JP2002103504A - Transparent conductive film - Google Patents
Transparent conductive filmInfo
- Publication number
- JP2002103504A JP2002103504A JP2000303627A JP2000303627A JP2002103504A JP 2002103504 A JP2002103504 A JP 2002103504A JP 2000303627 A JP2000303627 A JP 2000303627A JP 2000303627 A JP2000303627 A JP 2000303627A JP 2002103504 A JP2002103504 A JP 2002103504A
- Authority
- JP
- Japan
- Prior art keywords
- conductive film
- transparent conductive
- film
- layer
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明はハードコート層を有
する透明導電性フィルムに関し、例えばアナログ方式タ
ッチパネルの電極板などに好適なハードコート層付きの
透明導電性フィルムに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a transparent conductive film having a hard coat layer, and more particularly to a transparent conductive film having a hard coat layer suitable for an electrode plate of an analog type touch panel.
【０００２】[0002]
【従来の技術】アナログ式タッチパネルは、例えば銀行
の自動引き落とし機や交通機関の切符販売機等の表示板
に用いられている。このタッチパネルは、透明導電膜を
内側にして透明導電性フィルムをスペーサを介し対向配
置し、透明導電膜の一方に電流を流し他方の透明導電膜
における電圧を計測するようにして、対向する透明導電
膜を指やペン等による押圧操作を介して接触させ、その
接触部分での電流の流れにより位置を検知するようにし
たものであり、通電のために透明導電膜の端部に銀ペー
スト等の導電性ペーストからなるリードが設けらてれ
る。2. Description of the Related Art An analog type touch panel is used for a display panel of, for example, an automatic debit machine at a bank or a ticket vending machine at a transportation facility. In this touch panel, a transparent conductive film is disposed opposite to a transparent conductive film with a spacer interposed therebetween, and a current is applied to one of the transparent conductive films to measure a voltage of the other transparent conductive film. The film is brought into contact through a pressing operation with a finger, a pen, or the like, and the position is detected by a current flow at the contact portion. Leads made of conductive paste are provided.
【０００３】前記のリードは、例えば対向配置の透明導
電性フィルムの表面をフラットに保ちながら、透明導電
膜間に介在させた導電性ペ一ストを１００〜１５０℃で
１〜２時間加熱して硬化処理する方法などにより形成さ
れる。また前記の押圧操作に耐えるようにするため当該
操作面にハードコート層を設けた透明導電性フィルムが
用いられる。The above-mentioned leads are obtained by heating a conductive paste interposed between transparent conductive films at 100 to 150 ° C. for 1 to 2 hours, for example, while keeping the surfaces of the transparent conductive films disposed opposite to each other flat. It is formed by a curing method or the like. Further, in order to withstand the pressing operation, a transparent conductive film having a hard coat layer provided on the operation surface is used.
【０００４】しかしながら、前記の加熱処理により、透
明導電性フィルムの導電膜基材成分が、粘着剤層に拡散
して発生すると思われる画面の視認不良が生じるという
問題がある。[0004] However, there is a problem in that the above-mentioned heat treatment results in poor visibility of the screen, which is considered to be caused by diffusion of the conductive film base component of the transparent conductive film into the pressure-sensitive adhesive layer.
【０００５】[0005]
【発明が解決しようとする課題】本発明は、前記従来の
問題を解決するため、加熱加工時において基材成分が粘
着剤層中に拡散するのを防ぐことにより、画面の視認不
良が生じないハードコート処理層付きの透明導電性フィ
ルムを提供することを目的とする。SUMMARY OF THE INVENTION In order to solve the above-mentioned conventional problems, the present invention prevents the base component from diffusing into the pressure-sensitive adhesive layer during the heating process, thereby preventing the screen from being visually impaired. An object of the present invention is to provide a transparent conductive film having a hard coat treatment layer.
【０００６】[0006]
【課題を解決するための手段】前記目的を達成するた
め、本発明の透明導電性フィルムは、ハードコート層を
有する透明導電性フィルムにおいて、少なくとも一面に
ハードコート層を有するハードコートフィルムと、基材
の一方の面に透明導電膜を設け、他方の面に一層以上の
基材成分拡散防止層を設けた導電フィルムとを、前記基
材成分拡散防止層が粘接着層側になるように接着積層し
たことを特徴とする。In order to achieve the above object, the transparent conductive film of the present invention comprises a transparent conductive film having a hard coat layer, a hard coat film having a hard coat layer on at least one surface, and a base material. Provide a transparent conductive film on one side of the material, a conductive film provided with one or more substrate component diffusion prevention layer on the other surface, such that the substrate component diffusion prevention layer is on the adhesive layer side It is characterized by being bonded and laminated.
【０００７】[0007]
【発明の実施の形態】本発明によれば、導電フィルムの
基材の粘接着層と接する面（透明導電膜側と反対の面）
に一層以上の基材成分拡散防止層を設けることにより、
加熱加工時において導電フィルム基材成分が粘着剤層中
に拡散することを防ぎ、それに起因する視認不良を防ぐ
ことが可能となった。DESCRIPTION OF THE PREFERRED EMBODIMENTS According to the present invention, a surface of a conductive film that is in contact with an adhesive layer (a surface opposite to a transparent conductive film side).
By providing one or more base material component diffusion prevention layers to
It is possible to prevent the conductive film base component from diffusing into the pressure-sensitive adhesive layer at the time of heat processing, and to prevent poor visibility resulting therefrom.
【０００８】基材成分拡散防止層は、透明導電性フィル
ムにおける導電フィルムの接着剤との接着側に設けられ
る。基材成分拡散防止層形成材としては透明な膜を形成
しうる適宜なものを用い、無機物または有機物またはそ
れらの複合材料であっても構わない。その膜厚は好まし
くは０．０１〜２０μｍの範囲である。さらに好ましい
厚さは０．０２〜０．５μｍの範囲である。The base component diffusion preventing layer is provided on the transparent conductive film on the side of the conductive film to be bonded to the adhesive. As the base material component diffusion preventing layer forming material, an appropriate material capable of forming a transparent film is used, and an inorganic or organic material or a composite material thereof may be used. Its thickness is preferably in the range of 0.01 to 20 μm. A more preferred thickness is in the range of 0.02 to 0.5 μm.
【０００９】基材成分拡散防止層を形成するには、コー
ターを用いた塗布法や、スプレー法、スピンコート法、
インラインコート法などが用いられることが多いが、真
空蒸着法、スパッタリング法、イオンプレーティング
法、スプレー熱分解法、化学メッキ法、電気メッキ法と
いった手法が用いられても構わない。In order to form the base component diffusion preventing layer, a coating method using a coater, a spray method, a spin coating method,
Although an in-line coating method or the like is often used, a method such as a vacuum evaporation method, a sputtering method, an ion plating method, a spray pyrolysis method, a chemical plating method, and an electroplating method may be used.
【００１０】コーティング法においてはアクリル系樹
脂、ウレタン系樹脂、メラミン系樹脂、紫外線（ＵＶ）
硬化型樹脂、エポキシ系樹脂等の樹脂成分やこれらとア
ルミナ、シリカ、マイカ等の無機粒子の混合物が使われ
ても良い。或いは高分子基板を２層以上の共押出しによ
り基材成分拡散防止層の機能を持たせても構わない。In the coating method, acrylic resin, urethane resin, melamine resin, ultraviolet (UV)
Resin components such as curable resins and epoxy resins, and mixtures of these with inorganic particles such as alumina, silica and mica may be used. Alternatively, two or more polymer substrates may be coextruded to have the function of a base component diffusion preventing layer.
【００１１】真空蒸着法、スパッタリング法、イオンプ
レーティング法、スプレー熱分解法、化学メッキ法、電
気メッキ法等の手段を用いる場合は、金、銀、白金、パ
ラジウム、銅、アルミニウム、ニッケル、クロム、チタ
ン、鉄、コバルト、錫、これらの合金等からなる金属、
酸化インジウム、酸化スズ、酸化チタン、酸化カドミウ
ム、これらの混合物等からなる金属酸化物、ヨウ化銅等
からなる他の金属化合物を用いることができる。When using means such as vacuum deposition, sputtering, ion plating, spray pyrolysis, chemical plating, and electroplating, gold, silver, platinum, palladium, copper, aluminum, nickel, chromium , Titanium, iron, cobalt, tin, metals composed of these alloys, etc.,
Other metal compounds such as metal oxides composed of indium oxide, tin oxide, titanium oxide, cadmium oxide, a mixture thereof and the like, and copper iodide can be used.
【００１２】次に、本発明の透明導電性フィルムの実施
形態を図１〜２に示す。図１の透明導電性フィルムは、
透明基材（導電膜基材）１２の第１面に透明導電膜１１
を設け、第２面に基材成分拡散防止層１３を設けた導電
フィルム１と、粘着剤層２と、透明基材（ハードコート
基材）３２の両面にハードコート層３１，３３を設けた
ハードコートフィルム（以下「ＨＣフィルム」ともい
う）３とを備え、導電膜基材１２の基材成分拡散防止層
面１３とＨＣフィルム３とを粘着剤層２を介して接着し
たものである。Next, an embodiment of the transparent conductive film of the present invention is shown in FIGS. The transparent conductive film of FIG.
A transparent conductive film 11 is formed on the first surface of a transparent substrate (conductive film substrate) 12.
And a hard coat layer 31, 33 on both sides of a conductive film 1 provided with a base material component diffusion preventing layer 13 on the second surface, an adhesive layer 2, and a transparent base material (hard coat base material) 32. A hard coat film (hereinafter also referred to as an “HC film”) 3 is provided, and the base material component diffusion preventing layer surface 13 of the conductive film base material 12 and the HC film 3 are bonded via the pressure-sensitive adhesive layer 2.
【００１３】図２の透明導電性フィルムは、透明基材
（導電膜基材）１２の第１面に透明導電膜１１を設け、
第２面に基材成分拡散防止屑１３を設けた導電フィルム
１と、粘着剤層２と、透明基材（ハードコート基材）３
２の片面にハードコート層３３を設けたＨＣフィルム３
とを備え、導電膜基材１２の基材成分拡散防止層面１３
とＨＣフィルム３とを粘着剤層２を介して接着したもの
である。In the transparent conductive film shown in FIG. 2, a transparent conductive film 11 is provided on a first surface of a transparent substrate (conductive film substrate) 12.
Conductive film 1 provided with substrate component diffusion preventing debris 13 on the second surface, adhesive layer 2, transparent substrate (hard-coated substrate) 3
HC film 3 provided with a hard coat layer 33 on one side of 2
And a substrate component diffusion preventing layer surface 13 of the conductive film substrate 12.
And the HC film 3 are adhered via the pressure-sensitive adhesive layer 2.
【００１４】導電フィルムにおける導電膜基材１２やＨ
Ｃフィルムにおけるハードコート基材３２としては、例
えばポリエステル、ポリアミド、ポリ塩化ビニル、ポリ
スチレン、ノルボルネン系樹脂、ポリエチレンやポリプ
ロピレン等のオレフィン系樹脂などの適宜なプラスチッ
クからなるフィルムが用いられる。フィルム厚は、適宜
に決定しうるが一般的には、パネル形成時の作業性や性
能等の点より３〜３００μｍが好ましく、さらに好まし
くは５〜２５０μｍ、特に１０〜２００μｍが好まし
い。In the conductive film, the conductive film substrate 12 or H
As the hard coat substrate 32 in the C film, for example, a film made of an appropriate plastic such as polyester, polyamide, polyvinyl chloride, polystyrene, norbornene-based resin, and olefin-based resin such as polyethylene and polypropylene is used. The thickness of the film can be appropriately determined, but is generally preferably from 3 to 300 μm, more preferably from 5 to 250 μm, particularly preferably from 10 to 200 μm, from the viewpoint of workability and performance during panel formation.
【００１５】ＨＣフィルムは、フィルムの片面若しくは
両面をハードコート処理することにより形成することが
できる。ハードコート処理は、例えばアクリルウレタン
系樹脂やポリシロキサン系樹脂、エポキシ系樹脂、エポ
キシ基を含むシロキサン系樹脂などの硬質樹脂を塗布し
て硬化処理する方法などにより行うことができる。ハー
ドコート処理に際しては、シリコーン樹脂等を配合して
表面を粗面化したノングレア面として、タッチパネル等
として実用した際に鏡作用による写り込みを防止しうる
タイプなどとして形成することもできる。The HC film can be formed by hard coating one or both surfaces of the film. The hard coat treatment can be performed by a method of applying a hard resin such as an acrylic urethane-based resin, a polysiloxane-based resin, an epoxy-based resin, or a siloxane-based resin containing an epoxy group, followed by a curing treatment. At the time of the hard coat treatment, a non-glare surface whose surface is roughened by blending a silicone resin or the like may be formed as a non-glare surface that can prevent reflection by mirror action when used as a touch panel or the like.
【００１６】ハードコート処理層を形成する際、厚さが
薄いと硬度不足となり、厚すぎるとクラックが発生する
場合がある。また、カールの防止特性等も考慮にいれる
と、好ましい厚さは０．１〜３０μｍである。When the hard coat treatment layer is formed, if the thickness is small, the hardness becomes insufficient, and if the thickness is too large, cracks may occur. Further, in consideration of curling prevention characteristics and the like, the preferred thickness is 0.1 to 30 μm.
【００１７】ＨＣフィルムと導電フィルムを接着積層す
るための粘着層としては、透明性を有する適宜なものを
用いうる。好ましい粘着層としては、例えばアクリル系
粘着剤、シリコーン系粘着剤、ゴム系粘着剤などで形成
したクッション性に優れるものが好ましい。特に１×１
０4〜１×１０6Ｎ／ｍ2の弾性係数を有して、厚さが１
μｍ以上、さらに好ましくは５〜５００μｍの粘着層で
ある。粘着層は、ＨＣフィルム又は／及び導電フィルム
に予め付設して接着積層に供してもよいし、当該接着積
層時に塗工することもでき、従って粘着層は適宜な段階
に適宜な方式で設けることができる。As the pressure-sensitive adhesive layer for bonding and laminating the HC film and the conductive film, an appropriate one having transparency can be used. As the preferable pressure-sensitive adhesive layer, a layer excellent in cushioning property formed of, for example, an acrylic pressure-sensitive adhesive, a silicone-based pressure-sensitive adhesive, or a rubber-based pressure-sensitive adhesive is preferable. Especially 1 × 1
0 4 to 1 with a modulus of elasticity of × 10 6 N / m 2, a thickness of 1
It is an adhesive layer having a thickness of at least μm, more preferably 5 to 500 μm. The adhesive layer may be attached to the HC film and / or the conductive film in advance and provided for adhesive lamination, or may be applied at the time of the adhesive lamination. Therefore, the adhesive layer may be provided at an appropriate stage in an appropriate manner. Can be.
【００１８】導電フィルムは、フィルムの片面に透明導
電膜を設けることにより得られる。透明導電膜の形成
は、例えば真空蒸着法、スパッタリング法、イオンプレ
ーティング法、スプレー熱分解法、化学メッキ法、電気
メッキ法、あるいはこれらの組合せ法などの適宜な薄膜
形成法によりフィルム上に透明導電膜形成材からなる膜
を付設することにより行うことができる。膜の形成速度
や大面積膜の形成性、生産性などの点よりは、真空蒸着
法やスパッタリング法が好ましい。The conductive film is obtained by providing a transparent conductive film on one side of the film. The transparent conductive film is formed on the film by an appropriate thin film forming method such as a vacuum evaporation method, a sputtering method, an ion plating method, a spray pyrolysis method, a chemical plating method, an electroplating method, or a combination thereof. It can be performed by providing a film made of a conductive film forming material. From the viewpoint of film formation speed, large-area film formation, productivity, and the like, a vacuum evaporation method or a sputtering method is preferable.
【００１９】前記の透明導電膜形成材としては、透明な
導電性の膜を形成しうる適宜なものを用いうる。好まし
くは例えば、インジウム−錫酸化物合金（ＩＴＯ）、
金、銀、白金、パラジウム、銅、アルミニウム、ニッケ
ル、クロム、チタン、鉄、コバルト、錫、これらの合金
等からなる金属、酸化インジウム、酸化スズ、酸化チタ
ン、酸化カドミウム、これらの混合物等からなる金属酸
化物、ヨウ化銅等からなる他の金属化合物などが用いら
れる。As the transparent conductive film forming material, an appropriate material capable of forming a transparent conductive film can be used. Preferably, for example, indium-tin oxide alloy (ITO),
Metals consisting of gold, silver, platinum, palladium, copper, aluminum, nickel, chromium, titanium, iron, cobalt, tin, alloys of these, etc., indium oxide, tin oxide, titanium oxide, cadmium oxide, mixtures thereof, etc. Other metal compounds such as metal oxides and copper iodide are used.
【００２０】透明導電膜の厚さは、使用目的に応じて適
宜に決定することができる。ちなみにタッチパネル用の
電極板としては、表面抵抗を１０3Ω／□以下としたも
のが好ましく、一般的には１０3Ω／□以下の表面抵抗
としたものが好ましい。かかる表面抵抗は、通例、金属
系の場合で３〜６０ｎｍ、金属酸化物系の場合で８〜５
００ｎｍの厚さとすることが好ましい。The thickness of the transparent conductive film can be appropriately determined according to the purpose of use. Incidentally as the electrode plate for touch panel, a surface resistance preferably those with 10 3 Ω / □ or less, is generally preferable that the surface resistance of 10 3 Ω / □ or less. Such a surface resistance is usually 3 to 60 nm in the case of a metal type, and 8 to 5 in the case of a metal oxide type.
Preferably, the thickness is 00 nm.
【００２１】なお透明導電膜の付設に際しては、フィル
ムの表面にコロナ放電処理、紫外線照射処理、プラズマ
処理、スパッタエッチング処理、アンダーコート処理等
の適宜な前処理を施して、透明導電膜の密着性を高める
こともできる。When attaching the transparent conductive film, the film surface is subjected to an appropriate pretreatment such as a corona discharge treatment, an ultraviolet irradiation treatment, a plasma treatment, a sputter etching treatment, an undercoat treatment, etc. Can also be increased.
【００２２】なお本発明において用いるＨＣフィルムや
導電フィルム、粘着層は、タッチパネル作成時等や、必
要に応じての上記アニール処理などにおいて加熱される
ものであることより、１００℃以上、さらには１５０℃
以上の耐熱性を有することが好ましい。The HC film, the conductive film, and the adhesive layer used in the present invention are heated at 100 ° C. or higher, more preferably at 150 ° C., because they are heated at the time of making a touch panel or the above-mentioned annealing treatment as required. ° C
It is preferable to have the above heat resistance.
【００２３】[0023]
【実施例】以下、実施例及び比較例を用いて本発明をさ
らに具体的に説明する。なお、本発明は下記の実施例に
限定されるものではない。The present invention will be described more specifically below with reference to examples and comparative examples. In addition, this invention is not limited to a following example.
【００２４】（比較例１）厚さ１２５μｍのポリエチレ
ンテレフタレート（ＰＥＴ）フィルムの第１面にアクリ
ルウレタン系樹脂からなる厚さ５μｍのハードコート処
理層を設けてＨＣフィルムとし、このＨＣフィルムの第
２面上に厚さ２５μｍのアクリル系粘着剤層を設けた。COMPARATIVE EXAMPLE 1 A 125 μm thick polyethylene terephthalate (PET) film was provided with a 5 μm thick hard coat treatment layer made of an acrylic urethane resin on the first surface to form an HC film. An acrylic pressure-sensitive adhesive layer having a thickness of 25 μm was provided on the surface.
【００２５】厚さ２３μｍのＰＥＴフィルムの第１面
に、厚さ２５ｎｍのインジウム−錫酸化物合金（ＩＴ
Ｏ）蒸着膜を有する導電フィルムの第２面を前記の粘着
層を介して接着積層して透明導電性フィルムを得た。On a first surface of a 23 μm-thick PET film, a 25 nm-thick indium-tin oxide alloy (IT
O) A transparent conductive film was obtained by bonding and laminating the second surface of the conductive film having a vapor-deposited film via the above-mentioned adhesive layer.
【００２６】（比較例２）厚さ１２５μｍのＰＥＴフィ
ルムの第１面にアクリルウレタン系樹脂からなる厚さ５
μｍのハードコート層を設けるとともに、第２面に厚さ
７μｍのハードコート層を設けてＨＣフィルムとした。
そして、このＨＣフィルムの第２面上に厚さ２５μｍの
アクリル系粘着剤層を設けた。(Comparative Example 2) The first surface of a PET film having a thickness of 125 μm was made of an acrylic urethane resin and had a thickness of 5
A hard coat layer having a thickness of 7 μm was provided on the second surface while a hard coat layer having a thickness of μm was provided to obtain an HC film.
Then, an acrylic pressure-sensitive adhesive layer having a thickness of 25 μm was provided on the second surface of the HC film.
【００２７】厚さ２３μｍのＰＥＴフィルムの第１面
に、厚さ２５ｎｍのＩＴＯ蒸着膜を有する導電フィルム
の第２面を前記の粘着層を介して接着積層して透明導電
性フィルムを得た。A transparent conductive film was obtained by bonding and laminating a second surface of a conductive film having a 25 nm thick ITO vapor-deposited film on the first surface of a 23 μm thick PET film via the above-mentioned adhesive layer.
【００２８】（実施例１）厚さ１２５μｍのＰＥＴフィ
ルムの第１面にアクリルウレタン系樹脂からなる厚さ５
μｍのハードコート処理層を設けてＨＣフィルムとし、
このＨＣフィルムの第２面上に厚さ２５μｍのアクリル
系粘着剤層を設けた。Example 1 A PET film having a thickness of 125 μm was formed on a first surface of an acrylic urethane resin to a thickness of 5 μm.
μm hard coat treatment layer to make HC film,
An acrylic pressure-sensitive adhesive layer having a thickness of 25 μm was provided on the second surface of the HC film.
【００２９】厚さ２３μｍのＰＥＴフィルムの第１面
に、厚さ２５ｎｍのＩＴＯ蒸着膜を有し、第２面にオリ
ゴマー拡散防止層（基材成分拡散防止層）として厚さ１
０ｎｍのＩＴＯ蒸着膜を有する導電フィルムの第２面を
前記の粘着層を介して接着積層して透明導電性フィルム
を得た。A PET film having a thickness of 23 μm has a 25 nm-thick ITO vapor deposited film on the first surface, and has a thickness of 1 nm as an oligomer diffusion preventing layer (base component diffusion preventing layer) on the second surface.
The transparent conductive film was obtained by bonding and laminating the second surface of the conductive film having an ITO vapor-deposited film of 0 nm via the above-mentioned adhesive layer.
【００３０】（実施例２）厚さ１２５μｍのＰＥＴフィ
ルムの第１面にアクリルウレタン系樹脂からなる厚さ５
μｍのハードコート層を設け、第２面に厚さ７μｍのハ
ードコート層を設けてＨＣフィルムとした。そして、こ
のＨＣフィルムの第２面上に厚さ２５μｍのアクリル系
粘着剤層を設けた。(Example 2) A 5 μm thick PET film having a thickness of 125 μm was formed on the first surface of an acrylic urethane resin.
A hard coat layer having a thickness of 7 μm was provided, and a hard coat layer having a thickness of 7 μm was provided on the second surface to obtain an HC film. Then, an acrylic pressure-sensitive adhesive layer having a thickness of 25 μm was provided on the second surface of the HC film.
【００３１】厚さ２３μｍのＰＥＴフィルムの第１面
に、厚さ２５ｎｍのＩＴＯ蒸着膜を有し、第２面にオリ
ゴマー拡散防止層（基材成分拡散防止層）として厚さ１
０ｎｍのＩＴＯ蒸着膜を有する導電フィルムの第２面を
前記の粘着層を介して接着積層して透明導電性フィルム
を得た。A PET film having a thickness of 23 μm has an ITO vapor deposited film having a thickness of 25 nm on the first surface, and has a thickness of 1 nm as an oligomer diffusion preventing layer (base component diffusion preventing layer) on the second surface.
The transparent conductive film was obtained by bonding and laminating the second surface of the conductive film having an ITO vapor-deposited film of 0 nm via the above-mentioned adhesive layer.
【００３２】（実施例３）厚さ１２５μｍのＰＥＴフィ
ルムの第１面にアクリルウレタン系樹脂からなる厚さ５
μｍの、第２面に厚さ７μｍのハードコート処理層を設
けてＨＣフィルムとした。そして、このＨＣフィルムの
第２面上に厚さ２５μｍのアクリル系粘着剤層を設け
た。Example 3 A PET film having a thickness of 125 μm and a thickness of 5 made of an acrylic urethane resin
A 7 μm-thick hard coat treatment layer was provided on the second side of the second surface to form an HC film. Then, an acrylic pressure-sensitive adhesive layer having a thickness of 25 μm was provided on the second surface of the HC film.
【００３３】厚さ２３μｍのＰＥＴフィルムの第１面
に、厚さ２５ｎｍのＩＴＯ蒸着膜を有し、第２面にオリ
ゴマー防止層（基材成分拡散防止層）として、厚さ２０
ｎｍのポリビニルアルコールーメラミン樹脂をコーティ
ングした導電フィルムの第２面を前記の粘着層を介して
接着積層して透明導電性フィルムを得た。A PET film having a thickness of 23 μm has an ITO deposited film having a thickness of 25 nm on the first surface, and has a thickness of 20 nm as an oligomer preventing layer (base component diffusion preventing layer) on the second surface.
The transparent conductive film was obtained by bonding and laminating the second surface of a conductive film coated with a polyvinyl alcohol-melamine resin having a thickness of 10 nm via the above-mentioned adhesive layer.
【００３４】（実施例４）厚さ１２５μｍのＰＥＴフィ
ルムの第１面にアクリルウレタン系樹脂からなる厚さ５
μｍの、第２面に厚さ７μｍのハードコート処理層を設
けてＨＣフィルムとした。そして、このＨＣフィルムの
第２面上に厚さ２５μｍのアクリル系粘着剤層を設け
た。Example 4 The first surface of a PET film having a thickness of 125 μm was made of an acrylic urethane resin and had a thickness of 5 μm.
A 7 μm-thick hard coat treatment layer was provided on the second side of the second surface to form an HC film. Then, an acrylic pressure-sensitive adhesive layer having a thickness of 25 μm was provided on the second surface of the HC film.
【００３５】厚さ２３μｍのＰＥＴフィルムの第１面
に、厚さ２５ｎｍのＩＴＯ蒸着膜を有し、第２面に厚さ
２０ｎｍのポリビニルアルコールーメラミン系樹脂中に
無機粒子であるシリカを１重量％分散させた基材成分拡
散防止層を有する導電フィルムの第２面を前記の粘着層
を介して接着積層して透明導電性フィルムを得た。On a first surface of a 23 μm-thick PET film, a 25 nm-thick ITO vapor-deposited film is provided on a first surface, and on a second surface, 1 wt. The transparent conductive film was obtained by bonding and laminating the second surface of the conductive film having the base component component diffusion preventing layer in which the base material component was dispersed in% by way of the aforementioned adhesive layer.
【００３６】（評価試験）評価結果を表１，２に示す。
比較例および実施例で得た透明導電フィルムの光学特性
（ｂ値及びヘーズ）について、 (1) 初期状態 (2) 温度：１５０℃の環境下で１．５時間加熱処理後、
８０℃の環境下に２４０間保存後 (3) 温度：１５０℃の環境下で１．５時間加熱処理後、
温度：６０℃、相対湿度：９５％ＲＨの環境下に２４０
時間保存後の各３点を測定した。表１，２において、ｂ
値はJIS K 7105に準ずるＬ，ａ，ｂ表色系における数値
であり、株式会社村上色彩技術研究所製の高速分光光度
計CMS−500により測定した値である。また、ヘーズは次
の式により定義され、JIS K7105に準じてスガ試験機株
式会社製の全自動直読ヘーズコンピュータHGM−2DPによ
り測定した。(Evaluation Test) The evaluation results are shown in Tables 1 and 2.
Regarding the optical properties (b value and haze) of the transparent conductive films obtained in Comparative Examples and Examples, (1) Initial state (2) Temperature: After heat treatment in an environment of 150 ° C. for 1.5 hours,
After storage for 240 hours in an environment of 80 ° C. (3) Temperature: After a heat treatment of 1.5 hours in an environment of 150 ° C.,
Temperature: 60 ° C, relative humidity: 240 in an environment of 95% RH
Each of the three points after the time storage was measured. In Tables 1 and 2, b
The value is a numerical value in the L, a, b color system according to JIS K 7105, and is a value measured by a high-speed spectrophotometer CMS-500 manufactured by Murakami Color Research Laboratory Co., Ltd. The haze was defined by the following equation, and was measured by a fully automatic direct reading haze computer HGM-2DP manufactured by Suga Test Instruments Co., Ltd. according to JIS K7105.
【００３７】Ｈ＝（Ｔｄ／Ｔｔ）×１００ （ここで、Ｈはヘーズ（％）、Ｔｄは拡散透過率
（％）、Ｔｔは全部光線透過率（％）を示す。） また外観は、基材成分の析出による視認性を確認し、そ
の判定を○、△、×で示す。○は基材成分に起因すると
思われる結晶が粘着剤層中にほとんど無く、目視におい
て外観上良好なもの。△は基材成分に起因すると思われ
る結晶が顕微鏡において多少確認されるが、目視におい
ては外観上は良好なもの。×は基材成分に起因すると思
われる結晶が確認され、目視において外観不良となって
いるものを示す。H = (Td / Tt) × 100 (where H indicates haze (%), Td indicates diffuse transmittance (%), and Tt indicates all light transmittance (%)). The visibility due to the precipitation of the material components was confirmed, and the judgment was indicated by ○, Δ, and ×. ○ indicates that there is almost no crystal in the pressure-sensitive adhesive layer, which is considered to be derived from the base material component, and the appearance is good visually. The symbol Δ indicates that crystals considered to be attributable to the base component are slightly observed under a microscope, but are visually good in appearance. × indicates that crystals considered to be derived from the base material component were confirmed and the appearance was poor visually.
【００３８】[0038]
【表１】 [Table 1]
【００３９】[0039]
【表２】 [Table 2]
【００４０】以上の結果から明らかなとおり、本発明の
実施例品は、光学特性も外観も実施例品に比較して優れ
ていることが確認できた。この理由は、導電フィルムの
粘接着層と接する側に基材成分拡散防止層を設けたこと
により、加熱加工時に導電フィルム基材成分が粘着剤層
中に拡散することを防げたからである。As is clear from the above results, it was confirmed that the products of the examples of the present invention were superior in both optical characteristics and appearance to those of the examples. This is because the conductive film base component was prevented from diffusing into the pressure-sensitive adhesive layer during the heating process by providing the base material component diffusion preventing layer on the side of the conductive film that is in contact with the adhesive layer.
【００４１】[0041]
【発明の効果】以上説明のように本発明は、導電フィル
ムの粘接着層と接する側に基材成分拡散防止層を設けた
ことにより、加熱加工時に導電フィルム基材成分が粘着
剤層中に拡散することを防ぎ、それに起因する外観不良
が生じにくいアナログ方式タッチパネルの電極板などに
好適なハードコート層付きの透明導電性フィルムを提供
することができる。As described above, according to the present invention, by providing a base component diffusion preventing layer on the side of the conductive film which is in contact with the adhesive layer, the conductive film base component is contained in the adhesive layer during heating. It is possible to provide a transparent conductive film with a hard coat layer which is suitable for an electrode plate of an analog touch panel and the like, which prevents diffusion to the outside and does not easily cause poor appearance due to the diffusion.
【図１】本発明の一実施形態の透明導電性フィルムの概
略断面図を示す。FIG. 1 is a schematic sectional view of a transparent conductive film according to an embodiment of the present invention.
【図２】本発明の別の実施形態の透明導電性フィルムの
概略断面図を示すFIG. 2 shows a schematic cross-sectional view of a transparent conductive film according to another embodiment of the present invention.
１ 導電フィルム ２ 粘着剤層 ３ ハードコートフィルム １１ 透明導電膜 １２ 透明基材（導電膜基材） １３ 基材成分拡散防止層 ３１，３３ ハードコート層 ３２ 透明基材（ハードコート基材） DESCRIPTION OF SYMBOLS 1 Conductive film 2 Adhesive layer 3 Hard coat film 11 Transparent conductive film 12 Transparent base material (conductive film base material) 13 Substrate component diffusion prevention layer 31, 33 Hard coat layer 32 Transparent base material (Hard coat base material)
───────────────────────────────────────────────────── フロントページの続き (72)発明者 野口 知功 大阪府茨木市下穂積１丁目１番２号 日東 電工株式会社内 Ｆターム(参考） 4F100 AA00D AA33 AH00D AK25G AK25J AK42 AK51G AK51J AR00B AR00C AR00D AT00A BA04 BA07 BA10B BA10D CA25D GB90 JG01C JK12B JK12C JN01C 5B087 CC13 CC14 CC17 5G307 FA02 FB01 FB02 FC03 FC09 ────────────────────────────────────────────────── ─── Continued on the front page (72) Inventor Tomonori Noguchi 1-2-1, Shimohozumi, Ibaraki-shi, Osaka Nitto Denko Corporation F-term (reference) 4F100 AA00D AA33 AH00D AK25G AK25J AK42 AK51G AK51J AR00B AR00C AR00D AT00A BA04 BA07 BA10B BA10D CA25D GB90 JG01C JK12B JK12C JN01C 5B087 CC13 CC14 CC17 5G307 FA02 FB01 FB02 FC03 FC09
Claims (5)
ルムにおいて、 少なくとも一面にハードコート層を有するハードコート
フィルムと、 基材の一方の面に透明導電膜を設け、他方の面に一層以
上の基材成分拡散防止層を設けた導電フィルムとを、 前記基材成分拡散防止層が粘接着層側になるように接着
積層したことを特徴とする透明導電性フィルム。1. A transparent conductive film having a hard coat layer, comprising: a hard coat film having a hard coat layer on at least one surface; a transparent conductive film provided on one surface of a substrate; and one or more substrates on the other surface. A transparent conductive film, comprising: a conductive film provided with a material component diffusion preventing layer; and an adhesive lamination such that the base component component diffusion preventing layer is on the adhesive layer side.
れている請求項１に記載の透明導電性フィルム。2. The transparent conductive film according to claim 1, wherein hard coat layers are provided on both surfaces of the film.
１または２に記載の透明導電性フィルム。3. The transparent conductive film according to claim 1, wherein the base component diffusion preventing layer is an inorganic substance.
１または２に記載の透明導電性フィルム。4. The transparent conductive film according to claim 1, wherein the base component diffusion preventing layer is an organic substance.
合材料である請求項１または２に記載の透明導電性フィ
ルム。5. The transparent conductive film according to claim 1, wherein the base component diffusion preventing layer is a composite material of an inorganic substance and an organic substance.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000303627A JP4151818B2 (en) | 2000-10-03 | 2000-10-03 | Transparent conductive film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000303627A JP4151818B2 (en) | 2000-10-03 | 2000-10-03 | Transparent conductive film |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002103504A true JP2002103504A (en) | 2002-04-09 |
| JP4151818B2 JP4151818B2 (en) | 2008-09-17 |
Family
ID=18784806
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000303627A Expired - Lifetime JP4151818B2 (en) | 2000-10-03 | 2000-10-03 | Transparent conductive film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4151818B2 (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007052485A1 (en) * | 2005-10-31 | 2007-05-10 | Nitto Denko Corporation | Conductive laminated film, electrode plate for touch panel, touch panel, and adhesive for conductive laminated film |
| US7438978B2 (en) * | 2003-02-03 | 2008-10-21 | Bridgestone Corporation | Transparent conductive film, transparent conductive plate, and touch panel |
| JP2009093735A (en) * | 2007-10-05 | 2009-04-30 | Dainippon Printing Co Ltd | Suspension substrate and its manufacturing method |
| WO2010061851A1 (en) * | 2008-11-28 | 2010-06-03 | 株式会社 きもと | Sheet with coating film and manufacturing method thereof |
| WO2011034151A1 (en) | 2009-09-18 | 2011-03-24 | 三菱樹脂株式会社 | Double-sided laminated polyester film |
| WO2012043652A1 (en) * | 2010-09-29 | 2012-04-05 | 日東電工株式会社 | Resin film with adhesive layer, laminated film, and touchpanel |
| WO2012153677A1 (en) * | 2011-05-11 | 2012-11-15 | 日東電工株式会社 | Transparent conductive laminate and touch panel |
| JP2013129201A (en) * | 2013-01-25 | 2013-07-04 | Nitto Denko Corp | Electrically-conductive laminated film, electrode plate for touch panel, touch panel and adhesive for electrically-conductive laminated film |
| JP2014067612A (en) * | 2012-09-26 | 2014-04-17 | Toppan Printing Co Ltd | Conductive film and method of producing the same, and laminate, electronic device, and touch panel |
| CN104656974A (en) * | 2013-11-20 | 2015-05-27 | 大日本印刷株式会社 | Conductive Film, Hard Coating Film And Touch Control Panel Sensor |
| US9914810B2 (en) | 2011-03-16 | 2018-03-13 | Nitto Denko Corporation | Transparent conductive film and touch panel |
-
2000
- 2000-10-03 JP JP2000303627A patent/JP4151818B2/en not_active Expired - Lifetime
Cited By (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7438978B2 (en) * | 2003-02-03 | 2008-10-21 | Bridgestone Corporation | Transparent conductive film, transparent conductive plate, and touch panel |
| JP2007118499A (en) * | 2005-10-31 | 2007-05-17 | Nitto Denko Corp | Conductive laminated film, electrode plate for touch panel, touch panel and adhesive for conductive laminated film |
| WO2007052485A1 (en) * | 2005-10-31 | 2007-05-10 | Nitto Denko Corporation | Conductive laminated film, electrode plate for touch panel, touch panel, and adhesive for conductive laminated film |
| JP2009093735A (en) * | 2007-10-05 | 2009-04-30 | Dainippon Printing Co Ltd | Suspension substrate and its manufacturing method |
| JP5872770B2 (en) * | 2008-11-28 | 2016-03-01 | 株式会社きもと | Sheet with coating and method for producing the same |
| WO2010061851A1 (en) * | 2008-11-28 | 2010-06-03 | 株式会社 きもと | Sheet with coating film and manufacturing method thereof |
| JPWO2010061851A1 (en) * | 2008-11-28 | 2012-04-26 | 株式会社きもと | Sheet with coating and method for producing the same |
| WO2011034151A1 (en) | 2009-09-18 | 2011-03-24 | 三菱樹脂株式会社 | Double-sided laminated polyester film |
| KR20120064681A (en) | 2009-09-18 | 2012-06-19 | 미쓰비시 쥬시 가부시끼가이샤 | Double-sided laminated polyester film |
| WO2012043652A1 (en) * | 2010-09-29 | 2012-04-05 | 日東電工株式会社 | Resin film with adhesive layer, laminated film, and touchpanel |
| JP2012092314A (en) * | 2010-09-29 | 2012-05-17 | Nitto Denko Corp | Resin film with adhesive layer, laminated film, and touchpanel |
| US9914810B2 (en) | 2011-03-16 | 2018-03-13 | Nitto Denko Corporation | Transparent conductive film and touch panel |
| WO2012153677A1 (en) * | 2011-05-11 | 2012-11-15 | 日東電工株式会社 | Transparent conductive laminate and touch panel |
| CN103518239A (en) * | 2011-05-11 | 2014-01-15 | 日东电工株式会社 | Transparent conductive laminate and touch panel |
| KR20140009512A (en) | 2011-05-11 | 2014-01-22 | 닛토덴코 가부시키가이샤 | Transparent conductive laminate and touch panel |
| KR101640652B1 (en) | 2011-05-11 | 2016-07-18 | 닛토덴코 가부시키가이샤 | Transparent conductive laminate and touch panel |
| US9696574B2 (en) | 2011-05-11 | 2017-07-04 | Mari Tanabe | Transparent conductive laminate and touch panel |
| JP2012238467A (en) * | 2011-05-11 | 2012-12-06 | Nitto Denko Corp | Transparent conductive laminate and touch panel |
| JP2014067612A (en) * | 2012-09-26 | 2014-04-17 | Toppan Printing Co Ltd | Conductive film and method of producing the same, and laminate, electronic device, and touch panel |
| JP2013129201A (en) * | 2013-01-25 | 2013-07-04 | Nitto Denko Corp | Electrically-conductive laminated film, electrode plate for touch panel, touch panel and adhesive for electrically-conductive laminated film |
| CN104656974A (en) * | 2013-11-20 | 2015-05-27 | 大日本印刷株式会社 | Conductive Film, Hard Coating Film And Touch Control Panel Sensor |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4151818B2 (en) | 2008-09-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8075948B2 (en) | Transparent conductive film | |
| JP4777008B2 (en) | Conductive laminated film, electrode plate for touch panel and touch panel | |
| JP4086132B2 (en) | Transparent conductive film and touch panel | |
| JP4776754B2 (en) | Transparent conductive film with protective film and method of using the same | |
| JP6600550B2 (en) | Metal layer laminated transparent conductive film and touch sensor using the same | |
| JP3995141B2 (en) | Transparent conductive film and touch panel electrode | |
| JP2002103504A (en) | Transparent conductive film | |
| JP2667686B2 (en) | Transparent conductive laminate | |
| JP3310408B2 (en) | Transparent conductive film | |
| JP2002316378A (en) | Transparent conductive laminated body and touch panel using the same | |
| JPH1134207A (en) | Transparent conductive film | |
| JPH0713695A (en) | Transparent touch panel | |
| JP2000243146A (en) | Transparent conductive film and touch panel using same | |
| JP2624930B2 (en) | Transparent conductive laminate and touch panel | |
| JP4214063B2 (en) | Transparent conductive laminate and touch panel | |
| JP2003263925A (en) | Transparent conductive film and touch panel using the same | |
| JP2829003B2 (en) | Transparent conductive laminate | |
| JP2582859B2 (en) | Static electricity, electromagnetic wave shielding material | |
| JPH1029261A (en) | Transparent conductive sheet for inner touch panel | |
| JP4284566B2 (en) | Transparent conductive film, touch panel and liquid crystal display element | |
| JP2003098339A (en) | Method for manufacturing filter for display | |
| JP2613206B2 (en) | Method for producing transparent conductive film | |
| JPH08272530A (en) | Touch panel | |
| JPH11306867A (en) | Transparent conductive film and manufacture thereof | |
| JP3310409B2 (en) | Transparent conductive film |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20040521 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20060510 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20060613 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20060810 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20080626 |
|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20080626 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 4151818 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110711 Year of fee payment: 3 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140711 Year of fee payment: 6 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |