JP2002083808A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2002083808A5 JP2002083808A5 JP2001196819A JP2001196819A JP2002083808A5 JP 2002083808 A5 JP2002083808 A5 JP 2002083808A5 JP 2001196819 A JP2001196819 A JP 2001196819A JP 2001196819 A JP2001196819 A JP 2001196819A JP 2002083808 A5 JP2002083808 A5 JP 2002083808A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US60545400A | 2000-06-28 | 2000-06-28 | |
| US09/605454 | 2000-06-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002083808A JP2002083808A (ja) | 2002-03-22 |
| JP2002083808A5 true JP2002083808A5 (https=) | 2008-05-08 |
Family
ID=24423722
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001196819A Withdrawn JP2002083808A (ja) | 2000-06-28 | 2001-06-28 | 溶剤プリウェットを用いたコーティング・プロセス |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002083808A (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7605907B2 (en) | 2007-03-27 | 2009-10-20 | Asml Netherlands B.V. | Method of forming a substrate for use in calibrating a metrology tool, calibration substrate and metrology tool calibration method |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2901211B2 (ja) * | 1991-09-24 | 1999-06-07 | 松下電子工業株式会社 | 半導体装置の製造方法 |
| JPH05243140A (ja) * | 1992-02-27 | 1993-09-21 | Fujitsu Ltd | 回転塗布装置及び回転塗布方法 |
| JPH05310933A (ja) * | 1992-05-13 | 1993-11-22 | Toshiba Corp | 溶媒可溶性ポリイミドの製造方法 |
| JPH08330296A (ja) * | 1995-05-31 | 1996-12-13 | Sanyo Electric Co Ltd | 半導体装置の製造方法 |
-
2001
- 2001-06-28 JP JP2001196819A patent/JP2002083808A/ja not_active Withdrawn