JP2002129262A - Extra-fine copper alloy wire and its production method - Google Patents
Extra-fine copper alloy wire and its production methodInfo
- Publication number
- JP2002129262A JP2002129262A JP2000329807A JP2000329807A JP2002129262A JP 2002129262 A JP2002129262 A JP 2002129262A JP 2000329807 A JP2000329807 A JP 2000329807A JP 2000329807 A JP2000329807 A JP 2000329807A JP 2002129262 A JP2002129262 A JP 2002129262A
- Authority
- JP
- Japan
- Prior art keywords
- wire
- copper alloy
- ultrafine
- alloy wire
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/4501—Shape
- H01L2224/45012—Cross-sectional shape
- H01L2224/45015—Cross-sectional shape being circular
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45147—Copper (Cu) as principal constituent
Landscapes
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、極細銅合金線及び
その製造方法に係り、特に、電子機器の電線・ケーブル
導体に用いられる極細銅合金線及びその製造方法に関す
るものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an ultrafine copper alloy wire and a method for manufacturing the same, and more particularly, to an ultrafine copper alloy wire used for electric wires and cable conductors of electronic equipment and a method for manufacturing the same.
【０００２】[0002]
【従来の技術】近年、電子機器、例えば、ノートパソコ
ン、携帯電話、デジタルビデオカメラなどの携帯型の情
報・通信・記録端末においては、より一層の小型化、薄
型化、及び軽量化が進められており、それらの電子機器
に用いられる電線（ケーブル）において極細化の要求が
高まっている。また、これらのケーブルは、狭隘なスペ
ースに配線され、過酷な曲げや捻り回しを受けることか
ら、耐屈曲性の要求も高まっている。2. Description of the Related Art In recent years, electronic devices, for example, portable information / communication / recording terminals such as notebook personal computers, mobile phones, and digital video cameras, have been further reduced in size, thickness, and weight. As a result, there is an increasing demand for finer wires (cables) used in such electronic devices. Further, since these cables are wired in a narrow space and are subjected to severe bending and twisting, demands for bending resistance are also increasing.
【０００３】極細のケーブル導体としては、一般的に、
線径が０．０２〜０．１ｍｍ程度の素線（極細線）を数
本から数十本撚り合わせたもの、又は、この素線を可撓
性を有した線状或いは帯状の絶縁体に巻き付けたもの等
が挙げられる。[0003] As a very fine cable conductor, generally,
Twisted or tens of strands (extremely thin wires) having a wire diameter of about 0.02 to 0.1 mm, or this strand is formed into a flexible linear or band-shaped insulator Wound material and the like can be mentioned.
【０００４】また、耐屈曲性の良好なケーブル導体とし
ては、従来から、硬質の銅合金線（以下、硬銅線と示
す）が使用されてきた。この硬銅線は、引張強さが約６
８６ＭＰａ（７０kgf/mm2 ）前後と非常に高く、曲げ歪
みが小さい場合（例えば、曲げ歪みが１％以下）には非
常に有用である。しかし、硬銅線は、伸びが小さいこと
から、曲げ歪みが大きい場合（例えば、曲げ歪みが１％
超）には十分な屈曲寿命が得られないという問題があっ
た。また、硬銅線は、端末加工時に素線が“ばらける”
といった不具合があった。[0004] Hard copper alloy wires (hereinafter referred to as hard copper wires) have been used as cable conductors having good bending resistance. This hard copper wire has a tensile strength of about 6
It is very high, around 86 MPa (70 kgf / mm 2 ), and is very useful when the bending strain is small (for example, the bending strain is 1% or less). However, since hard copper wire has a small elongation, it has a large bending strain (for example, a bending strain of 1%
Super) had a problem that a sufficient flex life could not be obtained. In addition, the hard copper wire is "split" when the terminal is processed.
There was such a problem.
【０００５】そこで、曲げ歪みが大きい場合には、硬銅
線の代わりに、伸びが良好（２０％前後）で、曲げ歪み
（塑性歪み）の吸収能が高く、耐屈曲性が良好な軟質の
銅合金線（以下、軟銅線と示す）を用いることが検討さ
れてきた。しかし、軟銅線からなる導体に絶縁体を押出
被覆してケーブルを形成する際に、強度不足により導体
に断線が生じるという問題があった。Therefore, when the bending strain is large, instead of the hard copper wire, a soft material having good elongation (around 20%), high absorption capacity for bending strain (plastic strain) and good bending resistance is used. The use of a copper alloy wire (hereinafter referred to as a soft copper wire) has been studied. However, when a conductor made of a soft copper wire is extrusion-coated with an insulator to form a cable, there is a problem that the conductor is disconnected due to insufficient strength.
【０００６】よって、広い歪み範囲（小さな歪みから大
きな歪み）に亘って、ケーブル導体の耐屈曲性の信頼性
を高めるには、引張強さ及び伸びに優れたケーブル導体
が必要であり、硬銅線と軟銅線の特性を併せ持つ半硬質
材からなる極細銅合金線が求められている。Accordingly, in order to increase the reliability of the flex resistance of a cable conductor over a wide strain range (from a small strain to a large strain), a cable conductor having excellent tensile strength and elongation is required. An ultrafine copper alloy wire made of a semi-hard material having both the characteristics of a wire and an annealed copper wire is required.
【０００７】しかし、引張強さが硬銅線と同程度で、か
つ、伸びが軟銅線と同程度の極細銅合金線は、現状では
見出されていない。このため、引張強さの減少を最低限
に抑え、かつ、伸びを高めた極細銅合金線が、電子機器
用のケーブル導体として、ニーズが高まっている。この
極細銅合金線として、半硬質のＣｕ−Ｓｎ系合金線が挙
げられる（実願昭６３−６１７０３号参照）。However, an ultrafine copper alloy wire having a tensile strength comparable to that of a hard copper wire and an elongation comparable to that of a soft copper wire has not been found at present. For this reason, there is an increasing need for ultrafine copper alloy wires with a minimum decrease in tensile strength and enhanced elongation as cable conductors for electronic devices. An example of the ultrafine copper alloy wire is a semi-hard Cu-Sn-based alloy wire (see Japanese Utility Model Application No. 63-61703).
【０００８】[0008]
【発明が解決しようとする課題】しかしながら、電子機
器用のケーブル導体としては、引張強さが高く、かつ、
耐屈曲性が良好である他に、純銅に近い高導電率を有し
ていることが望まれる。ここで、Ｃｕ−Ｓｎ系合金線の
合金構成元素であるＳｎは、純銅の電気比抵抗の増加に
寄与する度合いが２．８８（10-8Ω・ｍ／原子％）と比
較的大きいため、Ｃｕ−Ｓｎ系合金においては、Ｓｎの
含有量が少量であっても、Ｓｎの含有により導電率が大
幅に低下してしまう（Ｃｕ−0.30質量％Ｓｎの導電率は
８０％ＩＡＣＳ前後）という問題があった。However, a cable conductor for electronic equipment has a high tensile strength and
In addition to having good bending resistance, it is desired to have a high electrical conductivity close to that of pure copper. Here, Sn, which is an alloy constituent element of the Cu—Sn-based alloy wire, contributes to an increase in the electrical resistivity of pure copper to a relatively large degree of 2.88 (10 −8 Ω · m / at.%). In a Cu-Sn based alloy, even if the Sn content is small, the conductivity is significantly reduced by the Sn content (the conductivity of Cu-0.30 mass% Sn is around 80% IACS). was there.
【０００９】以上の事情を考慮して創案された本発明の
目的は、引張強さが高く、耐屈曲性が良好で、かつ、導
電率の高い極細銅合金線及びその製造方法を提供するこ
とにある。An object of the present invention, which has been made in view of the above circumstances, is to provide an ultrafine copper alloy wire having high tensile strength, good bending resistance, and high electrical conductivity, and a method of manufacturing the same. It is in.
【００１０】[0010]
【課題を解決するための手段】上記目的を達成すべく本
発明に係る極細銅合金線は、線径が０．０１〜０．１ｍ
ｍの極細銅合金線において、Ｍｇ又はＩｎを０．０５〜
０．９質量％含有し、銅及び不可避不純物を残部とする
銅合金からなり、かつ、最終線径形成後の熱処理によ
り、引張強さを３４３ＭＰａ（３５kgf/mm2 ）以上、伸
びを５％以上、導電率を８０％ＩＡＣＳ以上としたもの
である。In order to achieve the above object, the ultrafine copper alloy wire according to the present invention has a wire diameter of 0.01 to 0.1 m.
m or ultrafine copper alloy wire, Mg or In
0.9% by mass, made of a copper alloy containing copper and unavoidable impurities as the balance, and having a tensile strength of 343 MPa (35 kgf / mm 2 ) or more and an elongation of 5% or more by heat treatment after forming the final wire diameter. , With a conductivity of 80% IACS or more.
【００１１】以上の構成によれば、銅合金の合金構成元
素としてＭｇ又はＩｎを用いることで、従来の極細銅合
金線であるＣｕ−Ｓｎ系合金線と同等又はそれ以上の特
性を有する銅合金線を得ることができる。[0011] According to the above structure, by using Mg or In as an alloy constituent element of the copper alloy, a copper alloy having characteristics equal to or better than that of a conventional ultrafine copper alloy wire, a Cu-Sn alloy wire. You can get a line.
【００１２】一方、本発明に係る極細銅合金線の製造方
法は、線径が０．０１〜０．１ｍｍの極細銅合金線の製
造方法において、Ｍｇ又はＩｎを０．０５〜０．９質量
％含有し、銅及び不可避不純物を残部とする銅合金に伸
線加工を施して極細線を形成し、最終線径形成後の極細
線に連続的に熱処理を施して、引張強さを３４３ＭＰａ
（３５kgf/mm2 ）以上、伸びを５％以上、導電率を８０
％ＩＡＣＳ以上に調質するものである。On the other hand, the method for producing an ultrafine copper alloy wire according to the present invention is a method for producing an ultrafine copper alloy wire having a wire diameter of 0.01 to 0.1 mm. %, Copper and a copper alloy having the unavoidable impurities as the balance are subjected to wire drawing to form an ultrafine wire, and the ultrafine wire after the final wire diameter is formed is continuously subjected to heat treatment to have a tensile strength of 343 MPa.
(35 kgf / mm 2 ) or more, elongation 5% or more, conductivity 80
It is tempered to at least% IACS.
【００１３】以上の方法によれば、Ｍｇ又はＩｎを０．
０５〜０．９質量％含有し、銅及び不可避不純物を残部
とする銅合金を用いて形成した線材を最終線径に形成し
た後、この線材に連続的に熱処理を施すことで、線材の
特性を、従来の極細銅合金線であるＣｕ−Ｓｎ系合金線
と同等又はそれ以上に調質することができる。According to the above-described method, Mg or In is added to 0.1%.
After forming a wire having a final diameter of 0.5 to 0.9% by mass and using a copper alloy containing copper and unavoidable impurities as a balance, the wire is continuously subjected to a heat treatment to obtain a characteristic of the wire. Can be refined to a level equal to or higher than that of a Cu-Sn-based alloy wire, which is a conventional ultrafine copper alloy wire.
【００１４】また、上記極細線に、管状炉による焼鈍、
通電加熱装置による通電抵抗加熱、又は誘導コイル等に
よる誘導加熱により、連続的に熱処理を施すことが好ま
しい。[0014] The ultrafine wire may be annealed in a tubular furnace,
It is preferable to continuously perform the heat treatment by means of electric resistance heating by an electric heating device or induction heating by an induction coil or the like.
【００１５】上記のように数値範囲を限定した理由を以
下に述べる。The reason for limiting the numerical range as described above will be described below.
【００１６】銅合金をＣｕ−Ｍｇ系又はＣｕ−Ｉｎ系と
した理由は、前述したＣｕ−Ｓｎ系の銅合金と比較し
て、導電性が優れるためである。具体的には、Ｍｇ又は
Ｉｎを含有させたことによる導電性の低下は、Ｓｎを含
有させた場合の１／３に抑えることができる。The reason why the copper alloy is made of Cu-Mg type or Cu-In type is that the conductivity is superior to that of the above-mentioned Cu-Sn type copper alloy. Specifically, the decrease in conductivity due to the inclusion of Mg or In can be suppressed to 1/3 of that in the case of including Sn.
【００１７】ここで、Ｍｇ又はＩｎの含有量を０．０５
〜０．９ｍａｓｓ％としたのは、含有量が０．０５ｍａ
ｓｓ％未満だと、所望の強度を得ることができないと共
に、良好な耐屈曲性が得られず、また、含有量が０．９
ｍａｓｓ％を越えると、導電率が８０％ＩＡＣＳ未満に
低下してしまうためである。Here, the content of Mg or In is set to 0.05
The reason why the content is set to 0.9 mass% is that the content is 0.05 ma.
If it is less than ss%, the desired strength cannot be obtained, good bending resistance cannot be obtained, and the content is 0.9% or less.
If it exceeds mass%, the conductivity will be reduced to less than 80% IACS.
【００１８】引張強さを３４３ＭＰａ（３５kgf/mm2 ）
以上とした理由は、配線作業時（又は供用時）における
断線を防ぐと共に、良好な耐屈曲性を得るためである。The tensile strength is 343 MPa (35 kgf / mm 2 )
The reason for this is to prevent disconnection during wiring work (or during operation) and to obtain good bending resistance.
【００１９】伸びを５％以上とした理由は、撚線の端末
加工時における“ばらけ”を防ぐと共に、伸びが１〜３
％程度の硬銅線と比較して、大きな歪みの屈曲を受ける
際の耐屈曲性を良好とするためである。The reason why the elongation is set to 5% or more is that "split" at the time of processing the end of the stranded wire is prevented, and the elongation is 1 to 3%.
% As compared with a hard copper wire of about%.
【００２０】導電率を８０％ＩＡＣＳ以上とした理由
は、信号線として使用するだけではなく、電源線として
も使用可能とするためである。The reason why the conductivity is set to 80% IACS or more is that it can be used not only as a signal line but also as a power supply line.
【００２１】[0021]
【発明の実施の形態】以下、本発明の好適一実施の形態
を説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a preferred embodiment of the present invention will be described.
【００２２】本発明に係る極細銅合金線は、線径が０．
０１〜０．１ｍｍの極細線であって、Ｍｇ（又はＩｎ）
を０．０５〜０．９質量％、好ましくは０．０５〜０．
８質量％含有し、銅及び不可避不純物を残部とする銅合
金からなり、かつ、最終線径形成後の熱処理により、引
張強さを３４３ＭＰａ（３５kgf/mm2 ）以上、伸びを５
％以上、導電率を８０％ＩＡＣＳ以上、好ましくは８５
％ＩＡＣＳ以上としたものである。The ultrafine copper alloy wire according to the present invention has a wire diameter of 0.1 mm.
An ultrafine wire of 01 to 0.1 mm, which is made of Mg (or In)
From 0.05 to 0.9% by mass, preferably from 0.05 to 0.9% by mass.
It is composed of a copper alloy containing 8% by mass, copper and unavoidable impurities, and has a tensile strength of 343 MPa (35 kgf / mm 2 ) or more and an elongation of 5 by heat treatment after forming a final wire diameter.
%, Conductivity of 80% IACS or more, preferably 85% or more.
% IACS or more.
【００２３】次に、本発明に係る極細銅合金線の製造方
法を説明する。Next, a method for manufacturing an ultrafine copper alloy wire according to the present invention will be described.
【００２４】先ず、無酸素銅の溶湯にＭｇ（又はＩｎ）
を添加して銅合金溶湯を形成すると共に、連続鋳造によ
り、Ｍｇ（又はＩｎ）０．０５〜０．９質量％、好まし
くは０．０５〜０．８質量％含有し、銅及び不可避不純
物を残部とする銅合金荒引線を形成する。この荒引線に
伸線加工（冷間加工）を施して、最終的に、線径が０．
０１〜０．１ｍｍの極細線を形成する。First, Mg (or In) is added to the molten oxygen-free copper.
To form a molten copper alloy and, by continuous casting, contain 0.05 to 0.9% by mass, preferably 0.05 to 0.8% by mass of Mg (or In) to contain copper and unavoidable impurities. A copper alloy rough drawn wire to be the remainder is formed. This rough drawing is subjected to wire drawing (cold working), and finally the wire diameter is reduced to 0.
An ultrafine line of 01 to 0.1 mm is formed.
【００２５】その後、この極細線に、管状炉による焼
鈍、通電加熱装置による通電抵抗加熱、又は誘導コイル
等による誘導加熱により連続的に熱処理を施して、引張
強さを３４３ＭＰａ（３５kgf/mm2 ）以上、伸びを５％
以上、導電率を８０％ＩＡＣＳ以上、好ましくは８５％
ＩＡＣＳ以上に調質し、極細銅合金線を得る。Thereafter, the ultrafine wire is continuously subjected to heat treatment by annealing in a tubular furnace, resistance heating by a current heating device, or induction heating by an induction coil or the like, so that the tensile strength is 343 MPa (35 kgf / mm 2 ). Above, the growth is 5%
As described above, the conductivity is 80% IACS or more, preferably 85%
Temper to IACS or higher to obtain extra fine copper alloy wire.
【００２６】このようにして得られた極細銅合金線の単
線又は極細銅合金線を複数本撚り合わせてなる撚線が、
ケーブル導体として用いられる。また、この極細銅合金
線の外周に、必要に応じてＡｇメッキ、Ｓｎメッキ、Ｎ
ｉメッキ等の各種メッキを施し、メッキ被覆された極細
銅合金線をケーブル導体として用いてもよい。A stranded wire obtained by twisting a plurality of single wires or ultrafine copper alloy wires of the thus obtained ultrafine copper alloy wire is as follows:
Used as a cable conductor. Further, if necessary, Ag plating, Sn plating, N
Various types of plating such as i-plating may be performed, and a plated ultrafine copper alloy wire may be used as a cable conductor.
【００２７】次に、本発明の作用を説明する。Next, the operation of the present invention will be described.
【００２８】伸線加工まま（熱処理なし）の線材は、引
張強さが７３５ＭＰａ（７５kgf/mm2 ）以上と硬銅線並
みの強度を有しているものの、合金構成元素の含有量に
よっては伸びが１％未満及び／又は導電率が８０％ＩＡ
ＣＳ未満となるため、その特性を調質すべく、線材に対
して熱処理（焼鈍処理）を行なう必要がある。The as-drawn wire material (without heat treatment) has a tensile strength of 735 MPa (75 kgf / mm 2 ) or more, which is comparable to that of hard copper wire, but it has an elongation depending on the content of alloying elements. Less than 1% and / or conductivity 80% IA
Since it is less than CS, it is necessary to perform a heat treatment (annealing treatment) on the wire in order to refine its characteristics.
【００２９】この際、線径が０．１ｍｍ以下の線材をボ
ビンに巻き付け、焼鈍炉内でバッチ式に熱処理を行なう
と、線材同士が粘着してしまうことから、次工程で巻き
替える際、断線したり、線材の表面に傷が付いてしま
う。線材表面に傷が付くと、屈曲寿命、即ち耐屈曲性に
悪影響を及ぼすことから、本発明に係る極細銅合金線材
の製造方法においては、伸線加工後の線材に連続的に熱
処理を施している。これによって、熱処理後の線材の表
面に傷が付くおそれがなくなり、延いては線材の耐屈曲
性が更に良好となる。At this time, if a wire having a wire diameter of 0.1 mm or less is wound around a bobbin and heat-treated in a batch manner in an annealing furnace, the wires will stick to each other. Or the surface of the wire is scratched. If the surface of the wire is scratched, the bending life, that is, the bending resistance is adversely affected, and therefore, in the method for manufacturing the ultrafine copper alloy wire according to the present invention, the wire after the drawing process is continuously subjected to heat treatment. I have. Thereby, there is no possibility that the surface of the wire after the heat treatment is scratched, and the bending resistance of the wire further improves.
【００３０】また、本発明に係る極細銅合金線材の製造
方法においては、連続的な熱処理における各種の熱処理
条件（例えば、ライン速度、炉内温度、通電加熱装置の
電圧値、及び誘導コイル等の誘導電流値）を適宜調整す
ることにより、極細銅合金線の各特性の調質を行なうこ
とができる。Further, in the method for producing a microfine copper alloy wire according to the present invention, various heat treatment conditions in continuous heat treatment (for example, line speed, furnace temperature, voltage value of current heating device, induction coil, etc. By appropriately adjusting the value of the induced current, it is possible to refine the properties of the ultrafine copper alloy wire.
【００３１】さらに、前述した従来のＣｕ−Ｓｎ系合金
線の合金構成元素であるＳｎは、純銅の電気比抵抗の増
加に寄与する度合いが２．８８（10-8Ω・ｍ／原子％）
と比較的大きかった。これに対して、本発明に係る極細
銅合金線は、合金構成元素としてＭｇ又はＩｎを含有さ
せており、Ｍｇ又はＩｎは、純銅の電気比抵抗の増加に
寄与する度合いが、それぞれ０．６５、１．０６（10-8
Ω・ｍ／原子％）と非常に小さい。この結果、Ｃｕ−Ｍ
ｇ系又はＣｕ−Ｉｎ系合金線におけるＭｇ又はＩｎによ
る導電率の低下は、Ｃｕ−Ｓｎ系合金線におけるＳｎの
場合の約１／３となるため、導電性に優れた銅合金線を
得ることができる。Further, Sn, which is an alloy constituent element of the above-mentioned conventional Cu-Sn alloy wire, contributes to an increase in the electrical resistivity of pure copper at 2.88 (10 -8 Ω · m / at.%).
Was relatively large. In contrast, the ultrafine copper alloy wire according to the present invention contains Mg or In as an alloy constituent element, and the degree of Mg or In contributing to an increase in the electrical resistivity of pure copper is 0.65 or more, respectively. , 1.06 (10 -8
Ω · m / atomic%). As a result, Cu-M
Since the decrease in conductivity due to Mg or In in a g-based or Cu-In-based alloy wire is about 1/3 of that in the case of Sn in a Cu-Sn-based alloy wire, a copper alloy wire excellent in conductivity is obtained. Can be.
【００３２】また、本発明に係る極細銅合金線は、主に
信号線として使用されるが、合金構成元素（Ｍｇ又はＩ
ｎ）の含有量又は熱処理条件によっては、純銅と同程度
の導電率を有することから、電源線としても利用可能と
なる。Although the ultrafine copper alloy wire according to the present invention is mainly used as a signal line, the alloy constituent element (Mg or I) is used.
Depending on the content of n) or the heat treatment conditions, it can be used as a power supply line because it has the same conductivity as pure copper.
【００３３】[0033]
【実施例】（実施例１〜５）小型連続鋳造機を用い、純
度９９．９９９９％の無酸素銅の溶湯にＭｇを添加して
銅合金溶湯を形成すると共に、Ｍｇを０．０７〜０．９
質量％の範囲で含有し、銅及び不可避不純物を残部とす
るφ８ｍｍの銅合金荒引線を５種類形成する。各銅合金
荒引線の化学組成は、それぞれ、Cu-0.07mass%Mg、Cu-
0.15mass%Mg、Cu-0.30mass%Mg、Cu-0.70mass%Mg、Cu-0.
90mass%Mgである。EXAMPLES (Examples 1 to 5) Using a small-sized continuous casting machine, Mg was added to a 99.9999% pure oxygen-free copper melt to form a copper alloy melt, and Mg was added to 0.07-0. .9
Five kinds of copper alloy rough drawn wires of φ8 mm, which are contained in the range of mass% and the balance is copper and unavoidable impurities, are formed. The chemical composition of each copper alloy rough wire is Cu-0.07mass% Mg, Cu-
0.15mass% Mg, Cu-0.30mass% Mg, Cu-0.70mass% Mg, Cu-0.
It is 90 mass% Mg.
【００３４】次に、これらの各荒引線に冷間伸線加工を
施して、φ０．０８ｍｍの極細線を形成する。Next, each of these rough drawn wires is subjected to cold drawing to form an extra fine wire of φ0.08 mm.
【００３５】その後、これらの各極細線を、ライン速度
が５００ｍ／ｍｉｎ、電圧が３４Ｖに調整された通電加
熱装置に通し、通電抵抗加熱により連続的に熱処理を施
し、５種類の極細銅合金線を得る。Thereafter, each of these ultrafine wires was passed through an electric heating device adjusted to a line speed of 500 m / min and a voltage of 34 V, and was continuously subjected to heat treatment by electric resistance heating to obtain five types of ultrafine copper alloy wires. Get.
【００３６】（実施例６〜１０）小型連続鋳造機を用
い、純度９９．９９９９％の無酸素銅の溶湯にＩｎを添
加して銅合金溶湯を形成すると共に、Ｉｎを０．０７〜
０．９質量％の範囲で含有し、銅及び不可避不純物を残
部とするφ８ｍｍの銅合金荒引線を５種類形成する。各
銅合金荒引線の化学組成は、それぞれ、Cu-0.07mass%I
n、Cu-0.15mass%In、Cu-0.30mass%In、Cu-0.70mass%I
n、Cu-0.90mass%Inである。(Examples 6 to 10) Using a small-sized continuous caster, In was added to a molten metal of oxygen-free copper having a purity of 99.9999% to form a molten copper alloy, and 0.07 to 10% of In was added.
Five types of copper alloy rough drawn wires of φ8 mm containing 0.9% by mass and remaining copper and unavoidable impurities are formed. The chemical composition of each copper alloy rough wire is Cu-0.07mass% I
n, Cu-0.15mass% In, Cu-0.30mass% In, Cu-0.70mass% I
n, Cu-0.90mass% In.
【００３７】次に、これらの各荒引線に冷間伸線加工を
施して、φ０．０８ｍｍの極細線を形成する。Next, each of these rough drawn wires is subjected to cold drawing to form an extra fine wire of φ0.08 mm.
【００３８】その後、これらの各極細線を、ライン速度
が５００ｍ／ｍｉｎ、電圧が３４Ｖに調整された通電加
熱装置に通し、通電抵抗加熱により連続的に熱処理を施
し、５種類の極細銅合金線を得る。Thereafter, each of these ultrafine wires was passed through an electric heating device adjusted to a line speed of 500 m / min and a voltage of 34 V, and continuously subjected to heat treatment by electric current resistance heating to obtain five types of ultrafine copper alloy wires. Get.
【００３９】（比較例１）化学組成が、Cu-0.01mass%Mg
の銅合金荒引線を用いる以外は、実施例１〜５と同様に
して極細銅合金線を得る。(Comparative Example 1) The chemical composition is Cu-0.01 mass% Mg
An ultrafine copper alloy wire is obtained in the same manner as in Examples 1 to 5, except that the copper alloy rough drawn wire is used.
【００４０】（比較例２）化学組成が、Cu-1.20mass%Mg
の銅合金荒引線を用いる以外は、実施例１〜５と同様に
して極細銅合金線を得る。Comparative Example 2 The chemical composition was Cu-1.20 mass% Mg
An ultrafine copper alloy wire is obtained in the same manner as in Examples 1 to 5, except that the copper alloy rough drawn wire is used.
【００４１】（比較例３）実施例３と同じ化学組成の銅
合金荒引線（Cu-0.01mass%Mg）に、冷間伸線加工を施し
て、φ０．０８ｍｍの極細線を形成する。この極細線に
対しては熱処理を施さなかった。(Comparative Example 3) A copper alloy rough drawn wire (Cu-0.01 mass% Mg) having the same chemical composition as in Example 3 is subjected to cold drawing to form an extra fine wire of φ0.08 mm. No heat treatment was applied to this ultrafine wire.
【００４２】（比較例４）化学組成が、Cu-0.01mass%In
の銅合金荒引線を用いる以外は、実施例６〜１０と同様
にして極細銅合金線を得る。(Comparative Example 4) The chemical composition was Cu-0.01mass% In.
An ultrafine copper alloy wire is obtained in the same manner as in Examples 6 to 10 except that the copper alloy rough drawn wire is used.
【００４３】（比較例５）化学組成が、Cu-1.20mass%In
の銅合金荒引線を用いる以外は、実施例６〜１０と同様
にして極細銅合金線を得る。(Comparative Example 5) The chemical composition was Cu-1.20mass% In.
An ultrafine copper alloy wire is obtained in the same manner as in Examples 6 to 10 except that the copper alloy rough drawn wire is used.
【００４４】（比較例６）実施例８と同じ化学組成の銅
合金荒引線（Cu-0.01mass%In）に、冷間伸線加工を施し
て、φ０．０８ｍｍの極細線を形成する。この極細線に
対しては熱処理を施さなかった。Comparative Example 6 A copper alloy rough drawn wire (Cu-0.01 mass% In) having the same chemical composition as in Example 8 is subjected to cold drawing to form a fine wire of φ0.08 mm. No heat treatment was applied to this ultrafine wire.
【００４５】（比較例７）小型連続鋳造機を用い、純度
９９．９９９９％の無酸素銅の溶湯にＳｎを添加して銅
合金溶湯を形成すると共に、Ｓｎを０．３０質量％の範
囲で含有し、銅及び不可避不純物を残部とするφ８ｍｍ
の銅合金荒引線を形成する。Comparative Example 7 A small continuous caster was used to form a copper alloy melt by adding Sn to an oxygen-free copper melt having a purity of 99.9999%, and Sn was added in a range of 0.30% by mass. 8mm with copper and inevitable impurities remaining
To form a copper alloy rough wire.
【００４６】次に、この荒引線に冷間伸線加工を施し
て、φ０．０８ｍｍの極細線を形成する。Next, the rough drawn wire is subjected to cold drawing to form a fine wire having a diameter of 0.08 mm.
【００４７】その後、この極細線を、ライン速度が５０
０ｍ／ｍｉｎ、電圧が３４Ｖに調整された通電加熱装置
に通し、通電抵抗加熱により連続的に熱処理を施し、極
細銅合金線を得る。Thereafter, this ultra-fine line is drawn at a line speed of 50
It is passed through an electric heating device whose voltage is adjusted to 34 V at 0 m / min and continuously heat-treated by electric resistance heating to obtain an ultrafine copper alloy wire.
【００４８】実施例１〜１０及び比較例１〜７の各極細
銅合金線の、化学組成及び各種特性（引張強さ（ＭＰ
ａ）、伸び（％）、導電率（％ＩＡＣＳ）、及び耐屈曲
性）を表１に示す。The chemical composition and various characteristics (tensile strength (MP) of each of the ultrafine copper alloy wires of Examples 1 to 10 and Comparative Examples 1 to 7
a), elongation (%), conductivity (% IACS), and flex resistance) are shown in Table 1.
【００４９】ここで、耐屈曲性は、屈曲試験における屈
曲寿命により評価を行なった。尚、屈曲試験は、極細銅
合金線を半径１ｍｍの曲げ治具で挾持すると共に、３０
ｇの重りを吊り下げて、９０°の屈曲を左右に繰り返し
行い、破断するまでの曲げ回数を測定した。耐屈曲性
は、屈曲寿命が５０回以上と良好なものを○、３０〜５
０回とやや難があるものを△、３０回未満と難があるも
のを×とした。Here, the bending resistance was evaluated based on the bending life in a bending test. In the bending test, the ultrafine copper alloy wire was clamped by a bending jig having a radius of 1 mm,
g was suspended and 90 ° bending was repeated right and left, and the number of bendings before breaking was measured. The flexing resistance was evaluated as "good" when the flex life was 50 times or more.
A sample having a difficulty of 0 times was rated as “△”, and a sample having a difficulty of less than 30 times was rated “x”.
【００５０】[0050]
【表１】 [Table 1]
【００５１】表１に示すように、従来のＣｕ−Ｓｎ系合
金線である比較例７の極細銅合金線は、引張強さが３７
４ＭＰａ（３８．１kgf/mm2 ）、伸びが８．７％、導電
率は８０．１％ＩＡＣＳであった。また、耐屈曲性は良
好であった。一方、実施例１〜１０の各極細銅合金線
は、引張強さが３４８〜４０２ＭＰａ（３５．５〜４
１．０kgf/mm2 ）、伸びが５．５〜８．６％、導電率が
８０．１〜９８．０％ＩＡＣＳであった。また、いずれ
も耐屈曲性は良好であった。As shown in Table 1, the ultrafine copper alloy wire of Comparative Example 7, which is a conventional Cu-Sn alloy wire, has a tensile strength of 37.
4 MPa (38.1 kgf / mm 2 ), elongation was 8.7%, and conductivity was 80.1% IACS. Further, the bending resistance was good. On the other hand, each of the ultrafine copper alloy wires of Examples 1 to 10 has a tensile strength of 348 to 402 MPa (35.5 to 4 MPa).
1.0 kgf / mm 2 ), elongation was 5.5 to 8.6%, and conductivity was 80.1 to 98.0% IACS. Moreover, the bending resistance was good in each case.
【００５２】このことから、実施例１〜１０の各極細銅
合金線は、従来のＣｕ−Ｓｎ系銅合金線と同等の特性を
有していることが確認できる。ここで、合金構成元素の
含有量が同じである実施例３，８及び比較例７を比較す
ると、実施例３，８の極細銅合金線の方が、比較例７の
極細銅合金線よりも導電率が高くなっている。よって、
実施例１〜１０の各極細銅合金線は、従来のＣｕ−Ｓｎ
系銅合金線と同等又はそれ以上の特性を有していること
が確認できる。From this, it can be confirmed that each of the ultrafine copper alloy wires of Examples 1 to 10 has the same characteristics as the conventional Cu-Sn based copper alloy wire. Here, comparing Examples 3 and 8 and Comparative Example 7 in which the contents of the alloy constituent elements are the same, the ultrafine copper alloy wires of Examples 3 and 8 are better than the ultrafine copper alloy wires of Comparative Example 7. The conductivity is high. Therefore,
Each of the ultrafine copper alloy wires of Examples 1 to 10 is a conventional Cu-Sn
It can be confirmed that it has the same or better characteristics as the system copper alloy wire.
【００５３】これに対して、比較例１，４の各極細銅合
金線は、伸びがそれぞれ１１．３％、導電率が９８．５
％ＩＡＣＳ、９８．８％ＩＡＣＳと、いずれも例中で最
高の値を示した。しかし、合金構成元素であるＭｇ，Ｉ
ｎの含有量がそれぞれ０．０１質量％であり、規定範囲
（０．０５〜０．９質量％）より少ないため、引張強さ
がそれぞれ２９５ＭＰａ（３０．１kgf/mm2 ）と低くな
っており、その結果、耐屈曲性にやや難があった。On the other hand, each of the ultrafine copper alloy wires of Comparative Examples 1 and 4 has an elongation of 11.3% and an electric conductivity of 98.5.
% IACS, 98.8% IACS, all showed the highest values in the examples. However, the alloy constituent elements Mg, I
Since the content of n is 0.01% by mass and less than the specified range (0.05 to 0.9% by mass), the tensile strength is as low as 295 MPa (30.1 kgf / mm 2 ). As a result, the bending resistance was somewhat difficult.
【００５４】また、比較例２，５の各極細銅合金線は、
引張強さはそれぞれ４０４ＭＰａ（４１．２kgf/m
m2 ）、伸びはそれぞれ５．５％と良好であると共に、
耐屈曲性も良好であった。しかし、合金構成元素である
Ｍｇ，Ｉｎの含有量がそれぞれ１．２０質量％であり、
規定範囲（０．０５〜０．９質量％）より多いため、導
電率がそれぞれ７５．８％ＩＡＣＳと低くなっている。The ultrafine copper alloy wires of Comparative Examples 2 and 5
Tensile strength was 404 MPa (41.2 kgf / m
m 2 ), elongation is as good as 5.5% each,
The bending resistance was also good. However, the contents of the alloy constituent elements Mg and In are 1.20% by mass, respectively.
Since it is larger than the specified range (0.05 to 0.9% by mass), the conductivity is as low as 75.8% IACS.
【００５５】さらに、比較例３，６の各極細銅合金線
は、引張強さは８０７ＭＰａ（８２．３kgf/mm2 ）、７
８７ＭＰａ（８０．３kgf/mm2 ）と、例中で最高の値を
示し、また、導電率は８７．８％ＩＡＣＳ、８８．２％
ＩＡＣＳと良好であった。しかし、伸線後の熱処理を施
していないため、伸びがそれぞれ２．１％、２．３％と
低くなっており、その結果、耐屈曲性に難があった。Further, each of the ultrafine copper alloy wires of Comparative Examples 3 and 6 has a tensile strength of 807 MPa (82.3 kgf / mm 2 ),
87 MPa (80.3 kgf / mm 2 ), the highest value in the examples, and the conductivity was 87.8% IACS, 88.2%
Good with IACS. However, since the heat treatment after the drawing was not performed, the elongation was as low as 2.1% and 2.3%, respectively. As a result, there was a difficulty in bending resistance.
【００５６】以上、本発明の実施の形態は、上述した実
施の形態に限定されるものではなく、他にも種々のもの
が想定されることは言うまでもない。As described above, the embodiments of the present invention are not limited to the above-described embodiments, and it is needless to say that various other embodiments are also conceivable.
【００５７】[0057]
【発明の効果】以上要するに本発明によれば、Ｃｕ−Ｍ
ｇ系又はＣｕ−Ｉｎ系合金を用いて形成した線材を最終
線径に形成した後、この線材に連続的に熱処理を施すこ
とで、線材の特性を、従来の極細銅合金線であるＣｕ−
Ｓｎ系合金線と同等又はそれ以上に調質することができ
るという優れた効果を発揮する。In summary, according to the present invention, Cu-M
After forming a wire formed using a g-based or Cu-In-based alloy to a final wire diameter, by continuously performing a heat treatment on the wire, the characteristics of the wire can be reduced to Cu-, a conventional ultrafine copper alloy wire.
An excellent effect of being able to be refined to the same level as or more than the Sn-based alloy wire is exhibited.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） Ｈ０１Ｂ 13/00 ５０１ Ｈ０１Ｂ 13/00 ５０１Ｄ ５０１Ｂ // Ｃ２２Ｆ 1/00 ６２５ Ｃ２２Ｆ 1/00 ６２５ ６３０ ６３０Ａ ６３０Ｋ ６６１ ６６１Ａ ６８５ ６８５Ｚ ６８６ ６８６Ａ (72)発明者 青山 正義 茨城県日立市日高町５丁目１番１号 日立 電線株式会社総合技術研究所内 (72)発明者 瀬谷 修 茨城県日立市日高町５丁目１番１号 日立 電線株式会社日高工場内 Ｆターム(参考） 5G301 AA08 AA11 AA12 AB02 AB05 AD01 AE10 5G307 CA04 CB01 ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 7 Identification code FI Theme coat ゛ (Reference) H01B 13/00 501 H01B 13/00 501D 501B // C22F 1/00 625 C22F 1/00 625 630 630A 630K 661K 661 661A 685 685Z 686 686A (72) Inventor Masayoshi Aoyama 5-1-1 Hidaka-cho, Hitachi City, Ibaraki Prefecture Within Hitachi Cable Research Institute, Ltd. (72) Inventor Osamu Seya 5-1-1 Hidaka-cho, Hitachi City, Ibaraki Prefecture No. 1 F-term in the Hidaka Plant of Hitachi Cable, Ltd. (reference) 5G301 AA08 AA11 AA12 AB02 AB05 AD01 AE10 5G307 CA04 CB01
Claims (3)
金線において、Ｍｇ又はＩｎを０．０５〜０．９質量％
含有し、銅及び不可避不純物を残部とする銅合金からな
り、かつ、最終線径形成後の熱処理により、引張強さを
３４３ＭＰａ以上、伸びを５％以上、導電率を８０％Ｉ
ＡＣＳ以上としたことを特徴とする極細銅合金線。An ultrafine copper alloy wire having a wire diameter of 0.01 to 0.1 mm, wherein Mg or In is contained in an amount of 0.05 to 0.9% by mass.
And a copper alloy containing copper and unavoidable impurities as the balance, and having a tensile strength of 343 MPa or more, an elongation of 5% or more, and a conductivity of 80% I by heat treatment after forming the final wire diameter.
An ultrafine copper alloy wire, characterized in that it has an ACS or higher.
金線の製造方法において、Ｍｇ又はＩｎを０．０５〜
０．９質量％含有し、銅及び不可避不純物を残部とする
銅合金に伸線加工を施して極細線を形成し、最終線径形
成後の極細線に連続的に熱処理を施して、引張強さを３
４３ＭＰａ以上、伸びを５％以上、導電率を８０％ＩＡ
ＣＳ以上に調質することを特徴とする極細銅合金線の製
造方法。2. A method for producing an ultrafine copper alloy wire having a wire diameter of 0.01 to 0.1 mm, wherein Mg or In is contained in an amount of 0.05 to 0.1 mm.
0.9% by mass, copper and copper alloy with unavoidable impurities as the balance are subjected to wire drawing to form an ultrafine wire, and the ultrafine wire after the final wire diameter is formed is continuously subjected to heat treatment to obtain a tensile strength. 3
43 MPa or more, elongation of 5% or more, conductivity of 80% IA
A method for producing an ultrafine copper alloy wire, characterized by tempering to a level higher than CS.
加熱装置による通電抵抗加熱、又は誘導コイル等による
誘導加熱により、連続的に熱処理を施す請求項２記載の
極細銅合金線の製造方法。3. The method for producing an ultrafine copper alloy wire according to claim 2, wherein the ultrafine wire is continuously heat-treated by annealing in a tubular furnace, resistance heating by an electric heating device, or induction heating by an induction coil or the like. .
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| JP2000329807A JP4288844B2 (en) | 2000-10-24 | 2000-10-24 | Extra fine copper alloy wire |
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| JP2000329807A JP4288844B2 (en) | 2000-10-24 | 2000-10-24 | Extra fine copper alloy wire |
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| JP2002129262A true JP2002129262A (en) | 2002-05-09 |
| JP4288844B2 JP4288844B2 (en) | 2009-07-01 |
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