JP2002164362A - チップサイズ半導体装置及びその製造方法 - Google Patents
チップサイズ半導体装置及びその製造方法Info
- Publication number
- JP2002164362A JP2002164362A JP2000356312A JP2000356312A JP2002164362A JP 2002164362 A JP2002164362 A JP 2002164362A JP 2000356312 A JP2000356312 A JP 2000356312A JP 2000356312 A JP2000356312 A JP 2000356312A JP 2002164362 A JP2002164362 A JP 2002164362A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- semiconductor device
- semiconductor
- size
- semiconductor chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 129
- 238000004519 manufacturing process Methods 0.000 title claims description 14
- 239000000463 material Substances 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 9
- 239000003822 epoxy resin Substances 0.000 abstract description 11
- 229920000647 polyepoxide Polymers 0.000 abstract description 11
- 229920001187 thermosetting polymer Polymers 0.000 abstract description 11
- 230000035515 penetration Effects 0.000 abstract description 4
- 239000010410 layer Substances 0.000 description 22
- 235000012431 wafers Nutrition 0.000 description 22
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- 239000000945 filler Substances 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/117—Shapes of semiconductor bodies
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000356312A JP2002164362A (ja) | 2000-11-22 | 2000-11-22 | チップサイズ半導体装置及びその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000356312A JP2002164362A (ja) | 2000-11-22 | 2000-11-22 | チップサイズ半導体装置及びその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002164362A true JP2002164362A (ja) | 2002-06-07 |
| JP2002164362A5 JP2002164362A5 (enrdf_load_stackoverflow) | 2008-02-07 |
Family
ID=18828589
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000356312A Pending JP2002164362A (ja) | 2000-11-22 | 2000-11-22 | チップサイズ半導体装置及びその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002164362A (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100586607B1 (ko) | 2004-12-28 | 2006-06-07 | 동부일렉트로닉스 주식회사 | 차단판을 이용한 반도체 칩 표면의 보호 방법 |
| JP2007266421A (ja) * | 2006-03-29 | 2007-10-11 | Sanyo Electric Co Ltd | 半導体装置およびその製造方法 |
| WO2012107972A1 (ja) * | 2011-02-10 | 2012-08-16 | パナソニック株式会社 | 半導体装置 |
-
2000
- 2000-11-22 JP JP2000356312A patent/JP2002164362A/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100586607B1 (ko) | 2004-12-28 | 2006-06-07 | 동부일렉트로닉스 주식회사 | 차단판을 이용한 반도체 칩 표면의 보호 방법 |
| JP2007266421A (ja) * | 2006-03-29 | 2007-10-11 | Sanyo Electric Co Ltd | 半導体装置およびその製造方法 |
| WO2012107972A1 (ja) * | 2011-02-10 | 2012-08-16 | パナソニック株式会社 | 半導体装置 |
| JP5066302B2 (ja) * | 2011-02-10 | 2012-11-07 | パナソニック株式会社 | 半導体装置 |
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Legal Events
| Date | Code | Title | Description |
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| RD01 | Notification of change of attorney |
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| A977 | Report on retrieval |
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| A02 | Decision of refusal |
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