JP2002169263A - Photomask and method of manufacturing for the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a photomask which is excellent in scratching resistance, solvent resistance, adhesion property to a transparent plate, such as a glass plate, cutting of images, etc., and simultaneously satisfies various requirements, such as the stabilization of dimensional accuracy, higher resolution for manufacturing of components of high fineness and the durability accompanying mass production and a method of manufacturing for the same. SOLUTION: This photomask is constituted by successively forming an acid soluble UV light shielding layer 2 and an acid resistant photosensitive resin layer 3 on a glass plate 1, forming UV shieldable images 2a by etching on the UV light shielding layer 2 and forming images 3a of the same patterns as the patterns of the images 2a on the photosensitive resin layer 3.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a photomask suitably used in a photolithography process using a photomechanical technology and a method for manufacturing the same, and more particularly to a scratch resistance, a solvent resistance and a transparent plate such as a glass plate. The present invention relates to a photomask excellent in adhesiveness, image cutting, and the like, and a method for manufacturing the same.

[0002]

2. Description of the Related Art In recent years, in the electronic component industry, the electric industry, and the like, the size of processing units for increasing efficiency in the manufacturing process, the size of electric products, the dimensional accuracy has been stabilized, and the production of high-definition components has been advanced. Therefore, high resolution and the like are required for photolithography, and therefore, a photomask used in a photolithography process is also required to have stable dimensional accuracy, high resolution, durability accompanying mass production, and the like.

There are the following photomasks conventionally used. A silver salt film type photomask in which a silver salt is dispersed in a gelatin layer on a polyester film. A silver salt glass dry plate type photomask in which a silver salt is dispersed in a gelatin layer on a glass plate. A thin metal chromium layer and a photosensitive resin layer were sequentially formed on a glass plate, the metal chrome layer was etched using an image pattern drawn on the photosensitive resin layer as a mask, and then the photosensitive resin layer was removed. Metal chrome based photomask.

[0004]

However, the conventional photomask has the following problems. In silver halide film-based photomasks, the polyester film and gelatin layer expand and contract due to changes in temperature and humidity, making it difficult to stabilize the dimensional accuracy and increase the accuracy of the image. Difficult to respond to. In addition, there is a problem in scratch resistance. In silver salt glass dry plate photomasks, although the elasticity due to changes in temperature and humidity is improved,
There are problems with high resolution and scratch resistance. Metal chromium-based photomasks have improved elasticity and higher resolution due to changes in temperature and humidity, but have a problem in abrasion resistance.

The present invention has been made in view of the above circumstances, and is excellent in abrasion resistance, solvent resistance, adhesion to a transparent plate such as a glass plate and the like, cutting of an image, and the like. An object of the present invention is to provide a photomask which can simultaneously satisfy various requirements such as stabilization, high resolution for producing high-definition parts, and durability accompanying mass production, and a method for manufacturing the same.

[0006]

In order to solve the above problems, the present invention employs the following photomask and a method for manufacturing the same. That is, the photomask according to claim 1 is characterized in that an acid-soluble ultraviolet light shielding layer is formed on a transparent plate, and an ultraviolet light shielding image is formed on the ultraviolet light shielding layer.

In this photomask, an ultraviolet light shielding layer having an ultraviolet light shielding image is formed on a transparent plate, so that the ultraviolet light shielding layer is free from expansion and contraction due to a change in temperature or humidity. Further, the presence or absence of the ultraviolet light shielding image becomes clear. This makes it possible to stabilize dimensional accuracy, increase image accuracy, and improve abrasion resistance.

[0008] The photomask according to the second aspect is the first aspect.
In the photomask according to the above, on the ultraviolet light shielding layer,
An acid-resistant photosensitive resin layer is formed, and an image having the same pattern as the image of the ultraviolet light shielding layer is formed on the photosensitive resin layer.

According to a third aspect of the present invention, there is provided a photomask.
Or the photomask according to item 2, wherein an opening of the image of the ultraviolet light shielding layer and / or an opening of the image of the photosensitive resin layer are filled with a translucent substance.

In this photomask, the opening of the image of the ultraviolet light shielding layer and / or the opening of the image of the photosensitive resin layer are filled with a translucent substance. Reinforced and improved mechanical strength.

According to a fourth aspect of the present invention, in the photomask according to the first, second or third aspect, the ultraviolet light shielding layer contains an acid-soluble resin and an ultraviolet light shielding substance. I do.

According to a fifth aspect of the present invention, there is provided a photomask.
The photomask according to the above, wherein the acid-soluble resin is an amine-containing acid-soluble resin. The amine contained in the amine-containing acid-soluble resin includes 1
Any of primary, secondary and tertiary amines may be used.

[0013] The photomask according to claim 6 is a photomask according to claim 5.
The photomask according to the above, wherein the amine-containing acid-soluble resin has an amine equivalent of 100 to 10,000. The amine equivalent is defined by the molecular weight per mole of amine in the amine-containing acid-soluble resin.

Here, the amine equivalent is 100 to 10,000.
The reason is that if the amine equivalent is less than 100,
When the etching rate of the ultraviolet light-shielding layer by the acid becomes too high, it becomes difficult to control the etching rate, and it is difficult to stabilize the dimensional accuracy and increase the accuracy of the image. When the amine equivalent exceeds 10,000, This is because etching with an acid becomes difficult. A more preferred range of the amine equivalent is 200 to 2000.

According to a seventh aspect of the present invention, there is provided a photomask.
7. The photomask according to claim 1, wherein
The ultraviolet light shielding layer contains a thermosetting resin. By including this thermosetting resin in the ultraviolet light shielding layer, the adhesion of the ultraviolet light shielding layer is improved,
Its hardness increases. This makes it possible to improve the adhesion and durability of the ultraviolet light shielding layer.

The photomask according to claim 8 is the photomask according to claim 7.
The photomask according to the item, wherein the ultraviolet light shielding layer contains a microwave-induced heating substance. In this photomask, when the ultraviolet light-shielding layer is irradiated with microwaves, the microwave-induced heat-generating substance contained in the ultraviolet light-shielding layer absorbs the microwaves and generates heat. The curable resin cures. Thereby, the hardness of the ultraviolet light shielding layer is increased, and the adhesion and durability of the ultraviolet light shielding layer can be improved.

The photomask according to the ninth aspect is characterized in that an acid-soluble conductive layer is formed on a transparent plate, and a conductive image is formed on the conductive layer. In this photomask, since the conductive layer having the conductive image is formed on the transparent plate, there is no possibility that the conductive layer may expand or contract due to a change in temperature or a change in humidity. Further, the presence or absence of the conductive image becomes clear. This makes it possible to stabilize dimensional accuracy, increase image accuracy, and improve abrasion resistance.

According to a tenth aspect of the present invention, there is provided the photomask according to the ninth aspect, wherein an acid-resistant photosensitive resin layer is formed on the ultraviolet light shielding layer, and the photosensitive resin layer is coated with the ultraviolet light shielding layer. It is characterized in that an image having the same pattern as the image is formed.

The photomask according to claim 11 is the photomask according to claim 9 or 10, wherein the conductive layer contains an acid-soluble resin and a conductive substance.

According to a twelfth aspect of the present invention, there is provided a method for manufacturing a photomask, comprising sequentially forming an acid-soluble ultraviolet light shielding layer and an acid-resistant photosensitive resin layer on a transparent plate, and exposing the photosensitive resin. An image is formed on the photosensitive resin, and then the ultraviolet light shielding layer is selectively removed using the image of the photosensitive resin as a mask to form an ultraviolet light shielding image on the transparent plate.

In this method of manufacturing a photomask, an acid-soluble ultraviolet light shielding layer and an acid-resistant photosensitive resin layer are sequentially formed on a transparent plate, and then the photosensitive resin is irradiated with ultraviolet light through a transparent negative film or the like. Then, development is performed using a developer that does not corrode the ultraviolet light-shielding layer to form an acid-resistant image on the photosensitive resin. Next, using the photosensitive resin on which the acid-resistant image is formed as a mask, the ultraviolet light shielding layer is etched (selectively removed) using an acidic solution to form an image formed of the ultraviolet light shielding layer on the transparent plate.

This eliminates the possibility of expansion and contraction due to changes in temperature and humidity, and clarifies the presence or absence of an ultraviolet light-shielded image. As a result, it is possible to obtain a photomask in which dimensional accuracy is stabilized, image accuracy is improved, and scratch resistance is improved.

According to a thirteenth aspect of the present invention, in the method for manufacturing a photomask according to the twelfth aspect, the photosensitive resin is removed after forming the ultraviolet light shielding image. .

According to a fourteenth aspect of the present invention, there is provided the photomask manufacturing method according to the twelfth or thirteenth aspect, wherein the ultraviolet light shielding layer contains a thermosetting resin material, and the ultraviolet light shielding image is displayed. After the formation, the thermosetting resin material is cured by heating.

In this method of manufacturing a photomask, the hardness of the ultraviolet light shielding layer is increased by heating and curing the thermosetting resin material after forming the ultraviolet light shielding image, and the adhesion of the ultraviolet light shielding layer is improved. And durability is improved.

According to a fifteenth aspect of the present invention, there is provided the photomask manufacturing method according to the twelfth or thirteenth aspect, wherein the ultraviolet light shielding layer contains a microwave-induced heat generating substance, and the ultraviolet light shielding image is displayed. After the formation, the microwave induced heating substance is heated by microwaves, and the thermosetting resin material is heated and cured by heat generated from the microwave induced heating substance.

In this method of manufacturing a photomask, it is possible to heat and cure only the image formed of the ultraviolet light shielding layer by using microwaves as external energy. Thereby, energy saving can be achieved as compared with the case where the entire photomask is cured by heating. Further, since only the image formed of the ultraviolet light shielding layer is heated and cured, a change in temperature dimension due to heating of the transparent plate is small.

According to a sixteenth aspect of the present invention, in the method of manufacturing a photomask according to any one of the twelfth to fifteenth aspects, the laser beam is used instead of exposing the photosensitive resin. It is characterized by drawing directly on a photosensitive resin.

[0029]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of a photomask and a method for manufacturing the same according to the present invention will be described with reference to the drawings.

[First Embodiment] FIG. 1 shows a first embodiment of the present invention.
3 is a cross-sectional view showing a photomask according to the embodiment, wherein reference numeral 1 denotes a glass plate (transparent plate), 2 denotes an acid-soluble ultraviolet light shielding layer formed on the glass plate 1, and 3 denotes an ultraviolet light shielding layer 2. An acid-resistant photosensitive resin layer formed thereon. An opening is formed in the ultraviolet light shielding layer 2 by etching (selective removal) to form an ultraviolet light shielding image 2a, and an opening is formed in the photosensitive resin layer 3 by development (selective removal) to form the image 2a. The images 3a have the same pattern.

As a material of the glass plate 1, ultraviolet (U)
V) Transmissive borosilicate glass, sodium borosilicate glass, and the like are preferably used. Note that, instead of the glass plate 1, a lithium niobate (LiNbO ₃ ) single crystal plate, an ultraviolet (U)
V) A transmission type heat-resistant resin plate or the like may be used.

The ultraviolet light shielding layer 2 is a composite material in which an ultraviolet light shielding substance is dispersed in an acid-soluble resin. As the acid-soluble resin, an amine-containing acid-soluble resin is preferably used. Further, as the ultraviolet light shielding material, gold (A
u), metals such as silver (Ag), copper (Cu), zinc (Zn), chromium (Cr), nickel (Ni), and cobalt (Co), carbon (C), copper oxide (CuO), zinc oxide ( Z
nO), chromium oxide (Cr ₂ O ₃ ), nickel oxide (Ni
O), oxides of the above metals such as cobalt oxide (CoO),
Azo-based organic pigments, organic solvent dyes having an absorption band in the ultraviolet (UV) band, and the like are preferably used.

The ultraviolet light shielding layer 2 contains, for example, a thermosetting resin which is heated and cured by an external heat source such as an infrared lamp. Examples of the thermosetting resin include, for example, an epoxy resin that is a compound containing an epoxy group, a resin material containing an epoxy compound and a curing agent thereof, or a compound having an unsaturated double bond such as an acrylic monomer and a heat polymerization catalyst. The resin material containing is preferably used.

Examples of the epoxy compound include bisphenol A type epoxy resin; bisphenol F type epoxy resin; phenol novolak type epoxy resin; alicyclic epoxy resin; heterocyclic epoxy resin such as triglycidyl isocyanate and hydantoin epoxy; Bisphenol A type epoxy resin; propylene glycol-
Fatty acid epoxy resins such as diglycidyl ether and pentaerythritol-polyglycidyl ether; epoxy resins obtained by reacting aromatic, fatty acid or alicyclic carboxylic acids with epichlorohydrin; epoxy resins containing spiro ring; allylphenol novolak compounds Glycidyl ether type epoxy resin which is a reaction product of phenol and epichlorohydrin; Glycidyl ether type epoxy resin which is a reaction product of a diallyl bisphenol compound having an allyl group at an ortho position of each hydroxyl group of bisphenol A and epichlorohydrin; Glycidyl acrylates And the like.

The thermosetting resin is prepared by using a microwave.
Heat curing is also possible. In this case, the ultraviolet
For example, black iron oxide (iron sesquioxide: F
e _ThreeO_Four), Acicular titanium oxide (TiO)_Two) And other microwaves
Pre-dispersed microwave-induced heating material that absorbs heat and generates heat
You need to keep it. The photosensitive resin layer 3 is damaged by acid.
Materials that are difficult to eat, such as acid-resistant photoresist
Become.

The amine-containing acid-soluble resin has an amine equivalent of 100 to 10,000, more preferably 200 to 2
000, and the chemical formula is a resin represented by the following general formula (1).

Embedded image

In the formula (1), m and n represent the molar ratio of each component, and m = 1 to 99 and m + n = 100. R ₁ is an arbitrary divalent organic residue, R ₂ and R
₃ is an arbitrary monovalent organic residue, R _{4 to} R ₆ are a hydrogen, halogen or monovalent organic residue, and R _{7 to} R ₁₀ are a monovalent organic residue containing no hydrogen, halogen or amine. , Respectively. Here, R _{4 to} R ₆ may be the same or different. Also, R _{7 to} R ₁₀ may be the same or different.

Further preferred amine-containing acid-soluble resin is a resin whose chemical formula is represented by the following general formula (2).

Embedded image

In the formula (2), m and n each represent a molar ratio of each component, and m = 1 to 99 and m + n = 100. Further, R ₁ and R ₂ are hydrogen or a methyl group, R ₃
Represents an arbitrary divalent organic residue, R ₄ and R ₅ represent a hydrogen or an alkyl group, and R ₆ represents an arbitrary amine-free monovalent organic residue.

Such an amine-containing acid-soluble resin is a copolymer comprising an amine-containing structural unit and an amine-free structural unit. Examples of the monomer constituting the amine-containing structural unit include 2- (dimethylamino) ethyl methacrylate, 2- (diethylamino) ethyl methacrylate, 2- (dimethylamino) ethyl acrylate,
One or more monomers selected from amino group-containing methacrylates (acrylates) such as-(diethylamino) ethyl acrylate.

Examples of the monomer constituting the amine-free constituent unit include methyl methacrylate, ethyl methacrylate, butyl methacrylate, isobutyl methacrylate, lauryl methacrylate, methyl acrylate, ethyl acrylate, n-decyl methacrylate, and the like.
In addition to methacrylates (acrylates) such as 2-ethylhexyl methacrylate and isodecyl methacrylate, hydroxyalkyl methacrylates (acrylates) such as hydroxyethyl methacrylate, hydroxypropyl methacrylate, hydroxyethyl acrylate, and hydroxypropyl acrylate, acrylonitrile,
One or more monomers selected from styrene, hydroxystyrene, vinyl acetate, and the like.

Next, a method of manufacturing the photomask will be described with reference to FIG. First, as shown in FIG. 2A, an acid-soluble ultraviolet light-shielding material 11 was applied onto one main surface of the glass plate 1 by spin coating or the like. The ultraviolet light-shielding material 11 includes an acid-soluble resin such as the above-described amine-containing acid-soluble resin, a powdery ultraviolet light-shielding substance,
It contains a powdery thermosetting resin material.

The acid-soluble resin was synthesized by the following method. First, methyl methacrylate (MMA) 40
0 parts by weight, 2-hydroxyethyl methacrylate (HO
MA), 100 parts by weight of dimethylaminoethyl methacrylate (DMMA), 15 parts by weight of azobisisobutyronitrile, and 1000 parts by weight of ethylene glycol monoethyl ether.

Next, these were put into a 3-liter separable flask equipped with a cooler, thermometer and stirrer prepared in advance, and the solution in this flask was stirred for 60 minutes using a stirrer. The temperature was raised to 70 ° C. using a heating device such as a mantle heater. Then
The solution was stirred for 90 minutes while controlling the temperature of the solution at 70 to 73 ° C. to perform a polymerization reaction. Then, while stirring the solution, the temperature was raised to 110 ° C. to decompose excess polymerization catalyst, and then cooled to room temperature to obtain a transparent and viscous polymer solution as an acid-soluble resin. . The viscosity of this polymer solution was 4500 centipoise (25
° C), the average molecular weight was 52,000.

Further, carbon fine powder (product name: Raven 1035, manufactured by Colombian Carbon Japan Co., Ltd.) is used as a powdery ultraviolet light shielding material, and alicyclic epoxy resin (product name: celloxide 202) is used as a thermosetting resin material.
1. Daicel Chemical Industries, Ltd.).

Next, on this ultraviolet light shielding material 11,
An acid-resistant photosensitive resin material 12 was formed. Examples of the acid-resistant photosensitive resin material 12 include the following photosensitive resins. A protein substance such as casein / shellac and a dichromate type, and polyvinyl alcohol and a dichromate or a diazo compound type which use water for development. A photopolymerizable resin in which an acrylic monomer, an acrylic oligomer, or the like is blended with an acrylic copolymer having a carboxyl group in a side chain, a novolak resin and a naphthoquinonediazide system using alkaline water for development. An organic solvent is used for development of polyvinyl cinnamate-based, cyclized rubber and diazide-based, and photopolymerizable resin-based blends of soluble polymer with acrylic monomer and acrylic oligomer. Thus, a substrate 13 on which the ultraviolet light shielding material 11 and the acid-resistant photosensitive resin material 12 were sequentially formed was obtained.

Next, as shown in FIG. 2B, the substrate 13 is irradiated with ultraviolet rays 15 through a transparent negative film 14, and thereafter, the photosensitive resin material 12 does not erode the ultraviolet light shielding material 11. Developing was performed using a developer to form an acid-resistant image 12 a on the photosensitive resin material 12.

Next, as shown in FIG. 2C, using the photosensitive resin material 12 on which the image 12a has been formed as a mask, the ultraviolet light shielding material 11 is etched using an acidic solution, and the ultraviolet light shielding material 11 is etched. An image 11 a having the same pattern as that of the image 12 a was formed on 11, and was used as a substrate 16.

By irradiating the base material 16 thus obtained with external energy such as infrared rays, the thermosetting resin material contained in the ultraviolet light shielding material 11 was cured by heating. As a result, the ultraviolet light shielding material 11 is cured,
Ultraviolet light shielding layer 2 having ultraviolet light shielding image 2a shown in FIG.
It became.

Here, the ultraviolet light shielding material 11 is preliminarily containing a microwave-induced heat-generating substance such as black iron oxide (iron tetroxide: Fe ₃ O ₄ ), acicular titanium oxide (TiO ₂ ) or the like. In this case, the thermosetting resin material contained in the ultraviolet light shielding material 11 can be heated and cured using microwaves instead of irradiating external energy such as infrared rays.

According to the photomask of this embodiment, an acid-soluble ultraviolet light-shielding layer 2 and an acid-resistant photosensitive resin layer 3 are laminated on a glass plate 1, and an ultraviolet light-shielding image is formed on the ultraviolet light-shielding layer 2. 2a, the image 3a having the same pattern as the image 2a was formed on the photosensitive resin layer 3, so that there was no possibility of expansion and contraction due to a change in temperature or humidity, and it was possible to clarify the presence or absence of an ultraviolet light shielding image. it can. Therefore, it is possible to stabilize the dimensional accuracy, increase the image accuracy, and improve the scratch resistance. Further, since the ultraviolet light shielding layer 2 contains a thermosetting resin, the adhesion and durability of the ultraviolet light shielding layer 2 can be improved.

According to the photomask manufacturing method of this embodiment, the acid-soluble ultraviolet light shielding material 1 is placed on the glass plate 1.
1 and an acid-resistant photosensitive resin material 12 are sequentially formed, then an acid-resistant image 12a is formed on the photosensitive resin material 12, and an image 11a having the same pattern as the image 12a is formed on the ultraviolet light shielding material 11. Because it is formed, there is no risk of expansion and contraction due to changes in temperature and humidity, and it is possible to clarify the presence or absence of an ultraviolet light-shielded image, thus stabilizing dimensional accuracy, improving image accuracy, and improving scratch resistance. A photomask capable of achieving the above can be easily manufactured with a simple process.

Further, since the acid-soluble ultraviolet light-shielding material 11 is used, an etchant having little influence on the environment can be selectively used. In addition, since the ultraviolet light shielding material 11 contains a thermosetting resin, the adhesion and durability of the obtained ultraviolet light shielding layer 2 can be improved.

If the ultraviolet light-shielding material 11 contains a microwave-induced heat-generating substance in advance, only the thermosetting resin material contained in the ultraviolet light-shielding material 11 is effectively heated and cured by using microwaves. Energy can be saved as compared with the case where external energy such as infrared rays is irradiated. In addition, in the case of this microwave heating, since a dimensional change due to heating of the glass plate 1 is reduced, a more accurate image can be formed, and therefore, a photomask having a more accurate image can be manufactured. it can.

[Second Embodiment] FIG. 3 shows a second embodiment of the present invention.
FIG. 4 is a cross-sectional view illustrating a photomask according to an embodiment of the present invention. The difference between the photomask of the present embodiment and the photomask of the above-described first embodiment is that the opening of the image 2a of the ultraviolet light shielding layer 2 and the photosensitive resin layer For example, at the opening of the image 3a of FIG.
The point is that a translucent substance 21 made of an organic silicon compound such as an acrylic resin or a silicate ester is filled.

According to the photomask of this embodiment, the opening of the image 2a of the ultraviolet light shielding layer 2 and the opening of the image 3a of the photosensitive resin layer 3 are filled with the translucent substance 21. The image 2a and the image 3a of the photosensitive resin layer 3 are both reinforced by the translucent substance 21, so that the mechanical strength of the photomask can be improved. Therefore, in addition to stabilizing the dimensional accuracy, increasing the accuracy of the image, and improving the scratch resistance, the durability of the photomask can be improved.

[Third Embodiment] FIG. 4 shows a third embodiment of the present invention.
FIG. 3 is a cross-sectional view illustrating a photomask according to the second embodiment. The difference between the photomask of the present embodiment and the photomask of the first embodiment is that the acid-resistant photosensitive resin layer 3 is removed to dissolve the acid. Is that the surface of the ultraviolet light shielding layer 2 is exposed.

According to the photomask of this embodiment, since the photosensitive resin layer 3 is removed and the surface of the ultraviolet light shielding layer 2 is exposed, the image portion of the photomask becomes one layer, and the photosensitive resin layer 3 is present. In this case, the thickness of the image portion can be reduced as compared with the case of performing the operation. Therefore, when exposure processing is performed using the photomask, dimensional accuracy of exposure can be improved.

[Fourth Embodiment] FIG. 5 shows a fourth embodiment of the present invention.
FIG. 9 is a cross-sectional view illustrating a photomask according to the third embodiment. The difference between the photomask of the present embodiment and the photomask of the second embodiment is that the acid mask exposed after removing the acid-resistant photosensitive resin layer 3 is removed. The point is that only the opening of the soluble ultraviolet shielding layer 2 in the image 2a is filled with the translucent substance 21.

According to the photomask of this embodiment, since only the opening of the image 2 a of the ultraviolet light shielding layer 2 is filled with the translucent substance 21, the image 2 a of the ultraviolet light shielding layer 2 is reinforced by the translucent substance 21. As a result, the mechanical strength of the photomask can be improved. In addition, since the photosensitive resin layer 3 is removed to expose the surface of the ultraviolet light shielding layer 2, the image portion of the photomask becomes one layer, and the thickness of the image portion is reduced as compared with the case where the photosensitive resin layer 3 is present. can do. Therefore, when exposure processing is performed using the photomask, dimensional accuracy of exposure can be improved.

[Fifth Embodiment] FIG. 6 shows a fifth embodiment of the present invention.
FIG. 3 is a cross-sectional view illustrating a photomask according to an embodiment of the present invention. The difference between the photomask of the present embodiment and the photomask of the above-described first embodiment is that, instead of forming the acid-soluble ultraviolet light shielding layer 2, The point is that a soluble conductive layer 31 was formed, and a conductive image 31a was formed on the conductive layer 31.

The conductive layer 31 contains an acid-soluble resin typified by the amine-containing acid-soluble resin used in the first embodiment, a conductive substance, and an epoxy resin. As the conductive material, carbon (C) particles, gold (Au), platinum (Pt), platinum rhodium (Pt-
Rh) alloy, silver (Ag), silver palladium (Ag-Pd)
Precious metal particles such as alloys and metal particles such as copper (Cu) and nickel (Ni) are preferably used.

Next, a method for manufacturing the photomask of this embodiment will be described. First, silver (Ag) particles, a liquid acid-soluble resin, and an epoxy resin were prepared, and these were each weighed so as to have a predetermined ratio. Here, 8.5 g of silver (Ag) particles, 2.0 g of a liquid acid-soluble resin (1 g of a resin component and the remainder being a solvent), and 0.5 g of an epoxy resin were weighed. In addition, spherical silver type AG-1-1 (manufactured by Dowa Mining Co., Ltd.) was used as silver particles. The silver particles have a particle size of 0.1 to 0.2 μm and a specific surface area of 2.
The tap density was 5 m ² / g and the tap density was 2.2 g / cm 3.

Next, these compositions are kneaded well using a kneader such as a three-roll mill to form a paste, and the paste is applied on a glass plate 1 using a screen printer or the like. After drying for minutes, a conductive layer having a thickness of 15 μm was obtained. Next, a photosensitive resin similar to that of the first embodiment was applied on the conductive layer, and a series of processes such as exposure and etching were performed to form a conductive image on the conductive layer.

Next, the epoxy resin was cured by heating at 140 ° C. for 30 minutes to obtain a photomask of the present embodiment. When the specific resistance of the conductive layer 31 of this photomask was measured, it was found to be 1.2 × 10 ⁻⁴ Ωcm.
Met.

According to the photomask of this embodiment, the conductive layer 31 having acid solubility is formed on the glass plate 1 and the conductive image 31 a is formed on the conductive layer 31.
In 1a, there is no possibility of expansion and contraction due to a change in temperature or a change in humidity, so that dimensional accuracy can be stabilized, image accuracy can be improved, and scratch resistance can be improved. Therefore, a photomask having a conductive pattern with high accuracy and excellent scratch resistance can be obtained.

[Sixth Embodiment] FIG. 7 shows a sixth embodiment of the present invention.
FIG. 13 is a cross-sectional view illustrating a photomask of the fifth embodiment. The difference between the photomask of the present embodiment and the photomask of the fifth embodiment is that the acid-resistant photosensitive resin layer 3 is removed to dissolve the acid. The point is that the surface of the conductive layer 31 is exposed.

According to the photomask of this embodiment, since the photosensitive resin layer 3 is removed and the surface of the conductive layer 31 is exposed, the image portion of the photomask becomes one layer, and the photosensitive resin layer 3 exists. The thickness of the image portion can be reduced as compared with the case, and therefore, the dimensional accuracy of the image 31a can be improved.

As described above, one embodiment of the photomask and the method of manufacturing the same according to the present invention has been described with reference to the drawings. However, the specific structure is not limited to the above-described embodiment, and the gist of the present invention is as follows. The design can be changed without departing from the range. For example, the microwave induction heating substance may be any material that heats and cures the thermosetting resin material included in the ultraviolet light shielding material 11 using microwaves, such as black iron oxide or acicular titanium oxide (TiO ₂ ). Not limited.

Further, instead of irradiating the photosensitive resin material 12 with the ultraviolet rays 15, a configuration may be employed in which the photosensitive resin material 12 is directly drawn using a laser beam drawing machine or the like. The laser device used in this case is 400 nm to 5 nm.
A laser device that emits laser light having a wavelength of 50 nm, for example, an Ar laser, a Xe laser, a Kr laser, a YAG laser, a He-Cd laser, or the like is suitably used.

[0071]

As described above, according to the photomask of the first aspect of the present invention, an acid-soluble ultraviolet light shielding layer is formed on a transparent plate, and the ultraviolet light shielding layer is formed on the ultraviolet light shielding layer. Since the image is formed, there is no possibility of expansion or contraction due to a change in temperature or humidity, and the presence or absence of the ultraviolet light shielding image can be clarified. Therefore, it is possible to stabilize the dimensional accuracy, increase the image accuracy, and improve the scratch resistance.

According to the photomask of the third aspect, the opening of the image of the ultraviolet light shielding layer and / or the opening of the image of the photosensitive resin layer are filled with a light transmitting substance. Since the photomask is reinforced by the conductive material, the mechanical strength of the photomask can be improved. Therefore, in addition to stabilizing the dimensional accuracy, increasing the accuracy of the image, and improving the scratch resistance, the durability of the photomask can be improved.

According to the photomask of the seventh aspect, the thermosetting resin is contained in the ultraviolet light shielding layer, so that the adhesion and durability of the ultraviolet light shielding layer can be improved.

According to the photomask of the eighth aspect, since the ultraviolet light-shielding layer contains a microwave-induced heat-generating substance, in addition to improving the adhesion and durability of the ultraviolet light-shielding layer, the photomask of the transparent plate can be used. By suppressing the dimensional change due to heating, the accuracy of the image can be improved.

According to the photomask of the ninth aspect, an acid-soluble conductive layer is formed on the transparent plate, and a conductive image is formed on the conductive layer. There is no risk of expansion and contraction due to changes in humidity and humidity, and dimensional accuracy can be stabilized, image accuracy can be improved, and scratch resistance can be improved.

According to a twelfth aspect of the present invention, an acid-soluble ultraviolet light shielding layer and an acid-resistant photosensitive resin layer are sequentially formed on a transparent plate, and then the photosensitive resin is exposed to light. Forming an image on the photosensitive resin, and then selectively removing the ultraviolet light shielding layer using the image of the photosensitive resin as a mask to form an ultraviolet light shielding image on the transparent plate. There is no fear of expansion and contraction due to changes in humidity and humidity, and the presence or absence of an ultraviolet light shielding image can be clarified.
As a result, it is possible to easily obtain a photomask in which dimensional accuracy is stabilized, image accuracy is improved, and scratch resistance is improved.

According to the photomask manufacturing method of the present invention, the thermosetting resin material is contained in the ultraviolet light shielding layer, and after the ultraviolet light shielding image is formed, the thermosetting resin material is heated. Because of the curing, the adhesion and durability of the ultraviolet light shielding layer can be improved.

According to the photomask manufacturing method of the present invention, the ultraviolet light-shielding layer contains a microwave-induced heat generating substance, and after forming the ultraviolet light-shielding image,
The microwave-induced heating substance is heated by microwaves, and the thermosetting resin material is heated and cured by the heat generated by the microwave-induced heating substance. Only the resin can be effectively heated and cured, and energy can be saved as compared with the case where external energy such as infrared rays is irradiated.

Further, in the case of this microwave heating, since the thermal influence on the transparent plate can be suppressed, the dimensional change due to the heating of the transparent plate can be suppressed, and a more accurate image can be formed. it can. Therefore, a photomask having a more accurate image can be manufactured.

As described above, scratch resistance, solvent resistance, adhesion to a glass plate or a transparent plate such as a heat-resistant resin or a resin film, and cutting of an image are excellent, and dimensional accuracy is stabilized.
It is possible to provide a photomask that can simultaneously satisfy various requirements such as high resolution for manufacturing high-definition components and durability accompanying mass production. In addition, there is no fear of expansion and contraction due to a change in temperature or humidity, and a photomask manufacturing method capable of easily manufacturing a photomask with stable dimensional accuracy, high image accuracy, and improved abrasion resistance. Can be provided.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view illustrating a photomask according to a first embodiment of the present invention.

FIG. 2 is a process chart showing a method for manufacturing a photomask according to the first embodiment of the present invention.

FIG. 3 is a cross-sectional view illustrating a photomask according to a second embodiment of the present invention.

FIG. 4 is a cross-sectional view illustrating a photomask according to a third embodiment of the present invention.

FIG. 5 is a cross-sectional view illustrating a photomask according to a fourth embodiment of the present invention.

FIG. 6 is a sectional view showing a photomask according to a fifth embodiment of the present invention.

FIG. 7 is a cross-sectional view illustrating a photomask according to a sixth embodiment of the present invention.

[Explanation of symbols]

 Reference Signs List 1 glass plate (transparent plate) 2 acid-soluble ultraviolet light shielding layer 2a image 3 acid-resistant photosensitive resin layer 3a image 11 acid-soluble ultraviolet light shielding material 11a image 12 acid-resistant photosensitive resin material 12a image 13 Material 14 Transparent negative film 15 Ultraviolet 16 Substrate 17 Translucent substance 21 Translucent substance 31 Conductive layer 31a Conductive image

Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme Court II (Reference) G03F 7/40 521 G03F 7/40 521 (72) Inventor Yasuji Takeuchi 5-2-7 Higashifuchi Nobe, Sagamihara-shi, Kanagawa Japan Within Kaken Co., Ltd. (72) Inventor Tomoki Watanabe 5-2-7 Higashifuchi Nobe, Sagamihara City, Kanagawa Prefecture 2H095 BC05 BC06 BC08 BC10 BC11 BC17 2H096 AA24 BA02 BA05 BA10 CA05 CA20 EA02 GA08 HA17 JA04

Claims (16)

[Claims] 1. A photomask comprising an acid-soluble ultraviolet light-shielding layer formed on a transparent plate, and an ultraviolet light-shielding image formed on the ultraviolet light-shielding layer. 2. The method according to claim 1, wherein an acid-resistant photosensitive resin layer is formed on the ultraviolet light-shielding layer, and an image having the same pattern as the image of the ultraviolet light-shielding layer is formed on the photosensitive resin layer. The photomask according to claim 1. 3. The image forming apparatus according to claim 1, wherein an opening of the image of the ultraviolet light shielding layer and / or an opening of the image of the photosensitive resin layer are filled with a translucent substance. Photo mask. 4. The photomask according to claim 1, wherein the ultraviolet light-shielding layer contains an acid-soluble resin and an ultraviolet light-shielding substance. 5. The photomask according to claim 4, wherein the acid-soluble resin is an amine-containing acid-soluble resin. 6. The photomask according to claim 5, wherein the amine-containing acid-soluble resin has an amine equivalent of 100 to 10,000. 7. The photomask according to claim 1, wherein the ultraviolet light shielding layer contains a thermosetting resin. 8. The photomask according to claim 7, wherein said ultraviolet light shielding layer contains a microwave-induced heating substance. 9. A photomask comprising: a transparent layer, an acid-soluble conductive layer formed thereon, and a conductive image formed on the conductive layer. 10. The method according to claim 1, wherein an acid-resistant photosensitive resin layer is formed on the ultraviolet light-shielding layer, and an image having the same pattern as the image of the ultraviolet light-shielding layer is formed on the photosensitive resin layer. The photomask according to claim 9. 11. The photomask according to claim 9, wherein the conductive layer contains an acid-soluble resin and a conductive substance. 12. An acid-soluble ultraviolet light shielding layer and an acid-resistant photosensitive resin layer are sequentially formed on a transparent plate, and then the photosensitive resin is exposed to form an image on the photosensitive resin. Next, the ultraviolet light shielding layer is selectively removed using the photosensitive resin image as a mask to form an ultraviolet light shielding image on the transparent plate. 13. The method for manufacturing a photomask according to claim 12, wherein the photosensitive resin is removed after forming the ultraviolet light shielding image. 14. After the ultraviolet light shielding layer contains a thermosetting resin material to form the ultraviolet light shielding image,
14. The method according to claim 12, wherein the thermosetting resin material is cured by heating. 15. The microwave-induced heat-generating substance is contained in the ultraviolet light-shielding layer, and after forming the ultraviolet light-shielding image, the microwave-induced heat-generating substance is heated by microwaves. 14. The method for manufacturing a photomask according to claim 12, wherein the thermosetting resin material is heated and cured by generated heat. 16. Instead of exposing the photosensitive resin,
16. The method for manufacturing a photomask according to claim 12, wherein drawing is performed directly on the photosensitive resin using a laser beam.