JP2002137181A - Articulated robot device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an articulated robot device capable of restricting an operation occupied space small. SOLUTION: In this articulated robot device formed by connecting three arms 12, 14 and 16 to each other freely to be bent, belt transmitting mechanism 38, 42, 48, 52, 58, 70, 44, 54 and 72 are built in each arm, and in the case of expressing length of the first arm, the second arm and the third arm with L1, L2 and L3, they have the relation that L1:L2:L3=1:2:1. With this structure, a movement distance can be sufficiently secured, and the arms can be folded compact, and an operation occupied space can be restricted small.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an articulated robot device.

[0002]

2. Description of the Related Art Conventionally, articulated robot apparatuses have been used in various fields such as assembly, processing, painting, and conveyance of products. For example, in the manufacture of a flat display device or a semiconductor device, a substrate is transferred between processing chambers of a manufacturing processing apparatus or between a processing chamber and a substrate cassette for single-wafer processing in which substrates are processed one by one. To this end, an articulated robot apparatus as shown in FIG. 7 is used.

The robot apparatus shown in FIG. 7 has two arms 1 and 2 connected in a bendable manner, and is provided between the base 3 and the arm 1, between the arms 2 and 3, and between the arm 3 and the substrate support 4. Are synchronously operated by the belt transmission mechanism, whereby the substrate support 4 can be linearly moved in the horizontal direction.

However, as will be described below, since the structure has two arms, the operation occupation area becomes large, and the housing 5 surrounding the robot device also needs to be large. In addition, there is a problem that it cannot be installed or operated in a small place.

[0005]

Due to diversification of substrate processing, a large number of various processing apparatuses are used in the manufacturing process of semiconductor devices and the like. For this reason, there is a demand that the installation space of the manufacturing apparatus and the like should be as small as possible, and a small robot apparatus for transferring substrates disposed between processing chambers of the manufacturing processing apparatus is desired. I have.

A robot apparatus for transferring substrates is generally used in a housing, and the inside of the robot apparatus is provided with an ultra-clean environment by an air cleaning device. For the purpose of cleaning, the volume of the housing should be as small as possible. Is desirable.

However, in the above-described conventional articulated robot apparatus, since the arms 1 and 2 have almost the same length, if the required moving distance is to be obtained, the length of each of the arms 1 and 2 must be reduced. Needed to be longer. When the arms 1 and 2 are lengthened, the width (the direction perpendicular to the moving direction) increases as understood from the state shown by the solid line in FIG. In other words, the operation occupied space of the robot device becomes large. Therefore, the size of the housing 5 surrounding the robot device must be increased, and the above-mentioned demand cannot be met.

[0008] Therefore, a main object of the present invention is to provide an articulated robot apparatus which can reduce the space occupied by the operation. The problem of reducing the space occupied by the operation is not limited to the field of transporting semiconductor substrates, and the present invention is also applied to robot apparatuses in all fields such as painting, welding, and assembly.

[0009]

In order to achieve the above object, the present invention provides a base and a hollow structure having a distal end rotatably connected to the base about a first vertical axis. A first arm, a second arm having a hollow structure in which a distal end is rotatably connected to a distal end of the first arm about a second vertical axis, and a distal end of the second arm A third arm having a hollow structure, the end of which is rotatably connected around a third vertical axis; and a third arm having a distal end rotated about a fourth vertical axis. Attachment freely connected and the first
A driving source for rotating and driving the first arm, a first arm and a second
Are respectively disposed inside the arm and the third arm,
An articulated robot apparatus including a belt transmission mechanism that synchronously operates a second arm, a third arm, and an attachment in accordance with a rotation operation of the first arm.
L1 is the length between the first axis and the second axis of the second arm, L2 is the length between the second axis and the third axis of the second arm, and L2 is the length of the third arm. When the length between the third axis and the fourth axis is L3,
The relationship of L1: L2: L3 = 1: 2: 1 is satisfied.
When the first arm is rotationally driven, the fourth axis moves along a predetermined reference line orthogonal to the first axis and extending linearly in the horizontal direction, and the first arm and the second arm , Third
In which the center of gravity of the assembly consisting of the arm and the attachment moves along the reference line, and the orientation of the attachment in the horizontal direction is kept constant.

[0010] Such a structure is specifically as shown in FIGS. 1 to 3. As can be understood from these figures, the arm can be folded compactly and the space occupied by the operation of the arm is small. Become. In addition, since the center of gravity draws a linear trajectory, stable operation can be expected.

As the attachment, various devices such as a painting gun, a welding torch, and a robot hand can be used. However, the robot device of the present invention has a small operation occupied space and can perform a stable operation. It is effective to use a substrate support for supporting a substrate such as a semiconductor wafer or the like as an attachment for horizontal transfer of the substrate. In such a case, in the initial state where the first arm, the second arm, and the third arm are overlapped along a straight line orthogonal to the first axis and the reference line (see the state of the solid line in FIG. 1), Preferably, the substrate support is configured such that the center of gravity of the substrate supported by the support is substantially located on the first axis. In this state, when the base is rotatable in the horizontal direction, the center of gravity coincides with the rotation axis, and a stable operation can be obtained.

When the base is rotatable, the robot apparatus can operate in a cylindrical coordinate system, and when the first axis can swing at a predetermined point, the robot apparatus can operate in a polar coordinate system. By such an operation, the robot device of the present invention can be applied to various uses.

Further, in such a compact robot apparatus, the first housing is used for transferring a substrate.
, The second arm, the third arm and the substrate support, and the inside of the housing may be cleaned by a suitable cleaning means. That is, since the volume of the housing can be reduced in the robot device of the present invention, the inside thereof can be efficiently cleaned.

[0014] The cleaning means may be a blower that supplies air into the housing and a filter that cleans the air before supplying the air to the housing.

Since the belt transmission for driving each arm is disposed inside the arm, particles generated from the belt transmission and other members in the arm are prevented from scattering around the robot. Further, in order to enhance the effect, clean air supplied into the housing from the blower is introduced into the inside of the base and each arm from a gap in a connection portion between the base, each arm and the substrate support. By doing so, external contamination by particles is prevented.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below in detail with reference to the drawings.

FIG. 1 is a plan view conceptually showing an embodiment of an articulated robot device according to the present invention, and a housing surrounding the robot device is shown in a sectional view. Also,
2 is a sectional view taken along the line II-II of FIG. 1, and FIG.
FIG. 3 is a cross-sectional view along the line III-III, and shows a state indicated by a two-dot chain line in FIG. 1. The robot apparatus 10 according to the present embodiment is for horizontally transferring a semiconductor wafer W as a substrate, and basically includes a first arm 12 and a second arm 14 as shown in FIGS. , The third arm 1
6 are connected to bendable. As is clearly shown in FIG. 3, each of the arms 12, 14, 16 is a long hollow box-like body, and a cylindrical hollow shaft 18,
Reference numerals 20 and 22 extend downward in the vertical direction. In addition, about each arm 12,14,16, the hollow shaft 18,20,
The end on the side where 22 is provided is called the distal end, and the opposite side is called the distal end.

The hollow shaft 18 of the first arm 12 is inserted into a through hole 26 provided in an upper plate of a base 24 which is a cylindrical body. Thus, the first arm 12 is rotatable about the first axis C1 in the horizontal direction with respect to the base 24. A gear 28 is coaxially provided at the lower end of the hollow shaft 18, and the gear 28 is connected to a gear 32 of a rotating shaft of a motor (drive source) 30 installed in the base 24 by a toothed transmission belt 34. Have been. A base shaft 36 is fixed to the upper surface of the bottom plate portion of the base 24 and extends vertically upward. The base shaft 36 passes through the hollow portion at the center of the gear 28 and the hollow shaft 26 and terminates inside the first arm 12. I have. A gear 38 is integrally provided at an upper end of a base shaft 36 located inside the first arm 12.

The hollow shaft 20 of the second arm 14 is provided with a through hole 40 provided at the end of the upper plate of the first arm 12.
And the second arm 14 is connected to the first arm 1
2 is rotatable in the horizontal direction about the second axis C2. A gear 42 is provided at the lower end of the hollow shaft 20, and the gear 42 and the gear 38 on the base shaft 36 are provided.
A toothed transmission belt 44 is wrapped therebetween. A base shaft 46 fixed to the distal end in the first arm 12 is passed through the central hollow portion of the gear 42 and the hollow shaft 20,
It extends vertically upward. The upper end of the base shaft 46 terminates inside the second arm 14, and a gear 48 is provided integrally therewith.

As for the third arm 16, similarly to the relationship between the second arm 14 and the first arm 12, the distal end of the second arm 14 is moved in the horizontal direction about the third axis C3. Are connected rotatably. That is,
The hollow shaft 22 of the third arm 16 passes through a through hole 50 provided at the distal end of the second arm 14, and the gear 52 at the lower end thereof and the gear 48 at the distal end of the second arm 14 have teeth. Connected by a transmission belt 54. Also, the second
The base shaft 56 erected at the distal end in the arm 14 of the
The second gear 16 extends through the second and hollow shafts 22 and into the third arm 16, and a gear 58 is integrally provided at an upper end thereof.

At the tip of the third arm 16, a substrate support 60 for supporting a semiconductor wafer W as a substrate is arranged. Although various configurations of the substrate support 60 are conceivable, in the illustrated embodiment, a support shaft 64 rotatably fitted into the through hole 62 of the upper plate portion of the third arm 16 and a support shaft 64 A central support plate 66 provided at the upper end of
And four support arms 68 extending radially therefrom. The semiconductor wafer W is mounted on the upper surface of the support arm 68. The tip of each support arm 68 is bent upward, thereby preventing the semiconductor wafer W from being displaced in the horizontal direction. A gear 70 is fixed to the lower end of the support shaft 64, and is connected to the gear 58 at the end by a toothed transmission belt 72.

Further, in the present invention, each member has a dimensional characteristic. First, regarding the lengths of the arms 12, 14, and 16, the axes C1, C2; C2, C3;
If the distances between L.4 and L.4 are L1, L2 and L3, respectively, L
1: L2: L3: = 1: 2: 1. The radius of the gear 38 is r1, the radius of the gear 42 is r2, the radius of the gear 48 is r3, the radius of the gear 52 is r4, and the gear 58
Is radius r5 and the gear 70 is radius r6, r1:
r2 = 2: 1, r3: r4 = 1: 1, r5: r6 = 1:
2. Here, under the condition of r5: r6 = 1: 2, the axis C4 in FIG. 4 described later apparently moves on the X axis in a stationary state. However, by changing the gear ratio of r5: r6 (for example, 1: 1) in accordance with the purpose of use, it is possible to perform an operation having an advance angle or a delay angle on the axis C4 with respect to the X axis.

In such a configuration, the robot apparatus 1
0 is the first arm 12 as shown in FIG.
, The second arm 14 extends in the negative Y direction from the distal end of the first arm 12, the third arm 16 extends in the positive Y direction from the distal end of the second arm 14, and overlaps each other. State. In the initial position, the support shaft 64 (the fourth axis C4) of the substrate support 60 is arranged coaxially with the axis C1, which is the center of rotation of the first arm 12.

Now, the arms 12, 1 of the robot device 10 will be described.
This will be described with reference to FIG. From the state of the initial position, the electric motor 30 is controlled to rotate the gear 32, and the first arm 12 integrated with the gear 28 is rotated.
Is rotated clockwise (in the direction of arrow A in FIGS. 4A and 4B) by an angle α in the horizontal direction. At this time, the gear 38 of the base shaft 36 is moved relative to the first arm 12. Will be reversed. For this reason, the gear 42 connected to the gear 38 by the transmission belt 44 in the open wrapping manner is also the first gear.
Will rotate in the same direction as the gear 38 with respect to the arm 12. The radius r2 of the gear 42 is equal to the radius r of the gear 38.
Since it is half of 1, the rotation angle of the gear 42 is twice the rotation angle of the gear 38. The gear 42 has the second arm 14
Since the hollow shaft 20 is integrally mounted, the second
Of the first arm 12 in the same direction as the rotation direction of the gear 42, that is, in the direction of arrow B in FIG. 4B, with respect to the first arm 12 about the second axis C2, twice the angle of α. Just rotate. Further, since the base shaft 46 provided integrally with the first arm 12 rotates relatively in reverse with respect to the second arm 14, the diameter of the gear 48 on the base shaft 46 is the same as that of the gear 48 and the transmission belt 54. The gear 52 wound open around the second arm 14 also rotates with respect to the second arm 14 in the same direction and the same angle as the gear 48. As a result, the third arm 16 integral with the gear 52 has an angle twice as large as α in the direction of arrow C in FIG. 4B with respect to the second arm 14 about the third axis C3. Just rotate.

As described above, the second and third arms 14, 1
6 operates synchronously with the rotation of the first arm 12, and at this time, the fourth axis C of the distal end of the third arm 18 is always present.
4, that is, the center point of the substrate support 60 moves linearly in the positive direction on the X axis, and finally, as shown in FIG. 4C and the two-dot chain line in FIG. , 1
4, 16 are aligned in a straight line along the X axis. In this state, the semiconductor wafer W is transferred to and from the adjacent apparatus 100 by using, for example, a conventionally known transfer lift mechanism (not shown) (see a two-dot chain line in FIG. 1). ).

A gear 70 provided integrally with the support shaft 64 of the substrate support 60 and a gear 58 integral with the second arm 14 are wound around a transmission belt 72. Since the radius r6 is twice as large as the radius r5 of the gear 58, the direction of the substrate support 60 is kept constant with respect to the base 24 (the ground surface of the robot device 10). Thus, the direction of the semiconductor wafer W supported by the substrate support 60 is always constant,
It is not necessary to adjust the orientation when transferring to another device.

When returning to the initial position, the first arm 1
2 may be rotated in the direction opposite to the direction of arrow A in FIG.
When the substrate support 60 is moved in the negative X direction from the initial position, the first arm 12 at the initial position is rotated in the direction opposite to the arrow A direction. Also in this case, the substrate support 60, and thus the semiconductor wafer W thereon, moves linearly on the X axis while keeping the orientation constant (see FIGS. 4D and 4E).

In the configuration and operation as described above,
The space occupied by the operation of the arms 12, 14, 16 is suppressed to be small. For example, the configurations shown in FIGS. 1 and 7 are both for horizontally moving a distance twice the diameter of the semiconductor wafer W, but the conventional configuration shown in FIG. 7 is the configuration shown in FIG. 1 according to the present invention. It can be seen that the overhang amount of the arm at the initial position is considerably large as compared with the case of FIG. In the direction perpendicular to the direction of movement of the substrate support 60, the amount of extension of the arm at this initial position is the maximum width of the arm operation occupied space. Will be understood. Of course, when the moving distance is increased, the conventional configuration has a larger increase rate of the amount of extension of the arm, and it can be said that the robot apparatus 10 of the present invention has an effect of maintaining a compact state regardless of the moving distance. it can.

Furthermore, the center of gravity of the assembly consisting of the arms 12, 14, 16 and the substrate support 60 is always on the X axis during operation. Moreover, in many cases, in the initial position, which is the standby position, the center of gravity of the assembly including the semiconductor wafer W mounted on the substrate support 60 is located on the first axis C1. Such a position of the center of gravity makes the balance of the robot apparatus 10 good, and can prevent a load from acting on each component unevenly. As a result, it is possible to suppress wear of each component of the robot apparatus 10 and, consequently, generation of particles, and to extend the life.

On the other hand, the robot device 10 according to the present invention having a small operation occupation space can be used by being surrounded by a small housing 74. The housing 74 is provided with an air cleaning means such as HEPA (High Efficiency Particu
late Air) filter and ULPA (Ultra Low Penetration Ai)
r) It is preferable to arrange at least one blower 78 provided with a filter 76 for an ultra-clean environment such as a filter. When the blower 78 is operated, the air around the housing 74 is taken in, is cleaned by the filter 76, and is sent into the housing 74. The air in the housing 74 is discharged outside through a suitable opening (not shown). The air may be circulated. By providing such an air cleaning means, the inside of the housing 74 is kept ultra-clean, and the semiconductor wafer W during transfer can be protected from particles.

It should be noted here that the housing 74 surrounding the robot device 10 according to the present invention can be reduced in size. That is, it is known that when the inside of a space is to be cleaned by the air cleaning means having the same capacity, the smaller the volume of the space, the more efficiently the cleaning can be achieved. Therefore, in the robot apparatus 10 of the present invention, the substrate transfer environment can be ultra-cleaned with reduced labor by reducing the size of the housing 74.

From the viewpoint of protecting the semiconductor wafer W from particles, it is also important to prevent particles from flowing into the housing 74 from inside the base 24. Therefore, in order to super-clean the inside of the base 24, it is desirable to provide an air cleaning means 80 such as a blower with a filter for a super-clean environment similar to the above.

Although the preferred embodiment of the present invention has been described in detail, the present invention is not limited to the above embodiment.

For example, in the above embodiment, the base 24 is fixed, but the base 24 itself or the base 2
The base shaft 36 and the electric motor 30 in 4 may be rotated about the axis C1. In this case, the arms 12, 14,
16 can be extended in any direction of 360 degrees,
The degree of freedom in the layout of the substrate transfer destination is increased. In particular, in the case of this configuration, the center of gravity of the arm assembly in the initial state coincides with the axis C1, so that the rotation can be performed stably and the load on the robot device 10 can be reduced.

As schematically shown in FIG. 5, when the substrate transfer destination is a cassette 90 accommodating a plurality of semiconductor wafers W, the so-called blade type substrate support 60 'is moved to the third position.
It can be attached to the tip of the arm 16 of FIG. By using such a blade-type substrate support 60 ′, the semiconductor wafer W can be inserted into and removed from the shelf of the cassette 90. Note that in FIG.
Reference numeral 00 denotes an indexer which adjusts the height position of the cassette 90 so that the blade-type substrate support 60 'can be inserted into a desired shelf.

Although the base 24 is fixed in the above embodiment, the base 24 itself or the base 24 is fixed.
The base shaft 36 and the electric motor 30 may be moved up and down in the vertical direction. Thereby, there is an effect that the semiconductor wafer W can be taken in and out of the cassette at a high speed together with the operation of the indexer 900.

Further, it is possible to adopt a configuration as shown in FIG. Since the embodiment shown in FIGS. 1 to 3 conceptually shows the basic configuration of the robot apparatus of the present invention, bearings and the like are omitted. However, actually arm 1
Bearings are arranged at the rotation centers of 2, 14, and 16. A drive unit such as a belt transmission mechanism is disposed inside the arms 12, 14, and 16. Particles are generated from the drive unit and the bearing even if a wear-resistant material is used. As a result, there is a possibility that it will enter the housing 74. Therefore, the configuration shown in FIG. 6 is designed to prevent particles generated inside the arm or the like from flowing out into the housing 74.

This will be described in more detail. FIG. 6 is an enlarged longitudinal sectional view showing a portion between the second arm 14 and the third arm 16. A bearing 110 that supports the hollow shaft 22 of the third arm 16 is disposed between the bearing 110 and the base shaft 56 in the second arm 14. Thus, since the bearing 110, which is one of the particle generation sources, is disposed inside the second arm 14, the outflow of particles to the outside is slightly suppressed.

The first arm 12 and the second arm 1
4, the relationship between the first arm and the base,
The relationship between the third arm 16 and the substrate support 60 is substantially the same as the relationship between the second arm 14 and the third arm 16, and a description thereof will be omitted. The same applies to the following.

In the configuration of FIG. 6, the second and third arms 1
The arm shells 4 and 16 have a double structure, and are made of a light material such as aluminum.
Long rigid members 14b, 1 made of a material such as aluminum fixed inside the arm shells 14a, 16a.
6b. A hollow shaft 22 is fixed to the distal end of the rigid member 16b, and extends through a through hole 112 formed on the lower surface of the distal end of the arm shell 16a. The through hole 112 is defined by a cylindrical portion 114, which is
a cylindrical portion 11 defining a through hole 50 in the upper surface of the tip portion
6 are arranged coaxially with a predetermined gap ΔT inside. Although not shown, the base is provided with an opening communicating with the outside.

As described above, when the robot apparatus 10 is surrounded by the housing 74 and the blower 78 is attached to the housing 74, the internal pressure of the housing 74 is reduced by the blower 78.
When air is blown up from above, air flows from the internal space of the housing 74 into the arms 14 and 16 through the gap ΔT. Thereby, the arms 14, 1
Particles emitted from the bearing 110 and the belt transmission mechanisms 54 and 72 in the inside 6 are prevented from flowing back into the housing 74 from the arms 14 and 16.

Although the above embodiment is directed to a robot device 10 for transferring a semiconductor wafer, the present invention can be applied to other substrates such as a glass substrate for a flat panel display by changing the configuration of the substrate support 60. It is possible to apply

Further, instead of the substrate support 60, various attachments (not shown) such as a coating gun, a welding torch, and a robot hand are connected to the distal end of the third arm 16 for various other uses. The robot device of the present invention can be applied. In such other applications, it is preferable that the entire arm 12, 14, 16 is vertically moved up and down to be used as a cylindrical seating robot device. Further, an axis C1 serving as a rotation center of the first arm 12
Can be swung at a predetermined point (a point on the axis C1) so as to be compatible with a polar coordinate system.

[0044]

As described above, the articulated robot device according to the present invention requires a smaller space occupied by the operation than the conventional robot device, and the device can be made more compact. Therefore, it is possible to meet the demand for space saving.

When the arm assembly, which is the main body of the robot device, is surrounded by the housing, the volume of the housing can be reduced. Therefore, the inside of the housing can be efficiently ultra-cleaned, which is particularly effective for transferring a substrate such as a semiconductor wafer, which does not like particle contamination.

Further, since the center of gravity of the arm assembly of the robot apparatus according to the present invention is always arranged on a horizontal straight line passing through the rotation axis of the first arm, stable operation can be obtained and the life of the apparatus can be extended. Can be planned.

[Brief description of the drawings]

FIG. 1 is a plan view schematically showing an articulated robot apparatus according to the present invention, to which an attachment for transferring a substrate is attached.

FIG. 2 is a sectional view taken along the line II-II of FIG.

FIG. 3 is a cross-sectional view taken along a line III-III in FIG. 1, and is a cross-sectional view in a state indicated by a two-dot chain line in FIG.

4 (a) to 4 (e) are schematic explanatory views showing the operation of the robot apparatus of FIG. 1, and show only an arm.

FIG. 5 is a side view schematically showing another embodiment of the present invention.

FIG. 6 is a cross-sectional view showing, in an enlarged manner, a connection portion between a second arm and a third arm, which is still another embodiment of the present invention.

FIG. 7 is a plan view showing a conventional substrate transfer robot device.

[Explanation of symbols]

10 robot device, 12 first arm, 14 second
Arm, 16 ... third arm, 24 ... base, 30 ...
Electric motor (drive source), 38, 42, 48, 52, 5
8, 70 ... gears (belt transmission mechanism), 44, 54, 72
... toothed transmission belt (belt transmission mechanism), 60 ... substrate support (attachment), 74 ... housing, 76 ... filter (air cleaning means), 78 ... blower (air cleaning means), 80 ... air cleaning means , W: semiconductor wafer (substrate).

Claims (6)

[Claims] 1. A base, a first arm of a hollow structure having a distal end rotatably connected to the base about a first vertical axis, and a distal end at a distal end of the first arm. Second part of a hollow structure in which the part is rotatably connected about a second vertical axis.
And a third end of a hollow structure having a distal end rotatably connected to a distal end of the second arm around a third vertical axis.
An attachment, which is rotatably connected to a distal end of the third arm about a fourth axis in a vertical direction, and a drive source provided on the base and configured to rotationally drive the first arm. The first arm, the second arm, and the third arm are respectively disposed inside the first arm, the second arm, the third arm, and the attachment according to a rotation operation of the first arm. A belt transmission mechanism for operating the first arm in a synchronous manner, wherein a length between the first axis and the second axis in the first arm is L1, and the second axis in the second arm is When the length between the third axis and the third axis is L2, and the length between the third axis and the fourth axis in the third arm is L3, L1: L
2: L3 = 1: 2: 1 is satisfied, and when the first arm is rotationally driven, the fourth axis extends perpendicularly to the first axis and extends linearly in a horizontal direction. Moving along a reference line, a center of gravity of an assembly including the first arm, the second arm, the third arm, and the attachment moves along the reference line; An articulated robot device configured to maintain a constant orientation in a direction. 2. The articulated robot device according to claim 1, wherein the base is rotatable in a horizontal direction. 3. The articulated robot device according to claim 1, wherein the base is vertically movable in a vertical direction. 4. The apparatus according to claim 1, wherein the first axis is swingable about a predetermined point.
The articulated robot device according to any one of the above. 5. The apparatus according to claim 1, wherein said attachment is a substrate support for supporting a substrate.
The articulated robot device according to any one of the above. 6. In a state where the first arm, the second arm, and the third arm are overlapped along a straight line orthogonal to the first axis and the reference line, the substrate supporter The articulated robot apparatus according to claim 5, wherein the substrate support is configured such that a center of gravity of the supported substrate is substantially arranged on the first axis.