JP2002083832A - Method for fixing ic chip - Google Patents
Method for fixing ic chipInfo
- Publication number
- JP2002083832A JP2002083832A JP2000273715A JP2000273715A JP2002083832A JP 2002083832 A JP2002083832 A JP 2002083832A JP 2000273715 A JP2000273715 A JP 2000273715A JP 2000273715 A JP2000273715 A JP 2000273715A JP 2002083832 A JP2002083832 A JP 2002083832A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- hot
- melt adhesive
- fixing
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title description 9
- 239000000853 adhesive Substances 0.000 claims abstract description 28
- 230000001070 adhesive effect Effects 0.000 claims abstract description 28
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 13
- 239000004831 Hot glue Substances 0.000 claims description 26
- 239000000463 material Substances 0.000 claims description 22
- 238000007789 sealing Methods 0.000 abstract description 6
- 239000012943 hotmelt Substances 0.000 abstract 3
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 239000003566 sealing material Substances 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 239000000565 sealant Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 241001590997 Moolgarda engeli Species 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000008034 disappearance Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Credit Cards Or The Like (AREA)
- Wire Bonding (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、非接触型データ送
受信体などに用いるＩＣチップの固定方法に関するもの
である。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for fixing an IC chip used in a non-contact type data transceiver.
【０００２】[0002]
【発明が解決しようとする課題】従来、非接触型ＩＣタ
グなどのように非接触状態でデータの送受信を行ってデ
ータの記録、消去などが行なえる情報記録メディア（Ｒ
Ｆ−ＩＤ（ＲａｄｉｏＦｒｅｑｕｅｎｃｙ ＩＤｅｎｔ
ｉｆｉｃａｔｉｏｎ））の用途に用いられる非接触型デ
ータ送受信体は、基材上に導電パターンであるアンテナ
を配置し、そのアンテナにＩＣチップを実装した構成を
有している。この非接触型データ送受信体のアンテナに
あっては、導電ペーストにより印刷形成しているととも
に、ＩＣチップにあってはアンテナのチップ取付部位
（導電ペーストにより形成された導電層）に突き刺さっ
て導通を図るバンプを備えたものが採用されている。そ
して、アンテナとＩＣチップとを接続するにあたって、
従来ではＡＣＦ（Ａｎｉｓｏｔｒｏｐｉｃ Ｃｏｎｄｕ
ｃｔｉｖｅ Ｆｉｌｍ（異方導電性フィルム））、ＡＣ
Ｐ（Ａｎｉｓｏｔｒｏｐｉｃ Ｃｏｎｄｕｃｔｉｖｅ
Ｐａｓｔｅ（異方導電性ペースト））などの異方性導電
接着物質を介在させて、また、ＮＣＦ（Ｎｏｎ−Ｃｏｎ
ｄｕｃｔｉｖｅ Ｆｉｌｍ（絶縁性フィルム））、ま
た、近年にあってはＮＣＰ（Ｎｏｎ−Ｃｏｎｄｕｃｔｉ
ｖｅ Ｐａｓｔｅ（絶縁性ペースト））などの絶縁接着
物質（導電物質を含まない接着物質）を介在させてＩＣ
チップを加熱圧着させており、前記異方性導電接着物質
や絶縁接着物質などからなる熱硬化性接着剤を介在させ
た固定を行なって、アンテナとＩＣチップとの接続を図
っていた。さらには、アンダーフィル材を用いてチップ
取付部位にＩＣチップをより確実に接続させるようにし
ていた。Conventionally, an information recording medium (R) such as a non-contact type IC tag capable of recording and erasing data by transmitting and receiving data in a non-contact state.
F-ID (RadioFrequency IDent)
The non-contact data transmitter / receiver used for the purpose of application (i.f. application)) has a configuration in which an antenna that is a conductive pattern is arranged on a base material, and an IC chip is mounted on the antenna. The antenna of this non-contact type data transmitting / receiving body is formed by printing with a conductive paste, and in the case of an IC chip, the antenna is pierced into a chip attaching portion (conductive layer formed by the conductive paste) to conduct electricity. The one provided with a bump to be used is adopted. And when connecting the antenna and the IC chip,
Conventionally, ACF (Anisotropic Condu)
active Film (anisotropic conductive film)), AC
P (Anisotropic Conductive)
Anisotropic conductive adhesive such as Paste (anisotropic conductive paste)) and NCF (Non-Con
conductive film (insulating film)), and in recent years, NCP (Non-Conductivity).
ve paste (insulating paste)) or other insulating adhesive material (an adhesive material that does not contain a conductive material)
The chip is heated and pressed, and the antenna and the IC chip are connected by fixing with a thermosetting adhesive made of the anisotropic conductive adhesive material or the insulating adhesive material interposed therebetween. Further, the IC chip is more reliably connected to the chip mounting portion by using an underfill material.
【０００３】ところで、ＩＣチップがバンプを有してい
るかどうかに拘わらず、上記異方性導電接着物質や絶縁
接着物質、アンダーフィル材を介在させたＩＣチップの
固定は、プリント基板や従来のフレキシブル基板のよう
に、局部的な折れを意識する必要のない硬い素材を基材
とした場合には有効なものとなっている。一方、非接触
型データ送受信体自体が薄形のものとされて、基材が硬
いフィルムから形成されていても、厚みが１００μｍ以
下、特に５０μｍ以下になると、１８０°の折れが生じ
易くなり、このような折れ曲がりが生じた場合には上述
した接着物質が追従しなくなり、ＩＣチップとチップ取
付部位との間で接続不良やＩＣチップの脱落などを生じ
る。そのため、従来ではチップ取付部位に配したＩＣチ
ップを封止材を用いて封止するようにしている。その工
程を図２に示していて、基材１上のチップ取付部位２に
上述の熱硬化性接着剤３を設け（接着剤として導電接着
物質を用いた例を示している）、さらにその上にＩＣチ
ップ４を配置し（ア）、このＩＣチップ４をまず、所要
の温度に昇温された熱盤５にて仮圧着として加熱圧着す
る（イ）。この後、仮圧着での熱盤５より高い温度に昇
温設定された熱盤６にて本圧着としてＩＣチップ４をチ
ップ取付部位２側に加熱圧着して熱硬化性接着剤３を硬
化させる（ウ）。つぎに封止材７をＩＣチップ４上から
供給して（エ）、ＩＣチップ４を覆った前記封止材７を
乾燥Ａさせることで、ＩＣチップ４を封止している
（オ）。なお、８はバンプを示している。[0003] Regardless of whether the IC chip has bumps or not, the fixing of the IC chip with the above-described anisotropic conductive adhesive material, insulating adhesive material, or underfill material interposed is performed on a printed circuit board or a conventional flexible board. This is effective when a hard material, such as a substrate, which does not need to be conscious of local bending is used as a base material. On the other hand, even if the non-contact type data transmitting and receiving body itself is a thin type, and the base material is formed of a hard film, the thickness becomes 100 μm or less, particularly when the thickness becomes 50 μm or less, the 180 ° bend easily occurs, When such a bend occurs, the above-mentioned adhesive substance does not follow, resulting in poor connection between the IC chip and the chip mounting portion, dropping of the IC chip, and the like. Therefore, conventionally, an IC chip disposed at a chip attachment site is sealed using a sealing material. The process is shown in FIG. 2, in which the above-mentioned thermosetting adhesive 3 is provided at the chip mounting portion 2 on the base material 1 (an example using a conductive adhesive substance as an adhesive is shown), and furthermore, First, the IC chip 4 is placed on the hot platen 5 which has been heated to a required temperature and heat-pressed (a). Thereafter, the IC chip 4 is heat-pressed to the chip mounting site 2 side as the final press-bonding on the hot platen 6 set to a higher temperature than the hot platen 5 in the temporary press-bonding, so that the thermosetting adhesive 3 is cured. (C). Next, the sealing material 7 is supplied from above the IC chip 4 (d), and the sealing material 7 covering the IC chip 4 is dried A to seal the IC chip 4 (e). Incidentally, reference numeral 8 denotes a bump.
【０００４】しかしながら、上記熱硬化性接着剤を用い
てＩＣチップをチップ取付部位に固定してＩＣチップと
導電パターンとの接続を行い、封止材を用いてＩＣチッ
プと導電パターンとの接続切れやチップ脱落を防止しよ
うとする上述の従来方法では、熱硬化性接着剤を硬化さ
せる加熱圧着工程と供給された封止材を乾燥させて硬化
させる封止工程とが順を追って必要となっているもので
あり、ＩＣチップの配置から封止完了までのチップ固定
に係る時間が長くなるという問題がある。そこで本発明
は上記事情に鑑み、上記熱硬化性接着剤を硬化させてＩ
Ｃチップを圧着させる加熱圧着工程と封止工程とを一緒
に行えるようにすることを課題とし、ＩＣチップの固定
に係る時間を短縮することを目的とする。[0004] However, the IC chip is fixed to the chip mounting portion using the above-mentioned thermosetting adhesive, and the connection between the IC chip and the conductive pattern is performed. In the above-described conventional method for preventing chip or chip falling off, a heat-press bonding step of curing a thermosetting adhesive and a sealing step of drying and curing a supplied sealing material are required in order. Therefore, there is a problem that the time required for fixing the chip from the arrangement of the IC chip to the completion of the sealing is long. In view of the above circumstances, the present invention cures the above-mentioned thermosetting adhesive to obtain
An object of the present invention is to make it possible to perform a thermocompression bonding step of bonding a C chip and a sealing step together, and to reduce the time required for fixing an IC chip.
【０００５】[0005]
【課題を解決するための手段】本発明は上記課題を考慮
してなされたもので、基材に形成された導電パターンに
ＩＣチップを固定するにあたり、導電パターンのチップ
取付部位に熱硬化性接着剤を介して配置されたＩＣチッ
プにホットメルト接着シートを被せ、このホットメルト
接着シートを被せた状態で前記ＩＣチップをチップ取付
部位に加熱圧着し、前記加熱圧着により溶融したホット
メルト接着シートでＩＣチップを封止することを特徴と
するＩＣチップの固定方法を提供して、上記課題を解消
するものである。SUMMARY OF THE INVENTION The present invention has been made in consideration of the above problems, and has been made in consideration of the above problem. In fixing an IC chip to a conductive pattern formed on a substrate, a thermosetting adhesive is attached to a chip mounting portion of the conductive pattern. A hot-melt adhesive sheet is placed on the IC chip arranged via the agent, and the IC chip is heated and pressed on the chip mounting portion in a state where the hot-melt adhesive sheet is placed, and the hot-melt adhesive sheet is melted by the hot-press bonding. An object of the present invention is to solve the above-mentioned problem by providing a method of fixing an IC chip characterized by sealing the IC chip.
【０００６】[0006]
【発明の実施の形態】つぎに本発明を図１に示す実施の
形態に基づいて詳細に説明する。図１に示すようにＩＣ
チップ４を基材１におけるチップ取付部位２に固定する
に際しては、チップ取付部位２に熱硬化性接着剤３（接
着剤として導電接着物質を用いた例を示している）を設
け、その上にＩＣチップ４を配置し（ア）、そして、Ｉ
Ｃチップ４を所要の温度に昇温された熱盤５にて仮圧着
として加熱圧着する（イ）。図示した（ア）（イ）の段
階は従来における方法と同じである。上記仮圧着が行わ
れた後、ＩＣチップ４にホットメルト接着シート９をチ
ップ取付部位２の周囲にも及ぶようにして被せ、前記ホ
ットメルト接着シート９を被せた状態でＩＣチップ４を
チップ取付部位２に、仮圧着での熱盤５より高い温度に
昇温設定された熱盤６にて本圧着として加熱圧着する
（ウ）。この本圧着としての加熱圧着により前記熱硬化
性接着剤３が硬化して接着力を呈し、ＩＣチップ４とチ
ップ取付位置２での導電パターンとの接続がなされ、ま
た、前記ホットメルト接着シート９が溶融するように設
けられており、ホットメルト接着シート９が溶融してな
るホットメルト接着剤１０がＩＣチップ４及びチップ取
付部位２の周囲も覆うようになり、自然冷却、或いは強
制冷却して前記ホットメルト接着剤１０を硬化させてＩ
Ｃチップ４を封止する（エ）。なお、ＩＣチップ自体が
極めて小さくホットメルト接着シートも小寸のものであ
るため、溶融状態となったホットメルト接着剤の量が少
なく、そのホットメルト接着剤は自然冷却においても急
速に硬化する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described in detail based on an embodiment shown in FIG. IC as shown in FIG.
When the chip 4 is fixed to the chip attaching portion 2 of the base material 1, a thermosetting adhesive 3 (an example of using a conductive adhesive material as an adhesive) is provided on the chip attaching portion 2, and the chip attaching portion 2 is provided thereon. The IC chip 4 is placed (A), and I
The C chip 4 is heat-pressed as a temporary press on the hot platen 5 heated to a required temperature (A). The illustrated steps (a) and (a) are the same as the conventional method. After the above-mentioned temporary press-bonding is performed, the IC chip 4 is covered with the hot-melt adhesive sheet 9 so as to cover the periphery of the chip attaching portion 2, and the IC chip 4 is attached with the hot-melt adhesive sheet 9 covered. The part 2 is heated and press-bonded as a main press on the hot plate 6 set to a higher temperature than the hot plate 5 in the temporary press bonding (c). The thermosetting adhesive 3 is hardened by the thermocompression bonding as the final press bonding to exhibit an adhesive force, and the IC chip 4 is connected to the conductive pattern at the chip mounting position 2. Is melted, and the hot-melt adhesive 10 formed by melting the hot-melt adhesive sheet 9 also covers the periphery of the IC chip 4 and the chip mounting portion 2, and is naturally cooled or forcibly cooled. Curing the hot melt adhesive 10 to obtain I
The C chip 4 is sealed (d). Since the IC chip itself is extremely small and the hot-melt adhesive sheet is also small, the amount of the hot-melt adhesive in a molten state is small, and the hot-melt adhesive rapidly cures even in natural cooling.
【０００７】上記ホットメルト接着シート９は上述した
ように所定温度以上に昇温させたときに溶融状態となる
ホットメルト接着剤からなるものであり、例えばポリエ
ステル系である東亜合成株式会社製アロンメルト（商品
名）のホットメルト接着剤をシート状にしたり、有機溶
剤不溶型である東洋紡績株式会社製バイロン（商品名）
のホットメルト接着剤をシート状にしたものなどが使用
できる。また、上記基材の素材は特に限定されるもので
はなく、熱盤を用いた加熱圧着によって基材としての条
件から外れるような変形、変質を生じないものであれば
い。また、基材に形成する導電パターンも印刷やエッチ
ングなどにより得られるものであり、導電パターンの形
成方法が特に限定されるものではない。The hot-melt adhesive sheet 9 is made of a hot-melt adhesive which is in a molten state when the temperature is raised to a predetermined temperature or higher as described above. For example, polyester-based Alon Melt (manufactured by Toagosei Co., Ltd.) The hot melt adhesive (trade name) can be made into a sheet, and the organic solvent insoluble type Byron (trade name) manufactured by Toyobo Co., Ltd.
And the like can be used. The material of the base material is not particularly limited as long as it does not cause deformation or alteration that deviates from the conditions as a base material by heating and pressing using a hot plate. Further, the conductive pattern formed on the substrate is also obtained by printing, etching, or the like, and the method of forming the conductive pattern is not particularly limited.
【０００８】[0008]
【発明の効果】以上説明したように本発明のＩＣチップ
の固定方法によれば、基材に形成された導電パターンに
ＩＣチップを固定するにあたり、導電パターンのチップ
取付部位に熱硬化性接着剤を介して配置されたＩＣチッ
プにホットメルト接着シートを被せ、このホットメルト
接着シートを被せた状態で前記ＩＣチップをチップ取付
部位に加熱圧着し、前記加熱圧着により溶融したホット
メルト接着シートでＩＣチップを封止することを特徴と
するものである。これによって、ＩＣチップをチップ取
付部位に加熱圧着することで、硬化性接着剤の硬化によ
るＩＣチップと導電パターンとの接続と、ホットメルト
接着シートの溶融とが一緒に行えるようになり、この後
は溶融してなるホットメルト接着剤の冷却による硬化だ
けでＩＣチップが封止されるようになり、ＩＣチップの
配設から封止までの固定に関わる時間を短縮化できる。
そして、従来の加熱圧着工程が終了した場合でも、封止
剤滴下工程に移行する段階で基材側に曲りを生じるよう
な取り扱いを行ったときにはＩＣチップと導電パターン
との接続が切れる可能性があるが、本発明では、加熱圧
着完了の直後にホットメルト接着剤の温度を下げること
が簡単なものとなり、加熱圧着工程を終了したＩＣチッ
プ固定済みの製品に対する取り扱いにそれほどの注意を
要する必要がなくなるなど、実用性に優れた効果を奏す
るものである。As described above, according to the IC chip fixing method of the present invention, when the IC chip is fixed to the conductive pattern formed on the base material, the thermosetting adhesive is applied to the chip mounting portion of the conductive pattern. A hot melt adhesive sheet is placed on the IC chip disposed via the hot melt adhesive sheet, and the IC chip is heated and pressed on the chip mounting portion while the hot melt adhesive sheet is placed on the IC chip. It is characterized in that the chip is sealed. This allows the IC chip to be connected to the conductive pattern by the curing of the curable adhesive and the melting of the hot melt adhesive sheet by heating and pressing the IC chip to the chip mounting portion. The IC chip can be sealed only by curing the molten hot melt adhesive by cooling, and the time required for fixing from disposing the IC chip to sealing can be shortened.
Even when the conventional heat-compression bonding step is completed, there is a possibility that the connection between the IC chip and the conductive pattern may be cut off when handling such that bending occurs on the base material side at the stage of moving to the sealant dropping step. However, in the present invention, it is easy to lower the temperature of the hot-melt adhesive immediately after completion of the thermocompression bonding, and it is necessary to take great care in handling IC-fixed products that have completed the thermocompression bonding process. It has excellent practical effects such as disappearance.
【図１】本発明に係るＩＣチップの固定方法を示すもの
で、（ア）はＩＣチップをチップ取付部位に配設した状
態を示す説明図、（イ）は仮圧着を示す説明図、（ウ）
は本圧着を示す説明図、（エ）はホットメルト接着剤が
ＩＣチップを覆った状態を示す説明図である。FIGS. 1A and 1B show a method of fixing an IC chip according to the present invention, wherein FIG. 1A is an explanatory view showing a state in which an IC chip is arranged at a chip mounting portion, FIG. C)
FIG. 4 is an explanatory view showing the final pressure bonding, and FIG. 4D is an explanatory view showing a state in which the hot melt adhesive covers the IC chip.
【図２】従来例におけるＩＣチップの固定方法を示すも
ので、（ア）はＩＣチップをチップ取付部位に配設した
状態を示す説明図、（イ）は仮圧着を示す説明図、
（ウ）は本圧着を示す説明図、（エ）は封止剤の滴下を
示す説明図、（オ）は封止剤がＩＣチップを覆った状態
を示す説明図である。FIGS. 2A and 2B are views showing a method of fixing an IC chip in a conventional example, wherein FIG. 2A is an explanatory view showing a state in which the IC chip is arranged at a chip mounting portion, FIG.
(C) is an explanatory view showing the final pressure bonding, (D) is an explanatory view showing the dropping of the sealant, and (E) is an explanatory view showing a state where the sealant covers the IC chip.
１…基材 ２…チップ取付部位 ３…接着剤 ４…ＩＣチップ ５、６…熱盤 ９…ホットメルト接着シート １０…ホットメルト接着剤 Ｂ…強制冷却 DESCRIPTION OF SYMBOLS 1 ... Base material 2 ... Chip mounting part 3 ... Adhesive 4 ... IC chip 5, 6 ... Hot plate 9 ... Hot melt adhesive sheet 10 ... Hot melt adhesive B ... Forced cooling
───────────────────────────────────────────────────── フロントページの続き (72)発明者 山上 剛 東京都千代田区神田駿河台１丁目６番地ト ッパン・フォームズ株式会社内 Ｆターム(参考） 2C005 MA19 PA01 5B035 AA04 BA05 BB09 BC00 CA01 CA23 5F044 KK01 LL07 RR17 5F061 AA01 BA04 CA26 ────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Tsuyoshi Yamagami 1-6-6 Kanda Surugadai, Chiyoda-ku, Tokyo Toppan Forms Co., Ltd. F-term (reference) 2C005 MA19 PA01 5B035 AA04 BA05 BB09 BC00 CA01 CA23 5F044 KK01 LL07 RR17 5F061 AA01 BA04 CA26
Claims (1)
プを固定するにあたり、導電パターンのチップ取付部位
に熱硬化性接着剤を介して配置されたＩＣチップにホッ
トメルト接着シートを被せ、このホットメルト接着シー
トを被せた状態で前記ＩＣチップをチップ取付部位に加
熱圧着し、前記加熱圧着により溶融したホットメルト接
着シートでＩＣチップを封止することを特徴とするＩＣ
チップの固定方法。To fix an IC chip on a conductive pattern formed on a base material, a hot melt adhesive sheet is placed on an IC chip disposed on a chip mounting portion of the conductive pattern via a thermosetting adhesive. An IC characterized in that the IC chip is heat-pressed to a chip mounting portion with the hot-melt adhesive sheet covered thereon, and the IC chip is sealed with the hot-melt adhesive sheet melted by the heat-press bonding.
How to fix the chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000273715A JP2002083832A (en) | 2000-09-08 | 2000-09-08 | Method for fixing ic chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000273715A JP2002083832A (en) | 2000-09-08 | 2000-09-08 | Method for fixing ic chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2002083832A true JP2002083832A (en) | 2002-03-22 |
Family
ID=18759605
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000273715A Pending JP2002083832A (en) | 2000-09-08 | 2000-09-08 | Method for fixing ic chip |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002083832A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006139394A (en) * | 2004-11-10 | 2006-06-01 | Osaka Sealing Printing Co Ltd | Device and method for manufacturing sheet with micro-structure |
| JP2007095810A (en) * | 2005-09-27 | 2007-04-12 | Tokai Rika Co Ltd | Connector-integrated device |
| JP2007280343A (en) * | 2006-02-10 | 2007-10-25 | Fujitsu Ltd | Rfid tag manufacturing method and rfid tag |
| JP2008515178A (en) * | 2004-09-24 | 2008-05-08 | オベルトゥル カード システムズ ソシエテ アノニム | Method for assembling an electronic component on a preferably soft support and an electronic article such as a passport thus obtained |
| JP2009267344A (en) * | 2008-04-04 | 2009-11-12 | Sony Chemical & Information Device Corp | Method of manufacturing semiconductor device |
| JP2011049298A (en) * | 2009-08-26 | 2011-03-10 | Fujitsu Semiconductor Ltd | Method of manufacturing semiconductor device |
| CN105699875A (en) * | 2016-01-15 | 2016-06-22 | 工业和信息化部电子第五研究所 | Method for detecting multilayer copper interconnected layout structure |
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|---|---|---|---|---|
| JPS6245138A (en) * | 1985-08-23 | 1987-02-27 | Sony Corp | Manufacture of electronic part device |
| JPH11175682A (en) * | 1997-12-12 | 1999-07-02 | Hitachi Maxell Ltd | Ic card and its manufacture |
| JP2000215730A (en) * | 1999-01-25 | 2000-08-04 | Toshiba Chem Corp | Anisotropic conductive adhesive |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6245138A (en) * | 1985-08-23 | 1987-02-27 | Sony Corp | Manufacture of electronic part device |
| JPH11175682A (en) * | 1997-12-12 | 1999-07-02 | Hitachi Maxell Ltd | Ic card and its manufacture |
| JP2000215730A (en) * | 1999-01-25 | 2000-08-04 | Toshiba Chem Corp | Anisotropic conductive adhesive |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008515178A (en) * | 2004-09-24 | 2008-05-08 | オベルトゥル カード システムズ ソシエテ アノニム | Method for assembling an electronic component on a preferably soft support and an electronic article such as a passport thus obtained |
| JP2006139394A (en) * | 2004-11-10 | 2006-06-01 | Osaka Sealing Printing Co Ltd | Device and method for manufacturing sheet with micro-structure |
| JP2007095810A (en) * | 2005-09-27 | 2007-04-12 | Tokai Rika Co Ltd | Connector-integrated device |
| JP2007280343A (en) * | 2006-02-10 | 2007-10-25 | Fujitsu Ltd | Rfid tag manufacturing method and rfid tag |
| US8698633B2 (en) | 2006-02-10 | 2014-04-15 | Fujitsu Limited | RFID tag manufacturing method with strap and substrate |
| JP2009267344A (en) * | 2008-04-04 | 2009-11-12 | Sony Chemical & Information Device Corp | Method of manufacturing semiconductor device |
| EP2261963A1 (en) * | 2008-04-04 | 2010-12-15 | Sony Chemical & Information Device Corporation | Semiconductor device and method for manufacturing the same |
| EP2261963A4 (en) * | 2008-04-04 | 2013-09-11 | Sony Chem & Inf Device Corp | Semiconductor device and method for manufacturing the same |
| JP2011049298A (en) * | 2009-08-26 | 2011-03-10 | Fujitsu Semiconductor Ltd | Method of manufacturing semiconductor device |
| CN105699875A (en) * | 2016-01-15 | 2016-06-22 | 工业和信息化部电子第五研究所 | Method for detecting multilayer copper interconnected layout structure |
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