JP2002158148A - Method of forming electrode of electronic component and device for forming the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of forming an electrode capable of stably forming the sinking portion of the electrode. SOLUTION: Since the second elastic part 11b supporting the first elastic part 11a is harder than the first elastic part 11a, when a component chip 1a is pressed onto the first elastic part 11a to apply a conductive paste CP thereto, the first elastic part 11a is pressed to be deformed, whereas the second elastic part 11b is slightly deformed but acts such that it regulates the amount of sinking of the component chip 1a. That is, the size of the sneak path of the conductive paste CP applied to the component chip 1a, which corresponds to a reference character E2 in Fig. 1, can be made nearly equal to the depth of the trench 11a1. This can stabilize the shape of the sneak path of the conductive paste CP, or the shape of the sneak path 1b1 of an electrode 1b.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method and an apparatus for forming electrodes on component chips for various electronic components such as chip components, array components and composite components.

[0002]

2. Description of the Related Art FIG. 1 shows a capacitor type capacitor array known as one of array components. This capacitor array 1 has four capacitor portions arranged in parallel in a quadrangular prism-shaped component chip 1a made of ceramic. It is built in a state, and has a total of four pairs of electrodes 1b that are electrically connected to the respective capacitor sections, on both sides in the width direction of the component chip 1a. In order to enable surface mounting on a substrate, each electrode 1b is provided with a portion 1b1 (hereinafter referred to as a wraparound portion 1b1) that wraps around both sides in the height direction of the component chip 1a. Incidentally, some capacitor arrays have a number of built-in capacitor portions and a number of electrode pairs other than four.

The electrode 1b is formed by applying a conductor paste for an electrode to the component chip 1a in a predetermined shape, and then drying and firing the applied paste.
For applying the conductive paste, a method using an application plate 2 as shown in FIG. 2 and a method using an application roller 3 as shown in FIG. 3 are mainly employed.

The coating plate 2 shown in FIG. 2 has a plate-like elastic portion 2a made of an elastic material such as silicon rubber and a plate-like rigid portion 2b made of a rigid material such as stainless steel and supporting the lower surface of the elastic portion 2a. It is composed of Four grooves 2 corresponding to the number and positions of the electrodes 1b are formed on the surface of the elastic portion 2a.
a1 is formed in parallel.

[0005] The component chip 1 is
When the conductive paste CP is applied to the groove 2a1, the conductive paste CP is supplied to the surface of the elastic portion 2a of the coating plate 2 and excess conductive paste is scraped off from the surface of the elastic portion 2a by a blade. After filling the paste CP, the carrier plate (not shown) holding the component chip 1a in a predetermined posture is lowered to press one surface in the width direction of the component chip 1a against the surface of the elastic portion 2a, and Pressed component chip 1a
Is pulled away from the elastic portion 2a by raising the carrier plate. The component chip 1a is pressed by the elastic portion 2a during the pressing.
The conductor paste CP filled in each groove 2a1 is applied to one surface in the width direction of the component chip 1a, and at the same time, is also applied to both ends in both height directions adjacent to the same surface. You.

On the other hand, the application roller 3 shown in FIG. 3 has a cylindrical elastic portion 3a made of an elastic material such as silicon rubber,
A cylindrical rigid portion 3b made of a rigid material such as stainless steel and supporting the inner peripheral surface of the elastic portion 3a. On the surface of the elastic portion 3a, four grooves 3a1 corresponding to the number and position of the electrodes 1b are formed in parallel. Incidentally, reference numeral 4 in FIG. 3 denotes a container containing the conductive paste CP,
Reference numeral 5 denotes a blade for scraping the conductive paste CP adhered to the surface of the elastic portion 3a.

[0007] A component chip 1 is
When applying the conductive paste CP to the surface of the elastic portion 3a, the conductive paste CP is supplied to the surface of the elastic portion 3a by using the rotation of the application roller 3 in the direction of the arrow, and the excess conductive paste CP is applied from the surface of the elastic portion 3a by the blade 5. After filling the conductive paste CP in each groove 3a1 by scraping,
A carrier tape (not shown) holding the component chip 1a in a predetermined posture is moved in the tangential direction of the application roller 3 to press one surface in the width direction of the component chip 1a against the surface of the elastic portion 3a, and The pressed component chip 1a is separated from the elastic portion 3a by the movement of the carrier tape. The component chip 1a is pressed by the elastic part 3 during the pressing.
a, the conductive paste CP filled in each groove 3a1 is applied to one surface in the width direction of the component chip 1a, and at the same time, spreads to both ends in both height directions adjacent to the same surface. Is done.

[0008]

In the above-described conventional method using the coating plate 2 or the coating roller 3, the size of the component chip 1 a or the variation in the amount of paste filling in the groove 2 a 1 or each groove 3 a 1 is reduced. It is difficult to stably obtain the shape of the wraparound portion of the application paste defined by reference numerals E2 and E3, that is, the shape of the wraparound portion 1b1 of the electrode 1b. The wraparound portion 1b1 of the electrode 1b is an important part when joining the electrode 1b to the substrate electrode by soldering or the like.
If a shape defect occurs in the device 1, there is a possibility that a problem of a mounting defect may be caused. Needless to say, this problem can also occur when electrodes of the same shape are formed on electronic components other than the capacitor array shown in FIG. 1, and the problem becomes more significant when the electrode size is reduced. Become.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object thereof is to provide an electrode forming method capable of stably forming a wraparound portion of an electrode and an electrode forming apparatus suitable for carrying out the method. It is in.

[0010]

According to a first aspect of the present invention, there is provided a method for forming an electrode, comprising: supplying a conductive paste for an electrode to a surface of an elastic portion having a groove; After the conductive paste is filled in the groove by scraping off excess conductive paste with a blade, a step of applying the conductive paste filled in the groove to the component chip by pressing the component chip against the surface of the elastic portion is provided. In the method for forming an electrode of an electronic component, the elastic part includes a first elastic part having a predetermined hardness and a second elastic part which is harder than the first elastic part and supports the first elastic part. It is characterized by using the one provided on the first elastic part.

According to the first electrode forming method, when the component chip is pressed against the surface of the first elastic portion when the conductive paste is applied, the second elastic portion supporting the first elastic portion is formed by the first elastic portion.
Since the first elastic part is harder than the elastic part, the first elastic part is deformed so as to be crushed, while the second elastic part is slightly deformed by itself, but acts so as to regulate the amount of the component chip sunk. In other words, it is possible to secure a dimension substantially equal to the depth of the groove as a dimension corresponding to the width direction of the component chip of the wraparound portion of the conductor paste applied to the component chip, and thereby, the shape of the wraparound portion of the application paste, that is, The shape of the wraparound portion of the electrode can be stabilized.

In a second method of forming an electrode according to the present invention, a conductive paste for an electrode is supplied to the surface of an elastic portion having a groove, and excess conductive paste is scraped off from the surface of the elastic portion by a blade. The method of forming an electrode of an electronic component, comprising: applying a conductive paste filled in the groove to the component chip by pressing the component chip against the surface of the elastic portion after filling the conductive paste in the groove. As the portion, a first elastic portion having a predetermined hardness and a second elastic portion which is softer than the first elastic portion and supports the first elastic portion, wherein the groove is provided in the first elastic portion is used. The feature is that there was.

According to the second electrode forming method, when the component chip is pressed against the surface of the first elastic portion when the conductive paste is applied, the second elastic portion supporting the first elastic portion is formed by the first elastic portion.
Since the first elastic portion is softer than the elastic portion, the first elastic portion is locally curved without causing a change in thickness, while the second elastic portion is deformed so as to be crushed by the curved portion of the first elastic portion. In other words, it is possible to secure a dimension substantially equal to the width of the groove as a dimension corresponding to the length direction of the component chip in the wraparound portion of the conductor paste applied to the component chip,
Thereby, the shape of the wraparound portion of the application paste, that is, the shape of the wraparound portion of the electrode can be stabilized.

On the other hand, a first electrode forming apparatus according to the present invention is an electrode forming apparatus for an electronic component having means for applying a conductive paste for an electrode to a component chip. Part, and a blade for scraping excess conductive paste from the surface of the elastic part to which the conductive paste for the electrode is supplied and filling the groove with the conductive paste, the elastic part having a predetermined hardness It is characterized by comprising a first elastic portion and a second elastic portion that is harder than the first elastic portion and supports the first elastic portion, wherein the groove is provided in the first elastic portion. According to the first electrode forming apparatus, the first electrode forming method can be accurately performed.

According to a second electrode forming apparatus of the present invention, there is provided an electrode forming apparatus for an electronic component having means for applying a conductor paste for an electrode to a component chip, wherein the means has an elastic surface having a groove on a surface thereof. Part, and a blade for scraping excess conductive paste from the surface of the elastic part to which the conductive paste for the electrode is supplied and filling the groove with the conductive paste, the elastic part having a predetermined hardness A first elastic part and a second elastic part supporting the first elastic part softer than the first elastic part.
An elastic portion, wherein the groove is provided in the first elastic portion. According to the second electrode forming apparatus, the second electrode forming method can be accurately performed.

The above and other objects, structural features, and operational effects of the present invention will become apparent from the following description and the accompanying drawings.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS [First Embodiment] FIGS. 4 to 6 show an example in which the concept of the present invention is applied to a paste coating method using a coating plate. Reference numeral 12 denotes a blade for scraping paste, and CP denotes a conductor paste for electrodes. In the following description, reference numerals and names shown in FIG. 1 and FIG. 1 are cited.

The coating plate 11 has a band-shaped first elastic portion 11a made of an elastic material such as silicon rubber and a plate-shaped second elastic portion made of an elastic material such as silicon rubber and supporting the lower surface of the first elastic portion 11a. 11b and a plate-shaped rigid portion 11c made of a rigid material such as stainless steel and supporting the lower surface of the second elastic portion 11b. Four grooves 11a1 corresponding to the number and position of the electrodes 1b are formed in the first elastic portion 11a.
Are formed in parallel, the depth of each groove 11a1 matches the thickness of the first elastic portion 11a, and the bottom surface of each groove 11a1 is formed by the surface of the second elastic portion 11b.

The hardness of the first elastic portion 11a and the second elastic portion 11b is such that the first elastic portion 11a <the second elastic portion 11b, and the first elastic portion 11a is softer than the second elastic portion 11b. By the way, JIS-K-6253 (ISO-761)
The numerical value measured by the durometer specified in 9) is about 50 for the first elastic part 11a and about 50 for the second elastic part 11a.
Is about 80, but the hardness of the first elastic portion 11a is 40 to 6
0, and the hardness of the second elastic portion 11b is 7
What is necessary is just to be in the range of 0-90.

When the conductor paste CP is applied to the component chip 1a, first, the first elastic portion 1 of the application plate 11 is applied.
The conductive paste CP is supplied to the surface of the first elastic portion 11a, and thereafter, the tip of the blade 12 is moved rightward in FIG. 4 in a state of being in contact with the surface of the first elastic portion 11a. This allows
As shown in FIG. 5, the excess conductive paste CP is scraped off from the surface of the first elastic portion 11a by the blade 12, so that each groove 11a1 is filled with the conductive paste CP.

After filling the paste, the carrier plate (not shown) holding the component chip 1a in a predetermined posture is lowered, and one surface in the width direction of the component chip 1a is brought into contact with the first elastic portion 11a as shown in FIG. Press against the surface. After the pressing, the carrier plate is raised and the first elastic portion 11a
The component chip 1a pressed against the surface of the first elastic portion 1
Separate from 1a. Incidentally, the carrier plate is a plate-like elastic portion made of an elastic material such as silicone rubber and having a large number of holding holes formed in a predetermined arrangement, and a rigidity disposed around the elastic portion and inside the portion except for the holding holes. The component chip 1a is elastically held in the holding hole of the elastic portion in a predetermined posture and partially protruded.

Due to the pressing, the component chip 1a slightly sinks into the first elastic portion 11a, and the conductive paste CP filled in each groove 11a1 is applied to one surface in the width direction of the component chip 1a and is simultaneously formed on the same surface. The coating is also applied to the edges of both sides in the adjacent height direction. The application of the conductive paste CP to the component chip 1a is performed in the same manner on the other surface in the width direction of the component chip 1a after the application paste CP is dried. After the application paste CP is dried, the component chip 1a is applied. Is applied to a firing furnace, and dried application paste C
P is fired. The firing of the component chip 1a may be performed simultaneously with the firing of the conductor paste CP.
It may be performed before the application of P. Thus, the multilayer capacitor array 1 shown in FIG. 1 is manufactured.

When the component chip 1a is pressed against the surface of the first elastic portion 11a when applying the conductor paste CP,
Since the second elastic portion 11b supporting the first elastic portion 11a is harder than the first elastic portion 11a, as shown in FIG. 6, the first elastic portion 11a is deformed so as to be crushed while the second elastic portion 11b is deformed. The part 11b is a part chip 1
It acts to regulate the amount of sunk-in.

In other words, it is possible to secure a dimension substantially equal to the depth of the groove 11a1 as the dimension corresponding to the reference symbol E2 in FIG. 1 in the wraparound portion of the conductor paste CP applied to the component chip 1a. The shape of the wraparound portion, that is, the shape of the wraparound portion 1b1 of the electrode 1b can be stabilized. Therefore, it is possible to satisfactorily mount components by avoiding the problem of defective mounting due to the defective shape of the wraparound portion 1b1 of the electrode 1b, and to obtain the same effect even when the electrode size is reduced. it can.

FIGS. 4 to 6 show examples in which the concept of the present invention is applied to a paste application method using the application plate 11, but the same concept can be applied to a paste application method using an application roller. it can. FIG. 7 shows an example of the application, in which reference numeral 13 denotes an application roller, 14 denotes a container containing the conductive paste CP, and 15 denotes a blade for scraping the paste.

The application roller 13 has a band-shaped first elastic portion 13a made of an elastic material such as silicone rubber and a cylindrical second elastic member 13 made of an elastic material such as silicone rubber and supporting the inner peripheral surface of the first elastic portion 13a. The elastic portion 13b includes a columnar rigid portion 13c made of a rigid material such as stainless steel and supporting the inner peripheral surface of the second elastic portion 13b. 1st elastic part 1
3a, four grooves (not shown) corresponding to the number and positions of the electrodes 1b are formed in parallel, and the depth of each groove matches the thickness of the first elastic portion 13a. The bottom is second
It is constituted by the surface of the elastic portion 13b.

The hardness of the first elastic portion 13a and the second elastic portion 13b is in the relationship of the first elastic portion 13a <the second elastic portion 13b, and the first elastic portion 13a is softer than the second elastic portion 13b. By the way, JIS-K-6253 (ISO-761)
The numerical value measured by the durometer specified in 9) is about 50 for the first elastic portion 13a and about 50 for the second elastic portion 13a.
Is about 80, but the hardness of the first elastic portion 13a is 40 to 6
0, and the hardness of the second elastic portion 13b is 7
What is necessary is just to be in the range of 0-90.

When applying the conductive paste CP to the component chip 1a, first, the conductive paste C is applied to the surface of the first elastic portion 13a by using the rotation of the applying roller 13 in the direction of the arrow.
P is supplied to bring the tip of the blade 15 into contact with the surface of the first elastic portion 13a. As a result, the excess conductive paste CP is scraped off from the surface of the first elastic portion 13a by the blade 15, and each groove is filled with the conductive paste CP.

After the paste is filled, the carrier tape (not shown) holding the component chip 1a in a predetermined posture is moved in the tangential direction of the application roller 13 so that the component chip 1a is moved.
Is pressed against the surface of the first elastic portion 13a.
After the pressing, the component chip 1a pressed against the surface of the first elastic portion 13a by the movement of the carrier tape is moved to the first position.
Pull away from the elastic part 13a. Incidentally, the carrier tape is a band-shaped elastic layer made of an elastic material such as silicon rubber and formed with a large number of holding holes at equal intervals in the tape length direction, and a curved portion arranged at the center in the thickness direction of the elastic layer. A rigid tape having a possible thickness,
The component chip 1a is elastically held in the holding hole of the elastic layer in a predetermined posture and with a part thereof protruding.

Due to the pressing, the component chip 1a slightly sinks into the first elastic portion 13a, and the conductive paste CP filled in each groove is applied to one surface in the width direction of the component chip 1a and is adjacent to the same surface at the same time. Is applied to the edges of both sides in the height direction. The application of the conductor paste CP to the component chip 1a is performed in the same manner on the other surface in the width direction of the component chip 1a after the application paste CP is dried, and the component chip 1 is dried after the application paste CP is dried.
a is put into a firing furnace, and the dried application paste CP is fired. The firing of the component chip 1a is performed using the conductive paste CP.
May be performed at the same time as the firing of the conductive paste CP, or may be performed before applying the conductive paste CP. Thus, the multilayer capacitor array 1 shown in FIG. 1 is manufactured.

When pressing the component chip 1a against the surface of the first elastic portion 13a when applying the conductive paste CP,
Since the second elastic portion 13b supporting the first elastic portion 13a is harder than the first elastic portion 13a, the first elastic portion 13a is deformed so as to be crushed, as in the case of the application plate 11, while the second elastic portion 13b is deformed. The two elastic portions 13b act so as to regulate the amount of the component chip 1a sneaking in even though they deform slightly.

That is, it is possible to ensure a dimension substantially equal to the depth of the groove 11a1 as a dimension corresponding to the reference symbol E2 in FIG. 1 in a part of the conductor paste CP to be applied to the component chip 1a. The shape of the wraparound portion, that is, the shape of the wraparound portion 1b1 of the electrode 1b can be stabilized. Therefore, it is possible to satisfactorily mount components by avoiding the problem of defective mounting due to the defective shape of the wraparound portion 1b1 of the electrode 1b, and to obtain the same effect even when the electrode size is reduced. it can.

In the above description, the thickness of the first elastic portion 11a of the coating plate 11 is matched with the depth of the groove 11a1, and the thickness of the first elastic portion 13a of the coating roller 13 is matched with the depth of the groove. The thickness of the first elastic portion 11a of the coating plate 11 is set to be equal to that of the groove 11a1.
Or slightly larger than the depth of the application roller 13.
Even if the thickness of the first elastic portion 13a is slightly larger than the depth of the groove, the same function and effect as described above can be obtained.

In the above description, a case has been exemplified where a total of four pairs of component electrodes 1b are formed on the component chip 1a in the multilayer capacitor array 1 shown in FIG. When forming electrodes on a capacitor array, the same method and apparatus as described above can be used. Of course, one or more electrodes having the same shape are formed on various electronic components such as chip components, array components, and composite components other than the multilayer capacitor array. Even in this case, the same method and apparatus as described above can be used, and the same operation and effect as described above can be obtained.

[Second Embodiment] FIGS. 8 to 10 show an example in which the concept of the present invention is applied to a paste coating method using a coating plate.
Reference numeral 22 denotes a blade for scraping the paste, and CP denotes a conductor paste for the electrode. In the following description, reference numerals and names shown in FIG. 1 and FIG. 1 are cited.

The coating plate 21 has a band-shaped first elastic portion 21a made of an elastic material such as silicon rubber and a plate-shaped second elastic portion made of an elastic material such as silicon rubber and supporting the lower surface of the first elastic portion 21a. 21b and a plate-shaped rigid portion 21c made of a rigid material such as stainless steel and supporting the lower surface of the second elastic portion 21b. Four grooves 21a1 corresponding to the number and position of the electrodes 1b are formed in the first elastic portion 21a.
Are formed in parallel, the depth of each groove 21a1 matches the thickness of the first elastic portion 21a, and the bottom surface of each groove 21a1 is constituted by the surface of the second elastic portion 21b.

The hardness of the first elastic portion 21a and the second elastic portion 21b is in a relationship of first elastic portion 21a> second elastic portion 21b, and the first elastic portion 21a is harder than the second elastic portion 21b.
By the way, JIS-K-6253 (ISO-7719)
Numerical values when measured with a durometer specified in the above are about 80 for the first elastic part 21a and about 50 for the second elastic part 21, but the hardness of the first elastic part 21a is in the range of 70 to 90. And the hardness of the second elastic portion 21b is 40 to
It suffices if it is within the range of 60.

When applying the conductor paste CP to the component chip 1a, first, the first elastic portion 2 of the application plate 21 is applied.
The conductor paste CP is supplied to the surface of the first elastic portion 21a, and thereafter, the tip of the blade 22 is moved rightward in FIG. 8 in a state of being in contact with the surface of the first elastic portion 21a. This allows
As shown in FIG. 9, the excess conductive paste CP is scraped off from the surface of the first elastic portion 21a by the blade 22, and the grooves 21a1 are filled with the conductive paste CP.

After filling the paste, the carrier plate (not shown) holding the component chip 1a in a predetermined posture is lowered, and one surface in the width direction of the component chip 1a is brought into contact with the first elastic portion 21a as shown in FIG. Press against the surface. After the pressing, the carrier plate is raised and the first elastic portion 21
The component chip 1a pressed against the surface of a is separated from the first elastic portion 21a. Incidentally, the carrier plate is the same as that described in the first embodiment.

Due to the pressing, the component chip 1a slightly sinks into the first elastic portion 21a, and the conductive paste CP filled in each groove 21a1 is applied to one surface in the width direction of the component chip 1a and simultaneously becomes the same. The coating is also applied to the edges of both sides in the adjacent height direction. The application of the conductive paste CP to the component chip 1a is performed in the same manner on the other surface in the width direction of the component chip 1a after the application paste CP is dried. After the application paste CP is dried, the component chip 1a is applied. Is applied to a firing furnace, and dried application paste C
P is fired. The firing of the component chip 1a may be performed simultaneously with the firing of the conductor paste CP.
It may be performed before the application of P. Thus, the multilayer capacitor array 1 shown in FIG. 1 is manufactured.

When the component chip 1a is pressed against the surface of the first elastic portion 21a during the application of the conductor paste CP,
Since the second elastic portion 21b supporting the first elastic portion 21a is softer than the first elastic portion 21a, as shown in FIG.
The first elastic portion 21a is locally curved without causing a large variation in thickness, while the second elastic portion 21b is deformed so as to be crushed by the curved portion of the first elastic portion 21a.

That is, it is possible to secure a dimension substantially equal to the width of the groove 21a1 as a dimension corresponding to the reference symbol E3 in FIG. 1 in a wraparound portion of the conductor paste CP applied to the component chip 1a. The shape of the wraparound portion, that is, the shape of the wraparound portion 1b1 of the electrode 1b can be stabilized. Therefore, it is possible to satisfactorily mount components by avoiding the problem of defective mounting due to the defective shape of the wraparound portion 1b1 of the electrode 1b, and to obtain the same effect even when the electrode size is reduced. it can.

FIGS. 8 to 10 show an example in which the concept of the present invention is applied to a paste application method using the application plate 21, but the same concept can be applied to a paste application method using an application roller. it can. FIG. 11 shows an example of the application, in which reference numeral 23 is an application roller, 24 is a container containing the conductive paste CP, and 25 is a blade for scraping the paste.

The application roller 23 has a band-shaped first elastic portion 23a made of an elastic material such as silicon rubber and a cylindrical second elastic member 23 made of an elastic material such as silicon rubber and supporting the inner peripheral surface of the first elastic portion 23a. An elastic portion 23b and a columnar rigid portion 23c made of a rigid material such as stainless steel and supporting the inner peripheral surface of the second elastic portion 23b are provided. 1st elastic part 2
3a, four grooves (not shown) corresponding to the number and positions of the electrodes 1b are formed in parallel, and the depth of each groove matches the thickness of the first elastic portion 23a. The bottom is second
It is constituted by the surface of the elastic portion 23b.

The hardness of the first elastic portion 23a and the second elastic portion 23b is such that the first elastic portion 23a> the second elastic portion 23b, and the first elastic portion 23a is harder than the second elastic portion 23b.
By the way, JIS-K-6253 (ISO-7719)
Numerical values when measured with a durometer specified in are about 80 for the first elastic part 23a and about 50 for the second elastic part 23, but the hardness of the first elastic part 23a is in the range of 70 to 90. And the hardness of the second elastic portion 23b is 40 to
It suffices if it is within the range of 60.

When applying the conductive paste CP to the component chip 1a, first, the conductive paste C is applied to the surface of the first elastic portion 23a by utilizing the rotation of the application roller 23 in the direction of the arrow.
P is supplied to bring the tip of the blade 25 into contact with the surface of the first elastic portion 23a. As a result, the excess conductive paste CP is scraped off from the surface of the first elastic portion 23a by the blade 25, and each groove is filled with the conductive paste CP.

After the filling of the paste, the carrier tape (not shown) holding the component chip 1a in a predetermined posture is moved in the tangential direction of the application roller 23, and the component chip 1a is moved.
Is pressed against the surface of the first elastic portion 23a.
After the pressing, the component chip 1a pressed against the surface of the first elastic portion 23a by the movement of the carrier tape is moved to the first position.
Pull away from the elastic part 23a. Incidentally, the carrier tape is the same as that described in the first embodiment.

Due to the pressing, the component chip 1a slightly sinks into the first elastic portion 23a, and the conductive paste CP filled in each groove is applied to one surface in the width direction of the component chip 1a and is adjacent to the same surface at the same time. Is applied to the edges of both sides in the height direction. The application of the conductor paste CP to the component chip 1a is performed in the same manner on the other surface in the width direction of the component chip 1a after the application paste CP is dried, and the component chip 1 is dried after the application paste CP is dried.
a is put into a firing furnace, and the dried application paste CP is fired. The firing of the component chip 1a is performed using the conductive paste CP.
May be performed at the same time as the firing of the conductive paste CP, or may be performed before applying the conductive paste CP. Thus, the multilayer capacitor array 1 shown in FIG. 1 is manufactured.

When pressing the component chip 1a against the surface of the first elastic portion 23a when applying the conductor paste CP,
Since the second elastic portion 23b supporting the first elastic portion 23a is softer than the first elastic portion 23a, the first elastic portion 23a is locally formed without causing a large variation in the thickness similarly to the case of the application plate 21. While being curved, the second elastic portion 23b
Is deformed so as to be crushed by the curved portion of the first elastic portion 21.

That is, it is possible to secure a dimension substantially equal to the width of the groove as a dimension corresponding to the reference symbol E3 in FIG. 1 in a portion where the conductive paste CP wraps around the component chip 1a. The shape of the portion, that is, the shape of the wraparound portion 1b1 of the electrode 1b can be stabilized. Therefore, the wraparound portion 1 of the electrode 1b
The component mounting can be performed satisfactorily while avoiding the problem of the mounting defect caused by the shape defect of b1, and the same effect can be obtained even when the electrode size is miniaturized.

In the above description, the thickness of the first elastic portion 21a of the coating plate 21 is matched with the depth of the groove 21a1, and the thickness of the first elastic portion 23a of the coating roller 23 is matched with the depth of the groove. The thickness of the first elastic portion 21a of the application plate 21 is set to be equal to that of the groove 21a1.
Or slightly larger than the depth of the application roller 23.
Even if the thickness of the first elastic portion 23a is slightly larger than the depth of the groove, the same function and effect as described above can be obtained.

In the above description, the case where a total of four pairs of component electrodes 1b are formed on the component chip 1a in the multilayer capacitor array 1 shown in FIG. When forming electrodes on a capacitor array, the same method and apparatus as described above can be used. Of course, one or more electrodes having the same shape are formed on various electronic components such as chip components, array components, and composite components other than the multilayer capacitor array. Even in this case, the same method and apparatus as described above can be used, and the same operation and effect as described above can be obtained.

[Other Embodiments] FIGS. 12 to 15 show modified examples applicable to the first and second embodiments.

FIGS. 12A to 12C show modifications of the cross-sectional shape of the groove 11a1 of the first elastic portion 11a of the coating plate 11 shown in FIGS. 4 to 6, respectively.
FIG. 12A shows a groove 11a2 having a trapezoidal cross section, FIG. 12B shows a groove 11a3 having a substantially U-shaped cross section, and FIG. Groove 11a4
Is shown. Of course, the groove shapes shown in FIGS. 12A to 12C correspond to the first elastic portions 1 of the application roller 13 shown in FIG.
3A, the groove 21a1 of the first elastic portion 21a of the coating plate 21 shown in FIGS. 8 to 10, and the groove of the first elastic portion 23a of the coating roller 23 shown in FIG.

FIG. 13A shows an example in which the surface of the first elastic portion 11a of the coating plate 11 shown in FIGS. 4 to 6 is a rough surface RS, and the rough surface RS is the first elastic portion 11a. Of the conductive paste CP is scraped off by the blade 12e. First
If the surface of the elastic portion 11a is set as the rough surface RS, FIG.
As shown in (B), when the component chip 1a is pressed against the surface of the first elastic body 11a, the adhesive force of the component chip 1a can be reduced.
It is possible to prevent the component chip 1a from coming off the carrier plate or the carrier tape due to the adhesion force when the component chip 1a is separated from the carrier chip a. Of course, the first
The structure in which the surface of the elastic portion 11a is roughened is the first elastic portion 13a of the application roller 13 shown in FIG.
The first elastic portion 21a of the application plate 21 shown in FIG.
1 can also be applied to the first elastic portion 23a of the application roller 23 shown in FIG.

FIG. 14A shows a case in which a convex reinforcing portion 11c1 is formed on the surface of a rigid portion 11c constituting the coating plate 11 shown in FIGS. 4 to 6, and this reinforcing portion 11c1 is used as a first elastic portion 11a. The example shown in FIG. If the reinforcing portion 11c1 is provided inside the portion between the grooves 11a1, the grooves 11a1 which may be generated when the component chip 1a is pressed against the surface of the first elastic portion 11a in an inclined state as shown in FIG. Deformation can be suppressed to prevent the shape of the wraparound portion of the application paste from being disturbed.
Of course, the configuration in which the reinforcing portion 11c1 is provided inside the portion between the grooves 11a1 of the first elastic portion 11a is based on the first elastic portion 13a of the applying roller 13 shown in FIG. 7 or the applying plate 21 shown in FIGS. Alternatively, the present invention can be applied to the application roller 23 shown in FIG.

FIG. 15 shows an example in which the outer diameter of the application roller 13 shown in FIG. 7 is enlarged. If the outer diameter of the application roller 13 is small, the contact time between the surface of the first elastic portion 13a and the component chip 1a is short, so that the paste application may not be sufficiently performed, and the component chip may be attached to the surface of the first elastic portion 13a. Although the penetration angle of 1a becomes large and unnecessary force may act on the component chip 1a to cause a posture defect such as inclination, if the outer diameter of the application roller 13 is made as large as possible, the first
The contact time between the surface of the elastic portion 13a and the component chip 1a is increased so that the paste can be satisfactorily applied, and the angle of entry of the component chip 1a into the surface of the first elastic portion 13a is reduced, so that extra force is applied to the component chip 1a. And the posture of the component chip 1a can be prevented from being disturbed. Of course, the configuration in which the outer diameter of the application roller 13 is enlarged can also be applied to the application roller 23 shown in FIG.

FIG. 16 shows a method and an apparatus for applying the conductive paste CP to the component chip 1a by using an application belt 31 different from the application plate or the application roller.

The coating belt 31 is made of an endless elastic belt made of an elastic material such as silicon rubber, or an endless rigid belt having a bendable thickness and having an elastic belt attached to the surface thereof. A pair of pulleys 32
Under a predetermined tension. Grooves corresponding to the number and positions of the electrodes 1b are formed on the surface of the application belt 31. Further, a container 33 for accommodating the conductive paste 33 is disposed on the upper flat portion of the application belt 31, and a blade 34 for scraping excess conductor paste CP from the surface of the application belt 31 is provided on one side thereof, A flat support 35 that supports the inner peripheral surface of the application belt 31 is provided below the container 33 and the blade 34.

When the conductive paste CP is applied to the component chip 1a using this apparatus, the application belt 31 is moved in the direction of the arrow to supply the conductive paste CP to the surface of the application belt 31, and the conductive paste CP is applied to the surface of the application belt 31. Excess conductor paste CP is scraped from the surface of the application belt 31 by the contacting blade 34, and the groove is filled with the conductor paste CP. After filling the paste, the carrier plate (not shown) holding the component chip 1a in a predetermined posture is lowered to press a predetermined surface of the component chip 1a against the surface of the elastic portion 11a. After the pressing, the carrier plate is raised, and the component chip 1a pressed against the application belt 31 is pressed.
Is separated from the application belt 31. The carrier plate is the same as that described in the first embodiment.

According to the method and the apparatus, the conductive paste can be continuously supplied to the surface of the endless coating belt 31 to fill the groove with the conductive paste.
Can be used as a paste application surface, so that there is an advantage that the paste can be efficiently applied to the component chip 1a. Also, if the configuration of the first and second elastic portions employed in the first embodiment and the configuration of the first and second elastic portions employed in the second embodiment are applied to the application belt 31, the same as in each embodiment The operation and effect of the invention can be obtained.

[0062]

As described in detail above, according to the present invention,
Since the shape of the wraparound portion of the conductor paste applied to the component chip, that is, the shape of the wraparound portion of the electrode, can be stabilized, it is possible to avoid the problem of mounting failure due to the defective shape of the wraparound portion of the electrode and to reduce the component. The mounting can be performed well, and the same effect can be obtained even when the electrode size is miniaturized.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a multilayer capacitor array.

FIG. 2 is a diagram showing a conventional method and a conventional apparatus for applying a conductive paste to a component chip using an application plate.

FIG. 3 is a diagram showing a conventional method and a conventional apparatus for applying a conductive paste to a component chip using an application roller.

FIG. 4 is a diagram showing a paste application method and apparatus using an application plate according to the first embodiment of the present invention.

FIG. 5 is a view of FIG. 4 as viewed from the left side in the drawing.

FIG. 6 is a diagram showing a state in which a component chip is pressed against the surface of a first elastic portion of a coating plate.

FIG. 7 is a diagram showing an example in which the concept shown in FIGS. 4 to 6 is applied to a paste applying method and an apparatus using an applying roller.

FIG. 8 is a diagram showing a paste application method and apparatus using an application plate according to a second embodiment of the present invention.

9 is a view of FIG. 8 as viewed from the left side in the drawing.

FIG. 10 is a diagram showing a state in which a component chip is pressed against the surface of a first elastic portion of a coating plate.

FIG. 11 is a diagram showing an example in which the concept shown in FIGS. 8 to 10 is applied to a paste application method and apparatus using an application roller.

FIG. 12 is a longitudinal sectional view of a groove portion of a first elastic portion of a coating plate, showing a modification applicable to each of the first and second embodiments.

FIG. 13 is a longitudinal sectional view of a coating plate, showing a modification applicable to each of the first and second embodiments, and a diagram showing a state in which a component chip is pressed against the surface of a first elastic portion of the coating plate.

FIG. 14 is a longitudinal sectional view of a coating plate, showing a modification applicable to each of the first and second embodiments, and a diagram showing a state in which a component chip is pressed against the surface of a first elastic portion of the coating plate.

FIG. 15 is a partial side view of an application roller, showing a modification applicable to each of the first and second embodiments.

FIG. 16 is a diagram showing a method and an apparatus for applying a conductive paste to a component chip using an application belt different from an application plate or an application roller.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Capacitor array, 1a ... Part chip, 1b ... Electrode, 1b1 ... Wound part, CP ... Conductor paste, 11 ...
Coating plate, 11a: first elastic portion, 11a1: groove, 1
1b: second elastic portion, 12: blade, 13: coating roller, 13a: first elastic portion, 13b: second elastic portion, 15:
Blade, 21 coating plate, 21a first elastic portion,
21a1 groove, 21b second elastic part, 22 blade
Reference numeral 23: coating roller, 23a: first elastic portion, 23b: second elastic portion, 25: blade, 11a2, 11a3, 11
a4: groove, RS: rough surface, 11c1: reinforcement part.

Continued on the front page. (72) Kazuo Sugai, Taiyo Denki Co., Ltd. 6-16-20 Ueno, Taito-ku, Tokyo (72) Shinichi Sugita 6-16-20 Ueno, Taino-ku, Taito-ku, Tokyo Taiyo Denki (72) Inventor Kazuo Naganuma 6-16-20 Ueno, Taito-ku, Tokyo Taiyo Denki Co., Ltd. (72) Inventor Haruhiko Matsushita 6-16-20 Ueno, Taito-ku, Tokyo Taiyo Denki Co., Ltd. (72) Inventor Hiroyuki Mogi 6-16-20 Ueno, Taito-ku, Tokyo F-Term (in reference) 5E082 AA01 AB03 CC03 CC17 EE04 EE11 EE23 EE35 FF05 FG06 FG26 FG46 FG54 GG10 GG11 GG28 JJ03 JJ07 JJ07 JJ23 KK01 MM21

Claims (6)

[Claims] 1. A conductive paste for an electrode is supplied to the surface of an elastic portion having a groove, and excess conductive paste is scraped off from the surface of the elastic portion by a blade to fill the groove with the conductive paste. A method of forming an electrode of an electronic component, the method including applying a conductive paste filled in a groove to a component chip by pressing the conductive paste onto a surface of an elastic portion, wherein the elastic portion has a first elasticity having a predetermined hardness. And a second elastic portion which is harder than the first elastic portion and supports the first elastic portion, wherein the groove is provided in the first elastic portion. Method. 2. A conductive paste for an electrode is supplied to a surface of an elastic portion having a groove, and excess conductive paste is scraped from a surface of the elastic portion by a blade to fill the groove with the conductive paste, and then a component chip is formed. A method of forming an electrode of an electronic component, the method including applying a conductive paste filled in a groove to a component chip by pressing the conductive paste onto a surface of an elastic portion, wherein the elastic portion has a first elasticity having a predetermined hardness. And a second elastic portion which is softer than the first elastic portion and supports the first elastic portion, wherein the groove is provided in the first elastic portion. Method. 3. An electrode forming apparatus for an electronic component, comprising: means for applying a conductive paste for an electrode to a component chip, wherein said means is provided with an elastic portion having a groove on a surface and a conductive paste for an electrode. A blade for scraping excess conductive paste from the surface of the elastic portion and filling the groove with the conductive paste, wherein the elastic portion has a first elastic portion having a predetermined hardness and is harder than the first elastic portion. An electrode forming apparatus for an electronic component, comprising: a second elastic portion that supports a first elastic portion, wherein the groove is provided in the first elastic portion. 4. An electrode forming apparatus for an electronic component, comprising: means for applying a conductor paste for an electrode to a component chip, wherein the means is provided with an elastic portion having a groove on a surface and a conductor paste for an electrode. A blade for scraping excess conductive paste from the surface of the elastic portion to fill the groove with the conductive paste, wherein the elastic portion has a first elastic portion having a predetermined hardness and is softer than the first elastic portion. An electrode forming apparatus for an electronic component, comprising: a second elastic portion that supports a first elastic portion, wherein the groove is provided in the first elastic portion. 5. The surface of the first elastic portion is a rough surface having fine irregularities such that excess conductive paste can be scraped off from the surface of the first elastic portion by a blade. Or an electrode forming apparatus for an electronic component according to 4. 6. A reinforcing portion for suppressing groove deformation when a component chip is pressed against the surface of the elastic portion after filling the conductive paste in the groove, inside the inter-groove portion of the first elastic portion. The electrode forming apparatus for an electronic component according to any one of claims 3 to 5, wherein: