JP2002083808A - 溶剤プリウェットを用いたコーティング・プロセス - Google Patents
溶剤プリウェットを用いたコーティング・プロセスInfo
- Publication number
- JP2002083808A JP2002083808A JP2001196819A JP2001196819A JP2002083808A JP 2002083808 A JP2002083808 A JP 2002083808A JP 2001196819 A JP2001196819 A JP 2001196819A JP 2001196819 A JP2001196819 A JP 2001196819A JP 2002083808 A JP2002083808 A JP 2002083808A
- Authority
- JP
- Japan
- Prior art keywords
- polyimide
- dispensing
- solvent
- wafer
- dispense
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000002904 solvent Substances 0.000 title claims abstract description 178
- 238000000576 coating method Methods 0.000 title abstract description 6
- 239000004642 Polyimide Substances 0.000 claims abstract description 177
- 229920001721 polyimide Polymers 0.000 claims abstract description 177
- 238000004519 manufacturing process Methods 0.000 claims abstract description 23
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims description 52
- 238000000034 method Methods 0.000 claims description 47
- 239000000126 substance Substances 0.000 claims description 37
- 239000000725 suspension Substances 0.000 claims description 3
- 239000000375 suspending agent Substances 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 abstract description 40
- 230000000717 retained effect Effects 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 75
- 230000008569 process Effects 0.000 description 14
- 238000012360 testing method Methods 0.000 description 13
- 238000010586 diagram Methods 0.000 description 11
- 230000006870 function Effects 0.000 description 11
- 230000033001 locomotion Effects 0.000 description 9
- 239000000463 material Substances 0.000 description 6
- 230000008901 benefit Effects 0.000 description 5
- 238000013461 design Methods 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 229920006362 Teflon® Polymers 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- 239000004809 Teflon Substances 0.000 description 3
- 238000004891 communication Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000003908 quality control method Methods 0.000 description 2
- 230000011664 signaling Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000011179 visual inspection Methods 0.000 description 2
- AVFZOVWCLRSYKC-UHFFFAOYSA-N 1-methylpyrrolidine Chemical compound CN1CCCC1 AVFZOVWCLRSYKC-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- AHVYPIQETPWLSZ-UHFFFAOYSA-N N-methyl-pyrrolidine Natural products CN1CC=CC1 AHVYPIQETPWLSZ-UHFFFAOYSA-N 0.000 description 1
- 206010067171 Regurgitation Diseases 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000004590 computer program Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000007562 laser obscuration time method Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000006223 plastic coating Substances 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Landscapes
- Formation Of Insulating Films (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US60545400A | 2000-06-28 | 2000-06-28 | |
| US09/605454 | 2000-06-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002083808A true JP2002083808A (ja) | 2002-03-22 |
| JP2002083808A5 JP2002083808A5 (https=) | 2008-05-08 |
Family
ID=24423722
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001196819A Withdrawn JP2002083808A (ja) | 2000-06-28 | 2001-06-28 | 溶剤プリウェットを用いたコーティング・プロセス |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002083808A (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7605907B2 (en) | 2007-03-27 | 2009-10-20 | Asml Netherlands B.V. | Method of forming a substrate for use in calibrating a metrology tool, calibration substrate and metrology tool calibration method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0582509A (ja) * | 1991-09-24 | 1993-04-02 | Matsushita Electron Corp | 半導体装置の製造方法 |
| JPH05243140A (ja) * | 1992-02-27 | 1993-09-21 | Fujitsu Ltd | 回転塗布装置及び回転塗布方法 |
| JPH05310933A (ja) * | 1992-05-13 | 1993-11-22 | Toshiba Corp | 溶媒可溶性ポリイミドの製造方法 |
| JPH08330296A (ja) * | 1995-05-31 | 1996-12-13 | Sanyo Electric Co Ltd | 半導体装置の製造方法 |
-
2001
- 2001-06-28 JP JP2001196819A patent/JP2002083808A/ja not_active Withdrawn
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0582509A (ja) * | 1991-09-24 | 1993-04-02 | Matsushita Electron Corp | 半導体装置の製造方法 |
| JPH05243140A (ja) * | 1992-02-27 | 1993-09-21 | Fujitsu Ltd | 回転塗布装置及び回転塗布方法 |
| JPH05310933A (ja) * | 1992-05-13 | 1993-11-22 | Toshiba Corp | 溶媒可溶性ポリイミドの製造方法 |
| JPH08330296A (ja) * | 1995-05-31 | 1996-12-13 | Sanyo Electric Co Ltd | 半導体装置の製造方法 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7605907B2 (en) | 2007-03-27 | 2009-10-20 | Asml Netherlands B.V. | Method of forming a substrate for use in calibrating a metrology tool, calibration substrate and metrology tool calibration method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20080325 |
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| A621 | Written request for application examination |
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| A977 | Report on retrieval |
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| A131 | Notification of reasons for refusal |
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| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20100323 |
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| A761 | Written withdrawal of application |
Free format text: JAPANESE INTERMEDIATE CODE: A761 Effective date: 20100325 |