JP2002094277A - 電子機器の冷却装置 - Google Patents
電子機器の冷却装置Info
- Publication number
- JP2002094277A JP2002094277A JP2000318579A JP2000318579A JP2002094277A JP 2002094277 A JP2002094277 A JP 2002094277A JP 2000318579 A JP2000318579 A JP 2000318579A JP 2000318579 A JP2000318579 A JP 2000318579A JP 2002094277 A JP2002094277 A JP 2002094277A
- Authority
- JP
- Japan
- Prior art keywords
- cooling
- liquid
- heat
- flow path
- liquid flow
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 104
- 239000007788 liquid Substances 0.000 claims abstract description 61
- 239000000110 cooling liquid Substances 0.000 claims abstract description 33
- 238000010438 heat treatment Methods 0.000 claims abstract description 21
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 20
- 239000006096 absorbing agent Substances 0.000 claims abstract description 12
- 230000005855 radiation Effects 0.000 abstract description 9
- 230000020169 heat generation Effects 0.000 abstract 1
- 239000002826 coolant Substances 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 239000000696 magnetic material Substances 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 239000012809 cooling fluid Substances 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000318579A JP2002094277A (ja) | 2000-09-12 | 2000-09-12 | 電子機器の冷却装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000318579A JP2002094277A (ja) | 2000-09-12 | 2000-09-12 | 電子機器の冷却装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002094277A true JP2002094277A (ja) | 2002-03-29 |
| JP2002094277A5 JP2002094277A5 (enrdf_load_stackoverflow) | 2007-10-04 |
Family
ID=18797179
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000318579A Pending JP2002094277A (ja) | 2000-09-12 | 2000-09-12 | 電子機器の冷却装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002094277A (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005002307A1 (ja) * | 2003-06-27 | 2005-01-06 | Nec Corporation | 電子機器の冷却装置 |
| JP2005273617A (ja) * | 2004-03-26 | 2005-10-06 | Toshiba Corp | 流体ポンプ及び電気機器並びに冷却装置 |
| JP2012009898A (ja) * | 2011-09-28 | 2012-01-12 | Sanyo Denki Co Ltd | 電子部品冷却装置 |
-
2000
- 2000-09-12 JP JP2000318579A patent/JP2002094277A/ja active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005002307A1 (ja) * | 2003-06-27 | 2005-01-06 | Nec Corporation | 電子機器の冷却装置 |
| JPWO2005002307A1 (ja) * | 2003-06-27 | 2007-11-01 | 日本電気株式会社 | 電子機器の冷却装置 |
| US7483261B2 (en) | 2003-06-27 | 2009-01-27 | Nec Corporation | Cooling device for an electronic equipment |
| JP4561632B2 (ja) * | 2003-06-27 | 2010-10-13 | 日本電気株式会社 | 電子機器の冷却装置 |
| JP2005273617A (ja) * | 2004-03-26 | 2005-10-06 | Toshiba Corp | 流体ポンプ及び電気機器並びに冷却装置 |
| JP2012009898A (ja) * | 2011-09-28 | 2012-01-12 | Sanyo Denki Co Ltd | 電子部品冷却装置 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20070315 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20070809 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20070821 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20090422 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20090424 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20090821 |