JP2002134550A - Spool storage case for semiconductor bonding wire - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an improved spool storage case which is used for storage or transportation of a spool with wound semiconductor bonding wire. SOLUTION: In a spool storage case of a semiconductor bonding wire consisting of a casing main body A with a cover fitting bank having a hollow on the reverse and a cover case B capable of fitting in the outer surface of the cover fitting bank of this casing main body A, a trench 41 on the reverse side of the cover fitting bank 31 provided with the casing main body A has a space where a thumb can be put in at least.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a spool storage case used for storing and transporting a spool wound with a semiconductor bonding wire.

[0002]

2. Description of the Related Art Generally, a semiconductor bonding wire is wound on a spool, and the spool wound with the semiconductor bonding wire is stored or transported in a case. A sectional view of FIG. 5 shows a conventional spool storage case C ′ that stores the spool 2 around which the semiconductor bonding wire 6 is wound. As shown in FIG. 5, the spool storage case C ′ includes a case body A ′ and a lid case B ′.
The case body A 'is provided with a spool fitting ridge 1a for fitting the web of the spool 2 to hold the spool 2, and the lid case B' is provided with a web of the spool 2. And a spool fitting ridge 1b for holding the spool by fitting to the spool.

The spool fitting ridge 1a of the case body A '
Is provided with a lid fitting ridge 3 outside the cover case B ′.
Is fitted to the lid fitting ridge 3 to cover. Since the back side groove 4 formed on the back side of the lid fitting ridge 3 of the conventional case body A 'only supports the skirt portion S of the lid case B', the width is 8 mm or less and the depth is 20 mm.
It is composed of a groove consisting of the following narrow gaps. In order to store the spool 2 around which the semiconductor bonding wire 4 is wound in the conventional spool storage case C ', the spool 2 is inserted into the spool fitting ridge 1a of the case body A' and the lid fitting ridge 3
The cover case B 'is fitted on the inside so that the spool fitting ridge 1b fits on the spool 2 and the inner surface of the skirt portion S of the cover case B' fits on the outer surface of the cover fitting ridge 3 from above. Cover the lid.

In order to take out the spool 2 housed in this manner from the spool housing case C 'and mount it on a spool holder (not shown) of the semiconductor bonding apparatus, first, the lid case B' is removed from the case body A '. After the separation, the spool 2 is taken out. At this time, if the spool 2 is taken out by hand, the hand may accidentally touch the bonding wire 6 wound on the spool 2 and contaminate the bonding wire 6, which is not preferable. In order to solve this, as shown in FIG. 5, two dents are provided in the spool fitting ridge 1a of the case body A 'at least so as to allow at least a thumb, and fingers 5 of one hand are inserted into these dents. Then, while holding down the case main body A 'while pinching a part of the spool fitting ridge 1a, the lid is opened by pulling apart the lid case B' with the other hand to fit the spool fitting ridge 1a of the case main body A '. A method has been proposed in which the spool 2 is attached to a spool holder of a semiconductor bonding apparatus without directly touching the spool 2 with the finger held in place.

[0005]

However, the conventional spool storage case C 'has poor dimensional accuracy due to thermal deformation or the like after molding, and the case body A' and the lid case B 'cannot be easily fitted. If this is forcibly fitted with force, the fitting may be stronger than expected. In order to take out the spool 2 housed in the spool housing case C 'thus firmly fitted from the spool housing case C', it is performed by forcibly pulling the lid case B 'away from the case body A'. In this case, an unexpected force is required, and when the lid case B 'is forcibly separated from the case body A' by force, the spool 2 is rapidly separated from the case body A '. A '
Sometimes jumped out. Further, in the conventional spool storage case C ', when the fitting of the spool to the spool holder of the semiconductor bonding apparatus is strong, it is attempted to take out the spool from the spool holder using the case body A' of the conventional spool storage case C '. Cannot be taken out because it cannot be firmly grasped, and therefore, the flange 2 'of the spool must be directly grasped and removed with fingers.

[0006]

Means for Solving the Problems Accordingly, the present inventors have
As a result of conducting research to solve this problem, (a) Fig. 1
As shown in the cross-sectional view of FIG. 7, the width and the height of at least the size that allows the thumb to enter the back side groove of the lid fitting ridge formed on the case main body A of the spool storage case C. A wide lid fitting bank 31 having a wide back groove 41 having a space is provided.
After the finger is inserted and the spool 2 is pressed down while holding the flange 2 ′ toward the center from the wide back groove 41 of the wide lid fitting ridge 31, when the lid case B is pulled away from the case main body A, Even if there is a sudden dropout caused by the recoil when the lid case B cannot be pulled out easily, since the flange 2 ′ of the spool is firmly pressed by the finger 5,
The spool 2 does not fly out of the case body A, and when removing the spool from the spool holder of the semiconductor bonding apparatus, the case body A is put on the spool,
Since the flange 2 'can be indirectly grasped by the finger via the case main body A, the spool can be removed without directly touching the spool, and the fitting between the spool holder and the spool of the semiconductor bonding apparatus is firm. Even if there is, there is no situation in which the flange 2 'of the spool must be directly grasped and removed with a finger.
(B) In this case, since the material constituting the case body A and the lid case B has a thickness in the range of 0.2 to 0.8 mm, the material from the wide back-side groove 41 of the wide lid fitting ridge 31 to the central portion. The material that constitutes the case body A is elastically deformed simply by being pinched by the finger 5 toward the, and the knowledge that the flange 2 ′ of the spool 2 can be easily pressed from the wide back side groove 41 without touching the hand. It was.

The present invention has been made based on such findings, and (1) a case body A provided with a lid fitting ridge having a back side groove, and an outer surface of the lid fitting ridge of the case body A. In the spool housing case of the semiconductor bonding wire including the lid case B that can be fitted into the case, the lid fitting ridge provided on the case main body A has a wide back side groove 41 having at least a space large enough to receive a thumb. And a spool housing case for a semiconductor bonding wire, which is a wide lid fitting ridge 31 having the following.
The wide back-side groove 41 having a space large enough to accommodate the thumb is sufficient if it has a width and a depth at which the thumb can be inserted and the flange of the spool can be grasped. 9m
m or more, but the wider back-side groove 41 is only bulkier as it is larger, so the upper limit is 15 mm or less in width.
More preferably, the depth is suppressed to 45 mm or less.

FIG. 2 is a perspective view of another case body constituting the spool housing case of the semiconductor bonding wire of the present invention, and FIG. 3 is a sectional view taken along line XX of FIG. As shown in FIGS. 2 and 3, a lid fitting ridge 3 having the same narrow back side groove 4 as the conventional one is formed in the case main body A, and at least two Wide lid mating bank 31
And a wide back-side groove 41 having a space at least large enough to allow a thumb to enter is formed on the back side of the wide-cover fitting ridge 31.

Accordingly, the present invention provides (2) a semiconductor body comprising a case body A provided with a lid fitting ridge having a back side groove, and a lid case capable of fitting to the outer surface of the lid fitting ridge of the case body A. In the bonding wire spool storage case, the back side groove of the lid fitting ridge provided on the case main body A is at least a part of the lid fitting ridge 3 having the normal narrow width back side groove 4. The present invention is characterized by a spool housing case for a semiconductor bonding wire provided with at least two wide lid fitting ridges 31 each having a wide back groove 41 having a space large enough to accommodate the space.

As shown in FIG. 2, the case body constituting the spool housing case of the semiconductor bonding wire of the present invention may not have a spool fitting ridge. The lid case B with respect to the case body A having such a structure may be provided with a relatively deep spool fitting ridge 1b as shown in the perspective view of FIG.

As shown in FIGS. 2 and 3, an end stop tape of a bonding wire wound around a spool around a part of a lid fitting ridge of a case main body constituting a spool storage case of a semiconductor bonding wire according to the present invention. It is preferable to provide an opening 7 for peeling off. Therefore,
(3) The invention according to (1) or (2), wherein (3) an opening for peeling off an end stop tape of a bonding wire wound on a spool is provided in a part of the lid fitting ridge of the case body. And a spool storage case for semiconductor bonding wires.

The material of the case body and the lid case constituting the spool storage case of the semiconductor bonding wire of the present invention is any material as long as it has a certain degree of hardness, a certain degree of elasticity, and can be molded. It may be present, and is not particularly limited, but is more preferably a material having excellent transparency. Therefore, the present invention is characterized in that (4) the spool housing case of the semiconductor bonding wire according to (1), (2) or (3), wherein the case body and the lid case are made of a transparent material thin plate. is there.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION A transparent thermoplastic plastic plate having a thickness of 0.5 mm is used, and at least a thumb having the shape shown in FIG.
A case body A provided with a wide lid fitting ridge 31 having a wide back side groove 41 having a space of 0 mm, and a lid case B which can be fitted on the outer surface of the wide lid fitting ridge 31 of the case body A. Of the spool storage case of the present invention made of 100 pieces. On the other hand, 100 conventional spool storage cases shown in FIG. 5 were prepared.

When the spool is stored in the spool storage case of the present invention and the conventional spool storage case, the thumb and the middle finger are inserted, and the lid case B is vigorously pulled away from the case body A. Although the spool did not pop out, six spools popped out in the conventional spool storage case. In addition, when the case body was put on the spool mounted on the spool holder of the semiconductor bonding apparatus and the spool was removed without directly touching a finger, all the spools were removed using the case body of the spool storage case of the present invention. Although it could be removed, 34 spools could not be removed using the case body of the conventional spool storage case.

[0015]

As described above, the spool housing case of the semiconductor bonding wire according to the present invention can be used even if the dimensional accuracy varies or the dimensional accuracy is insufficient.
The spool does not pop out when the spool is taken out, allowing the use of a product that was previously defective and improving the product yield.Also, when the spool is taken out from the spool holder of the semiconductor bonding equipment, a finger is directly attached to the spool. It has excellent industrial effects such as being able to be removed without touching it.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a state in which a spool is housed in a semiconductor bonding wire spool housing case of the present invention.

FIG. 2 is a perspective view of a case main body in the semiconductor bonding wire spool storage case of the present invention.

FIG. 3 is a sectional view taken along line XX of FIG. 2;

FIG. 4 is a perspective view of a lid case in the semiconductor bonding wire spool storage case of the present invention.

FIG. 5 is a sectional view showing a state in which a spool is housed in a conventional semiconductor bonding wire spool housing case.

[Explanation of symbols]

 1a Spool fitting ridge 1b Spool fitting ridge 2 Spool 2 'Spool flange 3 Lid fitting ridge 31 Wide lid fitting ridge 4 Back side groove 41 Wide wide back side groove 5 Finger 6 Bonding wire 7 Opening A Case body B Cover case

Claims (4)

[Claims] 1. A spool storage case for a semiconductor bonding wire, comprising: a case main body provided with a lid fitting ridge having a back side groove; and a lid case fittable to an outer surface of the lid fitting ridge of the case main body. A spool housing case for a semiconductor bonding wire, wherein the lid fitting ridge provided on the case body is a wide lid fitting ridge having a wide back side groove having a space large enough to accommodate a thumb. . 2. A spool storage case for a semiconductor bonding wire, comprising: a case body provided with a lid fitting ridge having a back-side groove; and a lid case fittable on an outer surface of the lid fitting ridge of the case body. The back side groove of the lid fitting ridge provided in the case main body has a wide back side groove having a space at least large enough to allow a thumb to be partially inserted into a part of the lid fitting ridge having a normal narrow back side groove. A spool storage case for a semiconductor bonding wire, wherein at least two wide lid fitting ridges are provided. 3. An opening for removing an end stop tape of a bonding wire wound on a spool is provided in a part of a lid fitting ridge of the case body. Spool storage case for semiconductor bonding wire. 4. The spool housing case for semiconductor bonding wires according to claim 1, wherein the case body and the lid case are made of a transparent material thin plate.