JP2002076635A - Manufacturing method of multilayer printed-wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To machine a via hole to an insulating material by an inexpensive machining device and to effectively suppress the increase in machining time and costs even if the number of via holes to be machined to the insulating material increases. SOLUTION: The tip of a metal drilling pin 26 is positioned onto an interlayer connection section 66 and the drilling pin 26 is moved to the side of a printed- wiring surface 46, the via hole 74 reaching a circuit pattern 52 from a printed- wiring surface 60 is drilled onto the insulating material 58, and at the same time an interlayer connection section 66 is deformed plastically to form a cylindrical section 76 in contact with an interlayer terminal section 68 through the inside of the via hole 74, thus simultaneously drilling the via hole 74 at the insulating substance 58, and at the same time plastically deforming the interlayer connection section 66 at the position of the via hole 74 for electrical connection to the interlayer terminal section 68. Then, a conductive material 78 having flowability is filled into the via hole 74 and is heated and cured, thus reliably connecting the interlayer connection section 66 to the interlayer terminal section 68.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a multilayer printed wiring board in which a plurality of circuit boards are laminated and integrated.

[0002]

2. Description of the Related Art FIG. 7 shows the structure of a conventional multilayer printed wiring board. The multilayer printed wiring board 100 is manufactured by using a known build-up method, and includes a core layer 102 and a build-up layer 104 provided on the core layer 102. The core layer 102 includes a plate-shaped insulating base material 118 as a substrate support, and both sides of the insulating base material 104 are printed wiring surfaces 106, 1 respectively.
08. A copper plating layer 110 is formed on each of these printed wiring surfaces 106, and the copper plating layer 1 is formed.
10 is selectively etched by a known photoresist method or the like to form circuit patterns 112 and 114.

[0003] The build-up layer 104 provided on the core layer 102 includes a printed wiring surface 1 of the core layer 102.
06 is provided on the surface of the insulating base material 118, that is, the printed wiring surface 106.
The surface on the opposite side is the printed wiring surface 120.
A copper plating layer 122 is formed on the printed wiring surface 120 of the build-up layer 104.
Are selectively etched to form a circuit pattern 124.

In the above-described multilayer printed wiring board 100, when the circuit pattern 112 of the core layer 102 and the circuit pattern 124 of the buildup layer 104 are electrically connected, for example, the insulating base material 11 of the buildup layer 104 is used.
8, before forming the copper plating layer 122, a via hole 126 is formed in the insulating base material 118 from the printed wiring surface 120 to the surface of the circuit pattern 112 of the core layer 102 by laser light from a carbon dioxide laser or the like, and then printed. A copper plating layer 122 is integrally formed in the wiring surface 120 and the via hole 126, and the copper plating layer 1 in the via hole 126 is formed.
22, the circuit pattern 112 and the circuit pattern 124 are electrically connected.

[0005]

However, a high-power laser processing apparatus used for processing the via hole 126 in the insulating base material 118 by the above-described method is expensive, and such a laser processing apparatus is expensive. The equipment cost of the production line for the multilayer printed wiring board 100 provided is also expensive. When a plurality of via holes 126 are formed in the insulating base material 118 using a laser processing apparatus, one via hole 12
The laser beam axis and the multilayer printed wiring board 100 for each 6
It is necessary to repeat the operation of irradiating the multilayer printed wiring board 100 with laser light for a predetermined time with high precision by adjusting the relative position with respect to the multilayer printed wiring board 100. As the number of via holes 126 increases, the processing time for the multilayer printed wiring board 100 increases. Increase. As a result, a large number of via holes 126 are
The manufacturing cost of the multilayer printed wiring board 100 provided at 18 increases.

SUMMARY OF THE INVENTION In view of the above fact, it is an object of the present invention to make it possible to process via holes in an insulating base material using a low-cost processing apparatus. It is an object of the present invention to provide a method for manufacturing a multilayer printed wiring board that can effectively suppress an increase in processing time and processing cost.

[0007]

According to the method of manufacturing a multilayer printed wiring board according to the present invention, the tip of the perforated pin made of metal is connected to the metal conductor on the second printed wiring surface and to the first printed wiring board.
And the perforated pins are relatively moved to the first printed wiring surface side, and the pressing force from the perforated pins causes the second insulating base material to move from the second printed wiring surface to the first printed wiring surface. At the same time as drilling a via hole that reaches the circuit pattern,
The perforation pin is formed on the second printed wiring surface by plastically deforming a part of the metal conductor on the second printed wiring surface so that the metal conductor passes through the via hole and contacts the first circuit pattern. The metal conductor on the second printed wiring surface is electrically connected to the first circuit pattern through the via hole by the operation of positioning the drilled pin toward the first printed wiring surface side by positioning the hole at a predetermined position on the metal conductor. Since a via hole can be formed in the second insulating base material using a device having a simple structure including a support for the perforation pin, a mechanism for relatively pressing the perforation pin toward the first printed wiring surface, and the like, At the position of the via hole, the metal conductor on the second printed wiring surface and the circuit pattern on the first printed wiring surface can be electrically connected.

As a result, as compared with the conventional method of forming a via hole in an insulating base material using a laser processing device or the like, a via hole can be formed in the insulating base material by a processing device having a simple structure and a low price, so that a multilayer printed wiring is provided. The manufacturing cost of the plate can be reduced.

Further, a plurality of perforation pins are supported by a support, and the plurality of perforation pins are brought into contact with a metal conductor on the second printed wiring surface via the support, and these perforation pins are simultaneously connected to the second conductor. By pressing the printed circuit board toward the first printed wiring surface, a plurality of via holes can be formed in the second insulating base material at the same time. Therefore, even if the number of via holes processed in the second insulating base material increases, An increase in the processing time can be effectively suppressed, and an increase in the processing cost of the multilayer printed wiring board due to the increase in the processing time can also be suppressed.

Here, even if the metal conductor on the second printed wiring surface is a processing material of a circuit pattern (second circuit pattern) formed on the second printed wiring surface, It may be itself, or may be provided separately from the processing material or the second circuit pattern, and may be electrically connected to the second circuit pattern.

The via hole formed by the perforation pin may be formed so as to reach a position deeper than the surface of the first circuit pattern. For example, the first insulating pattern may be formed by breaking through the first circuit pattern. It may be perforated so as to reach an intermediate portion along the thickness direction of the material.

According to the method for manufacturing a multilayer printed wiring board according to the second aspect, in the method for manufacturing a multilayer printed wiring board according to the first aspect, the via hole is filled with a conductive material having fluidity, and the conductive material is filled. Is heat-cured to form connection conductors that are in close contact with the metal conductor in the via hole and the second circuit pattern portion, respectively, thereby plastically deforming through the via hole and contacting the first circuit pattern. When the contact area between the part of the metal conductor and the first circuit pattern is small, or when the part of the metal conductor and the first circuit pattern are relatively moved in the direction away from each other due to deformation of the board after the formation of the via hole. However, the connection between the metal conductor on the second printed wiring surface and the first circuit pattern can be reliably maintained by the connection conductor, and the connection between the metal conductor on the second printed wiring surface and the first circuit pattern is ensured. It is possible to prevent an increase in the electrical resistance between the turn.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a method for manufacturing a multilayer printed wiring board according to an embodiment of the present invention will be described with reference to the drawings.

(First Embodiment) FIG. 1 shows a first embodiment of the present invention.
1 shows a hole processing apparatus for a multilayer printed wiring board according to the embodiment. The hole processing apparatus 10 is provided in a production line of a multilayer printed wiring board and is for forming a via hole in an insulating base material. The hole processing apparatus 10 is provided with a processing table 12 in the form of a thick plate. The upper surface of the processing table 12 is used as a processing reference surface 14, and a multilayer printed wiring board 16 to be processed is mounted on the processing reference surface 14. Is placed. The processing reference surface 14 is processed so as to be a plane having sufficiently high flatness, and the shape along the surface direction is substantially rectangular. Here, the short direction of the processing reference surface 14 is the X-axis direction, the long direction is the Y-axis direction, and the processing table 1
The following description will be made with the thickness direction of No. 2 as the Z-axis direction.

On the processing reference surface 14, four positioning pins 18 are provided upright, and a pair of fixed rails 20 are disposed so as to extend in the Y-axis direction. A beam-shaped movable rail 22 is arranged between the pair of fixed rails 20 so as to extend in the X-axis direction.
0 and is movably supported by the pair of fixed rails 20 along the Y-axis direction. A housing-like carrier member 24 is arranged on the movable rail 22 so as to be movable along the X-axis direction.

Here, a Y-axis driving mechanism (not shown) for transmitting a driving force along the Y-axis direction to the movable rail 22.
Are connected, and the movable rail 22 is driven along the Y-axis direction by the driving force from the Y-axis driving mechanism. An X-axis driving mechanism (not shown) for transmitting a driving force along the X-axis direction is connected to the carrier member 24. The driving force from the X-axis driving mechanism causes the carrier member 24 to move along the X-axis direction. Driven. Accordingly, the carrier member 24 can be moved to an arbitrary position on the processing reference surface 14, and the moving range covers the entire area inside at least the four positioning pins 18.

As shown in FIG. 1, a piercing pin 26 and its Z-axis mechanism are mounted on the carrier member 24.
The Z-axis drive mechanism includes a cylindrical pin holder 28 as shown in FIG. 2, and drives the pin holder 28 in the Z-axis direction by an electromagnetic actuator or the like. The pin holder 28 is provided with a hollow cylindrical outer case 30 and the outer case 30, and an inner rod 32 is slidably inserted into the outer case 30. The inner rod 32 is supported by the outer case 30 so as to be movable along the Z-axis direction.
Is always urged toward the machining table 12 by a coil spring 34 disposed therein.

As shown in FIG. 2, a flange 36 is provided at the tip of the inner rod 32 to expand its diameter in the radial direction. A flat stopper surface 38 is formed on the lower surface side of the flange portion 36, and the stopper surface 38 is supported so as to be parallel to the processing reference surface 14. The machining table 12 is provided on the stopper surface 38 along the axis of the inner rod 32.
A piercing pin 26 is attached so as to protrude to the side. The perforation pin 26 is formed of a metal material sufficiently harder than copper or a copper alloy used as a copper plating material, and is formed of, for example, carbon steel, stainless steel, a titanium alloy, a nickel alloy, a cemented carbide, or the like. Piercing pin 26
Is a via hole whose outer diameter R is formed in the insulating base material (FIG. 4).
Is slightly smaller than the inner diameter of the insulating base material 58 in the build-up layer 42.
And the thickness is slightly longer than the thickness of the copper plating layer 62 (see FIG. 4). The tip of the piercing pin 26 is formed in a substantially conical shape whose diameter decreases toward the tip.

FIG. 3 shows a multilayer printed wiring board in which via holes are formed by the hole forming apparatus of FIG. The multilayer printed wiring board 16 is manufactured by using a known build-up method. As shown in FIG. 3A, a core layer 40 and a build-up layer provided on the core layer 40 are provided. 42 are provided. The core layer 40 includes a plate-shaped insulating base material 44 as a substrate support. The insulating base material 44 is made of, for example, a glass epoxy substrate, a glass polyimide substrate, a glass fluororesin substrate, a BT (bismaleate triazine) -resin substrate, a paper phenol substrate, or the like. The printed wiring surfaces 46 and 48 are provided.

The printed wiring surface 46 of the core layer 40,
48, a copper plating layer 50 is formed, and the copper plating layer 50 is selectively etched by a known photoresist method or the like to form circuit patterns 52 and 54. Note that a copper foil may be bonded to the printed wiring surfaces 46 and 48 as a lower layer of the copper plating layer 50 by a lining method or the like, and the copper plating layer 50 may be formed on the copper foil. Further, a through hole 56 is formed in the insulating base material 44 so as to penetrate in the thickness direction of the substrate as necessary. The inner peripheral surface of the through hole is integrated with the copper plating layer 50 on the printed wiring surfaces 46 and 48. A copper plating layer is formed.
As a result, the circuit patterns 52 and 54 are
6 are electrically connected to each other by a copper plating layer 50.

Each of the build-up layers 42 has a core layer 4
The printed circuit board has an insulating base material 58 laminated on the printed wiring surface. The insulating base material 58 of the build-up layer 42
Are, for example, epoxy resin, BT-resin, thermosetting PP
Using E (polyphenylene ether) resin as a material, the resin layer is formed by a resin coating method, a laminating press method, a laminating method, or the like, and is integrated with the core layer 40. The surface of the insulating base material 58, that is, the surface opposite to the core layer 40 is a printed wiring surface 60. A copper plating layer 62 is formed on the printed wiring surface, and the copper plating layer 62 is selectively etched to form a circuit pattern 64.

In the circuit pattern 64 of the build-up layer 42, an interlayer connection portion 66 is formed at a portion where the core layer 40 is connected to the circuit pattern 52. Before the via hole is processed, the interlayer connection portion 66 is formed as a substantially circular land as shown in FIG. 3B, and the diameter thereof is sufficiently larger than the inner diameter of the via hole 74 (see FIG. 4). Has become. In the circuit pattern 52 of the core layer 40, a substantially circular interlayer terminal portion 68 is formed at the center of a region where the interlayer connection portion 66 is projected along the substrate thickness direction.

At each corner of the multilayer printed wiring board 16, positioning holes 70 corresponding to the positioning pins 18 are formed as shown in FIG. When loading the multilayer printed wiring board 16 into the hole processing apparatus 10,
With the printed wiring surface 60 facing upward, the multilayer printed wiring board 16 is placed on the processing reference surface 14 while the four positioning pins 18 are inserted into the four positioning holes 70 respectively. Thereby, the multilayer printed wiring board 16 is positioned at a predetermined processing position along the plane direction (X-axis-Y-axis direction) and the thickness direction (Z-axis direction) with respect to the processing reference plane 14. At this time, in order to prevent the multilayer printed wiring board 16 from being displaced in the Z-axis direction, a weight is loaded on the multilayer printed wiring board 16 or the tip of the positioning pin 18 is used as a screw portion, and a nut is screwed into this screw portion. Thus, the multilayer printed wiring board 16 may be securely restrained in the Z-axis direction.

Next, the hole processing apparatus 1 according to the present embodiment
Via hole 7 for multilayer printed wiring board 16 with 0
The processing method No. 4 will be described. The hole processing apparatus 10 includes a controller (not shown) capable of inputting data from the outside. The controller includes an interlayer connection portion 66 in the circuit pattern 64 of the build-up layer 42 before starting the processing of the via hole 74. , That is, information corresponding to the XY coordinates on the machining reference plane 14 is input. At this time, the carrier member 24 is waiting at a predetermined origin position in the X-axis and Y-axis directions, and the perforation pins 26 are held at a standby position above the multilayer printed wiring board 16 by a Z-axis driving mechanism.

When the machining start command is input, the controller controls the X-axis drive mechanism and the Y-axis drive mechanism based on the input positional information, and controls the perforation pin 26 mounted on the carrier member 24 to Move to the center point. Next, the controller causes the stopper surface 38 to lower the perforation pin 26 at the standby position by the Z-axis drive mechanism. At this time, the piercing pin 26 descends to a piercing position where the stopper surface 38 of the inner rod 32 abuts on the outer peripheral edge of the interlayer connecting portion 66 as shown in FIG. As a result, the perforated pin 26 breaks through the central portion of the interlayer connection portion 66 and the insulating base material 58 under the interlayer connection portion 66, further presses the central portion of the interlayer terminal portion 68 on the printed wiring surface 46, and the interlayer terminal portion 68 and the lower portion thereof. A recess 72 corresponding to the tip shape of the perforated pin 26 is formed in the insulating substrate 44 on the side. Further, when the movement resistance of the perforated pin 26 becomes excessive due to an abnormal material of the interlayer connecting portion 66, the insulating base material 58, and the interlayer terminal portion 68 when the perforated pin 26 is lowered, the coil spring 34 is compressed and the perforated pins 26 and Z The shaft drive mechanism is protected. Thereafter, the controller causes the Z-axis drive mechanism to return the piercing pin 26 to the standby position, and returns the carrier member 24 to the origin position once by the X-axis drive mechanism and the Y-axis drive mechanism.

As shown in FIG. 4B, the perforated pin 26 penetrates the interlayer connecting portion 66 and the insulating base material 58 so that the insulating base material 58 is moved from the printed wiring surface 60 to the upper surface side of the interlayer terminal portion 68 as shown in FIG. A tapered via hole 74 is formed, and a cylindrical portion 76 is formed in which the vicinity of the center of the interlayer connecting portion 66 is plastically deformed in the bending direction along the inner peripheral surface of the via hole 74. Part is interlayer terminal part 6
8 is in contact with the outer peripheral side of the depression. Thereby, the interlayer connection part 6
6 is electrically connected to the interlayer terminal portion 68 through the via hole 74.

The controller repeats the above operation for all the interlayer connections 66 to which the position information has been input, and sequentially switches the interlayer connections 66 provided on the circuit pattern 64 of the buildup layer 42 to the circuit pattern of the core layer 40. The electrical connection is made to the interlayer terminal portion 68 provided in the second terminal 52.

When the processing of the via hole 74 and the cylindrical portion 76 on the multilayer printed wiring board 16 by the hole processing apparatus 10 is completed, the multilayer printed wiring board 16 is mounted on the processing table 1.
2 and is sent to a conductor molding step using a fluid conductor material such as cream solder or conductive paste. In this conductor molding step, as shown in FIG. 4C, after the conductor material 78 having fluidity is filled in the via holes 74 and the depressions 72 without gaps, the conductor material 78 is heated and hardened or sintered. The cylindrical portion 7 of the interlayer connecting portion 66
6 and the conductor closely contacting the recess 72 of the interlayer terminal portion 68 are formed. Thus, even if the contact area between the interlayer connection part 66 and the interlayer terminal part 68 is small, the circuit pattern 64
The resistance between the circuit pattern 64 and the circuit pattern 52 can be reduced sufficiently even if the multilayer printed wiring board 16 is distorted after the processing of the via hole 74.
The connection with is surely maintained. Note that this conductor forming step may be performed simultaneously with the mounting of the electronic component on the multilayer printed wiring board 16.

Next, the operation of the method for manufacturing a multilayer printed wiring board according to the present embodiment will be described.

The multilayer printed wiring board 16 according to the present embodiment
According to the manufacturing method of (1), the distal end of the metal perforated pin 26 is positioned on the interlayer connection portion 66, and the perforated pin 26 is moved to the printed wiring surface 46 side, so that the insulating substrate 58 is At the same time as forming the via hole 74 reaching the circuit pattern 52, the interlayer connecting portion 66 is plastically deformed to form the cylindrical portion 76 which passes through the inside of the via hole 74 and contacts the interlayer terminal portion 68. At the same time when the via hole 74 is formed in the insulating base material 58 using the insulating layer 10, the interlayer connection portion 66 of the circuit pattern 64 and the interlayer terminal portion 68 of the circuit pattern 52 can be electrically connected at the position of the via hole 74. As a result, as compared with a conventional method of forming a via hole in an insulating base material using a laser processing device or the like, a via hole 7 is formed in the insulating base material 58 by a simple operation using a low-cost hole processing device 10 having a simple structure.
4, the manufacturing cost of the multilayer printed wiring board 16 can be reduced.

The hole processing apparatus 1 according to the present embodiment
At 0, the perforation pin 26 was moved in the three-axis direction with respect to the multilayer printed wiring board 16 on the processing table 12 to position and move the perforation pin 26 up and down.
Processing table 12 on which multilayer printed wiring board 16 is placed
May be moved in three axial directions to position the multilayer printed wiring board 16 with respect to the perforation pins 26, and then moved up and down to form a via hole 74 in the insulating base material 58.

(Second Embodiment) FIG. 5 shows a second embodiment of the present invention.
1 shows a hole processing apparatus for a multilayer printed wiring board according to the embodiment. The hole processing device 80 is provided on a production line of the multilayer printed wiring board 16 and drills a via hole in the insulating base material 58, similarly to the hole processing device 10 according to the first embodiment. .

The hole processing apparatus 80 of this embodiment is provided with a processing table 82 having a thick plate shape, and the upper surface of the processing table 82 is a jig mounting surface 84. The jig mounting surface 84 is processed so as to be a flat surface with sufficiently high flatness. Four positioning pins 86 are provided upright on the jig mounting surface 84. In the hole processing device 80, the jig mounting surface 84
A plate-shaped drilling jig 88 is placed on top. The drilling jig 88 is provided with a support substrate 90 having a surface shape corresponding to the multilayer printed wiring board 16 to be processed. The support substrate 90 is made of a metal material such as carbon steel, a nickel-based alloy, and stainless steel. Become.

As shown in FIG. 5, a positioning hole 91 is formed in each corner of the support substrate 90. When the drilling jig 88 is loaded on the processing table 82, While inserting the four positioning pins 86 into the four positioning holes 91 respectively, the drilling jig 8
8 is placed on the jig placing surface 84. As a result, the drill jig 88 moves along the jig mounting surface 84 along the surface direction.
Is accurately positioned at a predetermined position in the.

The upper surface of the support substrate 90 of the drilling jig 88 is a processing reference surface 92. The processing reference surface 92 has a drilling pin having a substantially conical tip as shown in FIG. 93 is erected. As shown in FIG. 5, a plurality of perforation pins 93 are erected on the processing reference surface 92, and these perforation pins 93
6 are disposed at positions corresponding to the interlayer connection portions 66 (see FIG. 6). Such a piercing pin 93
For example, by selectively etching the processing reference surface 92 by a known photoresist method or the like, forming a substantially columnar projection on the processing reference surface 92, and polishing the projection by an electrolytic method or the like. It is formed. Also the piercing pin 93
Since the length is several tens to one hundred and several tens μm and the outer diameter is several tens μm corresponding to the size of the via hole 74, the supporting substrate 90
It can also be formed by mechanical processing such as grinding and polishing on the base plate, and by driving the base end of a perforation pin 93 formed by precision processing of a cemented carbide or the like into a processing reference surface 92 of a support substrate 90, A perforation pin 93 separate from the support substrate 90 may be fixed to the processing reference surface 92.

The multilayer printed wiring board 16 is mounted on the jig mounting surface 84 of the processing table 82 via a drill jig 88 as shown in FIG. The multilayer printed wiring board 16 is placed with four positioning pins 86 inserted through four positioning holes 70, respectively. As a result, the multilayer printed wiring board 16 is accurately positioned at the processing position on the jig mounting surface 84 along the surface direction, and the center of the drilling jig 88 and the center of the multilayer printed wiring board 16 accurately match. . The multilayer printed wiring board 16
Is placed on the processing table 82 in such a direction that the printed wiring surface 60 of the build-up layer 42 faces the processing reference surface 92.

As shown in FIG. 5, the hole processing apparatus 80 is provided with a thick plate-shaped pressing table 94 above the processing table 82. The pressing table 94 is a Z-axis driving mechanism (not shown). ) So that it can be moved up and down.
The lower surface side of the pressing table 82 is a flat pressing surface 96, and a positioning hole 97 corresponding to the positioning pin 86 of the processing table 82 is formed in each corner of the pressing surface 96. .

Next, the hole machining apparatus 8 according to the present embodiment will be described.
Via hole 7 for multilayer printed wiring board 16 with 0
The processing method No. 4 will be described. When the drilling jig 88 and the multilayer printed wiring board 16 are respectively mounted on the processing table 82, the hole processing apparatus 80 lowers the pressing table 94 by the Z-axis drive mechanism, and the pressing surface 96 is moved to the processing table 82. The upper multilayer printed wiring board 16 is pressed into contact with a predetermined pressing force. Thereby, the piercing pin 93 of the piercing jig 88 is
6 pierces through the center portion of the interlayer connection portion 66 and the insulating base material 58 under the interlayer connection portion 66 as shown in FIG. 6, and further presses the center portion of the interlayer terminal portion 68 on the printed wiring surface 46 so that the interlayer terminal portion 68 and A depression 72 corresponding to the tip shape of the perforated pin 26 is formed in the insulating base material 44 on the lower side. Thereafter, the hole processing device 80 is driven by the Z-axis
To return to the standby position.

As shown in FIG. 6, the perforated pins 93 pierce the interlayer connection portion 66 and the insulating base material 58,
From the printed wiring surface 60 to the insulating base material 58, the interlayer terminal portion 68
A via hole 74 having a tapered shape reaching the upper surface side of the via hole is formed, and a via hole 7 is formed near the center of the interlayer connection portion 66.
A cylindrical portion 76 plastically deformed in the bending direction is formed along the inner peripheral surface of the cylindrical member 4, and the distal end of the cylindrical portion 76 contacts the outer peripheral side of the recess 72 of the interlayer terminal portion 68. Thereby, the interlayer connection part 66
Are electrically connected to the interlayer terminals 68 through the via holes 74. In the hole processing device 80, the drilling jig 8
8 is provided with a plurality of perforation pins 93 in the support substrate 90, so that the via hole 74 described above can be
And a plurality of cylindrical portions 76 can be formed simultaneously.

When the processing of the via hole 74 and the cylindrical portion 76 on the multilayer printed wiring board 16 by the hole processing apparatus 80 is completed, the multilayer printed wiring board 16 is
2 and is sent to a conductor molding step using a fluid conductive material such as cream solder or conductive paste, as in the case of the first embodiment.
After the conductive material having fluidity is filled into the recesses 4 and the recesses 72 without gaps, the conductive material is heated and hardened or sintered, so that the tubular portions 76 of the interlayer connecting portions 66 and the recesses 72 of the interlayer terminal portions 68 are respectively provided. A closely adhered conductor is formed.

Next, the operation of the method for manufacturing a multilayer printed wiring board according to the present embodiment will be described.

The multilayer printed wiring board 16 according to the present embodiment
According to the manufacturing method of (1), in addition to the functions and effects obtained by the method of manufacturing a multilayer printed wiring board according to the first embodiment, a plurality of via holes 74 and a cylindrical portion 76 are formed in the insulating base material 58 of the build-up layer 42. Since it can be processed simultaneously, even if the number of via holes 74 processed in the insulating base material 58 increases, it is possible to effectively suppress an increase in the processing time,
An increase in processing cost of the multilayer printed wiring board 16 due to an increase in processing time can also be suppressed.

[0043]

As described above, according to the method for manufacturing a multilayer printed wiring board of the present invention, a via hole can be formed in an insulating base material of a multilayer printed wiring board by a low-cost processing apparatus, and the insulating base material can be processed. Even if the number of via holes to be formed increases, it is possible to effectively suppress an increase in processing time and processing cost.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a hole processing apparatus used in a method for manufacturing a multilayer printed wiring board according to a first embodiment of the present invention.

FIG. 2 is a cross-sectional view of a drilling pin and a pin holder in the hole processing device shown in FIG.

FIGS. 3A and 3B are a cross-sectional view and a plan view showing a configuration of a multilayer printed wiring board in which a via hole is formed by a method for manufacturing a multilayer printed wiring board according to an embodiment of the present invention.

FIG. 4 is a side view showing a process of processing a via hole and a conductor by the method for manufacturing a multilayer printed wiring board according to the first embodiment of the present invention.

FIG. 5 is a perspective view showing a hole processing apparatus used in a method for manufacturing a multilayer printed wiring board according to a second embodiment of the present invention.

6 is a side sectional view showing a state in which a via hole is being formed in the multilayer printed wiring board by the hole processing apparatus shown in FIG. 5;

FIG. 7 is a side sectional view showing a structure of a multilayer printed wiring board in which via holes are formed by a conventional method.

[Explanation of symbols]

 Reference Signs List 10 hole processing device 16 multilayer printed wiring board 26 perforated pin 40 core layer (first laminated substrate) 42 build-up layer (second laminated substrate) 44 insulating base material (first insulating base material) 46 printed wiring surface ( First printed wiring surface) 50 Copper plating layer (metal conductor) 52 Circuit pattern (first circuit pattern) 58 Insulating base material (second insulating base material) 60 Printed wiring surface (second printed wiring surface) 62 Copper plating layer (metal conductor) 66 Interlayer connection part (metal conductor) 68 Interlayer terminal part (first circuit pattern) 74 Via hole 80 Hole processing device 93 Drilling pin

Claims (2)

[Claims] 1. A first insulating substrate having at least one of a front and back surface as a first printed wiring surface is used as a support, and a first circuit pattern is formed on the first printed wiring surface by a metal conductor. And a second insulating substrate laminated on the first printed wiring surface and having a surface opposite to the first printed wiring surface as a second printed wiring surface. And a second laminated substrate having a metal conductor disposed on the second printed wiring surface, wherein the first circuit pattern is formed by a conductor in a via hole penetrating the second insulating base material. And a method for manufacturing a multilayer printed wiring board in which a metal perforated pin is positioned on a metal conductor on the second printed wiring surface and on the first circuit pattern. ,
The perforated pin is relatively moved to the first printed wiring surface side, and a via hole reaching the first circuit pattern from the second printed wiring surface to the second insulating base material by a pressing force from the perforated pin. And simultaneously plastically deforming a part of the metal conductor so that the metal conductor on the second printed wiring surface passes through the via hole and contacts the first circuit pattern. A method for manufacturing a multilayer printed wiring board, comprising: 2. A conductive material having fluidity is filled in the via hole, and the conductive material is heat-cured to form connection conductors which are in close contact with the metal conductor in the via hole and the second circuit pattern portion, respectively. 2. The method according to claim 1, further comprising the step of: