JP4624387B2 - Resist coated substrate manufacturing method and resist coated substrate manufactured by the manufacturing method - Google Patents

Description

  In the present invention, for example, various types of paints (resist) such as insulating paints and photosensitive paints are applied to single-layer or multi-layer printed wiring boards used as various electronic members such as electronic circuit boards, IC cards, and liquid crystal display boards. The present invention relates to a method for manufacturing a resist-coated substrate and a resist-coated substrate manufactured by the manufacturing method.

As a method for forming a coating film by applying a resist such as an insulating paint or a photosensitive paint on a single-layer or multilayer printed wiring board (hereinafter referred to as “substrate”) as an electronic member, conventionally, the following methods have been used. there were.
(1) A method of manufacturing a resist-coated substrate by applying a paint (resist) on one or both sides of a substrate with a roll coater and completely drying the resist.
(2) Applying and drying a resist, peeling off the protective film on the resist-coated surface side of the dry film with the protective film applied to the resist-coated surface, and overlaying the resist-coated surface side of the dry film on one or both sides of the substrate A method of applying pressure (hot laminating) to the surface on which the resist is applied by applying heat and pressure.

The method (1) has the following problems.
(A) Since the resist is dried after the resist is applied to the substrate, it takes time and effort to dry, and workability is poor.
(B) By simply applying a resist to the substrate and drying it, the resist surface tends to wave and become uneven, and lacks smoothness.
(C) When the substrate has a bottomed hole or a through hole, it is difficult to reliably fill the resist into the inside.

The method (2) has the following problems.
(A) Since a heating process for heating and melting the resist of the dry film is necessary, heating takes time and effort, and workability is poor.
(B) High heat is required to melt the dried resist, and the high heat may cause the film or substrate to be altered, distorted, or stretched.
(C) Since a protective film is stacked on the resist of the dry film, two types of films are necessary, workability is poor, and this contributes to high cost.
(D) There is a difficulty in the smoothness of the resist on the substrate surface.
(E) It is difficult to fill the resist into the hole of the substrate, which may cause insulation failure.

The resist coated substrate manufacturing method according to claim 1 of the present application is a resist coated substrate manufacturing method for manufacturing a resist coated substrate by applying a resist to a printed wiring substrate. In addition, the resist is applied at intervals in the running direction, and the applied resist is made into a semi-dry state with a drying device, and the film is applied to the semi-dry resist application surface of the printed wiring board, and the film is in a semi-dry state. A printed wiring board is bonded to the resist coating surface of the substrate, a resist is applied to the printed wiring board, the bonded printed wiring board and the film are pressed and adhered, the resist coating, the resist semi-drying, the printed wiring board and the film are applied. bonding, the printed wiring board and the film pressure compaction bonding the printed wiring board or / and films It is a method of continuous work in transmission. The state wherein the semi-dry state, where Ri resist Do and a smoothing when performing the bonding, or pressure compaction adhesion, and resist was dried to the extent possible filling to the printed wiring bottomed holes and the through hole of the substrate It is.

  In the resist coated substrate manufacturing method according to claim 2 of the present application, in the resist coated substrate manufacturing method, the transfer roll and the coating roll are rotationally contacted to transfer the resist from the transition roll to a part of the outer peripheral surface of the coating roll, In this method, the coating roll is rotated and brought into contact with a running film or a single-piece or continuous printed wiring board, and a resist is applied at intervals in the running direction of the film or the printed wiring board.

  In the resist-coated substrate manufacturing method according to claim 3 of the present application, in the resist-coated substrate manufacturing method, a coating roll in which a resist coating portion protruding or recessed from the outer peripheral surface is formed on a part of the outer peripheral surface of the roll. In this method, the printed wiring board or film is rotated and brought into contact with the resist, and the resist is applied to the printed wiring board or film at intervals in the running direction thereof.

  The resist-coated substrate manufacturing method according to claim 4 of the present application is a method in which, in the resist-coated substrate manufacturing method, a coated shape of the resist applied at intervals to the printed wiring board or the film is square.

  In the resist-coated substrate manufacturing method according to claim 5 of the present application, in the resist-coated substrate manufacturing method, a resist coating portion that protrudes in a square shape or is recessed in a square shape from the outer peripheral surface is formed on a part of the outer peripheral surface of the roll. The coating roll is rotated and brought into contact with the printed wiring board or film, and the resist is squarely applied to the printed wiring board or film by the square resist coating portion.

  The resist-coated substrate manufacturing method according to claim 6 of the present application is the resist-coated substrate manufacturing method, wherein a part of the outer peripheral surface of the transfer roll or / and the coating roll protrudes in a square shape from the outer peripheral surface or is recessed in a square shape. This is a method in which a resist coating portion is formed, and the transfer roll and the coating roll are brought into rotational contact to transfer the resist from the transition roll to the resist coating portion on the outer peripheral surface of the coating roll.

  The resist coated substrate manufacturing method according to claim 7 of the present application is the resist coated substrate manufacturing method according to any one of claims 1 to 6, wherein the printed wiring board and the film are bonded. This is a method in which the bonding and pressure contact are made by vacuum attachment.

  The resist-coated substrate manufacturing method according to claim 8 of the present application is a method in which, in the resist-coated substrate manufacturing method, the resist on the resist-coated substrate is completely dried with a drying apparatus after the printed wiring board and the film are pressed and adhered.

  The resist-coated substrate of the present application is a method characterized by being manufactured by the resist-coated substrate manufacturing method.

The resist coated substrate manufacturing method of the present application has the following effects.
(1) Since the resist applied to the printed wiring board is semi-dried, the film is attached to the resist coating surface of the printed wiring board, so that the film can be easily attached to the printed wiring board, and the resist of the printed wiring board is adhered. The resist applied to the printed wiring board is smooth.
(2) Since only one layer of film is attached to the printed wiring board, the number of films is reduced compared to the conventional dry film method in which both the dry film and the protective film are attached to the printed wiring board. Cost is reduced.
(3) Since the application of resist, semi-drying of resist, and film application can be performed automatically and continuously while the printed wiring board is running, workability is good.

The resist coated substrate manufacturing method of the present application has the following effects.
(1) When a coating roll on which a resist coating portion is formed is used, the resist can be applied only to the portions of the film and the printed wiring board that require resist coating, so there is no waste of resist. In addition, the resist does not become dirty at locations that do not require resist application.
(2) When an application roll having no resist application part is used, the resist can be applied to the entire surface of the film and the printed wiring board.
(3) Since the resist applied to the film or the resist applied to the printed wiring board is affixed to the printed wiring board in a semi-dry state, the film can be easily attached to the printed wiring board. The adhesion of the resist is good, and the resist applied to the printed wiring board becomes smooth.
(4) Since only one layer of film is attached to the printed wiring board, the number of films is reduced compared to the conventional dry film method in which both the dry film and the protective film are attached to the printed wiring board. , Reduce costs.
(5) Since the process from resist application, resist semi-drying, and film application can be performed automatically and continuously while the printed wiring board is running, workability is good.

The resist coated substrate manufacturing method of the present application has the following effects.
(1) When the transfer roll formed with the resist coating portion is used, the resist can be applied only to a portion where the resist coating is necessary in the film and the printed wiring board, and there is no waste of the resist. In addition, a portion that does not require resist coating is not stained with the resist.
(2) When the transfer roll in which the resist application part is not formed is used, the resist can be applied to the entire surface of the film and the printed wiring board.
(3) Since the film and the printed wiring board are attached while the resist applied to the film or the resist applied to the printed wiring board is semi-dried, the film and the printed wiring board can be easily attached. The adhesion of the resist to the substrate is good, and the resist applied to the printed wiring board becomes smooth.
(4) Since only the protective film layer is affixed to the printed wiring board, the number of films is reduced compared to the conventional dry film method in which both the dry film and the protective film are affixed to the printed wiring board. , Cost is reduced.
(5) Since the process from resist application, resist semi-drying, and film application can be performed automatically and continuously while the printed wiring board is running, workability is good.

The resist coated substrate manufacturing method of the present application has the following effects in addition to the above effects.
(1) Since the attachment of the printed wiring board and the film is a vacuum application type, the attachment is reliable, and the application of the resist from the film to the printed wiring board and the application of the resist to the printed wiring board are ensured. .
(2) The air in the resist applied to the film or the printed wiring board, the air between the printed wiring board and the film, the air in the bottomed hole or through hole of the printed wiring board is stuck between the printed wiring board and the film. Since it is discharged to the outside at the time of attachment, bubbles and pinholes are not generated in the resist applied to the printed wiring board.
(3) The resist can be reliably filled into the bottomed hole or through hole of the printed wiring board.

  The resist transfer roll of the present application is such that a resist coating part is formed on a part of the outer peripheral surface of the roll, and the resist of the resist coating part can be transferred to a part of the coating roll by rotating contact with the coating roll. Therefore, by bringing the coating roll into contact with the film or the printed wiring board, a resist having a desired shape and pattern can be applied only to a desired portion of the film or the printed wiring board, and the resist is applied to the film or the printed wiring board without waste. Is done. In addition, the coating roll is not soiled.

  The resist coating roll of the present application has a resist coating part formed on a part of the outer peripheral surface of the roll, and the resist of the resist coating part is directly applied to a part of the film or the printed wiring board by rotating contact with the film or the printed wiring board. Therefore, a resist having a desired shape and pattern can be reliably applied only to a desired portion of the film or printed wiring board.

  In the resist-coated dry film of the present application, the resist is partially applied at intervals to the film, and the resist is covered with a protective film superimposed on the entire surface or a part of the film, and the resist is dry. The resist can be applied only to a necessary portion of the printed wiring board by using it in the same manner as a conventional dry film for resist application. Since the resist is only applied to the part of the film that is necessary for application to the printed circuit board, less heat is required to melt the resist than when the resist is applied to the entire film, and the resist is wasted. It is economical.

  In the resist-coated substrate of the present application, a resist is applied to the entire surface or a part of the printed wiring board, and the resist is covered with a protective film superimposed on the printed wiring board. The resist is not peeled off or chipped.

(Embodiment 1 of resist-coated substrate manufacturing method)
An example of an embodiment of the resist coated substrate manufacturing method of the present invention will be described with reference to FIG. In this embodiment, the film 1 wound in a roll shape is pulled out, a resist is applied to a part of one side of the film 1 while the film 1 is traveling, and the film 1 is allowed to travel as it is to be semi-drying chamber (not shown). The resist coated on the film 1 is drawn into the semi-dry state (raw dry), the film 1 is pulled out from the semi-dry chamber, and the resist coated surface of the film 1 is not shown in the printed wiring board. (Hereinafter referred to as “substrate”), and then the resist of the substrate is dried to manufacture a resist-coated substrate.

  The resist is applied to the film 1 by applying a resist to the resist coating portion 3 (FIG. 5) formed by recessing a part of the outer peripheral surface of the coating roll 2 (lower than the outer peripheral surface) shown in FIG. The coating roll 2 is rotated and brought into contact with the traveling film 1 to apply a resist to a part of the film 1. In FIG. 1, a resist is applied to both surfaces of the film 1. However, in the resist-coated substrate manufacturing method of this embodiment, the film 1 is affixed to the substrate. In that case, the application roll 2 may be provided only on one side of the film 1.

  As shown in FIG. 5, the coating roll 2 is a roll-shaped member that applies a resist to a part of the film 1, and a resist coating portion 3 is formed on the outer peripheral surface. The resist coating portion 3 of the coating roll 2 is recessed one step lower than the outer peripheral surface of the coating roll 2. The resist R supplied from the resist supply unit 4 (FIG. 1) accumulates in the resist coating unit 3 and the resist R is applied to the film 1 as shown in FIG. The resist coating part 3 can also be formed separately at two or more locations in the circumferential direction of the coating roll 2. Although the resist coating portion 3 in FIG. 5 is rectangular, other shapes and patterns may be used. The resist coating unit 3 can be made one step higher than the outer peripheral surface of the coating roll 2. In this case, the resist R supplied from the resist supply unit 4 adheres to the resist coating unit 3 and is applied to the traveling film 1 in contact with the resist R. The coating roll 2 can be a roll made of any material such as rubber, resin, metal, or ceramic.

  The material of the film 1 can be arbitrarily selected. The film 1 may be a single leaf separated from each other or may be continuous. In addition, it is preferable that the resist R applied to the film 1 has a uniform thickness. For this reason, it is preferable that the contact surface 9a of the squeegee 9 is applied to the film 1 applied with the resist so as to be uniform. In order to equalize the thickness uniformly, the contact surface 9a is preferably wide.

  The resist supply unit 4 that supplies the resist to the coating roll 2 can be a resist storage tank or a rotating roll containing a large amount of resist. In any case where the resist is supplied from any resist supply unit 4 to the coating roll 2, it is preferable that the resist applied to the coating roll 2 has a uniform thickness. For this purpose, for example, the outer peripheral surface of the coating roll 2 It is preferable to apply a squeegee to level the resist to a uniform thickness.

  The film 1 coated with the resist as described above is run as it is and drawn into the semi-drying chamber, in which the resist coated on the film 1 is dried in a semi-dry state (raw dry), and the film 1 is semi-dried. It is pulled out from the drying chamber, and the resist-coated surface of the film 1 is attached to the substrate in a semi-dry state. The semi-drying of the resist of the film 1 is not limited to being carried into the semi-drying chamber, and can be performed by any method. Further, the film 1 can be attached by any appropriate method, but if the film 1 is attached by a vacuum attachment method, the attachment of the film 1 to the substrate and the application of the resist to the substrate can be ensured. In addition, air in the resist applied to the film 1, air between the substrate and the film 1, air in the bottomed hole or through hole of the substrate is discharged to the outside at the time of pasting, and is thus applied to the substrate No bubbles or pinholes are generated in the resist. Furthermore, the resist can be filled into a bottomed hole or a through hole of the substrate.

  After the film 1 is attached to the substrate, the attached film 1 and the substrate are run as they are and sent to a drying chamber or the like to completely dry the resist on the substrate. The drying of the resist is not limited to being carried into the drying chamber, and can be performed by any method. The film 1 and the substrate on which the resist is dried are run as they are, and while running or temporarily stopped, the film 1 is cut according to the outer diameter of the substrate, and the substrates are separated one by one. A coated substrate is used. In the case where the substrates are continuous, the substrate is cut at the same time as the film 1, and the substrates to which the film 1 is attached are separated one by one to obtain a resist-coated substrate.

  In the resist coated substrate manufacturing method of the present embodiment, the film 1 travels by rotating a rotary feed body such as a feed roller or a feed belt, and during the rotation, protrusions attached thereto are opened at both ends in the width direction of the film 1. The film 1 can be automatically fed by being inserted into the feed hole 11 (see FIG. 6). The feed hole 11 can be opened in the running film 1, and after the opening, the feed hole 11 can be used to feed the film as described above.

  The material of the substrate can be arbitrarily selected. The substrate may be a single leaf or a continuous substrate. The substrate may be a single layer or a laminate, and may be a hard substrate, a soft substrate, a rigid substrate, a flexible substrate, or a substrate that is not.

(Embodiment 2 of resist-coated substrate manufacturing method)
Another example of the embodiment of the resist coated substrate manufacturing method of the present invention will be described with reference to FIG. The resist-coated substrate manufacturing method of this embodiment also applies a resist to a part of the film 1 while the film 1 is running, and dries the film 1 in a semi-dry state (raw dry). Although it is common to the method of the first embodiment in that the coated surface is attached to a substrate (not shown) and then the resist of the substrate is dried to manufacture the resist coated substrate, the resist to the film 1 is used. This coating method is different from the method of the first embodiment.

  In the present embodiment, the resist is applied to the film 1 by applying the resist applied or stored in the resist application part 6 of the transfer roll 5 by bringing the application roll 2 and the transfer roll 5 into contact with each other as shown in FIG. Coating (transferring) is performed on the roll 2, and the resist of the coating roll 2 is rotated and brought into contact with the running film 1 to apply the resist R to the film 1 (or a single substrate or a continuous substrate). In FIG. 2, the resist is applied to both surfaces of the film 1. However, in the resist-coated substrate manufacturing method of this embodiment, the film 1 is applied to the substrate, and therefore, the resist may be applied to only one surface of the film 1. In this case, the application roll 2 and the transfer roll 5 need only be provided on one side of the film 1.

  The coating roll 2 and the transfer roll 5 can be made of any material such as rubber, resin, metal, or ceramic. The transfer roll 5 may be the same as or different from the application roll 2 described in the first embodiment.

  The resist supply unit 4 in FIG. 2 serves as a resist storage tank, the resist R therein is attached to the transfer roll 7, and the transfer roll 7 is brought into rotational contact with the transfer roll 5, thereby attaching the resist R to the transfer roll 5. When the transfer roll 5 is in rotational contact with the application roll 2, the resist R of the transfer roll 5 is applied to the application roll 2, and the resist R is applied to the traveling film 1. Also in this embodiment, it is preferable that the resist transferred to the resist coating portion 6 of the transfer roll 5 has a uniform thickness so that the resist thickness transferred to the coating roll 2 becomes uniform. It is preferable to apply a squeegee 8 to the outer peripheral surface of the transfer roll 5 to equalize the resist to a uniform thickness.

  Also in the second embodiment, the same film and substrate as those described in the first embodiment can be used. Also in the second embodiment, it is preferable that the contact surface 9a of the squeegee 9 is applied to the film 1 coated with a resist so as to be even.

(Embodiment 3 of resist-coated substrate manufacturing method)
Another example of the embodiment of the resist coated substrate manufacturing method of the present invention will be described. The method for producing a resist-coated substrate of the present invention is not limited to a method of applying a resist to the film 1 and attaching the film 1 to the substrate 20 in a semi-dry state as in the above embodiments, as shown in FIG. Further, while the substrate 20 is running, a resist is applied to a part of the substrate 20, the substrate 20 is dried in a semi-dry state (raw dry) in the semi-drying chamber 21, and the resist application surface of the substrate 20 is applied. A method of manufacturing a resist-coated substrate by attaching the film 1 and then drying the resist of the substrate 20 may be employed. The resist is applied to the substrate 20 by rotating the application roll 2 similar to that shown in FIG. 1 as shown in FIG. 3 and the application roll 2 and the transfer roll 5 as shown in FIG. Then, the resist applied or stored in the resist application part 6 of the transfer roll 5 is applied (transferred) to the application roll 2 and the resist of the application roll 2 is rotated and brought into contact with the traveling substrate 20. Either can be performed.

  In the resist-coated substrate manufacturing method of the present invention, the substrate 20 is allowed to run in the horizontal direction with its front and back surfaces oriented in the vertical direction (the state in which the substrate is laid down). In the present embodiment, the substrate 20 travels in the same manner as in each of the embodiments described above, in which feed holes are opened at both ends in the width direction of the substrate 20 and rotating feed bodies such as feed rollers and feed belts provided with protrusions on the outer periphery are rotated. The substrate 20 can be automatically fed by inserting the projection into the feed hole during the rotation. The feed hole can be opened in the traveling substrate 20, and after the opening, the feed hole can be used for feeding as described above.

  The substrate 20 to which the resist is applied may be continuous as shown in FIG. Further, the material of the substrate 20 can be arbitrarily selected. The substrate 20 may be a single layer or a laminate, and may be a hard one, a soft one, a rigid one, a flexible one, or another one. In addition, it is preferable that the resist R applied to the substrate 20 has a uniform thickness. For this reason, it is preferable that the contact surface 9a of the squeegee 9 is applied to the film 1 applied with the resist so that the resist R is evenly uniform. In order to equalize the thickness uniformly, the contact surface 9a is preferably wide (see FIGS. 1 and 2).

  The material of the film to be attached to the substrate can be arbitrarily selected, and the film may be a single leaf separated from each other or continuous.

(Other Embodiments of Resist Coated Substrate Manufacturing Method)
In the method for producing a resist-coated substrate of the present invention, the method for applying a resist to a film or a substrate is not limited to that shown in FIGS. 1 to 3, and any method can be used. Therefore, for example, as shown in FIG. 4, the application roll 2 and the transfer roll 5 are provided in contact with each other, the resist R in the resist supply unit 4 is directly attached to the transfer roll 5, and the resist application unit 6 of the transfer roll 5 is attached. It is also possible to apply (transfer) the resist that has been applied or stored on the application roll 2 and rotate the resist on the application roll 2 to the traveling film 1 or substrate. Also, the number of rolls provided is not limited to that shown in FIGS. 1 to 4 and may be any number.

  In the resist coated substrate manufacturing method of the present invention, the resist can be coated on the entire surface of the film or substrate using a coating roll or a transfer roll in which a resist coating portion is not formed. In that case, a resist coated substrate in which a resist is coated on the entire surface of the substrate can be manufactured.

  In the resist coated substrate manufacturing method of the present invention, a film can be attached to both surfaces of the substrate, or a film can be attached to only one surface. In addition, when a film is attached to both sides of the substrate, the film can be attached to both sides of the substrate at the same time, or can be attached with a time difference for each side.

  Further, the traveling direction of the film or the substrate is not limited to the upward direction in the vertical direction as shown in FIGS. 1 and 2, and can be traveled in an arbitrary direction. Therefore, for example, the substrate can be run vertically downward or obliquely. Further, as shown in FIG. 3, the substrate is run in the horizontal direction with the front and back surfaces of the substrate facing up and down (the substrate is laid down), or the front and back surfaces of the substrate are directed sideways (the substrate is erected). In the horizontal direction). Moreover, the width direction end of the film 1 or a board | substrate can be made high, and the film 1 or a board | substrate can be inclined and can be carried in to the application | coating roll 2.

  In addition, the traveling method of the film or substrate is the same as that of each of the embodiments described above. The method is not limited to the method in which the film or the substrate is automatically fed by rotating and inserting the projection into the feed hole during the rotation, and the film can be run by any method. Therefore, for example, without opening a feed hole in the film or substrate, the chucking chain or chucking conveyor grips and runs both ends of the film or substrate in the width direction, or a conveyor such as a belt conveyor or a roller conveyor. It can also be run by placing it on top.

(Embodiment 1 of resist coating roll)
The coating roll 2 in FIG. 1 has a resist coating portion 3 (FIG. 5) formed on a part of the outer peripheral surface of a roll made of various materials such as rubber, resin, metal, and ceramic. The resist coating section 3 is recessed (lowered) by one step from the outer peripheral surface of the roll so that the resist to be applied to the film or substrate can be collected. The resist coating portion 3 can be formed in a desired shape such as a circuit pattern, square, thin rectangle, or round shape. The resist coating part 3 can be formed at one place or two or more places on the outer peripheral surface of the roll. When forming in two or more places, it forms in the circumferential direction of an outer peripheral surface at intervals. The shape of the resist coating part 3 formed in two or more places may be the same or different. The resist coating part 3 is preferably formed at the center in the width direction of the roll.

(Embodiment 2 of resist coating roll)
The application roll 2 of FIG. 2 is made of various materials such as rubber and resin, and is the same as the conventional application roll 2 of this type. For this coating roll 2, use a coating roll having a groove formed on the outer peripheral surface (a coating roll previously developed and patented by the applicant of the present application: Japanese Patent No. 3253273) or other structure. Can do.

(Embodiment of resist transfer roll)
In FIG. 2, a transfer roll 5 is used separately from the coating roll. The transfer roll 5 has a resist coating portion 6 (FIG. 5) formed on a part of the outer peripheral surface of a roll made of various materials such as rubber, resin, metal, and ceramic, similarly to the application roll 2 of FIG. Yes. This transfer roll 5 is also formed with a resist coating portion 6 for storing or coating resist on the outer peripheral surface. The resist of the resist coating portion 6 is transferred to the coating roll 2 in FIG. In addition, the resist transferred to the coating roll 2 by being brought into rotational contact with the substrate is applied to the film or the substrate. The resist coating portion 6 of the transfer roll 5 in FIG. 2 is also recessed (lowered) by one step from the outer peripheral surface of the roll as shown in FIG. 5 so that the resist applied to the film or substrate can be stored. The resist coating portion 6 may be a circuit pattern or a desired shape such as a square, a thin rectangle, or a round shape. The resist application part 6 can be formed at one place or two or more places on the outer peripheral surface of the roll 5. When forming in two or more places, it forms in the circumferential direction of an outer peripheral surface at intervals. The shape of the resist coating portion 6 formed at two or more locations may be the same or different. The resist coating portion 6 is preferably formed at the center in the width direction of the roll.

(Embodiment 1 of resist-coated dry film)
As shown in FIG. 6, the resist-coated dry film of the present invention is a protective film in which a resist R is partially applied at intervals in the longitudinal direction of the film 1, and the resist R covers the entire surface or part of the film 1. It is covered with. The resist applied to the film 1 of this resist-coated dry film is dry, the protective film is peeled off, the resist-coated surface of the film 1 is attached to the substrate and heated and pressed to apply the resist on the resist-coated surface to the substrate. It can be applied. The material of the film 1 can be nylon, polyester, or any other desired material. The material of the protective film that covers the resist R can also be arbitrarily selected. The protective film has the same width as film 1 and is overlaid on the entire surface of resist 1 to cover resist R, or the same width as resist R or a little wider than that. It is also possible to cover only the portion of the resist R so as to overlap the resist R. The film 1 can be covered with the protective film before the resist R dries, when it is in a semi-dry state, or after the complete drying. When pasted in any state, after pasting, it is completely dried (the same dry state as an existing dry film). In addition, it is preferable to apply a squeegee or a blade to the resist R applied to the film 1 and apply the resist R to a uniform thickness before applying the protective film. Although the feed holes 11 can be opened at intervals in the longitudinal direction of the film 1 at both ends in the width direction of the laminated film 1 and the protective film, it is not always necessary to open them in advance. It can also be opened when the resist R of the film 1 is applied to a substrate using a resist-coated dry film.

(Embodiment 1 of resist-coated substrate)
The resist-coated substrate of the present invention is manufactured by each of the resist-coated substrate manufacturing methods, wherein a resist is applied to a part of both surfaces of the substrate, and the resist is covered with a film 1 superimposed on the substrate. It is what. In the resist-coated substrate of the present invention, the film 1 can be attached by applying a resist only to one side of the substrate. Moreover, a resist can also be apply | coated to the both surfaces of a board | substrate, or the whole surface of one side.

Explanatory drawing which shows an example of the resist application to the film in the resist coating substrate manufacturing method of this invention. Explanatory drawing which shows another example of the resist application to the film in the resist coating substrate manufacturing method of this invention. Explanatory drawing which shows another example of embodiment of the resist coated substrate manufacturing method of this invention. Explanatory drawing which shows another example of the resist application to the film in the resist coating substrate manufacturing method of this invention. (A) is a perspective view which shows an example of the resist application roll used for the resist coating substrate manufacturing method of this invention, and a resist transfer roll, (b) is AA sectional drawing of (a). (A) is a front view which shows an example of the film by which resist application was carried out by the resist application | coating to the film in the resist coating substrate manufacturing method of this invention, (b) is a side view of the film.

DESCRIPTION OF SYMBOLS 1 Film 2 Application | coating roll 3 Resist application part of application roll 4 Resist supply part 5 Transfer roll 6 Resist application part of transfer roll 7 Transfer roll 8, 9 Squeegee 11 Feed hole 20 Substrate 21 Semi-drying chamber R Resist

Claims (9)

In a resist coated substrate manufacturing method for manufacturing a resist coated substrate by applying a resist to a printed wiring board,
Apply a resist to a running single-leaf or continuous printed wiring board or film,
Put the applied resist in a semi-dry state with a dryer,
A film is applied to the semi-dried resist-coated surface of the printed wiring board, and a printed wiring board is bonded to the semi-dried resist-coated surface of the film .
The printed wiring board and the film that are bonded together are pressed and adhered,
The resist coated, semi-dry resist, bonding of the printed wiring board and the film, the pressure compaction bonding of the printed wiring board and the film, and continuous operation during conveyance of the printed circuit board and / or film,
The semi-dry state, when the bonding or pressure compaction bonding resist Ri is Do smooth, and the resist is in a state of being dried to the extent possible fill the bottomed holes and the through hole of the printed wiring board A method for producing a resist-coated substrate, comprising: In the resist coated substrate manufacturing method according to claim 1,
The transfer roll and the application roll are brought into rotational contact to transfer the resist from the transfer roll to a part of the outer peripheral surface of the application roll,
The coating roll is brought into rotational contact with the running film or single leaf or continuous printed wiring board,
A method for producing a resist-coated substrate, comprising: applying a resist to the film or printed wiring board. In the resist coated substrate manufacturing method according to claim 1 or 2,
A rotating roll is applied to a printed wiring board or a film on which a resist coating portion protruding or recessed from the outer circumferential surface is formed on a part of the outer circumferential surface of the roll,
A method for producing a resist-coated substrate, comprising: applying a resist to a printed wiring board or film at an interval in a running direction by the resist coating unit. In the resist coated substrate manufacturing method according to claim 3,
A method for producing a resist coated substrate, wherein a coated shape of a resist coated on a printed wiring board or film with a space is square. In the resist coated substrate manufacturing method according to claim 4,
A rotating roll is applied to a printed wiring board or a film on a part of the outer peripheral surface of the roll.
A method for producing a resist coated substrate, comprising: applying a resist to a printed wiring board or a film in a square shape by the square resist coating portion. In the resist coated substrate manufacturing method according to claim 4 or 5,
A resist coating portion that protrudes in a square shape or is recessed in a rectangular shape from the outer peripheral surface is formed on a part of the outer peripheral surface of the transfer roll or / and the application roll,
A method for producing a resist-coated substrate, wherein the transfer roll and the application roll are brought into rotational contact to transfer the resist from the transfer roll to a resist application portion on the outer peripheral surface of the application roll. In the resist coated substrate manufacturing method in any one of Claims 1 thru | or 6,
A method for producing a resist-coated substrate, characterized in that a printed wiring board and a film are bonded to each other and the pressure contact is made by vacuum bonding. In the resist coated substrate manufacturing method in any one of Claims 1 thru | or 7,
A method for producing a resist-coated substrate, wherein the resist on the resist-coated substrate is completely dried with a drying apparatus after the printed wiring board and the film are pressed and adhered.   A resist-coated substrate produced by the method for producing a resist-coated substrate according to claim 1.

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