JP2002100694A - Base for electronic component, electronic component provided with the base, and manufacturing method of the electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the size of a ceramic base by improving patterning precision on the ceramic base. SOLUTION: In a process of manufacturing a ceramic base 2 for mounting a crystal vibrator, the baked ceramic base 2 having almost entire surface metallized M is plated P with a nickel and gold on the metallized surface. The metabollized layer M and the plated layer P on the surface of the ceramic base are patterned with an element mounting pattern of a specified shape by a photolithography method.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a base of an electronic component typified by a surface mount type crystal unit, an electronic component having the base, and a method of manufacturing the electronic component. In particular, the present invention relates to a measure for improving patterning accuracy on a base.

[0002]

2. Description of the Related Art In recent years, miniaturization of information devices such as mobile computers and mobile communication devices such as mobile phones, car phones, and paging systems has been rapidly progressing. For this reason, there is a demand for further miniaturization of electronic components such as quartz oscillators used for these components.

[0003] As a configuration of this type of crystal resonator, for example, as disclosed in Japanese Patent Application Laid-Open No. H10-126201, a ceramic base is mounted on the ceramic base via a conductive adhesive or the like. The piezoelectric device includes a piezoelectric element (quartz vibrating piece) and a cap adhered to a ceramic base so as to cover the piezoelectric element and seal the internal space of the vibrator. Further, electrodes are formed on the front and back surfaces of the ceramic base, and the electrodes on the front and back surfaces are electrically connected via through holes formed in the ceramic base.

[0004] Further, as a conventional process for manufacturing a ceramic base of a crystal unit, the entire surface of a soft ceramic sheet formed by ceramic powder or a binder is metallized (by chromium oxide or the like) and is further formed thereon. A seal pattern or an element mounting pattern is printed by screen printing or the like, and in this state, the ceramic sheet is fired to form a ceramic base.

[0005]

However, as described above, in the conventional ceramic base manufacturing process, the ceramic sheet is fired in a state where the seal pattern and the element mounting pattern are printed. The patterning position may deviate from a predetermined position due to shrinkage of the ceramic sheet body. That is, at the time of the above-mentioned firing, the ceramic sheet body may shrink, for example, by about 30%. If the shrinkage ratio is not uniform in each part of the ceramic sheet body, the patterning position shifts, and the piezoelectricity with respect to this patterning position is reduced. The positional relationship between the element and the cap is not properly set, and the occurrence rate of defective products increases.

For this reason, conventionally, in consideration of the shrinkage at the time of baking, even if the patterning position slightly shifts, the patterning position of the piezoelectric element or the cap with respect to the patterning position can be appropriately obtained. The width dimension and the spacing dimension between patterns are set to be relatively large.

However, in this case, an increase in the size of the ceramic base cannot be avoided, and there is a limit in reducing the size of the crystal unit.

On the other hand, in this type of crystal resonator, it is desirable that the external dimensions are as small as possible, that is, as small as possible. However, in order to ensure good vibration characteristics of the crystal resonator element, the crystal The internal cavity of the child is preferably as large as possible. This is because, by increasing the internal cavity, gas molecules inside the vibrator are diluted, and adverse effects of the gas molecules on the vibration characteristics are reduced. Further, in order to facilitate the spurious management of the crystal resonator element, it is preferable to increase the size of the crystal resonator element, but this requires a large internal cavity.

One means for satisfying these mutually contradictory requirements is to make the area (sealing area) contributing to the joining of the cap on the ceramic base as small as possible. However, as described above, there is a limit in reducing the pattern width of the seal pattern in consideration of shrinkage of the ceramic base during firing (for example, the seal pattern width cannot be reduced to 0.3 mm or less). In fact, it is impossible to obtain a configuration that satisfies the above requirements by making this seal area extremely small.

The present invention has been made in view of the above point, and an object of the present invention is to reduce the size of a ceramic base by improving the patterning accuracy on the ceramic base.

[0011]

Means for Solving the Problems-Summary of the Invention-In order to achieve the above object, according to the present invention, a ceramic base is fired at a stage before patterning such as an element mounting pattern, and thereby, after patterning, The shrinkage of the ceramic base is prevented.

-Solution Means- Specifically, a base for a ceramic electronic component on which the element is mounted is assumed. In this electronic component base, a conductive metal thin film is formed on the entire surface of the fired ceramic body whose entire surface or a part of the surface is metallized, and the metallized layer and the thin film layer are patterned by a predetermined method. An element mounting pattern having a shape is formed.

As another configuration, a predetermined patterning is performed on the metallized layer of the fired ceramic body whose entire surface or a part of the surface is metallized, and a conductive metal layer is formed only on the patterned metallized layer. An element mounting pattern having a predetermined shape is formed by molding a thin film.

Further, as another configuration, a conductive metal thin film is formed on the entire surface of the fired ceramic body having a part of the surface metallized, and the thin film layer is patterned to have a predetermined shape. An element mounting pattern is formed.

In addition, for the fired ceramic body having via holes formed over the front and back surfaces, a conductive metal thin film is formed in a region including the via holes on the surface, and the thin film layer is patterned. Thus, a configuration in which an element mounting pattern having a predetermined shape is formed by the method described above can be used.

As one method of manufacturing an electronic component using this base, a conductive metal thin film is formed on the entire surface of a fired ceramic body having the entire surface or a part thereof metallized. The method includes providing a thin film forming step, a patterning step of patterning the metallized layer and the thin film layer to form an element mounting pattern having a predetermined shape, and an element mounting step of mounting an element corresponding to the element mounting pattern.

Further, as another manufacturing method, a thin film forming step of forming a conductive metal thin film over the entire surface of the fired ceramic body having a part of the surface metallized, and patterning the thin film layer. It is also possible to provide a patterning step of forming an element mounting pattern of a predetermined shape and an element mounting step of mounting an element corresponding to the element mounting pattern.

A thin film forming step of forming a thin film of a conductive metal in a region including a via hole on the surface of the fired ceramic body having a via hole formed over the front and back surfaces, and patterning the thin film layer. A patterning step of forming an element mounting pattern having a predetermined shape, and an element mounting step of mounting an element corresponding to the element mounting pattern.

In these manufacturing methods, before the thin film forming step, a metallizing step of metallizing the surface of the ceramic sheet formed by the ceramic powder, and firing the metallized ceramic sheet to form the ceramic body A manufacturing method in which a firing step of forming is performed is also included in the scope of the present invention.

Another manufacturing method includes a patterning step of patterning the metallized layer on the fired ceramic body having the entire surface or a part of the surface metallized, and conducting only on the metallized layer patterned in the patterning step. A thin film forming step of forming an element mounting pattern having a predetermined shape by forming a thin film of a conductive metal, and an element mounting step of mounting an element corresponding to the element mounting pattern are provided.

In this manufacturing method, before the patterning step, a metallizing step of metallizing the surface of the ceramic sheet formed by the ceramic powder, and firing the metallized ceramic sheet to form a ceramic body A manufacturing method in which the firing step is performed is also included in the scope of the present invention.

By these specific items, the base does not shrink after patterning. For this reason, a high positional accuracy of the patterning can be ensured, and the mounting positional relationship of the elements and the like with respect to the patterning position is appropriately set. Specifically, high patterning positional accuracy can be obtained by patterning the metallized layer and the thin film layer by a photolithography method. In addition, since the pattern width dimension and the space dimension between the patterns can be set small, the base can be reduced in size, and accordingly, the electronic components can be reduced in size.

The present invention also includes an electronic component in which an element is mounted on the base manufactured as described above. By using this base, the seal area of the seal pattern (the area contributing to the joining of the cap on the base) when attaching the cap to the base can be set very small, and the external dimensions of the electronic component can be reduced. However, a relatively large internal cavity can be ensured. For this reason, it is possible to obtain good device characteristics while reducing the size of the electronic component, and to provide a high-performance electronic component.

Further, as a specific operation in the above-mentioned thin film forming step, after nickel plating is performed on the metallized surface, gold plating is performed on the surface of the nickel plating layer. Since the lower layer of the two-layer thin film is a nickel layer that easily generates an oxide, good adhesion of the thin film to the metallized layer can be obtained.

[0025]

Embodiments of the present invention will be described below with reference to the drawings. In this embodiment, a case will be described in which the present invention is applied to a surface-mount type crystal unit.

FIG. 1 is an exploded perspective view schematically showing a crystal resonator 1 according to the present embodiment. As shown in FIG. 1, the quartz crystal resonator 1 has conductive element mounting portions 3A and 3B attached to the upper surface of a ceramic base 2 as a ceramic body according to the present invention, and the element mounting portions 3A and 3B. In addition, a rectangular AT-cut quartz plate 4 as an element according to the present invention is mounted, and a cap 5 is attached to the ceramic base 2 so as to cover the quartz plate 4 and seal the internal space of the vibrator. It is configured.

The ceramic base 2 is made of alumina (Al)
_{It is made of} a ceramic material such as ₂ O ₃ ) and is formed in a flat plate shape. The upper surface of the ceramic base 2 is entirely metallized with a metal material such as tungsten (W), and a surface electrode 21A made of a plating layer of nickel (Ni) and gold (Au) on the surface. , 21B and the like.

The surface electrodes 21A and 21B are provided with through holes 22A and 22 penetrating in the thickness direction of the ceramic base 2.
Since B is filled with a metal material such as tungsten, it is electrically connected to a back electrode (not shown).

Excitation electrodes and extraction electrodes (not shown) are formed on the front and back surfaces of the quartz plate 4 by a sputtering deposition method or the like. The excitation electrode and the extraction electrode are formed, for example, by chromium plating and silver plating on the upper surface.

The quartz plate 4 is mounted on the element mounting portions 3A and 3B such that the extraction electrodes of the crystal plate 4 and the element mounting portions 3A and 3B overlap each other. Both are electrically and mechanically connected by a conductive adhesive such as a system.

The cap 5 is formed by pressing a metal material, is an inverted concave type having an open lower surface, and is designed so that its outer dimensions are substantially equal to the outer dimensions of the ceramic base 2. A flange 51 extending in the horizontal direction is formed on the outer peripheral edge of the cap 5, and this flange 51 is soldered to the outer peripheral edge of the upper surface of the ceramic base 2. Thereby, the internal space of the vibrator is hermetically sealed. The above is the schematic configuration of the crystal resonator 1 according to the present embodiment.

Description of Manufacturing Process of Quartz Crystal Resonator 1 Next, a description will be given of a manufacturing process of the crystal resonator 1 configured as described above. The characteristic process of the present embodiment is a molding process of the ceramic base 2.

The molding process of the ceramic base 2 includes:
First, a liquid produced by dispersing ceramic powder in a predetermined solution and adding a binder is formed into a sheet shape. As a result, as shown in FIG. Is formed into a soft sheet-like ceramic material 2A (generally called a green sheet). This sheet-shaped ceramic material 2A is cut into a predetermined shape as shown in FIG.
(See the hatched portion in FIG. 2C) (metallization step). At this time, the through hole (not shown in FIG. 2) is formed in the sheet-shaped ceramic material 2A, and the through hole is also filled with tungsten. A pad (not shown) constituting a back electrode is also integrally formed on the back surface of the sheet-shaped ceramic material 2A.

After that, the sheet-like ceramic material 2A whose substantially entire surface is metallized is fired to obtain a flat ceramic base 2 (not yet patterned) (firing step). The size of the ceramic base 2 is obtained by shrinking (for example, shrinking by about 30%) the sheet-shaped ceramic material during the firing.

Next, nickel plating and gold plating are performed on the surface of the ceramic base 2, whereby a metal thin film (plating layer) P is formed on the surface of the ceramic base 2.
(Refer to the hatched portion in FIG. 2D) is formed (thin film forming step).

Thereafter, the metallized layer M and the plated layer P are patterned by a well-known photolithography method, whereby a seal pattern and an element mounting portion pattern having a predetermined shape are formed (patterning step).

The ceramic base 2 is formed by the above steps.

With respect to the ceramic base 2 thus formed, as shown in FIG. 1, the element mounting portions 3A, 3B
And the quartz plate 4 are placed (element mounting step), and the cap 5
Is soldered to the outer peripheral edge of the ceramic base, whereby the crystal unit 1 is completed.

-Effects of Embodiment- As described above, in the crystal unit 1 of the present embodiment, the thin film P of nickel and gold is formed on the fired ceramic base 2 having substantially the entire surface metallized M. Then, patterning is performed on each of these layers. In the conventional manufacturing method, since a ceramic base is obtained by firing a sheet-shaped ceramic material patterned by screen printing or the like, the patterning position shifts due to shrinkage due to firing, and the quartz plate or cap moves with respect to this patterning position. There was a possibility that the mounting positional relationship was not set properly. In the present embodiment, since the ceramic base 2 does not shrink after patterning, high patterning accuracy can be ensured. Specifically, it is possible to obtain the patterning accuracy with a high accuracy within ± 0.01 mm, which is 1/10 or less of the conventional accuracy.

For this reason, the mounting position relationship between the crystal plate 4 and the cap 5 with respect to the patterning position is appropriately set, and the incidence of defective products can be reduced. Further, since the patterning position hardly shifts, it is possible to set the pattern width dimension and the space dimension between the patterns smaller than those of the conventional one, and the ceramic base 2 can be downsized, and the The size of the child 1 can be reduced. Further, since the accuracy of the seal pattern can be increased, the seal area of the seal pattern (the area contributing to the joining of the cap 5 on the ceramic base 2) can be set very small, and the crystal oscillator A relatively large internal cavity can be ensured while reducing the external dimensions. As a result, the vibration characteristics of the quartz plate 4 can be obtained favorably, and the high-performance quartz resonator 1 can be provided. In addition, even when a configuration in which a plurality of quartz plates are mounted in the same cavity is used (a large number of quartz plates are simultaneously mounted), it is possible to appropriately obtain the mounting positions of the individual quartz plates.

Further, since the cap 5 of the present embodiment is formed by press working, it is manufactured with higher dimensional accuracy than that obtained by conventional drawing, and in combination with the above-described patterning with high accuracy. Thus, the above-mentioned effect can be further exerted. In addition, the shape of the flange 51 can be optimized as compared with the one manufactured by drawing, whereby the size of the crystal unit 1 can be further reduced. More specifically, FIG. 3A shows a joining (soldering) position of the pressed cap 5 to the ceramic base 2, and FIG. 3B shows a ceramic base 2 ′ of the drawn cap 5 ′. 3 shows a joining portion with respect to. Thus, in the drawn cap 5 ′, the distance between the cap body 52 ′ and the flange 51 ′ is R
There was a portion, which hindered downsizing of the vibrator 1.
On the other hand, in the pressed cap 5, there is almost no R portion between the cap body 52 and the flange 51,
The size of the vibrator 1 can be reduced as compared with the case where the drawn cap 5 'is adopted.

In the present embodiment, the metallized layer M is formed on substantially the entire surface of the sheet-shaped ceramic material 2A. However, the present invention is not limited to this, and the metallized layer is formed only on a part requiring metallization. You may.

-Modification- Next, a modification of the present invention will be described.

(Modification of Thin Film Material) First, as a modification of the material of the thin film P formed on the ceramic base 2 after firing, chromium (Cr) may be used instead of nickel. That is, the lower layer of the thin film P composed of these two layers is preferably made of a metal which easily generates an oxide, whereby good adhesion to the metallized layer M can be obtained. Further, as the material of the other layer, silver (Ag) or copper (Cu) can be employed instead of gold.

(Modification of Cap 5) As a modification of the cap 5, as shown in FIG. 4, the cap 5 is formed in a U-shaped cross section. That is, the flange 51 is not formed. Therefore, soldering is performed so that the open side edge of the cap 5 abuts on the seal pattern on the ceramic base 2. In this case, for example, the cap 5
Is 0.1 mm, the width of the seal area of the seal pattern may be 0.1 mm. In the conventional method, a sealing area of 0.3 mm or more was required in consideration of shrinkage of the ceramic base during firing. According to the present invention, the cap 5 can be satisfactorily joined to the ceramic base 2 even if the sealing area is set to 0.1 mm, and the size of the crystal unit 1 can be reduced with the reduction of the sealing area. Can be achieved.

(Manufacturing method by multi-cavity) The above-described method of manufacturing the crystal unit 1 is particularly suitable for a manufacturing method by multi-cavity. That is, a large-sized ceramic base 2 is manufactured by the above-described method, a plurality of quartz plates 4 are placed on the ceramic base 2, each is sealed with a cap 5, and then cut to obtain a plurality of quartz-crystal vibrating parts. This is a manufacturing method in which a child 1 is obtained. A plurality of specific examples of such a manufacturing method will be described below.

First, as a first manufacturing method, as shown in FIG. 5, a plurality of quartz plates are placed on the ceramic base 2 (the quartz plates are omitted in FIG. 5), and each of them corresponds to each. Are soldered individually to cut the ceramic base 2 between the crystal units 1 by laser or dicing. In FIG. 5, the cutting position is indicated by a dashed line.

In the second manufacturing method, as shown in FIG. 6, a cap 5 integrated with a plurality of quartz resonators 1 is adopted. When the cap 5 is cut, the cap 5 and the ceramic base 2 are connected to each other. Are cut together. In FIG. 6 as well, the cutting position is indicated by a chain line.

As shown in FIG. 7, the third manufacturing method also employs a cap 5 integrated over a plurality of crystal units 1 as a cap. In this manufacturing method, a portion of the cap 5 (a portion between the individual crystal units 1) is formed thin, and the thin portion 53 is cut at the time of cutting. Also in FIG. 7, the cutting position is indicated by a dashed line.

In each of the above-mentioned manufacturing methods, the pads 23, 23,... Constituting the back electrode are set in consideration of the cutting position. That is, the pad 23 is positioned inside the cutting position.

(Modification of Metalized Layer and Plating Layer) The region where the plated layer P is formed does not necessarily have to coincide with the region where the metalized layer M is formed. You may set it large. Hereinafter, this configuration will be specifically described with reference to the drawings.

FIGS. 8A and 8B show the ceramic base 2 after the metallizing step and the firing step in this example have been performed. FIG. 8A is a plan view, FIG. 8B is a rear view, and FIG. FIG. 2 is a cross-sectional view taken along line AA in FIG. Also,
9A and 9B show the ceramic base 2 after the thin film forming step and the patterning step in this example have been performed, wherein FIG. 9A is a plan view, FIG. 9B is a rear view, and FIG. 9C is FIG.
FIG. 4 is a cross-sectional view taken along line BB in FIG. FIG.
In (a), the mounting position of the quartz plate (tuning fork type quartz plate) 4 is indicated by a broken line.

As shown in these figures, in the present example, in the metallization step, only the portions (the portions called via holes 24A and 24B) filled with tungsten in the through holes on the surface side of the ceramic base 2 are metallized layers. M is formed. In each of the drawings, the formation portions of the via holes 24A and 24B are indicated by mesh lines.

On the other hand, on the back side of the ceramic base 2, metallized layers M are formed at four corners thereof. These metallization layers M on the back surface are composed of metallization layers M1 and M1 for device terminals formed so as to cover the via holes 24A and 24B, and metallization layers M2 and M2 for ground terminals. In each figure, the formation portions of these metallized layers M1 and M2 are hatched.

Then, in the thin film forming step, a plating layer P of a metal thin film is formed on substantially the entire surface including the via holes 24A and 24B on the surface side of the ceramic base 2, and in the patterning step, as shown in FIG. Next, patterning of the seal pattern SP and the element mounting portion pattern CP by the photolithography method is performed.

As described above, in this example, the size of the metallized layer M in the metallization step is different from the size of the plated layer P in the thin film forming step. In particular, in the configuration of the present example, the formation area of the metallized layer M on the front surface side of the ceramic base 2 can be minimized, and the amount of material used to form the metallized layer M can be reduced to reduce cost. be able to.

(Modification of Patterning Step and Thin Film Forming Step) As a modification of the patterning step and thin film forming step, a metallized layer M is patterned in advance, and a plating layer P is formed thereon. . That is, the metallized layer M is applied to the fired ceramic base 2 having the entire surface or a part of the surface metallized.
Then, patterning corresponding to the shapes of the seal pattern and the element mounting portion pattern is performed. Thereafter, nickel plating and gold plating are performed on the patterned metallized layer to form a plated layer P.
As a result, a seal pattern having a predetermined shape and an element mounting portion pattern are formed on the surface of the ceramic base 2.

According to this embodiment, the patterning process for the plating layer P by the photolithography method is not required, and the manufacturing process of the ceramic base 2 can be simplified.

-Other Embodiments- The present invention is not limited to the quartz oscillator 1 having the above-described structure, but may have other structures such as a quartz oscillator (tuning fork type) or lithium niobate or tantalum acid instead of quartz. The present invention is applicable to a piezoelectric vibrator using lithium or the like and various other electronic components.

When the cap 5 is soldered to the ceramic base 2, the solder may be re-melted to perform degassing.

[0061]

As described above, in the present invention, the ceramic base is baked before the patterning of the element mounting pattern or the like is performed, thereby preventing the ceramic base from shrinking after the patterning. For this reason, the base does not shrink after patterning, and high positional accuracy of patterning can be ensured. As a result, it is possible to appropriately set the relationship of the mounting position of the element or the like with respect to the patterning position, and it is possible to set the pattern width dimension and the interval dimension between the patterns to be small. The size and cost of parts can be reduced.

In the case where gold plating is performed on the surface of the nickel plating layer after nickel plating is performed on the metallized surface of the base, the lower layer of the thin film is a layer that easily generates oxide. Thus, good adhesion of the thin film to the metallized layer can be obtained, and the quality of the base can be improved.

Furthermore, when only the formation portion of the via hole for conducting the electrodes on the front and back surfaces of the base is used as the metallized region, the formation region of the metallized layer can be suppressed to a necessary minimum and the metallized layer is formed. The cost can be reduced due to the reduction in the amount of material used, and the practicality of the electronic component can be improved.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view schematically showing a crystal resonator according to an embodiment.

FIG. 2 is a view showing a forming process of a ceramic base.

FIG. 3A is a cross-sectional view illustrating a joint portion of a pressed cap to a ceramic base, and FIG. 3B is a cross-sectional view illustrating a joint portion of a drawn cap to a ceramic base.

FIG. 4 is a cross-sectional view showing a modification of the cap.

FIG. 5 is a diagram showing a first multi-cavity manufacturing method.

FIG. 6 is a diagram showing a second multi-cavity manufacturing method.

FIG. 7 is a view showing a third multi-cavity manufacturing method.

FIG. 8 shows a ceramic base after a firing step in a modification of the metallization layer and the plating layer, wherein (a) is a plan view,
(B) is a rear view, and (c) is a cross-sectional view along the line AA in (a).

9A and 9B show a ceramic base after a patterning step in a modification of the metallization layer and the plating layer, wherein FIG. 9A is a plan view, FIG. 9B is a rear view, and FIG.
It is sectional drawing which followed the B line.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Quartz crystal oscillator (electronic component) 2 Ceramic base (ceramic body) 2A Sheet-shaped ceramic material (ceramic sheet body) 24A, 24B Via hole 4 Quartz plate (element)

Claims (12)

[Claims] 1. A ceramic electronic component base on which an element is mounted, wherein a fired ceramic body having the entire surface or a part thereof metallized is formed with a conductive metal thin film on the entire surface thereof. An electronic component base, wherein an element mounting pattern having a predetermined shape is formed by patterning the metallized layer and the thin film layer. 2. In a ceramic electronic component base on which an element is mounted, a predetermined patterning is performed on a metallized layer of a fired ceramic body whose entire surface or a part of the surface is metallized, and An electronic component base, wherein an element mounting pattern having a predetermined shape is formed by forming a thin film of a conductive metal only on a metallized layer. 3. A ceramic electronic component base on which an element is mounted, wherein a fired ceramic body having a part of its surface metallized is formed by forming a conductive metal thin film on the entire surface of the fired ceramic body.
An electronic component base, wherein an element mounting pattern having a predetermined shape is formed by patterning the thin film layer. 4. A ceramic electronic component base on which an element is mounted, wherein a fired ceramic body having a via hole formed over the front and back surfaces has a conductive metal in a region including the via hole on the surface. An electronic component base, wherein an element mounting pattern having a predetermined shape is formed by forming a thin film of the above and patterning the thin film layer. 5. An electronic component comprising an element mounted on the base according to any one of claims 1 to 4. 6. A method for manufacturing an electronic component comprising an element mounted on a ceramic base, wherein a fired ceramic body having the entire surface or a part thereof metallized is coated with a conductive metal thin film over the entire surface. A thin film forming step of forming; a patterning step of patterning a metallized layer and a thin film layer to form an element mounting pattern of a predetermined shape; and an element mounting step of mounting an element corresponding to the element mounting pattern. A method for manufacturing an electronic component, comprising: 7. A method of manufacturing an electronic component comprising an element mounted on a ceramic base, wherein a patterning step of patterning a metallized layer on a fired ceramic body having the entire surface or a part thereof metallized; A thin film forming step of forming a conductive metal thin film only on the metallized layer patterned in the patterning step to form an element mounting pattern of a predetermined shape; and an element mounting step of mounting an element corresponding to the element mounting pattern. A method for manufacturing an electronic component, comprising: 8. The method for manufacturing an electronic component according to claim 7, wherein before the patterning step, a metallizing step of metallizing a surface of the ceramic sheet body formed by ceramic powder, and firing the metallized ceramic sheet body And performing a firing step of forming a ceramic body by heating. 9. A method for manufacturing an electronic component comprising an element mounted on a ceramic base, wherein a thin film of a conductive metal is formed on the entire surface of the fired ceramic body having a part of its surface metallized. An electronic device comprising: a thin film forming step; a patterning step of patterning a thin film layer to form an element mounting pattern having a predetermined shape; and an element mounting step of mounting an element corresponding to the element mounting pattern. The method of manufacturing the part. 10. A method of manufacturing an electronic component comprising an element mounted on a ceramic base, wherein a fired ceramic body having a via hole formed over the front and back surfaces is provided in a region including the via hole on the front surface. A thin film forming step of forming a conductive metal thin film; a patterning step of patterning the thin film layer to form an element mounting pattern having a predetermined shape; and an element mounting step of mounting an element corresponding to the element mounting pattern. A method of manufacturing an electronic component. 11. The method for manufacturing an electronic component according to claim 6, wherein before the thin film forming step, a metallizing step of metallizing a surface of the ceramic sheet body formed by the ceramic powder; And baking a ceramic sheet to form a ceramic body. 12. The method for manufacturing an electronic component according to claim 6, wherein in the thin film forming step, after nickel plating is performed on the metallized surface, gold plating is performed on the surface of the nickel plating layer. A method of manufacturing an electronic component, wherein the method is performed.