JP2002164694A - Electronic component mounter - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component mounter which prohibits the component placing device from lifted, causing no scattering of other components on the component placing device if a surface of the component placing device is accidentally sucked when a sucking nozzle sucks a component. SOLUTION: An electronic component mounter 40 is provided wherein an electronic component mounted on a printed board 22 on a board table 9 is transported to a prescribed position from component placing devices 21 and 31 by part sucking heads 1 and 10. Here, placing device fixing means 42 and 44 are provided which fix the component placing devices 21 and 31 to the base stage of a component supplying parts 5 and 6 when sucking an electronic component with sucking nozzles 16-20 of the component sucking heads 1 and 10. Thus, the component placing devices 21 and 31 are prevented from lifted when the sucking nozzles 16-20 suck them.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pick-up nozzle mounted on a component pick-up head, which picks up an electronic component on a component mount supported by a component feeder and conveys the electronic component to a predetermined position from the component mount. More specifically, the present invention relates to an electronic component mounting machine that performs mounting processing on a printed circuit board on a substrate table, and more specifically, to prevent inconvenience caused by vibration or lifting of the component mounting device during suction processing by the suction nozzle. It is related to the improvement of.

[0002]

2. Description of the Related Art FIG. 10 shows a conventional example of an electronic component mounting machine. The electronic component mounter 30 shown here is
First component mounter 3 on which electronic components are mounted in a prescribed arrangement
1 and a second component supporter 21 supporting a second component mounter 21 on which electronic components are mounted in a prescribed arrangement.
Supply section 6 and printed circuit board 2 on which electronic components are mounted
2, a first component suction head 1 for sucking and taking out an electronic component from the first component mounting device 31, and an electronic component from the second component mounting device 21. A second component suction head 10 that sucks and takes out, a first head driving mechanism 33 that moves the first component suction head 1, and a second head that moves the second component suction head 10 A drive mechanism 35 and a control device 37 for controlling the moving operation of the component suction heads 1 and 10 and the advancing and retreating operation of the suction nozzles of the component suction heads 1 and 10 based on information taught in advance. Then, the electronic components mounted on the printed circuit board 22 on the substrate table 9 are conveyed to a predetermined position from above each component mounting device by the component suction head.

The first component supply section 5 is a so-called cassette type component supply section, and has a configuration in which four cassettes containing electronic components at a constant pitch are connected in series as a first component placement device 31. Each cassette can house different electronic components, and can also house the same electronic component. Depending on mounting conditions on the printed circuit board 22, etc.
Parts to be accommodated in each cassette are determined.

The second component supply unit 6 is a so-called tray-type component supply unit. As the second component placement unit 21, a tray plate having electronic component placement units formed at a predetermined arrangement pitch is used. ing.

The types and arrangement pitches of the electronic components mounted on the component mounters 21 and 31 are previously input to the control device as control data.

As shown in FIG. 11, the first component suction head 1 has four suction heads 12, 13, 1 corresponding to the cassette arrangement in the first component supply section 5 described above.
Suction nozzles 16, 17, 18, 19 for adsorbing and holding electronic components for each suction head.
Is equipped. These suction nozzles 16, 17, 1
Reference numerals 8 and 19 are provided so as to be able to advance and retreat independently of each other in a direction perpendicular to the component placement surface of the first component placement device 31.

The first head drive mechanism 33 moves the first component suction head 1 in the X-axis direction on a plane parallel to the component mounting surface of the component mounting device 31 and the mounting surface of the printed circuit board 22. An axial driving mechanism 2 and a Y-axis driving mechanism 3 for moving the first component suction head 1 in the Y-axis direction on a plane parallel to the component mounting surface of the component mounting device 31 and the mounting surface of the printed circuit board 22. , 4.

The first component suction head 1 is driven by the driving mechanisms 2, 3, 4 at an arbitrary position on the component mounting surface of the component mounting device 31 and on the component mounting surface of the second component mounting device 21. It can be moved to any position, any position on the transfer pallet 11 described later, or any position on the printed board 22 of the board table 9,
Both the process of sucking and removing the electronic component from the first component supply unit 5, the second component supply unit 6, and the transfer pallet 11 and the process of mounting the extracted electronic component at a desired position on the printed circuit board 22 are performed. It is possible.

When the first component suction head 1 picks up a component from the first component supply unit 5, the attitude of the picked up electronic component is detected by the first recognition sensor 7, and the printed board 22 is picked up. After correcting the rotation angle θ around the central axis of the suction nozzle in the X-axis direction and the Y-axis direction according to the mounting position and the mounting direction above, mounting on the printed circuit board 22 is performed.

Similarly, when a component is sucked from the second component supply unit 6 or the transfer pallet 11, the posture of the sucked electronic component is detected by the second recognition sensor 8 and the printed board 22 is detected. After correcting the rotation angle θ around the central axis of the suction nozzle in the X-axis direction and the Y-axis direction according to the mounting position and the mounting direction above, mounting on the printed circuit board 22 is performed.

The second component suction head 10 comprises a single suction head 10a having a suction nozzle 20, and is attached to a head drive mechanism 35 as shown in FIG.

The second head driving mechanism 35 is a guide rail that crosses the component mounting surface of the second component mounting device 21 in the X-axis direction, and is provided movably in the Y-axis direction.

The second component suction head 10 travels on the second head drive mechanism 35 to move the component placement surface of the second component placement device 21 and the component placement surface of the transfer pallet 11. It can be moved to any position on the surface.

The second component suction head 10 is mounted on the printed circuit board 22 while the first component suction head 1 is mounting the electronic component taken out of the first component supply unit 5 or the transfer pallet 11 on the printed circuit board 22. The electronic component to be mounted on the first component suction head 1 is taken out of the second component mounting device 21 and mounted on the transfer pallet 11.

[0015]

By the way, until now,
The above-described mechanism for moving the suction nozzles 16, 17, 18, 19, 20 toward and away from the respective component mounting surfaces requires a servomotor having a high component cost to simplify control and reduce costs. It does not use high-precision positioning technology using.

In general, each suction nozzle is set with a reciprocating movement range so that the tip of the nozzle slightly hits the electronic component when the nozzle advances to the maximum, and at the same time, when the tip of the nozzle hits the electronic component. In order to prevent parts and nozzles from being damaged by the impact of shock, the tip of each suction nozzle has a buffer function, and at the time of actual suction, simply push the electronic component to be sucked to the maximum extent simply I have to.

However, in such an advancing / retracting mechanism, for example, when the component mounting device is a tray plate and the electronic component does not exist at the advanced position of the suction nozzle due to a broken or missing component or the like, The tip of the suction nozzle that has advanced to the maximum hits the surface of the tray plate and sucks the surface of the tray plate.
There is a possibility that other electronic components on the tray plate may be scattered.

Also, for example, during suction, the suction performance may vary due to slight rattling of the tray plate and the like, and depending on the shape and dimensional errors of the tray plate and the electronic components, the suction cannot be performed normally, and the remaining electronic components are left behind. Moreover, there is a fear that inconvenience such as dropping of the component immediately after the suction is caused.

Therefore, an object of the present invention is to solve the above-mentioned problems, and when performing a component suction process using a suction nozzle,
Even if the surface of the component placement device is accidentally sucked, the component placement device is lifted to prevent scattering of other components on the component placement device. It is an object of the present invention to provide an electronic component mounting machine capable of improving the mounting efficiency of electronic components by stable suction without causing variation in performance and without leaving electronic components left behind.

[0020]

SUMMARY OF THE INVENTION It is an object of the present invention to provide a component supply unit for supporting a component mounting device on which electronic components are mounted in a prescribed arrangement, and a printed circuit board on which the electronic components are mounted. A component table, a component suction head equipped with a suction nozzle for suctioning the electronic component in a direction perpendicular to a component mounting surface of the component mounter, and a component suction head for the component mounter. A head drive mechanism that can move to an arbitrary position on the component mounting surface, and a control device that controls the movement operation of the component suction head, the advance / retreat operation of the suction nozzle, and the like based on information taught in advance. An electronic component mounting machine that transports an electronic component mounted on a printed board on the substrate table from a component mounting device to a predetermined position by the component suction head; To be achieved by the electronic component mounting apparatus characterized by comprising a 置器 fixing means mounting for fixing the component mounting 置器 the base of the component supply unit.

According to the above arrangement, the electronic component does not exist at the advanced position of the suction nozzle due to, for example, a cut-out of the component on the component mounting device or a missing component. Even if the tip of the nozzle sucks the surface of the component mounting device,
Since the component mounting device is fixed to the base of the component supply section by the mounting device fixing means, the component mounting device is not lifted by the withdrawal (elevation) of the suction nozzle. The disadvantage that other electronic components on the component mounting device are scattered by the lifting can be prevented.

Further, if the component placement device is firmly fixed to the base of the component supply section by the placement device fixing means before the suction by the suction nozzle, the component placement device can be slightly moved during the suction by the suction nozzle. Prevents fluctuations in suction performance due to loose play, etc., prevents electronic components from being left behind due to variations in suction performance, and prevents components from falling immediately after suction, etc., and mounting electronic components by stable suction Efficiency can be improved.

Preferably, in the above electronic component mounting machine, the mounting device fixing means is mounted on the component suction head so as to be able to advance and retreat in the same direction as the suction nozzle. The component placement device may be fixed to a base of a component supply unit by pressing a peripheral edge of a descending region of the nozzle against the base.

In this way, it is possible to accurately press the periphery of the suction portion by the suction nozzle regardless of the size and shape of the component mounting device.

More preferably, in the above electronic component mounting machine, when a plurality of the component suction heads are connected in series, the placing device fixing means is fixedly mounted at the tip of the suction nozzle, and the suction nozzle is mounted. When the component placement surface of the component placement device is brought close to the component placement surface to a certain distance, the component placement surface is pressed against the base, and a suction nozzle for mounting the placement device fixing means is selected. By selecting a suction nozzle to be lowered onto the component placement device when the component is sucked, it is preferable that a fixing portion on the component placement device during the suction process can be selected.

With this arrangement, among the suction nozzles of the plurality of component suction heads connected in series, the suction nozzle used for suctioning the electronic component and the suction nozzle for operating the mounting device fixing means are appropriately adjusted. By switching, it is possible to select the pressing position by the mounting device fixing means according to the component arrangement on the component mounting device, and it is possible to stably fix the component mounting device.

[0027]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of an electronic component mounting machine according to the present invention will be described below in detail with reference to the drawings.

FIGS. 1 to 5 show a first embodiment of an electronic component mounting machine according to the present invention. FIG. 1 is a perspective view of the first embodiment of the electronic component mounting machine according to the present invention. FIG. 2 shows FIG.
FIG. 3 is an enlarged perspective view of the first component suction head shown in FIG.
FIG. 4 is an enlarged perspective view of the second component suction head shown in FIG. 1, FIG. 4 is a schematic diagram showing one configuration of component supply data input to the electronic component mounter of FIG. 1, and FIG. It is a flowchart which shows the procedure of component suction processing.

The electronic component mounter 40 of the first embodiment
The first component suction head 1 and the second component suction head 10 of the electronic component mounting machine 30 shown in FIG. 10 are provided with mounting device fixing means 42 and 44, respectively. The basic configuration other than the container fixing means 42 and 44 is as follows.
It is common with the conventional one.

That is, the electronic component mounting machine 4 shown here
0 denotes a first component supply unit 5 that supports the first component mounting unit 31 on which electronic components are mounted in a predetermined arrangement, and a second component mounting unit 5 on which electronic components are mounted in a predetermined arrangement. The second component supply unit 6 that supports the mounting device 21, the board table 9 on which the printed circuit board 22 on which the electronic component is mounted is mounted, and the electronic component is sucked and taken out from the first component mounting device 31. A first component suction head 1, a second component suction head 10 that sucks and takes out an electronic component from the second component mounting device 21,
A first head drive mechanism 33 for moving the first component suction head 1, a second head drive mechanism 35 for moving the second component suction head 10, and information based on information taught in advance. A control device 46 for controlling the moving operation of the component suction heads 1 and 10 and the advancing and retreating operation of the suction nozzles of the component suction heads 1 and 10 is provided, and mounted on the printed board 22 on the board table 9. The electronic component is transported to a predetermined position from above each component mounting device by the component suction head.

The first component supply section 5 is a so-called cassette type component supply section, and has a structure in which four cassettes containing electronic components at a constant pitch are continuously provided as a first component placement device 31. Each cassette can house different electronic components, and can also house the same electronic component. Depending on mounting conditions on the printed circuit board 22, etc.
Parts to be accommodated in each cassette are determined.

The second component supply unit 6 is a so-called tray-type component supply unit. As the second component placement unit 21, a tray plate having electronic component placement portions formed at a predetermined arrangement pitch is used. ing.

The types, arrangement pitches, and the like of the electronic components mounted on each of the component mounters 21 and 31 are input to the control device 46 in advance as control data.

As shown in FIG. 2, the first component suction head 1 has four suction heads 12, 13, 1 corresponding to the cassette arrangement in the first component supply section 5 described above.
Suction nozzles 16, 17, 18, 19 for adsorbing and holding electronic components for each suction head.
Is equipped. These suction nozzles 16, 17, 1
Reference numerals 8 and 19 are provided so as to be able to advance and retreat independently of each other in a direction perpendicular to the component placement surface of the first component placement device 31.

The first head driving mechanism 33 moves the first component suction head 1 in the X-axis direction on a plane parallel to the component mounting surface of the component mounting device 31 and the mounting surface of the printed circuit board 22. An axial driving mechanism 2 and a Y-axis driving mechanism 3 for moving the first component suction head 1 in the Y-axis direction on a plane parallel to the component mounting surface of the component mounting device 31 and the mounting surface of the printed circuit board 22. , 4.

The first component suction head 1 is driven by the driving mechanisms 2, 3, 4 at an arbitrary position on the component mounting surface of the component mounting device 31 and on the component mounting surface of the second component mounting device 21. It can be moved to any position, any position on the transfer pallet 11 described later, or any position on the printed board 22 of the board table 9,
Both the process of sucking and removing the electronic component from the first component supply unit 5, the second component supply unit 6, and the transfer pallet 11 and the process of mounting the extracted electronic component at a desired position on the printed circuit board 22 are performed. It is possible.

When the first component suction head 1 picks up a component from the first component supply unit 5, the posture of the sucked electronic component is detected by the first recognition sensor 7, and the printed board 22 is picked up. After correcting the rotation angle θ around the central axis of the suction nozzle in the X-axis direction and the Y-axis direction according to the mounting position and the mounting direction above, mounting on the printed circuit board 22 is performed.

Similarly, when picking up a component from the second component supply unit 6 or the transfer pallet 11, the posture of the sucked electronic component is detected by the second recognition sensor 8, and the printed board 22 is picked up. After correcting the rotation angle θ around the central axis of the suction nozzle in the X-axis direction and the Y-axis direction according to the mounting position and the mounting direction above, mounting on the printed circuit board 22 is performed.

The second component suction head 10 comprises a single suction head 10a having a suction nozzle 20, and is attached to a head drive mechanism 35 as shown in FIG.

The second head driving mechanism 35 is a guide rail that crosses the component mounting surface of the second component mounting device 21 in the X-axis direction, and is provided movably in the Y-axis direction.

The second component suction head 10 travels on the second head drive mechanism 35 to move the component placement surface of the second component placement device 21 and the component placement surface of the transfer pallet 11. It can be moved to any position on the surface.

The second component suction head 10 is called a so-called transfer head.
While the electronic component taken out of the first component supply unit 5 or the transfer pallet 11 is being mounted on the printed circuit board 22, the electronic component to be mounted next by the first component suction head 1 is placed on the second component mounting unit. It is taken out of the container 21 and transferred onto the transfer pallet 11.

The above-mentioned suction nozzles 16, 17, 1
The mechanism for moving the nozzles 8, 19, 20 toward and away from the respective component mounting surfaces is configured to set the reciprocating movement range so that the tip of the nozzle slightly hits the electronic component when the nozzle advances to the maximum, and at the same time, sets the nozzle tip. The tip of each suction nozzle has a buffering function to prevent damage to the components and nozzle itself due to the impact when the electronic component hits the electronic components. To make the most of it.

Next, in the present embodiment, the mount fixing means 42 and 44 additionally provided will be described in detail.

As shown in FIG. 2, when the first component suction head 1 is operated, the mounting device fixing means 42 adjusts the peripheral edge of the lowering area of the suction nozzle on the first component mounting device 31 to the component supply section. Is a hook-shaped or U-shaped structural material for fixing the component mounting device 31 to the base of the component supply unit 5 by pressing the component mounting device 31 on the base.

The mounting device fixing means 42 is arranged so that each of the suction nozzles 16, 17, 18, 19 reaches the periphery of the descending region of the suction nozzle before descending onto the electronic component.
The first component suction head 1 is provided so as to be able to advance and retreat in the same direction as the suction nozzles 16, 17, 18 and 19.

As shown in FIG. 3, when the second component suction head 10 is operated, the mounting device fixing means 44 moves the peripheral edge of the lowering area of the suction nozzle on the second component mounting device 21 to the second position. This is a U-shaped structural material that fixes the second component placement device 21 to the base of the second component supply unit 6 by pressing the component placement unit 6 against the base of the component supply unit 6.

The mounting unit fixing means 44 is
0 before dropping on the electronic component.
0 so as to reach the periphery of the descent region of zero.
The second component suction head 10 is provided so as to be able to advance and retreat in the same direction.

As shown in FIG. 4, the information necessary for mounting the electronic components on the printed circuit board 22 is taught to the control device 46 in advance.

Each piece of information shown in FIG. 4 is information for picking up and taking out a component on the second component mounting device 21.
Is information indicating the mounting position of the electronic component on the second component mounting device 21 using the X and Y coordinates, and (b) indicates the entire mounting on the second component mounting device 21. (C) indicates a placement part on which electronic components are not placed in the placement part, and (c) performs a suction process on each placement part on the second component placement device 21 when performing the suction process. It is an instruction as to whether or not the holding by the placement device fixing means 44 is performed. In this example, it is instructed to perform the holding by the placement device fixing means 44 in all the placement sections (reflection of all numbers = present).

Based on the information shown in FIG. 4, the suction nozzle 20 of the second component suction head 10 picks up the electronic component on the second component placement device 21 and transfers it to the transfer pallet 11. Then, specifically, the process proceeds according to the procedure shown in FIG.

That is, when the processing is started, first, it is confirmed whether or not the holding (holding) by the mounting / fixing means 44 is necessary in the data (c) of FIG. 4 (step S50).
1).

If it is not necessary to hold down the mounting device fixing means 44, the mounting device fixing means 44 is not operated, and the process proceeds to step S511.
The suction nozzle 20 is moved down to the mounting portion indicated in FIG.

In the case of the present embodiment, in FIG. 4 (c), all the receivers are instructed to carry out the pressing by the receiver fixing means 44, so that in step S501, it is necessary to hold the tray. Is determined, and step S521 is performed.
First, the lower edge of the placement device fixing means 44 presses down the periphery of the placement portion of the electronic component against the second component supply portion 6 and fixes it, and while maintaining that state, the process proceeds to step S52.
As shown in FIG. 2, the suction nozzle 20 is lowered to perform suction of the electronic component, and when the suction of the electronic component is completed, the mounting device fixing means 44 is raised to cancel the holding by the mounting device fixing device 44. After that, the process ends (step S52).
3).

The point of determining whether or not to perform the holding by the mounting device fixing means according to the data shown in FIG. 4 is that the first component suction head 1 uses the first component supply unit 5 or the second component supply unit. The same applies to the case where components are sucked from the transfer pallet 6 and the transfer pallet 11. When the holding by the mounting device fixing means is necessary, the operation of the mounting device fixing means before the suction by the suction nozzle is started is also required. It is common.

As shown in FIG. 6, the data indicating whether or not the holding by the mounting device fixing means is to be performed is instructed to be reflected individually according to the empty position of the tray, with "all data reflected = no data". If the suction nozzle is moved to a vacant position (a position where no parts are placed) on the tray based on the vacant position information on the tray shown in FIG. Activate the container fixing means.

When a plurality of suction nozzles are connected in series as in the first component suction head 1, some of the suction nozzles drop to empty positions when the electronic components on the tray are not placed continuously. Then, the surface of the tray is attracted. In such a place, the mounting device fixing means is operated according to the information as shown in FIG.

In the above electronic component mounting machine 40, for example,
No electronic components are present at the advance position of the suction nozzle due to a broken or missing part on the component mounting device, and the tip of the suction nozzle that has advanced as much as possible sucks the surface of the component mounting device. However, since the component mounting device such as the tray is fixed to the base of the component supply unit by the mounting device fixing means provided on the component suction head, the component mounting device is moved by the suction nozzle retreating (rising). It is possible to prevent the occurrence of an inconvenience that the electronic component on the component placement device is scattered by the lifting of the component placement device without causing an accident of being lifted.

Further, if the component mounting device is firmly fixed to the base of the component supply section by the mounting device fixing means before the suction by the suction nozzle, the component mounting device can be slightly moved when the suction nozzle suctions. Prevents fluctuations in suction performance due to loose play, etc., prevents electronic components from being left behind due to variations in suction performance, and prevents components from falling immediately after suction, etc., and mounting electronic components by stable suction Efficiency can be improved.

In the above-described embodiment, each of the component suction heads 1 and 10 is provided with the mounting device fixing means.

However, in the case where four suction heads 12, 13, 14, and 15 are connected in series like the first component suction head 1, for example, a part of the suction heads 1 is used.
Placement device fixing means 51, 53 for holding the component placement device against the component supply section at the tips of the suction nozzles 17, 19 of 3, 15
When the suction nozzles 17 and 19 are brought close to the component mounting surface of the tray as the second component mounter 21 to a certain distance, these mounter fixing means 51 and 53 are attached to the component. The mounting surface may be pressed against the base of the second component supply unit 6.

In this case, the control device for controlling the operation of the first component suction head 1 includes a mounting unit fixing means 5.
Selection of a suction nozzle for assembling the components 1 and 53 and selection of a suction nozzle to be lowered onto the component placement device 21 when components are sucked from the component placement device 21, and a fixing position on the component placement device 21 during a suction process. May be selectable.

In this manner, among the suction nozzles 16 to 20 of the plurality of component suction heads 12, 13, 14, and 15 which are continuously provided, a suction nozzle used for suctioning an electronic component, a mounting device, and the like. By appropriately switching the suction nozzle that operates the fixing means, according to the component arrangement on the component mounting device,
It is possible to select the pressing position by the mounting device fixing means, and it is possible to stably fix the component mounting device.

In each of the above embodiments, the mounting means is provided for the component suction head or the suction nozzle. However, the component supply unit itself may be provided with the mounting means. .

FIGS. 8 and 9 show the second component placement unit 6 on the base 6a of the second component supply unit 6 supporting the second component placement unit 21 on which the electronic component 211 is placed. An example is shown in which a mounting device fixing means 55 for pressing and fixing the container 21 from the periphery thereof to the base 6a is provided.

However, as described above, the second component mounting device 21
If the structure is to hold down from the surroundings, for example,
When the central component mounting portion of the second component mounting device 21 is sucked, a sufficient effect may not be exhibited in some cases.

Therefore, it is preferable that the pressing by the mounting device fixing means is locally performed in the vicinity of performing suction by the suction nozzle.

The mounting device fixing means 42 and 44 and the mounting device fixing means 51 and 53 are attached to the component suction heads and the suction nozzles. Since the periphery of the descending area is locally pressed against the base of each component supply unit, the periphery of the suction nozzle by the suction nozzle can be accurately pressed regardless of the size or shape of the component placement devices 21 and 31. .

In each of the above embodiments, the component supply unit is provided with both the cassette type component supply unit and the tray type component supply unit, but only one of the component supply units is provided. The present invention is also effective for an electronic component mounting machine.

Also, like the first component suction head 1,
When one component suction head has a configuration in which a plurality of suction heads are connected in series, the number of suction heads connected in series, etc.
It is not limited to the above embodiment.

The specific structure of the mounting means is as follows.
It is not limited to the above embodiment. According to the component arrangement in each component mounting device and the outer shape of the electronic component mounted on the component mounting device, it is possible to improve the form in which the surface of the component mounting device can be easily pressed.

The specific structure of the information for instructing the mounting of the component mounting device by the mounting device fixing means is described in FIG.
And it is not limited to the configuration shown in FIG. It can be appropriately improved according to the processing capability of the control device, the expression capability in a program for driving the control device, and the like.

[0073]

According to the electronic component mounter of the present invention, the electronic component does not exist at the advance position of the suction nozzle due to, for example, a cut-out or a missing component on the component mounting device. Even if the tip of the suction nozzle that has advanced to the maximum position sucks the surface of the component placement device, the component placement device is fixed to the base of the component supply unit by the placement device fixing means, so that the suction nozzle retreats ( As a result, an accident that the component placement device is lifted by the rise does not occur, and it is possible to prevent the inconvenience that the other electronic components on the component placement device are scattered by the lifting of the component placement device.

Further, if the component placement device is firmly fixed to the base of the component supply section by the placement device fixing means before the suction by the suction nozzle, the component placement device can be slightly moved during the suction by the suction nozzle. Prevents fluctuations in suction performance due to loose play, etc., prevents electronic components from being left behind due to variations in suction performance, and prevents components from falling immediately after suction, etc., and mounting electronic components by stable suction Efficiency can be improved.

Further, according to the configuration of the second aspect, it is possible to accurately press the periphery of the suction portion by the suction nozzle regardless of the size and shape of the component mounting device.

Further, according to the third aspect of the present invention, among the suction nozzles of the plurality of component suction heads connected in series, a suction nozzle used for suctioning electronic components and a mounting device fixing means are provided. By appropriately switching the suction nozzle to be operated, it is possible to select the holding position by the mounting device fixing means according to the component arrangement on the component mounting device, and to stably fix the component mounting device. Can be.

[Brief description of the drawings]

FIG. 1 is a perspective view of a first embodiment of an electronic component mounter according to the present invention.

FIG. 2 is an enlarged perspective view of a first component suction head shown in FIG.

FIG. 3 is an enlarged perspective view of a second component suction head shown in FIG.

FIG. 4 is a schematic diagram showing one configuration of component supply data input to the electronic component mounter of FIG. 1;

FIG. 5 is a flowchart illustrating a procedure of a component suction process in the electronic component mounting machine of FIG. 1;

FIG. 6 is a schematic diagram showing another example of the configuration of component supply data input to the electronic component mounter of FIG. 1;

FIG. 7 is an enlarged perspective view of a first component suction head in a second embodiment of the electronic component mounting machine according to the present invention.

FIG. 8 is a plan view showing another embodiment of the mounting device fixing means of the electronic component mounting machine according to the present invention.

9 is a sectional view taken along line IX-IX in FIG.

FIG. 10 is a perspective view of a conventional electronic component mounting machine.

11 is an enlarged perspective view of a first component suction head of the electronic component mounter shown in FIG.

12 is an enlarged perspective view of a second component suction head of the electronic component mounting machine shown in FIG.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 First component suction head (component suction / mounting head) 5 First component supply unit (cassette type component supply unit) 6 Second component supply unit (tray type component supply unit) 9 Substrate table 10 Second component Suction head (transfer head) 12-15 Suction head 16-20 Suction nozzle 21 Second component placement device (tray plate) 22 Printed circuit board 31 First component placement device (cassette) 33 First head drive mechanism 35 second head drive mechanism 42, 44 placement device fixing means 46 control device 51, 53 placement device fixing means 55 placement device fixing means

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Naoto Mimura 1006 Kadoma Kadoma, Osaka Pref. Matsushita Electric Industrial Co., Ltd. (72) Inventor Kazuyuki Nakano 1006 Kadoma Kadoma, Kadoma City Osaka Pref. Terms (reference) 3C007 DS06 FS01 FT01 FU02 NS17 3F061 AA04 CA01 CB01 CC03 DB06 5E313 AA02 AA11 AA23 DD01 DD05 DD22 DD23 EE24 EE25 FF24 FF28

Claims (3)

[Claims] 1. A component supply unit that supports a component mounting device on which electronic components are mounted in a prescribed arrangement, a board table on which a printed circuit board on which the electronic components are mounted is mounted, and the electronic components are sucked. A component suction head equipped with a suction nozzle capable of moving back and forth in a direction orthogonal to a component mounting surface of the component mounting device,
A head drive mechanism that can move the component suction head to an arbitrary position on a component mounting surface of the component mounting device; and a moving operation of the component suction head and the suction nozzle based on information taught in advance. A control device for controlling the forward / backward movement of the electronic component mounting machine, wherein the electronic component mounted on the printed board on the board table is transported to a predetermined position from a component mounting device by the component suction head. An electronic component mounting machine, comprising: a mounting device fixing means for fixing the component mounting device to a base of a component supply unit when an electronic component is suctioned by a suction nozzle. 2. The mounting device fixing means is mounted on the component suction head so as to be able to advance and retreat in the same direction as the suction nozzle.
2. The component mounting device is fixed to a base of a component supply unit by pressing a peripheral edge of a lowering area of the suction nozzle on the component mounting device against the base. Electronic component mounting machine. 3. When a plurality of said component suction heads are connected in series, said placement device fixing means is fixedly mounted at the tip of a suction nozzle and moves said suction nozzle to a predetermined distance to a component of said component placement device. When the component mounting surface is pressed against the base when approaching the mounting surface, a suction nozzle for assembling the mounting device fixing means is selected, and the component mounting device is mounted on the component mounting device at the time of sucking the component from the component mounting device. 2. A fixed portion on a component mounting device at the time of a suction process can be selected by selecting a suction nozzle to be lowered.
Electronic component mounting machine according to 1.