JP2002137034A - Method and device for three-dimensional alignment of wire - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method and device for three-dimensional alignment of wire that can fabricates a structure of wires aligned three-dimensionally and precisely at a narrow pitch. SOLUTION: The method and device for three-dimensional alignment of wire can fabricate a structure of wires aligned three-dimensionally at a designated pitch. After at least two sheets of spacer plates 12 are arranged facing each other in the circumferential direction of a rotational axis 11, by rotating the rotational axis 11, wires 13 are wound on the spacer plates 12 at the designated pitch enclosing the rotational axis 11 and spacer plates 12. Then on these spacer plates 12, new spacer plates 12 whose sides perpendicular to the rotational axis 11 are longer than those of the preceding spacer plates 12 by a designated increment are piled, and further wire 13 is wound on them at the designated pitch repeatedly to form the wire structure.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for three-dimensionally arranging wires for producing a wire structure in which wires are three-dimensionally arranged at a predetermined pitch.

[0002]

2. Description of the Related Art To manufacture a wire structure in which conductive wires are three-dimensionally and precisely arranged at a predetermined pitch is, for example, to manufacture an anisotropic conductive material in which a wire structure is embedded in rubber or resin. In doing so, it has become one of the important technologies. The anisotropic conductive material is used as a member of a printed circuit board or the like for connecting elements and electrodes of a wiring board face to face, and at this time, conduction is obtained only in a direction between the electrodes by wires, and Insulation is secured in the horizontal direction of the wiring board. Taking advantage of such characteristics, anisotropic conductive materials have been widely used as wiring members for calculators and liquid crystals.

However, it is practically extremely difficult to fabricate a wire structure in which wires are three-dimensionally and precisely arranged at a predetermined pitch. No. 321556, Japanese Patent Application No. 11-
No. 359585 proposes a wire stereoscopic alignment method and apparatus. According to these wire three-dimensional alignment methods and devices, wires can be three-dimensionally aligned at a predetermined pitch with high accuracy.

[0004]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a wire structure in which wires are three-dimensionally aligned at a narrower pitch with high accuracy. An object of the present invention is to provide a method and an apparatus for three-dimensionally aligning wires that can be manufactured.

[0005]

According to the present invention, there is provided a wire three-dimensional alignment method for manufacturing a wire structure in which wires are three-dimensionally aligned at a predetermined pitch, wherein at least two spacers are arranged in a circumferential direction of a rotation axis. After arranging the plates so as to face each other, by rotating the rotation axis, a wire is wound at a predetermined pitch on the spacer plate so as to surround the rotation axis and the spacer plate, Then, on the spacer plate,
Stacking a new spacer plate whose side orthogonal to the rotation axis is longer than the spacer plate by a predetermined length,
Further, there is provided a wire three-dimensional alignment method characterized by repeating an operation of winding a wire thereon at a predetermined pitch.

Further, according to the present invention, there is provided a wire three-dimensional alignment method for producing a wire structure in which wires are three-dimensionally aligned at a predetermined pitch, wherein at least two spacer plates are provided on two peripheral side surfaces at a predetermined interval. After constructing the plate structure by arranging them so as to be opposed to each other, the wire supply means moves around the plate structure, so that the wire supply means moves on the spacer plate on which the plate structure is constructed. A wire is wound at a predetermined pitch, and then a new spacer plate having a length parallel to the wire winding direction longer by a predetermined length than the spacer plate is stacked on the spacer plate. A wire three-dimensional alignment method characterized by repeating an operation of winding a wire at a predetermined pitch.

Further, according to the present invention, a rotating shaft, a mold disposed around the rotating shaft, and a mold disposed inside the mold so as to face each other in a circumferential direction of the rotating shaft. At least two spacer plates provided, driving means for rotating the rotating shaft and the mold, and a predetermined pitch from the outer peripheral side of the two spacer plates to a predetermined position of the two spacer plates. And a wire supply means for supplying a wire to be wound. In the wire three-dimensional alignment method and apparatus described above, grooves are formed at predetermined pitches on opposite end faces of the spacer plate, and the wires are housed in the grooves, so that the wires can be three-dimensionally arranged with high accuracy. Preferred.

[0008]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described in detail based on embodiments, but the present invention is not limited to these embodiments. FIG. 1 is a schematic configuration diagram showing an embodiment of an apparatus for performing the wire three-dimensional alignment method according to the present invention, and FIG. 2 is a partially enlarged perspective view of FIG. In the three-dimensional wire aligning apparatus 10, a mold 17 is provided so as to surround the rotation shaft 11 and the periphery of the rotation shaft 11. On the mold 17, two spacer plates 12 are arranged in the circumferential direction of the rotating shaft 11. The two spacer plates 12 are disposed so as to be parallel to each other with the rotation shaft 11 interposed therebetween, and are supported by the mold 17 by support rods 20 at both ends of the center of the spacer plate 12.

A wire bobbin as a wire supply means is provided on two spacer plates 12 arranged around the rotation shaft 11 so as to face each other, so as to surround the rotation shaft 11 and the spacer plate 12. 14
Is wound at a predetermined pitch. At the start of winding, the wire 13 is fixed at the wire mounting portion 18 of the metal mold 17 of the wire three-dimensional alignment device 10. Reference numeral 15 denotes a base which supports the rotating shaft 11 and supports the wire bobbin 14 via an arm 16. A mold 17 is attached to the rotating shaft 11, and the spacer plate 12 is stacked on the mold 17. 24 indicates a torque motor.

In the three-dimensional wire aligning apparatus 10 having the above-described structure, the wire 13 unwound from the wire bobbin 14 is wound around the tension adjusting roller 19, and is further moved in the axial direction of the mold rotating shaft 11 (in FIG. ), Is wound around the roller 23 of the wire moving device 22 that moves by a predetermined pitch, and then the wire mounting portion 1 of the mold 17 is wound.
Attach wire 13 to 8. The movement of the wire 13 is synchronized with the rotation of the mold 17. Next, the wire 13 is wound around the spacer plate 12 at a predetermined pitch by rotating the rotating shaft 11. Then, this spacer plate 1
2, a new spacer plate 12 whose side orthogonal to the rotation axis 11 is longer than the spacer plate 12 by a predetermined length is stacked, and the new spacer plate 1 is further stacked.
The operation of winding the wire 13 on the wire 2 is repeated.

In the three-dimensional wire aligning apparatus 10, two (one pair) spacer plates 12 that are sequentially laminated have a dimension longer by a predetermined length than the spacer plate 12 located immediately below each. Use things. Therefore, as shown in FIG. 3, if the wire pitch is P, the length of the upper spacer plate 27 is 1 and the length of the lower spacer plate 28 is m, the following equation is established.

## EQU1 ## l = m + 2P

Therefore, by sequentially stacking spacer plates having a length corresponding to a desired pitch,
A wire structure in which a wire is stretched can be easily manufactured. Accordingly, it is possible to appropriately cope with a narrow-pitch printed circuit board and the like that will be increasingly demanded.

As described above, the upper spacer plate 27
Is increased by a predetermined dimension with respect to the length of the lower spacer plate 28, so that wires with a narrower pitch can be stretched without making the thickness of the spacer plate itself unnecessarily thin. At the same time, it is possible to manufacture a wire structure in which various narrow-pitch wires are stretched by using a steel plate having a constant thickness sold as a standard general-purpose product as a spacer plate.

In FIGS. 1 and 2, reference symbol A denotes a wire moving zone, and the wire 13 is moved by a predetermined pitch by the wire moving device 22 in the wire moving zone A during rotation of the mold 17. Thus, the rotation shaft 11 is set to n
The wire 1 in the wire movement zone A every rotation.
3 is moved by a predetermined pitch, and a new spacer plate 12 is laminated when the rotation is completed n times. Further, by repeating the operation of winding the wire 13 thereon at a predetermined pitch for a predetermined number of times or more, a wire structure in which the wire 13 is three-dimensionally arranged at a predetermined narrowly controlled pitch and with high accuracy can be manufactured. .

As described above, two wire structures 21 (21a, 21b) as shown in FIG. 4 are obtained. In the wire structure obtained in this manner, since the wires are three-dimensionally arranged with high precision at a predetermined and narrowly controlled pitch, the wire structure is embedded in rubber or resin and cut into an appropriate size. Thereby, for example, a member such as an anisotropic conductive material that can conduct in only one direction can be manufactured.

FIG. 5 is a perspective view showing one embodiment of the structure of the spacer plate 12. Grooves 30 are formed on the upper surface of the spacer plate 12 at a predetermined pitch along the direction in which the wires are stretched. By stretching the wires so as to fit in the grooves 30, the distance between the wires on the upper surface of the spacer plate 12 can be made constant, and the accuracy of the stretched position can be secured. The groove 30 is not an essential component for implementing the present invention, and it goes without saying that the effect of the present invention can be obtained by using a spacer plate without the groove 30.

Next, another example of the wire three-dimensional alignment method of the present invention will be described. That is, in FIG.
A plate structure is constructed by arranging two spacer plates 12 at predetermined intervals so as to face each other on two side surfaces around the plate structure, and the wire bobbin 14 is moved around the plate structure. 4, the wire structure 2 in which the wires are three-dimensionally arranged at a predetermined pitch and with high accuracy as shown in FIG.
1 can be produced.

Next, as described above, after obtaining a wire structure using the wire three-dimensional alignment method and alignment device of the present invention, rubber or plastic, or plastic (resin) and ceramic are applied to the wire structure. An insulating material such as a composite material is poured and the insulating material is cured. The pouring of the insulating material into such a wire structure is usually performed by installing the wire structure in a mold and introducing the insulating material into the mold. The pouring is preferably performed by a vacuum casting method.

Next, after the insulating material is cured, by removing the spacer plate and the like, a composite block body 38 in which the wires 34 are arranged at a predetermined pitch as shown in FIG. 6 is manufactured. In FIG. 6, the composite block 3
Numeral 8 is configured by arranging conductive wires 34 at a predetermined pitch on an insulating material 32 such as rubber, plastic, or a composite material composed of plastic and ceramic. The wire 34 is connected to one surface 36 of the composite block body 38.
From the first surface 36 to the other surface 39 opposing the one surface 36.
9 is formed in a state where the wire 34 protrudes.

After manufacturing the composite block body 38 as described above, the composite block body 38 is printed by slicing (cutting) with a band saw, a wire saw, or the like on surfaces A1, A2,... A conductive material such as a circuit board material or an anisotropic conductive material can be manufactured. According to the above-described method, since the wires 34 can be arranged at predetermined intervals and with high dimensional accuracy, the wires 34 can be arranged at a narrower pitch (high density), for example,
A printed circuit board material arranged at a narrow pitch of 0.5 mm or less can be obtained.

FIG. 7 shows an example of a printed circuit board material manufactured by the method and apparatus of the present invention. In FIG. 7, a substrate material 40 is made of plastic and ceramic, and a wire 44 is attached to an insulating material 43 formed in a plate shape.
Are arranged at a predetermined pitch. Then, the ends of the wires 44 are exposed on both surfaces of the insulating material 43 and the substrate material 40
Can be electrically connected between the two surfaces of the substrate. The substrate material 40 having such a configuration is used as a base substrate. For example, as shown in FIG. 7, a surface wiring layer in which wiring layers 45 and insulating layers 46 are alternately laminated is provided on both surfaces thereof. , And a semiconductor chip 47 is mounted thereon.
Construct a printed circuit board.

[0022]

As described above, according to the method and apparatus for three-dimensionally aligning wires according to the present invention, wires with a narrower pitch can be stretched without reducing the thickness of the spacer plate itself to a predetermined thickness or more. A high-density wire structure can be obtained. Also, using a steel plate of a certain thickness sold as a standard general-purpose product as a spacer plate,
It is possible to manufacture a wire structure in which wires of various narrow pitches are stretched.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram showing an embodiment of an apparatus for performing a wire three-dimensional alignment method according to the present invention.

FIG. 2 is a partially enlarged perspective view of FIG.

FIG. 3 is an explanatory diagram showing a relationship between a wire pitch and a length of a spacer plate.

FIG. 4 is a perspective view showing an example of a wire structure obtained by the present invention.

FIG. 5 is a perspective view showing one embodiment of a spacer plate.

FIG. 6 is a partial perspective view showing an example of a composite block body.

FIG. 7 is a perspective view showing an example of a printed circuit board.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 10 ... Wire three-dimensional arrangement apparatus, 11 ... Rotation axis, 12 ... Spacer plate, 13 ... Wire, 14 ... Wire bobbin, 1
5 ... Base, 16 ... Arm, 17 ... Mold, 18 ... Wire attachment part, 19 ... Tension adjustment roller, 20 ... Support rod, 2
1, 21a, 21b: wire structure, 22: wire moving device, 23: roller, 24: torque motor, 27: upper spacer plate, 28: lower spacer plate, 3
0: groove, A: wire movement zone, 32: insulating material, 3
4 ... wire, 36 ... one surface of the composite block, 38 ... composite block, 39 ... other surface of the composite block, 40 ...
Substrate material, 43: insulating material, 44: wire, 45: wiring layer, 46: insulating layer, 47: semiconductor chip.

Claims (5)

[Claims] 1. A wire three-dimensional alignment method for manufacturing a wire structure in which wires are three-dimensionally aligned at a predetermined pitch, wherein at least two spacer plates are arranged in a circumferential direction of a rotating shaft so as to face each other. After the installation, the wire is wound around the spacer plate at a predetermined pitch by rotating the rotating shaft so as to surround the rotating shaft and the spacer plate. A three-dimensional wire alignment method comprising: stacking a new spacer plate having a side perpendicular to the rotation axis by a predetermined length longer than the spacer plate, and repeating the operation of winding wires on the new spacer plate at a predetermined pitch. . 2. A wire three-dimensional alignment method for producing a wire structure in which wires are three-dimensionally aligned at a predetermined pitch, comprising: at least two spacer plates on two peripheral side surfaces;
After constructing the plate structure by arranging them so as to face each other at a predetermined interval, the wire supply means moves around the plate structure, thereby forming the spacer plate. A wire is wound on the spacer plate at a predetermined pitch, and a new spacer plate having a length parallel to the wire winding direction longer than the spacer plate by a predetermined length is stacked on the spacer plate. A wire three-dimensional alignment method, wherein an operation of winding a wire thereon at a predetermined pitch is repeated. 3. The wire three-dimensional alignment method according to claim 1, wherein grooves are formed at a predetermined pitch on both end faces of the spacer plate facing each other, and wires are accommodated in the grooves. 4. A rotating shaft, a mold disposed around the rotating shaft, and at least two sheets disposed inside the mold so as to face each other in a circumferential direction of the rotating shaft. A spacer plate; a driving means for rotating the rotating shaft and the mold; and a wire for supplying a wire wound at a predetermined pitch from an outer peripheral side of the two spacer plates to a predetermined position of the two spacer plates. A wire three-dimensional alignment device, comprising: supply means. 5. The three-dimensional wire aligning apparatus according to claim 4, wherein grooves are formed at both ends of the spacer plate facing each other at a predetermined pitch, and wires are accommodated in the grooves.