JP2002158149A - Method of forming electrode of electronic component and device for forming the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of forming an electrode, capable of stably forming a sneak path of the electrode. SOLUTION: A conductive paste CP is supplied to the surface of the elastic part 11a of a coated plate 11, and then a slider 12a is moved with the tip of the blade 12e of a paste scraping unit 12 attached to the surface of the elastic part 11a, thereby scraping the extra conductive paste CP from the surface of the elastic part 11a by the blade 12e and filling each trench 11a1 with the conductive paste CP. Since the blade 12e is urged by a coil spring 12f, even if the surface of the elastic part 11a is uneven, the tip of the blade 12e slides on the surface of the elastic part 11a along the uneven surface to make the amount of paste filled in each trench 11a1 uniform.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method and an apparatus for forming electrodes on component chips for various electronic components such as chip components, array components and composite components.

[0002]

2. Description of the Related Art FIG. 1 shows a multilayer capacitor array known as one of array components. In this capacitor array 1, four capacitor portions are arranged in parallel in a square pillar-shaped component chip 1a made of ceramic. And a total of four pairs of electrodes 1b that are electrically connected to the respective capacitor sections are provided on both sides in the width direction of the component chip 1a. In order to enable surface mounting on a substrate, each electrode 1b is provided with a portion 1b1 (hereinafter referred to as a wraparound portion 1b1) that wraps around both sides in the height direction of the component chip 1a. Incidentally, some capacitor arrays have a number of built-in capacitor portions and a number of electrode pairs other than four.

The electrode 1b is formed by applying a conductor paste for an electrode to the component chip 1a in a predetermined shape, and then drying and firing the applied paste.
For applying the conductive paste, a method using an application plate 2 as shown in FIG. 2 and a method using an application roller 3 as shown in FIG. 3 are mainly employed.

The coating plate 2 shown in FIG. 2 has a plate-like elastic portion 2a made of an elastic material such as silicon rubber and a plate-like rigid portion 2b made of a rigid material such as stainless steel and supporting the lower surface of the elastic portion 2a. It is composed of Four grooves 2 corresponding to the number and positions of the electrodes 1b are formed on the surface of the elastic portion 2a.
a1 is formed in parallel.

[0005] The component chip 1 is
When the conductive paste CP is applied to the groove 2a1, the conductive paste CP is supplied to the surface of the elastic portion 2a of the coating plate 2 and excess conductive paste is scraped off from the surface of the elastic portion 2a by a blade. After filling the paste CP, the carrier plate (not shown) holding the component chip 1a in a predetermined posture is lowered to press one surface in the width direction of the component chip 1a against the surface of the elastic portion 2a, and Pressed component chip 1a
Is pulled away from the elastic portion 2a by raising the carrier plate. The component chip 1a is pressed by the elastic portion 2a during the pressing.
The conductor paste CP filled in each groove 2a1 is applied to one surface in the width direction of the component chip 1a, and at the same time, is also applied to both ends in both height directions adjacent to the same surface. You.

On the other hand, the application roller 3 shown in FIG. 3 has a cylindrical elastic portion 3a made of an elastic material such as silicon rubber,
A cylindrical rigid portion 3b made of a rigid material such as stainless steel and supporting the inner peripheral surface of the elastic portion 3a. On the surface of the elastic portion 3a, four grooves 3a1 corresponding to the number and position of the electrodes 1b are formed in parallel. Incidentally, reference numeral 4 in FIG. 3 denotes a container containing the conductive paste CP,
Reference numeral 5 denotes a blade for scraping the conductive paste CP adhered to the surface of the elastic portion 3a.

[0007] A component chip 1 is
When applying the conductive paste CP to the surface of the elastic portion 3a, the conductive paste CP is supplied to the surface of the elastic portion 3a by using the rotation of the application roller 3 in the direction of the arrow, and the excess conductive paste CP is applied from the surface of the elastic portion 3a by the blade 5. After filling the conductive paste CP in each groove 3a1 by scraping,
A carrier tape (not shown) holding the component chip 1a in a predetermined posture is moved in the tangential direction of the application roller 3 to press one surface in the width direction of the component chip 1a against the surface of the elastic portion 3a, and The pressed component chip 1a is separated from the elastic portion 3a by the movement of the carrier tape. The component chip 1a is pressed by the elastic part 3 during the pressing.
a, the conductive paste CP filled in each groove 3a1 is applied to one surface in the width direction of the component chip 1a, and at the same time, spreads to both ends in both height directions adjacent to the same surface. Is done.

[0008]

In the above-described conventional method using the coating plate 2 or the coating roller 3, the size of the component chip 1 a or the variation in the amount of paste filling in the groove 2 a 1 or each groove 3 a 1 is reduced. It is difficult to stably obtain the shape of the wraparound portion of the application paste defined by reference numerals E2 and E3, that is, the shape of the wraparound portion 1b1 of the electrode 1b. The wraparound portion 1b1 of the electrode 1b is an important part when joining the electrode 1b to the substrate electrode by soldering or the like.
If a shape defect occurs in the device 1, there is a possibility that a problem of a mounting defect may be caused. Needless to say, this problem can also occur when electrodes of the same shape are formed on electronic components other than the capacitor array shown in FIG. 1, and the problem becomes more significant when the electrode size is reduced. Become.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object thereof is to provide an electrode forming method capable of stably forming a wraparound portion of an electrode and an electrode forming apparatus suitable for carrying out the method. It is in.

[0010]

According to a first aspect of the present invention, there is provided a method for forming an electrode, comprising: supplying a conductive paste for an electrode to a surface of an elastic portion having a groove; After the conductive paste is filled in the groove by scraping off excess conductive paste with a blade, a step of applying the conductive paste filled in the groove to the component chip by pressing the component chip against the surface of the elastic portion is provided. The method for forming an electrode of an electronic component is characterized in that excess conductive paste is scraped off from the surface of the elastic part by the blade while maintaining the contact pressure of the blade against the surface of the elastic part constant.

According to this first electrode forming method, when the excess conductive paste is scraped off from the surface of the elastic portion by the blade, the contact end of the blade is kept at a constant contact pressure with the surface of the elastic portion. Since the conductive paste slides along the undulations, the conductive paste can be uniformly filled in the grooves of the elastic portion. Since the conductive paste is uniformly filled in the grooves of the elastic portion, the shape of the wraparound portion of the conductive paste applied to the component chip by pressing against the surface of the elastic body can be stabilized.

In a second method of forming an electrode according to the present invention, a conductive paste for an electrode is supplied to the surface of an elastic portion having a groove, and excess conductive paste is scraped off from the surface of the elastic portion by a blade. A method for forming an electrode of an electronic component, comprising: applying a conductive paste filled in a groove to a component chip by pressing a component chip against a surface of the elastic portion after filling the conductive paste in the groove. The use of a blade having a concave portion facing the groove at the contact end so that when the excess conductive paste is scraped off from the surface of the elastic portion by the blade, the conductive paste rises above the opening edge of the groove. .

According to the second electrode forming method, since the concave portion facing the groove of the elastic portion is provided at the contact end of the blade, the excess conductive paste is scraped off from the surface of the elastic portion by the blade. In addition, the conductive paste can be filled in the groove of the elastic portion in a state of being raised from the opening edge of the groove. Since the conductive paste is filled in the groove of the elastic part so as to rise above the opening edge of the groove, the size corresponding to the width direction of the part chip in the wraparound part of the application paste just by pressing the component chip lightly against the surface of the elastic part And the shape of the wraparound portion of the conductive paste applied to the component chip by pressing against the surface of the elastic body can be stabilized.

Further, in the third electrode forming method according to the present invention, the conductive paste for the electrode is supplied to the surface of the elastic portion having the groove, and excess conductive paste is scraped off from the surface of the elastic portion by a blade. A method for forming an electrode of an electronic component, comprising: applying a conductive paste filled in a groove to a component chip by pressing a component chip against a surface of the elastic portion after filling the conductive paste in the groove. The use of a blade having a convex portion facing the groove at the contact end, so that when the excess conductive paste is scraped off from the surface of the elastic portion by the blade, the conductive paste is lower than the opening edge of the groove. Features.

According to the third electrode forming method, since the convex portion facing the groove of the elastic portion is provided at the contact end of the blade, the excess conductive paste is scraped off from the surface of the elastic portion by the blade. In addition, the conductive paste can be filled in the groove of the elastic portion so as to be lower than the opening edge of the groove. Since the conductive paste is filled into the groove of the elastic portion so as to be lower than the opening edge of the groove, when the component chip is pressed against the surface of the elastic portion, the filling paste is prevented from protruding from the groove to the surface side. By pressing the elastic body against the surface, the shape of the wraparound portion of the conductive paste applied to the component chip can be stabilized, while the first electrode forming apparatus according to the present invention provides a conductive paste for the electrode on the component chip. An electrode forming apparatus for an electronic component, comprising: an elastic portion having a groove on a surface thereof;
A blade for scraping excess conductive paste from the surface of the elastic part to which the conductive paste for the electrode is supplied and filling the conductive paste in the groove, and a blade for scraping excess conductive paste from the surface of the elastic part. Constant pressure means for maintaining the contact pressure of the blade against the surface of the elastic portion constant. According to the first electrode forming apparatus, the first electrode forming method can be accurately performed.

According to a second aspect of the present invention, there is provided an electrode forming apparatus for an electronic component having means for applying a conductor paste for an electrode to a component chip, wherein the means has an elastic surface having a groove on a surface thereof. And a blade for scraping excess conductive paste from the surface of the elastic portion to which the conductive paste for the electrode is supplied and filling the groove with the conductive paste, and a blade scraping excess conductive paste from the surface of the elastic portion. It is characterized in that the contact end of the blade is provided with a concave portion provided opposite to the groove of the elastic portion so that the conductive paste rises more than the opening edge of the groove when removing.
According to the second electrode forming apparatus, the second electrode forming method can be accurately performed.

Further, a third electrode forming apparatus according to the present invention is an electrode forming apparatus for an electronic component comprising means for applying a conductor paste for an electrode to a component chip, wherein the means has an elastic surface having a groove on a surface. And a blade for scraping excess conductive paste from the surface of the elastic portion to which the conductive paste for the electrode is supplied and filling the groove with the conductive paste, and a blade scraping excess conductive paste from the surface of the elastic portion. It is characterized in that the contact end of the blade is provided with a convex portion provided to face the groove of the elastic portion so that the conductive paste is lower than the opening edge of the groove when removing.
According to the third electrode forming apparatus, the third electrode forming method can be accurately performed.

The above and other objects, structural features, and operational effects of the present invention will become apparent from the following description and the accompanying drawings.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS [First Embodiment] FIGS. 4 to 6 show a first embodiment of the present invention. In the drawings, reference numeral 11 denotes a coating plate, 12 denotes a paste scraping means, and CP denotes an electrode. Conductor paste for use. In the following description, FIGS.
Are referred to by reference numerals and names.

The coating plate 11 includes a plate-like elastic portion 11a made of an elastic material such as silicon rubber and a plate-like rigid portion 11b made of a rigid material such as stainless steel and supporting the lower surface of the elastic portion 11a. I have. Four grooves 11 corresponding to the number and positions of the electrodes 1b are formed on the surface of the elastic portion 11a.
a1 is formed in parallel.

The paste scraping means 12 includes a U-shaped slider 12a, a shaft 12b, a stopper rod 12c, and a spring engagement rod 1 provided on the slider 12a.
2d, a sharp blade 12e having a through hole 12e1 and a stopper portion 12e2 and rotatably provided on the shaft 12b through the through hole 12e1, and extending between the stopper portion 12e2 of the blade 12e and the spring engaging rod 12d. And provided coil spring 12f. Blade 12e
The stopper portion 12e2 defines the initial position of the blade 12e by contact with the stopper rod 12c. The slider 12a of the paste scraping means 12 is parallel to the surface of the rigid portion 11b of the application plate 11 by a linear drive mechanism such as a motor-driven ball screw and a nut screwed into the nut, or a linear drive actuator such as a cylinder. You can move.

When applying the conductive paste CP to the component chip 1a, first, the elastic portion 11a of the application plate 11 is applied.
Then, the slider 12a is moved rightward in FIG. 4 while the tip of the blade 12e of the paste scraping means 12 is in contact with the surface of the elastic portion 11a.

As a result, as shown in FIG.
Excessive conductive paste CP is applied to blade 12e from the surface of
Conductor paste C in each groove 11a1
P is filled. Since the blade 12e is urged in the counterclockwise direction in FIG. 4 by the coil spring 12f, the tip of the blade 12e maintains a constant contact pressure against the surface of the elastic portion 11a even when the surface of the elastic portion 11a has undulations. It slides along the surface undulation as it is. In the case of a fixed type blade, if the surface of the elastic portion 11a has undulations, the blade 12
The contact pressure of e changes according to the undulation, and the change in the contact pressure causes a variation in the paste filling amount in each groove 11a1, but the paste scraping means 12 does not cause such a problem. Therefore, the filling amount of the paste in each groove 11a1 becomes uniform.

After filling the paste, the carrier plate (not shown) holding the component chip 1a in a predetermined posture is lowered, and one surface in the width direction of the component chip 1a is placed on the surface of the elastic portion 11a as shown in FIG. Press. After pressing,
By raising the carrier plate, the component chip 1a pressed against the surface of the elastic portion 11a is separated from the elastic portion 11a. Incidentally, the carrier plate is a plate-like elastic portion made of an elastic material such as silicone rubber and having a large number of holding holes formed in a predetermined arrangement, and a rigidity disposed around the elastic portion and inside the portion except for the holding holes. The component chip 1a is elastically held in the holding hole of the elastic portion in a predetermined posture and partially protruded.

Due to the pressing, the component chip 1a slightly sinks into the elastic portion 11a, and the conductive paste CP filled in each groove 11a1 is applied to one surface in the width direction of the component chip 1a and is adjacent to the same surface. It is also applied to the edges on both sides in the height direction. The application of the conductive paste CP to the component chip 1a is performed in the same manner on the other surface in the width direction of the component chip 1a after the application paste CP is dried. After the application paste CP is dried, the component chip 1a is applied. Into a firing furnace to fire the dried application paste CP. The firing of the component chip 1a may be performed simultaneously with the firing of the conductive paste CP, or may be performed before the conductive paste CP is applied. Thus, the multilayer capacitor array 1 shown in FIG. 1 is manufactured.

As described above, each groove 1 of the elastic portion 11a is
Since the conductive paste CP is uniformly filled in 1a1, the shape of the wraparound portion of the conductive paste CP applied to the component chip 1a by pressing against the surface of the elastic body 11a, that is, the shape of the wraparound portion 1b1 of the electrode 1b Can be stabilized. As a result, it is possible to satisfactorily perform component mounting while avoiding the problem of mounting failure due to the defective shape of the wraparound portion 1b1 of the electrode 1b, and to obtain the same effect even when the electrode size is miniaturized. it can.

FIGS. 4 to 6 illustrate the paste application method using the application plate 11, but the above concept can be applied to a paste application method using an application roller. 7 shows an application form of FIG.
3 is an application roller, 14 is a container containing the conductive paste CP, and 15 is a paste scraping means.

The application roller 13 includes a cylindrical elastic portion 13a made of an elastic material such as silicon rubber and a cylindrical rigid portion 13b made of a rigid material such as stainless steel and supporting the inner peripheral surface of the elastic portion 13a. Have been. Elastic part 13a
3B, four grooves (not shown) corresponding to the number and positions of the electrodes 1b are formed in parallel, similarly to FIG. 3B.

The paste scraping means 15 includes a U-shaped frame 15a and a shaft 1 mounted on the slider 15a.
5b, stopper rod 15c and spring engaging rod 15
d, a sharp blade 15e having a through hole 15e1 and a spring engaging portion 15e2 and rotatably provided on the shaft 15b through the through hole 15e1, and a spring engaging portion 15e2 of the blade 15e and a spring engaging rod 15d. And a coil spring 15f stretched therebetween. The stopper portion 15e2 of the blade 15e defines an initial position of the blade 12e by contact with the stopper rod 15c. The frame 15 a of the paste scraping means 15 is fixed to the container 14.

When applying the conductive paste CP to the component chip 1a, first, the conductive paste CP is supplied to the surface of the elastic portion 13a using the rotation of the application roller 13 in the direction of the arrow, and the blade 15e of the paste scraping means 15 is supplied. Is brought into contact with the surface of the elastic portion 13a.

As a result, excess conductive paste CP is scraped off from the surface of the elastic portion 13a by the blade 15e, and each groove is filled with the conductive paste CP. Since the blade 15e is urged counterclockwise in FIG. 7 by the coil spring 15f, the tip of the blade 15e is
The object a slides along the surface undulations while keeping the contact pressure on the surface constant. In the case of a fixed type blade, if the surface of the elastic portion 13a has undulations, the elastic portion 1
The contact pressure of the blade 15e with the surface of the blade 3a changes according to the undulations, and the change in the contact pressure causes variations in the amount of paste filling in each groove. Does not occur, and the filling amount of the paste in each groove becomes uniform.

After the paste is filled, the carrier tape (not shown) holding the component chip 1a in a predetermined posture is moved in the tangential direction of the application roller 13 so that the component chip 1a is moved.
Is pressed against the surface of the elastic portion 13a. After the pressing, the elastic portion 13a is moved by the movement of the carrier tape.
The component chip 1a pressed against the surface of the
Pull away from. By the way, with the carrier tape,
A band-shaped elastic layer formed of an elastic material such as silicon rubber and having a large number of holding holes formed at equal intervals in the tape length direction, and a rigid tape having a bendable thickness arranged at the center in the thickness direction of the elastic layer. A component chip 1
“a” is elastically held in the holding hole of the elastic layer in a predetermined posture and with a part thereof protruding.

Due to the pressing, the component chip 1a slightly sinks into the elastic portion 13a, and the conductive paste CP filled in each groove is applied to one surface in the width direction of the component chip 1a, and at the same time, the height adjacent to the same surface is increased. It is also applied to the edges of both sides in the vertical direction. The application of the conductor paste CP to the component chip 1a is similarly performed on the other surface in the width direction of the component chip 1a after the application paste CP is dried.
After the application paste CP is dried, the component chips 1a are put into a firing furnace, and the dried application paste CP is fired. The firing of the component chip 1a may be performed simultaneously with the firing of the conductive paste CP, or may be performed before the conductive paste CP is applied. Thus, the multilayer capacitor array 1 shown in FIG. 1 is manufactured.

As described above, since the conductive paste CP is uniformly filled in each groove of the elastic portion 13a, the conductive paste CP applied to the component chip 1a by being pressed against the surface of the elastic body 11a. The shape of the wraparound portion, that is, the shape of the wraparound portion 1b1 of the electrode 1b can be stabilized. Thereby, the wraparound portion 1b1 of the electrode 1b
The component mounting can be performed satisfactorily by avoiding the problem of mounting failure caused by the defective shape of the above, and the same effect can be obtained even when the electrode size is miniaturized.

In the above description, the paste scraping means 12
Although the coil springs 12f and 15f have been illustrated as means for biasing the blades 12e and 15e of the first and second embodiments, a spring material other than the coil spring may be used, or the contact pressure of the blades 12e and 15e may be kept constant by using air pressure. It may be. If the sliders 12a and 15a are configured to be able to swing in the direction orthogonal to the grooves of the elastic portions 11a and 13a by a method of supporting both sides of the sliders 12a and 15a with coil springs, the elastic portion 11
blades 12a and 1 for surface undulations of a and 13a
5a can be further improved.

Further, in the above description, the case where a total of four pairs of component electrodes 1b are formed on the component chip 1a in the multilayer capacitor array 1 shown in FIG. When forming electrodes on a capacitor array, the same method and apparatus as described above can be used. Of course, one or more electrodes having the same shape are formed on various electronic components such as chip components, array components, and composite components other than the multilayer capacitor array. Even in this case, the same method and apparatus as described above can be used, and the same operation and effect as described above can be obtained.

Second Embodiment FIGS. 8 to 11 show a second embodiment of the present invention. In the drawings, reference numeral 11 denotes an application plate, 12 denotes a paste scraping means, and CP denotes a conductor paste for an electrode. It is. In the following description, the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted. Further, as in the first embodiment, in the following description, reference numerals and names shown in FIG. 1 and FIG. 1 are cited.

The second embodiment is different from the first embodiment in that each groove 11a of the elastic portion 11a of the coating plate 11 is provided at the tip of the blade 12e of the paste scraping means 12.
1, more specifically, is provided with a concave portion 12e3 matching the width and arrangement of the grooves 11a1 and having a depth of about half the depth of the grooves 11a1.

When applying the conductor paste CP to the component chip 1a, first, the elastic portion 11a of the application plate 11 is applied.
Is supplied to the surface of the elastic portion 11a, and then the slider 12a is moved while the tip of the blade 12e of the paste scraping means 12 is in contact with the surface of the elastic portion 11a.

As a result, as shown in FIG.
Excessive conductive paste CP is applied to blade 12e from the surface of
Conductor paste C in each groove 11a1
P is filled. An elastic portion 1 is provided at the contact end of the blade 12e.
Since the recesses 12e3 facing the respective grooves 11a1 of the recesses 1a are formed, when the excess conductor paste CP is scraped off from the surface of the elastic portion 11a by the blade 12e, as shown in FIG. The conductive paste CP rises from the opening edge of each groove 11a1 by the matched height. The blade 12e is a coil spring 12
f, the tip of the blade 12e is kept in contact with the elastic portion 11a even when the surface of the elastic portion 11a has undulations.
While the contact pressure on the surface a is maintained at a constant level, it slides along the surface undulations. As a result, the amount of paste filling in each groove 11a1 including the above-mentioned raised portion becomes uniform.

After filling the paste, the carrier plate (not shown) holding the component chip 1a in a predetermined posture is lowered, and one surface in the width direction of the component chip 1a is placed on the surface of the elastic portion 11a as shown in FIG. Press. After the pressing, the carrier plate is raised to separate the component chip 1a pressed against the surface of the elastic portion 11a from the elastic portion 11a. The carrier plate is the same as that described in the first embodiment.

Due to the pressing, the component chip 1a slightly sinks into the elastic portion 11a, and the conductive paste CP filled in each groove 11a1 is applied to one surface in the width direction of the component chip 1a and is adjacent to the same surface. It is also applied to the edges on both sides in the height direction. The application of the conductive paste CP to the component chip 1a is performed in the same manner on the other surface in the width direction of the component chip 1a after the application paste CP is dried. After the application paste CP is dried, the component chip 1a is applied. Into a firing furnace to fire the dried application paste CP. The firing of the component chip 1a may be performed simultaneously with the firing of the conductive paste CP, or may be performed before the conductive paste CP is applied. Thus, the multilayer capacitor array 1 shown in FIG. 1 is manufactured.

As described above, each groove 1 of the elastic portion 11a is
1a1 is filled with the conductive paste CP so as to be higher than the opening edge of each groove 11a1.
a is pressed lightly against the surface of the elastic portion 11a to sufficiently secure the dimension corresponding to the reference symbol E2 in FIG. 1 in the wraparound portion of the application paste CP, and is applied to the component chip 1a by pressing against the surface of the elastic body 11a. Conductor paste CP
, That is, the shape of the wraparound portion 1b1 of the electrode 1b can be stabilized. This allows
It is possible to satisfactorily mount components by avoiding the problem of defective mounting due to the defective shape of the wraparound portion 1b1 of the electrode 1b, and the same effect can be obtained even when the electrode size is miniaturized.

FIGS. 8 to 11 illustrate the paste application method using the application plate 11, but the above concept can be applied to a paste application method using an application roller. Specifically, the paste scraping means 1 shown in FIG.
If the same recesses as described above facing the respective grooves of the elastic portion 13a of the application roller 13 are provided at the tip of the blade 15e of No. 5, the same effect as the paste application method using the application plate 11 can be obtained.

In the above description, the paste scraping means 12
As means for urging the blade 12e, the coil spring 12
Although f is illustrated, a spring material other than a coil spring may be used,
The contact pressure of the blade 12e may be kept constant using air pressure. Further, if the slider 12a can be swung in a direction orthogonal to the groove of the elastic portion 11a by a method of supporting both sides of the slider 12a with a coil spring or the like, the followability of the blade 12a to the surface unevenness of the elastic portion 11a is further improved. be able to.
Incidentally, these techniques can also be applied to the case where a recess is formed at the tip of the blade 15e of the paste scraping means 15 shown in FIG.

In the above description, the contact pressure of the blade of the paste scraping means is kept constant by using a constant pressure means composed of a coil spring or the like. However, the conductive paste rises from the opening edge of the groove. The effect of filling as described above can be similarly obtained even when a fixed type blade is used.

Further, in the above description, a case has been exemplified where a total of four pairs of component electrodes 1b are formed on the component chip 1a in the multilayer capacitor array 1 shown in FIG. When forming electrodes on a capacitor array, the same method and apparatus as described above can be used. Of course, one or more electrodes having the same shape are formed on various electronic components such as chip components, array components, and composite components other than the multilayer capacitor array. Even in this case, the same method and apparatus as described above can be used, and the same operation and effect as described above can be obtained.

Third Embodiment FIGS. 12 to 15 show a third embodiment of the present invention. In the drawings, reference numeral 11 denotes an application plate, 12 denotes a paste scraping means, and CP denotes a conductor paste for an electrode. It is. In the following description, the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted. Further, as in the first embodiment, in the following description, reference numerals and names shown in FIG. 1 and FIG. 1 are cited.

The third embodiment is different from the first embodiment in that the groove 11 of the elastic portion 11a of the coating plate 11
The elastic portion 11a of the application plate 11 is provided at the point where the depth of the a2 is made deeper than the groove 11a1 by the height of a convex portion 12e4 described later and at the tip of the blade 12e of the paste scraping means 12.
The protrusions 12e4 oppose the respective grooves 11a1. More specifically, the protrusions 12e4 have a height matching the width and arrangement of the grooves 11a1 and having a height of about 1/3 of the depth of the grooves 11a2.

When applying the conductor paste CP to the component chip 1a, first, the elastic portion 11a of the application plate 11 is applied.
Is supplied to the surface of the elastic portion 11a, and then the slider 12a is moved while the tip of the blade 12e of the paste scraping means 12 is in contact with the surface of the elastic portion 11a.

As a result, as shown in FIG.
Excess conductor paste CP is applied to blade 12 from the surface of 1a.
e, the grooves 11a2 are filled with the conductive paste CP. At the contact end of the blade 12e, a convex portion 12e4 facing each groove 11a2 of the elastic portion 11a is formed. Therefore, when the excess conductor paste CP is scraped off from the surface of the elastic portion 11a by the blade 12e,
As shown in FIG. 14, the conductive paste CP is lower than the opening edge of each groove 11a1 by a depth substantially corresponding to the height of each protrusion 12e4. The blade 12e is a coil spring 1
2f, the tip of the blade 12e remains in the elastic portion 1a even when the surface of the elastic portion 11a has undulations.
1a is slid along the surface undulations while keeping the contact pressure against the surface constant.
The filling amount of the paste in 1a2 becomes uniform.

After filling the paste, the carrier plate (not shown) holding the component chip 1a in a predetermined posture is lowered, and one surface in the width direction of the component chip 1a is placed on the surface of the elastic portion 11a as shown in FIG. Press. After the pressing, the carrier plate is raised to separate the component chip 1a pressed against the surface of the elastic portion 11a from the elastic portion 11a. The carrier plate is the same as that described in the first embodiment.

Due to the pressing, the component chip 1a slightly sinks into the elastic portion 11a, and the conductive paste CP filled in each groove 11a2 is applied to one surface in the width direction of the component chip 1a and is adjacent to the same surface. It is also applied to the edges on both sides in the height direction. The application of the conductive paste CP to the component chip 1a is performed in the same manner on the other surface in the width direction of the component chip 1a after the application paste CP is dried. After the application paste CP is dried, the component chip 1a is applied. Into a firing furnace to fire the dried application paste CP. The firing of the component chip 1a may be performed simultaneously with the firing of the conductive paste CP, or may be performed before the conductive paste CP is applied. Thus, the multilayer capacitor array 1 shown in FIG. 1 is manufactured.

As described above, each groove 1 of the elastic portion 11a is
1a2 is filled with the conductive paste CP so as to be lower than the opening edge of each groove 11a2.
When pressing a on the surface of the elastic portion 11a, the filling paste CP is prevented from protruding from each groove 11a2 to the surface side, and the conductive paste CP applied to the component chip 1a by pressing on the surface of the elastic body 11a is suppressed. The shape of the portion, that is, the shape of the wraparound portion 1b1 of the electrode 1b can be stabilized. As a result, it is possible to satisfactorily perform component mounting while avoiding the problem of mounting failure due to the defective shape of the wraparound portion 1b1 of the electrode 1b, and to obtain the same effect even when the electrode size is miniaturized. it can.

FIGS. 12 to 15 illustrate the paste application method using the application plate 11, but the above concept can be applied to a paste application method using an application roller. Specifically, if the same protruding portion as described above facing each groove of the elastic portion 13a of the application roller 13 is provided at the tip of the blade 15e of the paste scraping means 15 shown in FIG.
The same operation and effect as those of the paste application method using the application plate 11 can be obtained.

In the above description, the paste scraping means 12
As means for urging the blade 12e, the coil spring 12
Although f is illustrated, a spring material other than a coil spring may be used,
The contact pressure of the blade 12e may be kept constant using air pressure. Further, if the slider 12a can be swung in a direction orthogonal to the groove of the elastic portion 11a by a method of supporting both sides of the slider 12a with a coil spring or the like, the followability of the blade 12a to the surface unevenness of the elastic portion 11a is further improved. be able to.
Incidentally, these techniques can also be applied to the case where a recess is formed at the tip of the blade 15e of the paste scraping means 15 shown in FIG.

In the above description, the contact pressure of the blade of the paste scraping means is kept constant by using a constant pressure means composed of a coil spring or the like. However, the conductive paste is kept lower than the opening edge of the groove. The same effect can be obtained even when a fixed type blade is used.

Further, in the above description, the case where a total of four pairs of component electrodes 1b are formed on the component chip 1a in the multilayer capacitor array 1 shown in FIG. When forming electrodes on a capacitor array, the same method and apparatus as described above can be used. Of course, one or more electrodes having the same shape are formed on various electronic components such as chip components, array components, and composite components other than the multilayer capacitor array. Even in this case, the same method and apparatus as described above can be used, and the same operation and effect as described above can be obtained.

[Other Embodiments] FIGS. 16 to 19 show modified examples applicable to the first to third embodiments.

FIGS. 16A to 16C show FIGS. 4 to 6 and FIG.
11 and 13 to 15 show modifications of the cross-sectional shape of the grooves 11a1 and 11a2 of the elastic portion 11a of the coating plate 11 shown in FIGS.
16A shows a groove 11a3 having a trapezoidal cross section, FIG. 16B shows a groove 11a4 having a substantially U-shaped cross section, and FIG. Groove 11a5
Is shown. Of course, the groove shapes shown in FIGS. 16A to 16C correspond to the elastic portions 13a of the application roller 13 shown in FIG.
It can also be applied to grooves.

FIG. 17A shows FIGS. 4 to 6 and FIGS.
And coating plate 1 shown in each of FIGS. 13 to 15
1 shows an example in which the surface of the elastic portion 11a is a rough surface RS, and the rough surface RS is formed of such fine irregularities that the excess conductor paste CP can be scraped off from the surface of the elastic portion 11a by the blade 12e. . If the surface of the elastic portion 11a is formed as a rough surface RS, the adhesive force of the component chip 1a can be reduced when the component chip 1a is pressed against the surface of the elastic body 11a as shown in FIG. When the component chip 1a is separated from the elastic portion 11a, it is possible to prevent the component chip 1a from falling out of the carrier plate or the carrier tape due to the adhesion force. Of course, the configuration in which the surface of the first elastic portion 11a is roughened is the same as that of the elastic portion 13a of the application roller 13 shown in FIG.
Also applicable to

FIG. 18A shows that a reinforcing portion 21b1 having a convex shape is formed on the surface of a rigid portion 21b constituting the coating plate 21, and the reinforcing portion 21b1 is arranged inside the portion between the grooves 21a1 of the elastic portion 21a. Here is an example. If the reinforcing portion 21b1 is provided inside the portion between the grooves 21a1, the elastic portion 21a is provided in a state where the component chip 1a is inclined as shown in FIG.
The deformation of the groove 21a1 that can occur when pressed against the surface of the coating paste can be suppressed, and the shape of the wraparound portion of the application paste can be prevented from being disturbed. Of course, the groove 21a of the elastic portion 21a
The configuration in which the reinforcing portion 21b1 is provided inside the portion between the two is shown in FIG.
6, FIG. 9 to FIG. 11, and FIG. 13 to FIG. 15 can be applied to the coating plate 11 and the coating roller 13 shown in FIG.

FIG. 19 shows an example in which the outer diameter of the application roller 13 shown in FIG. 7 is enlarged. If the outer diameter of the application roller 13 is small, the contact time between the surface of the elastic portion 13a and the component chip 1a is short, so that the paste may not be sufficiently applied, and the component chip 1a with respect to the surface of the elastic portion 13a.
When the outer diameter of the application roller 13 is increased as much as possible, the elastic portion 13a may be deformed.
It is possible to extend the contact time between the surface of the component chip 1a and the component chip 1a to perform the paste application satisfactorily, and to reduce the angle of entry of the component chip 1a into the surface of the elastic portion 13a. This prevents the attitude of the component chip 1a from being disturbed.

FIG. 20 shows a method and an apparatus for applying the conductor paste CP to the component chip 1a by using an application belt 31 different from the application plate or the application roller.

The application belt 31 is made of an endless elastic belt made of an elastic material such as silicon rubber, or a belt formed by attaching an elastic belt to the surface of an endless rigid belt having a bendable thickness. A pair of pulleys 32
Under a predetermined tension. Grooves corresponding to the number and positions of the electrodes 1b are formed on the surface of the application belt 31. Further, a container 33 for accommodating the conductive paste 33 is disposed on the upper flat portion of the application belt 31, and a blade 34 for scraping excess conductor paste CP from the surface of the application belt 31 is provided on one side thereof, A flat support 35 that supports the inner peripheral surface of the application belt 31 is provided below the container 33 and the blade 34.

When the conductor paste CP is applied to the component chip 1a by using this apparatus, the application belt 31 is moved in the direction of the arrow to supply the conductor paste CP to the surface of the application belt 31 and to apply the conductor paste CP to the surface of the application belt 31. Excess conductor paste CP is scraped from the surface of the application belt 31 by the contacting blade 34, and the groove is filled with the conductor paste CP. After filling the paste, the carrier plate (not shown) holding the component chip 1a in a predetermined posture is lowered to press a predetermined surface of the component chip 1a against the surface of the elastic portion 11a. After the pressing, the carrier plate is raised, and the component chip 1a pressed against the application belt 31 is pressed.
Is separated from the application belt 31. The carrier plate is the same as that described in the first embodiment.

According to the method and the apparatus, the conductive paste can be continuously supplied to the surface of the endless coating belt 31 to fill the groove with the conductive paste.
Can be used as a paste application surface, so that there is an advantage that the paste can be efficiently applied to the component chip 1a. Further, if a constant pressure means as in the first embodiment is added to the blade 34, or if a concave portion or a convex portion similar to those of the second and third embodiments is provided at the contact end of the blade 34, A similar effect can be obtained.

[0068]

As described in detail above, according to the present invention,
Since the shape of the wraparound portion of the conductor paste applied to the component chip, that is, the shape of the wraparound portion of the electrode, can be stabilized, it is possible to avoid the problem of mounting failure due to the defective shape of the wraparound portion of the electrode and to reduce the component. The mounting can be performed well, and the same effect can be obtained even when the electrode size is miniaturized.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a multilayer capacitor array.

FIG. 2 is a diagram showing a conventional method and a conventional apparatus for applying a conductive paste to a component chip using an application plate.

FIG. 3 is a diagram showing a conventional method and a conventional apparatus for applying a conductive paste to a component chip using an application roller.

FIG. 4 is a diagram showing a paste application method and apparatus using an application plate according to the first embodiment of the present invention.

5 is a view of the paste scraping means of FIG. 4 as viewed from the left side.

FIG. 6 is a diagram showing a state in which a component chip is pressed against the surface of an elastic portion of a coating plate.

FIG. 7 is a diagram showing a form in which the concept shown in FIGS. 4 to 6 is applied to a paste application method and apparatus using an application roller.

FIG. 8 is a side view of a paste scraping unit according to a second embodiment of the present invention.

FIG. 9 is a view showing a paste application method and apparatus using an application plate according to a second embodiment of the present invention.

FIG. 10 is a diagram showing a state in which a conductive paste is filled in a groove of an elastic portion of a coating plate.

FIG. 11 is a diagram showing a state in which a component chip is pressed against the surface of an elastic portion of a coating plate.

FIG. 12 is a side view of a paste scraping unit according to a third embodiment of the present invention.

FIG. 13 is a view showing a paste application method and apparatus using an application plate according to a third embodiment of the present invention.

FIG. 14 is a view showing a state in which a conductive paste is filled in a groove of an elastic portion of a coating plate.

FIG. 15 is a diagram showing a state in which a component chip is pressed against the surface of an elastic portion of a coating plate.

FIG. 16 is a longitudinal sectional view of a groove portion of an elastic portion of an application plate, showing a modification applicable to each of the first to third embodiments.

FIG. 17 is a vertical cross-sectional view of a coating plate, showing a modification applicable to each of the first to third embodiments, and a diagram showing a state in which a component chip is pressed against the surface of an elastic portion of the coating plate.

FIG. 18 is a vertical cross-sectional view of a coating plate, showing a modification applicable to each of the first to third embodiments, and a diagram showing a state in which a component chip is pressed against the surface of an elastic portion of the coating plate.

FIG. 19 is a partial side view of an application roller, showing a modification applicable to each of the first to third embodiments.

FIG. 20 is a diagram showing a method and an apparatus for applying a conductive paste to a component chip using an application belt different from an application plate or an application roller.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Capacitor array, 1a ... Part chip, 1b ... Electrode, 1b1 ... Wound part, CP ... Conductor paste, 11 ...
Coating plate, 11a ... elastic part, 11a1, 11a2,
11a3, 11a4, 11a5 ... groove, 12 ... paste scraping means, 12e ... blade, 12e3 ... recess, 12e4
... Convex part, 12f ... Coil spring, 13 ... Application roller, 1
3a: elastic portion, 15: paste scraping means, 15e: blade, 15f: coil spring, RS: rough surface, 21: coating plate, 21a: elastic portion, 21a1, groove, 21b1: reinforcing portion, 31: coating belt, 32 ... pulley, 33 ... container, 34 ... blade.

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Kazuo Sugai, 6-16-20 Ueno, Taito-ku, Tokyo Taiyo Denki Co., Ltd. (72) Shinichi Sugita 6-16-20, Ueno, Taito-ku, Tokyo Taiyo Denki Co., Ltd. (72) Inventor Kazuo Naganuma 6-16-20 Ueno, Taito-ku, Tokyo Taiyo Denki Co., Ltd. (72) Inventor Haruhiko Matsushita 6-16-20 Ueno, Taito-ku, Tokyo Taiyo Induction (72) Inventor Hiroyuki Mogi 6-16-20 Ueno, Taito-ku, Tokyo Taiyo Denki Co., Ltd. F-term (reference) 5E082 AA01 AB03 CC03 CC17 EE04 EE11 EE23 EE35 FF05 FG06 FG26 FG46 GG10 GG28 JJ03 JJ07 JJ07 JJ23 KK01

Claims (8)

[Claims] 1. A conductive paste for an electrode is supplied to the surface of an elastic portion having a groove, and excess conductive paste is scraped off from the surface of the elastic portion by a blade to fill the groove with the conductive paste. A method of forming an electrode of an electronic component, comprising applying a conductive paste filled in a groove to a component chip by pressing the conductive paste onto the surface of the elastic portion. A method for forming an electrode of an electronic component, wherein excess conductive paste is scraped off from the surface of the elastic part by a blade. 2. A conductive paste for an electrode is supplied to a surface of an elastic portion having a groove, and excess conductive paste is scraped from a surface of the elastic portion by a blade to fill the groove with the conductive paste, and then a component chip is formed. Forming a conductive paste filled in the groove on the surface of the elastic part by applying the conductive paste to the component chip. Wherein the conductive paste rises above the opening edge of the groove when scraping excess conductive paste from the surface of the elastic portion with a blade. 3. A conductive paste for an electrode is supplied to the surface of the elastic portion having the groove, and excess conductive paste is scraped off from the surface of the elastic portion by a blade to fill the groove with the conductive paste. The electrode paste of the electronic component comprising a step of applying a conductive paste filled in the groove to the component chip by pressing the elastic paste on the surface of the elastic part, wherein the contact end has a convex part facing the groove of the elastic part. A method for forming an electrode for an electronic component, comprising: using a blade, scraping excess conductive paste from the surface of the elastic portion with the blade, so that the conductive paste is lower than the opening edge of the groove. 4. An electrode forming apparatus for an electronic component, comprising: means for applying a conductor paste for an electrode to a component chip, wherein the means is provided with an elastic portion having a groove on a surface and a conductor paste for an electrode. A blade for scraping excess conductive paste from the surface of the elastic portion and filling the groove with the conductive paste, and a contact pressure of the blade against the surface of the elastic portion when the excess conductive paste is scraped off from the surface of the elastic portion by the blade. And a constant-pressure means for maintaining the pressure constant. 5. An electrode forming apparatus for an electronic component, comprising: means for applying a conductive paste for an electrode to a component chip, wherein said means is provided with an elastic portion having a groove on a surface and a conductive paste for an electrode. A blade for scraping excess conductive paste from the surface of the elastic part and filling the groove with conductive paste, and when scraping excess conductive paste from the surface of the elastic part with a blade, the conductive paste is larger than the opening edge of the groove. An electrode forming device for an electronic component, comprising: a concave portion provided at a contact end of a blade so as to swell so as to face a groove of an elastic portion. 6. An electrode forming apparatus for an electronic component, comprising: means for applying a conductor paste for an electrode to a component chip, wherein the means is provided with an elastic portion having a groove on a surface and a conductor paste for an electrode. A blade for scraping excess conductive paste from the surface of the elastic part and filling the groove with conductive paste, and when scraping excess conductive paste from the surface of the elastic part with a blade, the conductive paste is larger than the opening edge of the groove. An electrode forming apparatus for an electronic component, comprising: a protruding portion provided at a contact end of a blade so as to be at a low position so as to face a groove of an elastic portion. 7. The elastic part according to claim 4, wherein the surface of the elastic part is a rough surface composed of fine irregularities such that excess conductive paste can be scraped off from the surface of the elastic part by a blade. The electrode forming apparatus for an electronic component according to claim 1. 8. A reinforcing portion for suppressing groove deformation when a component chip is pressed against the surface of the elastic portion after the conductive paste is filled in the groove, inside the inter-groove portion of the elastic member. The electrode forming apparatus for an electronic component according to any one of claims 4 to 7, wherein: