JP2002148777A5 - - Google Patents

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Publication number
JP2002148777A5
JP2002148777A5 JP2000344647A JP2000344647A JP2002148777A5 JP 2002148777 A5 JP2002148777 A5 JP 2002148777A5 JP 2000344647 A JP2000344647 A JP 2000344647A JP 2000344647 A JP2000344647 A JP 2000344647A JP 2002148777 A5 JP2002148777 A5 JP 2002148777A5
Authority
JP
Japan
Prior art keywords
flat plate
manifold
forming
slot die
slit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000344647A
Other languages
English (en)
Japanese (ja)
Other versions
JP4092069B2 (ja
JP2002148777A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2000344647A priority Critical patent/JP4092069B2/ja
Priority claimed from JP2000344647A external-priority patent/JP4092069B2/ja
Priority to DE10063216A priority patent/DE10063216B8/de
Priority to US09/738,980 priority patent/US6478483B2/en
Publication of JP2002148777A publication Critical patent/JP2002148777A/ja
Publication of JP2002148777A5 publication Critical patent/JP2002148777A5/ja
Application granted granted Critical
Publication of JP4092069B2 publication Critical patent/JP4092069B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2000344647A 1999-12-20 2000-11-13 スロットダイを用いた感光材料用処理装置 Expired - Fee Related JP4092069B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2000344647A JP4092069B2 (ja) 2000-11-13 2000-11-13 スロットダイを用いた感光材料用処理装置
DE10063216A DE10063216B8 (de) 1999-12-20 2000-12-19 Vorrichtung zum Bearbeiten von fotosensiblem Material
US09/738,980 US6478483B2 (en) 1999-12-20 2000-12-19 Apparatus for processing photosensitive material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000344647A JP4092069B2 (ja) 2000-11-13 2000-11-13 スロットダイを用いた感光材料用処理装置

Publications (3)

Publication Number Publication Date
JP2002148777A JP2002148777A (ja) 2002-05-22
JP2002148777A5 true JP2002148777A5 (https=) 2005-05-12
JP4092069B2 JP4092069B2 (ja) 2008-05-28

Family

ID=18818811

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000344647A Expired - Fee Related JP4092069B2 (ja) 1999-12-20 2000-11-13 スロットダイを用いた感光材料用処理装置

Country Status (1)

Country Link
JP (1) JP4092069B2 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8752501B2 (en) * 2010-07-29 2014-06-17 Corning Incorporated Systems and methods for dispensing a fluid
CN103801466B (zh) * 2012-11-15 2015-11-18 沈阳芯源微电子设备有限公司 一种低冲击力均布流量的湿法处理工艺喷嘴
JP7646400B2 (ja) * 2021-03-15 2025-03-17 株式会社東芝 塗工ヘッド
US20250178019A1 (en) * 2022-02-15 2025-06-05 Hirano Tecseed Co., Ltd. Die

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