JP2002118152A - Bonding head and bonding apparatus provided therewith - Google Patents

Bonding head and bonding apparatus provided therewith

Info

Publication number
JP2002118152A
JP2002118152A JP2000308113A JP2000308113A JP2002118152A JP 2002118152 A JP2002118152 A JP 2002118152A JP 2000308113 A JP2000308113 A JP 2000308113A JP 2000308113 A JP2000308113 A JP 2000308113A JP 2002118152 A JP2002118152 A JP 2002118152A
Authority
JP
Japan
Prior art keywords
vibration
vibration transmitting
bonding head
temperature
vibrator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000308113A
Other languages
Japanese (ja)
Inventor
Norihiko Nakajima
憲彦 中島
Junichiro Soejima
潤一郎 副島
Yukinori Oishi
幸則 大石
Yoshiki Hashimoto
芳樹 橋本
Yoshinobu Suzuki
喜伸 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kaijo Corp
Original Assignee
Kaijo Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kaijo Corp filed Critical Kaijo Corp
Priority to JP2000308113A priority Critical patent/JP2002118152A/en
Publication of JP2002118152A publication Critical patent/JP2002118152A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/47—Joining single elements to sheets, plates or other substantially flat surfaces
    • B29C66/472—Joining single elements to sheets, plates or other substantially flat surfaces said single elements being substantially flat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/08—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using ultrasonic vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/18—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/18—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools
    • B29C65/24—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools characterised by the means for heating the tool
    • B29C65/245—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools characterised by the means for heating the tool the heat transfer being achieved contactless, e.g. by radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/72—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by combined operations or combined techniques, e.g. welding and stitching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112—Single lapped joints
    • B29C66/1122—Single lap to lap joints, i.e. overlap joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/81—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps
    • B29C66/818—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the cooling constructional aspects, or by the thermal or electrical insulating or conducting constructional aspects of the welding jaws or of the clamps ; comprising means for compensating for the thermal expansion of the welding jaws or of the clamps
    • B29C66/8181—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the cooling constructional aspects, or by the thermal or electrical insulating or conducting constructional aspects of the welding jaws or of the clamps ; comprising means for compensating for the thermal expansion of the welding jaws or of the clamps characterised by the cooling constructional aspects
    • B29C66/81811—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the cooling constructional aspects, or by the thermal or electrical insulating or conducting constructional aspects of the welding jaws or of the clamps ; comprising means for compensating for the thermal expansion of the welding jaws or of the clamps characterised by the cooling constructional aspects of the welding jaws
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
    • B29C66/832—Reciprocating joining or pressing tools
    • B29C66/8322—Joining or pressing tools reciprocating along one axis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
    • B29C66/912—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by measuring the temperature, the heat or the thermal flux
    • B29C66/9121—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by measuring the temperature, the heat or the thermal flux by measuring the temperature
    • B29C66/91211—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by measuring the temperature, the heat or the thermal flux by measuring the temperature with special temperature measurement means or methods
    • B29C66/91216—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by measuring the temperature, the heat or the thermal flux by measuring the temperature with special temperature measurement means or methods enabling contactless temperature measurements, e.g. using a pyrometer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
    • B29C66/912—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by measuring the temperature, the heat or the thermal flux
    • B29C66/9121—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by measuring the temperature, the heat or the thermal flux by measuring the temperature
    • B29C66/91231—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by measuring the temperature, the heat or the thermal flux by measuring the temperature of the joining tool
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
    • B29C66/914—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux
    • B29C66/9141—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the temperature
    • B29C66/91421—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the temperature of the joining tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
    • B29C66/914—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux
    • B29C66/9141—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the temperature
    • B29C66/91431—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the temperature the temperature being kept constant over time
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
    • B29C66/914—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux
    • B29C66/9161—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the heat or the thermal flux, i.e. the heat flux
    • B29C66/91641—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the heat or the thermal flux, i.e. the heat flux the heat or the thermal flux being non-constant over time
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/96—Measuring or controlling the joining process characterised by the method for implementing the controlling of the joining process
    • B29C66/961—Measuring or controlling the joining process characterised by the method for implementing the controlling of the joining process involving a feedback loop mechanism, e.g. comparison with a desired value
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/82—Pressure application arrangements, e.g. transmission or actuating mechanisms for joining tools or clamps
    • B29C66/824—Actuating mechanisms
    • B29C66/8242—Pneumatic or hydraulic drives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
    • B29C66/912—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by measuring the temperature, the heat or the thermal flux
    • B29C66/9121—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by measuring the temperature, the heat or the thermal flux by measuring the temperature
    • B29C66/91211—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by measuring the temperature, the heat or the thermal flux by measuring the temperature with special temperature measurement means or methods
    • B29C66/91212—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by measuring the temperature, the heat or the thermal flux by measuring the temperature with special temperature measurement means or methods involving measurement means being part of the welding jaws, e.g. integrated in the welding jaws
    • B29C66/91213—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by measuring the temperature, the heat or the thermal flux by measuring the temperature with special temperature measurement means or methods involving measurement means being part of the welding jaws, e.g. integrated in the welding jaws and measuring the electrical resistance of a resistive element belonging to said welding jaws, said element being, e.g. a thermistor

Abstract

PROBLEM TO BE SOLVED: To provide a bonding head and a bonding apparatus provided therewith, which can surely bond a bonding object and a member to be bonded, and with which miniaturization of the whole body of the apparatus is possible. SOLUTION: This bonding head comprises a vibrator 2, a vibration transferring member 1 which is coupled to the vibrator 2 to transfer the ultrasonic vibration from the vibrator 2 to the bonding object, supporting members 3 (a first supporting member 3a and a second supporting member 3b) that support and fix the vibration transferring member 1, a compressing member 4 that compresses the bonding object to apply the ultrasonic vibration to the bonding object and to the member to be bonded to bond the both, and a set of heating mechanism 30, a cooling mechanism 40, and a controller 50, which control the temperature at an optimum temperature.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【発明の属する技術分野】本発明は、ボンディングヘッ
ド及びこれを備えたボンディング装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bonding head and a bonding apparatus having the same.

【０００２】[0002]

【従来の技術】従来、金属や合成樹脂等の接合対象物と
被接合部材とを超音波振動により接合する超音波溶接装
置としては、例えば、実公昭４０−３６３１号公報に開
示されたものがある。この超音波溶接装置は、両端に設
けられた振動子と、この振動子に結合された２つの超音
波ホーンと、２つの超音波ホーンに挟まれて結合された
１つの超音波溶接用つづみ型チップと、この溶接用チッ
プに一体に取り付けられた支持具などを備えている。2. Description of the Related Art Conventionally, as an ultrasonic welding apparatus for joining an object to be joined such as a metal or a synthetic resin and a member to be joined by ultrasonic vibration, for example, one disclosed in Japanese Utility Model Publication No. 40-3631 is disclosed. is there. This ultrasonic welding apparatus comprises a vibrator provided at both ends, two ultrasonic horns connected to the vibrator, and one ultrasonic welding stub sandwiched and connected between the two ultrasonic horns. It is provided with a mold tip and a support member integrally attached to the welding tip.

【０００３】[0003]

【発明が解決しようとする課題】従来の超音波溶接装置
は、２つの超音波ホーンを支持体がそれぞれ支持するの
で安定はしているものの、振動子、超音波ホーン、超音
波溶接用つづみ型チップなどの個々の構成部品が多く、
また、一体に加工することができないので作業工数も多
くなり、また、装置全体が大型化してしまうため小型化
を図ることが望まれている。The conventional ultrasonic welding apparatus is stable because two ultrasonic horns are supported by the support, respectively, but the vibrator, the ultrasonic horn, and the ultrasonic welding steppers are used. Many individual components such as die chips,
Further, since it cannot be integrally processed, the number of work steps is increased, and the size of the entire apparatus is desired to be reduced because it is increased in size.

【０００４】そこで、本発明は、従来の超音波溶接装置
に数々の改良を試みてなされたものであって、接合対象
物と被接合部材との接合が確実で装置全体の小型化が可
能なボンディングヘッド及びこれを備えたボンディング
装置を提供することを目的とする。In view of the above, the present invention has been made by making various improvements to a conventional ultrasonic welding apparatus. The present invention has been made to ensure that the object to be joined and the member to be joined are securely joined and the entire apparatus can be reduced in size. An object of the present invention is to provide a bonding head and a bonding apparatus including the same.

【０００５】[0005]

【課題を解決するための手段】本発明によるボンディン
グヘッドは、超音波振動を印加して接合対象物と被接合
部材とを接合するボンディングヘッドであって、超音波
振動を発生する振動子と、前記超音波振動の１波長をλ
として超音波振動の進行方向におけるλ／２の長さを有
する第１の振動伝達部と、該第１の振動伝達部と前記振
動子間に結合されて前記進行方向におけるλ／４の長さ
を有する第２の振動伝達部と、該第１の振動伝達部の他
端に結合されて前記進行方向におけるλ／４の長さを有
する第３の振動伝達部とを有する振動伝達部材と、前記
第１の振動伝達部の両端を支持して超音波振動の節の位
置に設けられた第１の支持部材及び第２の支持部材とを
有する支持部材と、前記第１の振動伝達部における超音
波振動の腹の位置に前記接合対象物に当接して押圧する
押圧部材と、前記押圧部材を非接触により加熱可能な加
熱機構と、前記振動子を冷却可能な冷却機構と、前記加
熱機構及び前記冷却機構を駆動制御して温度制御可能な
構成としたものである。A bonding head according to the present invention is a bonding head for applying an ultrasonic vibration to join an object to be joined and a member to be joined, and a vibrator for generating the ultrasonic vibration; One wavelength of the ultrasonic vibration is λ
A first vibration transmitting portion having a length of λ / 2 in the traveling direction of the ultrasonic vibration, and a length of λ / 4 in the traveling direction coupled between the first vibration transmitting portion and the vibrator. A vibration transmission member having a second vibration transmission portion having a length of λ / 4 in the traveling direction and coupled to the other end of the first vibration transmission portion; A support member having a first support member and a second support member provided at the positions of the nodes of the ultrasonic vibration while supporting both ends of the first vibration transmission unit; A pressing member that abuts against and presses the bonding object at a position of an antinode of ultrasonic vibration, a heating mechanism that can heat the pressing member in a non-contact manner, a cooling mechanism that can cool the vibrator, and the heating mechanism And a configuration in which the cooling mechanism is driven to control the temperature. .

【０００６】また、本発明によるボンディングヘッドの
前記第１の振動伝達部は、四角柱状であって、前記接合
対象物を押圧する方向における大きさが前記第２の振動
伝達部及び第３の振動伝達部に等しく、前記接合対象物
を押圧する方向における断面積が前記第２の振動伝達部
及び第３の振動伝達部の断面積よりも小であることを特
徴とするものである。Further, the first vibration transmitting portion of the bonding head according to the present invention has a quadrangular prism shape, and has a size in a direction of pressing the object to be joined, the second vibration transmitting portion and the third vibration transmitting portion. The cross-sectional area in the direction of pressing the object to be joined is smaller than the cross-sectional areas of the second vibration transmitting section and the third vibration transmitting section.

【０００７】また、本発明によるボンディングヘッドの
前記押圧部材は、前記接合対象物を吸引して吸着する吸
着口を有するものである。Further, the pressing member of the bonding head according to the present invention has a suction port for sucking and sucking the object to be joined.

【０００８】また、本発明によるボンディングヘッドの
前記押圧部材は、外表面の一部若しくは全部を黒色系の
色で形成したものである。The pressing member of the bonding head according to the present invention has a part or the whole of the outer surface formed in a black color.

【０００９】また、本発明によるボンディングヘッドの
前記加熱機構は、前記押圧部材を非接触により加熱可能
な加熱器と、該加熱器によって加熱された前記押圧部材
の温度を非接触により計測可能な測温体と、該測温体か
らの電気信号に基づいて予め設定した設定温度と比較し
て調節信号を制御手段へ出力する温度調節器とを有する
ものである。Further, the heating mechanism of the bonding head according to the present invention includes a heater capable of heating the pressing member in a non-contact manner, and a measuring device capable of measuring the temperature of the pressing member heated by the heater in a non-contact manner. It has a temperature body and a temperature controller for outputting an adjustment signal to the control means in comparison with a preset temperature set based on an electric signal from the temperature measurement body.

【００１０】また、本発明によるボンディングヘッドの
少なくとも、前記加熱機構の前記加熱器及び前記測温体
は、前記振動伝達部材と一体に可動する構成としたもの
である。Further, at least the heater and the temperature measuring element of the heating mechanism of the bonding head according to the present invention are configured to move integrally with the vibration transmitting member.

【００１１】また、本発明によるボンディングヘッドの
前記冷却機構は、前記振動子を冷却するカバーと、該冷
却カバー内の冷却水を循環して冷却する冷却器と、振動
子の温度を計測する測温体と、測温体からの電気信号を
受けて予め設定した温度と比較して制御手段への調節信
号を出力する温度調節器とを有するものである。Further, the cooling mechanism of the bonding head according to the present invention includes a cover for cooling the vibrator, a cooler for circulating and cooling the cooling water in the cooling cover, and a measuring device for measuring the temperature of the vibrator. It has a temperature body and a temperature controller which receives an electric signal from the temperature measuring element, compares the temperature with a preset temperature, and outputs an adjustment signal to the control means.

【００１２】また、本発明によるボンディングヘッドの
前記冷却機構の冷却器は、ファン、エアーの吹き付け、
エアーの引き抜きなどで構成したものである。Further, the cooler of the cooling mechanism of the bonding head according to the present invention includes a fan,
It is constructed by extracting air.

【００１３】また、本発明によるボンディング装置は、
超音波振動を印加して接合対象物と被接合部材とを接合
するボンディングヘッドを有するボンディング装置であ
って、超音波振動を発生する振動子と、前記超音波振動
の１波長をλとして超音波振動の進行方向におけるλ／
２の長さを有する第１の振動伝達部と、該第１の振動伝
達部と前記振動子間に結合されて前記進行方向における
λ／４の長さを有する第２の振動伝達部と、該第１の振
動伝達部の他端に結合されて前記進行方向におけるλ／
４の長さを有する第３の振動伝達部とを有する振動伝達
部材と、前記第１の振動伝達部の両端を支持して超音波
振動の節の位置に設けられた第１の支持部材及び第２の
支持部材とを有する支持部材と、前記第１の振動伝達部
における超音波振動の腹の位置に前記接合対象物に当接
して押圧する押圧部材と、前記押圧部材を非接触により
加熱可能な加熱機構と、前記振動子を冷却可能な冷却機
構と、前記加熱機構及び前記冷却機構を駆動制御して温
度制御可能な構成としたボンディングヘッドを備え、前
記ボンディングヘッドを駆動する圧接機構と、前記ボン
ディングヘッド及び前記圧接機構の制御を行う制御手段
とを有するものである。Further, the bonding apparatus according to the present invention comprises:
What is claimed is: 1. A bonding apparatus comprising: a bonding head for applying an ultrasonic vibration to join an object to be joined and a member to be joined, comprising: a vibrator for generating an ultrasonic vibration; Λ / in the direction of vibration
A first vibration transmitting unit having a length of 2; a second vibration transmitting unit coupled between the first vibration transmitting unit and the vibrator and having a length of λ / 4 in the traveling direction; Coupled to the other end of the first vibration transmission unit,
A vibration transmitting member having a third vibration transmitting portion having a length of 4, a first supporting member supporting both ends of the first vibration transmitting portion and being provided at a position of a node of ultrasonic vibration; A supporting member having a second supporting member, a pressing member that abuts against the joint object at a position of an antinode of the ultrasonic vibration in the first vibration transmitting unit, and heats the pressing member in a non-contact manner. A heating mechanism capable of cooling the vibrator; a bonding mechanism configured to control the temperature of the heating mechanism and the cooling mechanism by driving and controlling the temperature; and a pressing mechanism configured to drive the bonding head. And control means for controlling the bonding head and the press-contact mechanism.

【００１４】[0014]

【発明の実施の形態】次に、本発明によるボンディング
ヘッド及びこれを備えたボンディング装置の実施の形態
について、図１乃至図６を参照して説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, an embodiment of a bonding head according to the present invention and a bonding apparatus having the same will be described with reference to FIGS.

【００１５】次に、本発明による第１の実施の形態とし
てのボンディングヘッドについて、図１乃至図６を参照
して説明する。図１（ａ）は、本発明によるボンディン
グヘッドの第１の実施の形態を示す正面図、（ｂ）は、
（ａ）に示すボンディングヘッドの振動モードを示す
図、図２（ａ）は、図１（ａ）に示すボンディングヘッ
ドの平面図、（ｂ）は、（ａ）におけるＡ−Ａ断面図及
びＣ−Ｃ断面図、（ｃ）は、（ａ）におけるＢ−Ｂ断面
図、図３は、本発明によるボンディングヘッドの押圧部
材の構成を示す斜視図、図４は、本発明によるボンディ
ングヘッドの第１の実施の形態を示す斜視図、図５は、
本発明によるボンディングヘッドの一部の回路を示すブ
ロック図、図６は、本発明によるボンディングヘッドを
備えたボンディング装置の構成を示す図である。Next, a bonding head according to a first embodiment of the present invention will be described with reference to FIGS. FIG. 1A is a front view showing a first embodiment of a bonding head according to the present invention, and FIG.
FIG. 2A shows a vibration mode of the bonding head shown in FIG. 2A, FIG. 2A is a plan view of the bonding head shown in FIG. 1A, and FIG. FIG. 3C is a perspective view showing the configuration of the pressing member of the bonding head according to the present invention, and FIG. 4 is a perspective view showing the structure of the bonding head according to the present invention. FIG. 5 is a perspective view showing one embodiment, and FIG.
FIG. 6 is a block diagram showing a partial circuit of a bonding head according to the present invention, and FIG. 6 is a diagram showing a configuration of a bonding apparatus provided with the bonding head according to the present invention.

【００１６】図１及び図２に示すように、ボンディング
ヘッド１０は、所定の周波数の超音波振動を発生する１
つの振動子２と、振動子２と結合して振動子２からの超
音波振動を接合対象物２２（図６に図示）に伝播する振
動伝達部材１と、振動伝達部材１を支持固定する支持部
材３（第１の支持部材３ａ及び第２の支持部材３ｂ）
と、接合対象物２２（図６に図示）を押圧して振動子２
からの超音波振動を印加して接合対象物２２と被接合部
材２３（図６に図示）との接合を行う押圧部材４と、図
５に示す、加熱機構３０と、冷却機構４０と、制御手段
としての操作器５０とを有する。As shown in FIGS. 1 and 2, the bonding head 10 generates an ultrasonic vibration of a predetermined frequency.
A vibrator 2, a vibration transmitting member 1 coupled to the vibrator 2 and transmitting ultrasonic vibrations from the vibrator 2 to an object 22 (shown in FIG. 6), and a support for supporting and fixing the vibration transmitting member 1. Member 3 (first support member 3a and second support member 3b)
And pressing the object 22 (shown in FIG. 6)
The pressing member 4 for applying the ultrasonic vibration from the to join the object 22 and the member 23 (shown in FIG. 6), the heating mechanism 30 and the cooling mechanism 40 shown in FIG. And an operating device 50 as means.

【００１７】図１乃至図６に示すように、振動子２は、
例えばＰＺＴ（ｐｉｅｚｏｅｌｅｃｔｒｉｃ：圧電）素
子等で構成され、ケーブル１４を介して発振器１８から
所定の周波数の電圧が印加されて超音波振動を発生す
る。振動子２の超音波振動の進行方向ｕにおける全長
は、超音波振動の１波長λに対してλ／２で設定されて
いる。発振器１８から印加される電圧の周波数は、１５
ｋＨｚ〜２００ｋＨｚのものが使用可能である。しかし
て、本実施の形態は、１５ｋＨｚ〜２００ｋＨｚのう
ち、高周波駆動（例えば、６０ｋＨｚ）であるため低周
波領域での駆動と異なり、ヒータを押圧部材４に直接取
付けた場合には、振動の発生源となるおそれがあり、振
動系に影響を及ぼして振動エネルギーが減少するおそれ
があるので、非接触の加熱機構３０を備えている。As shown in FIGS. 1 to 6, the vibrator 2 comprises:
For example, it is composed of a PZT (piezoelectric) element or the like, and a voltage of a predetermined frequency is applied from an oscillator 18 via a cable 14 to generate ultrasonic vibration. The total length of the vibrator 2 in the traveling direction u of the ultrasonic vibration is set to λ / 2 with respect to one wavelength λ of the ultrasonic vibration. The frequency of the voltage applied from the oscillator 18 is 15
A frequency of kHz to 200 kHz can be used. However, in the present embodiment, when the heater is directly mounted on the pressing member 4, vibration is generated when the heater is directly mounted on the pressing member 4, unlike high frequency driving (for example, 60 kHz) among 15 kHz to 200 kHz. A non-contact heating mechanism 30 is provided because it may be a source and may affect the vibration system and reduce vibration energy.

【００１８】また、振動伝達部材１は、ジュラルミン、
ステンレス鋼（ＳＵＳ）、アルミニウム、チタン合金等
の金属からなり、全体が中実で四角柱状に形成されてい
る。振動伝達部材１の全長は、振動子２が発生する超音
波振動の進行方向ｕの共振長、すなわち超音波振動の半
波長（λ／２）の整数倍に設定されており、本実施の形
態では、振動子２が発生する超音波振動の進行方向ｕに
おける全長がλ／２の２倍であるλである。The vibration transmitting member 1 is made of duralumin,
It is made of a metal such as stainless steel (SUS), aluminum, or a titanium alloy, and is entirely solid and formed in a quadrangular prism shape. The total length of the vibration transmission member 1 is set to an integral multiple of the resonance length in the traveling direction u of the ultrasonic vibration generated by the vibrator 2, that is, an integral multiple of a half wavelength (λ / 2) of the ultrasonic vibration. In this case, the total length in the traveling direction u of the ultrasonic vibration generated by the vibrator 2 is λ, which is twice λ / 2.

【００１９】また、振動伝達部材１は、超音波振動の進
行方向ｕにおけるλ／２の長さを有する第１の振動伝達
部１ａと、第１の振動伝達部１ａと振動子２との間に結
合されて超音波振動の進行方向ｕにおける長さがλ／４
である第２の振動伝達部１ｂと、第１の振動伝達部１ａ
の他端、すなわち振動子２と対向する側の端部に結合さ
れて超音波振動の進行方向ｕにおける長さがλ／４であ
る第３の振動伝達部１ｃとを有する。The vibration transmitting member 1 has a first vibration transmitting portion 1a having a length of λ / 2 in the traveling direction u of the ultrasonic vibration, and a portion between the first vibration transmitting portion 1a and the vibrator 2. And the length in the traveling direction u of the ultrasonic vibration is λ / 4
A second vibration transmission unit 1b, and a first vibration transmission unit 1a
, That is, a third vibration transmitting portion 1c whose length in the traveling direction u of the ultrasonic vibration is λ / 4.

【００２０】第１の振動伝達部１ａの幅は、図２（ａ）
乃至（ｃ）から明らかなように、第２の振動伝達部１ｂ
及び第３の振動伝達部１ｃの幅ｍよりも小となってお
り、ｍ＞ｍ’である。The width of the first vibration transmitting portion 1a is as shown in FIG.
Or (c), the second vibration transmitting portion 1b
And the width m of the third vibration transmission portion 1c is smaller than m, and m> m ′.

【００２１】また、第１の振動伝達部１ａの大きさｌ
は、図２（ｂ）及び（ｃ）に示すように、第２の振動伝
達部１ｂ及び第３の振動伝達部１ｃの大きさｌと等し
い。The size l of the first vibration transmitting portion 1a
Is equal to the size l of the second vibration transmission unit 1b and the third vibration transmission unit 1c, as shown in FIGS. 2B and 2C.

【００２２】したがって、第１の振動伝達部１ａの断面
積は、ｍ’ｌであり、第２の振動伝達部１ｂ及び第３の
振動伝達部１ｃは、ｍｌであるから、ｍｌ＞ｍ’ｌの関
係になり、振動子２からの超音波振動の振幅は、第１の
振動伝達部１ａで増幅されて押圧部材４から接合対象物
２２（図６に図示）に対して超音波振動が印加される。Therefore, the cross-sectional area of the first vibration transmitting section 1a is m'l, and the second vibration transmitting section 1b and the third vibration transmitting section 1c are ml, so that ml>m'l The amplitude of the ultrasonic vibration from the vibrator 2 is amplified by the first vibration transmitting unit 1a, and the ultrasonic vibration is applied from the pressing member 4 to the joining object 22 (shown in FIG. 6). Is done.

【００２３】また、第１の振動伝達部１ａと第２の振動
伝達部１ｂ及び第３の振動伝達部１ｃの大きさはｌで等
しいから、押圧部材４の取付面が、図１から明らかなよ
うに、フラットな面となるので、押圧部材４は、第１の
支持部材３ａ及び第２の支持部材３ｂの内側に埋没する
ことなく接合対象物２２に当接可能である。Further, since the first vibration transmitting portion 1a, the second vibration transmitting portion 1b, and the third vibration transmitting portion 1c are equal in size to each other, the mounting surface of the pressing member 4 is clear from FIG. Thus, since it becomes a flat surface, the pressing member 4 can contact the joining object 22 without being buried inside the first support member 3a and the second support member 3b.

【００２４】しかして、押圧部材４の取付面が、図１に
示すようなフラットな面ではなく、第１の支持部材３ａ
及び第２の支持部材３ｂの内側に位置する場合には、接
合対象物２２を第１の支持部材３ａ及び第２の支持部材
３ｂの下面よりも上方に位置させるようにしなければ接
合することができなくなるため装置の構成が複雑とな
る。したがって、本発明のように、押圧部材４の取付面
をフラットな面とすることによって、押圧部材４の第１
の支持部材３ａ及び第２の支持部材３ｂの内側への埋没
を防ぎ、押圧部材４の近傍のスペースの有効利用を図
り、装置全体の小型化を達成している。However, the mounting surface of the pressing member 4 is not a flat surface as shown in FIG.
If the object 22 is located inside the second support member 3b, the object 22 to be joined must be located above the lower surfaces of the first support member 3a and the second support member 3b. Since it becomes impossible, the configuration of the apparatus becomes complicated. Therefore, as in the present invention, by setting the mounting surface of the pressing member 4 to a flat surface, the first
Of the support member 3a and the second support member 3b are prevented from being buried inside, the space near the pressing member 4 is effectively used, and the overall size of the apparatus is reduced.

【００２５】なお、第１の振動伝達部１ａと、第２の振
動伝達部１ｂ及び第３の振動伝達部１ｃの断面積とが、
ｍｌ＞ｍ’ｌの関係であれば、第１の振動伝達部１ａ、
第２の振動伝達部１ｂ及び第３の振動伝達部１ｃの形態
は、任意に設定可能であり、第１の振動伝達部１ａのみ
を四角柱状に形成し、第２の振動伝達部１ｂ及び第３の
振動伝達部１ｃについては円柱状とするようにしてもよ
く、また、その他の形態を適宜採択してもよい。The cross-sectional areas of the first vibration transmitting section 1a and the second vibration transmitting section 1b and the third vibration transmitting section 1c are as follows.
If the relation of ml> m′l is satisfied, the first vibration transmission unit 1a,
The form of the second vibration transmitting unit 1b and the third vibration transmitting unit 1c can be set arbitrarily. Only the first vibration transmitting unit 1a is formed in a square pillar shape, and the second vibration transmitting unit 1b and the The third vibration transmitting section 1c may be formed in a columnar shape, and other forms may be appropriately adopted.

【００２６】次に、本発明によるボンディングヘッド１
０は、振動伝達部材１を支持固定する支持部材３及び押
圧部材４が、振動伝達部材１の全長（λ）の範囲内に配
置されている。押圧部材４は、互いにλ／２の距離を隔
てて設けられた第１の支持部材３ａと第２の支持部材３
ｂとの間に位置しているため、接合対象物２２に付与す
る押圧力が均一化され、振動伝達部材１に高荷重が付加
された場合であっても振動伝達部材１のたわみや変形が
抑止されて超音波振動を高効率で印加することができ
る。Next, the bonding head 1 according to the present invention will be described.
Reference numeral 0 indicates that the support member 3 and the pressing member 4 for supporting and fixing the vibration transmission member 1 are arranged within a range of the entire length (λ) of the vibration transmission member 1. The pressing member 4 includes a first support member 3a and a second support member 3 provided at a distance of λ / 2 from each other.
b, the pressing force applied to the joining object 22 is made uniform, and even when a high load is applied to the vibration transmitting member 1, the deflection or deformation of the vibration transmitting member 1 is prevented. Suppressed, ultrasonic vibration can be applied with high efficiency.

【００２７】図１（ｂ）に示すように、支持部材３を構
成する第１の支持部材３ａ及び第２の支持部材３ｂは、
振動子２から伝播される超音波振動の振幅が０となるノ
ーダル・ポイント（節の位置）の２ヶ所に設けられてお
り、また、図４及び図６にも示すように、支持部材３
は、円盤状の固定部材１９を介して振動伝達部材１を圧
接機構１５に対して支持固定する。この支持部材３は、
ジュラルミン、ステンレス鋼（ＳＵＳ）、アルミニウ
ム、超硬、チタン合金等の金属で形成されている。As shown in FIG. 1B, the first support member 3a and the second support member 3b constituting the support member 3 are
It is provided at two nodal points (node positions) where the amplitude of the ultrasonic vibration propagated from the vibrator 2 becomes 0. As shown in FIGS.
Supports and fixes the vibration transmitting member 1 to the press-contact mechanism 15 via a disk-shaped fixing member 19. This support member 3
It is made of metal such as duralumin, stainless steel (SUS), aluminum, carbide, titanium alloy and the like.

【００２８】押圧部材４は、略直方体状に形成され、超
硬、ステンレス鋼（ＳＵＳ）、チタン合金等の金属が使
用可能であり、図６に示すように、接合対象物２２と対
向する位置に設けられている。押圧部材４は、図１
（ｂ）に示すように、第１の振動伝達部１ａにおける超
音波振動の振幅が最大（又は最小）になる位置に取付ら
れている。The pressing member 4 is formed in a substantially rectangular parallelepiped shape, and can be made of a metal such as carbide, stainless steel (SUS), or a titanium alloy. As shown in FIG. It is provided in. The pressing member 4 is shown in FIG.
As shown in (b), it is attached to a position where the amplitude of the ultrasonic vibration in the first vibration transmitting section 1a is maximum (or minimum).

【００２９】また、図３に示すように、押圧部材４は、
二次元方向に移動する可動テーブル（図示せず）及び圧
接機構１５により昇降・移動して接合対象物２２を下面
で吸引して図６に示す被接合部材２３の接合面に位置決
め載置を行う吸着口４ａと、押圧部材４の一側面（この
場合、前面）上に開口する吸引口４ｃと、吸引口４ｃか
ら吸着口４ａに吸引力を付与するダクト４ｂとを有す
る。なお、吸引力を付与する吸引機構については図示し
ていないが、公知の吸引機構を用いている。As shown in FIG. 3, the pressing member 4
A movable table (not shown) that moves in a two-dimensional direction and a press-contact mechanism 15 move up and down to suck the object 22 to be joined on the lower surface, and perform positioning and placement on the joint surface of the member 23 shown in FIG. It has a suction port 4a, a suction port 4c that opens on one side surface (in this case, a front surface) of the pressing member 4, and a duct 4b that applies suction force from the suction port 4c to the suction port 4a. Although a suction mechanism for applying a suction force is not shown, a known suction mechanism is used.

【００３０】そして、押圧部材４は、接合対象物２２を
吸着口４ａに吸着して被接合部材２３との接合面に位置
決めして接合する。しかして、押圧部材４に吸引されて
いる接合対象物２２を被接合部材２３との接合面に位置
決めして吸引力を一端解除して接合するようにしてもよ
い。Then, the pressing member 4 sucks the object 22 to be joined to the suction port 4a, and positions and joins the object 22 to the surface to be joined with the member 23 to be joined. Thus, the joining target 22 sucked by the pressing member 4 may be positioned on the joining surface with the member 23 to be joined, and the suction force may be released once to join.

【００３１】また、図４乃至図６に示すように、本発明
は、押圧部材４を非接触により加熱して接合対象物２２
と被接合部材２３との接合効率を向上させることが可能
な加熱機構３０を有する。As shown in FIG. 4 to FIG. 6, the present invention heats the pressing member 4 in a non-contact manner to
A heating mechanism 30 capable of improving the joining efficiency between the member and the member 23 to be joined.

【００３２】加熱機構３０は、押圧部材４を非接触によ
り加熱することが可能な加熱器３１と、加熱器３１によ
って加熱された押圧部材４の温度を非接触により計測す
る測温体３２と、測温体３２からの電気信号に基づいて
予め設定した設定温度と比較して調節信号を制御手段と
しての操作器５０へ出力する温度調節器３３を有する。The heating mechanism 30 includes a heater 31 capable of heating the pressing member 4 in a non-contact manner, a temperature measuring body 32 measuring the temperature of the pressing member 4 heated by the heater 31 in a non-contact manner, There is provided a temperature controller 33 that outputs an adjustment signal to an operation device 50 as control means by comparing the temperature with a preset temperature based on an electric signal from the temperature sensor 32.

【００３３】加熱器３１は、電磁波系ランプヒータ、レ
ーザーヒータ、抵抗体の輻射熱などが使用可能であり、
非接触で加熱することができる。測温体３２は、放射温
度計、熱電対、白金測温抵抗体、サーミスタなどが使用
可能である。また、温度調節器３３は、測温体３２と、
測温体３２からの電気信号に基づいて予め設定した設定
温度と比較して調節信号を出力する比較器で構成されて
いる。The heater 31 can use electromagnetic wave lamp heaters, laser heaters, radiant heat from resistors, and the like.
It can be heated without contact. As the temperature detector 32, a radiation thermometer, a thermocouple, a platinum resistance temperature detector, a thermistor, or the like can be used. Further, the temperature controller 33 includes a temperature measuring body 32,
It is composed of a comparator that outputs an adjustment signal in comparison with a preset temperature based on an electric signal from the temperature measuring element 32.

【００３４】加熱器３１を電磁波系のヒータを使用する
場合には、ボンディングツールとしての押圧部材４の外
表面を炭化系のメッキや黒色のペイントなどの黒色系の
色彩で形成して熱の吸収率を向上させることが可能であ
る。When an electromagnetic wave heater is used as the heater 31, the outer surface of the pressing member 4 as a bonding tool is formed of a black color such as carbonized plating or black paint to absorb heat. It is possible to improve the rate.

【００３５】また、図５に示すように、加熱機構３０の
制御を行う制御手段としての操作器５０は、ＳＳＲ（ソ
リッドステートリレー）、サイクルコントロール、電力
調整器などで構成することが可能であり、加熱機構３０
の制御を行うものである。また、この制御手段としての
操作器５０は、冷却機構４０の制御も行う。As shown in FIG. 5, the operating device 50 as a control means for controlling the heating mechanism 30 can be constituted by an SSR (solid state relay), a cycle control, a power regulator and the like. , Heating mechanism 30
Is performed. The operating device 50 as the control means also controls the cooling mechanism 40.

【００３６】また、加熱機構３０の加熱器３１、測温体
３２、冷却機構４０のカバー４１、冷却器４２、測温体
４３は、図示してはいないが、ボンディングヘッド１０
と一体に同期して可動する構成となっている。しかし
て、本実施の形態によるボンディングヘッド１０は、加
熱機構３０、冷却機構４０により常時監視制御されてい
る。したがって、監視制御可能であれば、加熱機構３０
の加熱器３１、測温体３２、冷却機構４０のカバー４
１、冷却器４２、測温体４３の取付位置等は、適宜選定
すればよい。また、図５に示す操作器５０、温度調節器
３３，４４などは、ボンディングヘッド１０と同期させ
て駆動してもよいが、ボンディングヘッド１０の重量が
増えるので同期させて駆動する構成とはしていない。Although not shown, the heater 31, the temperature measuring body 32 of the heating mechanism 30, the cover 41 of the cooling mechanism 40, the cooler 42, and the temperature measuring body 43 are not shown.
It is configured to be able to move synchronously with the camera. The bonding head 10 according to the present embodiment is constantly monitored and controlled by the heating mechanism 30 and the cooling mechanism 40. Therefore, if monitoring control is possible, the heating mechanism 30
Heater 4, temperature measuring body 32, cover 4 of cooling mechanism 40
1, the mounting position of the cooler 42, the temperature measuring element 43 and the like may be appropriately selected. The operating device 50 and the temperature controllers 33 and 44 shown in FIG. 5 may be driven in synchronization with the bonding head 10, but are driven in synchronization because the weight of the bonding head 10 increases. Not.

【００３７】次に、冷却機構４０は、図４乃至図６に示
すように、振動子２を冷却するカバー４１と、冷却カバ
ー４１内の冷却水を循環して冷却する冷却器４２と、振
動子２の温度を計測する測温体４３と、測温体４３から
の電気信号を受けて予め設定した温度と比較して操作器
５０への調節信号を出力する温度調節器４４とを有す
る。Next, as shown in FIGS. 4 to 6, the cooling mechanism 40 includes a cover 41 for cooling the vibrator 2, a cooler 42 for circulating cooling water in the cooling cover 41 for cooling, It has a temperature measuring element 43 for measuring the temperature of the child 2, and a temperature adjuster 44 for receiving an electric signal from the temperature measuring element 43, comparing the temperature with a preset temperature, and outputting an adjustment signal to the operating device 50.

【００３８】カバー４１は、本実施の形態によれば、カ
バー４１内の内部に冷却水を循環して振動子を冷気によ
り冷却するためのものであるが、冷却水を用いずに、フ
ァン、エアーの吹き付け、エアーの引き抜きなどで冷却
器４２を構成する場合には、振動子２に直接エアーを供
給する必要があるのでカバー４１は使用する必要はな
い。また、カバー４１は、図４から明らかなように、支
持部材３ａに設けられているステー４５に取付固定され
ている。なお、本実施の形態による振動子２は、振動子
２が組み込まれて結合されているホーンを含むものであ
る。According to the present embodiment, the cover 41 circulates cooling water inside the cover 41 and cools the vibrator with cool air. When the cooler 42 is formed by blowing air, extracting air, or the like, the cover 41 does not need to be used because it is necessary to supply air directly to the vibrator 2. 4, the cover 41 is attached and fixed to a stay 45 provided on the support member 3a. The vibrator 2 according to the present embodiment includes a horn in which the vibrator 2 is incorporated and coupled.

【００３９】また、冷却器４２は、カバー４１内の冷却
水を循環するバルブなどで構成される。The cooler 42 comprises a valve for circulating the cooling water in the cover 41 and the like.

【００４０】また、測温体４３は、熱電対などで構成さ
れており、振動子２の温度を計測して、その計測した値
を電気信号として温度調節器４４に出力し、温度調節器
４４はその電気信号を受けて予め設定した温度と比較し
て操作器５０に出力する。操作器５０は、冷却器４２に
対してバルブの開閉などの制御指令を送出してカバー４
１内の冷却水を循環させるなどの制御を行う。なお、温
度調節器４４は、温度調節器３３と同様に、比較器など
で構成されている。The temperature measuring element 43 is composed of a thermocouple or the like, measures the temperature of the vibrator 2 and outputs the measured value to the temperature controller 44 as an electric signal. Receives the electric signal, compares it with a preset temperature, and outputs it to the operating device 50. The operation device 50 sends a control command such as opening and closing of a valve to the cooler 42 to
Control such as circulating the cooling water in 1 is performed. The temperature controller 44 includes a comparator and the like, like the temperature controller 33.

【００４１】次に、図５に示すように、制御手段として
の制御部（ＣＰＵ）１７は、マイクロコンピュータ等で
構成されて装置全体の制御を行うものであり、外部の図
示せぬ操作手段からの操作指令に基づいて作動する。そ
して、操作器５０は、制御手段としての制御部（ＣＰ
Ｕ）１７からの指令によって駆動制御（ＯＮ／ＯＦＦ）
される。しかして、前述した加熱機構３０、冷却機構４
０の駆動制御は操作器５０が行う。なお、操作器５０及
び制御部（ＣＰＵ）１７を制御手段と呼ぶ。Next, as shown in FIG. 5, a control section (CPU) 17 as a control means is constituted by a microcomputer or the like and controls the entire apparatus. It operates based on the operation command. The operating device 50 includes a control unit (CP
U) Drive control (ON / OFF) by command from 17
Is done. Thus, the above-described heating mechanism 30 and cooling mechanism 4
The drive control of 0 is performed by the operation device 50. The operation device 50 and the control unit (CPU) 17 are referred to as control means.

【００４２】また、振動子２を駆動する発振器１８は、
所定の周波数を発振する発振回路１８ａと、発振回路１
８ａから発振される周波数により駆動する駆動回路１８
ｂと、駆動回路１８ｂの駆動周波数を電力増幅する増幅
回路１８ｃと、振動子２への駆動力を付与すると共に振
動子２とのインピーダンスの整合を行うタンク回路１８
ｄと、タンク回路１８ｄの出力を受けて発振回路１８ａ
に振幅帰還を行う振幅帰還回路１８ｅとからなる。The oscillator 18 for driving the vibrator 2 is
An oscillation circuit 18a for oscillating a predetermined frequency;
Drive circuit 18 driven by the frequency oscillated from 8a
b, an amplifier circuit 18c for power amplifying the drive frequency of the drive circuit 18b, and a tank circuit 18 for applying a driving force to the vibrator 2 and matching the impedance with the vibrator 2
and the oscillation circuit 18a receiving the output of the tank circuit 18d.
And an amplitude feedback circuit 18e that performs amplitude feedback.

【００４３】また、本発明による第１の振動伝達部１
ａ、第２の振動伝達部１ｂ、第３の振動伝達部１ｃ、第
１の支持部材３ａ、第２の支持部材３ｂ及び押圧部材４
は、各々別体として形成したものを溶接、螺子及び接着
剤等により互いに結合して一体化してもよく、各部材の
一部又は全てを一体の部材として形成する構成としても
よい。Further, the first vibration transmission unit 1 according to the present invention
a, the second vibration transmitting section 1b, the third vibration transmitting section 1c, the first support member 3a, the second support member 3b, and the pressing member 4
May be combined with each other by welding, screws, adhesives, or the like, and may be integrated, or a part or all of the members may be formed as an integral member.

【００４４】本発明による第１の実施の形態としてのボ
ンディングヘッド１０は、以下のような効果を奏する。The bonding head 10 according to the first embodiment of the present invention has the following effects.

【００４５】振動伝達部材１の超音波振動の進行方向ｕ
における全長がλに設定されており、全体が小型化され
ている。The traveling direction u of the ultrasonic vibration of the vibration transmitting member 1
Is set to λ, and the whole is downsized.

【００４６】振動伝達部材１を支持固定する支持部材３
及び押圧部材４は、振動伝達部材１の全長（λ）の範囲
内に配置され、押圧部材４は、互いにλ／２の距離を隔
てて設けられた第１の支持部材３ａと第２の支持部材３
ｂとの間に位置しているため、接合対象物２２に付与す
る押圧力が均一化される。また、振動伝達部材１に高荷
重が付加された場合であっても、振動伝達部材１のたわ
みや変形が抑止可能で超音波振動を高効率で印加するこ
とができる。Support member 3 for supporting and fixing vibration transmitting member 1
The pressing member 4 is disposed within a range of the entire length (λ) of the vibration transmitting member 1, and the pressing member 4 includes a first supporting member 3 a and a second supporting member provided at a distance of λ / 2 from each other. Member 3
b, the pressing force applied to the joining object 22 is made uniform. Further, even when a high load is applied to the vibration transmitting member 1, the deflection or deformation of the vibration transmitting member 1 can be suppressed, and the ultrasonic vibration can be applied with high efficiency.

【００４７】第１の支持部材３ａ及び第２の支持部材３
ｂは、超音波振動の伝播に影響を及ぼさないノーダル・
ポイントに設けられ、それぞれ振動伝達部材１の両端か
ら均等な距離（λ／４）を隔てた位置に設けられ、振動
伝達部材１が片持支持とならないのでバランスよく保持
され、接合対象物２２への押圧力を均一にすることがで
きる。The first support member 3a and the second support member 3
b is a Nodal that does not affect the propagation of ultrasonic vibration.
The vibration transmission member 1 is provided at a point and is provided at a position separated by an equal distance (λ / 4) from both ends of the vibration transmission member 1. Pressing force can be made uniform.

【００４８】また、本発明は、加熱機構３０が非接触で
あるので、ボンディングツールとしての押圧部材４の形
態に拘束されることなく、種々の加熱器を採択すること
が可能であり、また、最適な温度での温度コントロール
が可能である。Further, according to the present invention, since the heating mechanism 30 is non-contact, various heaters can be adopted without being restricted by the form of the pressing member 4 as a bonding tool. Temperature control at the optimum temperature is possible.

【００４９】また、本発明は、冷却機構４０を有してい
るので、振動子２の高周波駆動も可能であり、最適な温
度での温度コントロールが可能であるので、振動子の高
寿命化を図ることができる。Further, according to the present invention, since the cooling mechanism 40 is provided, the vibrator 2 can be driven at a high frequency, and the temperature can be controlled at an optimum temperature. Can be planned.

【００５０】次に、本発明による第１の実施の形態とし
てのボンディング装置について、図６を参照して説明す
る。Next, a bonding apparatus according to a first embodiment of the present invention will be described with reference to FIG.

【００５１】図６に示すように、ボンディング装置２０
は、接合対象物２２及び接対象物２２が接合される被接
合部材２３が載置される載置台１６と、接合対象物２２
に超音波振動を印加して接合対象物２２と被接合部材２
３とを接合するボンディングヘッド１０と、ボンディン
グヘッド１０を保持し、このボンディングヘッド１０に
押圧力を付与する圧接機構１５と、発振器１８、制御部
（ＣＰＵ）１７とを有する。As shown in FIG.
The mounting table 16 on which the joining object 22 and the member 23 to which the joining object 22 is joined are placed,
Is applied to the object 22 and the member 2
3, a bonding mechanism 15 that holds the bonding head 10 and applies a pressing force to the bonding head 10, an oscillator 18, and a control unit (CPU) 17.

【００５２】載置台１６は、図示せぬ搬送手段により搬
送される被接合部材２３を所定の位置に位置決め可能で
ある。しかして、載置台１６を制御部１７からの制御信
号に基づいて矢印ｘ方向及びｙ方向（図６の紙面に垂直
な方向）の二次元方向に移動可能としてもよい。The mounting table 16 is capable of positioning a member 23 to be transferred conveyed by a conveying means (not shown) at a predetermined position. Thus, the mounting table 16 may be movable in a two-dimensional direction in the directions of the arrows x and y (the direction perpendicular to the plane of FIG. 6) based on a control signal from the control unit 17.

【００５３】また、接合対象物２２及び被接合部材２３
としては、ＩＣチップ等の電子部品と基板、金属や合成
樹脂製の板状部材等のボンディング接続が可能である。The object 22 to be joined and the member to be joined 23
For example, a bonding connection between an electronic component such as an IC chip and a substrate, a plate member made of metal or synthetic resin, or the like is possible.

【００５４】圧接機構１５は、モータ等を有しボンディ
ングヘッド１０を矢印ｚ方向に昇降動作させて位置決め
する駆動部１５ａと、モータ、エアシリンダ及び油圧シ
リンダ等で構成され、ロッド１５ｃの突出量を可変して
先端部に取り付けられた固定部材１９を介してボンディ
ングヘッド１０による接合対象物２２への押圧力を付与
する荷重機構部１５ｂとで構成されている。また、駆動
部１５ａの移動量及び荷重機構部１５ｂによるロッド１
５ｃの突出量は、制御部（ＣＰＵ）１７により制御され
る。The press-contact mechanism 15 includes a drive unit 15a having a motor and the like for moving the bonding head 10 up and down in the direction of the arrow z, and a motor, an air cylinder, a hydraulic cylinder, and the like. And a load mechanism 15b that variably applies a pressing force to the bonding object 22 by the bonding head 10 via a fixing member 19 attached to the distal end. In addition, the rod 1 by the moving amount of the driving unit 15a and the load mechanism unit 15b.
The protrusion amount of 5c is controlled by the control unit (CPU) 17.

【００５５】次に、上記の構成からなるボンディング装
置２０の動作について説明する。Next, the operation of the bonding apparatus 20 having the above configuration will be described.

【００５６】図６に示すように、載置台１６上に接合対
象物２２及び被接合部材２３が載置位置決めされると、
駆動部１５ａが作動してボンディングヘッド１０が矢印
ｚ方向に下降して所定の高さに位置決めされる。続い
て、荷重機構部１５ｂが作動してボンディングヘッド１
０の押圧部材４が接合対象物２２に当接して一定の圧力
で押圧して振動子２からの超音波振動が印加されて接合
対象物２２と被接合部材２３との接合が行われる。As shown in FIG. 6, when the object 22 and the member 23 are positioned on the mounting table 16,
The driving unit 15a operates to lower the bonding head 10 in the direction of the arrow z and to position the bonding head 10 at a predetermined height. Subsequently, the load mechanism 15b is operated to activate the bonding head 1.
The zero pressing member 4 comes into contact with the object 22 to be pressed and is pressed with a constant pressure, and the ultrasonic vibration from the vibrator 2 is applied to join the object 22 to be joined and the member 23 to be joined.

【００５７】次に、駆動部１５ａ及び荷重機構部１５ｂ
を作動させてボンディングヘッド１０を所定の高さまで
上昇させて次のボンディング接続に備える。そして、前
記動作を繰り返して接合対象物２２と被接合部材２３と
のボンディング接続を繰り返す。Next, the drive section 15a and the load mechanism section 15b
To raise the bonding head 10 to a predetermined height to prepare for the next bonding connection. Then, the above operation is repeated to repeat the bonding connection between the joining object 22 and the member 23 to be joined.

【００５８】[0058]

【発明の効果】以上説明したように、本発明によれば、
接合対象物に対して超音波振動を高効率で伝達可能な振
動伝達部材の支持位置が具体的に設定され、接合対象物
と被接合部材との接合を確実に行い、装置全体の小型化
が可能である。As described above, according to the present invention,
The support position of the vibration transmitting member that can transmit ultrasonic vibrations to the object to be joined with high efficiency is specifically set, and the joining of the object to be joined and the member to be joined is ensured, and the overall size of the device can be reduced. It is possible.

【００５９】また、本発明によれば、加熱機構及び冷却
機構を有しているので、最適な温度での温度コントロー
ルが可能である。Further, according to the present invention, since a heating mechanism and a cooling mechanism are provided, temperature control at an optimum temperature is possible.

【図面の簡単な説明】[Brief description of the drawings]

【図１】（ａ）は、本発明によるボンディングヘッドの
第１の実施の形態を示す正面図、（ｂ）は、（ａ）に示
すボンディングヘッドの振動モードを示す図である。FIG. 1A is a front view showing a first embodiment of a bonding head according to the present invention, and FIG. 1B is a diagram showing a vibration mode of the bonding head shown in FIG.

【図２】（ａ）は、図１（ａ）に示すボンディングヘッ
ドの平面図、（ｂ）は、（ａ）におけるＡ−Ａ及びＣ−
Ｃ断面図、（ｃ）は、（ａ）におけるＢ−Ｂ断面図であ
る。2 (a) is a plan view of the bonding head shown in FIG. 1 (a), and FIG. 2 (b) is a view showing AA and C- in FIG.
C sectional view, (c) is a BB sectional view in (a).

【図３】本発明によるボンディングヘッドの押圧部材の
構成を示す斜視図である。FIG. 3 is a perspective view showing a configuration of a pressing member of the bonding head according to the present invention.

【図４】本発明によるボンディングヘッドの第１の実施
の形態を示す斜視図である。FIG. 4 is a perspective view showing a first embodiment of a bonding head according to the present invention.

【図５】本発明によるボンディングヘッドの一部の回路
を示すブロック図である。FIG. 5 is a block diagram showing a partial circuit of a bonding head according to the present invention.

【図６】本発明によるボンディングヘッドを備えたボン
ディング装置の構成を示す図である。FIG. 6 is a diagram illustrating a configuration of a bonding apparatus including a bonding head according to the present invention.

【符号の説明】[Explanation of symbols]

１ 振動伝達部材 １ａ 第１の振動伝達部 １ｂ 第２の振動伝達部 １ｃ 第３の振動伝達部 ２ 振動子 ３ 支持部材 ３ａ 第１の支持部材 ３ｂ 第２の支持部材 ４ 押圧部材 ４ａ 吸着口 ４ｂ ダクト ４ｃ 吸引口 １０ ボンディングヘッド １４ ケーブル １５ 圧接機構 １５ａ 駆動部 １５ｂ 荷重機構部 １５ｃ ロッド １６ 載置台 １７ 制御部（ＣＰＵ） １８ 発振器 １９ 固定部材 ２０ ボンディング装置 ２２ 接合対象物 ２３ 被接合部材 ３０ 加熱機構 ３１ 加熱器 ３２ 測温体 ３３ 温度調節器 ４０ 冷却機構 ４１ カバー ４２ 冷却器 ４３ 測温体 ４４ 温度調節器 ４５ ステー ５０ 操作器 REFERENCE SIGNS LIST 1 vibration transmission member 1a first vibration transmission portion 1b second vibration transmission portion 1c third vibration transmission portion 2 vibrator 3 support member 3a first support member 3b second support member 4 pressing member 4a suction port 4b Duct 4c Suction port 10 Bonding head 14 Cable 15 Pressure contact mechanism 15a Drive unit 15b Load mechanism unit 15c Rod 16 Placement table 17 Control unit (CPU) 18 Oscillator 19 Fixing member 20 Bonding device 22 Object to be joined 23 Member to be joined 30 Heating mechanism 31 Heater 32 Temperature detector 33 Temperature controller 40 Cooling mechanism 41 Cover 42 Cooler 43 Temperature detector 44 Temperature controller 45 Stay 50 Controller

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） Ｈ０１Ｌ 41/09 Ｈ０１Ｌ 41/08 Ｕ (72)発明者 大石 幸則 東京都羽村市栄町３−１−５ 株式会社カ イジョー内 (72)発明者 橋本 芳樹 東京都羽村市栄町３−１−５ 株式会社カ イジョー内 (72)発明者 鈴木 喜伸 東京都羽村市栄町３−１−５ 株式会社カ イジョー内 Ｆターム(参考） 4F211 AD03 AD05 AD08 AG01 AG03 AH37 AP05 AR06 TA01 TN23 TQ09 TQ10 TQ11 TW15 5D107 AA13 BB01 CC01 CD05 FF03 5F044 PP16 PP19 ──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat II (Reference) H01L 41/09 H01L 41/08 U (72) Inventor Yukinori Oishi 3-1-5 Sakaemachi, Hamura-shi, Tokyo Stock Kaijo Co., Ltd. (72) Inventor Yoshiki Hashimoto 3-1-5 Sakaemachi, Hamura-shi, Tokyo Tokyo Intranet (72) Yoshinobu Suzuki 3-1-5 Sakaemachi, Hamura-shi, Tokyo F-term in Kaijo Co., Ltd. (Reference) 4F211 AD03 AD05 AD08 AG01 AG03 AH37 AP05 AR06 TA01 TN23 TQ09 TQ10 TQ11 TW15 5D107 AA13 BB01 CC01 CD05 FF03 5F044 PP16 PP19

Claims (9)

【特許請求の範囲】[Claims] 【請求項１】 超音波振動を印加して接合対象物と被接
合部材とを接合するボンディングヘッドであって、 超音波振動を発生する振動子と、 前記超音波振動の１波長をλとして超音波振動の進行方
向におけるλ／２の長さを有する第１の振動伝達部と、
該第１の振動伝達部と前記振動子間に結合されて前記進
行方向におけるλ／４の長さを有する第２の振動伝達部
と、該第１の振動伝達部の他端に結合されて前記進行方
向におけるλ／４の長さを有する第３の振動伝達部とを
有する振動伝達部材と、 前記第１の振動伝達部の両端を支持して超音波振動の節
の位置に設けられた第１の支持部材及び第２の支持部材
とを有する支持部材と、 前記第１の振動伝達部における超音波振動の腹の位置に
前記接合対象物に当接して押圧する押圧部材と、 前記押圧部材を非接触により加熱可能な加熱機構と、 前記振動子を冷却可能な冷却機構と、 前記加熱機構及び前記冷却機構を駆動制御して温度制御
可能な構成としたことを特徴とするボンディングヘッ
ド。1. A bonding head for applying an ultrasonic vibration to join an object to be joined and a member to be joined, comprising: a vibrator that generates an ultrasonic vibration; A first vibration transmission unit having a length of λ / 2 in the traveling direction of the acoustic vibration;
A second vibration transmitting unit coupled between the first vibration transmitting unit and the vibrator and having a length of λ / 4 in the traveling direction; and a second vibration transmitting unit coupled to the other end of the first vibration transmitting unit. A vibration transmitting member having a third vibration transmitting portion having a length of λ / 4 in the traveling direction; and a vibration transmitting member provided at a position of a node of ultrasonic vibration by supporting both ends of the first vibration transmitting portion. A supporting member having a first supporting member and a second supporting member; a pressing member that abuts against and presses the joining object at a position of an antinode of ultrasonic vibration in the first vibration transmitting unit; A bonding head, comprising: a heating mechanism capable of heating a member in a non-contact manner; a cooling mechanism capable of cooling the vibrator; and a temperature controllable structure by driving and controlling the heating mechanism and the cooling mechanism. 【請求項２】 前記第１の振動伝達部は、四角柱状であ
って、前記接合対象物を押圧する方向における大きさが
前記第２の振動伝達部及び第３の振動伝達部に等しく、
前記接合対象物を押圧する方向における断面積が前記第
２の振動伝達部及び第３の振動伝達部の断面積よりも小
であることを特徴とする請求項１記載のボンディングヘ
ッド。2. The first vibration transmitting section is a quadrangular prism and has a size in the direction of pressing the object to be joined equal to the second vibration transmitting section and the third vibration transmitting section.
2. The bonding head according to claim 1, wherein a cross-sectional area in a direction in which the object to be joined is pressed is smaller than a cross-sectional area of the second vibration transmitting unit and the third vibration transmitting unit. 3. 【請求項３】 前記押圧部材は、前記接合対象物を吸引
して吸着する吸着口を有することを特徴とする請求項１
又は請求項２に記載のボンディングヘッド。3. The apparatus according to claim 1, wherein the pressing member has a suction port for sucking and sucking the object to be joined.
Or the bonding head according to claim 2. 【請求項４】 前記押圧部材は、外表面の一部若しくは
全部を黒色系の色で形成したことを特徴とする請求項１
又は請求項３記載のボンディングヘッド。4. The pressing member according to claim 1, wherein a part or all of an outer surface of the pressing member is formed in a black color.
Or the bonding head according to claim 3. 【請求項５】 前記加熱機構は、前記押圧部材を非接触
により加熱可能な加熱器と、該加熱器によって加熱され
た前記押圧部材の温度を非接触により計測可能な測温体
と、該測温体からの電気信号に基づいて予め設定した設
定温度と比較して調節信号を制御手段へ出力する温度調
節器とを有することを特徴とする請求項１記載のボンデ
ィングヘッド。5. The heating mechanism includes: a heater capable of heating the pressing member in a non-contact manner; a temperature measuring body capable of measuring a temperature of the pressing member heated by the heater in a non-contact manner; 2. The bonding head according to claim 1, further comprising a temperature controller that outputs an adjustment signal to a control unit in comparison with a preset temperature based on an electric signal from the heating element. 【請求項６】 少なくとも、前記加熱機構の前記加熱器
及び前記測温体は、前記振動伝達部材と一体に可動する
構成としたことを特徴とする請求項５記載のボンディン
グヘッド。6. The bonding head according to claim 5, wherein at least the heater and the temperature measuring element of the heating mechanism are configured to move integrally with the vibration transmitting member. 【請求項７】 前記冷却機構は、前記振動子を冷却する
カバーと、該冷却カバー内の冷却水を循環して冷却する
冷却器と、振動子の温度を計測する測温体と、測温体か
らの電気信号を受けて予め設定した温度と比較して制御
手段への調節信号を出力する温度調節器とを有すること
を特徴とする請求項１記載のボンディングヘッド。7. The cooling mechanism includes a cover that cools the vibrator, a cooler that circulates and cools cooling water in the cooling cover, a temperature sensor that measures the temperature of the vibrator, and a temperature sensor. 2. The bonding head according to claim 1, further comprising: a temperature controller for receiving an electric signal from the body and comparing the temperature with a preset temperature to output an adjustment signal to the control means. 【請求項８】 前記冷却機構の冷却器は、ファン、エア
ーの吹き付け、エアーの引き抜きなどで構成したことを
特徴とする請求項１又は請求項７記載のボンディングヘ
ッド。8. The bonding head according to claim 1, wherein the cooler of the cooling mechanism is configured by a fan, blowing air, extracting air, or the like. 【請求項９】 超音波振動を印加して接合対象物と被接
合部材とを接合するボンディングヘッドを有するボンデ
ィング装置であって、 超音波振動を発生する振動子と、 前記超音波振動の１波長をλとして超音波振動の進行方
向におけるλ／２の長さを有する第１の振動伝達部と、
該第１の振動伝達部と前記振動子間に結合されて前記進
行方向におけるλ／４の長さを有する第２の振動伝達部
と、該第１の振動伝達部の他端に結合されて前記進行方
向におけるλ／４の長さを有する第３の振動伝達部とを
有する振動伝達部材と、 前記第１の振動伝達部の両端を支持して超音波振動の節
の位置に設けられた第１の支持部材及び第２の支持部材
とを有する支持部材と、 前記第１の振動伝達部における超音波振動の腹の位置に
前記接合対象物に当接して押圧する押圧部材と、 前記押圧部材を非接触により加熱可能な加熱機構と、 前記振動子を冷却可能な冷却機構と、 前記加熱機構及び前記冷却機構を駆動制御して温度制御
可能な構成としたボンディングヘッドを備え、 前記ボンディングヘッドを駆動する圧接機構と、 前記ボンディングヘッド及び前記圧接機構の制御を行う
制御手段とを有することを特徴とするボンディング装
置。9. A bonding apparatus having a bonding head for applying an ultrasonic vibration to join an object to be joined and a member to be joined, a vibrator for generating an ultrasonic vibration, and one wavelength of the ultrasonic vibration. A first vibration transmission unit having a length of λ / 2 in the traveling direction of the ultrasonic vibration, where
A second vibration transmitting unit coupled between the first vibration transmitting unit and the vibrator and having a length of λ / 4 in the traveling direction; and a second vibration transmitting unit coupled to the other end of the first vibration transmitting unit. A vibration transmitting member having a third vibration transmitting portion having a length of λ / 4 in the traveling direction; and a vibration transmitting member provided at a position of a node of ultrasonic vibration by supporting both ends of the first vibration transmitting portion. A supporting member having a first supporting member and a second supporting member; a pressing member that abuts against and presses the joining object at a position of an antinode of ultrasonic vibration in the first vibration transmitting unit; A heating mechanism capable of heating the member in a non-contact manner, a cooling mechanism capable of cooling the vibrator, a bonding head configured to control the temperature by controlling the driving of the heating mechanism and the cooling mechanism, A pressure contact mechanism for driving the Bonding apparatus characterized by a control means for controlling the loading head and the pressing mechanism.
JP2000308113A 2000-10-06 2000-10-06 Bonding head and bonding apparatus provided therewith Pending JP2002118152A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000308113A JP2002118152A (en) 2000-10-06 2000-10-06 Bonding head and bonding apparatus provided therewith

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000308113A JP2002118152A (en) 2000-10-06 2000-10-06 Bonding head and bonding apparatus provided therewith

Publications (1)

Publication Number Publication Date
JP2002118152A true JP2002118152A (en) 2002-04-19

Family

ID=18788489

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000308113A Pending JP2002118152A (en) 2000-10-06 2000-10-06 Bonding head and bonding apparatus provided therewith

Country Status (1)

Country Link
JP (1) JP2002118152A (en)

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006173423A (en) * 2004-12-17 2006-06-29 Nec Corp Ultrasonic horn and bonding device using the same
JP2006339198A (en) * 2005-05-31 2006-12-14 Toray Eng Co Ltd Ultrasonic bonding horn and ultrasonic bonding apparatus using same
JP2007129123A (en) * 2005-11-07 2007-05-24 Matsushita Electric Ind Co Ltd Apparatus and method for mounting electronic component, and ultrasonic vibration device
WO2007129700A1 (en) * 2006-05-09 2007-11-15 Panasonic Corporation Electronic part mounting head, electronic part mounting apparatus, and electronic part mounting method
JP2008130793A (en) * 2006-11-21 2008-06-05 Athlete Fa Kk Ultrasonic bonding device
WO2009125748A1 (en) * 2008-04-07 2009-10-15 株式会社アドウェルズ Support device for resonator
JP2010050465A (en) * 2009-09-11 2010-03-04 Tdk Corp Mounting device for using supersonic vibration to mount mounting component on mounted component
JP2010264409A (en) * 2009-05-18 2010-11-25 Isomura Hosui Kiko Co Ltd Tilting tube unit and method of producing the same
EP2327534A1 (en) * 2009-11-25 2011-06-01 Telsonic Holding AG Method and device for welding workpieces
TWI392039B (en) * 2009-05-26 2013-04-01 Adwelds Corp Supporting device of resonator
KR101771875B1 (en) * 2017-03-16 2017-08-28 임준수 Ultrasonic Sewing Machine Having Function of Cooling
JP2019102762A (en) * 2017-12-08 2019-06-24 パナソニックＩｐマネジメント株式会社 Joint device, joint tool and manufacturing method of joint tool
WO2021047733A1 (en) * 2019-09-11 2021-03-18 Hesse Gmbh Method for producing an electrically conductive connection
WO2021047734A1 (en) * 2019-09-11 2021-03-18 Hesse Gmbh Device for heating and determining an actual temperature of a bonding tool of an ultrasonic bonding device
WO2021089155A1 (en) * 2019-11-07 2021-05-14 Schunk Sonosystems Gmbh Ultrasonic welding apparatus with cooling for oscillator arrangement
US20220193815A1 (en) * 2019-09-11 2022-06-23 Hesse Gmbh Bonding arrangement and bonding tool
US20220193816A1 (en) * 2019-09-11 2022-06-23 Hesse Gmbh Ultrasonic tool and ultrasonic connection device herein

Cited By (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4626292B2 (en) * 2004-12-17 2011-02-02 日本電気株式会社 Ultrasonic horn and bonding device using the same
JP2006173423A (en) * 2004-12-17 2006-06-29 Nec Corp Ultrasonic horn and bonding device using the same
JP2006339198A (en) * 2005-05-31 2006-12-14 Toray Eng Co Ltd Ultrasonic bonding horn and ultrasonic bonding apparatus using same
JP2007129123A (en) * 2005-11-07 2007-05-24 Matsushita Electric Ind Co Ltd Apparatus and method for mounting electronic component, and ultrasonic vibration device
JP4609280B2 (en) * 2005-11-07 2011-01-12 パナソニック株式会社 Electronic component mounting apparatus, electronic component mounting method, and ultrasonic vibration device
WO2007129700A1 (en) * 2006-05-09 2007-11-15 Panasonic Corporation Electronic part mounting head, electronic part mounting apparatus, and electronic part mounting method
US7980444B2 (en) 2006-05-09 2011-07-19 Panasonic Corporation Electronic component mounting head, and apparatus and method for mounting electronic component
JPWO2007129700A1 (en) * 2006-05-09 2009-09-17 パナソニック株式会社 Electronic component mounting head, electronic component mounting apparatus, and electronic component mounting method
CN101310580B (en) * 2006-05-09 2011-06-22 松下电器产业株式会社 Electronic part mounting head, electronic part mounting apparatus, and electronic part mounting method
JP4700060B2 (en) * 2006-05-09 2011-06-15 パナソニック株式会社 Electronic component mounting head, electronic component mounting apparatus, and electronic component mounting method
JP2008130793A (en) * 2006-11-21 2008-06-05 Athlete Fa Kk Ultrasonic bonding device
EP2267765A4 (en) * 2008-04-07 2016-09-14 Adwelds Corp Support device for resonator
WO2009125748A1 (en) * 2008-04-07 2009-10-15 株式会社アドウェルズ Support device for resonator
KR101161724B1 (en) 2008-04-07 2012-07-04 애드웰즈 코퍼레이션 Support device for resonator
CN101978484B (en) * 2008-04-07 2012-07-25 阿德威尔斯股份有限公司 Support device for resonator
US8353442B2 (en) 2008-04-07 2013-01-15 Adwelds Corporation Support device for resonator
JP2010264409A (en) * 2009-05-18 2010-11-25 Isomura Hosui Kiko Co Ltd Tilting tube unit and method of producing the same
TWI392039B (en) * 2009-05-26 2013-04-01 Adwelds Corp Supporting device of resonator
JP2010050465A (en) * 2009-09-11 2010-03-04 Tdk Corp Mounting device for using supersonic vibration to mount mounting component on mounted component
EP2327534A1 (en) * 2009-11-25 2011-06-01 Telsonic Holding AG Method and device for welding workpieces
KR101771875B1 (en) * 2017-03-16 2017-08-28 임준수 Ultrasonic Sewing Machine Having Function of Cooling
JP2019102762A (en) * 2017-12-08 2019-06-24 パナソニックＩｐマネジメント株式会社 Joint device, joint tool and manufacturing method of joint tool
WO2021047733A1 (en) * 2019-09-11 2021-03-18 Hesse Gmbh Method for producing an electrically conductive connection
WO2021047734A1 (en) * 2019-09-11 2021-03-18 Hesse Gmbh Device for heating and determining an actual temperature of a bonding tool of an ultrasonic bonding device
US20220193815A1 (en) * 2019-09-11 2022-06-23 Hesse Gmbh Bonding arrangement and bonding tool
US20220193816A1 (en) * 2019-09-11 2022-06-23 Hesse Gmbh Ultrasonic tool and ultrasonic connection device herein
WO2021089155A1 (en) * 2019-11-07 2021-05-14 Schunk Sonosystems Gmbh Ultrasonic welding apparatus with cooling for oscillator arrangement
CN114641366A (en) * 2019-11-07 2022-06-17 崇德超声波有限公司 Ultrasonic welding device with function of cooling oscillator assembly
JP7350169B2 (en) 2019-11-07 2023-09-25 シュンク ソノジステム ゲゼルシャフト ミット ベシュレンクテル ハフツング Ultrasonic welding equipment with cooling for oscillator placement
US11845140B2 (en) 2019-11-07 2023-12-19 Schunk Sonosystems Gmbh Ultrasonic welding device with cooling for oscillator assembly
CN114641366B (en) * 2019-11-07 2024-02-23 崇德超声波有限公司 Ultrasonic welding device with function of cooling oscillator assembly

Similar Documents

Publication Publication Date Title
JP2002118152A (en) Bonding head and bonding apparatus provided therewith
US20070257087A1 (en) Ultrasonic press using servo motor with integrated linear actuator
TW200305472A (en) Component mounting method, component mounting apparatus, and ultrasonic bonding head
US20100140326A1 (en) Bonding tool, electronic component mounting apparatus and electronic component mounting method
US7156281B2 (en) Bonding device and bonding tool
US3158928A (en) Method and means for operating a generating means coupled through a transducer to a vibratory energy work performing device
US20220194023A1 (en) Ultrasonic Joining Method and Arrangement
JPH0964081A (en) Method and device for mounting semiconductor
JP4093781B2 (en) Ultrasonic head
JP2002067162A (en) Bonding head, and bonding device equipped with the same
JP3664155B2 (en) Electronic component bonding apparatus and bonding tool
JP4056276B2 (en) Component mounting method and apparatus
JP2006339198A (en) Ultrasonic bonding horn and ultrasonic bonding apparatus using same
JP2004167435A (en) Ultrasonic horn for bonding and bonding device provided with the same
JP3533992B2 (en) Bonding device and bonding tool for electronic components
US20060113351A1 (en) Ultrasonic head
JP3346272B2 (en) Electronic component bonding tool
JP3683655B2 (en) Bonding medium application device
JP4109000B2 (en) Electronic component mounting equipment
JP4646862B2 (en) Semiconductor chip ultrasonic bonding method and ultrasonic bonding apparatus therefor
JP4651232B2 (en) Soldering apparatus and method
JP3560584B2 (en) Ultrasonic welding equipment
JP2004095810A (en) Bonding apparatus and bonding tool of electronic component
JP2005238268A (en) Ultrasonic joining method and device, and ultrasonic amplitude control method
US20220194014A1 (en) Method for producing an electrically conductive connection