JP2002134561A5 - - Google Patents

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Publication number
JP2002134561A5
JP2002134561A5 JP2000327884A JP2000327884A JP2002134561A5 JP 2002134561 A5 JP2002134561 A5 JP 2002134561A5 JP 2000327884 A JP2000327884 A JP 2000327884A JP 2000327884 A JP2000327884 A JP 2000327884A JP 2002134561 A5 JP2002134561 A5 JP 2002134561A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000327884A
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Japanese (ja)
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JP4334128B2 (ja
JP2002134561A (ja
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Priority to JP2000327884A priority Critical patent/JP4334128B2/ja
Priority claimed from JP2000327884A external-priority patent/JP4334128B2/ja
Publication of JP2002134561A publication Critical patent/JP2002134561A/ja
Publication of JP2002134561A5 publication Critical patent/JP2002134561A5/ja
Application granted granted Critical
Publication of JP4334128B2 publication Critical patent/JP4334128B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2000327884A 2000-10-27 2000-10-27 半導体実装方法および半導体実装装置 Expired - Fee Related JP4334128B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000327884A JP4334128B2 (ja) 2000-10-27 2000-10-27 半導体実装方法および半導体実装装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000327884A JP4334128B2 (ja) 2000-10-27 2000-10-27 半導体実装方法および半導体実装装置

Publications (3)

Publication Number Publication Date
JP2002134561A JP2002134561A (ja) 2002-05-10
JP2002134561A5 true JP2002134561A5 (US20040097461A1-20040520-C00035.png) 2007-04-12
JP4334128B2 JP4334128B2 (ja) 2009-09-30

Family

ID=18804824

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000327884A Expired - Fee Related JP4334128B2 (ja) 2000-10-27 2000-10-27 半導体実装方法および半導体実装装置

Country Status (1)

Country Link
JP (1) JP4334128B2 (US20040097461A1-20040520-C00035.png)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005301056A (ja) * 2004-04-14 2005-10-27 Hitachi Displays Ltd 表示装置とその製造方法
CN100463130C (zh) * 2004-05-20 2009-02-18 威盛电子股份有限公司 倒装芯片封装工艺
TWI299555B (en) * 2006-04-28 2008-08-01 Taiwan Tft Lcd Ass Semiconductor flip-chip package component and fabricating method
TW201018340A (en) * 2008-10-30 2010-05-01 Nan Ya Printed Circuit Board Method for improving yield of solder bumps
JP5191927B2 (ja) * 2009-02-26 2013-05-08 アルプス電気株式会社 Ｍｅｍｓセンサ及びその製造方法
JP2012089563A (ja) * 2010-10-15 2012-05-10 Sanken Electric Co Ltd 半導体モジュール
JP2019121704A (ja) * 2018-01-09 2019-07-22 トヨタ自動車株式会社 半導体装置
JP7428916B2 (ja) * 2021-12-27 2024-02-07 日亜化学工業株式会社 発光装置の製造方法および発光装置
CN116110805B (zh) * 2023-04-13 2023-07-11 深圳宏芯宇电子股份有限公司 芯片键合方法、结构及存储器

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