JP2002161193A - Resin composition for recovering mold releasability - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a resin composition having excellent in recovering mold releasability of a metal mold for sealing a semiconductor. SOLUTION: The resin composition consists of (A) an epoxy resin, (B) a phenol resin, (C) an accelerator, (D) a glycerol trifatty acid ester of glycerol and 24-36C saturated fatty acid, and (E) an inorganic filler.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mold release resin composition for semiconductor encapsulation.

[0002]

2. Description of the Related Art In recent market trends of miniaturization, weight reduction, and high performance of electronic devices, as semiconductor devices become more highly integrated year by year and surface mounting of semiconductor devices is promoted,
Demands for epoxy resin compositions for semiconductor encapsulation are becoming increasingly stringent. Epoxy resin compositions for semiconductor encapsulation using various resins and additives that meet this requirement are subject to mold contamination during continuous molding, mold removal, and molding defects such as unfilling. Therefore, it has become common to periodically clean the mold surface.

Conventionally, a cleaning material for a semiconductor encapsulating mold is made of a resin having a large molding shrinkage such as an amino resin and a filler having a high hardness such as crystal-crushed silica and glass fiber. It was mainly used to remove dirt on the mold surface by using. After the cleaning material is used, the mold surface becomes clean, but the mold release agent on the mold surface is also removed. Therefore, there is a problem that the semiconductor device formed immediately after cleaning has extremely poor mold releasability. Was. Therefore, after using the cleaning material, it is necessary to mold the mold release recovery resin composition, transfer the release agent in the mold release recovery resin composition to the mold surface, and recover the mold release property. The mold release recovery resin composition transfers the release agent to the surface of the mold and quickly recovers the mold release property. Conventionally, as the mold release recovery resin composition, for example, an epoxy resin, a phenolic resin, a curing accelerator, carnauba wax, and those composed of components such as silica have been used. There is a need for a resin composition having more excellent mold release recovery.

[0004]

SUMMARY OF THE INVENTION The present invention provides a mold-releasing resin composition for semiconductor encapsulation which has excellent mold-releasability.

[0005]

The present invention provides (A) an epoxy resin, (B) a phenolic resin, (C) a curing accelerator,
(D) a glycerin trifatty acid ester of glycerin and a saturated fatty acid having 24 to 36 carbon atoms, and (E) a glycerin trifatty acid ester comprising an inorganic filler, preferably glycerin and a saturated fatty acid having 24 to 36 carbon atoms. The fatty acid ester is contained in the entire mold release recovery resin composition in an amount of from 0.5 to 1.
5% by weight of a mold release recovery resin composition for semiconductor encapsulation.

[0006]

BEST MODE FOR CARRYING OUT THE INVENTION The epoxy resin used in the present invention is not particularly limited. For example, phenol novolak epoxy resin, cresol novolak epoxy resin, biphenyl epoxy resin, bisphenol epoxy resin, stilbene Type epoxy resin,
Triphenol methane type epoxy resin, phenol aralkyl type epoxy resin, naphthalene type epoxy resin, alkyl-modified triphenol methane type epoxy resin, triazine nucleus containing epoxy resin, dicyclopentadiene modified phenol type epoxy resin, etc. You may mix and use.

[0007] The phenolic resin used in the present invention is not particularly limited. Examples thereof include a phenol resin, a phenol aralkyl resin having a phenylene and / or diphenylene skeleton, and these may be used alone or as a mixture. The mixing ratio of the epoxy resin and the phenol resin is not particularly limited, but the epoxy group / phenolic hydroxyl group ratio is preferably 0.1%.
9 to 1.2 are preferred, and more preferably 0.95 to 1.
15 is desirable. If the amount deviates greatly from this range, the resin composition may not be sufficiently cured, and the workability may deteriorate such as a decrease in releasability.

The curing accelerator used in the present invention includes:
Refers to those that can be a catalyst for the crosslinking reaction between the epoxy resin and the phenol resin, for example,
1,8-diazabicyclo (5,4,0) undecene-7
And the like, an organic phosphorus-based compound such as triphenylphosphine, tetraphenylphosphonium / tetraphenylborate salt, and an imidazole compound such as 2-methylimidazole, but are not limited thereto. These curing accelerators may be used alone or as a mixture.

Glycerin used in the present invention and C2
Glycerin trifatty acid esters with saturated fatty acids of 4 to 36 have a function of imparting sufficient fluidity to the resin composition and further improving the releasability. The mold release recovery resin composition exhibits excellent mold release recovery after using a cleaning material. Specific examples of glycerin trifatty acid ester of glycerin and a saturated fatty acid having 24 to 36 carbon atoms include glycerin trilignoserate, glycerin triserotinate, and glycerin trimontanate. These may be used alone or as a mixture. If the number of carbon atoms of the saturated fatty acid used for the esterification is 23 or less, it is not preferable because sufficient releasability cannot be obtained. If the carbon number is 37 or more,
Due to its high molecular weight, the fluidity is reduced, and excessively seeping out of the mold surface is excellent in terms of the effect of mold release recovery. It is not preferable because there is a drawback that floating and dirt are generated. In addition, monoesters and diesters are not preferable because they are easily compatible with the resin component to be blended, so that they do not easily seep onto the mold surface during molding and the effect of mold release recovery is reduced. In addition, the carbon number of the saturated fatty acid referred to in the present invention refers to the sum of the carbon numbers of the alkyl group and the carboxyl group in the saturated fatty acid.

Glycerin used in the present invention and C2
The amount of the glycerin trifatty acid ester obtained by esterifying the saturated fatty acid of 4-36 is not particularly limited, but is preferably 0.1 to 3% by weight, more preferably 0.5 to 3% by weight in the whole resin composition. 1.5% by weight is desirable. 3
If the amount is more than 10% by weight, there is a problem that oil excessively seeps into a mold and oil is floated on the surface of the molded semiconductor device immediately after recovery from mold release. If the amount is less than 0.1% by weight, the release agent does not sufficiently migrate to the surface of the mold, and the expected recovery from the mold release may not be obtained. Examples of the inorganic filler used in the present invention include fused spherical silica and crystal-crushed silica.

[0011] In addition to the components (A) to (E), a mold release agent such as carnauba wax, stearic acid, or montanic acid wax may be added to the mold release recovery resin composition for semiconductor encapsulation of the present invention. Alternatively, additives such as a coupling agent, an antioxidant, and a coloring agent such as carbon black may be used. The mold release recovery resin composition for semiconductor encapsulation of the present invention, after mixing each component using a mixer or the like, heating and kneading using a heating kneader, a hot roll, an extruder, etc., followed by cooling and pulverization. Is obtained.

[0012]

The present invention will be specifically described below with reference to examples.
The mixing ratio is by weight. Example 1 Orthocresol novolak type epoxy resin (softening point: 65 ° C., epoxy equivalent: 20.9) 21.4 parts by weight Phenol novolak resin (softening point: 90 ° C., hydroxyl equivalent: 104) 10.6 parts by weight 1,8-diazabicyclo (5) , 4,0) undecene-7 (hereinafter referred to as DBU) 0.2 part by weight Fused spherical silica 66.7 parts by weight Glycerin trimontanate (carbon number 29) 0.6 part by weight Carnauba wax 0.2 part by weight Carbon After mixing 0.3 parts by weight of black using a mixer, the surface temperature was 95 ° C and 2 ° C.
A sheet obtained by kneading 20 times using a biaxial roll at 5 ° C. was cooled and pulverized to obtain a resin composition. The properties of the obtained resin composition were evaluated by the following methods. Table 1 shows the evaluation results.

Evaluation method Spiral flow: Using a mold for spiral flow measurement in accordance with EMMI-1-66, a mold temperature of 175 ° C.
The measurement was performed at an injection pressure of 70 kg / cm ² and a curing time of 2 minutes.
The unit is cm. Mold release property: A molded product was molded with a mold for load evaluation at the time of mold release using a melamine resin-based cleaning material for cleaning the mold surface, and the mold release agent component on the surface of the mold was removed. Then, after the mold release recovery resin composition was molded five times, the evaluation material was transfer molded under the conditions of a mold temperature of 175 ° C., an injection pressure of 70 kg / cm ² , and a curing time of 2 minutes. The mold load was measured. The unit is N.
The mold for load evaluation at the time of mold release consists of an upper mold, a middle mold and a lower mold. A push-pull gauge was applied to a circular molded article having a thickness of 14 mmΦ and a thickness of 1.5 mm attached to the middle mold after molding, and the molded article was protruded. The load applied at that time was measured. As an evaluation material, an epoxy resin molding material EME-7351 for semiconductor encapsulation manufactured by Sumitomo Bakelite Co., Ltd. was used. Product dirt: Immediately after the use of the mold release recovery resin composition, oil floating on the molded product surface of the molded evaluation material and the degree of dirt were confirmed. Those that could be wiped off when the surface was wiped were judged to be oily, and those that could not be removed were judged to be dirty. Those with stains on the product surface were marked with Δ without any stain but with oil floating, and those with none were marked with ○.

Examples 2 to 7, Comparative Examples 1 to 5 Resin compositions similar to those in Example 1 were prepared according to the formulations in Tables 1 and 2, and the results of evaluation in the same manner as in Example 1 were shown in Tables 1 and 2.
It is shown in Table 2. In addition, the epoxy resin used in other than Example 1,
Details of the phenol resin and the release agent are shown below. Biphenyl type epoxy resin (melting point 105 ° C, epoxy equivalent 191) Phenol aralkyl resin (softening point 62 ° C, hydroxyl equivalent 168) Chain fatty acid ester (C37 or more) Glycerin monomontanate (C29)

[Table 1]

[0015]

[Table 2]

[0016]

According to the present invention, the molded semiconductor device has no oil floating or dirt, is excellent in mold release recovery, and has improved productivity by using the resin composition for mold release for semiconductor encapsulation of the present invention. To contribute.

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Claims (2)

[Claims] 1. An epoxy resin, (B) a phenolic resin, (C) a curing accelerator, (D) glycerin and 2 carbon atoms.
A mold release recovery resin composition for semiconductor encapsulation, comprising: glycerin trifatty acid ester with saturated fatty acids of 4 to 36; and (E) an inorganic filler. 2. The resin composition according to claim 1, wherein the glycerin trifatty acid ester of glycerin and a saturated fatty acid having 24 to 36 carbon atoms is contained in the entire mold release recovery resin composition in an amount of 0.5 to 1.5% by weight. A mold release recovery resin composition for semiconductor encapsulation.