JP2002176237A - Printed wiring board - Google Patents
Printed wiring boardInfo
- Publication number
- JP2002176237A JP2002176237A JP2000371707A JP2000371707A JP2002176237A JP 2002176237 A JP2002176237 A JP 2002176237A JP 2000371707 A JP2000371707 A JP 2000371707A JP 2000371707 A JP2000371707 A JP 2000371707A JP 2002176237 A JP2002176237 A JP 2002176237A
- Authority
- JP
- Japan
- Prior art keywords
- diameter
- interlayer conductive
- resin layer
- wiring board
- insulating resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【技術分野】本発明は，絶縁樹脂層の上下面を電気的に
導通させる層間導電部を有するプリント配線板に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board having an interlayer conductive portion for electrically connecting upper and lower surfaces of an insulating resin layer.
【０００２】[0002]
【従来技術】従来より，図４（Ａ）に示すごとく，絶縁
樹脂層９２にスルーホール９２５を形成し，その内壁に
メッキを施すことにより，上記絶縁樹脂層９２の上下面
の電気的導通を図るための層間導電部９４を設けたプリ
ント配線板９がある。該プリント配線板９は，絶縁樹脂
層９２の上面９２２及び下面９２３に導体配線９３を有
する。該導体配線９３は，上記層間導電部９４の上下に
接続するためのランド部９３１を有する。2. Description of the Related Art Conventionally, as shown in FIG. 4A, a through hole 925 is formed in an insulating resin layer 92, and the inner wall thereof is plated to conduct electrical conduction between the upper and lower surfaces of the insulating resin layer 92. There is a printed wiring board 9 provided with an interlayer conductive portion 94 for the purpose. The printed wiring board 9 has the conductor wiring 93 on the upper surface 922 and the lower surface 923 of the insulating resin layer 92. The conductor wiring 93 has a land portion 931 for connecting above and below the interlayer conductive portion 94.
【０００３】[0003]
【解決しようとする課題】しかしながら，上記ランド部
９３１の直径Ｒ３は，図４（Ａ），（Ｂ）に示すごと
く，上記スルーホール９２５の直径，即ち層間導電部９
４の直径Ｒ２よりも大きい。それ故，上記絶縁樹脂層９
２の上面９２２又は下面９２３において上記ランド部９
３１の占める面積が大きくなり，配線間隔９３を狭くす
ることが困難となる（図３（Ｂ）参照）。その結果，高
密度配線が困難となるおそれがある。However, as shown in FIGS. 4A and 4B, the diameter R3 of the land 931 is equal to the diameter of the through hole 925, that is, the interlayer conductive part 93.
4 is larger than the diameter R2. Therefore, the insulating resin layer 9
2 on the upper surface 922 or the lower surface 923
The area occupied by 31 increases, and it is difficult to reduce the wiring interval 93 (see FIG. 3B). As a result, high-density wiring may be difficult.
【０００４】また，上記のごとくランド部９３１の直径
Ｒ３が大きいと，図４（Ｂ）に示すごとく，上記導体配
線９３のライン部９３２の線幅よりもランド部９３１の
直径Ｒ３を大きくすることとなる場合がある。この場
合，図４（Ｂ）に示すごとく，上記導体配線９３のライ
ン部９３２とランド部９３１との境界部９３３における
外形が屈曲した状態となり応力が集中しやすい。それ
故，この境界部９３３において，上記導体配線９３に亀
裂９３９を生じ易くなり，導通不良の原因となるおそれ
があるという問題もある。If the diameter R3 of the land portion 931 is large as described above, the diameter R3 of the land portion 931 must be larger than the line width of the line portion 932 of the conductor wiring 93 as shown in FIG. It may be. In this case, as shown in FIG. 4B, the outer shape of the boundary portion 933 between the line portion 932 and the land portion 931 of the conductor wiring 93 is in a bent state, and stress tends to concentrate. Therefore, at the boundary portion 933, there is a problem that a crack 939 is easily generated in the conductor wiring 93, which may cause a conduction failure.
【０００５】本発明は，かかる従来の問題点に鑑みてな
されたもので，導通不良が生じ難く，高密度配線を可能
とするプリント配線板を提供しようとするものである。The present invention has been made in view of such a conventional problem, and an object of the present invention is to provide a printed wiring board which does not easily cause conduction failure and enables high-density wiring.
【０００６】[0006]
【課題の解決手段】請求項１に記載の発明は，絶縁樹脂
層と，該絶縁樹脂層の上面及び下面の少なくとも一方に
配設された導体配線と，上記絶縁樹脂層に埋め込まれた
メタル片によって構成されると共に上記絶縁樹脂層の上
下面を電気的に導通させる層間導電部とを有するプリン
ト配線板であって，上記導体配線は，上記層間導電部の
上面又は下面に接続するためのランド部を有し，該ラン
ド部の最大径は上記層間導電部の直径以下であることを
特徴とするプリント配線板にある。According to a first aspect of the present invention, there is provided an insulating resin layer, a conductor wiring disposed on at least one of an upper surface and a lower surface of the insulating resin layer, and a metal piece embedded in the insulating resin layer. And an interlayer conductive part for electrically connecting the upper and lower surfaces of the insulating resin layer, wherein the conductive wiring is a land for connecting to the upper or lower surface of the interlayer conductive part. And a maximum diameter of the land portion is equal to or less than a diameter of the interlayer conductive portion.
【０００７】本発明において最も注目すべきことは，上
記ランド部の直径が上記層間導電部の直径以下であるこ
とである。なお，本明細書において，上記ランド部の最
大径とは，上記ランド部の幅が最大となる向きに関する
幅をいい，例えば，上記ランド部が円形の場合はその直
径をいい，上記ランド部が長方形の場合はその対角線の
長さをいう。What is most notable in the present invention is that the diameter of the land portion is smaller than the diameter of the interlayer conductive portion. In the present specification, the maximum diameter of the land portion refers to the width in the direction in which the width of the land portion is maximum. For example, when the land portion is circular, it refers to its diameter. In the case of a rectangle, it refers to the length of the diagonal line.
【０００８】次に，本発明の作用効果につき説明する。
上記プリント配線板は，上記のごとく，導体配線のラン
ド部の直径が上記層間導電部の直径以下である。そのた
め，上記導体配線のライン部を狭い間隔で形成しても，
上記ランド部が他の導体配線に接近しすぎるおそれがな
い（図３（Ａ）参照）。それ故，高密度配線が可能とな
る。Next, the function and effect of the present invention will be described.
In the printed wiring board, as described above, the diameter of the land portion of the conductor wiring is equal to or smaller than the diameter of the interlayer conductive portion. Therefore, even if the line portions of the conductor wiring are formed at narrow intervals,
There is no possibility that the land portion gets too close to other conductor wiring (see FIG. 3A). Therefore, high-density wiring becomes possible.
【０００９】また，上記のごとくランド部の直径が上記
層間導電部よりも小さいため，上記ランド部の直径を，
上記導体配線のライン部の線幅と同等とすることができ
る。これにより，上記導体配線を，ライン部とランド部
とが連続した外形となるように形成することができる。
この場合には，上記ライン部とランド部との間に，屈曲
部等の形状的な境界部が特になく，応力が集中する部分
が特に存在しない。従って，上記導体配線は，亀裂を生
じ難く，導通不良を防ぐことができる。Further, as described above, the diameter of the land is smaller than that of the interlayer conductive part.
It can be made equal to the line width of the line portion of the conductor wiring. Thus, the conductor wiring can be formed so that the line portion and the land portion have a continuous outer shape.
In this case, there is no particular boundary between the line portion and the land portion, such as a bent portion or the like, and there is no particular portion where stress concentrates. Therefore, the conductor wiring is less likely to crack, and can prevent poor conduction.
【００１０】以上のごとく，本発明によれば，導通不良
が生じ難く，高密度配線を可能とするプリント配線板を
提供することができる。As described above, according to the present invention, it is possible to provide a printed wiring board in which poor conduction hardly occurs and which enables high-density wiring.
【００１１】次に，請求項２に記載の発明のように，上
記ランド部の最大径は，上記層間導電部の直径の０．６
〜０．９倍であることが好ましい。これにより，一層確
実に高密度配線のプリント配線板を得ることができる。
上記ランド部の直径が上記層間導電部の直径の０．６倍
未満の場合には，上記ランド部と上記層間導電部との密
着力が小さくなるおそれがある。一方，上記ランド部の
直径が上記層間導電部の直径の０．９倍を超える場合に
は，上記ランド部が，上記層間導電部の上面又は下面か
らはみ出て，結果的に配線エリアを小さくしてしまうお
それがある。また，最悪の場合にはショートの原因とな
るおそれがあり，その結果，高密度配線が困難となるお
それがある。Next, the maximum diameter of the land portion is 0.6 times the diameter of the interlayer conductive portion.
It is preferably 0.9 times. This makes it possible to more reliably obtain a printed wiring board having high-density wiring.
If the diameter of the land portion is less than 0.6 times the diameter of the interlayer conductive portion, the adhesion between the land portion and the interlayer conductive portion may be reduced. On the other hand, when the diameter of the land portion exceeds 0.9 times the diameter of the interlayer conductive portion, the land portion protrudes from the upper or lower surface of the interlayer conductive portion, and as a result, the wiring area is reduced. There is a risk that it will. In the worst case, a short circuit may be caused, and as a result, high-density wiring may be difficult.
【００１２】なお，上記ランド部は，円形や半円形であ
る必要は必ずしもなく，長方形その他の形状であっても
よい。その場合には，上記ランド部と層間導電層との接
合面積は，上記層間導電層の上面又は下面の面積の少な
くとも４０％を越えていることが好ましい。The lands need not necessarily be circular or semicircular, but may be rectangular or other shapes. In this case, it is preferable that the bonding area between the land and the interlayer conductive layer exceeds at least 40% of the area of the upper or lower surface of the interlayer conductive layer.
【００１３】[0013]
【発明の実施の形態】実施形態例１ 本発明の実施形態例にかかるプリント配線板１につき，
図１〜図３を用いて説明する。本例のプリント配線板１
は，図１（Ａ）に示すごとく，絶縁樹脂層２と，該絶縁
樹脂層２の上面２２及び下面２３に配設された導体配線
３と，上記絶縁樹脂層２の上下面を電気的に導通させる
層間導電部４とを有する。該層間導電部４は，上記絶縁
樹脂層２に埋め込まれたメタル片４１によって構成され
ている。DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiment 1 A printed wiring board 1 according to an embodiment of the present invention will be described.
This will be described with reference to FIGS. Printed wiring board 1 of this example
As shown in FIG. 1A, the insulating resin layer 2, the conductor wiring 3 disposed on the upper surface 22 and the lower surface 23 of the insulating resin layer 2, and the upper and lower surfaces of the insulating resin layer 2 are electrically connected. And an interlayer conductive portion 4 for conducting. The interlayer conductive part 4 is constituted by a metal piece 41 embedded in the insulating resin layer 2.
【００１４】上記導体配線３は，図１（Ｂ）に示すごと
く，上記層間導電部４の上面又は下面に接続するための
ランド部３１を有する。そして，図１（Ａ），（Ｂ）に
示すごとく，該ランド部３１の直径Ｒ１は上記層間導電
部４の直径Ｒ２以下である。具体的には，上記ランド部
の直径Ｒ１は１２０μｍ，上記層間導電部４の直径Ｒ２
は１５０μｍであって，上記ランド部の直径Ｒ１は上記
層間導電部４の直径Ｒ２の０．８倍である。なお，図１
（Ｂ）に示すごとく，上記導体配線３のライン部３２の
線幅は上記ランド部３１の直径Ｒ１と同じである。As shown in FIG. 1B, the conductor wiring 3 has a land portion 31 for connecting to the upper or lower surface of the interlayer conductive portion 4. As shown in FIGS. 1A and 1B, the diameter R1 of the land portion 31 is smaller than the diameter R2 of the interlayer conductive portion 4. Specifically, the diameter R1 of the land portion is 120 μm, and the diameter R2 of the interlayer conductive portion 4 is R2.
Is 150 μm, and the diameter R1 of the land portion is 0.8 times the diameter R2 of the interlayer conductive portion 4. Note that FIG.
As shown in (B), the line width of the line portion 32 of the conductor wiring 3 is the same as the diameter R1 of the land portion 31.
【００１５】上記プリント配線板１は，以下のようにし
て上記層間導電部４を形成することにより製造する。即
ち，図２（Ａ）に示すごとく，まず，絶縁樹脂層２の両
面に銅箔２１を貼着してなる銅張板２０と，メタルプレ
ート４０とを，開口部５１を有するダイ５の上面５２に
順次載置する。The printed wiring board 1 is manufactured by forming the interlayer conductive portion 4 as follows. That is, as shown in FIG. 2A, first, a copper clad plate 20 in which copper foil 21 is adhered to both surfaces of the insulating resin layer 2 and a metal plate 40 are attached to the upper surface of the die 5 having an opening 51. 52 are sequentially placed.
【００１６】次いで，図２（Ｂ）に示すごとく，上記ダ
イ５の開口部５１に挿通可能な大きさの打ち抜き手段６
１によって，上記メタルプレート４０からメタル片４１
を下方へ打ち抜くと共に，上記銅張板２０から基板片２
９を下方へ打ち抜いて銅張板２０に貫通穴２５を形成す
る。Next, as shown in FIG. 2B, a punching means 6 having a size that can be inserted into the opening 51 of the die 5 is used.
1, the metal piece 41 is removed from the metal plate 40.
From the copper clad plate 20 and the substrate piece 2
9 is punched downward to form a through hole 25 in the copper clad plate 20.
【００１７】次いで，図２（Ｃ）に示すごとく，上記ダ
イ５の下方に配置された埋め込み手段６２によって，上
記メタル片４１を下方から押し上げて，上記貫通穴２５
に埋め込む。上記埋め込み手段６２は，上記基板片２９
を介して上記メタル片４１を押し上げる。そして，上記
基板片２９は，メタル片４１の埋め込み後に除去する。Next, as shown in FIG. 2C, the metal piece 41 is pushed up from below by the embedding means 62 arranged below the die 5, and the through hole 25 is formed.
Embed in The embedding means 62 is provided with the substrate piece 29.
The metal piece 41 is pushed up through. Then, the substrate piece 29 is removed after the metal piece 41 is embedded.
【００１８】これにより，図１（Ａ）に示すごとく，上
記絶縁樹脂層２の上下面の電気的導通を図るための層間
導電部４を形成する。即ち，上記のごとく上記絶縁樹脂
層２に埋め込まれたメタル片４１が，上記層間導電部４
を構成している。その後，上記絶縁樹脂層２の両面にエ
ッチング，メッキ等を行うことにより，導体配線３を形
成し，図１（Ａ）に示すプリント配線板１を製造する。Thus, as shown in FIG. 1A, an interlayer conductive portion 4 for electrically connecting the upper and lower surfaces of the insulating resin layer 2 is formed. That is, the metal piece 41 embedded in the insulating resin layer 2 as described above is
Is composed. Thereafter, the conductor wiring 3 is formed by performing etching, plating, and the like on both surfaces of the insulating resin layer 2 to manufacture the printed wiring board 1 shown in FIG.
【００１９】次に，本例の作用効果につき説明する。上
記プリント配線板１は，上記のごとく，導体配線３のラ
ンド部３１の直径Ｒ１が上記層間導電部４の直径Ｒ２以
下である。そのため，図３（Ａ）に示すごとく，上記導
体配線３のライン部３２を狭い間隔で形成しても，上記
ランド部３１が他の導体配線３と接近しすぎるおそれが
ない。それ故，高密度配線が可能となる。Next, the operation and effect of this embodiment will be described. As described above, in the printed wiring board 1, the diameter R1 of the land portion 31 of the conductor wiring 3 is smaller than the diameter R2 of the interlayer conductive portion 4. Therefore, as shown in FIG. 3A, even if the line portions 32 of the conductor wiring 3 are formed at a narrow interval, there is no possibility that the land portion 31 is too close to another conductor wiring 3. Therefore, high-density wiring becomes possible.
【００２０】即ち，仮に図３（Ｂ）に示す従来例のよう
に導体配線９３のランド部９３１の直径Ｒ３を層間導電
部９４の直径Ｒ２よりも大きくした場合，隣り合うラン
ド部９３１の間に絶縁を確保するために必要な間隔Ａを
設けると，ライン部９３２の間隔Ｂ２が広くなる。その
ために，高密度配線が困難となる。That is, if the diameter R3 of the land portion 931 of the conductor wiring 93 is made larger than the diameter R2 of the interlayer conductive portion 94 as in the conventional example shown in FIG. When the interval A necessary for securing insulation is provided, the interval B2 between the line portions 932 is increased. Therefore, high-density wiring becomes difficult.
【００２１】これに対し，図３（Ａ）に示すごとく，本
発明のプリント配線板１の場合には，隣り合うランド部
３１の間隔が隣り合う層間導電部４の間隔よりも狭くな
ることがない。そのため，図３（Ａ）に示すごとく，隣
り合う層間導電部４の間に間隔Ａを設けても，ライン部
３２の間隔Ｂ１が大きく広がることはない。その結果，
高密度配線が可能となる。On the other hand, as shown in FIG. 3A, in the case of the printed wiring board 1 of the present invention, the interval between the adjacent land portions 31 may be smaller than the interval between the adjacent interlayer conductive portions 4. Absent. Therefore, as shown in FIG. 3A, even if the interval A is provided between adjacent interlayer conductive portions 4, the interval B1 between the line portions 32 does not greatly increase. as a result,
High-density wiring becomes possible.
【００２２】また，上記のごとくランド部３１の直径Ｒ
１が上記層間導電部４よりも小さいため，上記ランド部
３１の直径Ｒ１が，上記導体配線３のライン部３２の線
幅と同等とすることができる。これにより，図１（Ｂ）
に示すごとく，上記導体配線３を，ライン部３２とラン
ド部３１とが連続した外形となるように形成することが
できる。この場合には，上記ライン部３２とランド部３
１との間に，屈曲部等の形状的な境界部が特になく，応
力が集中する部分が特に存在しない。従って，上記導体
配線３は，亀裂を生じ難く，導通不良を防ぐことができ
る。Further, as described above, the diameter R of the land portion 31 is determined.
Since 1 is smaller than the interlayer conductive part 4, the diameter R1 of the land part 31 can be made equal to the line width of the line part 32 of the conductor wiring 3. As a result, FIG.
As shown in (1), the conductor wiring 3 can be formed so that the line portion 32 and the land portion 31 have a continuous outer shape. In this case, the line portion 32 and the land portion 3
There is no particular shape boundary such as a bent portion between the first portion and the first portion, and there is no particular portion where stress concentrates. Accordingly, the conductor wiring 3 is less likely to crack and can prevent poor conduction.
【００２３】また，上記ランド部３１の直径Ｒ１は，上
記層間導電部４の直径Ｒ２の０．８倍であるため，一層
確実に高密度配線のプリント配線板１を得ることができ
る。即ち，上記ランド部３１と上記層間導電部４との密
着力を確保すると共に，上記ランド部３１を，上記層間
導電部４の上面又は下面からはみ出さないよう形成して
ショートを防ぐことが容易となる。Further, since the diameter R1 of the land portion 31 is 0.8 times the diameter R2 of the interlayer conductive portion 4, the printed wiring board 1 of high-density wiring can be obtained more reliably. That is, while ensuring the adhesion between the land portion 31 and the interlayer conductive portion 4, the land portion 31 is formed so as not to protrude from the upper or lower surface of the interlayer conductive portion 4 to easily prevent a short circuit. Becomes
【００２４】[0024]
【発明の効果】上述のごとく，本発明によれば，導通不
良が生じ難く，高密度配線を可能とするプリント配線板
を提供することができる。As described above, according to the present invention, it is possible to provide a printed wiring board which does not easily cause a conduction failure and enables high-density wiring.
【図１】実施形態例１における，（Ａ）プリント配線板
の断面説明図，（Ｂ）プリント配線板の上面から見た層
間導電部と導体配線の平面図。FIG. 1A is a cross-sectional explanatory view of a printed wiring board according to a first embodiment, and FIG. 1B is a plan view of an interlayer conductive portion and a conductive wiring viewed from the upper surface of the printed wiring board.
【図２】実施形態例１における，（Ａ）メタル片と基板
片の打ち抜き前，（Ｂ）打ち抜き後，（Ｃ）メタル片の
埋め込み後の状態をそれぞれ表す，プリント配線板の製
造方法の説明図。FIG. 2 is a diagram illustrating a method of manufacturing a printed wiring board according to the first embodiment, showing a state before (A) punching of a metal piece and a substrate piece, (B) after punching, and (C) after embedding of a metal piece. FIG.
【図３】実施形態例１における，（Ａ）本発明のプリン
ト配線板の導体配線，（Ｂ）従来の導体配線の説明図。FIG. 3 is an explanatory view of (A) a conductor wiring of a printed wiring board of the present invention and (B) a conventional conductor wiring in the first embodiment.
【図４】従来例における，（Ａ）プリント配線板の断面
説明図，（Ｂ）プリント配線板の上面から見た層間導電
部と導体配線の平面図。4A is a cross-sectional explanatory view of a printed wiring board in a conventional example, and FIG. 4B is a plan view of an interlayer conductive portion and a conductive wiring viewed from the upper surface of the printed wiring board.
１．．．プリント配線板， ２．．．絶縁樹脂層， ２２．．．上面， ２３．．．下面， ３．．．導体配線， ３１．．．ランド部， ３２．．．ライン部， ４．．．層間導電部， ４１．．．メタル片， 1. . . 1. printed wiring board, . . Insulating resin layer, 22. . . Top surface, 23. . . Lower surface, 3. . . Conductor wiring, 31. . . Land part, 32. . . Line section, 4. . . 41. interlayer conductive portion; . . Metal pieces,
Claims (2)
下面の少なくとも一方に配設された導体配線と，上記絶
縁樹脂層に埋め込まれたメタル片によって構成されると
共に上記絶縁樹脂層の上下面を電気的に導通させる層間
導電部とを有するプリント配線板であって，上記導体配
線は，上記層間導電部の上面又は下面に接続するための
ランド部を有し，該ランド部の最大径は上記層間導電部
の直径以下であることを特徴とするプリント配線板。An insulating resin layer, a conductor wiring disposed on at least one of an upper surface and a lower surface of the insulating resin layer, and a metal piece embedded in the insulating resin layer; What is claimed is: 1. A printed wiring board having an interlayer conductive portion for electrically connecting upper and lower surfaces, wherein the conductor wiring has a land portion for connection to an upper surface or a lower surface of the interlayer conductive portion. A printed wiring board, wherein the diameter is equal to or less than the diameter of the interlayer conductive portion.
径は，上記層間導電部の直径の０．６〜０．９倍である
ことを特徴とするプリント配線板。2. The printed wiring board according to claim 1, wherein the maximum diameter of the land is 0.6 to 0.9 times the diameter of the interlayer conductive part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000371707A JP2002176237A (en) | 2000-12-06 | 2000-12-06 | Printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000371707A JP2002176237A (en) | 2000-12-06 | 2000-12-06 | Printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2002176237A true JP2002176237A (en) | 2002-06-21 |
Family
ID=18841387
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000371707A Pending JP2002176237A (en) | 2000-12-06 | 2000-12-06 | Printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002176237A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0621649A (en) * | 1992-04-03 | 1994-01-28 | Internatl Business Mach Corp <Ibm> | Multilayer ultrasmall electronic-circuit module and its formation method |
| JPH06104545A (en) * | 1992-09-22 | 1994-04-15 | Matsushita Electric Ind Co Ltd | Both-sided printed board and production thereof |
| JPH1084186A (en) * | 1996-09-06 | 1998-03-31 | Matsushita Electric Ind Co Ltd | Manufacturing method of interconnection board and interconnection board |
| JPH1093242A (en) * | 1996-09-18 | 1998-04-10 | Toshiba Corp | Printed wiring board |
| JPH11103165A (en) * | 1997-09-29 | 1999-04-13 | Kyocera Corp | Multilayered wiring board and its manufacture |
-
2000
- 2000-12-06 JP JP2000371707A patent/JP2002176237A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0621649A (en) * | 1992-04-03 | 1994-01-28 | Internatl Business Mach Corp <Ibm> | Multilayer ultrasmall electronic-circuit module and its formation method |
| JPH06104545A (en) * | 1992-09-22 | 1994-04-15 | Matsushita Electric Ind Co Ltd | Both-sided printed board and production thereof |
| JPH1084186A (en) * | 1996-09-06 | 1998-03-31 | Matsushita Electric Ind Co Ltd | Manufacturing method of interconnection board and interconnection board |
| JPH1093242A (en) * | 1996-09-18 | 1998-04-10 | Toshiba Corp | Printed wiring board |
| JPH11103165A (en) * | 1997-09-29 | 1999-04-13 | Kyocera Corp | Multilayered wiring board and its manufacture |
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