JP2002091019A - Method for forming printed film of electronic material - Google Patents

Abstract

PROBLEM TO BE SOLVED: To suppress the bleeding and sagging of a printed film of ink of an electronic material in the lateral direction when the ink is injected into a part obtained by partially removing a resist film on a substrate to form the printed film and to enhance the pattern precision of a resistor or the like by the ink. SOLUTION: In the method for forming a printed film of an electronic material, a resist is applied on a substrate 1 to form a resist film 2, the required part of the resist film 2 is removed, ink 4 of the electronic material is injected into the part freed of the resist film 2 to form a printed film, the injected ink 4 is cured and the resist film 2 is optionally removed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for forming a printed film of an electronic material on a substrate such as a printed wiring board or a ceramic substrate by using an electronic material such as a resistor material or a conductive material. .

[0002]

2. Description of the Related Art Conventionally, this type of printing method for electronic materials has
A pattern such as a resistor was formed by a screen printing method. In the screen plate, an opening is formed in advance in a portion where ink is to be printed by a photolithography technique, and the screen plate and the printing material are aligned and brought into close contact with each other. Next, printing was performed by moving the squeegee while applying an appropriate force downward, so that the ink applied in advance in the direction of movement of the squeegee was embedded in the opening of the screen plate. Next, separate the screen plate from the substrate,
Leave only the ink on the substrate. Thereafter, the ink was cured at a predetermined temperature and time.

[0003]

However, in the conventional printing method for electronic materials, the screen plate is separated from the printing material in a state where the ink is not cured, so that the horizontal method of the ink cannot be restricted, and the lateral bleeding cannot be performed. There is a problem that the pattern of the resistance or the like is not sufficiently accurate, and that the pattern of the resistance or the like is not sufficient.
Another problem is that when the screen plate is separated from the printing material, a part of the ink adheres to the side surface of the opening of the screen plate, and the amount of the applied ink is not constant. Then, this invention was made in order to solve such a subject, and after injecting the ink of an electronic material into the part which removed the resist film on a board | substrate, forming a printing film and hardening the said ink, An object of the present invention is to provide a novel method for forming a printed film of an electronic material, which removes the resist film.

[0004]

According to a first aspect of the present invention, there is provided a method of forming a printed film of an electronic material, comprising the steps of: applying a resist on a substrate to form a resist film; A removing step of removing a portion, a printing step of injecting an electronic material ink into the removed portion of the resist film after the removing step to form a printed film, and a curing step of curing the ink after the printing step, And a resist film removing step of removing the resist film after the curing step.

According to a second aspect of the present invention, in the method of printing a film of an electronic material, the curing step is a heat treatment.

According to a third aspect of the present invention, there is provided a method of forming a printed film of an electronic material, comprising the steps of: applying a permanent resist on a substrate to form a permanent resist film; A first removing step of removing, a printing step of injecting an electronic material ink into the removed portion of the permanent resist film after the first removing step to form a printed film, and a curing step of curing the ink after the printing step And a second removing step of removing the permanent resist adhering to the permanent resist film after the curing step.

According to a fourth aspect of the present invention, in the method for forming a printed film of an electronic material, the second removing step is a polishing process.

According to a fifth aspect of the present invention, there is provided a method of forming a printed film of an electronic material, wherein a resist film is formed by applying a resist on a substrate to form a resist film, and a removing step of removing a required portion of the resist film. And after the removing step, a first printing step of injecting an electronic material ink into the removed portion of the resist film under reduced pressure or vacuum to form a printed film, and after the first printing step, return to normal pressure. A second printing step of injecting the ink again to perform printing.

According to a sixth aspect of the present invention, in the method for forming a printed film of an electronic material, the reduced pressure prevents evaporation of the solvent of the ink and does not exceed the vapor pressure of the ink at the printing temperature of the ink. The method according to claim 5, wherein the setting is performed.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiment 1 Embodiment 1 FIG. Hereinafter, as Example 1 according to Embodiment 1 of the present invention, a method for manufacturing a printed resistor will be described with reference to FIG. 1A to 1F are manufacturing process diagrams of the printed resistor according to the first embodiment. FIG. 1 (a) (b)
In step (1), a resist of a photosensitive dry film is applied to a predetermined thickness on a substrate 1 to form a resist film 2. The substrate 1 is not only a printed wiring board but also a ceramic substrate or the like. Usually, the thickness of the resist film 2 is 25 μm to 50 μm,
The thickness accuracy is about ± 3 μm, but is not limited to this. As the dry film resist, for example, a commercially available dry film can be used. Next, as shown in FIG. 1C, a required portion of the resist film 2 is removed by a photolithography technique. Then, as shown in FIG.
A commercially available ink 4 is injected by a squeegee 3 into a required portion from which the resist film 2 has been removed. Thereafter, in the state shown in FIG. 1E, the ink 4 is cured by heating at 120 ° C. in an oven. Thereafter, the resist film 2 is removed with an alkali stripping solution to form a printed resistor made of the ink 4 as shown in FIG. Further, in order to completely cure the ink 4, the ink 4 may be heated again here.

Embodiment 2 FIG. In the second embodiment, a commercially available photosensitive liquid resist is used as the resist. This liquid resist is applied to the substrate 1 with a predetermined thickness by a known screen printing method, spray coating method, roll coating method or slot coating method. After the application, the liquid resist is cured by a heating step at a temperature of 80 ° C. for 0.5 hour. After that, a printing resistor of the ink 4 is formed by the same steps as those in the first embodiment.

As described above, according to the first and second embodiments,
Through the above-described manufacturing process, the sagging and bleeding of the ink 4 in the lateral direction can be effectively prevented, and the ink 4 is also controlled by the thickness of the resist film 2 in the thickness direction. Thus, printing with high dimensional accuracy can be performed. In the first and second embodiments, the case where the printed resistor is formed using the resistor material as the electronic material has been described. However, the present invention is not limited to this, and the conductive material, the dielectric material, the magnetic material, The present invention can also be applied to a method for forming a conductive film, a dielectric film, and the like using a semiconductor material.

Embodiment 2 FIG. In the first embodiment, the resist film 2 is finally peeled and removed, but in the second embodiment, the resist film 2 is not peeled and removed by using a photosensitive permanent resist. As the photosensitive permanent resist, a commercially available resist generally having good heat resistance, insulation properties, adhesion to the substrate 1 and the like is used. Hereinafter, the second embodiment will be described with reference to FIG. FIG.
(F) is a manufacturing process diagram of the printed resistor according to the second embodiment. As shown in FIGS. 2A and 2B, a photosensitive permanent resist of a photosensitive dry film is applied on the substrate 1 to form a photosensitive permanent resist film 5. The substrate 1 is a printed wiring board, a ceramic substrate, or the like, as in the first embodiment. The thickness of the photosensitive permanent resist film 5 is also 25.
μm to 50 μm, and the thickness accuracy is about ± 3 μm, but is not limited thereto. This is the same as in the first embodiment. Next, as shown in FIG. 2C, a required portion of the photosensitive permanent resist film 5 is removed by a photolithography technique, and thereafter, as shown in FIG. The squeegee 3 is used to inject the ink 4 into the required portion where the ink has been removed. The ink 4 is the same as in the first embodiment. Thereafter, the ink 4 is cured by heating at 180 ° C. in an oven in a state shown in FIG. Since the ink 4 partially adheres to the photosensitive permanent resist film 5, the surface of the photosensitive permanent resist film 5 is polished by a rotary polishing machine or the like, and the ink 4 adhering to the surface is removed. In this way, as shown in FIG. 2F, a printing resistor made of the ink 4 is formed. Further, in order to completely cure the ink 4, the ink 4 may be heated again.

Embodiment 3 A method for manufacturing a printed resistor according to Embodiment 3 of the present invention will be described below. A photosensitive resist is applied on a substrate such as a printed wiring board and a ceramic substrate to form a resist film. Next, a required portion of the resist film is removed by photolithography. Thereafter, ink is injected by a squeegee or the like into a required portion from which the resist film has been removed under reduced pressure or vacuum.
The reason why the ink is printed under reduced pressure or vacuum is to reduce bubbles in the ink and to reduce variations in resistance values when a plurality of printing resistors are formed using the ink. During printing of the ink, the degree of reduced pressure (atmospheric pressure) depends on the vapor pressure of the ink solvent. Actually, when a high boiling point solvent such as diethyl glycol or monobutyl ether (20 ° C., vapor pressure 3 Pa) is used for the ink, the atmospheric pressure during printing of the ink prevents evaporation of the solvent of the ink and the ink. Is set so as not to exceed the vapor pressure of the solvent of the ink at the printing temperature. Thereafter, the pressure is once returned to normal pressure to shrink the bubbles existing inside the ink. In addition, the ink is printed under the reduced pressure or vacuum to reduce bubbles in the solvent. By repeating such a process a plurality of times, volume shrinkage due to bubbles coming out of the ink solvent during the first printing can be compensated for, and variation in the resistance value of the printing resistor can be reduced.

In the first and second embodiments, in the first and second embodiments, the case where the printed resistor is formed by using the resistor material as the electronic material has been described. However, the present invention is not limited to this. , Conductive materials, dielectric materials, magnetic materials,
The present invention can also be applied to a method for forming a conductive film, a dielectric film, and the like using a semiconductor material.

[0016]

As described above, according to the present invention, a printed film is formed by injecting an electronic material ink into a portion of the substrate from which the resist film has been removed, and after curing the ink, the resist film is removed. Therefore, there is an effect that bleeding or sagging of the ink in the lateral direction of the printing film is less likely to occur, and the accuracy of a pattern such as resistance is improved.

[Brief description of the drawings]

FIG. 1 is a sectional configuration diagram of a multilayer printed wiring board according to the present invention.

FIG. 2 is a sectional configuration diagram of a multilayer printed wiring board according to the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Substrate, 2 ... Photosensitive resist film, 3 ... Squeegee, 4 ...
Ink, 5 ... photosensitive permanent resist film

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H05K 3/10 H05K 3/12 610F 3/12 610 B41M 1/12 // B41M 1/12 H05K 1/16 CH05K 1/16 B41J 3/20 111H F-term (reference) 2C065 JH06 JH07 JH12 JH14 2H096 AA27 HA01 HA30 JA04 JA10 LA01 2H113 AA01 AA04 BA09 BA47 BB09 BB22 BC00 BC10 BC12 CA17 FA28 FA29 FA34 FA35 4E351 BBA BB01 CC22 CC40 DD01 EE01 GG06 5E343 AA02 AA11 AA23 BB16 BB21 BB63 BB72 DD01 EE17 ER11 ER12 ER35 GG08

Claims (6)

[Claims] A resist film forming step of applying a resist on a substrate to form a resist film; a removing step of removing a required portion of the resist film; A printing step of injecting a material ink to form a printing film, a curing step of curing the ink after the printing step, and a resist film removing step of removing the resist film after the curing step. And a method for forming a printed film of an electronic material. 2. The method according to claim 1, wherein the curing step includes a heat treatment. 3. A permanent resist film forming step of applying a permanent resist on a substrate to form a permanent resist film, a first removing step of removing a required portion of the permanent resist film, and after the first removing step, A printing step of injecting an electronic material ink into a portion where the permanent resist film has been removed to form a printed film, a curing step of curing the ink after the printing step, and an adhesion on the permanent resist film after the curing step A method for forming a printed film of an electronic material, comprising: a second removing step of removing a permanent resist. 4. The method according to claim 3, wherein the second removing step performs a polishing process. 5. A resist film forming step of applying a resist on a substrate to form a resist film, a removing step of removing a required portion of the resist film, and after the removing step, the resist film is formed under reduced pressure or vacuum. A first printing step of injecting an ink of an electronic material into a portion where the ink has been removed to form a print film, and a second printing step of returning to normal pressure and injecting the ink again to perform printing after the first printing step And a method for forming a printed film of an electronic material. 6. The electronic device according to claim 5, wherein the reduced pressure is set to a range that does not exceed a vapor pressure of the ink at a printing temperature of the ink while preventing evaporation of a solvent of the ink. A method for forming a printed film of a material.