KR100865120B1 - Method for manufacturing of multi-layer PCB using ink jet printing type - Google Patents

Abstract

The present invention relates to a method for manufacturing a multilayer printed circuit board using an inkjet printing method. The present invention includes a first step of manufacturing a single printed circuit board by inkjet patterning, a second step of stacking a single printed circuit board in multiple layers, and a third step of curing and completing the stacked multilayer printed circuit boards. Characterized in that. Therefore, the present invention is simple in the manufacturing process for manufacturing a multi-layer printed circuit board is improved in terms of productivity and excellent cost in terms of cost reduction.

Inkjet method, multilayer printed circuit board,

Description

Method for manufacturing of multi-layer PCB using ink jet printing type}

1A and 1G are cross-sectional views illustrating a conventional multilayer printed circuit board,

Figure 2a and 2d is a process chart for explaining a printed circuit board of the inkjet printing method according to an embodiment of the present invention,

3 is a process chart for explaining a multi-layer printed circuit board of the inkjet printing method according to an embodiment of the present invention;

Figure 4 is a procedure illustrating a procedure for manufacturing a multi-layer printed circuit board of the inkjet printing method according to an embodiment of the present invention.

* Explanation of symbols for main parts of the drawings

20: coverlay 21: polyamide substrate

22: adhesive insulator 23: pattern

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a printed circuit board, and more particularly, to a method for manufacturing a multilayer printed circuit board for manufacturing a multilayer printed circuit board formed by stacking a plurality of single-layer circuit boards.

       In recent years, as electronic devices become smaller and thinner, miniaturization and densification of semiconductors such as LSI and Very Large Scale Integration (VLSI) are progressing. Accordingly, printed circuit boards are required to be made of high density and thin plates. In response, the company is running unfair research and development.

Therefore, in order to improve the degree of integration, a multilayer printed circuit board is manufactured.

       1A to 1G are cross-sectional views for explaining such a conventional multilayer printed circuit board.

       Hereinafter, a manufacturing process of a multilayer printed circuit board using a conductive liquid photosensitive material according to the present invention will be described in detail with reference to FIGS. 1A to 1G.

       First, as illustrated in FIG. 1A, an insulating material is applied to a jig 100 in a build-up manner to form an insulating layer 110.

       In this case, the insulating layer 110 may be formed without using the jig 100.

       Here, the insulating material is excellent in electrical properties, but prepreg made of semi-cured state by infiltrating glass fiber into a thermosetting resin having insufficient mechanical strength and a change in order (thermal expansion coefficient) due to temperature of about 10 times that of a metal or Build-up film with filler added to improve mechanical and thermal properties of synthetic resins.

       Thereafter, as illustrated in FIG. 1B, a via hole 120 for interlayer connection is formed in the insulating layer 110.

       The via hole 120 is generally formed using mechanical drilling, but it is preferable to use YAG (Yttrium Aluminum Garnet) laser or CO2 laser because it requires precise processing when forming a fine circuit pattern. The YAG laser is a laser capable of processing both a copper foil layer and an insulating layer, and the CO2 laser is a laser capable of processing only an insulating layer.

       After the via hole 120 is formed as described above, as shown in FIG. 1C, the via hole 120 is filled with the conductive liquid photosensitive material 130 and coated on the insulating layer 110. A conductive layer for forming a pattern is formed.

       The conductive liquid photosensitive material 130 is a liquid material in which the photosensitive polymer is mixed with the conductive polymer.

       When the conductive liquid photosensitive material 130 is applied, a screen coating method, a dip coating method, a roll coating method, an ED (Electro Deposition) method, etc., are used to make a uniform surface.

       Thereafter, as illustrated in FIG. 1D, after the curing process is performed on the conductive liquid photosensitive material 130, the jig 100 is removed.

       Here, the curing step refers to a step of drying the conductive liquid photosensitive material 130 using an oven or a hot air blower.

       As described above, after the jig 100 is removed, as shown in FIG. 1E, a circuit pattern is formed by coating chromium on an artwork film or glass surface on which a circuit pattern is formed on a conductive layer formed of the conductive liquid photosensitive material 130. The exposure process is performed by bringing a mask such as a glass mask into contact with each other.

       The exposure process is a process that causes the photosensitive material to react with light by irradiating ultraviolet rays. If the mask is formed by closely contacting a mask having a circuit pattern formed thereon, the ultraviolet rays do not pass through the wiring pattern portion but the ultraviolet rays pass through the other portions. (A) and the unexposed part A 'is formed. The exposed portion A exposed to ultraviolet rays changes physical or chemical properties by a polymerization reaction.

       Subsequently, as illustrated in FIG. 1F, when the developing process is performed on the exposed portion A and the unexposed portion A ', the single layer base substrate 150 on which the circuit pattern 140 is formed is completed.

       According to the characteristics of the photosensitive polymer, the unexposed portion A 'is dissolved while leaving the exposed portion A exposed to ultraviolet rays, or the exposed portion A is dissolved and unexposed portion A' is exposed to ultraviolet rays. In the remaining process, the unexposed portion A 'or the exposed portion A is removed due to the difference in the solubility of the exposed portion A and the unexposed portion A' in the developer. After the developing step, washing and drying are performed to remove the developer remaining on the substrate.

       After the base substrate 150 was completed as described above, the base substrate 150 was laminated according to the desired number of layers, and then heated and pressed to finally complete the multilayer printed circuit board as shown in FIG. 1G.

       Thereafter, as shown in FIG. 1G, the base substrate 150 and the insulating layer 160 are alternately stacked according to the desired number of layers, and then heated and pressed. In addition, a bonding layer (not shown) for adhesion between the layers is provided above and below the insulating layer 160.

       Here, the insulating layer 160 is an insulating layer in a cured state formed of a mixture of a general resin and a reinforcing base material such as paper, glass fiber, and glass nonwoven fabric, or has excellent electrical properties but insufficient mechanical strength and a change in order due to temperature It is possible to use both prepreg made of semi-cured state by penetrating glass fiber to thermosetting resin that is 10 times larger than metal, and build-up film with filler added to improve mechanical / thermal properties to synthetic resin.

       As such, when forming a conventional multilayer substrate, an insulating layer for insulation and an adhesive layer for adhesion between layers should be separately provided.

       The multilayer printed circuit board performs a separate process called a hot press in a manufacturing process for stacking the substrates in multiple layers due to adhesive and insulating problems.

       Therefore, the conventional multilayer printed circuit board has caused an increase in the manufacturing cost by using expensive raw materials, and also in the manufacturing, there is a problem in that productivity decreases due to an increase in manufacturing labor.

Accordingly, an object of the present invention is to form a coverlay made of a substrate and an adhesive insulator by using an adhesive insulator having adhesiveness and insulation between the substrate and the substrate at the same time to solve the above-mentioned problems and to form a circuit with inkjet thereon. The present invention provides a method of manufacturing a multilayer printed circuit board using an inkjet printing method, which can be easily stacked to form a multilayer circuit board.

In the method of manufacturing a multilayer printed circuit board according to the present invention for achieving the above object, the first step of manufacturing a single printed circuit board by inkjet patterning, the second step of laminating a single printed circuit board in multiple layers, and And a third step of curing and completing the stacked multilayer printed circuit board.

In addition, the first step is the step of applying the adhesive insulator to the substrate provided, the step of completing the coverlay integrally integrated with the substrate and the adhesive insulator, performing the inkjet patterning on the substrate of the coverlay, patterned Performing heat treatment on the substrate to vaporize a specific component of the ink.

In addition, the ink of the step of performing inkjet patterning is characterized in that the mixed solvent of silver and solvent.

In addition, the specific component of the ink to be vaporized is characterized in that the solvent.

In addition, the curing of the third step is characterized in that the heating and pressing.

Hereinafter, with reference to the accompanying Figures 2 to 4 will be described in detail a preferred embodiment of the present invention.

2A and 2D are process diagrams for describing an inkjet printing method of a printed circuit board according to an exemplary embodiment of the present invention.

Referring to FIG. 2A, the substrate 21 prepares a polyamide (thermosetting resin) film capable of withstanding heat of 200 degrees or more in a later heating process. As shown in FIG. 2B, an adhesive insulator 22 having both insulation and conductivity between substrates is formed under the substrate 21. In this way, the substrate 21 and the adhesive insulator 22 are integrally formed to complete the coverlay 20. Since the coverlay has adhesiveness and insulation at the same time, it is suitable for stacking a plurality of layers, thereby easily manufacturing a multilayer printed circuit board. This coverlay is shown in Figure 2c.

FIG. 2C illustrates a circuit pattern formed on the coverlay 20 in which the substrate 21 and the adhesive insulator 22 are integrally formed using an inkjet method. At this time, the inkjet header is positioned above the substrate 21. The inkjet header is filled with ink, which is mixed with metal (eg silver) and solvent (eg water or ethanol). This ink is sprayed through the nozzle of the inkjet header to form a circuit pattern on the substrate 21. This technique was filed by the same applicant in Korean Patent Application No. 2003-39634. The inkjet printing method of nanoparticle patterning is a solution input step in which a solution made by dissolving a metal salt, a metal, or a ceramic component to be patterned in pure water is installed in a pressure chamber, and the pressure in the pressure chamber is kept constant. Particle generation step of generating fine charged particles at the nozzle part of the other end of the microcapillary tube impregnated in the solution by applying a constant high voltage to the solution and on the path where the charged particle jet discharged from the nozzle part is scanned to the substrate having the opposite polarity. The charged particle jet, which has undergone the particle concentration step and the particle concentration step, which reduces the diameter of the particle jet by the electrostatic repulsive force of the same-polarity electrostatic concentration device, is attached to the substrate, and the substrate is a micro feeder driven by a step motor. And by the control device to control the conveyer to the input path By being moved in a fine pattern can discloses a technique comprising particles patterning step in which the fine grain pattern on the specimen.

 By applying this method, a circuit pattern can be formed through an inkjet header. Next, referring to FIG. 2D, a heating process for vaporizing solvent in particles of ink on a substrate is shown. That is, only the circuit pattern 23 can be formed by vaporizing the solvent in the ink jetted from the inkjet header. Therefore, the circuit pattern 23 is formed on the coverlay 20 to complete the formation of the printed circuit board.

A method of manufacturing a multilayer printed circuit board by stacking the completed printed circuit board into a multilayer printed circuit board will be described below with reference to FIGS. 3 and 4.

3 is a process diagram illustrating a multilayer printed circuit board of an inkjet printing method according to an embodiment of the present invention.

Referring to FIG. 3, after completing the coverlay 20 as described above, the coverlay 20 is laminated according to the desired number of layers, and then heated and pressurized to finally form the multilayer printed circuit board as illustrated in FIG. 3. Complete

       Thereafter, as shown in FIG. 3, the coverlays 20 and 20 'are laminated according to the desired number of layers, and then heated and pressed. That is, it is not necessary to laminate | stack a separate adhesive layer between coverlays 20 and 20 '.

       3, the coverlay 20 is completed by integrating the substrate 21 and the adhesive insulator 22 and the circuit pattern 23 is completed on the substrate. Then, the coverlay 20 'is completed by integrating another substrate 21' and the adhesive insulator 22 ', and the circuit pattern 23' is completed on the substrate. These separately integrated and completed coverlays 20, 20 'are laminated, heated and pressed. In this case, since the adhesive insulator 22 of the coverlay serves as an adhesive, a multilayer printed circuit board may be formed without forming a separate adhesive layer between layers. Subsequent processes, such as via hole formation for connection between layers after heating and pressing, are omitted in the description.

This multilayer printed circuit board will be described in more detail with reference to FIG. 4.

4 is a flowchart illustrating a procedure of manufacturing an inkjet printing multilayer printed circuit board according to an embodiment of the present invention.

Referring to FIG. 4, an adhesive insulator is coated on the prepared substrate (S10). An adhesive insulator is applied downward to the substrate to complete the coverlay formed integrally (S20). When the coverlay is completed, inkjet patterning is performed by inkjet printing to form a circuit pattern (S30). When the inkjet patterning is completed, it is heated to vaporize the solvent of the sprayed ink is subjected to a heat treatment process (S40). When the heat treatment is completed and the formation of the circuit pattern on the substrate in the coverlay is completed, a single substrate is completed (S50). When the single substrate is completed, a plurality of single substrates are laminated according to the laminated structure according to the desired number of layers (S60). When the lamination is completed, the curing process by pressing and heating (S70). When curing is completed, the multilayer printed circuit board is completed (S80). In this way, a multilayer circuit board is formed using an integrated coverlay without providing a separate adhesive layer.

Therefore, the present invention is simple in the manufacturing process for manufacturing a multi-layer printed circuit board is improved in terms of productivity and excellent cost in terms of cost reduction.

Claims (5)

In the multilayer printed circuit board manufacturing method, A first step of manufacturing a single printed circuit board by vaporizing the solvent by heat-treating the patterned substrate by inkjet patterning using ink which is a mixed solvent of silver and solvent; Stacking the single printed circuit board in multiple layers; And And a third step of curing and stacking the stacked multilayer printed circuit boards. The method of claim 1, The first step is Applying an adhesive insulator to the prepared substrate; Completing a coverlay in which the substrate and the adhesive insulator are integrally formed; Performing inkjet patterning on the substrate of the coverlay; And vaporizing a solvent of ink by performing heat treatment on the patterned substrate, wherein the multi-layer printed circuit board using the inkjet printing method is used. delete delete The method of claim 1, The hardening of the third step is A method of manufacturing a multilayer printed circuit board using an inkjet printing method, characterized in that heating and pressurization are performed.

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