JP2002111218A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2002111218A5 JP2002111218A5 JP2001168059A JP2001168059A JP2002111218A5 JP 2002111218 A5 JP2002111218 A5 JP 2002111218A5 JP 2001168059 A JP2001168059 A JP 2001168059A JP 2001168059 A JP2001168059 A JP 2001168059A JP 2002111218 A5 JP2002111218 A5 JP 2002111218A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001168059A JP2002111218A (ja) | 2000-06-27 | 2001-06-04 | セラミック積層デバイス |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000192265 | 2000-06-27 | ||
| JP2000-192265 | 2000-06-27 | ||
| JP2001168059A JP2002111218A (ja) | 2000-06-27 | 2001-06-04 | セラミック積層デバイス |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002111218A JP2002111218A (ja) | 2002-04-12 |
| JP2002111218A5 true JP2002111218A5 (enrdf_load_stackoverflow) | 2008-03-13 |
Family
ID=26594733
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001168059A Withdrawn JP2002111218A (ja) | 2000-06-27 | 2001-06-04 | セラミック積層デバイス |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002111218A (enrdf_load_stackoverflow) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6985712B2 (en) | 2001-08-27 | 2006-01-10 | Matsushita Electric Industrial Co., Ltd. | RF device and communication apparatus using the same |
| KR100850879B1 (ko) * | 2002-05-15 | 2008-08-07 | 엘지이노텍 주식회사 | 저온 소성 세라믹을 이용한 안테나 스위치 |
| DE10228328A1 (de) * | 2002-06-25 | 2004-01-22 | Epcos Ag | Elektronisches Bauelement mit einem Mehrlagensubstrat und Herstellungsverfahren |
| JP2004055965A (ja) | 2002-07-23 | 2004-02-19 | Seiko Epson Corp | 配線基板及び半導体装置並びにこれらの製造方法、回路基板並びに電子機器 |
| KR20040100395A (ko) * | 2003-05-22 | 2004-12-02 | 주식회사 에이엔티 | Ltcc 적층 커플링을 이용한 fbar 밴드패스 필터 및 듀플렉스 |
| JP2005158770A (ja) * | 2003-11-20 | 2005-06-16 | Matsushita Electric Ind Co Ltd | 積層基板とその製造方法及び前記積層基板を用いたモジュールの製造方法とその製造装置 |
| JP2008130618A (ja) * | 2006-11-16 | 2008-06-05 | Murata Mfg Co Ltd | 多層配線基板 |
| JP2008186962A (ja) * | 2007-01-29 | 2008-08-14 | Murata Mfg Co Ltd | 多層配線基板 |
| JP5273861B2 (ja) * | 2009-04-22 | 2013-08-28 | 太陽誘電株式会社 | 通信モジュール |
| JP5029704B2 (ja) * | 2010-01-20 | 2012-09-19 | 株式会社村田製作所 | 弾性波デュプレクサ |
| JP4947156B2 (ja) * | 2010-01-20 | 2012-06-06 | 株式会社村田製作所 | 弾性波デュプレクサ |
| JP2011216635A (ja) * | 2010-03-31 | 2011-10-27 | Murata Mfg Co Ltd | 電子部品内蔵基板、電子回路モジュール、および電子部品内蔵基板の製造方法 |
| US8558637B2 (en) * | 2010-05-12 | 2013-10-15 | Mediatek Inc. | Circuit device with signal line transition element |
-
2001
- 2001-06-04 JP JP2001168059A patent/JP2002111218A/ja not_active Withdrawn