JP2002066733A - Iron member for soldering and soldering device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an iron member 32 and a soldering robot capable of effectively soldering four or more rows of to be soldered parts, and suppressing generation of a soldering defect which is caused by excess adhesion of solder. SOLUTION: The iron member 32 wherein a plurality of recesses 310A and 310B which surround two rows of lead 210, extend along a column direction of the lead, and have opened both end parts in the extending direction are formed in an orthogonal direction to the extending direction of the iron tip 31 is used. The recesses may surround one single lead 210. In this case, the thickness of leg parts which are formed on both end sides in the orthogonal direction to the extending direction of the recesses are thinner than intervals between the rows of the lead, and a solder supply surface is provided on the outside surface of each leg part.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a soldering apparatus for soldering an object to be soldered, such as a board on which components such as electronic components and connectors are mounted, and a soldering iron member used in the apparatus. In particular, the present invention relates to a soldering device for soldering a plurality of soldering locations where a projecting member projects from a soldering target, and a soldering iron member used for the device.

[0002]

2. Description of the Related Art Conventionally, as this type of soldering device,
There is known an automatic soldering device (soldering robot) that moves a soldering iron member along a soldering location while supplying a thread-like solder to a soldering iron tip of the soldering iron member. In this soldering apparatus, when the iron tip of the soldering iron member is heated and the solder is supplied to the iron tip by the solder supply means, the solder in contact with the iron tip melts. The melted solder reaches a soldering location adjacent to the iron tip and is soldered. When soldering is performed on a plurality of soldering points arranged in a straight line on a soldering object using this soldering device, the soldering iron member of the soldering iron member may be soldered with a plurality of soldering tips. By moving the portions along the direction in which the portions are arranged, the soldering portions can be continuously soldered.

[0003]

However, when soldering a plurality of soldering points arranged in a plurality of rows with the above-mentioned conventional soldering apparatus, a plurality of soldering iron members are arranged along the soldering points. Had to be moved around times. For example, when the above-mentioned soldering portions are arranged in two rows, it is necessary to move the distance in which the soldering portions are arranged twice. As described above, it is necessary to move the soldering iron members at least by the number of rows of the soldering locations, and thus it has been difficult to improve the efficiency of the soldering process.

[0004] It is known that a gate-shaped iron tip formed so as to surround two rows of soldering points is capable of soldering two rows of soldering points by one movement of the soldering iron member. Have been. FIG. 7 is a partial sectional view showing an example of a gate-shaped iron tip. The tip of the gate-shaped iron tip 500 is mounted on the component-mounted board 20 to be soldered.
The two rows of leads 201 on the 0 are formed so as to sandwich the protruding soldering portion between the two legs 500a and 500b. The legs 500a, 50 of the iron tip 500
Solder holder (recess) 500 which is a groove-shaped space between 0b
To c, molten solder is supplied through a solder supply path 500d in the iron tip 500. The soldering tip 500 is moved in the column direction of the leads 201 in a state where the molten solder 40 'is filled in the solder reservoir 500c, so that the molten solder 40' The solders 40 ′ are brought into contact one after another, and the two rows of soldered portions can be soldered.

However, when soldering the four rows of soldering points where the leads protrude using the conventional portal iron tip, it is necessary to move the iron tips twice along the soldering locations. Therefore, the efficiency of the soldering process is insufficient. It is conceivable to form the solder holding portion of the iron tip so as to surround the four rows of leads so that only one movement of the iron tip is required. There is a problem that soldering failure is likely to occur due to soldering at unnecessary places.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and an object of the present invention is to efficiently perform soldering on four or more rows of soldering portions where protruding members protrude, and to use excessive soldering. An object of the present invention is to provide a soldering iron member and a soldering device that can suppress occurrence of soldering failure due to adhesion or unnecessary solder adhesion.

[0007]

In order to achieve the above object, the present invention is directed to a solder for soldering a plurality of rows of projecting members projecting from a surface of a soldering object at predetermined intervals. A soldering iron member for surrounding the two rows of the protruding members, extending along the row direction of the protruding members, and having recesses open at both ends in the extending direction; It is characterized in that a plurality are formed in a direction perpendicular to the direction.

In the soldering iron member according to the first aspect, the soldering iron tip is arranged so that the projecting member of the object to be soldered is surrounded by each recess in two rows. The soldering tip is moved along the extending direction of the recess while the soldering tip is heated to supply the solder to each recess, so that the soldering locations of four or more rows where the projecting members project are collectively soldered. I do. And, by making the concave portion of the iron tip large enough to surround the two rows of the protruding members, more solder than necessary is attached to a soldering location, or solder is attached to an unnecessary location. Has been suppressed.

According to a second aspect of the present invention, there is provided a soldering iron member for soldering a plurality of rows of projecting members projecting at a predetermined interval from the surface of a soldering object, wherein one row of the projecting members is provided. A plurality of recesses are formed in the direction perpendicular to the extending direction of the iron tip, the plurality of recesses surrounding the portion and extending along the row direction of the protruding members and having both ends opened in the extending direction. The thickness of the legs formed at both ends in the direction perpendicular to the existing direction is smaller than the interval between the rows of the protruding members, and each of the legs has a solder supply surface on the outer surface. It is.

[0010] In the soldering iron member according to the second aspect, the ironing tip is arranged so that the protruding member of the object to be soldered is surrounded by each recess one by one. The soldering tip is moved along the extending direction of the recess while the soldering tip is heated to supply the solder to each concave portion and the outer surface of each leg, so that four or more rows of the solder having the projecting members protrude. Solder all parts at once. And, by making the concave portion of the iron tip so large as to surround one row of the protruding member, more solder than necessary is attached to a soldering location, or solder is attached to an unnecessary location. Has been suppressed.

According to a third aspect of the present invention, there is provided the soldering iron member according to the first or second aspect, wherein at least one end side of the iron tip in the extending direction of the concave portion is provided on an outer surface adjacent to each concave portion. It has a solder supply surface.

In the soldering iron member according to a third aspect of the present invention, the solder is supplied to each of the solder supply surfaces on the outer surface adjacent to each of the recesses of the iron tip, and the solder is melted at each of the solder supply surfaces so that the solder is supplied to each of the recesses. Supply.

According to a fourth aspect of the present invention, there is provided a soldering iron comprising: a soldering iron member; heating means for heating the iron tip of the soldering iron member; and solder supply means for supplying solder to the iron tip. An apparatus, wherein the soldering iron member according to claim 1, 2 or 3 is used as the soldering iron member.

According to a fourth aspect of the present invention, the soldering tip of the soldering iron is heated by the heating means. The heated iron tip is arranged so as to surround the protruding member of the soldering target object with each concave portion. Then, the soldering tip is moved along the extending direction of the recess while the solder is supplied to each recess of the iron tip by the solder supply means or to each recess and the outer surface of each leg. As a result, the projecting member 4
Solder all the soldering points in rows and above.

According to a fifth aspect of the present invention, in the soldering device of the fourth aspect, the solder supply means is configured to be able to selectively supply solder to each recess of the iron tip. It is assumed that.

In the soldering apparatus according to the fifth aspect, the solder can be selectively supplied to the plurality of recesses of the iron tip by the solder supply means, so that soldering is performed according to the presence or absence of a soldering location corresponding to each recess. Can be supplied.

According to a sixth aspect of the present invention, in the soldering apparatus of the fifth aspect, a storage means for storing information on a soldering location on the soldering target, and the soldering target and the soldering iron are provided. A relative position changing means for changing a relative positional relationship between the member and the soldering object and the soldering iron member based on information on the soldering location stored in the storage means; Control the relative position changing means so as to change the relative positional relationship between the solder and the solder supply to each recess of the iron tip or to the outer surface of each recess and each leg. Thus, a control means for controlling the solder supply means is provided. Here, the relative positional relationship between the soldering object and the soldering iron member is only a positional relationship representing a linear distance between the soldering object and the soldering iron member. However, it also includes a rotational positional relationship indicating a relative rotational angle between the two. Further, the relative position changing means for changing the relative positional relationship includes means for moving or rotating at least one of the soldering object and the soldering iron member.

In the soldering apparatus of the present invention, information relating to a soldering location on a soldering object is stored in advance in the storage means. Then, based on the information on the soldering location stored in the storage means, the position of the soldering location on the object to be soldered is determined by the control means, and each of the concave portions of the iron tip of the soldering iron member is The relative position varying means is controlled so as to surround the soldered portion. Also, based on the above information, before starting the soldering operation, which concave portion of the iron tip of the soldering iron member corresponds to the soldering portion, or which concave portion and the outer surface of the leg portion are the soldering portion. Is determined by the control means. By controlling the solder supply means by the control means based on this determination result, the supply of solder to each concave portion of the iron tip or the supply of solder to the outer surface of each concave portion and each leg is switched. By switching the solder supply in this way, depending on the presence or absence of a soldering location corresponding to each recess, or the presence or absence of a soldering location corresponding to the outer surface of each recess and each leg, the soldering location corresponds to The solder is automatically supplied only to the recessed portion or only to the outer peripheral surfaces of the recessed portion and the leg corresponding to the soldering location.

[0019]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment in which the present invention is applied to a soldering robot as a soldering device will be described below. This soldering robot automatically solders a board (PCB) as an object to be soldered. FIG. 2 is a front view showing a schematic configuration of the soldering robot according to the present embodiment. This soldering robot has an apparatus main body 10 having a worktable 101 at the top.
0, stand members 102 and 103 attached to both sides of the apparatus body 100, and the stand members 102 and 1
An X-axis guide member 104 attached to the upper portion of the support member 03 so as to bridge between the two stand members; And a unit 10.

Two guide rails 10 extending in the Y-axis direction (the front-back direction in the drawing) are provided at the center of the worktable 101.
5 and 106 are formed, and movable brackets 107 and 108 are attached along the guide rail so as to be movable in the Y-axis direction. A work table 109 is mounted on the movable brackets 107 and 108, and a board 200 as an object to be soldered is mounted on the work table 109 via board support stands 110 and 111. The driving of the movable brackets 107 and 108 in the Y-axis direction is controlled by a control unit, which will be described later, based on information on a soldering location on the board. The data of the information on the soldering location on the board is acquired in a data capturing operation (teaching operation) performed in advance, and together with data such as various parameters at the time of soldering, the memory card 113 inserted into the memory card slot 112. Is stored.

The soldering unit 10 includes a unit main body 11, a pair of solder supply sub-units 20A and 20B attached to both sides of the unit main body 11, and an elevating slide shaft 12 extending downward from the unit main body 11.
And a soldering head 30 attached via a relay member 13, a swing arm 14, and the like. A movable bracket (not shown) is provided on the back side of the unit body 11, and the movable bracket is guided by a guide rail (not shown) formed on the X-axis guide member 104 side, so that the soldering unit 10 is mounted. It can be moved in the X-axis direction.

The elevating slide shaft 12 extending downward from the unit main body 10 is drive-controlled so as to move in the Z-axis direction (vertical direction in the figure), and rotates about the center axis in the Z-axis direction. It can be driven to rotate. The relay member 13 connected to the elevating slide shaft 12 has a soldering tip at the tip of the soldering head 30 so that the iron tip can be pressed against the substrate 200 with a predetermined pressure.
An air pressure mechanism (not shown) is incorporated. Further, the swing arm 14 connected to the relay member 13 is configured so that the soldering head 30 can be fixed by being inclined at a predetermined angle.

The soldering head 30 has a built-in heater as a heating means and a soldering iron member (hereinafter referred to as “iron member”) 32 having an iron tip 31 at a tip portion, and both sides of the iron member 32. Set of solder supply heads 3 fixed to fixed arm members 33A, 33B
4A and 34B. This solder supply head 3
Needles 35A, 3A and 3B having a hollow structure are provided at the tips of the iron tips 4A and 34B on the side of the iron tip 31 so that the thread-like solder can pass through.
5B. Further, the solder supply head 34
A and 34B are supplied with thread-like solder via the solder supply tubes 21A and 21B from the solder supply subunits 20A and 20B, which can be controlled independently. The solder supply heads 34A, 34B
The thread-like solder 40 is connected to the needle members 35A, 35A.
A pre-heating unit for pre-heating before discharging from B may be provided.

The solder supply subunits 20A and 20A
B is a solder supply device 23A, 23B having a pair of delivery rollers 22A, 22B and a motor (not shown), and solder reels 24A, 24 around which a predetermined amount of thread-like solder 40 is wound.
B. The delivery roller pair 22A, 22B sends the solder 40 to the solder supply tubes 21A, 21B by rotating while pinching the thread-shaped solder 40, and one of the roller pairs is driven by a motor. The roller and the other roller are driven rollers. The distance between the two rollers is a
The driving roller is controlled so as to send the thread solder 40 at a predetermined speed and to selectively turn on / off the thread solder delivery. This solder supply subunit 20A, 20
B, the solder supply tubes 21A and 21B and the solder supply heads 34A and 34B,
Solder supply means for supplying solder to the second iron tip 31 is configured. Note that the solder supply devices 23A and 23A
B may be provided with a sensor for detecting solder breakage, a sensor for detecting clogging of solder, or the like, as appropriate. Further, the solder supply devices 23A and 23B are provided with the delivery roller pair 2
It is not limited to the one using 2A, 22B,
The thread-like solder may be sent out by another mechanism.

FIGS. 1 and 3 show the iron member 3 respectively.
FIG. 2 is an enlarged perspective view and an enlarged front view of a distal end portion of a second embodiment. The iron tip 31 of the iron member 32 is arranged in a row direction (a moving direction of the iron tip) of the lead 201 which is a protruding member protruding from a soldering position on the substrate 200 to which the component 202 is attached.
Two concave portions (solder holding portions) 3 arranged in a direction orthogonal to
10A and 310B are formed. This recess 310
A and 310B surround two rows of the leads 201 and extend in the column direction of the leads 201. Both ends in the extending direction are open so that the leads 201 can pass through. Note that, in the present embodiment, the cross-sectional shape of the inner wall surfaces of the recesses 310A and 310B in a plane orthogonal to the moving direction of the iron tip is a semicircular shape, but is not limited to this shape. For example, the character "ku" or "ko"
It may be shaped like a letter. The recesses 310A, 3A
It may be formed so that the area of the cross-sectional shape of 10B changes in the iron tip moving direction.

Each of the recesses 310A of the iron tip 31 is
On the outer surface adjacent to 310B, each recess 310A, 310
A solder supply surface 320 for supplying the solder 40 to B is provided. Each recess 310 of the solder supply surface 320
In the portions corresponding to A and 310B, the tips of the needle members 35A and 35B of the solder supply heads 34A and 34B are arranged so as to be close to and opposed to each other. Thread solder 4 discharged from tips of needle members 35A, 35B
Each 0 ′ contacts the solder supply surface 320 of the iron tip 31 and melts, and flows down along the solder supply surface 320 by gravity. The molten solder 40 'flowing down in this manner is supplied so as to cover the leads 201 in each row.

As shown in FIG. 1, the tip surface (bottom surface) of the iron tip 31 is machined to a surface inclined at a predetermined angle with respect to the center axis of the iron member 32.
Is inclined, the tip surface of the iron tip 31 and the surface of the substrate 200 are substantially parallel to each other so that they are surely in contact with each other. By tilting the iron member 32 in this manner, the iron member 32 can be smoothly moved on the substrate 200, and the driving load of the iron member 32 can be reduced.

FIG. 4 is a block diagram showing a main part of a control system of the soldering robot. The control unit 300 as a control unit is configured using a CPU, a RAM, a ROM, an I / O interface, and the like. This control unit 30
0 is a memory card drive device 30 for writing and reading data to and from the memory card 113.
1, and various motor drive circuits 302A, 302B, 30
3 to 305 are connected. The various motor drive circuits 302A, 302B, 303 to 305, motors connected to the respective circuits, movable brackets driven by the respective motors, guide rails for guiding the movable brackets, etc., allow the board 200 and the iron member 32 to move between the board 200 and the iron member 32. Relative position changing means for changing the relative positional relationship (linear distance and rotation angle) of the above.

As described above, the data on the soldering location of the substrate 200 to be soldered and the data on various parameters (such as the amount of thread-like solder discharged and the moving speed of the ironing member) during soldering are stored in the memory card 113. It is remembered. The data in the memory card 113 is taken into the control unit 300 via the memory card drive 301. A command signal for each motor drive unit is generated and transmitted based on the data. Based on the command signal, each motor drive unit controls the corresponding pulse motor 3
06A, 306B, and 307 to 309 are rotationally driven. It should be noted that the data and the like relating to the soldering location may be stored in another storage medium such as a floppy (registered trademark) disk or a hard disk for use. Also,
The configuration may be such that data relating to the soldering location and the like are taken in from an external device such as a personal computer connected to the device main body 100.

When soldering a plurality of soldering portions arranged in four rows on the substrate 200 using the soldering robot having the above configuration, first, the substrate 200 is set on the substrate support stand 110 on the work table 109. . next,
By controlling the position of the work table 109 in the Y-axis direction, the rotation angle of the soldering head 30, and the position of the soldering unit 10 in the X-axis direction, one of four rows of the leads 201 on the substrate 200 is formed. The iron tip 31 is located at the end of. Next, the soldering head 30 is moved downward in the Z-axis to bring the iron tip 31 into contact with the substrate 200, and the work table 109 is moved toward the Y-axis to move the iron tip 31 relative to the substrate 200. Solder is supplied to the solder supply surface 311 of the iron tip 31 while being moved, and soldering is performed on four rows of soldering locations located in the recesses 310A and 310B of the iron tip 31. Then, when the iron tip 31 has relatively moved to the other end of the lead row, the supply of solder to the iron tip 31 is stopped,
The soldering head 30 is moved upward in the Z axis. The single movement of the iron tip 31 makes it possible to collectively solder the four rows of leads 201.

When soldering is performed at two soldering locations (lead insertion locations) using the iron tip 31, only the upper portion of the two recesses 310A and 310B that surrounds the lead is soldered. Control to supply solder. By performing this control, the substrate 200
Unnecessary solder adhesion and useless supply of solder can be avoided.

As described above, according to the present embodiment, the lead 201
Along the row of soldering points where
By rotating the soldering points, the soldering points in four rows can be collectively soldered, so that the soldering of the soldering points in four rows can be efficiently performed. Moreover, each of the recesses 310A, 310 of the iron tip 31 described above.
Since B is set so as to surround two rows of the leads 201, it is possible to suppress the occurrence of soldering failure due to excessive solder attachment or unnecessary solder attachment. Further, by switching the solder supply to the recesses 310A and 310B of the iron tip 31, the solder is not wasted and not only the four rows of soldered portions but also
A row or three rows of soldering locations can be collectively soldered.

FIGS. 5 and 6 are an enlarged perspective view and an enlarged front view, respectively, of the distal end portion of an iron member according to another embodiment of the present invention. The iron tip 31 of this iron tip member is a component 202
Direction of the lead 201 protruding from the soldering position on the substrate 200 to which the is attached (the moving direction of the tip)
Recesses (lead through portions) 3 arranged in a direction orthogonal to
12A and 312B are formed. This recess 312
A and 312B surround one row of the leads 201 and extend in the column direction of the leads 201, and are open at both ends in the extending direction so that the leads 201 can pass through. And these recesses 312A, 312B
The inner wall is formed such that the height of the upper end surface thereof becomes higher toward the downstream side in the iron tip moving direction (Y direction in the figure).

Each of the recesses 312A of the tip 31 is
A solder supply surface 321 for supplying solder onto the lead 210 that has passed through each of the recesses 312A and 312B is provided on the outer surface adjacent to 312B and located on the upstream side in the moving direction of the iron tip.
have. Each recess 312 of the solder supply surface 321
In the portions corresponding to A and 312B, the tips of the needle members 35A and 35B of the solder supply head are arranged so as to be close to and opposed to each other. Needle members 35A, 35
The thread-like solder 40 ′ discharged from the tip of B comes into contact with the solder supply surface 321 of the iron tip 31 and melts, and flows down by gravity along the solder supply surface 321. Further, the iron tip 31 of the present embodiment has legs 313A and 313B formed at both ends in a direction orthogonal to the extending direction of the recess. The thickness of the legs 313A and 313B is set to be smaller than the interval between the rows of the leads 210. The outer surfaces of the legs 313A and 313B have solder supply surfaces 321C and 321D. The distal ends of the needle members 35C and 35D of the solder supply head are arranged at positions facing the solder supply surfaces 321C and 321D so as to be close to and opposed to each other. Needle member 35
The thread-like solder 40 'discharged from the tips of C and 35D respectively contacts and melts the respective solder supply surfaces 321C and 321D, and flows down by gravity along the solder supply surfaces 321C and 321D. As described above, each solder supply surface 3 of the iron tip 31
The molten solder 40 ′ flowing down the first and second 321 S is supplied so as to cover the leads 201 in each row.

As described above, even in the embodiment using the iron tip 31 shown in FIGS. 5 and 6, the iron tip 31 is moved once along the row of the soldering portion where the lead 201 protrudes, so that four rows Can be collectively soldered, so that soldering can be efficiently performed on four rows of soldering locations. In particular, each of the recesses 312A and 312B of the
Is set so as to enclose one row, so that it is possible to further suppress the occurrence of soldering failure due to excessive solder attachment or unnecessary solder attachment. Also, when the iron tip 31 shown in FIGS. 5 and 6 is used, the solder supply to the solder supply surfaces 321, 321 C, and 321 D of the iron tip 31 is switched so that the solder is not wastefully consumed. It is possible to collectively solder not only the soldering positions in rows but also soldering positions in two or three rows.

In each of the above embodiments, the case where the iron tip 31 is provided with two rows of recesses or two rows of recesses, respectively, is described. May be used. In this case, soldering locations in five or more rows can be collectively soldered. For example, when three recesses for two rows are provided, soldering locations in six rows can be collectively soldered. When three recesses for one row are provided, soldering locations for five rows can be collectively soldered.

[0037]

According to the first to sixth aspects of the present invention, the iron tip is moved once along the row of the soldering locations where the protruding members protrude, so that four or more rows of the protruding members protrude. Since the locations can be collectively soldered, soldering can be efficiently performed on four or more rows of solder locations. In addition, there is an effect that occurrence of defective soldering due to excessive solder adhesion or unnecessary solder adhesion can be suppressed.

In particular, according to the third aspect of the present invention, since the solder can be supplied to each of the solder supply surfaces on the outer side adjacent to the concave portion of the iron tip, there is an effect that the solder supply becomes easy. .

In particular, according to the fifth aspect of the present invention, it is possible to supply the solder in accordance with the presence or absence of the soldering portion corresponding to each concave portion. It can be soldered freely. In addition, since unnecessary solder supply can be stopped to the concave portion or the outer peripheral surface of the leg portion where there is no corresponding soldering portion, useless solder consumption can be prevented.

In particular, according to the sixth aspect of the present invention, the soldering iron member can be automatically moved to the soldering location on the soldering object, and the soldering location corresponding to each of the concave portions can be automatically moved. Solder supply according to presence or absence,
Alternatively, there is an effect that the solder can be automatically supplied in accordance with the presence or absence of the soldering portion corresponding to the outer surface of each of the concave portions and the respective leg portions.

[Brief description of the drawings]

FIG. 1 is an enlarged perspective view of a tip end of a soldering member in a soldering device according to an embodiment of the present invention.

FIG. 2 is a front view showing a schematic configuration of the soldering device.

FIG. 3 is an enlarged front view of a tip portion of the ironing member.

FIG. 4 is a block diagram showing a main part of a control system of the soldering device.

FIG. 5 is an enlarged perspective view of a tip end of a soldering member in a soldering device according to another embodiment of the present invention.

FIG. 6 is an enlarged front view of the tip of the ironing member.

FIG. 7 is a partial cross-sectional view of an iron tip according to a conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Soldering unit 11 Unit main body 12 Elevating slide shaft 13 Relay member 14 Swing arm 20A, 20B Solder supply subunit 21A, 21B Solder supply tube 22A, 22B Delivery roller pair 23A, 23B Solder supply device 24A, 24B Solder reel 30 Solder Soldering head 31 Iron tip 310A, 310B Depression (solder holding part) 312A, 312B Depression (lead penetration part) 32 Iron member 320 Solder supply surface 321, 321C, 321D Solder supply surface 33A, 33B Fixed arm member 34A, 34B Solder supply head 35A, 35B, 35C, 35D Needle member 40 Threaded solder 40 'Molten solder 100 Machine body 101 Workbench 102, 103 Stand member 104 X-axis guide member 112 Memory card 2 0 substrate 201 lead 202 parts 300 controller 301 memory card drive

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[Procedure amendment]

[Submission date] October 30, 2001 (2001.10.
30)

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] Claims

[Correction method] Change

[Correction contents]

[Claims]

[Procedure amendment 2]

[Document name to be amended] Statement

[Correction target item name] 0002

[Correction method] Change

[Correction contents]

[0002]

2. Description of the Related Art Conventionally, as this type of soldering device,
While supplying solder filamentous the tip of the soldering iron members, automatic soldering device for moving the soldering iron member along the soldered portion (soldering robot) are known. In this soldering apparatus, when the iron tip of the soldering iron member is heated and the solder is supplied to the iron tip by the solder supply means, the solder in contact with the iron tip melts. The melted solder reaches a soldering location adjacent to the iron tip and is soldered. When soldering is performed on a plurality of soldering points arranged in a straight line on a soldering object using this soldering device, the soldering iron member of the soldering iron member may be soldered with a plurality of soldering tips. By moving the portions along the direction in which the portions are arranged, the soldering portions can be continuously soldered.

[Procedure amendment 3]

[Document name to be amended] Statement

[Correction target item name] 0009

[Correction method] Deleted

[Procedure amendment 4]

[Document name to be amended] Statement

[Correction target item name] 0010

[Correction method] Deleted

[Procedure amendment 5]

[Document name to be amended] Statement

[Correction target item name] 0011

[Correction method] Change

[Correction contents]

[0011] According to a second aspect of the invention, the soldering iron member according to claim 1, on the outer surface adjacent to the recess at at least one end portion side in the extending direction of the recess portion of the tip, the solder supply Characterized by having a surface.

[Procedure amendment 6]

[Document name to be amended] Statement

[Correction target item name] 0012

[Correction method] Change

[Correction contents]

In the soldering iron member according to a second aspect of the present invention, the solder is supplied to each of the solder supply surfaces on the outer surface adjacent to each of the recesses of the iron tip, and the solder is melted at each of the solder supply surfaces to form the solder into each of the recesses. Supply.

[Procedure amendment 7]

[Document name to be amended] Statement

[Correction target item name] 0013

[Correction method] Change

[Correction contents]

According to a third aspect of the present invention, there is provided a soldering iron comprising: a soldering iron member; heating means for heating the iron tip of the soldering iron member; and solder supply means for supplying solder to the iron tip. An apparatus, wherein the soldering iron member according to claim 1 or 2 is used as the soldering iron member.

[Procedure amendment 8]

[Document name to be amended] Statement

[Correction target item name] 0014

[Correction method] Change

[Correction contents]

According to the third aspect of the present invention, the soldering iron member is heated by the heating means. The heated iron tip is arranged so as to surround the protruding member of the soldering target object with each concave portion. Then, the soldering tip is moved along the extending direction of the recess while the solder is supplied to each recess of the iron tip by the solder supply means or to each recess and the outer surface of each leg. As a result, the projecting member 4
Solder all the soldering points in rows and above.

[Procedure amendment 9]

[Document name to be amended] Statement

[Correction target item name] 0015

[Correction method] Change

[Correction contents]

According to a fourth aspect of the present invention, in the soldering apparatus of the third aspect , the solder supply means is provided with a plurality of the iron tips.
A plurality of recesses are provided corresponding to each of the number of recesses .

[Procedure amendment 10]

[Document name to be amended] Statement

[Correction target item name] 0016

[Correction method] Change

[Correction contents]

[0016] In the soldering device according to claim 4, selectively supplying a solder to each <br/> of the plurality of recesses of said soldering tip by the respective Ha <br/> Sunda supply means, each recess Solder can be supplied according to the presence or absence of a corresponding soldering location.

[Procedure amendment 11]

[Document name to be amended] Statement

[Correction target item name] 0017

[Correction method] Change

[Correction contents]

According to a fifth aspect of the present invention, in the soldering apparatus of the fourth aspect , a storage means for storing information on a soldering position on the soldering target, and the soldering target and the soldering iron. A relative position changing means for changing a relative positional relationship between the member and the soldering object and the soldering iron member based on information on the soldering location stored in the storage means; controls the said relative position changing means the relative positional relationship between to vary, solder supply to each recess portion of the tip
And a control means for controlling the plurality of solder supply means so as to switch the plurality of solder supply means. Here, the relative positional relationship between the soldering object and the soldering iron member is only a positional relationship representing a linear distance between the soldering object and the soldering iron member. However, it also includes a rotational positional relationship indicating a relative rotational angle between the two. Further, the relative position changing means for changing the relative positional relationship includes means for moving or rotating at least one of the soldering object and the soldering iron member.

[Procedure amendment 12]

[Document name to be amended] Statement

[Correction target item name] 0018

[Correction method] Change

[Correction contents]

In the soldering device according to the fifth aspect , information on a soldering position on a soldering target object is stored in the storage means in advance. Then, based on the information on the soldering location stored in the storage means, the position of the soldering location on the object to be soldered is determined by the control means, and each of the concave portions of the iron tip of the soldering iron member is The relative position varying means is controlled so as to surround the soldered portion. Further, it is determined based on the information, what recess of the tip of the soldering iron member before starting the soldering operation is compatible with the soldering point by the control means. Switching the solder supply to each recess portion of the tip by control means based on the determination result by controlling the plurality of solder <br/> da supply means. By switching in this way the solder supply, depending on the existence of soldering portion corresponding to each recess, automatically supplies Ha Sunda only in a recess soldering point corresponds.

[Procedure amendment 13]

[Document name to be amended] Statement

[Correction target item name] 0037

[Correction method] Change

[Correction contents]

[0037]

According to the first to fifth aspects of the present invention, the iron tip is moved once along the row of soldering locations where the protruding members protrude, so that four or more rows of the protruding members protrude. Since the locations can be collectively soldered, soldering can be efficiently performed on four or more rows of solder locations. In addition, there is an effect that occurrence of defective soldering due to excessive solder adhesion or unnecessary solder adhesion can be suppressed.

[Procedure amendment 14]

[Document name to be amended] Statement

[Correction target item name] 0038

[Correction method] Change

[Correction contents]

In particular, according to the second aspect of the present invention, since the solder can be supplied to each of the solder supply surfaces on the outer surface adjacent to each of the recesses of the iron tip, there is an effect that the solder supply becomes easy. .

[Procedure amendment 15]

[Document name to be amended] Statement

[Correction target item name] 0039

[Correction method] Change

[Correction contents]

In particular, according to the fourth aspect of the present invention, it is possible to supply the solder in accordance with the presence or absence of the soldering location corresponding to each concave portion. It can be soldered freely. Moreover, since the soldering location is no recess corresponding can stop unnecessary solder supply, there is an effect that it is possible to prevent wasteful solder consumption.

[Procedure amendment 16]

[Document name to be amended] Statement

[Correction target item name] 0040

[Correction method] Change

[Correction contents]

In particular, according to the fifth aspect of the present invention, the soldering iron member can be automatically moved to the soldering location on the soldering object, and the soldering location corresponding to each of the concave portions can be automatically moved. the solder supply according to the presence or absence
There is an effect that can be performed automatically.

Claims (6)

[Claims] 1. A soldering iron member for soldering a plurality of rows of projecting members projecting from a surface of an object to be soldered at predetermined intervals, the soldering iron member surrounding two rows of the projecting members, and A plurality of recesses extending along the row direction of the protruding members and having open ends at both ends in the extending direction are formed in a direction orthogonal to the extending direction of the iron tip. Iron members. 2. A soldering iron member for soldering a plurality of rows of projecting members projecting from a surface of an object to be soldered at a predetermined interval, the soldering iron member surrounding one row of the projecting members, and A plurality of recesses extending along the column direction of the protruding members and having both ends opened in the extending direction are formed in a direction orthogonal to the extending direction of the iron tip, and are orthogonal to the extending direction of the recesses. A soldering iron member characterized in that the thickness of the legs formed at both ends in the direction is smaller than the distance between the rows of the protruding members, and each leg has a solder supply surface on the outer surface. 3. The soldering iron member according to claim 1, wherein a solder supply surface is provided on an outer surface adjacent to each of the recesses on at least one end side in the extending direction of the recesses of the iron tip. A soldering iron member characterized by the above-mentioned. 4. A soldering apparatus comprising: a soldering iron member; heating means for heating the iron tip of the soldering iron member; and solder supply means for supplying solder to the iron tip. A soldering device using the soldering iron member according to claim 1, 2 or 3 as the soldering iron member. 5. A soldering apparatus according to claim 4, wherein said solder supply means is configured to selectively supply solder to each of the recesses of said iron tip. . 6. A soldering device according to claim 5, wherein a storage means for storing information relating to a soldering position on the soldering target, and a storage means for storing information between the soldering target and the soldering iron member. A relative position changing unit that changes a relative positional relationship, and a relative position between the soldering target and the soldering iron member based on the information of the soldering location stored in the storage unit. Controlling the relative position changing means so as to change the relative positional relationship, and supplying the solder to the concave portions of the iron tip or to the solder supply to the outer surfaces of the concave portions and the legs. And a control means for controlling the means.