JP2002138269A - Polyester based hot melt adhesive composition and adhesive film/sheet formed by using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a polyester-hot-melt adhesive composition capable of manifesting and maintaining temporary adhesiveness by adjusting tack strength at an ordinary temperature by controlling surface roughness, and to prepare an adhesive film/sheet formed by using the same. SOLUTION: This adhesive composition is incorporated with 5-100 pts.wt. of an adhesion imparting agent comprising 2-50 pts.wt. of a non-crystalline saturated polyester resin whose Tg and molecular weight are respectively 50 to 100 deg.C and 1500-35000 and a terpene phenol based resin whose Tg is 30-130 deg.C per 100 pts.wt. of a crystalline saturated polyester resin whose Tg and molecular weight are respectively -75 to -40 deg.C and 1000-50000.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a specific polyester hot-melt adhesive composition, and more particularly to the use of this polyester hot-melt adhesive composition, ie, a kind of polyester hot-melt adhesive composition. The normal temperature tack force is adjusted by changing the surface roughness of the adhesive film / sheet obtained by molding this polyester-based hot melt adhesive composition. When it is used for an adhesive composition for a non-contact type IC card in which it is difficult to position a card material as an adherend, the surface roughness of the adhesive film / sheet is set to a predetermined value or more to reduce the adhesive area. By reducing the size, normal temperature tack is eliminated, while on the other hand, the backing reinforcement for FPC, which requires a moderate temperature tack in the temporary attachment process with a reinforcing plate as a pre-work in general For applications in which conflicting requirements are required, such as adhesive compositions for adhesives, polyester-based hot melts capable of developing and maintaining temporary adhesion by making the surface roughness of the adhesive film / sheet less than a predetermined value. The present invention relates to an adhesive composition and an adhesive film / sheet formed using the same.

[0002]

2. Description of the Related Art In general, for joining materials of the same kind or different kinds, a joining material having a pressure-sensitive adhesive function such as a double-sided adhesive tape, a liquid adhesive, a thermosetting adhesive composition,
A hot melt adhesive composition or a photocurable adhesive composition is useful.

Specifically, for example, a bonding material having a pressure-sensitive adhesive function such as a double-sided pressure-sensitive adhesive tape has the advantage of its pressure-sensitive adhesive property. After sticking to one material, the separator is peeled off, and the other is removed. Although the materials can be easily joined by laminating even at room temperature, they have pressure-sensitive adhesiveness, so that the cohesive force is limited and it is difficult to obtain strong adhesiveness. Further, in the case of a double-sided adhesive tape, there is a case where a material having a high adhesive strength has a high temporary adhering force and cannot be re-attached temporarily.

[0004] Further, in handling the above-mentioned liquid adhesive or thermosetting adhesive composition, it is necessary to adjust the amount of application from the viewpoints of contamination in a work place, stability of quality, etc., because the liquid adhesive is in a liquid state. As a result, it requires high technical skills and skill,
In addition, although a curing treatment is always necessary, this curing treatment is often very difficult. In the photocurable adhesive composition, its management and handling at a work site, and furthermore, an ultraviolet irradiation device, etc. Irradiation and curing steps are required, and high technical skills and skills are required.

Therefore, recently, hot-melt adhesive compositions, particularly polyester-based hot melt adhesive compositions, are adhesive compositions mainly containing a polyester resin which is a typical thermoplastic resin. Since it exhibits excellent adhesiveness to a very wide range of adherends, it has recently been studied to use it for the production of IC cards that have begun to spread rapidly.

[0006]

Meanwhile, an IC card has a contact type in which the contacts of an IC chip embedded in the card are exposed on the surface of the card, and an IC card for transmitting and receiving data to and from an IC chip disposed in the card. Alternatively, there is a non-contact type in which a transmitting antenna is coated with, for example, a polyester film, and the latter is expected to occupy an overwhelming mainstream in the future because of its excellent durability.

The adhesive composition used for this non-contact type IC card has a non-tack property at normal temperature, heat resistance, moisture heat resistance,
It is required to have thermal shock resistance, strong adhesive strength enough to break the skin material that covers the IC chip and antenna, and to ensure that the skin material can be melted at a low temperature that does not cause thermal change or deformation during manufacturing. It is required to prepare.

Therefore, in recent years, as a polyester-based hot melt adhesive composition, non-tack, heat resistance, wet heat resistance, and heat resistance at room temperature, which are required especially for adhesive sheets for non-contact type IC cards, which are being widely put into practical use. A study has been conducted on a biaxially stretched polyester film generally used as an IC card skin material that satisfies all conditions such as a strong adhesive strength enough to break the material.

However, a polyester hot-melt adhesive composition satisfying all of these requirements has not been found so far.

[0010] The reason for this is that if non-tackiness at room temperature is to be realized, the bonding temperature conditions such as the melting temperature will be high, and the skin material will be easily deformed during bonding and production. Also, if the bonding temperature condition is lowered, tackiness is developed in a high-temperature atmosphere such as during storage in summer, and dust or the like adheres to the adhesive composition exposed on the end face of the card, and the appearance deteriorates, and the cards are mutually bonded. This is because a problem such as adhesion occurs.

In order to solve these problems, the present inventors have developed a specific polyester-based hot-melt adhesive composition, and have developed this polyester-based hot-melt adhesive composition for use in non-contact type IC cards. It has been proposed to be suitably used as an adhesive composition (Japanese Patent Application No. 2000-250).
549).

That is, the polyester-based hot melt adhesive composition has excellent adhesion to a plastic film (skin material) such as a polyester film,
In addition to developing a strong adhesive force that destroys the skin material that covers electronic components such as IC chips and antennas,
Extremely poor tackiness at room temperature, with the required heat resistance, wet heat resistance, and thermal shock resistance, as well as low-temperature meltability that does not cause thermal change or deformation of the skin material during manufacturing, and adhesion temperature conditions Is low and the bonding time is very short.
It is very suitably used as an adhesive composition for non-contact type IC cards.

By the way, a hot-melt type film-like or sheet-like adhesive requires a slight adhesiveness for the purpose of temporary fixing to an adherend depending on the use, and requires heat, pressure and the like in a later step. In some cases, a material that exhibits high adhesive properties using a technique is required.

In particular, as in the case of an adhesive film / sheet for an FPC reinforcing plate, an aluminum plate as a reinforcing plate, SUS
A material that is used as a bonding material for a plate, a polyimide plate, a polyester film, or the like, is temporarily attached by a method such as roll lamination, and exhibits strong adhesive strength by heating and heating and pressing in a later step is required.

[0015] From the above, the present inventor has subsequently proposed a polyester hot-melt adhesive composition proposed in the specification of Japanese Patent Application No. 2000-250549 and a film obtained by forming the same into a film or sheet. In addition, the use of a sheet-like adhesive has been intensively studied for the development of various applications.

As a result, the inventor of the present invention, in forming this kind of polyester-based hot-melt adhesive composition into a film or a sheet, for example, uses adhesives obtained by selectively using releasable separators having different surface roughnesses. Agent film
It has been found that by controlling the surface roughness of the sheet, it can be suitably used in various applications, such as eliminating normal-temperature tack or developing an appropriate normal-temperature tack.

The present invention has been completed in order to solve the above-mentioned technical problems, and is a method for forming a specific polyester-based hot-melt adhesive composition to obtain a surface roughness of an adhesive film / sheet obtained. To control the room temperature tack force by controlling the temperature, particularly in terms of workability, for example, a non-contact type IC card adhesive composition where it is difficult to position a card material as an adherend when there is a room temperature tack In the case of using the separator, the surface roughness of the separator is set to a predetermined value or more to reduce the bonding area to eliminate the normal temperature tack, and conversely,
For applications such as adhesive compositions for backing reinforcing plates for FPC that require a moderate room temperature tack in the temporary attachment process with the reinforcing plate as a pre-work, the surface roughness of the resulting adhesive film / sheet is less than the specified value. An object of the present invention is to provide a polyester-based hot-melt adhesive composition capable of exhibiting and maintaining a temporary adhesive property by using the same and an adhesive film / sheet formed using the same.

[0018]

In order to achieve the above object, the polyester hot melt adhesive composition according to the present invention has a crystal having a Tg of -75 ° C to -40 ° C and a molecular weight of 10,000 to 50,000. Tg is 50 ° C or higher and 100 ° C with respect to 100 parts by weight of the unsaturated polyester resin.
Hereinafter, 2 to 50 parts by weight of a non-crystalline saturated polyester resin having a molecular weight of 1500 to 35,000 and a Tg of 30 ° C. or higher and 1
A technical means is employed in which 5 to 100 parts by weight of an adhesion-imparting agent made of a terpene phenol-based resin having a temperature of 30 ° C. or lower is blended.

The polyester hot-melt adhesive composition according to the present invention will be described in more detail as follows. An adhesive film obtained using the polyester hot-melt adhesive composition of the present invention is as follows. When the surface roughness of the sheet is controlled to 2 μm or more or less than 2 μm, it can be suitably used even in applications requiring mutually contradictory physical properties, such as eliminating normal temperature tack or developing an appropriate normal temperature tack. .

That is, the polyester hot-melt adhesive composition according to the present invention has very low room temperature tackiness. For example, the polyester hot-melt adhesive composition has a surface roughness of 2 μm or more or less than 2 μm. Adhesive film obtained by casting coating on the shape separator
If the surface roughness of the sheet is increased to Ra = 2 μm or more to reduce the area of the projections involved in the bonding, that is, the bonding area, the normal temperature tackiness is lost, and conversely, the surface roughness of the adhesive film / sheet is Ra = 2 μm. If the surface is smoothed to less than and the entire surface or almost the entire surface is configured to participate in the adhesion, an appropriate room temperature tackiness is exhibited.

In the present invention, the crystalline saturated polyester resin (A), which is the main polymer, preferably has a Tg of -75 ° C to -40 ° C, particularly -70 ° C.
The temperature is more preferably -50 ° C or lower. When such a specific crystalline saturated polyester resin (A) is used, rubber elasticity is generated, and the surface roughness of an adhesive film / sheet described later is controlled. Thus, the room temperature tackiness can be easily eliminated, or conversely, the room temperature tackiness can be exhibited.

When the Tg of the crystalline saturated polyester resin (A) becomes a high temperature exceeding −40 ° C., the Tg of the obtained polyester hot melt adhesive composition becomes
Is not preferable from the viewpoint of cold resistance, and the low-temperature adhesive property is deteriorated and the melt viscosity is increased.
As a result of the need to increase the bonding temperature conditions during the production of the C card, the IC chip built in the non-contact type IC card,
Considering the embeddability when sandwiching electronic components such as antenna coil materials with skin materials, the bonding time becomes longer, the skin material around the electronic components tends to undergo thermal change or thermal deformation, and the appearance deteriorates. In such a case, a fatal defect may occur, or the time required for bonding (bonding time) may need to be increased, and the productivity may be reduced.

On the other hand, if the Tg of the crystalline saturated polyester resin (A) is as low as less than -75 ° C., the main polymer becomes too flexible and the rigidity and heat resistance of the card may be impaired. Furthermore, even if the surface roughness of the adhesive film / sheet described later is reduced to Ra = 2 μm or more and the area of the projections involved in bonding, that is, the bonding area is reduced, room temperature tackiness may be exhibited. It is not preferable because it cannot be used in the field of a non-contact type IC card or the like where the normal temperature tackiness is unnecessary.

By the way, even in the field where room temperature tackiness, that is, temporary adhesion, such as FPC is required, the crystalline saturated polyester resin (A) as the main polymer has a Tg of-
It is preferably 75 ° C or higher and -40 ° C or lower, particularly,
The temperature is more preferably from -70 ° C to -50 ° C.

In this case, it is necessary to have an appropriate temporary adhesion property. Therefore, as a constitution thereof, the surface roughness of the obtained adhesive film / sheet is Ra as described later.
= 2 μm or less so as to increase the contact area between the adhesive film / sheet and the adherend.

In such a field, Tg is -40.
If the temperature is higher than 0 ° C., Tg tends to increase due to the incorporation of an adhesive agent described below, which is not preferable in terms of cold resistance.
Since the melt viscosity tends to be high, it is necessary to heat under temporary bonding conditions, or it is necessary to lengthen the pressing time. In either case, productivity is impaired, which is not preferable. When the temperature is lower than 75 ° C., there is a possibility that rigidity and heat resistance may be impaired due to too much flexibility, and there is a possibility that workability may be impaired due to excessively strong temporary adhesion since the softening temperature tends to decrease. Is not preferred.

From the above, by adopting a crystalline saturated polyester resin (A) which satisfies the above-mentioned conditions as the main polymer, normal temperature tackiness is eliminated, or conversely, normal temperature tackiness is exhibited and temporary tackiness is exhibited. For example, physical properties according to the use can be expressed.

The molecular weight of the crystalline saturated polyester resin (A) is preferably from 10,000 to 50,000. If the molecular weight is less than 10,000, the adhesive film / sheet described later may become brittle. On the other hand, if it exceeds 50,000, the softening temperature becomes too high. As a result, a skin material around an electronic component such as an IC chip incorporated in a non-contact type IC card is liable to undergo thermal change or thermal deformation, and The above-mentioned problems may be caused such as deterioration of Tg. In addition, even in the field where temporary adhesion is required, Tg tends to be high, which is not preferable in terms of cold resistance. However, since the melt viscosity tends to be high, it is not preferable because the above-described problem may occur such as the necessity of heating under the temporary fixing condition.

Next, the non-crystalline saturated polyester resin (B) blended with the crystalline saturated polyester resin (A) as the main polymer increases the cohesive force of the obtained adhesive composition, As a result of exhibiting a role of reducing the rubber elasticity of the unsaturated polyester resin (A), the flexibility (hardness) of the polyester-based hot melt adhesive composition is adjusted so that the card skin material of the IC card (for example, polyester resin) When the film is peeled off, moderate stress relaxation occurs inside the adhesive composition, and the function of adjusting the hardness to cause the material destruction of the card skin material is exhibited.

In the amorphous polyester resin (B) used in the present invention, its Tg is preferably 50 ° C. or more and 100 ° C. or less, and its molecular weight is 1500-150.
Those having a range of 35,000, preferably 3000 to 15000 are preferred.

This non-crystalline polyester resin (B) is
Since the crystalline saturated polyester resin as the main polymer has relatively rubber elasticity, the cohesive force and the hardness of the adhesive are adjusted so that moderate stress relaxation inside the adhesive can be achieved before the card skin material is peeled off. In addition to serving to adjust the hardness for breaking the resulting skin material, the above object can be achieved by a synergistic effect with an adhesion-imparting material described later.

This non-crystalline saturated polyester resin (B)
If the Tg is less than 50 ° C., even if the surface roughness of the adhesive film / sheet described later is Ra = 2 μm or more, tackiness is exhibited in a high-temperature atmosphere such as during transportation or storage in summer, and the card end surface It is not preferable because dust or the like adheres to the exposed adhesive composition to deteriorate the appearance, and the cards adhere to each other, and particularly, the stickiness is developed on the end faces of the cards. If the temperature exceeds 100 ° C., the softening temperature of the resin (B) tends to be 150 ° C. or higher, and when a hot-melt property is required, the melt has a very high viscosity and the bonding temperature conditions during card production need to be increased. As a result, the adhesive temperature condition becomes too high. As a result, the skin material around the electronic component such as the IC chip built in the non-contact type IC card is liable to undergo thermal change or thermal deformation, and the appearance is deteriorated. Like It is not preferable because there is a possibility that a problem occurs.

The amorphous saturated polyester resin (B) used in the present invention has a molecular weight of 1500-3500.
It is preferably 0, and if it is less than 1500, the resulting polyester-based hot melt adhesive composition becomes brittle, so that the property improvement / improvement of the main polymer becomes poor. As the softening temperature rises and the bonding temperature condition becomes too high, thermal changes and thermal deformation are likely to occur in the skin material around electronic components such as IC chips built in the non-contact type IC card, and the appearance deteriorates. , There is a risk that the problems described above may occur,
On the other hand, if the mixing amount is small, it is not preferable because the physical properties of the main polymer cannot be modified or improved.

In the present invention, the mixing ratio of the crystalline saturated polyester resin (A) and the non-crystalline saturated polyester resin (B) is such that (B) is 2 to 100 parts by weight of (A). A range of 50 parts by weight, particularly preferably a range of 5 to 40 parts by weight is desirable.

If the amount of (B) is too small, less than 2 parts by weight, relative to 100 parts by weight of (A), the effect of the compounding is difficult to manifest, and there is no point in mixing, and the adhesive film / sheet described below will not be used. It is not preferable because the hardness and cohesive strength cannot be adjusted. On the other hand, if it exceeds 50 parts by weight, the rubber elasticity of the above (A) is excessively impaired, and conversely the internal stress relaxation that contributes to the adhesive strength is reduced. It is not preferable because it cannot be expected.

In fields where temporary adhesion is required, such as an FPC reinforcing plate, the amorphous saturated polyester resin (B) may be used for the same reason as internal stress relaxation that contributes to adhesive strength.
It is preferable that the Tg, the molecular weight, and the compounding ratio of the compound be in the above ranges.

Further, in the present invention, a specific adhesion-imparting agent is blended in order to improve or improve the adhesive strength of the polyester-based hot-melt adhesive composition. An adhesion-imparting agent composed of a terpene phenolic resin (C) having a temperature of 30 ° C or more and 130 ° C or less is exemplified.

As the terpene phenolic resin (C) as the adhesion-imparting agent, terpene monophenol resin or terpene diphenol resin or a mixture thereof,
Products in which these coexist, as well as modified products thereof, may be mentioned.

The Tg of the terpene phenolic resin (C) used in the present invention is preferably in the range of 30 ° C. to 130 ° C. If it is lower than 30 ° C., it exhibits tackiness at room temperature and is suitable for non-contact type IC cards. Is not suitable because it is inappropriate. On the other hand, if it exceeds 130 ° C., the softening temperature of the resin becomes 160
As the bonding temperature condition becomes too high exceeding ℃, it is necessary to extend the bonding time. As a result, heat change or thermal deformation occurs in the skin material around the electronic components such as the IC chip built in the non-contact type IC card. It is not preferable because the above-described problems may occur, for example, the appearance may be easily deteriorated.

By the way, in the present invention, it is preferable that the softening temperature of the terpene phenolic resin most preferably used is taken into consideration.
Although it is related to the above, a range of 60 to 160 ° C. is preferable. If the temperature is lower than 60 ° C., it is not preferable because the tackiness is developed in a high-temperature atmosphere. As a result, the above-mentioned problems such as the heat change and deformation likely to occur in the skin material around the electronic components such as the IC chip built in the non-contact type IC card, and the appearance is deteriorated, and the like, may possibly occur. Absent.

Further, the molecular weight of the terpene phenolic resin is not particularly limited as long as it satisfies the above conditions, but is preferably 1500 or less, and if this molecular weight exceeds 1500, As a result of the bonding temperature condition being too high, the above-mentioned problems such as the thermal change and deformation of the skin material around the electronic component such as the IC chip built in the non-contact type IC card are likely to occur and the appearance is deteriorated. It is not preferable because there is a possibility that it may occur.
A value of from 1000 is desirable because it is easy to adjust the adhesiveness and the adhesive temperature by the number of blending parts.

In the present invention, the compounding ratio of the crystalline saturated polyester resin (A) and the terpene phenolic resin (C) as an adhesion-imparting agent is 100 parts by weight of the (A) and the (C) Is preferably in the range of 5 to 100 parts by weight.

If the amount of (C) is too small, such as less than 5 parts by weight, based on 100 parts by weight of (A), the effect of the compounding, that is, the adhesiveness of the obtained adhesive composition is hardly exhibited, is added. It is not preferable because it has no meaning.
If the amount exceeds 00 parts by weight, the softening point and the melt viscosity of the obtained adhesive composition are remarkably reduced, and it is difficult to set the conditions at the time of IC card production, and the adhesive composition causes a flow of the adhesive composition in the bonding step. Therefore, it is not preferable because it is unsuitable for card molding and the quality tends to vary, and from these viewpoints,
With respect to 100 parts by weight of (A), (C)
It is desirable to adjust to a range of 7.5 to 60 parts by weight.

In fields where temporary adhesion is required, such as FPC reinforcing plates, the terpene phenolic resin (C) has a Tg, a softening point, a molecular weight and a compounding ratio for the same reason such as adjustment of the bonding temperature. Are preferably in the above ranges.

From the above, in the polyester hot melt adhesive composition according to the present invention, the crystalline saturated polyester resin (A), the non-crystalline saturated polyester resin (B) and the terpene phenolic resin (C) Is an essential component, and these components are contained in a specific mixing ratio, that is, in the range of 2 to 50 parts by weight of (B) and in the range of 5 to 100 parts by weight of (C) with respect to 100 parts by weight of (A). It is obtained by blending.

In the present invention, the crystalline saturated polyester resin (A), the non-crystalline saturated polyester resin (B) and the terpene phenolic resin (C) are essential components. Modifiers such as fatty acid esters, phthalates, amide compounds, phosphate compounds, calcium carbonate, silica,
Inorganic fillers such as titanium oxide, pigments, vinyl acetates, ethylene vinyl esters, elastomers having good compatibility with polyesters such as styrene-butadiene rubber, furthermore, an appropriate amount of an antioxidant, an antioxidant, etc. Adhesiveness, melt viscosity, hue and the like may be adjusted.

The polyester-based hot melt adhesive composition according to the present invention can be obtained by blending the above-mentioned predetermined components in an appropriate amount and melt-mixing the mixture by a general kneading machine such as a kneader according to a general formulation.

The adhesive film / sheet according to the present invention is characterized in that the polyester hot melt adhesive composition of the present invention is formed into a film or sheet to achieve the above object. Things.

The polyester hot-melt adhesive composition of the present invention has the above-mentioned constitution and the above-mentioned characteristics. However, this adhesive composition is formed into a film or a sheet to provide excellent bonding. The adhesive film or sheet can be used stably by adjusting the surface roughness of the adhesive film / sheet, because it can be used in any field where temporary adhesion is required or temporary adhesion is not required. The method is suitably and reliably employed in any application where a temporary adhesion property is required or where a temporary adhesion property is not required.

The method for forming the polyester hot-melt adhesive composition of the present invention into a film or a sheet is not particularly limited. The method may be, for example, a method of forming a film or a sheet by an extruder, or a method of forming a film or a sheet by cast coating or coating on a releasable separator. .

The thickness of the adhesive film or sheet according to the present invention is not particularly limited according to the use, but is generally 10 μm or more, preferably 15 μm or more.
It is desirably in the range of ６００600 μm, preferably 30-300 μm.

For example, in the case of an IC card, there are many films having a surface roughness of 0.5 μm or less, but if it is less than 10 μm, a sufficient adhesive strength may not be obtained. In such a case as well, the required adhesive strength may not be obtained in some cases, and the adhesive composition may not be sufficiently embedded in the surface irregularities due to the circuit pattern.

On the other hand, if the thickness exceeds 600 μm, in the case of an IC card, the adhesive force is limited and there is no meaning, and the cost is high. In addition, the thickness of the polyester film used as the base material of the IC card and the entire IC card There is no point in considering the need to design a thickness of about 0.76 mm in general or less, and
When used as a reinforcing plate for an FPC, there is no meaning because the adhesive strength is limited, and the cost is increased. In addition, the overall thickness becomes too thick, which is contrary to the demand in the field, which is not preferable.

Further, in the adhesive film / sheet according to the present invention, the measured value at Shore hardness A is 50 to 8
If the measured value is less than 50, the adhesive film / sheet may be flexible and deformed during use, and the specified thickness may not be secured. Either case is not preferable because the film / sheet becomes hard and cracks may occur during the punching operation.

In the present invention, Shore hardness A means JI
SK 6253: A value measured with a type A durometer specified in "Testing method for hardness of vulcanized rubber and thermoplastic rubber".

By the way, the adhesive film / sheet of the present invention has excellent adhesiveness to a use thereof, specifically, a plastic film (skin material) such as a polyester film, and has a tackiness at room temperature. In addition, the bonding temperature conditions can be reduced, and the bonding time can be extremely short. For example, the adhesive composition for a non-contact type IC card is difficult to position the card material to be adhered when there is a room temperature tack. It is suitable for use in areas where room temperature tackiness is not required, that is, in areas where workability is good because there is no temporary adhesion property, while suitable room temperature tackiness in the temporary attachment step with a reinforcing plate as a pre-operation. The composition is such that it can be suitably used in fields where room temperature tackiness is required, such as an adhesive composition for a backing reinforcing plate for FPC, that is, a field in which workability is good because there is temporary adhesion. That.

In other words, the adhesive film / sheet of the present invention can be made to have a temporary adhesion property, or conversely, to have no temporary adhesion property, by adjusting the surface roughness thereof, depending on the application. , Each can be adjusted.

That is, in the adhesive film / sheet according to the present invention, in order to achieve the above object, by setting the surface roughness to be less than Ra = 2 μm, the contact area with the adherend is increased. It is configured so as to have a temporary adhesion property.

As described above, in the adhesive film / sheet according to the present invention, the method for making the surface roughness Ra less than 2 μm is not particularly limited, but the most inexpensive and simple method is the method of the present invention. When forming the polyester hot melt adhesive composition of the film-shaped or sheet-shaped, using a releasable separator having a surface roughness of less than 2 μm,
A method of forming a film or a sheet into the releasable separator by cast coating, coating, or the like may be used.

Thus, the adhesive film of the present invention
In the sheet, by making the surface smoothness less than 2 μm, the contact with the adhesive film / sheet is made good and the temporary adhesion is exhibited. Therefore, this adhesive film / sheet is suitably used as a backing reinforcing plate for FPC.

In the adhesive film / sheet according to the present invention, in order to achieve the above object, the surface roughness is set to Ra = 2 μm or more to form irregularities on the surface. It is configured to be in contact with the film / sheet so as to reduce the contact area with each other, so that there is no temporary adhesion. Therefore, this adhesive film / sheet is suitably used as an adhesive film / sheet for a non-contact type IC card.

As the releasable separator used in the present invention, a separator having a surface roughness of 2 μm or more may be a conventionally known releasable separator. Specifically, for example, a product name of 80 EVW (Oji Paper Co., Ltd.) Company thickness about 100μ
m), trade name G85 White AA (manufactured by Lintec Corporation, thickness: about 70 μm), Futmura Chemical Co., Ltd. (FOR-MP polypropylene film sand mat processed product, thickness: 40 μm), and the like.

As the releasable separator used in the present invention, if the surface roughness is less than 2 μm, a conventionally known releasable separator is used. Specifically, for example, a polyethylene laminated paper separator (Kite Co., Ltd.) Made SL-
80KCN thickness about 110-120μm) and 75EPS
(M) (thickness: 95 μm, manufactured by Oji Paper Co., Ltd.). Examples of the plastic film or those subjected to a peeling treatment include polyethylene film, polypropylene film, polyester film, and PPS.
Film, fluororesin film, PBT film, TP
An X film or a polyamide film is required.

Incidentally, in the present invention, the surface roughness (R
a) means a value measured by a tester specified in JIS B0601.

[0065]

As described above, in the polyester hot melt adhesive composition according to the present invention, the crystalline saturated polyester resin (A), the amorphous saturated polyester resin (B) and the terpene phenol resin ( C) as an essential component, their Tg, molecular weight, and blending ratio are strictly adjusted, and the adhesive film / sheet obtained by molding this is controlled in terms of its surface roughness (Ra) to obtain a polyester. Plastic film (skin material) such as film, and aluminum plate or S
Has excellent adhesion to metal plates such as US plates,
It can eliminate the normal temperature tackiness or conversely express the normal temperature tackiness, and has the required heat resistance, wet heat resistance, and thermal shock resistance. Since it has meltability at a low temperature that does not cause thermal deformation, it has an effect that the bonding time can be extremely short.

[0066]

Hereinafter, the present invention will be described in detail with reference to Examples and Comparative Examples, but the present invention is not limited to these Examples.

1. In the following Examples 1 to 4 and Comparative Examples 1 to 13, the raw materials constituting the polyester-based adhesive composition were melted and kneaded with a pressure kneader and uniformly mixed. Compositions are melted and prepared by a tank-type hot melt applicator, and each of the melted polyester-based adhesive compositions is releasable by a die coater (surface roughness: 2.5 μm).
The resultant was applied by casting to a thickness of 100 ± 10 μm, and formed into an adhesive film (surface roughness: 2.5 μm) of a polyester-based adhesive composition.

In the same manner, the melted polyester-based adhesive composition of each of the Examples and Comparative Examples was applied to a thickness of 5 μm on a releasable separator (0.5 μm) using a die coater.
The composition was applied to a thickness of 0 ± 5 μm and formed into an adhesive film (surface roughness 0.5 μm) of a polyester-based adhesive composition.

The resin as a raw material in each of the examples and comparative examples, and its Tg, molecular weight and compounding amount are as follows.

Example 1 A molecular weight of 1500 was added to 100 parts by weight of a crystalline saturated polyester resin (A) having a molecular weight of 25,000 and Tg-45 ° C.
0, non-crystalline saturated polyester resin having a Tg of 60 ° C (B)
10 parts by weight, a terpene monophenol resin having a molecular weight of 700 and a Tg of 92 ° C. (trade name: Mighty Ace G-150, manufactured by Yasuhara Chemical Co., Ltd.) (C) 20 parts by weight of 1. The mixture was kneaded and molded by the method described above to obtain an adhesive film of a polyester-based adhesive composition (thickness of 100 ± 10 μm and thickness of 50 ± 5 μm).

Example 2 100 parts by weight of a crystalline saturated polyester resin (A) having a molecular weight of 25,000 and Tg-45 ° C.,
Amorphous saturated polyester resin (B) 20 having a Tg of 53 ° C.
35 parts by weight of a terpene monophenol resin (C) having a Tg of 92 ° C. Kneading and molding by the method described in the above, an adhesive film of a polyester-based adhesive composition (having a thickness of 100 ± 10 μm and a thickness of 50 ± 5 μm
Thing).

Example 3 A molecular weight of 1500, based on 100 parts by weight of a crystalline saturated polyester resin (A) having a molecular weight of 30,000 and Tg-60 ° C.
0, non-crystalline saturated polyester resin having a Tg of 60 ° C (B)
15 parts by weight, a molecular weight of 430, a terpene diphenol resin having a Tg of 65 ° C. (trade name: YP- manufactured by Yashara Chemical Co., Ltd.)
90L and below, same. ) (C) 30 parts by weight of 1. Kneading and molding by the method described in the above, an adhesive film of a polyester-based adhesive composition (thickness of 100 ± 10 μm and thickness of 50 ± 10 μm).
± 5 μm).

Example 4 100 parts by weight of a crystalline saturated polyester resin (A) having a molecular weight of 30,000 and Tg of -60 ° C.,
Amorphous saturated polyester resin (B) 40 having a Tg of 53 ° C.
10 parts by weight of a terpene diphenol resin having a molecular weight of 430 and a Tg of 65 ° C. The mixture was kneaded and molded by the method described above to obtain an adhesive film of a polyester-based adhesive composition (thickness of 100 ± 10 μm and thickness of 50 ± 5 μm).

Comparative Example 1 A molecular weight of 15,000 and a Tg of 100 parts by weight of a crystalline saturated polyester resin having a molecular weight of 25,000 and a Tg of -45 ° C.
10 parts by weight of a non-crystalline saturated polyester resin at 60 ° C and a hydrogenated terpene resin 2 having a molecular weight of 700 and a Tg of 68 ° C
0 parts by weight. Kneading and molding by the method described in (1) above, the adhesive film (thickness 100 ± 10) of the polyester-based adhesive composition.
μm and a thickness of 50 ± 5 μm).

Comparative Example 2 100 parts by weight of a crystalline saturated polyester resin having a molecular weight of 25,000 and a Tg of -45 ° C., and a molecular weight of 2,500 and a Tg of 5
20 parts by weight of a 3 ° C. non-crystalline saturated polyester resin and 20 parts by weight of an aromatic terpene resin having a molecular weight of 800 and a Tg of 64 ° C. The mixture was kneaded and molded by the method described above to obtain an adhesive film of a polyester-based adhesive composition (thickness of 100 ± 10 μm and thickness of 50 ± 5 μm).

Comparative Example 3 A molecular weight of 15,000 and a Tg of 100 parts by weight of a crystalline saturated polyester resin having a molecular weight of 30,000 and a Tg of -60 ° C.
15 parts by weight of a non-crystalline saturated polyester resin at 60 ° C. and 30 parts by weight of a styrene resin having a molecular weight of 2500 and Tg of 40 ° C. The mixture was kneaded and molded by the method described above to obtain an adhesive film of a polyester-based adhesive composition (thickness of 100 ± 10 μm and thickness of 50 ± 5 μm).

COMPARATIVE EXAMPLE 4 100 parts by weight of a crystalline saturated polyester resin having a molecular weight of 30,000 and a Tg of -60 ° C., and a molecular weight of 2500 and a Tg of 5
40 parts by weight of a 3 ° C. non-crystalline saturated polyester resin and 10 parts by weight of a rosin-based resin having a molecular weight of 900 and a Tg of 45 ° C. The mixture was kneaded and molded by the method described above to obtain an adhesive film of a polyester-based adhesive composition (thickness of 100 ± 10 μm and thickness of 50 ± 5 μm).

Comparative Example 5 A polymer having a molecular weight of 23,000 and a Tg of 100 parts by weight of a crystalline saturated polyester resin having a molecular weight of 30,000 and a Tg of -60 ° C.
10 parts by weight of a non-crystalline saturated polyester resin at 7 ° C. and 20 parts by weight of a terpene monophenol resin having a molecular weight of 700 and a Tg of 92 ° C. Kneading and molding by the method described in (1) above, an adhesive film of polyester-based adhesive composition (thickness 100 ± 1).
0 μm and a thickness of 50 ± 5 μm).

Comparative Example 6 A polymer having a molecular weight of 18,000 and a Tg of 100 parts by weight of a crystalline saturated polyester resin having a molecular weight of 27000 and a Tg of -15 ° C.
10 parts by weight of a non-crystalline saturated polyester resin at 4 ° C. and a terpene diphenol resin 3 having a molecular weight of 430 and a Tg of 65 ° C.
0 parts by weight. Kneading and molding by the method described in (1) above, the adhesive film (thickness 100 ± 10) of the polyester-based adhesive composition.
μm and a thickness of 50 ± 5 μm).

Comparative Example 7 A molecular weight of 15,000 and a Tg of 100 parts by weight of a crystalline saturated polyester resin having a molecular weight of 27000 and a Tg of -15 ° C.
20 parts by weight of a non-crystalline saturated polyester resin at 60 ° C. and 20 parts by weight of a terpene monophenol resin having a molecular weight of 700 and a Tg of 92 ° C. Kneading and molding by the method described in (1) above, the adhesive film (thickness 100 ±) of the polyester-based adhesive composition.
10 μm and a thickness of 50 ± 5 μm).

Comparative Example 8 A polymer having a molecular weight of 23000 and a Tg of 100 parts by weight of a crystalline saturated polyester resin having a molecular weight of 27000 and a Tg of -15 ° C.
20 parts by weight of a 7 ° C. non-crystalline saturated polyester resin and a hydrogenated terpene resin 20 having a molecular weight of 700 and a Tg of 68 ° C.
Parts by weight as in 1. Kneading and molding according to the method described in (1) above, an adhesive film (100 ± 10 μm thick) of the polyester-based adhesive composition.
m and a thickness of 50 ± 5 μm).

Comparative Example 9 A polymer having a molecular weight of 2500 and a Tg of 5 was added to 100 parts by weight of a crystalline saturated polyester resin having a molecular weight of 27000 and a Tg of -15 ° C.
20 parts by weight of a 3 ° C. non-crystalline saturated polyester resin and 20 parts by weight of an aromatic terpene resin having a molecular weight of 800 and a Tg of 64 ° C. The mixture was kneaded and molded by the method described above to obtain an adhesive film of a polyester-based adhesive composition (thickness of 100 ± 10 μm and thickness of 50 ± 5 μm).

COMPARATIVE EXAMPLE 10 100 parts by weight of a crystalline saturated polyester resin having a molecular weight of 22,000 and a Tg of 19 ° C., a molecular weight of 23,000 and a Tg of 7
20 parts by weight of a non-crystalline saturated polyester resin at 20 ° C. and 20 parts by weight of an aromatic terpene resin having a molecular weight of 800 and a Tg of 64 ° C. The mixture was kneaded and molded by the method described above to obtain an adhesive film of a polyester-based adhesive composition (thickness of 100 ± 10 μm and thickness of 50 ± 5 μm).

Comparative Example 11 100 parts by weight of a crystalline saturated polyester resin having a molecular weight of 22,000 and a Tg of 19 ° C., and a molecular weight of 2500 and a Tg of 53 were used.
20 parts by weight of a non-crystalline saturated polyester resin having a molecular weight of 2,500 and a styrene resin having a Tg of 40 ° C. of 30 parts by weight. The mixture was kneaded and molded by the method described above to obtain an adhesive film of a polyester-based adhesive composition (thickness of 100 ± 10 μm and thickness of 50 ± 5 μm).

Comparative Example 12 A molecular weight of 18,000 and a Tg of 4 were added to 100 parts by weight of a crystalline saturated polyester resin having a molecular weight of 22,000 and a Tg of 19 ° C.
Terpene diphenol resin 30 having a molecular weight of 430 and a Tg of 65 ° C.
Parts by weight as in 1. Kneading and molding according to the method described in (1) above, an adhesive film (100 ± 10 μm thick) of the polyester-based adhesive composition.
m and a thickness of 50 ± 5 μm).

Comparative Example 13 100 parts by weight of a crystalline saturated polyester resin having a molecular weight of 22,000 and a Tg of 19 ° C., a molecular weight of 18,000 and a Tg of 4
20 parts by weight of a non-crystalline saturated polyester resin having a molecular weight of 900 ° C. and 10 parts by weight of a rosin-based resin having a Tg of 45 ° C. The mixture was kneaded and molded by the method described above to obtain an adhesive film of a polyester-based adhesive composition (thickness of 100 ± 10 μm and thickness of 50 ± 5 μm).

Table 1 shows Examples 1 to 4 and Comparative Examples 1 to 13 in the above mixing ratios.

The adhesive film of each example was tested for its normal-temperature tackiness by the following method. That is, in order to confirm the room temperature tackiness, a separator having a thickness of 20 mm was used.
μm release polyethylene film (surface roughness 1.5μ
m) A and 70 μm thick releasable separator (Surface roughness 2.5 μm, manufactured by Lintec Co., Ltd., trade name: G85 ShiroAA)
B and the polyester-based adhesive composition of each of the above examples was cast and coated. In each of the above examples, the surface roughness was 1.5 μm and 2.5 μm, and the thickness was 50 ± 5
A rectangular adhesive film having a size of 25 μm, a width of 25 mm and a length of 100 mm was obtained.

The adhesive film used had a surface roughness of 1.5 μm and a surface roughness of 2.5 μm, and the rough surface was a biaxially stretched polyester film (T-60 # 100 manufactured by Toray Industries, width 40 mm). , Length 120 mm, thickness 100 μm).

Next, from above, the JIS was
Each sample was obtained by reciprocating once with a 2 kg rubber roller specified by C2107 and left for 20 minutes or more.

After that, it was confirmed whether or not the temporary adhesion property when one piece of each sample was peeled off by hand, that is, the presence or absence of tackiness at room temperature, showed that the surface roughness of the adhesive film was 1.5.
In the case of μm, temporary tackiness, that is, normal temperature tackiness was observed, whereas in the case of 2.5 μm, temporary tackiness, that is, no normal temperature tackiness was observed.

A. An adhesive force test as an adhesive film for a non-contact type IC card (hereinafter, referred to as an adhesive force A) Further, the adhesive film (thickness: 100 ± 10 μm) of each of the above-described Examples and Comparative Examples was used for non-contact. In order to test the performance of the adhesive force A as an adhesive film for a type IC card, each of the films was cut into a square size of 25 mm × 25 mm, and a biaxially stretched polyester film a (E-20 # manufactured by Toray Industries, Inc.) was used. 100 width 40mm, length 120mm,
100 μm thick) and biaxially stretched polyester film b
(T-60 # 100 manufactured by Toray Industries, width 40 mm, length 120
mm, thickness 100 μm) (in this case, about 6 mm from one end and interposed at the center of the inside). This was bonded at a bonding temperature of 130 ° C., a bonding time of 15 seconds, and a pressure of 200 kP.
a) The sample was subjected to heating and pressurizing with a press laminator (a rectangle having an adhesion area of 10 mm × 25 mm) (in this case, the heating press head was heated and pressurized from the outside of the film a) to form samples of Examples and Comparative Examples.

After leaving each of these samples at room temperature for 1 hour, a pulling speed of 100 ± 1 was applied from the other end of each sample.
The adhesive force A was measured using the peak value at the time of T-peeling at 0 mm / min as a measured value. Table 1 shows the measurement results.

B. Adhesive force test as adhesive film for FPC reinforcing plate (hereinafter referred to as adhesive force B) Further, using the adhesive films (thickness 50 ± 5 μm) of each of the above Examples and Comparative Examples, an FPC adhesive was used. In order to test the performance of the adhesive force B as a film, each film was cut into a square of 25 mm × 25 mm,
Polyimide film c (Nippon Steel Chemical CCL width 40
mm, length 120 mm, thickness 64 μm) and a biaxially stretched polyester film b (T-60 # 100 manufactured by Toray, width 4)
0 mm, a length of 120 mm, and a thickness of 100 μm) (in this case, about 6 mm from one end and interposed at the center of the inside), and this is bonded at a bonding temperature of 120 ° C. and a bonding time of 15 mm.
Seconds, pressure 500kPa, press laminating (adhesion area 10mm
(25 mm rectangle) was heated and pressed (in this case, the heating press head was heated and pressed from the outside of the film c), and samples of each example and each comparative example were formed.

After leaving each of these samples for 1 hour at room temperature, a pulling speed of 100 ± 1 was applied from the other end of each sample.
The adhesive force B was measured using the peak value at the time of T peeling at 0 mm / min as a measured value. Table 1 shows the measurement results.

[0096]

[Table 1]

As shown in Table 1, the adhesive force A of Examples 1 to 4 was 75 to 105 N / 25 mm, and
It is recognized that the adhesive film has a sufficient adhesive strength as a card adhesive film.

On the other hand, as shown in Table 1, those of Comparative Examples 1 to 13 are remarkably low at 3 to 20 N / 25 mm, and it is recognized that they are insufficient as adhesive films for IC cards.

When the adhesive strength A was measured, the presence or absence of material destruction of the biaxially stretched polyester film (PET film) was observed. In the case of using the samples of Examples 1 to 4, material destruction (PET film) was observed. ) Was observed, but no material destruction was observed in the samples using Comparative Examples 1 to 13.

As described above, the polyester hot-melt adhesive films according to Examples 1 to 4 are non-tack at room temperature, but have a low bonding temperature of 130 ° C., and have a low adhesive temperature. It is recognized that a strong adhesive force is developed to such an extent as to cause material destruction, and that there is no risk of heat change or thermal deformation of the skin material during the production of the IC card.

The polyester-based hot melt adhesive films according to Examples 1 to 4 had no particular problem with respect to heat resistance, moisture heat resistance, thermal shock resistance, etc., and exhibited good properties. Was.

As shown in Table 1, the adhesive strength B of Examples 1 to 4 was 26 to 32 N / 25 mm, and it was confirmed that the adhesive strength of the adhesive film for an FPC reinforcing plate was sufficient. .

On the other hand, as shown in Table 1, those of Comparative Examples 1 to 13 were remarkably low at 4 to 10 N / 25 mm, and were found to be insufficient as adhesive films for FPC reinforcing plates. .

As described above, the adhesive film for the FPC reinforcing plate has a high adhesive strength and has a high reliability.
C can be supplied.

[0105]

As described above, the polyester hot-melt adhesive composition according to the present invention has the above-mentioned constitution and has excellent adhesiveness to a plastic film (skin material) such as a polyester film. It has a strong adhesive strength enough to break the skin material that covers electronic components such as IC chips and antennas, and has no tackiness at room temperature. Since it has melting property at a low temperature that does not cause deformation, the bonding temperature condition is low, the bonding time can be very short, and it has excellent effects such as being suitably used as a non-contact type IC card adhesive composition. Is played.

The polyester hot-melt adhesive composition according to the present invention is a hot-melt adhesive composition containing a polyester resin whose Tg and molecular weight are designed in a specific range as a main component. Since the melt adhesive composition has excellent heat resistance, moisture heat resistance, and thermal shock resistance, there is no problem in these characteristics, and the effect of being suitably used as an adhesive used in a non-contact type IC card is also obtained. You can get it.

Further, in the polyester hot melt adhesive composition according to the present invention, an appropriate room temperature tack is required in a temporary attachment step with a reinforcing plate as a preparatory work, for example, FPC.
In the field of adhesive compositions for backing reinforcing plates, by making the surface roughness of the adhesive film or sheet less than a predetermined value,
It is possible to develop and maintain an appropriate temporary adhesiveness excellent in workability, and the adhesive film for an FPC reinforcing plate formed of this polyester-based hot melt adhesive composition has extremely high adhesiveness. In addition to having excellent heat resistance,
There is no problem in these properties such as resistance to moist heat and thermal shock, and it has the effect of being suitably used as an adhesive composition for a reinforcing plate of an FPC.

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) G06K 19/077 G06K 19/00 K F Term (Reference) 4J004 AA02 AA11 AA15 AB03 BA02 FA05 4J040 DN072 EL012 GA05 JA09 JB01 KA26 LA01 LA02 LA06 MA10 MB03 MB05 NA20 NA21 5B035 AA07 AA08 BB09 CA02 CA03 CA23

Claims (10)

[Claims] 1. A non-crystal having a Tg of from 50 ° C. to 100 ° C. and a molecular weight of from 1500 to 35,000 per 100 parts by weight of a crystalline saturated polyester resin having a Tg of from −75 ° C. to -40 ° C. and a molecular weight of 10,000 to 50,000. 2 to 50 parts by weight of a water-soluble saturated polyester resin and Tg of 30 ° C. or more 13
A polyester hot melt adhesive composition comprising 5 to 100 parts by weight of an adhesion imparting agent made of a terpene phenolic resin at 0 ° C. or lower. 2. The polyester hot melt adhesive composition according to claim 1, wherein the adhesion-imparting agent comprising the terpene phenolic resin has a molecular weight of 1500 or less. 3. An adhesive film / sheet wherein the polyester hot melt adhesive composition according to claim 1 or 2 is formed into a film or sheet. 4. The adhesive film / sheet according to claim 3, wherein the surface roughness of the adhesive film / sheet is less than Ra = 2 μm. 5. The adhesive film / sheet according to claim 3, wherein the surface roughness is Ra = 2 μm or more. 6. The adhesive film / sheet according to claim 3, wherein the measured value of the Shore hardness A is in the range of 50 to 80. 7. A polyester hot melt adhesive composition, wherein the polyester hot melt adhesive composition according to claim 1 is used as an adhesive composition for a non-contact type IC card. 8. The adhesive film or sheet according to claim 3, 5 or 6, wherein the adhesive film or sheet is a non-contact type IC card adhesive film.
Adhesive film / sheet which is a sheet. 9. A polyester hot-melt adhesive according to claim 1 or 2, which is used as an adhesive for a backing reinforcing plate of a flexible printed circuit board (hereinafter simply referred to as FPC). Adhesive composition. 10. An adhesive film / sheet according to claim 3, 4 or 6, wherein the adhesive film / sheet is used as an adhesive for a backing reinforcing plate of an FPC.