrate the resin substrate or the connection intermediate in the thickness direction.

The resin substrate of the present invention can be manufactured as follows. That is, after arranging the porous layer on at least one substrate surface of the resin substrate, by applying a pressing force to the resin substrate to such an extent that the resin component of the resin substrate does not enter the pores of the porous layer. Then, the porous layer is pressure-bonded to the resin substrate.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below with reference to the drawings.

(First Preferred Specific Example) FIGS. 1A and 1B
Shows a schematic cross-sectional view of the resin substrate 10 of this specific example.

The resin substrates 10A and 10B have a porous layer 11 on the surface. That is, the difference between the resin substrates 10A and 10B of this specific example and the conventional resin substrate is as follows.
Whether or not the surface has the porous layer 11 serving as the compression functional layer is determined. The resin substrates 10A and 10B of this specific example have the porous layer 11 on at least one surface.

1A and 1B, the substrate 10A,
Although an example in which the porous layer 11 is provided on both surfaces of 10B is shown, the resin substrate of the present invention can also be used when a porous layer is provided only on one surface.

As the substrate material of the resin substrates 10A and 10B of this embodiment, a prepreg 100 or an adhesive sheet 101 in which a thermosetting resin is impregnated into a reinforcing fiber material can be used. An example using the prepreg 100 is a resin substrate 10A shown in FIG. 1A, and an example using the adhesive sheet 101 is a resin substrate 10B shown in FIG. 1B.

Examples of the prepreg 100 include a glass epoxy prepreg and an aramid epoxy prepreg. The glass epoxy prepreg is obtained by impregnating a glass nonwoven fabric with a semi-cured (B stage) epoxy resin. Aramid epoxy prepreg is obtained by impregnating a semi-cured epoxy resin into an aramid nonwoven fabric. The semi-cured epoxy resin has adhesiveness. Therefore, in these prepregs 100, there is no need to provide an adhesive layer for bonding the porous layer 11 on the surface of the prepreg 100 as shown in FIG. 1A.

The adhesive sheet 101 is a film substrate made of a thermoplastic resin such as polyimide, liquid crystal polymer, aramid, PTFE (polytetrafluoroethylene) or a thermosetting resin. In the resin substrate 10B made of the adhesive sheet 101, as shown in FIG. 1B, an adhesive layer 102 made of a thermosetting resin or a thermoplastic resin is provided on the porous film forming surface of the adhesive sheet 101. .

The types of thermosetting resin or thermoplastic resin impregnated in the prepreg 100 (hereinafter referred to as prepreg impregnated resin) and the resin constituting the adhesive layer 102 provided on the adhesive sheet 101 are the same as the resin substrates 10A and 10B. It can be selected depending on the combination with the metal used for the wiring layer (described later), and is not particularly limited.

However, as will be described later, it is necessary to allow an adhesive or a prepreg-impregnated resin to penetrate into the internal space of the porous layer 11 from the periphery thereof. In order for these resins to enter the porous layer 11, the prepreg-impregnated resin and the adhesive layer 102 need to maintain fluidity during the process. Therefore, a thermosetting resin is used in a semi-cured state. In the case of a thermoplastic resin, the temperature at the time of the step of flowing the adhesive is set to a temperature equal to or higher than the softening temperature and fluidized.

Specific Prepreg Impregnated Resin or Adhesive Layer 1
The following are examples of the material 02. That is,
Epoxy resin, polyimide resin, phenol resin, fluorine resin, unsaturated polyester resin, PPE (polyphenylene ether) resin, bismaleimide triazine resin,
A thermosetting resin such as a cyanate ester resin or a thermoplastic resin may be used. When a film substrate of a thermoplastic resin is used as the adhesive sheet 101, the film substrate itself has an adhesive property at a softening point or higher, so that the film substrate itself can also serve as an adhesive layer.

The resin substrate 10 thus configured
A, a porous layer 11 on at least one substrate surface
Is provided. The porous layer 11 includes a resin substrate 10A,
10B is a compression functional layer that imparts a function of compressing by receiving pressure in its thickness direction. Specific examples of the porous layer 11 include a porous sheet such as PTFE (polytetrafluoroethylene), polyimide, and aramid, and a porous ceramic.

The porous layer 11 has a thickness of 1 μm inside.
Very small holes can be provided from those having a diameter of less than m to several μm. Moreover, in this case, the size of the holes can be controlled with high accuracy.

When a circuit board used for a high-frequency circuit is manufactured, it is preferable to provide a compression function layer made of a porous layer 11 having a small dielectric constant such as PTFE (polytetrafluoroethylene) in the following points.

That is, since the magnetic flux density leaking from the wiring layer is high at the surface layer portions of the resin substrates 10A and 10B which are closest to the wiring layer, the effect of the dielectric constant dielectric loss is
A Larger than inside 10B. Therefore, the resin substrate 10
When the compression function layer such as the porous layer 11 disposed on the surface portion of each of the resin substrates A and 10B is made of a material having a low dielectric constant, the high-frequency characteristics of the circuit board including the resin substrates 10A and 10B can be improved. By providing the porous layer 11, the mechanical strength of the resin substrates 10A and 10B can be reinforced.

The porous layer 11 has a plurality of holes 1 therein.
03. The hole group 103 is formed by a plurality of holes 104 communicating with each other. At least one of the hole groups 103 has both ends open on both sides of the porous layer 11. That is, the hole group 103 includes a non-sealed non-sealed part in the porous layer 11. There is at least one hole group 103 in a sealed state. Porous layer 1
The two surfaces of 1 are connected to each other by the hole group 103 configured as described above.

Next, a method for manufacturing the resin substrates 10A and 10B will be described with reference to FIG. FIG. 2A shows the resin substrate 10
2A shows a method of manufacturing the resin substrate 10B.

The method of manufacturing any of the resin substrates 10A and 10B is basically the same. That is, the compression functional layers are laminated and integrated on both surfaces of the prepreg 100 or the adhesive sheet 101. Specifically, the porous layer 1 is formed on both sides of the prepreg 100 or the adhesive sheet 101.
1 is thermocompression-bonded. The thermocompression bonding can be performed, for example, by rolling the heated roller pressed against the porous layer 11. However, when performing thermocompression bonding, the porous layer 1
The pressure applied to the resin substrates 10A and 10B is such that the resin components of the resin substrates 10A and 10B hardly penetrate into the first hole 104.
10B. Here, the resin components of the resin substrates 10A and 10B refer to the impregnated resin of the prepreg 100 or the resin component constituting the adhesive layer 102.

At the same time when the porous layer 11 is pressed against the resin substrates 10A and 10B, a protective film layer may be detachably formed on at least one substrate surface of the resin substrates 10A and 10B. In this case, by forming the porous layer 11 on the protective film layer in advance, arranging the porous layer 11 so as to be in contact with the resin substrates 10A and 10B, and pressing the protective film layer, the protective film is pressed. A resin substrate having a layer and a porous layer 11 can be easily manufactured with a reduced number of manufacturing steps. For example, the following conditions can be set as the crimping conditions at this time. That is, PET film (thickness 4 ~
25 μm) to a glass epoxy prepreg or aramid epoxy prepreg,
With a hot roller heated to 40 ° C., a feed speed of 1 to 3 m / sec and an air pressure of 0.5 to 5.0 kgf / cm ² can be achieved. The protective film layer and the porous layer 11 are, of course,
It may be formed on both surfaces of the resin substrates 10A and 10B. However, it is needless to say that an asymmetric arrangement may be adopted in which the porous layer 11 and the protective film layer are provided only on one substrate surface of the substrates 10A and 10B, and only the protective film layer is provided on the other substrate surface. Nor.

(Second Preferred Embodiment) A resin substrate 30 according to a second preferred embodiment of the present invention will be described with reference to FIG. FIG. 3A shows an insulating particle layer 3 serving as a compression function layer.
2 is a schematic cross-sectional view of a resin substrate 30 having a cross section 2.

This embodiment is different from the first preferred embodiment in that the porous layer 11 is changed to the insulating particle layer 32.
It is configured similarly to the first preferred embodiment.

The insulating particle layer 32 can be constituted as follows. That is, in the resin substrate 10B made of the adhesive sheet 101 described in the first preferred embodiment, by adding a plurality of insulating particles 31 to the adhesive layer 102 ', the insulating particles are added to the insulating layer. The conductive particle layer 32 can be configured.

More specifically, an insulating particle layer 32 is formed by adding insulating particles 31 such as silica, alumina, and aluminum hydroxide to the adhesive layer 102 '. Then, the thus-formed insulating particle layer 32 is formed on at least one substrate surface of the resin substrate 10B. At this time, the insulating particles 31 are made to protrude from the surface of the adhesive layer 102 '.

In the resin substrate 30 having such an insulating particle layer 32, as shown in FIG. 3B, the insulating particles 31 are pushed into the adhesive layer 102 'in the subsequent heat compression step. Thereby, the resin substrate 30 is compressed.

Using the resin substrate 10A comprising the prepreg 100 described in the first preferred embodiment, the resin substrate 3
0, the insulating particle layer 32 described above.
When an insulating particle layer similar to that described above is provided, the following may be performed.

That is, as shown in FIG. 3C, the resin impregnating the woven or nonwoven fabric as the reinforcing material in the prepreg 100 may be a resin containing the insulating particles 31 ′. As a specific example of such a resin substrate 30 ′, a glass epoxy prepreg with a filler impregnated with an epoxy resin in which silica particles are dispersed in a glass woven fabric can be used.

(Third Preferred Embodiment) A third preferred embodiment of the present invention will be described with reference to FIG. FIG.
FIG. 2 is a schematic cross-sectional view of a resin substrate 50 having a concave portion 51 functioning as a compression functional layer on the surface. That is, the difference between the resin substrate 50 of the present example and the general resin substrate for a circuit board is whether or not the surface has the concave portion 51. The resin substrate 50 of the present example has at least one substrate surface. It has at least one recess 51.
FIG. 4 shows an example in which a plurality of concave portions 51 are provided on both surfaces, however, the resin substrate 50 of this specific example can also be provided in the case where only one concave portion is provided or only one concave portion is provided.

As will be described later, the shape and number of the concave portions 51 are not particularly limited, and the total volume of all the concave portions is important.

The material of the resin substrate 50 of this embodiment is as follows.
The same material as the resin substrates 10A, 10B, 30 in the second specific example can be used.

The method for forming the concave portion 51 is not particularly limited. For example, an adhesive layer is formed on a support provided with a convex portion corresponding to the concave portion 51, and the adhesive layer is transferred onto a film substrate. It can be formed by removing the support. For the adhesive layer, a thermosetting adhesive or a thermoplastic adhesive can be used. In the case of a thermosetting adhesive, transfer is formed in a semi-cured state, and in the case of a thermoplastic adhesive, the temperature is raised to a softening point or higher during transfer formation.

Another method for forming the concave portion 51 is as follows.
There are the following methods. That is, a flat adhesive layer is formed on a film substrate in advance, and pressure is applied to the adhesive layer in a semi-cured state by using a mold provided with a convex portion corresponding to the position of the concave portion 51. Thereafter, by removing the mold, a concave portion 51 having a desired size and shape can be provided at a desired position of the adhesive sheet. In the case of a thermoplastic adhesive, the mold is pressed while heating to a temperature higher than the softening point.

It is preferable to perform a release treatment on a portion of the support or the mold that is in contact with the adhesive layer. that way,
The adhesive is easily separated from the support and the mold, and the production of the resin substrate 50 of this specific example is facilitated. Further, in the method of forming the concave portion 51 with the support or the mold described above, the shape and number of the concave portion 51, the interval thereof, and the like can be arbitrarily selected.

As another method of forming the concave portion 51, there is the following method. That is, after forming a solution obtained by diluting a thermosetting adhesive with a solvent, ultrasonic vibration is applied to generate bubbles in the solution. The solution with bubbles is applied on a film substrate. Then, by drying the solution with bubbles on the film substrate, the solvent is volatilized to be in a semi-cured state. As a result, the bubble portion becomes a void and forms the concave portion 51.

As an example of such a method, there is the following method. That is, the polyimide-based adhesive THF
(Tetrahydroxyfuran) solution (solid content 30 wt%)
To generate ultrasonic bubbles (38 kHz, 150 W). The solution is applied to a polyimide film substrate (thickness: 13 μm) by a gap coater, and dried at 120 ° C. for 1 minute. Thereby, the concave portion 51 is formed in the dried solution. The thickness of the solution after drying is about 6 μm.

Further, as another method of forming the concave portion 51, there is the following method. That is, a photosensitive adhesive layer is formed flat on a film substrate in advance.
On this adhesive layer, a recess 5 having a desired shape and size is formed.
The uncured portion is developed by covering with a mask corresponding to 1 and exposing. Thereby, the concave portion 51 is formed on the adhesive layer. In this case, the adhesive layer is kept in a semi-cured state. According to this method, the concave portion 51 can be formed relatively easily.

Even in the case of the resin substrate 50 made of a prepreg, the concave portion 51 can be formed by the same method as the resin substrate made of the adhesive sheet.

In the case of the resin substrate 50 made of prepreg, since the contained resin has adhesiveness, the concave portion 51 can be formed in the resin of the surface layer without forming an adhesive layer. The concave portion 51 can be formed in the same manner by using the above-described support or mold.

In the case of a prepreg, the concave portion 51 can be formed through a normal manufacturing process. That is,
In the method of manufacturing the resin substrate 50 using the prepreg, first, a sheet-like reinforcing material such as a glass cloth or aramid paper is impregnated with a solution diluted to a desired viscosity with a solvent to prepare the resin substrate 50. Then, the excess solution is scraped off from the produced resin substrate 50 with a roller or the like, and the resin substrate 50 is dried to further remove the excess solvent. In such a process, a roller provided with a convex portion corresponding to the concave portion 51 is passed through the resin substrate 50 before drying. Thereby, the resin substrate 50 having the concave portion 51 on the surface can be easily manufactured.

In the method of manufacturing the resin substrate 50 using the prepreg, the concave portion 51 can be manufactured as follows. That is, the heating and drying process is rapidly performed in the drying step for removing the excess solvent. As a result, a void is formed on the surface of the resin substrate 50 from which the solvent has escaped.

As an example of such a manufacturing method, there is the following method. That is, the resin substrate 50 is prepared by impregnating an aramid nonwoven fabric (basic weight 72 g / m ² , thickness 120 μm) with a MEK (methyl ethyl ketone) solution (solid content 60%) of the epoxy resin composition for prepreg impregnation. Next, an excess solution is squeezed out of the resin substrate 50 by inserting the resin substrate 50 between a pair of rollers having a gap of 150 μm. Thereafter, the resin substrate 50 is put into the dryer heated to 200 ° C. for 3 minutes. Thereby, the concave portion 51 is formed in the resin substrate 50.

According to this method, an extra step of providing the concave portion 51 is not required, and the resin substrate 50 can be manufactured at low cost.

In the case of the resin substrate 50 of this embodiment in which the adhesive layer is formed on one side or both sides of the film substrate, the concave portions 51 are also provided.
Can be formed. In other words, in the step of applying the adhesive layer and drying it later, similarly, it is rapidly heated and dried to form voids and form the concave portions 51 in the resin substrate 50. (Fourth Preferred Embodiment) Next, the resin substrates 10A, 10B, 30, 50 described in the first to third preferred embodiments will be described.
The structure of the intermediate connector 12 using the above will be described with reference to FIG. In the connection intermediate 12 described in this specific example with reference to FIG. 5 and the circuit board described in a specific example described later, any of the resin substrates 10A, 10B, 30, and 50 may be a resin substrate. Can be used as Therefore, in the following description and the drawings referred to in the description, the resin substrates 10A, 10B, 30, and 50 are collectively referred to as the resin substrate 1
Description will be made assuming 0. Further, since the porous layer 11, the insulating particle layer 32, and the concave portion 51 all function as a compression function layer, the porous layer 11, the insulating particle layer, and the like in the following description and the drawings referred to in the description. 32 and the concave portion 51
All of them will be described as the compression function layer 60.

As shown in FIG. 5, the intermediate connector 12 is formed by forming a through hole 13 at a desired position on the resin substrate 10 and filling the through hole 13 with a conductor 14. The conductor 14 becomes an interstitial via hole.

As the conductor 14, a conductive paste containing a conductive powder in a resin binder can be used.
The conductivity of the conductive paste is improved by applying compression.

As the conductive powder, a powder made of at least one metal selected from gold, silver, copper, nickel, palladium, lead, tin, indium and bismuth, an alloy thereof, or a mixture thereof is used. Further, a coated filler formed by coating the above-mentioned metal or alloy on a sphere made of the above-mentioned metal or alloy, an oxide such as alumina or silica, or an organic synthetic resin is used as the conductive powder.

The shape of the conductive powder is not particularly limited, but may be powdery, fibrous, granulated powder, spherical ball,
Alternatively, a mixture thereof is used.

As the resin used for the resin binder, a liquid epoxy resin, a polyimide resin, a cyanate ester resin, a phenol resole resin, or the like is used.

Examples of the epoxy resin include glycidyl ether type epoxy resins such as bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol AD type epoxy resin, alicyclic epoxy resin, glycidylamine type epoxy resin, and glycidyl ester type epoxy resin. For example, an epoxy resin containing two or more epoxy groups is used.

The above-mentioned resins may be, if necessary, butyl cellosolve, ethyl cellosolve, butyl carbitol,
Ethyl carbitol, butyl carbitol acetate,
Additives such as solvents and dispersants such as ethyl carbitol acetate and α-terpineol can also be contained.

Further, the conductor 14 is not limited to the above-mentioned conductive paste, but may be formed by pressing a via post made of a metal such as gold, silver, copper, nickel, palladium, lead, tin, indium or bismuth. Any type of connection material for an interstitial via hole that obtains conduction can be used without particular limitation.

To form an interstitial via hole in the connection intermediate 12, first, a through hole 13 is formed at a desired position on the resin substrate 10. The method of forming the through hole 13 is as follows.
An ordinary circuit board hole processing method, a laser processing method such as a carbon dioxide laser or a YAG laser, or a mechanical processing method such as a drill or a puncher can be used.

In particular, the through-hole 1 is formed by a thermal processing laser processing method.
When forming 3, the peripheral wall of the through hole 13 can be melted. At this time, the compression function layer 60 is
In the case of the configuration from one, it is as follows. That is,
The holes 104 of the porous layer 11 located on the peripheral wall are crushed by melting of the peripheral wall of the through hole. The holes 104 located on the peripheral wall of the through-hole serve as bleeding spots when the conductive paste filled in the through-hole 13 bleeds around. Therefore, if the hole 104 at this position can be crushed, the bleeding of the paste can be prevented.

However, the holes 104 need not necessarily be completely crushed. The holes 104 may be crushed to a size that does not allow the conductive powder to enter, so that the above-described effect of preventing paste bleeding and the following effects can be obtained. That is, in this case, the resin component in the conductive paste enters the holes 104 left in a reduced state, and as a result, the compression of the conductive paste filled in the through holes 13 is increased, and the conductive paste (conductive The resistance of the body 14) can be reduced.

Next, the conductor 14 is filled in the through hole 13 to complete the connection intermediate 12 shown in FIG.

The filling of the conductor 14 uses a printing method. At this time, it is preferable that the resin substrate 10 having the through-holes 13 formed thereon is placed on a vacuum suction table via a spread sheet, and the conductors 14 are printed and filled. Then, the packing density of the conductive particles can be further increased when the connection intermediate 12 is compressed in the circuit board manufacturing process described later. This is because the resin component in the conductive paste 14 is firmly sucked into the spreading paper due to the suction by the vacuum suction and the capillary phenomenon generated in the spreading paper,
Thereby, the packing density of the conductive powder is increased and voids are generated between the conductive powders. (Fifth Preferred Embodiment) Next, the structure of a circuit board using the connection intermediate 12 described in the fourth preferred embodiment and a method of manufacturing the same will be described. First, the double-sided circuit board 17
Will be described with reference to FIG.

As shown in FIG. 6A, a metal foil 15 for forming a wiring layer is overlaid on both surfaces of the connection intermediate 12 and thermocompression-bonded. The conditions for thermocompression bonding differ depending on the material composition used. For example, a polyimide film substrate (thickness 1)
When using a resin substrate 10 in which an adhesive layer 102 (thickness of about 6 μm) made of a polyimide resin is formed on a resin substrate 10 made of 3 μm), the pressure is 150 kgf / cm.
^2. Heat and press at 200 ° C for 1 hour. When the resin substrate 10 made of aramid epoxy prepreg is used, heating and pressing are performed at a pressure of 50 kgf / cm ² and a temperature of 200 ° C. for one hour.

As the metal foil 15, a copper foil such as an electrolytic copper foil or a rolled copper foil used for a normal circuit board is used. The thickness of the metal foil 15 is not particularly limited, but is 3 μm to 70 μm.
Is preferred because it is easily available.

According to the above-described steps, the metal foil 15 and the connection intermediate 12 are bonded by thermocompression bonding. Next, as shown in FIG. 6B, the metal foil 15 is processed into a wiring layer 16 having a desired wiring pattern. Thereby, the double-sided circuit board 17 is completed. The wiring layer 16 can be processed by a photolithography method that is usually used in manufacturing a circuit board.

In the method of manufacturing the double-sided circuit board 17, when the metal foil 15 is subjected to thermocompression bonding, the connection intermediate body 12 is compressed by the function of the compression function layer 60, and the thickness thereof is reduced. As a result, the conductor 14 is compressed at the same time as the connection intermediate 12 is compressed, and the conductivity of the conductor 14 is increased.

First, the application of compression when the compression function layer 60 is formed from the porous layer 11 will be described. in this case,
The resin component on the surface of the resin substrate 10 has fluidity. Therefore, when the connection intermediate 12 is pressed in the thickness direction, the resin component impregnates the pore group 103 in the porous layer 11, and the porous layer 11
As a result, the connecting intermediate 12 is compressed by that amount, and its thickness is reduced. Thereby, the conductor 14
As the connection intermediate 12 is compressed, it is simultaneously compressed and its conductivity increases.

Next, from the insulating particle layer 32 to the compression functional layer 60
A description will be given of the compression application in the case of the configuration. In this case, in the heat compression step, the insulating particles 31
It is pushed inside 2 '. Thereby, the resin substrate 30
Is compressed, and the thickness of the connection intermediate body 12 is reduced accordingly. As a result, the conductor 14 is compressed at the same time as the connection intermediate 12 is compressed, and the conductivity of the conductor 14 is increased.

Next, a description will be given of the application of compression when the compression function layer 60 is constituted by the concave portions 51. In this case, the concave portion 51 is crushed by the heat compression process. As a result, the resin substrate 50 is compressed, and the thickness of the connection intermediate 12 is reduced accordingly. Thereby, the conductor 14 is connected to the connection intermediate 12
Is simultaneously compressed and its conductivity increases. That is, as shown in FIG. 7A and FIG.
Has a function of compressing the connection intermediate 12 (resin substrate 50) by flowing the resin component 52 from the periphery thereof. In this case, it is important to control the entire volume of the concave portion 51. Specifically, the ratio of the total volume of the concave portion 51 to the total volume of the connection intermediate 12 (the total volume of the concave portion 51 / the total volume of the connection intermediate 12) needs to be the compression ratio of the connection intermediate 12.

The compression ratio for the conductor 14 is preferably as follows. That is, when the conductor 14 is used as the interstitial via hole, the compression ratio is preferably set to 5% or more. Even if the compression ratio is less than 5%, the conduction of the interstitial via hole can be ensured. However, when the content is 5% or more, a sufficient compressive force is applied to a contact portion between the conductive powders and a contact portion between the conductive powder and the metal foil 15, so that the portions are strongly adhered to each other. Thereby, the connection resistance of the interstitial via hole is reduced. In addition, connection stability is improved.

The double-sided circuit board 1 thus manufactured
7 has the following configuration. That is, the compression function layer 60 is provided on at least one substrate surface of the resin substrate 10.
have. The resin substrate 10 has a through hole 13 in its thickness direction. The through hole 13 is filled with a conductor 14. A wiring layer 16 having a desired wiring pattern is provided on both surfaces of the resin substrate 10. Resin substrate 1
The wiring layers 16 on both sides of the “0” are electrically connected to each other by the conductor.

When the double-sided circuit board 17 is formed, the following is preferable. That is, as shown in FIG. 8, it is preferable that the maximum diameter L of the holes 104, which are components of the hole group 103, be smaller than the minimum separation S of the conductor 14. By doing so, the following is achieved.

The conductive paste forming the conductor 14 enters the holes 104 by receiving a compressive force. By setting the maximum diameter L, the conductive paste that has entered the holes 104 is formed. A short circuit between the conductors 14 due to the paste can be prevented.

In this specific example, the compression force can be further increased by combining the effect of applying compression by the compression function layer 60 with another technique.

For example, a so-called transfer method is used in which a wiring layer 16 formed in advance, instead of the metal foil 15, is pressed into the connection intermediate 12 in a step of laminating the metal foil 15 on the resin substrate 10 and performing thermocompression bonding.

More specifically, as shown in FIG.
A wiring layer with a carrier, in which a wiring layer is formed on a 0 layer, can be used. Examples of wiring layers with carriers include:
For example, there is an aluminum carrier in which a wiring layer is laminated via a separation layer.

That is, as shown in FIG. 9A, the wiring layer 21 is formed by patterning the copper foil laminated on the support substrate 20 by etching using an aqueous solution of iron chloride, an aqueous solution of ammonium persulfate, or the like. Then, as shown in FIGS. 9A and 9B, the wiring layer 21 is connected to the connection intermediate 1.
2, the supporting substrate 20 is removed by etching with hydrochloric acid or the like.

By using the transfer method, the compressive force applied to the conductor 14 of the connection intermediate 12 is obtained by adding the compressive force caused by the porous layer 11 and the compressive force caused by the indentation of the wiring layer 21. Help.

Further, even if a compressible base material having pores therein is used for the resin substrate 10 ′, a larger compressive force is applied to the conductor 1 by a synergistic effect with the compressive effect of the porous layer 11 of the present invention.
4 can be added. Examples of such a resin substrate 10 'include a porous film of polyimide or fluororesin.

Further, as shown in FIG. 10, the conductor 14 filling the through hole 13 is projected from the surface of the connection intermediate 12 and the compressive force applied to the conductor 14 is further increased by thermocompression bonding. be able to. This will be described below.

First, as shown in FIG. 10A, at least one surface of the resin substrate 10 having the compression function layer 60 is
Protective film layer 22 made of a film material such as T (polyethylene terephthalate) or PEN (polyethylene naphthalate) and having its substrate contacting surface subjected to mold release treatment (for example, treatment using a silicon-based release treatment agent). Attach. If the protective film layer 22 is composed of these materials, the resin substrate 10
The protective film layer 22 can be attached detachably.

Next, as shown in FIG. 10B, the protective film layer 22 is formed.
The through hole 13 is formed in the resin substrate 10 including the above. Then, the conductors 14 are filled in the through holes 13 by a printing method. At this time, the protective film layer 22 functions as a mask for preventing the conductor 14 from adhering to an unnecessary portion. further,
The conductors 14 are filled in the through holes 13 by the thickness of the protective film layer 22.

Next, as shown in FIG. 10C, the protective film layer 2
When 2 is peeled off, a connection intermediate 12 is obtained in which the conductor 14 protrudes from the through hole 13. In this state, the metal foil 15 is attached to both surfaces of the resin substrate 10. Then, the metal foil 15 and the resin substrate 10 are integrated by thermocompression bonding. At this time, since the conductor 14 protrudes from the through hole 13, in the thermocompression bonding step, the protrusion of the conductor 14 also functions to increase the compressive force on the conductor 14.

Lastly, the metal foil 15 is patterned into a wiring layer 16 having a desired wiring pattern by patterning the metal foil 15 by a photolithography process. Thereby, the double-sided circuit board 17 shown in FIG. 10D is completed. In the double-sided circuit board 17, the connection reliability of the interstitial via hole is increased by the increase in the compressive force on the conductor.

The connection intermediate 12 and the double-sided circuit board 17 are formed as described above. When a multilayer circuit board is manufactured using the connection intermediate 12 and the double-sided circuit board 17, To

As shown in FIG. 11A, a core substrate 18 made of a conventional double-sided circuit board such as the above-described double-sided circuit board 17 or a glass epoxy board is prepared. Then, the connection intermediate 12 and the metal foil 15 are stacked on the wiring layer 16 of the prepared core substrate 18 and thermocompression bonded. As a result, the core substrate 18, the connection intermediate 12, and the metal foil 15 are integrated. As the connection intermediate 12, it is preferable to use one in which the conductor 14 slightly protrudes from the surface of the intermediate. Then, the compressive force on the conductor 14 can be further increased.

Further, the metal foil 15 is processed into a wiring layer 16 by a photolithography method. As a result, FIG.
The multilayer circuit board shown in B is completed. By repeating this method, a multi-layer circuit board can be easily manufactured.

Next, another method of manufacturing a double-sided circuit board or a multilayer board will be described with reference to FIGS.

First, a resin substrate 10 having a compression function layer 60 attached to at least one substrate surface and a wiring layer 21 supported by a support substrate 20 are prepared. Then, the protective film layer 22 is attached to one substrate surface of the resin substrate 10. The protective film layer 22 may be provided on the surface on which the compression function layer is provided, or may be provided on the surface on which the compression function layer is not provided. FIG.
For example, as an example, the protective film layer 22
Is provided.

Next, as shown in FIGS. 12A-1 and 12A-2, the wiring layer 21 is formed on the surface of the resin substrate 10 where the protective film layer is not disposed.
Place. At this time, the wiring layer 21 is arranged after being positioned with respect to the resin substrate 10. The wiring layer 21
As shown in FIG. 12A-2, may be arranged so as to be partially embedded in the resin substrate 10 by a compression process. Conversely, as shown in FIG. 12A-1, the wiring layer 21 may be arranged on the surface of the resin substrate 10 without performing the compression process. When the wiring layer 21 is placed on the resin substrate 10 while being placed on the surface of the substrate, the wiring layer 21 is embedded in the resin substrate 10 by a thermocompression bonding process described later, and the compressive force against the conductor 14 is Can be increased.

Next, a through hole 13 is formed in the resin substrate 10. The through hole 13 is formed in the thickness direction until the through hole 13 reaches the wiring layer 21 from the surface on which the protective film layer is provided. At this time, the through holes 13
Are formed in a state where they are aligned with respect to the wiring layer 21.
The through holes 13 can be formed by a laser processing method using a carbon dioxide laser, a YAG laser, an excimer laser, or the like. In particular, when the through hole 13 is formed by a thermal processing laser processing method, the peripheral wall of the through hole 13 can be melted.
At this time, when the compression function layer 60 is composed of the porous layer 11, the following is performed. That is, the holes 104 of the porous layer 11 located on the peripheral wall are crushed by melting of the peripheral wall of the through hole. The hole 104 located on the peripheral wall of the through hole is a bleeding generation point when the conductive paste filled in the through hole bleeds around. Therefore, if the hole 104 at this position can be crushed, the bleeding of the paste can be prevented.

However, the holes 104 need not necessarily be completely crushed. The holes 104 may be crushed to a size that does not allow the conductive powder to enter, so that the above-described effect of preventing paste bleeding and the following effects can be obtained. That is, in this case, the resin component in the conductive paste enters the holes 104 left in a reduced state, and as a result, the compression of the conductive paste filled in the through holes 13 is increased, and the conductive paste (conductive The resistance of the body 14) can be reduced.

After the through holes 13 are formed, as shown in FIG. 12B, a conductor 14 made of a conductive paste is
Fill 3 At the time of filling the conductor 14 or after the filling, if the depressurizing process is applied to the through-hole 13, it is possible to prevent bubbles from remaining in the through-hole 13. Such decompression treatment leads to high-density filling of the conductor 14.

After the conductor 14 is filled, the protective film layer 22
Is removed. Then, as shown in FIG. 12C, the metal foil 15 is disposed on the surface of the resin substrate 10 from which the protective film layer has been removed, and is subjected to thermocompression treatment. As the conditions for the thermocompression bonding, the conditions for thermocompression bonding of general circuit boards can be used. For example, 180-2
50 ° C., 30 to 200 kgf / cm ² , 0.5 to 2.0
Time conditions can be used.

Finally, the metal foil 15 is formed on the wiring layer 16 having a desired wiring pattern by photolithography.
Process into Then, the support substrate 20 is removed. Thereby, the double-sided wiring board 17 shown in FIG. 12D is completed.

According to this method, since the conductor 14 can be formed in accordance with the position of the wiring layer 16, the positioning accuracy between the wiring layer 16 and the conductor 14 is improved.

In the case of forming a multilayer substrate, the following is performed.

First, a laminate shown in FIG. 13A is manufactured.
This is because in the configuration of the resin substrate 10 with a wiring layer shown in FIGS. 12A-1 and 12A-2,
This is a double-sided circuit board 17 shown in FIG.

Then, the metal foil 15 is laminated on the produced laminate. The metal foil 15 is arranged on the wiring layer non-arranged surface of the laminate.

After placing the metal foil 15 on the laminate, the laminate is subjected to a thermocompression treatment. Then, the metal foil 15 is processed into a wiring layer 16 having a desired wiring pattern by a photolithography method. Thereby, a multilayer substrate shown in FIG. 13B is completed. Further, by repeating the above-described steps, a further multilayered circuit board can be manufactured.

FIG. 1 shows still another method of manufacturing a circuit board.
4, description will be given with reference to FIG.

First, a resin substrate 10 having a compression function layer 60 and a protective film layer 22 adhered to at least one substrate surface
And a core substrate 18 shown in FIG. 11A. Then, the resin substrate 10 is stacked on both surfaces of the core substrate 18 to form a laminate. When the resin substrates 10 are laminated, the following is performed. That is, after the protective film layer 22 on the core substrate contact surface of the resin substrate 10 is peeled off, the resin substrate 10 is laminated on the core substrate 18. Alternatively, the resin substrate 10 is laminated on the core substrate 18 in a state where the surface on which the protective film layer is not formed of the resin substrate 10 is arranged in a direction in which the resin substrate 10 contacts the double-sided circuit board 17.

Then, as shown in FIGS. 14A and 14B, the through holes 13 are formed in each of the laminated resin substrates 10.
To form The through-hole 13 is formed in a state where it is aligned with the wiring layer 16 at the bottom. That is, the through hole 13 is formed in the thickness direction of the resin substrate 10 until the through hole 13 reaches the wiring layer 16.

After the through holes 13 are formed, as shown in FIGS. 14C and 15A, each of the through holes 13 has a conductor 1.
Fill 4 After that, the protective film layer 22 is removed.

After removing the protective film layer 22, metal foils 15 (not shown) are arranged on both sides of the laminate. And
The laminate and the metal foil 1 are subjected to thermocompression bonding.
5 is integrated. Finally, the metal foil 15 is processed into a wiring layer 16 requiring a desired wiring pattern by a photolithography method. Thus, a multilayer substrate shown in FIG. 15B is completed.

Next, the reason why the provision of the compression functional layer of the present invention represented by the porous layer 11 is advantageous for the structure of the circuit board will be described.

First, the first reason will be described. For a substrate structure in which an interlayer connection is made with a conductor made of a conductive paste, it is essential to compress the conductor in some form.
Conventionally, a prepreg having a hole inside is used as a resin substrate, and then the conductor is compressed by compressing the prepreg. That is, by pressing the prepreg, the pores are crushed to reduce the thickness of the prepreg, thereby compressing the conductor.

However, when a large number of holes are present in the resin substrate, the dimensions of the resin substrate tend to change due to temperature, humidity, external force, and the like. The dimensional change during the circuit board manufacturing process is
It is a cause of a process failure such as a pattern shift or the like, and is desirably as small as possible. The formation of holes in the resin substrate itself causes the circuit board to be easily deformed, which is disadvantageous in the process of manufacturing a circuit board having higher density and higher definition wiring.

On the other hand, in the resin substrate 10 of the present invention in which the compression function layer 60 such as the porous layer 11 is provided on the surface, the substrate itself is made of a resin in a solid state (a state without holes). Therefore, a dimensional change can be reduced, and it is possible to sufficiently cope with a high density circuit board.

Next, the second reason will be described. As the density of a circuit board increases, the spacing between conductors becomes increasingly smaller. As described above with reference to FIG. 8, when a hole is present between the conductors, if the maximum diameter of the hole is larger than the minimum separation distance between the conductors, the conductive paste penetrating into the holes causes the adjacent hole to become adjacent. Conductors may be short-circuited.

However, it is not easy to control the size of the holes in the prepreg with high accuracy.
It is difficult to form minute holes with high accuracy. Therefore, in the configuration of the circuit board in which holes are formed in the prepreg to impart compressibility, it becomes difficult to make the diameter of the holes smaller than the spacing between the conductors as the mounting density increases. As a result, in a circuit board with a higher density, the risk of a short circuit of the conductor due to the conductive paste penetrating the holes increases. As described above, the holes formed in the resin substrate itself are likely to cause a short circuit as the mounting density increases, and thus are not acceptable.

On the other hand, in the resin substrate 10 of the present invention in which the compression function layer 60 (particularly, the porous layer 11) is provided on the surface, the size of the holes 104 can be controlled with high precision, Hole 104 can be formed with high accuracy. Therefore, if the porous layer 11 having such holes 104 is provided, a short circuit caused by the conductive paste entering the holes 104 can be prevented even if the mounting density on the circuit board is increased. .

When the porous layer 11 is provided, the mechanical strength of the resin substrate 10 can be reinforced.

[0121]

As described above, according to the present invention,
An advantageous effect is obtained in that a resin substrate, a connection intermediate, and a circuit board using the same can be realized with a low inner via connection resistance and excellent connection stability.

[Brief description of the drawings]

FIG. 1A is a sectional view showing a configuration of a resin substrate 10A according to a first preferred embodiment of the present invention, and FIG.
Is a resin substrate 10 according to the first preferred embodiment of the present invention.
It is sectional drawing which shows the structure of B.

FIG. 2A is a cross-sectional view illustrating a method for manufacturing a resin substrate 10A, and FIG. 2B is a cross-sectional view illustrating a method for manufacturing a resin substrate 10B.

FIG. 3A is a sectional view showing a configuration of a resin substrate 30 according to a second preferred embodiment of the present invention, and FIG.
FIG. 3C is a cross-sectional view illustrating a configuration of the resin substrate 30 in a compressed state, and FIG. 3C is a cross-sectional view illustrating another configuration of the resin substrate 30.

FIG. 4 is a sectional view showing a configuration of a resin substrate 50 according to a third preferred embodiment of the present invention.

FIG. 5 is a sectional view showing a configuration of a connection intermediate 12 according to a fourth preferred embodiment of the present invention.

FIG. 6 is a sectional view showing each step in a method for manufacturing a double-sided substrate 17 according to a fifth preferred embodiment of the present invention.

FIG. 7 is an enlarged sectional view of a main part showing a state in which a resin component 58 flows into a concave portion 51.

FIG. 8 is a plan view showing a relationship between a maximum diameter L of a hole 104 and a minimum separation distance S of a conductor 14.

FIG. 9 is a cross-sectional view showing each step in a method for manufacturing a double-sided circuit board using a wiring layer with a carrier.

FIG. 10 is a cross-sectional view showing each step in a method for manufacturing a double-sided circuit board 17 using a protective film layer.

FIG. 11 is a cross-sectional view showing each step in the method for manufacturing a multilayer substrate.

FIG. 12 is a cross-sectional view showing each step in another manufacturing method of the double-sided circuit board.

FIG. 13 is a cross-sectional view showing each step in another method for manufacturing a multilayer substrate.

FIG. 14 is a cross-sectional view showing a first half of a process in still another method of manufacturing a multilayer substrate.

FIG. 15 is a cross-sectional view showing a latter half of a process in still another method of manufacturing a multilayer substrate.

[Explanation of symbols]

Reference Signs List 10A resin substrate (prepreg) 10B resin substrate (adhesive sheet) 11 porous resin layer 12 connection intermediate 13 through hole 14 conductor 15 metal foil 16 wiring layer 17 double-sided circuit board 18 core substrate 20 support substrate 21 wiring layer 22 protection Film layer 30 Resin substrate 25 Film substrate 30 Adhesive resin layer 31 Insulating particles 32 Insulating particle layer 50 Resin substrate 51 Depression 60 Compression functional layer 100 Pre-preg 101 Adhesive sheet 102 Adhesive layer 103 Hole group 104 Hole 50 Resin Substrate 51 Depression 52 Resin component

Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat II (Reference) H05K 3/40 H05K 3/40 K (72) Inventor Yoshihiro Kawakita 1006 Kazuma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Inventor Koji Nakagiri 1006 Kazuma Kadoma, Kadoma City, Osaka Prefecture Inside Matsushita Electric Industrial Co., Ltd. AR00A AT00B BA02 BA07 DC11 DJ00A DJ03A GB43 JB15B JG01 JG04 JK07A 5E317 AA24 BB01 BB11 CC25 CD32 GG11 5E346 AA02 AA12 AA15 AA32 AA38 AA43 BB01 CC02 CC08 CC31 DD02 DD32 EE02 EE06 FF19 GG07

Claims (30)

[Claims] 1. A resin substrate used for an insulator layer of a circuit board, wherein a compression function layer is provided on at least one substrate surface,
The compression functional layer provides a resin substrate including this layer with a function of compressing by receiving a pressure in a thickness direction of the substrate. 2. The resin substrate according to claim 1, wherein the compression function layer is a porous layer. 3. The porous layer has a group of holes, the group of holes is composed of a plurality of holes communicating with each other, and both ends of the group of holes are open on both sides of the porous layer. The resin substrate according to claim 2. 4. The resin substrate according to claim 1, wherein the compression functional layer is a layer of insulating particles provided on the resin substrate so as to protrude from the substrate surface. 5. The resin substrate according to claim 1, wherein the resin substrate has a semi-cured state at least on a surface on which the compression function layer is disposed. 6. The resin substrate according to claim 1, wherein a protective film layer is detachably provided on a further upper layer of the compression function layer. 7. A resin substrate used for an insulator layer of a circuit board, wherein at least one substrate surface is provided with a porous layer. 8. A connection intermediate disposed between both of the wiring layers facing each other and electrically connecting these wiring layers, the connection intermediate being provided on a surface of at least one substrate of the resin substrate. Compression functional layer, a through hole formed in the thickness direction of the resin substrate, and a conductor provided in the through hole, the compression functional layer, the connection intermediate including this layer, A connection intermediate that imparts the function of compressing under pressure in the thickness direction. 9. The intermediate connector according to claim 8, wherein the compression function layer is a porous layer. 10. The porous layer has a group of holes,
The intermediate connector according to claim 9, wherein the hole group includes a plurality of holes communicating with each other, and both ends of the hole group are open on both surfaces of the porous layer. 11. The intermediate connector according to claim 8, wherein the compression function layer is a layer of insulating particles provided on the resin substrate so as to protrude from the substrate surface. 12. The intermediate connector according to claim 8, wherein the resin substrate has a semi-cured state at least on a surface on which the compression function layer is disposed. 13. A connection intermediate disposed between two wiring layers facing each other and electrically connecting the wiring layers, the connection intermediate being provided on a resin substrate and at least one substrate surface of the resin substrate. A connection intermediate, comprising: a porous layer, a through hole formed in a thickness direction of the resin substrate, and a conductor provided in the through hole. 14. A resin substrate, a compression functional layer provided on at least one substrate surface of the resin substrate, a through hole formed in a thickness direction of the resin substrate, and a conductor provided in the through hole And a wiring layer provided on both surfaces of the resin substrate and electrically connected to each other via the conductor. The compression function layer is formed on the resin substrate including this layer in a substrate thickness direction. A circuit board that provides a function of compressing under pressure. 15. The circuit board according to claim 14, wherein the compression function layer is a porous layer. 16. The porous layer has a group of holes,
The hole group is composed of a plurality of holes communicating with each other,
The circuit board according to claim 15, wherein both ends of the hole group are open on both sides of the porous layer. 17. The circuit board according to claim 15, wherein the size of the pores in the porous layer is smaller than the minimum spacing between the adjacent through holes. 18. The circuit board according to claim 14, wherein the compression functional layer is a layer of insulating particles provided on the resin substrate so as to protrude from the substrate surface. 19. A resin substrate, a porous layer provided on at least one substrate surface of the resin substrate, a through hole formed in a thickness direction of the resin substrate, and a conductor provided in the through hole And a wiring layer provided on both surfaces of the resin substrate and electrically connected to each other via the conductor. 20. A method of manufacturing a resin substrate, comprising a step of providing a compression functional layer on at least one substrate surface of the resin substrate. 21. The method for manufacturing a resin substrate according to claim 20, further comprising a step of removably providing a protective film layer on the compression function layer. 22. A step of disposing a porous layer on at least one substrate surface of a resin substrate; and applying a pressure to the resin substrate such that a resin component of the resin substrate does not enter pores of the porous layer. By applying
Pressing the porous layer to the resin substrate. 23. A step of disposing a porous layer on at least one substrate surface of a resin substrate; a step of forming a through hole in a thickness direction of the resin substrate; and a step of filling a conductor in the through hole. A step of arranging a wiring layer or a metal foil on at least one substrate surface of the resin substrate, and pressing the resin substrate in a thickness direction of the resin substrate so that the resin component of the resin substrate is in the pores of the porous layer. And c. Compressing the resin substrate by invading the resin substrate. 24. The method for manufacturing a circuit board according to claim 23, wherein a resin substrate having at least a porous layer arrangement surface in a semi-cured state is used as the resin substrate. 25. The method according to claim 25, further comprising: providing a protective film layer on a surface of the resin substrate as a pre-treatment of the step of forming the through-hole. The method for manufacturing a circuit board according to claim 23, further comprising a step of removing the film layer. 26. The method according to claim 23, wherein the step of disposing the porous layer on the resin substrate is omitted by using the resin substrate having the porous layer on at least one substrate surface. A method for manufacturing a circuit board. 27. A step of disposing a porous layer on at least one substrate surface of a resin substrate; a step of disposing a wiring layer or a metal foil on one substrate surface of the resin substrate; A step of forming a through hole reaching the wiring layer or the metal foil on the surface of the substrate; a step of filling the through hole with a conductor; and disposing another wiring layer or the metal foil on the other surface of the resin substrate. And compressing the resin substrate by pressing the resin substrate in the thickness direction to cause the resin component of the resin substrate to enter the pores of the porous layer and compress the resin substrate. Production method. 28. The method for manufacturing a circuit board according to claim 27, wherein a resin substrate having at least a surface on which a porous layer is arranged is in a semi-cured state is used as the resin substrate. 29. The method according to claim 29, further comprising: providing a protective film layer on the surface of the other substrate of the resin substrate as a pre-treatment before the step of forming the through-hole. The method for manufacturing a circuit board according to claim 27, further comprising a step of removing the protective film layer as a pretreatment. 30. The method according to claim 27, wherein the step of arranging the porous layer on the resin substrate is omitted by using the resin substrate having the porous layer on at least one substrate surface. A method for manufacturing a circuit board.