JP2002068470A - Electronic parts manufacturing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a compact and inexpensive electronic parts manufacturing device allowing highly precise visual inspection, characteristic inspection and taping of chip parts. SOLUTION: The electronic parts manufacturing device comprises a first table 1 having a vacuum-back-pressure switchable suction nozzle arranged for sucking the chip parts 27, a second table 2 having a suction nozzle arranged to be rotated at a preset angle for every index for sucking the chip parts 27, a supply unit 3 for supplying the chip parts 27 to the first table 1, a transfer unit 8 for transferring the chip parts 27 from the first table 1 to the second table 2, a plurality of visual inspection units 5, 6, 7 arranged near the outer circumferences of the first table 1 and the second table 2, and picking units 11, 11a for fractionally picking good or bad inspected products, a positioning unit 10 and a taping unit 12.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component manufacturing apparatus having a unit for visual inspection, characteristic inspection and taping of a chip type electronic component.

[0002]

2. Description of the Related Art A conventional electronic component manufacturing apparatus having a unit for visual inspection, characteristic inspection and taping of a chip type electronic component will be described with reference to the drawings.

FIG. 7 is a plan view of a main part of a conventional six-face appearance inspection mechanism, FIG. 8 is a sectional view of a main part structure of the same disk, and FIG. 9 is a plan view of a main part of the same characteristic inspection taping mechanism.

[0004] In FIG. 7, a chip component 27 that is supplied with its front and back surfaces aligned by a parts feeder 40 is supplied to a supply portion 41 with respect to a rotatable first disk 42 having a notch on the outer periphery in which the chip component 27 can be stored. Supplied by Note that the chip component 27 is an electronic component having six surfaces: front and back, two side surfaces, and two end surfaces.

The first disk 42 has a sectional structure as shown in FIG. 8 (a), and its outer periphery and upper and lower surfaces are fixed guides 43, 4 to prevent the chip component 27 from deviating.
4, 45 are provided.

An appearance inspection section 46 composed of a camera and an illumination mechanism above the first disk 42 performs an appearance inspection of the front and back surfaces of the chip component 27 from above and below, and one end surface from outside. Note that, at the inspection position, the fixed guide 45a holds the chip component 27 as shown in FIG.
Suction guide 45b for adsorbing the fixed guide 44
Has a notch at the position of the chip component 27 or is made of a transparent material, and is designed so as not to hinder the appearance inspection.

Next, the chip parts 2 are blown by air.
7 is removed from the first disk 42, moved to the reversing unit 47, and loaded. When passing through this portion, the position of the chip component 27 is reversed by 90 degrees around an axis perpendicular to the end surface, and the front and back surfaces are turned sideways.
Set the side up and down.

Thereafter, the second disk 48 having the same structure as the first disk 42 is supplied by a supply unit of the same mechanism,
Similarly, the appearance inspection unit 46 performs an appearance inspection of both side surfaces from above and below and one end surface from outside. Finally, the non-defective product and the defective product are separated, and the chip part 27 is individually (separately) taken out by the take-out part 49.

In FIG. 9, the chip component 27 is supplied to the rotatable disk 50 by the parts feeder 40 and the supply unit 41 in a state where the front and back surfaces are aligned, similarly to the appearance inspection mechanism.

Then, a predetermined characteristic value is measured by a characteristic inspection section 51 comprising a contact on the disk 50 and a drive mechanism for bringing the contact into contact with the chip component.

Next, after the defective chip part 27 is discharged in the defective discharge part 53, only the chip part 27 having good characteristics is stored in the cavity of the tape 54 in the taping part 52, and the cover tape is mounted thereon to perform taping. Is to be packaged.

In each of the two mechanisms, the number of indexed disks and the arrangement and number of the appearance inspection unit, the characteristic inspection unit, and the defective ejection unit are appropriately set according to the target chip component 27. The second disks 42 and 48 have a normal diameter of 7
Those having a size of about 0 to 150 mm are frequently used.

[0013]

However, in the appearance inspection of a chip component, it is necessary to accurately separate the part to be detected from the part other than the warp to recognize the detected part. The chip component to be inspected is sunk surrounded by the disc and the fixed guide, which limits the direction in which the light source for illumination can be emitted, the chip component gets behind the components of the disc, or There has been a problem that the arrangement of the illumination mechanism is restricted by the components of the bearing.

Further, since the appearance inspection step and the characteristic inspection step, which are indispensable in the production of chip parts, are separated irrespective of the final packaging form, the chip parts once aligned and inspected are individually (separately). It has to be taken out and put back into the next process unit.

In recent years, while chip components have recently been rapidly reduced in size to 1005 type and further to 0603 type, while the clearance between the cavity and the chip component during taping is required to be, for example, 0.1 mm or less, the taping method has been required. In the method of transferring chip components in the notch portion of the disk and transferring it to the cavity, the difference between the notch size required to supply the chip component to the notch of the disk and the product size of the chip component is The clearance needs to be further reduced.

That is, in the electronic component manufacturing apparatus constituted by the conventional mechanism, the selection setting of the inspection illumination mechanism itself is restricted, and the edge of the chip component cannot be detected with high accuracy.
In-process inventory occurs between processes, production lead time is delayed, and smooth operation is difficult in the supply, transport and taping sections of chip components on disks, which hinders equipment operation. Was.

The present invention has been made to solve the above-mentioned problems, and enables high-precision appearance inspection, characteristic inspection, and smooth and high-precision taping operation of a chip component, and can realize a compact and inexpensive apparatus. It is an object to provide an electronic component manufacturing apparatus.

[0018]

In order to solve the above problems, an electronic component manufacturing apparatus according to the present invention is provided with a plurality of suction nozzles capable of switching between vacuum and back pressure, and a side surface of a chip component is provided by the suction nozzles. And a plurality of intermittently rotatable first tables for sucking and rotating and transporting, and a plurality of suction nozzles which are switchable between vacuum and back pressure and are rotatable by a predetermined angle are arranged, and the rotatable suction nozzles are used for the chip component. A second table coupled to the first table so as to be intermittently rotatable so as to adsorb and rotate the upper surface, and to be able to transfer the chip components from the first table; A supply unit for supplying parts;
Near the outer circumference of the table and the second table,
An inspection means for externally inspecting the entire surface of the chip component, which is constituted by a plurality of visual inspection units each arranged at a predetermined position corresponding to the intermittent rotation of the first table and the second table; This is an electronic component manufacturing apparatus provided with a take-out unit that sorts out defective inspection products and inspection non-defective products of the chip component subjected to the appearance inspection, so that reliable chip component inspection and taping can be performed.

[0019]

DESCRIPTION OF THE PREFERRED EMBODIMENTS According to the first aspect of the present invention, a plurality of suction nozzles capable of switching between vacuum and back pressure are provided.
An intermittently rotatable first table for suctioning and rotating and transporting the side surface of the chip component by the suction nozzle, and a plurality of suction nozzles which can switch between vacuum and back pressure and rotate by a predetermined angle are provided, and the rotation is possible. It can rotate intermittently so that the upper surface of the chip component is sucked by a suction nozzle and rotated and transported.
A second table coupled to the first table so that the chip components can be transferred from the first table; a supply unit for supplying the chip components to the first table; The entire surface of the chip component, which is constituted by a plurality of visual inspection units arranged at predetermined positions corresponding to the intermittent rotation of the first table and the second table, is near the outer circumference of the second table. An electronic component manufacturing apparatus comprising: an inspection unit for inspecting, and a take-out unit for separating and taking out defective inspection products and good inspection products of the chip component subjected to appearance inspection by the appearance inspection unit, wherein the chip component is provided by a vacuum suction nozzle. Transporting the chip components around the chip components without the need for guide components, and the illumination mechanism during visual inspection The chip nozzle can be rotated at a predetermined angle so that the appearance inspection surface of the chip component can always be directed to the outside of the table, and the appearance inspection unit is radially arranged near the outer circumference of the table, which is advantageous in terms of space. This makes it possible to perform the appearance inspection with high accuracy and to realize stable operation of the equipment.

According to a second aspect of the present invention, the electrical characteristics of the chip component are measured near the first table or the second table at a position corresponding to the intermittent rotation of the first table or the second table. 2. The electronic component manufacturing apparatus according to claim 1, further comprising a contact unit, wherein a space for the appearance inspection unit is significantly reduced, and a characteristic inspection mechanism can be provided. Can be connected.

According to a third aspect of the present invention, in the vicinity of the second table, a positioning unit for correcting the position of the chip component in the θ direction to a position corresponding to the intermittent rotation of the second table, and taping the chip component. An electronic component manufacturing apparatus according to claim 2, further comprising a taping unit for packaging, wherein the position is corrected in a θ direction (a rotation direction around an axis perpendicular to the tape plane). In addition to the operation described in (1), the taping unit can be provided, and the connection can be made up to the taping step.

According to a fourth aspect of the present invention, the displacement of the chip component in the X, Y, and θ directions is recognized based on the data of the lower surface of the chip component taken in during the visual inspection, and X, Y is determined by the cavity position during taping. 4. The electronic component manufacturing apparatus according to claim 3, further comprising a taping unit that corrects the direction, and a positioning unit that corrects the shift amount in the θ direction by rotating a suction nozzle provided on the second table. This has the effect that the chip components can be positioned in a non-contact manner and taping can be stably performed even on minute chip components.

According to a fifth aspect of the present invention, there is provided a taping unit which recognizes a shift amount of a chip component and does not insert the chip component into a tape cavity when the shift amount is larger than a preset amount. According to the electronic component manufacturing apparatus of the present invention, even if the position of the conveyed chip component is shifted from the clearance of the cavity, it has an effect that stable taping can be performed.

According to a sixth aspect of the present invention, the X direction in the tape longitudinal direction is the feed amount of the tape transport mechanism, and the Y direction perpendicular to the tape longitudinal direction and horizontal to the tape plane rotates on the tape transport line. 5. The electronic component manufacturing apparatus according to claim 4, wherein the taping unit is configured to correct the cavity position by a swing mechanism having a center, and the position of the chip component is eliminated without requiring a separate correction mechanism. This has the effect that correction can be performed.

According to a seventh aspect of the present invention, there is provided a gear fixed to a rotating shaft of a suction nozzle disposed on a second table, and a gear engaged with the gear, and is rotatably supported by the second table. A first timing pulley, a second timing pulley provided on a rotating shaft of a second table, and a timing belt for suspending between the first timing pulley and the second timing pulley. 2. The electronic component manufacturing apparatus according to claim 1, wherein the suction nozzle is configured to rotate on its own axis, and has an operation of ensuring a reliable and compact operation.

Hereinafter, an electronic component manufacturing apparatus according to an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a plan view of a main part of an electronic component manufacturing apparatus according to the present invention, FIG. 2 is a cross-sectional view of a main part of the first and second tables, and FIG.
FIG. 4 is an enlarged perspective view of the chip component and the suction nozzle, FIG. 5 is a cross-sectional view of the main part of the positioning unit, and FIG. 6 is a main view of the taping unit. It is a component structure top view.

In FIG. 1, 1 is, for example, 120 mm in diameter.
Rotatable first table divided into twelve metal bodies, 2
Is in contact with the outer circumference of the first table 1 and has a diameter of 150 mm.
Rotatable second table divided into 12 parts like the first table
It is a table. Reference numeral 3 denotes a supply unit, which adsorbs and mounts the chip components 27 described in the related art described above, which are aligned and conveyed in a line by the parts feeder 4, one by one at predetermined intervals. .

Reference numeral 5 denotes an appearance inspection unit which is an inspection means in which a camera and an illumination mechanism are installed on one plate in order to inspect the side surface or the end surface of the chip component 27, and a plurality of appearance inspection units 5 are provided. It is arranged near the radial outer circumference from the center of the table.

Reference numeral 6 denotes an appearance inspection unit serving as inspection means for inspecting the lower surface of the chip component 27. The appearance inspection unit 6 also employs a prism, and is similar to the appearance inspection unit 5 for inspecting a side surface or an end surface. It is arranged near the outer circumference of each table which is advantageous in terms of space.

Reference numeral 7 denotes an appearance inspection unit serving as an inspection means for inspecting the upper surface of the chip component 27. The appearance inspection unit 7 is disposed above the movement locus of the chip component 27.

8 is a transfer unit for transferring the chip component 27 from the first table 1 to the second table 2, 9 is a contact unit for measuring various characteristics of the chip component 27, and 10 is a positioning unit. When taping the chip component 27, the tape component is positioned for insertion into the cavity of the tape 54 described in the related art.

Reference numerals 11 and 11a denote a plurality of or one defective discharge ports for discharging chip components 27 which have become defective in inspection, and constitute a take-out unit for separating defective inspection and non-defective products and extracting defective inspection products.

Reference numeral 12 denotes a taping unit for accommodating the chip part 27 of a good inspection product in the cavity of the tape 54 and mounting the cover tape by thermocompression bonding.

In FIG. 2, reference numeral 13 denotes a chip component 2
7 is a suction nozzle made of a ceramic material for sucking and holding 7, and can be connected to a distributor 14 via a first table 1 to a distributor 14 for switching between vacuum and back pressure as required.

Reference numeral 13a denotes a suction nozzle arranged on the second table 2 similar to the suction nozzle 13, and the piping has the same configuration as that of the first table 1. Reference numeral 15 denotes a compression spring that urges the suction nozzle 13a downward, 16 denotes a shaft that fixes the suction nozzle 13a and that is movable in the vertical and rotational directions, and 17 denotes a rotation gear, which is inserted into the shaft 16 and an intermediate portion thereof. It is fixed to.

Reference numeral 18 denotes an attachment for moving the suction nozzle 13a up and down.
The positioning unit 10 and the taping unit 12 are disposed at three places. Reference numeral 19 denotes a drive shaft for vertical movement, which is inserted into a shaft of a rotary shaft 20 having a hollow shaft structure, and has one end connected to the attachment 18 and the other end connected to an intermittent drive source or a vertical drive source.

21 is arranged on the upper surface of the second table 2,
This is a gear that meshes with the rotation gear 17, and in this device, one gear is arranged for two suction nozzles.

Reference numeral 22 denotes a first timing pulley which rotates integrally with the gear 21. Reference numeral 23 denotes a fixed table, which is used at the three positions (the transfer unit 8, the positioning unit, 10, a stopper for the downward direction of the suction nozzle 13a in a portion other than the taping unit 12).

The fixed table 23 is attached to the attachment 18 for vertical movement by, for example, the second table 2.
Detent (not shown) connected to the fixed part near the outer circumference of
Regulates the direction of rotation.

Reference numeral 24 denotes a second timing pulley fixed to the lower portion of the fixed table 23, and reference numeral 25 denotes a two-toothed timing belt suspended between the first timing pulley 22 and the second timing pulley 24. An intermittent drive source for the first table 1 and the second table 2 and a vertical drive source for the second table 2 are disposed below the bearings 28a and 28b and the main body frame 28, and are coupled to respective shafts.

In FIG. 3, reference numeral 26 denotes a tension pulley for smoothly and properly suspending the timing belt 25 between the first timing pulley 22 and the second timing pulley 24.

Next, the operation of the apparatus configured as described above will be described. Here, the posture and the surface of the chip component 27 sucked and placed on the first table 1 to be inspected are defined as surfaces a to f as shown in FIG.

In the first table 1, the chip component 27 is sucked by the suction nozzle 13 on the surface b shown in FIG. 4, and is rotated and conveyed one index at a time in one cycle while maintaining its posture counterclockwise. That is, 30 ° per cycle
(= 360 ° divided by 12).

On the first table 1, an appearance inspection and a characteristic inspection are performed on the surface a (the upper surface of the chip component 27) and the surface d (the same side surface). If the chip component 27 is a good product, two defective discharge ports are provided. Pass through 11 stations sequentially. If a defective chip component 27 is detected, the defective discharge port 11
Is discharged to

The characteristic inspection according to the present embodiment is performed by contacting the contact unit 9 from the outer periphery of the first table 1 to the d-plane (not shown).

Next, the chip component 27 is transferred by the transfer unit section 8 to the second table 2 having the a surface of the chip component 27 as a suction surface. Note that the transfer of the chip components 27 from the first table 1 to the second table 2 is performed by disposing the chip components 27 from the suction nozzle 13 disposed on the first table 1 to the second table 2 as in the present embodiment. Suction nozzle 13
Alternatively, the chip component may be temporarily transferred to another member and then transferred indirectly. Next, the second table 2 rotates clockwise by one index in one cycle.
3a itself rotates counterclockwise for each index.

Therefore, at the second index from the transfer unit 8, the d surface (the side surface of the chip component 27) is located on the outer peripheral side of the second table 2, and then the f surface (the chip component 27 End face), b face (chip component 27)
Side) and then the e-plane (the end face of the chip component 27). In this order, the appearance inspection is performed by the appearance inspection unit 5 on the outer peripheral side of the second table 2.

However, since the d surface has already been inspected in the first table 1, the c surface (the lower surface of the chip component 27) is placed on the outer periphery of the second table 2 at the station where the d surface is located on the outer peripheral side. The appearance inspection is performed by the inspection unit 6.

Next, a chip component 2 for taping
After passing through the station of the defective discharge port 11a, the position of the chip component 27 is corrected and set (not shown) so that the positioning unit 10 can be inserted into the cavity of the tape 54 in the taping. A chip part 2 is provided at a predetermined position of the cavity 54.
Then, the cover tape is attached by thermocompression bonding to complete the taping.

When the chip component 27 is displaced more than a predetermined displacement amount, the chip component 27 is discharged to the defective discharge port 11a at the defective discharge station without performing position correction, and It is not inserted into the cavity.

In general, the simplest mechanism that can be considered in the rotation structure of the suction nozzle 13a in the present apparatus is that a rotation gear 17 fixed to a shaft 16 to which the suction nozzle 13a is connected is attached to the center of the second table 2 at the center. This is a configuration that meshes with a fixed gear (sun gear). However, in the case of this apparatus, it is necessary to set the gear ratio of the rotation gear: sun gear = 1: 3 from the relationship of 90 degrees rotation at one index, and in this case, the diameter of the rotation gear 17 becomes too large to be adjacent. The gears will interfere with each other.

Accordingly, it is necessary to change the speed between the sun gear and the rotation gear in two steps. As a method, another idler gear is interposed between the two gears (the sun gear and the rotation gear). Can be configured by
In such a structure in which the gears are shifted in multiple stages only with the gears, the backlash due to the gears is large and the accuracy is not good. Furthermore, in the structure, it is difficult to adjust the backlash between the gears, and the device of the present invention is a mechanism combining a gear and a timing belt,
By applying tension to the timing belt 25 by the tension pulley 26, play is easily eliminated, and a highly accurate rotation structure is realized.

Next, the positioning unit 10 for the chip component 27 in FIG. 1 will be described. As shown in FIG.
The structure of the suction nozzle 13a of the second table 2 is such that the shaft 30 and the rotation gear 17 are not fixed, but are pressed by the urging force of the compression spring 29, and the collar 30 fixed to the shaft 16 is used.
With this frictional force, the rotational torque during rotation is transmitted.
However, when correcting the position of the chip component 27 in the θ direction, the attachment 31 is lowered from above in the positioning unit 10 in FIG. And the notch in the upper part of the motor is rotated by a required amount of pulse motor.

Also, as shown in FIG.
4 is a pin pulley for feeding the pitch 4 at a constant pitch, 33 is a pulse motor for rotating and driving the pin pulley 32, and 34 is a pin pulley for tension. Not shown).

Reference numeral 35 denotes a swing fulcrum of the entire taping unit 12, reference numeral 36 denotes a cam follower fixed to the taping unit 12, and reference numeral 37 denotes a cam for applying a displacement, which is rotationally driven by a pulse motor 38.

In this apparatus, the position correction of the chip component 27 in the X direction (longitudinal direction of the tape 54) does not make the feed amount of the pulse motor 33 used for transporting the tape 54 fixed, but makes the correction amount. Correction is performed by changing the feed amount and transporting. In the Y direction (tape 54
The position correction in the width direction) is performed such that the entirety of the taping unit 12 is sufficiently away from the taping position 39 of the chip component 27 in the direction in which the tape 54 runs, and the rotation of the cam 37 on the tape running line is attached to the pulse motor 38.
Is rotated by the required amount to move it by the correction value to perform the correction.

With the mechanism having the above configuration, based on the image data captured by the c-plane (lower surface) appearance inspection unit 6 of the chip component 27 on the second table 2 in FIG.
Correction in the X, Y, and θ directions is performed to perform smooth and accurate taping.

Needless to say, in this apparatus, θ
The suction nozzle 13a corrected in the direction is provided with a mechanism unit (not shown) for returning the chip component 27 to the initial position after taping the chip component 27 and returning to the transfer unit unit 8 for suctioning the next chip component 27. , The suction nozzle 13a,
It returns to the initial position and sucks the next chip component 27.

[0059]

As described above, according to the electronic component manufacturing apparatus of the present invention, there is an effect that highly accurate appearance inspection, characteristic inspection and taping of chip components can be realized by a compact and inexpensive apparatus.

[Brief description of the drawings]

FIG. 1 is a plan view of a main part configuration of an electronic component manufacturing apparatus according to the present invention.

FIG. 2 is a sectional view of a main part of the first and second tables.

FIG. 3 is a plan view of a main part of a suction nozzle rotation mechanism of the second table.

FIG. 4 is an enlarged perspective view of the chip component and a suction nozzle.

FIG. 5 is a sectional view of a main part of the positioning unit.

FIG. 6 is a plan view of a main part configuration of the taping unit.

FIG. 7 is a plan view of a main part of a conventional six-face appearance inspection mechanism.

FIG. 8 is a sectional view of a main part structure of the disk.

FIG. 9 is a plan view of a main part of the same property inspection taping mechanism.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 1st table 2 2nd table 3 Supply unit 4, 40 Parts feeder 5, 6, 7 Visual inspection unit (inspection means) 8 Transfer unit part 9 Contact unit 10 Positioning unit 11, 11a Defective outlet 12 Taping unit 13 , 13a Suction nozzle 14 Distributor 15, 29 Compression spring 16 Shaft 17 Rotating gear 18, 31 Attachment 19 Drive shaft 20 Rotating shaft 21 Gear 22 First timing pulley 23 Fixed table 24 Second timing pulley 25 Timing belt 26 Tension Pulley 27 Chip component 28 Body frame 28a, 28b Bearing 30 Collar 32, 34 Pin pulley 33, 38 Pulse motor 35 Swing fulcrum 36 Cam follower 37 Cam 39 Taping position 41 Supply unit 42 First disk 43, 4 , 45, 45a fixed guide 45b suction holes 46 appearance inspection unit 47 reversing unit 48 second disc 49 receiving portion 50 disk 51 characteristic inspection unit 52 taping unit 53 defective discharge unit 54 Tape

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Kenji Okura 1006 Ojimon Kadoma, Kadoma City, Osaka Prefecture F-term in Matsushita Electric Industrial Co., Ltd. (reference) 2G051 AA73 AB20 CA04 CA07 DA02 DA08 DA09 DA13 3F072 AA14 GB07 GB10 GE02 GE03 GE05 GG03 HA03 KC01 KC05 KC07 KC10 KC12

Claims (7)

[Claims] 1. A plurality of vacuum nozzles and a back pressure switchable suction nozzle are provided, an intermittently rotatable first table for sucking and rotating and transporting a side surface of a chip component by the suction nozzle, and a vacuum and a back pressure. A plurality of suction nozzles that can be switched and are rotatable by a predetermined angle at a predetermined angle are disposed, the upper surface of the chip component is sucked by the rotatable suction nozzle, and the chip component is intermittently rotatable so as to be rotatably transported. A second table coupled to the first table so that the chip components can be transferred, a supply unit for supplying the chip components to the first table, and outer circumferences of the first table and the second table The entirety of the chip component, which is in the vicinity and includes a plurality of visual inspection units respectively disposed at predetermined positions corresponding to the intermittent rotation of the first table and the second table. An electronic component manufacturing apparatus, comprising: an inspection unit for inspecting the appearance of a surface; and an extraction unit for separating and extracting inspection defective products and inspection non-defective products of the chip component subjected to the appearance inspection by the appearance inspection unit. 2. A contact unit for measuring an electrical characteristic of a chip component is provided near a first table or a second table at a position corresponding to intermittent rotation of the first table or the second table. 2. The electronic component manufacturing apparatus according to 1. 3. A positioning unit for correcting the position of the chip component in the θ direction near the second table at a position corresponding to the intermittent rotation of the second table, and a taping unit for taping and packaging the chip component are added. 3. The electronic component manufacturing apparatus according to claim 2, wherein 4. The displacement of the chip component in the X, Y, and θ directions is recognized based on the data of the chip component bottom surface taken in during the visual inspection, and X, Y is determined according to the cavity position during taping.
4. The electronic component manufacturing apparatus according to claim 3, further comprising a taping unit that corrects in the Y direction, and a positioning unit that corrects the shift amount in the θ direction by rotating a suction nozzle disposed on the second table. 5. 5. The taping unit according to claim 4, wherein the taping unit recognizes a shift amount of the chip component and does not insert the chip component into the cavity of the tape when the shift amount is larger than a preset amount. Electronic component manufacturing equipment. 6. The X direction in the tape longitudinal direction is the feed amount of the tape transport mechanism, and the Y direction perpendicular to the tape longitudinal direction and horizontal to the tape plane is a swing mechanism having a rotation center on the tape transport line. 5. A taping unit for correcting a cavity position.
An electronic component manufacturing apparatus according to claim 1. 7. A gear fixed to a rotation shaft of a suction nozzle disposed on a second table, a first timing pulley having a gear engaged with the gear and rotatably supported by the second table. A second timing pulley provided on a rotating shaft of a second table, and a timing belt suspended between the first timing pulley and the second timing pulley, wherein the suction nozzle rotates. The electronic component manufacturing apparatus according to claim 1.