JP2002075174A - Plasma display panel and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a plasma display device which will not cause lowering of discharging efficiency, because the barrier ribs and the dielectric surface of a back plate can be cleaned easily so as not to have resist left, so that impurity gas is not produced. SOLUTION: In processes prior to barrier rib insertion in opening portions of a resist pattern or burning of electrodes is completed, by cleaning the opening portions and the electrodes with ozonic water or ionic water, their resist removability and the insulating property between the electrodes are improved. Additionally, there will not be resist left in the plasma display device and generation of impurity gas are prevented, and the lowering of discharging efficiency will not occur.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a method for manufacturing a plasma display device.

[0002]

2. Description of the Related Art As an example of a plasma display device, an AC type plasma display device (hereinafter referred to as PDP) as shown in FIG. 2 has been known. Hereinafter, a panel configuration of a conventional PDP and an operation principle thereof will be described with reference to the drawings.

In FIG. 1, reference numeral 116 denotes a front plate,
Is a back plate.

The PDP 101 has a front panel 116 and a rear panel 10.
And a sealing member 115 made of low-melting glass to form a space for gas discharge.
0 kPa (300 Torr) to 66.5 kPa (500
Torr) (a mixed gas of helium, xenon, neon, etc.).

The back plate 106 includes a back glass 107 and the address electrodes 1 patterned on the surface of the back glass 107.
08 and back plate dielectric 109 formed so as to cover it
And a plurality of partitions 110 and red, blue, and green phosphors 111 formed between the partitions 110. Here, the partition 110 is a means for partitioning the gas discharge space. The space 112 thus partitioned serves as a light emitting region, and the phosphor 111 is formed for each light emitting region.

On the other hand, the front plate 116 is composed of a front glass 102, a display electrode composed of a transparent electrode 114 and a bus electrode 103 patterned on the surface of the front glass 102, and a front plate dielectric 104 formed to cover the display electrode. And a protective film 105 made of magnesium oxide formed thereon.

The partition 110 and the address electrode 108 are formed in the same direction, and the display electrode composed of the bus electrode 103 and the transparent electrode 104 is orthogonal to the address electrode 108.

The PDP 101 configured as described above is partitioned by partition walls 110 corresponding to display pixels by applying a voltage to a display electrode composed of the address electrode 108, the transparent electrode 114 and the bus electrode 103 at an appropriate timing. Discharge occurs in the space 112, ultraviolet rays are generated, and visible light is emitted from the red, green, and blue phosphors 111 excited by the ultraviolet rays, and the visible light is displayed as an image.

Next, a method of manufacturing such a PDP will be described with reference to FIG.

In FIG. 1, the display electrodes of the front plate 116 are a wide transparent electrode 114 and a narrow opaque bus electrode 10.
Generally, it has a two-layer structure of No. 3. First, a transparent electrode 114 made of ITO (indium tin oxide) and a bus electrode 103 made of a low melting point glass frit mixed with silver as a conductive material as a bus electrode are formed on the front glass 102 by photolithography. Forming
The front plate dielectric 104 is formed and baked so as to cover it, and a protective film 105 made of magnesium oxide is formed thereon to produce.

The back plate 106 has a back glass 1
The address electrode 108 is formed on the address line 07. This address electrode 108 is also formed by photolithography of a low melting point glass frit mixed with silver as a conductive material. After forming a back plate dielectric 109 to cover it and baking it, a barrier rib material was formed by printing on one surface thereof, and then a portion where the barrier ribs 110 were not formed was removed by sandblasting to form a line through a baking process. The partition 110 is formed.
Thereafter, the phosphors 111 are filled between the partitions 110 by a printing method for each of red, green, and blue, dried, and fired to produce the phosphor.

The sealing member 115 is coated with low-melting glass around the front plate 116 and the rear plate 106 completed in this way, and then fired to seal them. After sealing, the panel is vacuum-evacuated from the chip tube 113, filled with a rare gas and chip-off to complete the PDP 101.

[0013]

Conventionally, as a method of manufacturing a partition wall of a PDP, a process of forming a partition wall material on the entire surface and shaving off unnecessary portions, or a process of pasting the partition wall material at a predetermined position, printing and drying is repeated 10 times or more. Screen printing is used. However, with these methods, it is difficult to fabricate a high-definition, large-screen PDP-compatible partition wall with a good shape, with high accuracy, and with good reproducibility.

As a method for solving this problem, there has been proposed a photo-embedding method in which a partition material is pasted into an opening of a resist pattern formed by a photo process and is embedded therein (Japanese Patent Laid-Open No. Hei 10-188792). However, in this method, it is necessary to completely remove the used resist before baking the partition. If a part of the resist remains on the surface of the partition wall or the surface of the back plate dielectric, the PDP is filled with a discharge gas, causing an impurity gas to be generated, and this gas is mixed to lower the discharge efficiency.

In order to enhance the removability of the resist, treatment with an acidic solution, cleaning with a high-speed jet fluid, and the like have been proposed (JP-A-10-326561, JP-A-11-25).
0796).

In these methods, waste treatment of the acidic solution after the resist treatment, introduction of a cleaning device equipped with a high-speed jetting mechanism, and the like are required, and this is a factor that raises the production cost.

Further, as a method of manufacturing an electrode, an electrode material obtained by forming a conductive material such as silver, a low melting point glass frit, or a photosensitive resin on a substrate is formed on a substrate, and the electrode pattern is exposed and developed by a photolithography method. In general, a method of forming an electrode pattern by removing a unnecessary thin film after patterning and etching a metal thin film of chromium, copper, or the like with a resist film by a photolithography method, and used. .

At this time, if an unnecessary electrode material remains in the electrode pattern after development, after firing the electrode, silver as a conductive material remains between the electrodes, resulting in poor insulation between the electrodes.

Furthermore, a state in which a dielectric is formed without firing the electrode having an unnecessary conductive material remaining in the electrode pattern, and the electrode and the dielectric are fired simultaneously, or a residue of the resist remains on the metal thin film electrode. When a dielectric is formed and baked, these residues remain in the dielectric as impurities, or bubbles are generated, which lowers the withstand voltage between the electrodes, thereby easily causing dielectric breakdown.

A first object of the present invention is to provide a plasma display device which does not involve waste liquid treatment or the introduction of a new washing machine, has no residual resist removed on the surface of the partition walls and the dielectric of the back plate, and eliminates generation of impurity gas. It is to provide a method of manufacturing the device.

A second object of the present invention is to provide a method of manufacturing a plasma display device in which an unnecessary conductive material and a resist residue between electrodes are removed to improve the insulation between the electrodes.

[0022]

According to a first aspect of the present invention, there is provided a method of manufacturing a plasma display device according to the present invention, wherein the step of forming a partition for defining a discharge space forms a resist on a substrate. A third step of forming an opening by exposure and development, a third step of filling the opening with a partition material, and a fourth step of removing the resist and firing the partition. The method is characterized in that the opening is washed with ozone water before.

As a second means for achieving the first object, a method of manufacturing a plasma display device according to the present invention is characterized in that a partition forming step for defining a discharge space includes a first step of forming a resist on a substrate, and an exposure step. A second step of forming an opening by development, and a third step of filling the opening with a partition material.
A fourth step of removing the resist and baking the partition walls, wherein the opening is washed with ion water before the third step.

Further, as a first means for achieving the second object, in the method of manufacturing a plasma display device according to the present invention, the electrode forming step includes a photolithography method, and the electrode forming step is performed before the electrode firing step or the dielectric forming step. It is characterized by washing with ozone water.

Further, as a second means for achieving the second object, in the method of manufacturing a plasma display device according to the present invention, the electrode forming step includes a photolithography method, and the electrode forming step is performed before the electrode firing step or the dielectric forming step. It is characterized by washing with ion water.

[0026]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a first embodiment of a method for manufacturing a plasma display device according to the present invention will be described with reference to the drawings.

FIG. 1 is a sectional view showing each step of the partition wall forming process of the plasma display device according to the present invention. In carrying out the process, first, a front plate is prepared. The front plate may have conventional specifications, which will be described below with reference to FIG.

On the front plate 116, a transparent electrode 114 and a bus electrode 103 made of a low-melting glass frit using silver as a conductive material are formed on the front glass 102 by photolithography. Next, a dielectric 104 is formed by a screen printing method and is fired. After that, the protective film 105 is formed by an evaporation method, and the front plate 116 is completed.

As for the back plate, the address electrodes and the back plate dielectric are the same as in the conventional case. Hereinafter, a method of manufacturing the back plate will be described with reference to FIG. 2, an address electrode 108 made of a low melting point glass frit using silver as a conductive material is first formed on a rear glass 107 by a photolithography method. Next, the back plate dielectric 109 is printed and fired. Although the back plate dielectric 109 may be transparent, a white colored material may be used for the purpose of improving luminance. Further, a material colored in a color other than white to improve the contrast may be used.

A step of forming a partition on the back plate dielectric 109 is performed. This step will be described below with reference to FIG.

FIG. 1A shows a state in which an address electrode 108 and a back plate dielectric 109 are formed on a back glass 107. A resist thickness of 6 is formed on the back plate dielectric 109.
Two layers of a photosensitive dry film resist 22 of 0 μm are laminated using a laminator 21 to form a resist 1 having a thickness of 120 μm.
0 is formed (FIG. 1B).

Next, as shown in FIG. 1C, an ultraviolet light (UV) is
And the resist 10 is exposed. The exposure amount at this time is 100 to 200 mJ / cm ² .

In this embodiment, a negative resist is used.

After the exposure is completed, development is performed. 1 developer
A 3% aqueous solution of sodium carbonate is sprayed for about 3 to 5 minutes, then washed with water, drained and dried, and further cured by applying ultraviolet light and heat. A predetermined pattern is formed on the resist 10 through exposure and development processes. Next, spray cleaning and drying are performed using ion water 23 in this state (FIG. 1D).

This ionized water is obtained by dissolving ozone gas in pure water, and has an ozone concentration of 5 to 15 mg / l and a cleaning time of 3 to 15 minutes. When the ozone concentration is less than 5 mg / l, no cleaning effect can be obtained, and when it is more than 20 mg / l, the resist is damaged. As for the cleaning method, the spray method is more effective than the immersion method, and the cleaning time can be shortened.

Impurities on the resist surface of the resist opening 24 and the surface of the back plate dielectric 109 are decomposed and removed by the oxidizing action of the ozone water, and the resist is peeled off from the partition wall material or the back plate dielectric surface or the back plate dielectric is removed. The adhesion between the body and the partition wall material is improved.

If the resist is not easily peeled off from the partition wall material, a part of the resist remains on the side surfaces of the partition walls and on the surface of the dielectric of the back plate when the resist is removed. The remaining resist cannot be completely removed even if the partition walls are baked.

If the adhesion between the partition wall material and the back plate dielectric is poor, the partition wall material is also removed at the same time as the resist is removed.

FIG. 1E shows a step of filling the resist 10 on which a predetermined pattern has been formed with the partition wall material 26. The partition wall material 26 is a paste in which a resin or a solvent is mixed with a glass frit, and a solid screen plate 27 of a screen mesh 120 is squeegee 25 having a rubber hardness of 70 degrees at 10 mm / mi.
Scan at a speed of n to fill and dry. The distance between the screen plate 27 and the rear plate glass 107 is 3 to 7 mm. In this step, the back plate glass 107 is turned 180 degrees and printing is repeated 4 to 5 times to fill the partition wall material 26.

Before the drying, the back plate glass is put in a vacuum container and vacuum-degassed, whereby the partition wall material can be more reliably filled. Alternatively, it may be filled using a roll coater method or a die coat method. Alternatively, the partition material may be formed in a film shape and then laminated.

Thereafter, polishing is carried out for the purpose of removing the partition material adhered to the surface of the resist 10 and adjusting the height of the partition (FIG. 1F).

The resist 10 used last is removed. For removal, for example, immersion is carried out for 10 to 15 minutes in a 5% aqueous sodium hydroxide solution heated to about 40 ° C., and then warm water (50 to 70
C) for another 2-5 minutes.

Although a 5% aqueous sodium hydroxide solution was used as an example for removal, another alkaline aqueous solution may be used. This is fired in a belt firing furnace at a firing temperature of 400-6.
Baking at 00 ° C. completes the partition 110 (FIG. 1)
(G)).

Thereafter, the discharge space 1 partitioned by the partition 110
12 is filled with a phosphor 111 by a printing method, and dried and fired to produce a back plate 106.

A low-melting glass is applied to the periphery of the front plate 116 and the rear plate 106 completed in this manner by applying a sealing member 115, followed by baking to seal the PDP 101.
Finally, after evacuating the space 2 from the tip tube 113,
40 kPa (300 Torr) to 66.5 kPa (50
(0 Torr) of a rare gas (mixed gas of helium, xenon, neon, etc.) to complete the PDP 101.

Next, a second embodiment according to a method for manufacturing a plasma display device of the present invention will be described.

The difference from the first embodiment is that ion water is used in place of the ozone water in the cleaning step of FIG.

This ion water is obtained by putting pure water into an electrolytic cell via an ion exchange membrane having electrodes on both sides, and applying an electric field between the electrodes to electrolyze the pure water. Ion water generated on the anode side is used for cleaning, and the ion water on the anode side has a strong oxidizing action. This anode side ion water is used as a cleaning liquid in the cleaning step.

This ionized water also decomposes and removes impurities on the resist surface of the resist opening 24 and on the surface of the back plate dielectric 109 by an oxidizing action, similar to the ozone water used in the first embodiment. The effect of improving the releasability from the body surface or the adhesion between the back plate dielectric and the partition wall material can be obtained.

These ozone water and ionized water have high reactivity, and the waste liquid after washing reacts with air, does not generate toxic ozone gas, etc., and does not contain acid or alkali, so that it can be easily treated. it can.

Next, a third embodiment of the method for manufacturing a plasma display device of the present invention will be described with reference to FIG.

Except for the electrode process, it is the same as the first embodiment.

First, the front glass 102 is attached to the front plate 116.
A transparent electrode 114 and a bus electrode 103 made of a low melting point glass frit using silver as a conductive material are formed thereon by photolithography.

In this bus electrode, an electrode material is formed on a transparent electrode, and is exposed and developed to form an electrode pattern. At this time, if unnecessary electrode material remains in the electrode pattern after development,
After firing the electrodes, silver as a conductive material remains between the electrodes, resulting in poor insulation between the electrodes, and sometimes short-circuiting between the electrodes, causing display failure.

To prevent this, the substrate is spray-cleaned and dried using ion water before firing the electrodes.

The ion water used for cleaning is obtained by dissolving ozone gas in pure water, and has an ozone concentration of 5 to 15 mg / l.
The washing time is 3 to 10 minutes. As for the cleaning method, the spray method is more effective than the immersion method, and the cleaning time can be shortened.

The method of producing the ozone water is the same as in the first embodiment.

The electrode material remaining thin on the substrate surface between the electrodes can be decomposed and removed by the oxidizing action of the ozone water, and the insulation after firing the electrodes can be improved.

The same effect can be obtained when the address electrodes on the back plate are formed by the same method.

Also, a dielectric is formed without firing the electrode in which an unnecessary conductive material remains in the electrode pattern, and the residue of the resist remains after firing the electrode and the dielectric at the same time or forming the metal thin film electrode. When a dielectric is formed and baked in a state where it is kept, these residues remain as impurities in the dielectric or bubbles are generated, which lowers the withstand voltage between the electrodes, thereby easily causing dielectric breakdown. These problems can be solved by introducing water washing.

Further, the same effect as that of ozone water can be obtained also in the formation of an electrode when the ion water used in the second embodiment is used.

[0062]

According to the present invention, it is possible to manufacture a plasma display device in which the resist removed from the surface of the partition walls and the back plate dielectric remains without generation of impurity gas. This makes it possible to provide a plasma display device in which the discharge efficiency does not decrease.

Further, it is possible to prevent impurities and bubbles in the conductive material and the dielectric between the electrodes, and to improve the insulation.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing a partition forming step of a plasma display device according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view illustrating a configuration of a plasma display device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Resist 11 Photomask 21 Laminator 22 Dry resist film 23 Ozone water, ion water 24 Opening 25 Squeegee 26 Partition material 27 Screen plate 101 PDP 102 Front glass 103 Bus electrode 104 Front plate dielectric 105 Protective film 106 Back plate 107 Back glass 108 Address electrode 109 Back plate dielectric 110 Partition wall 111 Phosphor layer 112 Space section 113 Chip tube 114 Transparent electrode 115 Sealing member

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Hiroyuki Yonehara 1006 Kazuma Kadoma, Osaka Pref. Matsushita Electric Industrial Co., Ltd. 72) Inventor Yoshiki Sasaki 1006 Kazuma, Kazuma, Osaka Prefecture F-term in Matsushita Electric Industrial Co., Ltd.

Claims (9)

[Claims] A first step of forming a resist on the substrate; a second step of forming an opening by exposure and development; and a third step of filling the opening with a partition material. A fourth step of removing the resist and baking the barrier ribs, and cleaning the opening with ozone water before the third step. 2. The method according to claim 1, wherein the ozone water is obtained by dissolving ozone gas in pure water. 3. The ozone water has an ozone concentration of 5 mg / l.
2. The method for manufacturing a plasma display device according to claim 1, wherein: 4. A partition forming step for defining a discharge space includes a first step of forming a resist on a substrate, a second step of forming an opening by exposure and development, and a third step of filling the opening with a partition material. A fourth step of removing the resist and baking the partition walls, wherein the opening is washed with ion water before the third step. 5. An anode obtained by providing electrodes at both ends of an ion-exchange membrane and electrolyzing pure water.
5. The method according to claim 4, wherein the ionized water on the side is used. 6. The method according to claim 1, wherein the resist is of a negative type. 7. The method according to claim 1, wherein the resist in the fourth step is removed by immersing the resist in an alkaline aqueous solution and hot water. 8. A method for manufacturing a plasma display device, wherein the electrode forming step includes a photolithography method, and washing with ozone water is performed before the electrode baking step or the dielectric forming step. 9. A method of manufacturing a plasma display device, wherein the electrode forming step includes a photolithography method, and washing with ion water is performed before the electrode baking step or the dielectric forming step.