JP2002118025A - Cutting method using wire saw - Google Patents

Cutting method using wire saw

Info

Publication number
JP2002118025A
JP2002118025A JP2000305630A JP2000305630A JP2002118025A JP 2002118025 A JP2002118025 A JP 2002118025A JP 2000305630 A JP2000305630 A JP 2000305630A JP 2000305630 A JP2000305630 A JP 2000305630A JP 2002118025 A JP2002118025 A JP 2002118025A
Authority
JP
Japan
Prior art keywords
magnet
wire
adjacent
wire saw
magnet block
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000305630A
Other languages
Japanese (ja)
Other versions
JP4604330B2 (en
Inventor
Naoyoshi Sasaki
直義 佐々木
Ryotaro Sasaki
亮太郎 佐々木
Toshibumi Oketani
俊文 桶谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDK Corp filed Critical TDK Corp
Priority to JP2000305630A priority Critical patent/JP4604330B2/en
Publication of JP2002118025A publication Critical patent/JP2002118025A/en
Application granted granted Critical
Publication of JP4604330B2 publication Critical patent/JP4604330B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

PROBLEM TO BE SOLVED: To prevent magnet pieces containing no adjoining surface from becoming inaccurate in thickness due to the fact that a wire is fitted in the adjoining surfaces of adjacent magnet blocks and getting to run unstably, and resultantly adjacent wires becoming unstable in running also, in a method where a plurality of magnet blocks are arranged into a magnet train, composed of the magnet blocks whose adjacent surfaces are brought into contact with each other, and the magnet train is made to bear against a plurality of wires which run rectilinearly in parallel and cut out into a plurality of magnet pieces at the same time. SOLUTION: A method of cutting a magnet block with a wire saw is carried out with the steps which include a glass plate 11 being pasted on a processing jig 12, a plurality of magnet blocks are pasted on the undersurface of the glass plate 11 to make a magnet train 10, the adjoining surfaces of the magnet blocks are tilted, set arcuate or made rugged surfaces to be engaged with each other so as not to coincide with the direction in which a wire 3 runs rectilinearly, and the wire 3 is prevented from being fitted into the adjoining surfaces.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、Nd−Fe−B系
の焼結型永久磁石の製造方法に係り、所定の大きさに成
形し焼結した磁石用ブロックを分割切断するが、これら
の磁石用ブロックを複数個並べて保持し複数のワイヤが
同時に分割切断するワイヤソーによる切断方法に関す
る。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a sintered permanent magnet of the Nd--Fe--B type, and cuts and cuts a magnet block molded and sintered to a predetermined size. The present invention relates to a cutting method using a wire saw in which a plurality of magnet blocks are arranged and held, and a plurality of wires are divided and cut simultaneously.

【0002】[0002]

【従来の技術】情報機器の小型化や薄型化に伴い、小さ
い形状や薄い形状をした永久磁石の需要が急増してい
る、なかでも、強力な磁化が可能で比較的コストが低い
Nd−Fe−B系の焼結型永久磁石は、ハードデイスク
のヘッド駆動用磁石として用いられる、図8に示す磁石
片1はヘッド駆動用磁石とする中間製品であり、磁石片
1に表面処理しメッキを施し着磁するとヘッド駆動用磁
石になる、この磁石片1は図7に示す磁石用ブロック1
00を所定の厚みに切断したものである、磁石用ブロッ
ク100は微粉砕後の粉体をプレス成形し焼結したもの
であり、ワイヤソーの被加工物取り付け部に着脱自在な
加工治具にガラス板の一面を貼着し、このガラス板の他
面に磁石用ブロック100を複数個並べて貼着し磁石列
10とする、加工治具をワイヤソーの被加工物取り付け
部に装着し切断する、複数のワイヤが同時に磁石列10
の磁石用ブロック100を切断する、図6はガラス板1
1に磁石用ブロック100を貼着した状態であり、磁石
用ブロック100を図7に示す矢印Aの方向から見て示
す、相互に隣接する磁石用ブロック100も貼着し磁石
列10とするが、隣接部101はガラス板11の長手方
向に直交している、磁石用ブロック100を切断するワ
イヤもガラス板11の長手方向に直交しており、ワイヤ
ソーにおいて隣接部101と切断するワイヤは平行であ
る。
2. Description of the Related Art As information devices become smaller and thinner, the demand for permanent magnets having a small or thin shape is rapidly increasing. In particular, Nd-Fe, which can provide strong magnetization and has a relatively low cost, is available. -B type sintered permanent magnet is used as a head magnet for driving a hard disk. The magnet piece 1 shown in FIG. 8 is an intermediate product used as a head driving magnet, and the magnet piece 1 is subjected to surface treatment and plating. When magnetized, it becomes a head driving magnet. This magnet piece 1 is a magnet block 1 shown in FIG.
00 is cut into a predetermined thickness. The magnet block 100 is formed by press-molding and sintering powder after fine pulverization, and a glass jig is detachably attached to a workpiece attachment portion of a wire saw. One surface of the plate is adhered, a plurality of magnet blocks 100 are arranged and adhered to the other surface of the glass plate to form a magnet row 10, and a processing jig is attached to a workpiece mounting portion of a wire saw and cut. Of the same row of magnets 10
The magnet block 100 is cut, and FIG.
1 is a state in which the magnet block 100 is adhered, and the magnet blocks 100 which are shown when the magnet block 100 is viewed from the direction of the arrow A shown in FIG. The adjacent portion 101 is orthogonal to the longitudinal direction of the glass plate 11, the wire for cutting the magnet block 100 is also orthogonal to the longitudinal direction of the glass plate 11, and the wire for cutting the adjacent portion 101 in the wire saw is parallel. is there.

【0003】ところで、1個の磁石用ブロック100は
例えば10乃至30個の磁石片1に切断する、磁石片1
の厚みにより切断する個数は増減することになり、複数
のワイヤが同時に磁石列10の磁石用ブロック100を
切断する、予め、磁石列10の端部は除くことにして磁
石片1にしないが、隣接部101に関して厚みのばらつ
きに相違が生じる、一例を示すと、磁石列10の両端部
を除いて計125個に切断して厚みを測定し、そのサン
プルを隣接部101に関して同一条件の母集団毎にばら
つきを調べると、隣接部101を含む第1サンプルの母
集団はσ=138μm、第1サンプルに隣接するサンプ
ルだけでなる第2サンプルの母集団はσ=12μm、そ
れ以外の第3サンプルの母集団はσ=5μmであった、
まず、第1サンプルに該当する部分は磁石列10の端部
と同じく磁石片1に適さない、第3サンプルに該当する
部分は最もばらつきが小さく追加工無しで磁石片1に適
する、問題は第2サンプルに該当する部分であり、必要
な厚み精度に応じて追加工を施さないと磁石片1に適さ
ない、追加工は追加の工程と時間を要し、コストが嵩み
納期を長くする問題が生じることになる。
By the way, one magnet block 100 is cut into, for example, 10 to 30 magnet pieces 1.
The number of cuts will increase or decrease depending on the thickness of the magnets, and a plurality of wires cut the magnet block 100 of the magnet row 10 at the same time. As an example, there is a difference in the variation in the thickness with respect to the adjacent portion 101. For example, the thickness is measured by cutting the magnet array 10 into a total of 125 pieces except for both ends, and the sample is subjected to the population of the adjacent portion 101 under the same condition. When the variation is examined every time, the population of the first sample including the adjacent portion 101 is σ = 138 μm, the population of the second sample including only the sample adjacent to the first sample is σ = 12 μm, and the other third sample is Was σ = 5 μm,
First, the portion corresponding to the first sample is not suitable for the magnet piece 1 like the end of the magnet row 10, and the portion corresponding to the third sample has the smallest variation and is suitable for the magnet piece 1 without additional processing. It is a part corresponding to 2 samples and is not suitable for the magnet piece 1 unless additional processing is performed according to the required thickness accuracy. The additional processing requires additional steps and time, increases the cost, and prolongs the delivery time. Will occur.

【0004】[0004]

【発明が解決しようとする課題】本発明は、上記のよう
な従来の技術における問題点を解決するためになされた
ものである、従って、本発明が解決しようとする課題
は、第2サンプルに該当する部分の厚みばらつきを第3
サンプルと同程度にすること、そのため、第2サンプル
に該当する部分の厚みばらつきが生じない、切断精度の
良いワイヤソーによる切断方法を提供することにある。
SUMMARY OF THE INVENTION The present invention has been made to solve the problems in the prior art as described above. Therefore, the problem to be solved by the present invention is to Third variation in the thickness of the corresponding part
An object of the present invention is to provide a cutting method using a wire saw with high cutting accuracy, which does not cause variation in thickness of a portion corresponding to the second sample.

【0005】[0005]

【課題を解決するための手段】上記目的を達成するため
に本発明の請求項1に記載の発明は、複数の磁石用ブロ
ックを相互に隣接する面が接する磁石列となし、前記磁
石列を直線状に平行走行する複数のワイヤに当接して同
時に複数の磁石片に切断する方法において、前記磁石用
ブロックの相互に隣接する面を前記ワイヤが直線状に走
行する方向と一致させないことを特徴とするワイヤソー
による切断方法としている。
In order to achieve the above object, according to the first aspect of the present invention, a plurality of magnet blocks are formed as a magnet row in which adjacent surfaces are in contact with each other, and the magnet row is formed. In a method of simultaneously cutting a plurality of magnet pieces while abutting on a plurality of wires running in a straight line in parallel, the mutually adjacent surfaces of the magnet block are not matched with the direction in which the wires run in a straight line. Cutting method using a wire saw.

【0006】請求項2に記載の発明は、前記磁石用ブロ
ックの相互に隣接する面を前記ワイヤが直線状に走行す
る方向と傾斜させる請求項1記載のワイヤソーによる切
断方法としている。
According to a second aspect of the present invention, there is provided a cutting method using a wire saw according to the first aspect, wherein the mutually adjacent surfaces of the magnet block are inclined with respect to a direction in which the wire travels linearly.

【0007】請求項3に記載の発明は、前記磁石用ブロ
ックの相互に隣接する面を円弧形状にする請求項1記載
のワイヤソーによる切断方法としている。
According to a third aspect of the present invention, there is provided a cutting method using a wire saw according to the first aspect, wherein mutually adjacent surfaces of the magnet block are formed in an arc shape.

【0008】請求項4に記載の発明は、前記磁石用ブロ
ックの相互に隣接する面を複数の凹凸形状が噛み合う形
状とする請求項1記載のワイヤソーによる切断方法とし
ている。
According to a fourth aspect of the present invention, there is provided the cutting method using a wire saw according to the first aspect, wherein the mutually adjacent surfaces of the magnet block have a shape in which a plurality of concave and convex shapes are engaged.

【0009】[0009]

【発明の実施の形態】以下、本発明の実施の形態につい
て説明する、図1は本発明の切断方法を実施するワイヤ
ソー7の説明図であり、図2はワイヤソー7の被加工物
取り付け部に装着する加工治具12を示し、加工治具1
2にガラス板11を貼着し、ガラス板11に磁石用ブロ
ックを貼着して磁石列10とする構成を示し、図1にお
ける矢印Xの方向から見た側面図である、図2の矢印A
は磁石用ブロックの方向を示し、図7に示す磁石用ブロ
ック100の矢印Aと磁石用ブロックに対し同じ方向を
示す、磁石用ブロック100の場合は図7に示す姿勢と
上下反対に貼着されていることを示す、これから説明す
る他の磁石用ブロックについても同じである、図3乃至
図5は本発明の切断方法の磁石列10により実施の形態
を示す説明図である。
DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment of the present invention will be described. FIG. 1 is an explanatory view of a wire saw 7 for carrying out a cutting method of the present invention, and FIG. The processing jig 12 to be mounted is shown, and the processing jig 1
2 shows a configuration in which a glass plate 11 is adhered to 2 and a magnet block is adhered to the glass plate 11 to form a magnet row 10, and is a side view seen from the direction of arrow X in FIG. A
Indicates the direction of the magnet block, and indicates the same direction as the arrow A of the magnet block 100 shown in FIG. 7 with respect to the magnet block. In the case of the magnet block 100, the magnet block 100 is stuck upside down with the posture shown in FIG. 3 to 5 are explanatory views showing an embodiment using a magnet array 10 of the cutting method of the present invention.

【0010】図1はワイヤソー7の主要な構成を示す説
明図である、繰り出しリール4に巻かれたワイヤ3をガ
イドローラ6で保持しながら引き出し、相互に平行かつ
回転自在に配置された3本の溝付きローラ2に巻回す
る、ローラ2には複数列に矢印Fの方向に平行走行する
ワイヤ3が架けられる、ローラ2を巻回したワイヤ3は
ガイドローラ6で保持しながら引き出して巻き取りリー
ル5に巻き取る、ワイヤ3と3本の溝付きローラ2によ
り形作られる三角形の上部1辺に対し、ワイヤソー7の
被加工物取り付け部は平行走行するワイヤ3に直交する
上方から昇降する、被加工物取り付け部に装着された加
工治具12にはガラス板11と磁石列10が貼着されて
おり、矢印Dの方向に下降させると、磁石列10はワイ
ヤ3の走行方向に長手方向が直交する姿勢で平行走行す
るワイヤ3に当接する、磁石列10がワイヤ3に当接し
てから磁石片1に切断される方法は従来と同じであり、
磁石列10がワイヤ3に当接し押し付けられた状態で、
当接した部分に遊離砥粒を含む加工液を流しながらワイ
ヤ3が走行することで切断する。
FIG. 1 is an explanatory view showing the main structure of a wire saw 7. The wire 3 wound around a pay-out reel 4 is pulled out while being held by a guide roller 6, and three wires 3 are arranged in a mutually parallel and rotatable manner. A plurality of wires 3 running parallel to the direction of arrow F are wound around the roller 2. The wire 3 wound around the roller 2 is pulled out and wound while being held by the guide roller 6. The workpiece mounting portion of the wire saw 7 moves up and down from the upper side orthogonal to the parallel running wire 3 with respect to one upper side of a triangle formed by the wire 3 and the three grooved rollers 2, which is wound around the take-up reel 5. A glass plate 11 and a magnet array 10 are attached to a processing jig 12 attached to a workpiece mounting portion. When the magnet array 10 is lowered in the direction of arrow D, the magnet array 10 is elongated in the traveling direction of the wire 3. It abuts the wire 3 parallel running in a posture in which directions are perpendicular to, a method of the magnet array 10 is disconnected from the contact with the wire 3 to the magnet element 1 is the same as the prior art,
In a state where the magnet array 10 is pressed against the wire 3,
The wire 3 travels and cuts while a working liquid containing free abrasive grains flows in the abutted portion.

【0011】図3乃至図5は本発明の切断方法による磁
石列10を示す、図3はガラス板11に磁石用ブロック
200を貼着した状態であり、磁石用ブロック200の
相互に隣接する面も貼着し磁石列10とするが、直線状
の隣接部201はガラス板11の長手方向に対し傾斜さ
せている、磁石用ブロック200を切断するワイヤ3は
ガラス板11の長手方向に直交しており、ワイヤ3に対
して隣接部201は傾斜していることになる。
FIGS. 3 to 5 show a magnet array 10 according to the cutting method of the present invention. FIG. 3 shows a state in which a magnet block 200 is adhered to a glass plate 11, and the surfaces of the magnet block 200 adjacent to each other. Also, the magnet row 10 is adhered, but the linear adjacent portion 201 is inclined with respect to the longitudinal direction of the glass plate 11. The wire 3 for cutting the magnet block 200 is orthogonal to the longitudinal direction of the glass plate 11. Therefore, the adjacent portion 201 is inclined with respect to the wire 3.

【0012】図4はガラス板11に磁石用ブロック30
0を貼着した状態を示す、磁石用ブロック300の相互
に隣接する面も貼着し磁石列10とするが、隣接部30
1は円弧形状をしており、相互に隣接する磁石用ブロッ
ク300は円弧形状の隣接する面を一致させる、すなわ
ち、一方が凸状の円弧形状は他方が凹状の円弧形状で隣
接する面を一致させる、磁石用ブロック300を切断す
るワイヤ3はガラス板11の長手方向に直交する直線状
であり、ワイヤ3に対し円弧形状の隣接部301は直線
と円弧が当接し一致しない。
FIG. 4 shows a magnet block 30 on a glass plate 11.
0, the surfaces adjacent to each other of the magnet block 300 are also attached to form the magnet row 10.
1 has an arc shape, and mutually adjacent magnet blocks 300 match the adjacent surfaces of the arc shape, that is, one convex arc shape matches the adjacent surface with the concave arc shape of the other. The wire 3 that cuts the magnet block 300 is a straight line perpendicular to the longitudinal direction of the glass plate 11, and the arc-shaped adjacent portion 301 of the wire 3 is in contact with the straight line and the arc, and does not match.

【0013】図5はガラス板11に磁石用ブロック40
0を貼着した状態を示す、磁石用ブロック400の相互
に隣接する面も貼着し磁石列10とするが、隣接部40
1は複数の凹凸形状が噛み合う形状をしており、相互に
隣接する磁石用ブロック400は凹凸形状の隣接する面
を一致させる、すなわち、一方の凹形状に他方の凸形状
が嵌合し隣接する面の全てを一致させる、磁石用ブロッ
ク400を切断するワイヤ3はガラス板11の長手方向
に直交する直線状であり、ワイヤ3に対し隣接部401
は隣接する面の全てが一致して平行になることが生じな
い。
FIG. 5 shows a magnet block 40 on a glass plate 11.
0, the surfaces adjacent to each other of the magnet block 400 are also attached to form the magnet row 10, but the adjacent portion 40
Reference numeral 1 denotes a shape in which a plurality of concave and convex shapes are meshed with each other, and mutually adjacent magnet blocks 400 make the adjacent surfaces of the concave and convex shapes coincide, that is, one convex shape is fitted to the other convex shape and adjacent to each other. The wire 3 that cuts the magnet block 400 so that all of its surfaces coincide with each other is a straight line orthogonal to the longitudinal direction of the glass plate 11, and the adjacent portion 401 to the wire 3.
Does not occur that all of the adjacent planes coincide and become parallel.

【0014】図3乃至図5に示す実施の形態において、
隣接部201,301,401はワイヤソー7のワイヤ
3に対し隣接する面の全てが一致して平行になる関係を
生じない、従来の隣接部101がワイヤ3に平行になる
ことから、隣接部101と位置が一致するか最も近いワ
イヤ3の走行を阻害していた、すなわち、発明者らの観
察によるとワイヤ3は隣接部101に嵌入し易く、嵌入
すると隣接部101に沿いワイヤ3が走行し、ワイヤ3
の走行は嵌入した隣接部101に阻害される、隣接部1
01が本来ワイヤ3が走行する位置と完全に一致するこ
とはほとんどなく、ワイヤ3の走行は異なる位置にずれ
て直線状にも走行しないことが見られる、そのため、隣
接部101に嵌入したワイヤ3の不安定な走行が両隣を
走行するワイヤ3まで影響する、両隣のワイヤ3の走行
までも不安定になると、第2サンプルに該当する部分の
磁石片1に厚みのばらつきが生じる、本発明の切断方法
による隣接部201,301,401はワイヤ3が嵌入
することなく、両隣のワイヤ3の走行が不安定になるこ
とを防止できる、なお、相互に隣接する磁石用ブロック
は隣接する面を一致させると説明したが、磁石用ブロッ
クは粉体を成形し焼結したものであり、所定の形状誤差
を有し完全に一致させることは難しいものである、しか
し、磁石用ブロックが所定の形状誤差を有するものであ
っても、本発明の実施とその効果が得られることに変わ
りはない。
In the embodiment shown in FIGS. 3 to 5,
The adjacent portions 201, 301, and 401 do not have a relationship in which all surfaces adjacent to the wire 3 of the wire saw 7 coincide with each other and become parallel. The conventional adjacent portion 101 is parallel to the wire 3. In other words, according to observations by the inventors, the wire 3 is easily fitted into the adjacent portion 101, and when fitted, the wire 3 runs along the adjacent portion 101. , Wire 3
Is hindered by the fitted adjacent portion 101, the adjacent portion 1
01 rarely completely coincides with the position where the wire 3 originally travels, and it can be seen that the travel of the wire 3 is shifted to a different position and does not travel linearly. Of the present invention, the unstable running of the magnet affects the wires 3 running on both sides. If the running of the wires 3 on both sides becomes unstable, the thickness of the magnet piece 1 corresponding to the second sample varies. The adjacent portions 201, 301, and 401 formed by the cutting method can prevent the wires 3 from being fitted into each other, thereby preventing the running of the wires 3 on both sides from becoming unstable. As described above, the magnet block is formed by molding and sintering powder, and has a predetermined shape error and is difficult to completely match. There also have a predetermined shape error, it remains that implementation and its effects of the present invention can be obtained not.

【0015】[0015]

【発明の効果】本発明のワイヤソーによる切断方法によ
ると、複数の磁石用ブロックを相互に隣接する面で接す
る磁石列となし、この磁石列を複数のワイヤが同時に分
割切断しても、磁石用ブロックが相互に隣接する面と面
の間の隣接部にワイヤが嵌入することなく走行が安定
し、該ワイヤの両隣のワイヤも走行が安定する、そのた
め、従来は厚みのばらつきが生じていた第2サンプルに
該当する部分の磁石片にもばらつきがなく、磁石列の両
端部と隣接部を含む部分を除外した磁石片は、追加工を
施さなくても磁石片に適する厚み精度とばらつきが得ら
れる、その結果、追加の工程と時間が不要になりコスト
が節約でき納期を長くしない効果が生じる。
According to the cutting method using a wire saw of the present invention, a plurality of blocks for magnets are formed as magnet rows that are in contact with surfaces adjacent to each other. The running is stable without the wires being inserted into the adjacent portions between the surfaces where the blocks are adjacent to each other, and the running of the wires on both sides of the wires is also stable. There is no variation in the magnet pieces corresponding to the two samples, and the magnet pieces excluding the portions including both ends and adjacent portions of the magnet row have thickness accuracy and variation suitable for the magnet pieces without additional processing. As a result, an additional process and time are not required, so that the cost is saved and the delivery time is not lengthened.

【図面の簡単な説明】[Brief description of the drawings]

【図1】 ワイヤソーの主要な構成を示す説明図。FIG. 1 is an explanatory diagram showing a main configuration of a wire saw.

【図2】 ワイヤソーの被加工物取り付け部に装着する
加工治具。
FIG. 2 is a processing jig to be attached to a workpiece attachment portion of a wire saw.

【図3】 磁石用ブロックの相互に隣接する面を傾斜さ
せる磁石列。
FIG. 3 is a magnet row in which mutually adjacent surfaces of a magnet block are inclined.

【図4】 磁石用ブロックの相互に隣接する面を円弧状
にする磁石列。
FIG. 4 is a magnet row in which mutually adjacent surfaces of a magnet block are formed in an arc shape.

【図5】 磁石用ブロックの相互に隣接する面を凹凸が
噛み合う形状とする磁石列。
FIG. 5 is a diagram showing a magnet array in which the mutually adjacent surfaces of the magnet block have a shape in which irregularities mesh with each other.

【図6】 磁石用ブロックの相互に隣接する面がワイヤ
と平行な従来の磁石列。
FIG. 6 shows a conventional magnet array in which mutually adjacent surfaces of a magnet block are parallel to wires.

【図7】 磁石用ブロックの斜視図。FIG. 7 is a perspective view of a magnet block.

【図8】 磁石片の斜視図。FIG. 8 is a perspective view of a magnet piece.

【符号の説明】[Explanation of symbols]

1 磁石片 2 ローラ 3 ワイヤ 4 繰り出しリール 5 巻き取りリール 6 ガイドローラ 7 ワイヤソー 10 磁石列 11 ガラス板 12 加工治具 100,200,300,400 磁石用ブロック 101,201,301,401 隣接部 A 磁石用ブロックの方向を示す矢印。 D 加工治具を下降させる方向の矢印。 F ワイヤが平行走行する方向の矢印。 X 図2に示す加工治具の図1における矢視方向。 DESCRIPTION OF SYMBOLS 1 Magnet piece 2 Roller 3 Wire 4 Feeding reel 5 Take-up reel 6 Guide roller 7 Wire saw 10 Magnet row 11 Glass plate 12 Processing jig 100, 200, 300, 400 Magnet block 101, 201, 301, 401 Adjacent part A magnet Arrow indicating the direction of the application block. D Arrow in the direction to lower the processing jig. F Arrow in the direction in which the wires travel in parallel. X The direction of the processing jig shown in FIG.

───────────────────────────────────────────────────── フロントページの続き Fターム(参考) 3C058 AA05 AA07 AA11 AA16 AB04 AC04 BA02 BA07 CA02 DA03 5E062 CE01 CG01  ────────────────────────────────────────────────── ─── Continued on the front page F term (reference) 3C058 AA05 AA07 AA11 AA16 AB04 AC04 BA02 BA07 CA02 DA03 5E062 CE01 CG01

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 複数の磁石用ブロックを相互に隣接する
面が接する磁石列となし、前記磁石列を直線状に平行走
行する複数のワイヤに当接して同時に複数の磁石片に切
断する方法において、前記磁石用ブロックの相互に隣接
する面を前記ワイヤが直線状に走行する方向と一致させ
ないことを特徴とするワイヤソーによる切断方法。
1. A method of cutting a plurality of magnet blocks into a plurality of magnet pieces by simultaneously forming a plurality of magnet blocks into a magnet row whose surfaces adjacent to each other are in contact with each other and abutting the magnet row on a plurality of wires running in a straight line in parallel. A cutting method using a wire saw, wherein surfaces adjacent to each other of the magnet block are not made to coincide with a direction in which the wire travels linearly.
【請求項2】 前記磁石用ブロックの相互に隣接する面
を前記ワイヤが直線状に走行する方向と傾斜させる請求
項1記載のワイヤソーによる切断方法。
2. The cutting method using a wire saw according to claim 1, wherein the mutually adjacent surfaces of the magnet block are inclined with respect to a direction in which the wire travels linearly.
【請求項3】 前記磁石用ブロックの相互に隣接する面
を円弧形状にする請求項1記載のワイヤソーによる切断
方法。
3. The cutting method using a wire saw according to claim 1, wherein mutually adjacent surfaces of the magnet block are formed in an arc shape.
【請求項4】 前記磁石用ブロックの相互に隣接する面
を複数の凹凸形状が噛み合う形状とする請求項1記載の
ワイヤソーによる切断方法。
4. The cutting method using a wire saw according to claim 1, wherein the mutually adjacent surfaces of the magnet block have a shape in which a plurality of concave and convex shapes are engaged.
JP2000305630A 2000-10-05 2000-10-05 Cutting method with wire saw Expired - Lifetime JP4604330B2 (en)

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Application Number Priority Date Filing Date Title
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Application Number Priority Date Filing Date Title
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JP2002118025A true JP2002118025A (en) 2002-04-19
JP4604330B2 JP4604330B2 (en) 2011-01-05

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007220197A (en) * 2006-02-16 2007-08-30 Tdk Corp Vcm device and method for manufacturing permanent magnet

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62251062A (en) * 1986-04-23 1987-10-31 Toshiba Corp Cutting location method
JPS6419729A (en) * 1987-07-14 1989-01-23 Kyushu Electron Metal Manufacture of semiconductor wafer
JPH1034639A (en) * 1996-07-25 1998-02-10 Babcock Hitachi Kk Method and device for cutting extrusion-molded body
JPH1058440A (en) * 1996-08-20 1998-03-03 Komatsu Electron Metals Co Ltd Manufacture of semiconductor wafer
JPH10100139A (en) * 1996-04-16 1998-04-21 Charles Hauser Method for orienting a plurality of single crystals aligned and disposed on cut support to simultaneously cut in cutting machine and apparatus for executing the method
JPH1190923A (en) * 1997-09-19 1999-04-06 Hitachi Cable Ltd Cutting method by multiple wire saw
JP2000141199A (en) * 1998-09-01 2000-05-23 Sumitomo Special Metals Co Ltd Cutting method for rare earth alloy by wire saw and manufacture of rare earth alloy plate

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62251062A (en) * 1986-04-23 1987-10-31 Toshiba Corp Cutting location method
JPS6419729A (en) * 1987-07-14 1989-01-23 Kyushu Electron Metal Manufacture of semiconductor wafer
JPH10100139A (en) * 1996-04-16 1998-04-21 Charles Hauser Method for orienting a plurality of single crystals aligned and disposed on cut support to simultaneously cut in cutting machine and apparatus for executing the method
JPH1034639A (en) * 1996-07-25 1998-02-10 Babcock Hitachi Kk Method and device for cutting extrusion-molded body
JPH1058440A (en) * 1996-08-20 1998-03-03 Komatsu Electron Metals Co Ltd Manufacture of semiconductor wafer
JPH1190923A (en) * 1997-09-19 1999-04-06 Hitachi Cable Ltd Cutting method by multiple wire saw
JP2000141199A (en) * 1998-09-01 2000-05-23 Sumitomo Special Metals Co Ltd Cutting method for rare earth alloy by wire saw and manufacture of rare earth alloy plate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007220197A (en) * 2006-02-16 2007-08-30 Tdk Corp Vcm device and method for manufacturing permanent magnet

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