JP2002063860A - Image-forming device and manufacturing method of the same, and manufacturing method of spacer for the image- forming device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a spacer with high resistance enabling restraint of the volume charged, even if the spacer is irradiated with an electron beam. SOLUTION: The image forming device comprises a rear plate with an electron emission element, a face plate arranged so as to face the rear plate with an image forming part, and a spacer interposed between the face plate and the rear plate. For the spacer, a spacer base material 31 is covered with organic resin and carbon, and the surface of the spacer has carbon, and the carbon as a carbon layer 52, covers the surface of the organic resin 51 covering the spacer base material.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a spacer disposed in a container containing an electron-emitting device,
The present invention relates to an image forming apparatus including an electron-emitting device, an image forming member, and a spacer, and further relates to a method for manufacturing the same.

[0002]

2. Description of the Related Art Conventionally, as an image forming apparatus using an electron-emitting device, an electron source substrate on which a large number of cold cathode electron-emitting devices are formed and an anode substrate provided with a transparent electrode and a phosphor are opposed in parallel to each other. 2. Description of the Related Art A flat-type electron beam display panel that has been exhausted is known.

In such an image forming apparatus, a device using a field emission type electron-emitting device is disclosed in, for example, I. Brodie,
“Advanced technology: flat cold-cathode CRTs”, Info
rmation Display, 1/89, 17 (1989). A device using a surface conduction electron-emitting device is disclosed in, for example, Japanese Patent Application Laid-Open No. 7-45221.

[0004] A flat-type electron beam display panel can be made thinner, lighter, and larger in size than a cathode ray tube (CRT) display device which is widely used at present. Can provide a higher-luminance and higher-quality image than other flat-panel display panels such as a flat-panel display panel, a plasma display panel, and an electro-luminescent display panel using the same.

FIGS. 14 and 15 are schematic structural views of a conventional flat electron beam display panel as an example of an image forming apparatus using an electron-emitting device. Here, FIG.
3 is a sectional view taken along line AA ′ of FIG.

The structure of the conventional flat electron beam display panel shown in FIGS. 14 and 15 will be described in detail.
1 is a rear plate on which the electron source substrate 144 is disposed,
Reference numeral 2 denotes a face plate, which is an anode (anode) substrate facing in parallel with the rear plate 141. Reference numeral 143 denotes an outer frame of a support frame that surrounds an outer periphery of a side surface. Make up the vessel. 145 is an electron-emitting device. Reference numerals 146a (scanning electrodes) and 146b (signal electrodes) are electrode wirings in the X and Y directions, and are connected to the electron-emitting devices 145, respectively. Reference numeral 148 denotes a glass substrate serving as a base of the face plate 142, 149 denotes a phosphor, and 150 denotes a metal back. 151 is a spacer which is an X-direction electrode wiring 146a.
, The rear plate 141 and the face plate 142 are maintained at a predetermined interval, and are disposed as a support member for atmospheric pressure.

In order to form an image on this electron beam display panel, the scanning wiring electrodes 1 arranged in a matrix are used.
By sequentially applying a predetermined voltage to the signal wiring electrode 46a and the signal wiring electrode 146b, a predetermined electron-emitting device 145 located at the intersection of the matrix is selectively driven, and the emitted electrons are radiated to the phosphor 149 to emit a predetermined electron beam. Get a bright spot in the position. In addition,
The metal back (anode) 150 is used to accelerate the emitted electrons to obtain a brighter bright spot.
5 is applied with a high voltage so as to have a positive potential to attract electrons.

In the image forming apparatus having the above-mentioned structure, in particular, an inexpensive phosphor having a high luminous efficiency, which is used in a current CRT display, is used, an acceleration voltage of several kV to several tens kV is applied, and high brightness and high brightness are obtained. Although the color expression has been improved,
In consideration of vacuum breakdown (ie, discharge), the distance d between the rear plate 141 and the face plate 142 is 1 m.
m or more.

On the other hand, when a field emission device is used as the electron emission device, a focusing electrode is provided or a rear plate is not provided without a focusing electrode in order to cope with the problem of electron beam convergence. Distance d between 141 and face plate 142
In this case, the applied voltage depends on the performance of the phosphor, the presence or absence of a metal back, the distance between the face plate and the rear plate, and the like, but is about several hundred V to several kV. Voltage. Therefore, the rear plate 14
1 and the face plate 142 (to be precise, wiring 1
The distance d between the metal back 46a and the metal back 149) is generally set to about 100 μm to several mm in order to prevent vacuum breakdown (ie, discharge) due to the applied voltage.

Further, as the display area of the display panel increases, the rear plate substrate 141 and the face plate substrate 148 need to be thickened in order to suppress the deformation of the substrate due to the difference between the vacuum inside the envelope and the atmospheric pressure outside. Came out. Increasing the thickness of the substrate not only increases the weight of the display panel, but also causes distortion when viewed from an oblique direction, thereby deteriorating the viewing angle. Therefore, by arranging the spacer 151, the load on the strength of the substrates 141 and 148 can be reduced, and the weight, cost and size of the screen can be reduced. Therefore, the advantages of the flat type electron beam display panel can be sufficiently exhibited. You will be able to do it.

The material used for the spacer 151 has a high aspect ratio (ratio between the height of the spacer and the cross-sectional area) so that the spacer 151 has a sufficient atmospheric pressure resistance (compression strength) and can be arranged in an image forming apparatus. It is required to be removable, that is, resistant to breakage, distortion, and buckling due to compression, and has heat resistance enough to withstand the heating process in the manufacturing process and the high vacuum forming process. It is required that the coefficient of thermal expansion match with that of a high resistance or insulator that has a withstand voltage that can withstand high voltage application. Is required to be small, to be able to be processed with high dimensional accuracy, and to be excellent in mass productivity, and a glass material is generally used.

A general glass material is a material having relatively good mechanical strength, thermophysical properties, and emission gas characteristics.
Further, since it has good workability and mass productivity, it is generally used as a spacer material.

On the other hand, some of the electrons emitted from the electron-emitting device may enter the surface of the spacer. As a result, the spacer surface is charged, and the surface discharge withstand voltage is significantly reduced, or the surface potential fluctuates and the electric field in the vicinity is distorted, affecting the trajectory of the electrons emitted from the electron source and causing image displacement such as color shift. A phenomenon in which the quality is deteriorated may occur.

As a method of avoiding deterioration of image quality such as color shift caused by such charging, for example, a spacer formed of a high-resistance conductor through which a minute current flows, disclosed in Japanese Patent Publication No. 7-99679. There is a way to do that. The device disclosed here is provided with an electrode group between the face plate and the electron source, and these electrodes are focusing electrodes or deflection electrodes for the purpose of focusing or deflecting an electron beam, respectively. The potential is applied according to the purpose of the above.

An example of such an image forming apparatus having no electrode group is disclosed in Japanese Patent Application Laid-Open No. 5-26 by the present applicant.
No. 6807 discloses this. In this application, a conductive spacer member is connected to an electrode or wiring on an electron source substrate on which a plurality of electron-emitting devices are arranged, and an anode electrode to prevent charging.

On the other hand, in addition to inorganic materials such as glass, spacers made of resins such as polyimide are known. For example, "Advanced technology: flat cold-cathode
CRTs ”(pages 17-19 of Information Display 1/89) and US
In P5,063,327, Ivor Brodie discloses a spacer using polyimide. In this method, a photosensitive polyimide is applied to a substrate by a spin method, pre-baked, and then vacuum baked through a photolithography (mask exposure, development, washing) process, and finally applied to the cathode substrate surface. A polyimide spacer having a height of 100 μm is made. Further, USP 5,371,433 and the like can be cited as examples using photosensitive polyimide. In US Pat. No. 5,371,433, a 500 μm-high polyimide formed through photolithography (mask exposure, development, and cleaning) steps is also stacked in two steps to realize a spacer height of about 1 mm.

Japanese Patent Application Laid-Open No. 6-162968 discloses a flat panel type image forming apparatus in which secondary electrons generated in a large number of ducts are extracted by an address system and collide with a fluorescent screen. An example is disclosed in which a low secondary electron-emitting material such as polyimide is coated to prevent electron emission from the inner wall of a spacer plate disposed therebetween.

[0018]

SUMMARY OF THE INVENTION The present invention has been made in consideration of the above-mentioned prior art, and has as its object to provide an apparatus, such as an image forming apparatus, provided with a container containing an electron-emitting device. Accordingly, an object of the present invention is to provide a spacer having a high aspect ratio to which a high voltage can be applied, as a spacer disposed in the container.

Another object of the present invention is to provide the above spacer having a high creepage withstand voltage.

Another object of the present invention is to provide the above-mentioned spacer in which the charging phenomenon is suppressed.

Another object of the present invention is to provide an image forming apparatus capable of forming a high-quality image with high luminance and color purity.

Another object of the present invention is to provide a stable image forming apparatus in which discharge is unlikely to occur.

Another object of the present invention is to provide an image forming apparatus in which the spacer is arranged.

[0024]

According to the present invention, there is provided a rear plate on which an electron-emitting device is arranged, a face plate having an image forming member and opposed to the rear plate, A spacer disposed between the rear plate, and an image forming apparatus having the spacer, the spacer is coated with a spacer substrate with an organic resin and carbon,
Further, the image forming apparatus is characterized in that the spacer has the carbon on its surface, and the carbon is coated as a carbon layer on the surface of the organic resin covering the spacer base material.

In a preferred embodiment of the present invention, the spacer described in detail below is used as a spacer for an image forming apparatus using an electron-emitting device. Similar effects can be obtained by applying the present invention to an apparatus in which an electron-emitting device is included in a container, similarly to the image forming apparatus.

First, the inventors of the present invention have conducted intensive studies on the above-mentioned conventional technology, and as a result, the following findings have been obtained especially in a conventional image forming apparatus in which spacer materials and spacers are arranged. (1) In an image forming apparatus having a spacer formed of glass, the surface breakdown voltage is insufficient, and in order to apply a high voltage to the phosphor, the height of the spacer must be increased.

As described above, the spacer formed of glass has sufficient atmospheric pressure resistance (compression strength), and (i) has a high aspect ratio (spacer height and height) so that it can be arranged in an image forming apparatus. Cross-sectional area ratio), that is, resistant to breakage, distortion, and buckling due to compression; (ii) having heat resistance enough to withstand the heating process in the manufacturing process and the high vacuum forming process, and The thermal expansion coefficients of the substrate and the supporting frame are matched; (iii) the gas release rate is low to maintain a high vacuum; (iv) processing can be performed with high dimensional accuracy and mass productivity is excellent. That the glass material has a creepage withstand voltage of at most about 3 kV / mm.
A too large electric field cannot be applied.

Therefore, for example, when a phosphor for CRT is used at an acceleration voltage of 10 kV, a spacer height of 4 mm or more is required when a general glass material is used in consideration of a margin with respect to the surface breakdown voltage. It is. As described above, when the field emission device is used as the electron emission device, when the distance d between the rear plate 141 and the face plate 142 is increased, the convergence of the electron beam is deteriorated, and a high-definition image is formed. It is difficult to form. (2) In an image forming apparatus using a spacer formed of an organic resin, the mechanical strength is insufficient, and it is difficult to apply a sufficiently high pressure to the phosphor.

That is, when a resin such as polyimide is used, the aspect ratio of the spacer (the ratio between the height of the spacer and the cross-sectional area) is at most about 5 to 10 times.
If the cross-sectional area is about 100 μmφ, the height of the spacer is about 1 mm at the maximum, and the phosphor has a maximum height of 5 mm.
kV applied voltage.

According to the technique disclosed in US Pat. No. 5,063,327 for forming spacers using polyimide by photolithography, a large number of spacers can be formed on the rear plate or face plate at a time. The problem of complicated processes is reduced. However, the height of the spacer that can be formed is at most about several tens to hundreds of microns, and the voltage that can be applied to the face plate is limited. It is conceivable to repeat the process many times in order to obtain a higher spacer height, but this again complicates the process. Therefore, it is difficult to use a high-acceleration phosphor having high performance used in the current CRT and to apply several kV to several tens of kV as an acceleration voltage, and low acceleration having poor performance such as luminance and color purity. A phosphor must be used, and the image forming apparatus is not high in luminance and color purity.

In US Pat. No. 5,371,433, a polyimide having a height of 500 μm formed through a photolithography (mask exposure, development, cleaning) process is also used.
Although a spacer height of about 1 mm is realized by stacking on the step, in addition to the difficulty of alignment by superposition, a decrease in buckling strength due to the increase in the spacer height is unavoidable, and each pixel It was necessary to arrange a spacer in the space. (3) In an image forming apparatus using a spacer formed of an organic resin, the forming temperature of the image forming apparatus is high, and an area for disposing the spacer is required.

The number of spacers required to support the atmospheric pressure resistance is determined by the compressive strength of the material used. In particular, in an image forming apparatus using an electron-emitting device, in order to reduce the pressure inside the vacuum envelope as much as possible, the temperature is usually 200 ° C.
It is necessary to perform heating and exhausting at 300 ° C. for several hours or more. Needless to say, the atmospheric pressure is applied to the spacer during heating and exhausting, so that the spacer must have sufficient atmospheric pressure resistance, that is, compressive strength even in a temperature range of 200 ° C. to 300 ° C.

The relative atmospheric 0.01 kgf / mm ^2, compression strength at 300 ° C. of common glass material (breakdown limit), since is about 10kgf / mm ^2, 0.1% of the area to be at least the support Requires a spacer area. On the other hand, the compressive strength (strain limit) at 300 ° C. of a normal polyimide resin is about 2 to 5 kgf / mm ² , and requires a spacer area twice to five times that of a glass spacer. Further, in the display area of the image forming apparatus, spacers must be formed in small gaps between pixels, so that the width of each spacer must be reduced. Therefore, the aspect ratio of the spacer, that is, the spacer height / spacer width increases, so that buckling (bending) is likely to occur.
Buckling was sometimes caused by compressive stress below the strain limit. Therefore, it was necessary to arrange more spacers.

As the number of necessary spacers increases, the manufacturing process becomes more complicated, leading to a reduction in yield.

Further, since the spacer forming step using photolithography is performed on the rear plate or face plate, a polyimide residue remains on the rear plate or face plate, or during the process, the electron emitting element There was also concern that it would cause damage. (4) The spacer using the organic resin has a spacer surface
A spacer made of an insulator, which has no function to prevent charging.Especially, in an image forming apparatus that applies a high voltage to a phosphor, the surface of the spacer is charged, affecting the electron beam, causing a problem such as discharge. is there.

Resins such as polyimide have excellent withstand voltage and high surface withstand voltage, but have the following problems.
That is, the electrons emitted from the cold cathode electron-emitting device are:
Referring to FIG. 15, since a part of electrons is directly irradiated on the surface of a spacer placed in close proximity to the face plate 142 or the acceleration voltage is high, the metal back ( (Not shown)
Some of the irradiated electrons are reflected and may enter the spacer surface. If a spacer formed of an organic resin is used, as a result, secondary electrons are emitted from the surface of the spacer, and that portion is charged. The charging of the spacer surface due to electron collision from the outside significantly reduces the creeping discharge withstand voltage, or the surface potential fluctuates and the electric field in the vicinity thereof is distorted, affecting the trajectory of the electrons emitted from the electron source.

When the trajectory of the emitted electrons is bent, the longer the flight distance of the electrons emitted from the electron source, that is, the greater the distance d between the rear plate 141 and the face plate 142, the more the position of the electrons reached on the face plate 142. The gap increases. Therefore, when a spacer having a high height is used, a desired position on the face plate 142 is not reached, and a phenomenon occurs in which image quality such as color misregistration when three color phosphors are used is deteriorated. (5) There is a problem that a charging phenomenon occurs even in a spacer provided with conductivity. In addition, when imparting conductivity, a vacuum film forming method is mainly used, and it is not inexpensive. In addition, when a metal or a metal oxide is used as the conductive material, there is a problem in controlling the conductivity.

When electrons are incident on the spacer as described above, the charging phenomenon occurs because the secondary electron emission coefficient of the conductive material is also important.
The secondary electron emission coefficient may be larger than 1 and a material close to 1 is required. In addition, metals and metal oxides have high conductivity, and it is difficult to control high-resistance surface resistance.

The present invention has been made based on the above findings. Hereinafter, preferred embodiments of the present invention will be exemplified.
The present invention will be described in detail.

That is, (AA) an image forming apparatus according to the present invention includes a rear plate on which electron-emitting devices are disposed, a face plate having an image forming member, and disposed opposite to the rear plate; In an image forming apparatus having a spacer disposed between a plate and a rear plate, the spacer is configured by coating a spacer base material with an organic resin and carbon, and the surface of the spacer includes the carbon An image forming apparatus comprising:

(A) The first configuration example of the image forming apparatus of the present invention is an image forming apparatus in which the organic resin layer in which carbon is dispersed as carbon powder has a spacer covering a spacer base material.

The carbon powder is disposed on the surface of the organic resin covering the spacer substrate, or a part of the carbon powder is exposed on the surface of the organic resin covering the spacer substrate. In the form of carbon black, graphite, or a mixture thereof, wherein the carbon powder is a few wt% or more and a few tens wt with respect to the organic resin.
% Is preferably contained. The spacer has a sheet resistance of 10 ⁹ Ω / □ or more and 10 ¹² Ω / □ or less.

(B) The second configuration example of the image forming apparatus of the present invention is an image forming apparatus having a spacer in which the carbon serves as a carbon layer and covers the surface of an organic resin covering the spacer base material.

The carbon layer may be a pyrolytic polymer layer of the organic resin, or a layer having carbon fine particles made of graphite, amorphous carbon, or a mixture thereof, which are arranged in dot-shaped recesses formed on the surface of the organic resin. is there.

Further, as another structural example, a structure in which the carbon layer covers a part of the surface of the organic resin covering the spacer base material, or the carbon and the organic resin cover the spacer base material in a strip shape, respectively. It is a structure in which a plurality of the carbon layers are formed in a strip shape. The band-shaped carbon layer and the organic resin have a structure in which irregularities are formed, the pitch between the convex portions of the organic resin is P, and the width of the band of the carbon layer in a direction substantially perpendicular to the plate plane is 1. When satisfying the relational expression of 1 ≧ P / 2, the depth t of the concave portion of the organic resin covering the spacer base material is t ≧ 0.2.
More preferably, the relational expression 1 is satisfied and the thickness of the carbon layer formed in the concave portion is 100 nm or more.

The carbon layer may contain a catalytic metal such as an iron group of Ni, Fe and Co.

Further, it is more preferable that carbon fine particles made of graphite, amorphous carbon, or a mixture thereof are provided on the surface of the convex portion of the organic resin covering the spacer base material. Further, the sheet resistance of the spacer surface is 10 ⁹ Ω / □ or more and 10 ¹² Ω / □ or less.

(C) First of the image forming apparatus of the present invention,
In the second configuration example, the organic resin is preferably either a polyimide resin or a polybenzimidazole resin, and the polyimide resin is more preferably a wholly aromatic polyimide. (D) The spacer base material includes at least one fibrous filler of glass, alumina, boron, carbon, or ceramic whiskers dispersed in a glass member or an organic resin such as a polyimide resin or a polybenzimidazole resin. Wherein the filler is 1 to the organic resin.
Those containing not less than 50% by weight and not more than 50% by weight are preferably used.

(E) In the image forming apparatus of the present invention,
A contact layer is disposed at a contact portion of the spacer on the face plate and / or the rear plate side, the contact layer is the carbon, and the contact layer is electrically connected to the carbon layer formed on the side surface of the spacer. It is more preferable that the connection is made.

It is preferable that the spacer is joined to the anode formed on the face plate and / or the drive wiring formed on the rear plate, and the joining is made of a resin mixed with carbon powder. It is preferred to be carried out by

(F) In the image forming apparatus of the present invention,
The electron-emitting device is a cold cathode such as a field emission device or a surface conduction electron-emitting device.

(BB) A third configuration example of the image forming apparatus according to the present invention is directed to a face plate having an image forming member and a rear plate on which an electron-emitting device is arranged, and arranged to face the rear plate. And an image forming apparatus having a spacer disposed between the face plate and the rear plate, wherein the spacer is formed by coating a spacer base material with an organic resin, and wherein the spacer base material is an organic material. An image forming apparatus characterized in that at least one fibrous filler of glass, alumina, boron, carbon, and ceramic whiskers is dispersed in a resin.

The filler is used in an amount of 1 to the organic resin.
The organic resin is preferably used as a polyimide resin or a polybenzimidazole resin, and more preferably, the polyimide resin is a wholly aromatic polyimide.

As another configuration example, the spacer is formed by coating a spacer base material with an organic resin, and
The image forming apparatus is characterized in that the organic resin is a polybenzimidazole resin.

(CC) A method of manufacturing a spacer of an image forming apparatus according to the present invention is a method of manufacturing a spacer of an image forming apparatus, comprising a step of applying an organic resin to the spacer base material.

The step of applying the organic resin is preferably a step of immersing the spacer substrate in a solution containing the organic resin and then applying the resin by pulling up.

The step of applying the organic resin is a step of applying an organic resin having carbon powder. Further, there is provided a method of manufacturing a spacer for an image forming apparatus, comprising a step of applying an organic resin to the spacer base material and a step of carbonizing the organic resin.

The step of carbonizing the organic resin is a step of irradiating the organic resin with an electron beam, a step of heating the organic resin applied to the spacer substrate, or a step of heating by light irradiation. In particular, the step is performed by irradiating the organic resin with an electron beam or light in a band shape so as to be substantially parallel to the plate.

Preferably, before the step of carbonizing the organic resin, a step of partially forming a catalytic metal layer on the spacer substrate or on the organic resin applied to the spacer substrate. More preferably, in the step of forming a catalytic metal layer, the catalytic metal is formed in a strip shape so as to be substantially parallel to the plate.

The step of forming the catalytic metal layer is performed by applying the organometallic compound solution of the catalytic metal on the spacer substrate or the organic resin applied to the spacer substrate. It is applied by an inkjet method.

The present invention also provides a method of manufacturing a spacer for an image forming apparatus, comprising a step of irradiating an electron beam or light to an organic resin at a contact portion of the spacer on the face plate and / or rear plate side.

(DD) The method of manufacturing an image forming apparatus according to the present invention includes the step of connecting the spacer formed by the method of manufacturing a spacer of the image forming apparatus according to the present invention to the anode formed on the face plate and / or the rear plate. This is a method for manufacturing an image forming apparatus including a step of joining the formed drive wiring.

[Operation and Effect] Each of the above-described embodiments of the present invention has the following operation and effect.

(A) A rear plate on which the electron-emitting devices are arranged, an image forming member, a face plate arranged opposite to the rear plate, and a face plate disposed between the face plate and the rear plate In the image forming apparatus of the present invention, the spacer is formed by coating a spacer base material with an organic resin and carbon, and the spacer has the carbon on its surface. For example, the spacer has the excellent surface withstand voltage characteristic of the resin and the characteristic that the secondary electron emission coefficient of carbon is close to 1, and further has the high mechanical strength of the spacer base material. Without increasing the number
Since the distance between the rear plate and the face plate of 1 mm or more can be realized, a high-performance and inexpensive phosphor for CRT can be used at a high acceleration voltage, and as a result, an image forming apparatus with high luminance and excellent color purity can be provided. it can.

According to the first configuration example of the image forming apparatus of the present invention, wherein the organic resin layer in which the carbon is dispersed as carbon powder has a spacer covering a spacer base material, carbon black, graphite, According to the content of the carbon powder composed of the mixture with respect to the organic resin, the electric characteristics of the high-resistance spacer optimal for the image forming apparatus are achieved, so that even if the electron beam enters the spacer, the charge of It is possible to suppress the power consumption, suppress the power consumption, and apply a high acceleration voltage to the phosphor. As a result, it is possible to provide an image forming apparatus with high luminance and excellent color purity.

(B) According to the second constitutional example of the image forming apparatus of the present invention, wherein the carbon has a carbon layer as a carbon layer and has a spacer covering the surface of the organic resin covering the spacer substrate.
The carbon layer is a pyrolytic polymer layer of the organic resin,
Since it is a layer having carbon fine particles made of graphite, amorphous carbon, or a mixture thereof, which are arranged in dot-shaped recesses formed on the organic resin surface, the electrical characteristics of a high-resistance spacer optimal for an image forming apparatus are Is achieved, and even if an electron beam enters the spacer, charging can be suppressed.
Power consumption is also suppressed, and a high accelerating voltage can be applied to the phosphor. As a result, an image forming apparatus with high luminance and excellent color purity can be provided.

Further, the structure in which the carbon layer covers a part of the surface of the organic resin covering the spacer base material or the structure in which the carbon and the organic resin cover the spacer base material in a strip shape, respectively, According to another structural example in which the carbon layer and the organic resin have irregularities, the irregularities are formed by the carbon layer and the organic resin. Due to the recapture of secondary electrons, charging is suppressed, and the creepage withstand voltage is further increased. Since the prevention of electrification and the improvement of the surface discharge withstand voltage are performed, it is preferable to form a point-like concave portion on the convex surface of the organic resin or a high-resistance layer of a pyrolytic polymer. Further, since the carbon layer constituting the concave portion has high conductivity, the carbon layer is kept at the same potential and suppresses variation in the surface potential of the spacer. As a result, it is possible to provide an image forming apparatus having high luminance and excellent color purity.

(C) According to the first and second structural examples of the image forming apparatus of the present invention, wherein the organic resin is a polyimide resin or a polybenzimidazole resin, the height inside the container constituting the image forming apparatus is high. A vacuum atmosphere can be realized, and the above-described high creeping pressure resistance can be provided. (D) the spacer base material according to the present invention, wherein at least one or more fibrous fillers of glass, alumina, boron, carbon, and ceramic whiskers are dispersed in an organic resin such as a polyimide resin or a polybenzimidazole resin; According to the first and second configuration examples of the image forming apparatus, it is possible to provide an image forming apparatus having a high aspect ratio spacer having excellent mechanical strength in various forms, so that the number of spaces can be reduced and the cost can be reduced. An image forming apparatus having high brightness and excellent color purity can be provided.

(E) A contact layer made of a carbon material is disposed on a contact portion of the spacer on the face plate and / or the rear plate side. Further, in a preferred embodiment, the contact layer is formed on a side surface of the spacer. According to the image forming apparatus of the present invention electrically connected to the carbon layer, in order to form a low-resistance ohmic contact with the high-resistance film of the spacer and the electrodes or wiring of the rear plate and face plate, etc. Since the potential drop in the contact layer is small and does not affect the electron beam emitted from the electron-emitting device, a high-quality image in which the displacement of the electron beam on the phosphor surface is suppressed is provided. According to the bonding member made of a resin mixed with carbon powder, the bonding and connection between the spacer, the rear plate, and the face plate are performed using carbon of the same material as the contact layer of the spacer. Contact is realized.

(F) In the image forming apparatus of the present invention, wherein the electron-emitting device is a cold cathode such as a field emission device or a surface conduction electron-emitting device, the high-speed response of the cold-cathode electron emission device and a wide operating temperature range Accordingly, a high-quality and highly reliable image forming apparatus can be provided.

(G) A rear plate having an electron-emitting device, an image forming member, a face plate disposed to face the rear plate, and a face plate disposed between the face plate and the rear plate. In an image forming apparatus having a spacer, the spacer is configured by coating a spacer base material with an organic resin, and the spacer base material is made of an organic resin such as a polyimide resin or a polybenzimidazole resin. According to the third configuration example of the image forming apparatus of the present invention having a spacer in which at least one or more fibrous fillers of alumina, boron, carbon, and ceramic whiskers are dispersed, in various forms,
Since an image forming apparatus having a high aspect ratio spacer having excellent mechanical strength can be provided, an inexpensive, high vacuum atmosphere in a container constituting the image forming apparatus can be realized, and a high definition image forming apparatus can be provided.

(H) According to another configuration example, the spacer is formed by coating a spacer base material with an organic resin, and the organic resin is a polybenzimidazole resin. A high vacuum atmosphere in the container can be realized.

(I) According to the method of manufacturing a spacer of an image forming apparatus of the present invention, since the method of manufacturing a spacer of the image forming apparatus includes a step of applying an organic resin to the spacer base material, The thickness of the organic resin layer can be adjusted,
Furthermore, since the step of applying the organic resin is a step of immersing the spacer base in a solution containing the organic resin and then applying the resin by pulling up, the film thickness can be adjusted, and furthermore, the step is performed plural times. Thus, a large film thickness optimal for adjusting the creepage distance can be formed. Further, since the organic resin can be easily applied to the contact portion of the spacer base material on the face plate and / or rear plate side, it is advantageous for forming a contact layer described later.

Since the step of applying the organic resin is a step of applying an organic resin having carbon powder, the optimum high resistance for an image forming apparatus is determined depending on the content of conductive carbon powder in the insulating organic resin. Can be formed.

Further, since the method for manufacturing a spacer for an image forming apparatus comprises a step of applying an organic resin to the spacer base material and a step of carbonizing the organic resin, a vacuum film forming method is newly performed. For example, since a high-resistance film is not formed, a high-resistance spacer optimal for an image forming apparatus can be formed at low cost.

Since the step of carbonizing the organic resin is a step of irradiating the organic resin with an electron beam, the resistivity of the carbon layer can be freely controlled by the electron beam irradiation density and time. Since the step of heating the organic resin applied to the spacer base material or the step of heating by light irradiation, the resistivity of the carbon layer can be freely controlled by the heating time, temperature, light amount and the like. In particular, since the process is performed by irradiating the organic resin with an electron beam or light in a band shape so as to be substantially parallel to the plate, the conductivity of the organic resin layer can be selectively controlled.

Preferably, before the step of carbonizing the organic resin, a step of partially forming a catalytic metal layer on the spacer substrate or / and the organic resin applied to the spacer substrate. Therefore, the temperature of the carbonization step can be lowered, or the selective carbonization can be performed in the form in which the metal of the catalyst is arranged. More preferably, the step of forming the catalytic metal layer is such that the catalytic metal is formed in a strip shape so as to be substantially parallel to the plate, so that a spacer comprising a strip-shaped carbon layer and an organic layer can be formed. Since the creeping distance increases, the creeping discharge withstand voltage increases.

The step of forming the catalytic metal layer is performed by applying the organometallic compound solution of the catalytic metal on the spacer base material or the organic resin applied to the spacer base material. Therefore, it can be formed at low cost because it is performed by a coating method, not by a vacuum film forming method. Above all,
When applied by an inkjet method, the carbon layer can be formed in any form with good controllability.

The method for manufacturing a spacer of an image forming apparatus includes a step of irradiating an electron beam or light to an organic resin at a contact portion of the spacer on the face plate and / or rear plate side, so that a contact layer such as a metal layer is formed. Even if a new contact layer is not formed, a low-cost contact layer with low contact resistance can be formed.

In the method of manufacturing an image forming apparatus of the present invention, the spacer formed by the method of manufacturing a spacer of the image forming apparatus of the present invention is formed on the anode formed on the face plate and / or the rear plate. Since this is a method for manufacturing an image forming apparatus including a step of bonding to a drive wiring, a high-brightness, high-quality image forming apparatus can be provided at low cost.

[0081]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, preferred embodiments of the present invention will be described in detail with reference to the drawings.

FIGS. 1 and 2 are schematic views showing the structure of an image forming apparatus using the spacer of the present invention, and FIG. 2 is a sectional view taken along line AA 'in FIG. For simplicity, 2
Elements in rows and two columns were arranged in a matrix.

1 and 2, 1 is a rear plate as an electron source substrate, 2 is a face plate as an anode substrate, 3 is a support frame (a face plate and a rear plate constitute an airtight container), 4 is A substrate, which is a base of the rear plate 1, 5 is an electron-emitting device, 6a and 6b are electrodes for applying a voltage to the electron-emitting device 5, 7a (signal electrode) and 7b (scanning electrode) are electrodes 6a and 6b, respectively. Connected electrode wirings, 8 is a transparent substrate which is a base of the face plate 2, 9 is a transparent electrode, 10 is a phosphor, 11
Is a spacer.

The spacer 11 is made of a composite material of an organic resin and an inorganic material.

The structure of the spacer 11 according to the present invention will be described with reference to FIGS. 3, 4, 5 and 6.

FIG. 3 is a horizontal sectional view of the spacer 11 having the first structure suitable for the present invention. Here, 31 is a spacer base material, and 32 is a surface coat layer. In the present invention, the surface coat layer 32 is an abbreviation of a layer in which the spacer is formed by coating a spacer base material with an organic resin and carbon, and has the carbon on the surface of the spacer. . The spacer base material 31 is mainly configured for the purpose of supporting atmospheric pressure resistance, and the surface coat layer 32 is mainly configured for the purpose of improving the creepage withstand voltage in order to improve the low creepage withstand voltage value of the spacer base material 31. I have. As will be described in detail later, if a resin having conductivity is used as the surface coat layer 32, the surface potential can be further stabilized.

As an example of a suitable material for the spacer substrate 31, the glass material described in the prior art can be used.

Needless to say, the size and shape of the spacer substrate 31 are almost the same as the size and shape of the spacer 11.

The height of the spacer substrate 31 is the same as that of the aforementioned CR.
When using a high acceleration phosphor for T, applied voltage Va = several k
For V to several tens kV, it is set to several hundred μm to several mm. More preferably, it is about 1 mm to 4 mm.

When the above-mentioned low-acceleration phosphor is used, for example, it can be used at about 100 μm for Va = 500 V.

The size and shape of the bottom surface of the spacer base material 31 depend on the location where it can be installed in the display part, that is, the size and shape of the inter-pixel area determined by the pixel arrangement and the element pitch, and also when the panel is evacuated. Is appropriately determined according to the design requirements such as the conductance.

That is, in addition to the flat spacer shapes shown in FIGS. 1, 2 and 3, a plurality of spacers having a structure in which cylinders, quadrangular pillars, and cylinders are stacked, and a cross-shaped spacer are arranged. Structures can be used.

As another example of a suitable material for the spacer substrate 31, a material in which an inorganic fibrous filler such as glass is dispersed in a resin can be used. As a resin to be a base material, a resin having excellent heat resistance is preferable.

In general, it is preferable that the resin material is excellent in workability and mass productivity and inexpensive. However, those having high mechanical strength in a temperature range from room temperature to about 300 ° C. or more are difficult to obtain.

Therefore, in the present invention, the mechanical properties of the composite are greatly improved by dispersing an inorganic fibrous filler in a polybenzimidazole resin or a polyimide resin which has high heat resistance and does not lower the operating atmosphere of the vacuum device. Use what has been done.

The general filling effects of the fibrous filler include an increase in tensile strength, an increase in elastic modulus, an increase in bending strength, an improvement in dimensional stability, an improvement in creep characteristics,
Although there are improvement of warpage, improvement of abrasion resistance, improvement of heat resistance (thermosetting, thermal deformation, coefficient of linear expansion, etc.), improvement of impact resistance, etc., in the use as a spacer base material in the present invention, the bending strength The objective is to increase the dimensional stability, improve the dimensional stability, and improve the heat resistance (thermosetting, thermal deformation, linear expansion coefficient, etc.).

The fillers include: general-purpose glass fiber, ultra-high strength: carbon fiber, alumina fiber, boron fiber, ceramic whisker (single-crystal needle-like chemical substance): silicon carbide, silicon nitride, etc. Fibrous filler): β-wollastonite (anhydrous calcium silicate), zonotolite and the like. In the use as a spacer base material in the present invention, in particular, improvement of the strength of the resin as the spacer base material and the resin Glass fibers, carbon fibers, and silicon carbide whiskers are particularly preferred because it is preferable to match the thermal expansion coefficient with the glass material constituting the face plate, rear plate, and support frame.

The fiber length of the filler is several μm to several tens μm.
m is preferred. Further, the filler content is limited to 50 wt%, at which the reinforcing efficiency is saturated, as an upper limit.
Used as t% to 40 wt%.

A spacer made from a dispersion of these needle-like fillers in a polyimide or polybenzimidazole resin has high heat resistance and high strength, and is required at 300 ° C. for about 10 hours to suppress gas release. Can maintain sufficient strength to withstand vacuum baking.

Further, since the spacer base material of this configuration is mainly composed of a resin, it can be molded by a molding method such as an injection molding method, a compression molding method, and a casting method. In addition to the shape of the spacer on the flat plate shown in FIG. 3, it is also possible to use a structure in which a column, a square column, a stack of cylinders are stacked, or a plurality of spacers in the shape of a grid are arranged. FIG.
A self-standing spacer as shown in (a) and (b) can be easily configured. Here, the self-supporting spacer means a form of a spacer that can be disposed by itself without fixing or the like in a two-dimensional form in a planar direction when the plate shape and the rod shape are considered to be one-dimensional. FIGS. 13A and 13B
As described above, a zigzag shape may be used so that the spacer does not affect the electron-emitting device and the electron beam on the substrate, and the design can be made according to the size and shape of the inter-pixel region in the display unit described above. Of course, the present invention is not limited to these structures.

Table 1 shows the polyimide resin that can be injection molded.
An example in which the heat distortion temperature and the coefficient of thermal expansion of a polybenzimidazole resin alone, a polyimide resin containing a filler, and a polybenzimidazole resin containing a filler suitable for the present invention are shown. In the table, the content of all fibrous fillers is 30w
t%.

[0102]

[Table 1] As a material of the surface coat layer 32, an organic resin is used because of its manufacturing advantages such as high creepage pressure resistance and easy coating. In particular, a polybenzimidazole resin or a polyimide resin is selected because it can withstand a heat process in the air and in a vacuum and emits little gas. As the polyimide resin, a wholly aromatic polyimide is preferably used because of its excellent heat resistance.

Since the surface coat layer itself does not require any particular mechanical strength, the heat resistance in the present invention is not defined by the heat deformation temperature, glass transition point, etc. It is defined by the decomposition temperature in vacuum. The above polybenzimidazole resin and wholly aromatic polyimide resin can be preferably used because both the combustion temperature and the decomposition temperature exceed 500 ° C.

Further, since the resin can be baked sufficiently in vacuum, for example, at 300 ° C. for about 10 hours, gas emission from the surface coat layer can be minimized. As a result, the pressure in the vacuum vessel can be kept low, and creeping discharge due to adsorption of gas molecules on the surface can be avoided.
The creepage withstand voltage value can be made approximately equal to the spark discharge voltage in vacuum.

Table 2 shows an example of the properties of these resins. If a material having a small gas permeability is selected as the material of the surface coat layer, a material having relatively high gas emission can be used as the spacer base material. However, polybenzimidazole has a very small gas permeability, so that the gas permeability is extremely small. Relatively high emitting spacer substrates, such as sintered ceramic substrates, may also be used.

The polybenzimidazole coat layer can be easily coated using a varnish. A varnish for forming a polyimide coat layer is inexpensive and easy to handle, so that it can be suitably used in the present invention.

The effect of the present invention can be obtained if the thickness of the resin to be coated as the surface coat layer is several nm or more. However, although it depends on the coating method, it is preferably 10 nm or more in consideration of the uniformity of the film thickness. When the film thickness is about 10 μm or more, cracking may occur due to a difference in thermal expansion coefficient between the coated resin film and the substrate, and peeling may occur due to film stress. Therefore, the thickness of the resin is preferably about 10 nm to 10 μm, and more preferably 0.1 μm to 10 μm in consideration of the control of the thickness.

[0108]

[Table 2] Next, a spacer having a second configuration suitable for the present invention will be described. Basically, it has the configuration of the spacer 11 shown in FIG.

The surface coat layer 32 used in the spacer of the second configuration has an appropriate conductivity so that the secondary electron emission coefficient of the spacer surface is close to 1 and, at the same time, the surface of the spacer is not charged. A resin containing a carbon filler is coated and used.

As described above, the carbon material is a conductor having a secondary electron emission efficiency close to 1, and thus can be suitably used in the present invention.

As the base material of the surface coat layer 32, the above-mentioned polybenzimidazole resin or polyimide resin is preferably used, and as the carbon filler to be contained, furnace black, channel black, acetylene black, thermal black, lamp black, natural black, Graphite powder (pulverized and classified to a particle size of about 100 nm) and the like can be used.

As described above, the potential on the spacer surface is non-uniform due to factors such as the incidence of electrons on the spacer surface.
If unstable, the electron-emitting device 5 near the spacer 11
The orbits of the electrons emitted from may be bent or fluctuated. Since the non-uniformity and instability of the potential on the spacer surface are caused by secondary electron emission due to electron collision and charging due to the secondary electron emission, the secondary electron emission coefficient of the spacer surface is set to 1
Can be avoided by providing the spacer surface with appropriate conductivity so as not to cause charging. To obtain this effect, the surface resistance (sheet resistance Rs = ρ
/ W: where ρ is the specific resistance of the surface coat layer provided with conductivity, and w is the film thickness) is preferably about 10 ¹² Ω / □ or less. However, if the resistance of the surface coat layer imparted with conductivity is too low, heat is generated, which causes damage to the surface coat layer due to thermal runaway current, increases power consumption, and the like.

Here, the lower limit of the resistance varies depending on the voltage applied to the face plate and the like, but when applying 10 kV, a resistance of Rs = 10 ⁹ Ω / □ or more is required.
Therefore, in order to obtain the effect of the present invention, the resistance Rs of the resin coat layer provided with conductivity should be 10 ⁹ Ω / □ or more and 10 ¹² Ω /
□ Set below and adjust the thickness of the surface coat layer and the specific resistance.

In the case where the resin contains a carbon filler, the specific resistance of the surface coat layer can be adjusted by changing the concentration of the carbon filler in the resin, and varies depending on the type of resin used, the carbon powder, the particle size, and the like. However, by changing the carbon content ratio in the resin from a few wt% to a few tens wt%, from 1 to 1
It can be varied in the range of about 0 ⁸ [Omega] cm. For example, by mixing furnace black having an average particle size of 29 nm into a wholly aromatic polyimide resin by 18 wt%, 3 × 10
The specific resistance is about ⁴ Ωcm. If this is formed with a thickness of 0.1 μm, a surface coat layer having a sheet resistance of about 3 × 10 ⁹ Ω / □ can be obtained.

FIG. 4 schematically shows the shape of the surface of the surface coat layer when the carbon filler is contained in the resin. In FIG. 4, 31 is a spacer substrate, 32 is a surface coat layer, 41 is a carbon filler dispersed and contained, and 42 is an organic resin. As shown in FIG. 4, a part of the carbon filler 41 is exposed on the surface of the surface coat layer 32, and serves to prevent secondary electron emission efficiency on the surface from approaching 1 and to prevent charging on the surface. I have.

Alternatively, a carbon layer can be formed by carbonizing at least a part of a surface coat layer made of an organic resin, particularly, a polybenzimidazole resin or a polyimide resin.

The third configuration of the present invention is a
When the carbon layer is formed by carbonizing at least a portion of the above, the following configuration is used.

FIG. 5 shows an example of a partial sectional view of a spacer structure suitable for the present invention, in which the surface coat layer 32 is composed of the resin layer 51 and the carbon layer 52. FIG. 5A is a cross-sectional view, and FIG. 5B is an enlarged view in a case where a dot-shaped recess described later is formed. 51 is a resin layer, 52 is a carbon layer, and 5
Reference numeral 3 denotes a contact layer for making electrical connection with a rear plate, a face plate wiring, and the like (not shown);
55 is graphite.

The resin layer 51 is preferably made of the above-mentioned polybenzimidazole or polyimide resin, but is not limited thereto.

In the spacer structure shown in FIGS. 5A and 5B, the resistance of the surface coat layer 32 is adjusted by adjusting the material and form of the carbon layer 52. The crystallinity and form of carbon constituting the carbon layer 52 will be described. Here, carbon refers to graphite (so-called HOP)
HOPG, which includes G, PG, and GC, has a crystal structure of almost perfect graphite, PG has a crystal grain of about 20 nm and has a slightly disordered crystal structure, and GC has a crystal grain of about 2 nm and further has a disordered crystal structure. Refers to something that has grown. )
And amorphous carbon (refers to amorphous carbon and a mixture of amorphous carbon and the above-mentioned graphite microcrystals), and the state of a conductive pyrolyzed polymer formed by thermally decomposing a resin. The form is, in particular,
When the resin is made of graphite having a high conductivity of 10 S / cm to 10 ^-4 S / cm, the resin or
Since the resin or the pyrolytic polymer is formed by carbonizing the main surface of the pyrolytic polymer, FIG.
As shown in (b), the carbonized portion 54 becomes the concave portion 55 as the volume is reduced, becomes a fine particle-dispersed form, and becomes the point concave portion having the carbon. On the other hand, FIG.
As shown in (a), a pyrolytic polymer having low conductivity and high resistance has a film-like configuration. Here, the sheet resistance is preferably in the range of 10 ⁹ Ω / □ to 10 ¹² Ω / □ as in the second configuration. Hereinafter, these forms are called high resistance layers.

The contact layer 53 is a layer that makes ohmic contact with the wiring and electrodes of the face plate and the rear plate. If the contact layer 53 is not an ohmic contact or has a large contact resistance, a potential drop occurs in the contact layer, and the electron It is necessary to greatly affect the electron beam emitted from the emission element. This contact layer is preferably formed of a carbon layer because it is not necessary to newly form a contact layer of metal or the like, and because it is the same material as the surface coat layer, it becomes an ohmic contact. However, a contact layer such as a metal may be newly formed.

FIG. 6 is a partially enlarged view of a spacer 11 having a fourth structure according to the present invention, in which the surface coat layer comprises a resin layer and a carbon layer. FIG. 6A is a cross-sectional view, and FIG. 6B is a plan view seen from a lateral direction. FIG. 6A shows a case where the surface coat layer 31 is formed in a strip shape to increase the creeping distance, and a high resistance layer is formed on the convex surface. In FIG. 6 (a), P is the repetition pitch of the band-shaped uneven surface, q is the width of the bottom of the band-shaped concave surface, t is the difference in thickness between the concave surface and the convex surface, and t0 is the thickness of the convex surface. The width q of the bottom of the band-shaped concave surface is defined as the length between the midpoints of the inclined portion of the concave surface.

In FIG. 6, the spacer 11 is formed of a resin layer 5
1 has a convex surface and a concave surface of the carbon layer 52 on the resin layer 51, and the creepage distance increases due to the uneven surface. Also, as shown in FIG. 6, the shape of the concave surface is such that when an electron beam from the electron-emitting device is incident, the generated secondary electrons are incident again on the carbon layer in the concave surface. Carbon, which is a material having an emission coefficient close to 1, is used. For this reason, the secondary electron emission coefficient substantially approaches 1. Regarding the pitch P of the band-shaped uneven surface and the length of the bottom of the convex surface (width of the bottom of the concave surface) q, in this figure, P is about 2q, but is not limited to this. In consideration of electron recapture, q ≧ P / 2 is preferably used.

The depth t and the shape of the concave surface are designed in consideration of the influence on the creepage distance and the capture of secondary electrons.
0.2 × q is preferable, weight loss associated with carbonization of the resin,
The thickness of the resin layer is determined by volume reduction and the like, and although it depends on the material, the thickness of the resin layer is reduced to about 30% at the maximum by carbonization. When t0 is set, the thickness is t ≦ 0.7 × t0. Further, as described later, by irradiating the concave surface with an electron beam, light, or the like to partially remove carbon, the difference t in the thickness between the concave surface and the convex surface is t ≦ 0.7 × Not only the range of t0 but also the range of t <t0 is possible. The shape of the uneven surface is preferably a smooth curved shape without an acute angle so that the electric field is not concentrated and electrons are not emitted. As described above, the creepage distance of the uneven surface is designed according to the applied anode voltage Va and the electric field strength, and the shape parameters P, q, and t of the uneven surface are appropriately set. Further, the shape parameters P, q, and t of the strip-shaped uneven surface may be different or partially formed in the same spacer.

Further, in this configuration, the high resistance layer may be formed by forming the carbon layer 52 also on the surface of the convex resin layer. The high resistance layer takes the form of FIGS. 5A and 5B described above. In addition, since the concave carbon layer has high conductivity, the potential variation on the spacer surface caused by the partial resistance variation of the carbon layer 52 on the surface of the convex resin layer is suppressed, and the stable equipotential is reduced to the whole spacer. Can also be played at the same time. In this case, the carbon layer is made of one of the above materials, such as graphite and amorphous carbon having high conductivity.
If the thickness is 00 nm or more, the potential drop in the carbon layer is
In the case of the plate-like spacer described in the embodiment, the potential drop is suppressed to 10 V or less, and the effect of equipotential can be exhibited in the carbon layer. Therefore, the lower limit of the thickness of the carbon layer is 100 nm. In addition, it is preferable that the ohmic contact layer 53 is connected to the strip-shaped carbon layer provided on the spacer substrate from the viewpoint of the contact resistance.

FIG. 7 shows another configuration example of the fourth configuration of the present invention.

FIG. 7A shows a case where the carbon layer 52 at the bottom of the concave surface is not formed on the convex surface 51 of the spacer 11 shown in FIG. The anode voltage is not extremely high,
When the creepage breakdown voltage can be sufficiently ensured by increasing the creepage distance due to the uneven surface and recapturing secondary electrons, or when q >> 1 / 2P, it is not always necessary to form the carbon layer 52 on the convex surface.

FIG. 7B shows a case where the resin layer 51 is not arranged between the bottom of the concave surface of the spacer 11 of FIG. When there is a concern about impurity transfer from the spacer base material 31 to the surface, for example, sodium ion transfer when soda lime glass is used for the spacer base material, the carbon layer 52 and the surface of the spacer base material 31 are in direct contact with each other. May not be preferred. In such a case, as shown in FIGS. 6 and 7A, by disposing the resin layer 51 between the carbon layer 52 at the bottom of the concave surface of the spacer 11 and the spacer base material 31, for example, sodium ion It is possible to avoid such a problem that the resistance of the carbon layer 52 largely fluctuates from a design value due to diffusion. However,
When there is no such a concern as the spacer base material 31,
For example, when non-alkali glass, potassium-substituted glass, or the like is used, the resin layer 51 is not particularly required between the concave surface of the spacer 11 and the spacer base material 31.

FIG. 7C shows a case where a carbon layer 54 containing a catalyst metal is formed on the surface of the concave bottom of the carbon layer 52 of FIG. 7B. The catalyst metal layer 54 is made of Ni, Co, Fe
For example, a metal material of the iron group such as Pd or the platinum group of Pd and Pt is used. In particular, iron group metals are preferred in terms of lowering the temperature. These catalyst metals are carbonized at a lower temperature when the resin layer 51 is carbonized, so that the functions of simplifying the carbonization process and selectively forming the carbon layer 54 are achieved. In addition, the catalytic metal can be not only formed in advance on the concave organic resin layer and carbonized, but also disposed between the convex surface and the spacer base material 31 or mixed with the organic resin layer.

Next, a method of manufacturing a spacer according to the present invention will be described with reference to FIGS. 5 and 6 as examples. The method for manufacturing a spacer according to the present invention does not use a vacuum film-forming method as in the prior art and can use a simple process. Things.

The method of manufacturing a spacer according to the present invention is characterized in having the following steps.

Step-a) a step of applying an organic resin solution 51 to the spacer base material 31 cut into a plate shape, a step-b) a step of curing the organic resin 51 applied in the step-a), and a step-c A) a step of carbonizing the organic resin 51 cured in the step-b); and a spacer substrate 31 cut into a plate shape in the step-a).
In the step of applying a resin solution or a resin precursor solution, the spacer can be applied to the spacer substrate by a spinner. In particular, the spacer substrate 31 is dipped in a solution containing a resin or a resin precursor. Then, the spacer substrate 3 is cut by applying
This is preferable because it is applied to the entire surface, including the end face of the first member. The desired thickness of the organic resin layer 51 can be obtained by repeating Step-) a or repeating Step-) a and Step-b) after finishing Step-b).

The step of curing the resin applied in step-a) in step-b) is a step of removing the organic solvent in the resin solution by evaporation and curing the resin on the spacer base material 31 or the step of curing the resin. This is a step of removing the organic solvent in the solution containing the precursor by evaporation and curing the resin on the spacer base material 31 through a chemical reaction such as crosslinking and condensation.

A part of the spacer structure applicable to the present invention can be formed in the steps up to step-b). Hereinafter, a method of manufacturing a spacer configuration including the carbon layer 52 and the resin layer 51 as the surface coat layer 32 will be described.

In the step-c), the step of carbonizing the resin cured in the step-b) may be performed by electron beam or light irradiation,
By heating in vacuum or in an inert gas.

When the resin is heated in a vacuum or in an inert gas, the resin is thermally decomposed and carbonized. As described above, the volume decreases with carbonization by several tens% or more. At this time, if a catalytic metal having an effect of lowering the carbonization of the resin is formed in advance on the spacer base material or mixed in a resin solvent, the catalytic metal is formed on the resin. By doing so, selective carbonization occurs around the metal by the action of the catalytic metal.

When the resin is heated by light irradiation in a vacuum or in an inert gas, the resin is thermally decomposed and carbonized. As a light source, infrared light or visible light is emitted from a lamp, or laser light is emitted.

By irradiating the resin layer 51 with an electron beam in a vacuum, the resin is also carbonized. Since the irradiation condition of the electron beam is mainly determined by the thermal condition, it is determined by the electron beam density of the electron beam. When the electron beam density of the electron beam is low, the resin is decomposed into a thermally decomposed polymer or amorphous carbon, and when the electron beam density is further increased, graphite is formed.

When the resin layer 51 is partially and selectively carbonized as in the spacers shown in FIGS. 6 and 7, the catalyst is formed on the spacer base material or the organic resin in advance in a shape to be carbonized. If the reactive metal is formed, carbonization occurs selectively in the portion where the catalyst metal layer 54 is provided. If the catalytic metal is mixed in advance with the organic resin, carbonization is performed at a low temperature.

As a method for applying the catalytic metal, an ink jet method used in a printer is suitably used. That is, the organic metal-containing solution is discharged from the inkjet nozzle, and the organic metal solution is applied to the spacer substrate in a desired pattern, and then the desired pattern of the catalytic metal can be obtained by thermal decomposition. Here, the organometallic solution is
A solution in which an organic metal complex is dissolved in a solvent is preferably used. As the inkjet method to be used, a piezo jet method using a piezoelectric element or a bubble jet (registered trademark) method using thermal energy is suitably used.

In the case of electron beam irradiation or light irradiation, electron beam irradiation or light irradiation may be performed in accordance with a carbonization pattern. Furthermore, when the concave surface is irradiated with an electron beam or light, carbon in the concave surface is reduced, the difference t in thickness between the concave surface and the convex surface is increased, and the creepage distance can be further increased.
When carbonization is performed not only on the bottom of the concave surface but also on the organic resin of the convex surface layer, the amount of electrons and the time for irradiating the concave and convex surfaces can be set.

The carbonization step is also used for forming an ohmic contact layer by carbonizing an organic resin formed on the end surface of the spacer base material.

The above-described production method of the present invention may be performed alone or in combination.

As shown in FIG. 1, the rear plate 1 is an electron source substrate having a large number of electron-emitting devices arranged on a substrate 4. As the substrate 4, quartz glass, blue plate glass, Na
Glass and blue plate glass with reduced impurity content such as Si
A glass substrate laminated with O ₂ , ceramics such as alumina, a Si substrate, and the like can be used. In particular, when a large-screen display panel is formed, a liquid crystal growth method using a blue plate glass, a potassium glass, a blue plate glass, A glass substrate or the like on which SiO ₂ is laminated by a gel method, a sputtering method, or the like is relatively inexpensive and can be preferably used.

As the electron-emitting device 5, a surface conduction electron-emitting device is used here.

The present invention can be suitably used for a field emission type electron emission element, a metal / insulator / metal type electron emission element, a diamond type electron emission element and the like, in addition to the surface conduction type electron emission element.

FIG. 8 is an enlarged schematic view showing a surface conduction electron-emitting device used in the image forming apparatus shown in FIGS. In FIG. 8, the same portions as those shown in FIGS. 1 and 2 are denoted by the same reference numerals as those in FIGS. 1 and 2, and redundant description will be omitted. 8, reference numeral 81 denotes a conductive thin film, 82 denotes an electron-emitting portion, and 83 denotes an interlayer insulating layer for electrically separating the wiring electrode 7a from the wiring electrode 7b. For example, the conductive thin film 81 has a thickness of 50 nm from 1 nm.
A fine particle film composed of conductive fine particles having a thickness in the range of m is preferably used.

As a material for forming the conductive thin film 81, various conductors and semiconductors can be used. In particular, the conductive thin film 81 is obtained by heating and firing an organic compound containing a noble metal element such as Pd, Pt, Ag, and Au. Pd, Pt, Ag, Au,
PdO or the like is preferably used.

The electron-emitting portion 82 is constituted by a high-resistance crack formed in a part of the conductive thin film 81. Inside the electron-emitting portion 82, an element of the material forming the conductive thin film 81, carbon, and a carbon compound are contained. In some cases, conductive fine particles having a particle diameter ranging from several times to several hundred times the contained 0.1 nm may be present.

As the electrodes 6a and 6b, general conductive materials can be used. This is, for example, Ni, Cr, A
metals or alloys such as u, Mo, W, Pt, Ti, Al, Cu, Pd, and Pd, Ag, Au, RuO ₂ , Pd-A
It can be appropriately selected from a printed conductor composed of a metal such as g or a metal oxide and glass, a transparent conductor such as In ₂ O ₃ —SnO ₂ , and a semiconductor / conductor material such as polysilicon.

Various arrangements of the electron-emitting devices 5 can be employed. What is described here is, for example, as shown in FIG. 9, a plurality of electron-emitting devices 5 arranged in a matrix in the X direction and the Y direction in an arrangement called a simple matrix arrangement, and arranged in the same row. One of the electrodes 6a of the plurality of electron-emitting devices 5 is commonly connected to a wiring 7a in the X direction, and the other 6b of the electrodes of the plurality of electron-emitting devices 5 arranged in the same column.
Are commonly connected to the wiring 7b in the Y direction. X
Both the direction wiring electrode 7a and the Y-direction wiring electrode 7b can be formed of a conductive metal or the like formed by using a vacuum deposition method, a printing method, a sputtering method, or the like. The material, thickness, and width of the wiring are appropriately designed. In addition, the interlayer insulating layer 83 is an insulator layer formed of glass, ceramic, or the like by using a vacuum evaporation method, a printing method, a sputtering method, or the like.

For example, the substrate 4 on which the X-direction wiring 7a is formed
Is formed in a desired shape on the entire surface or a part thereof, and in particular, the film thickness, material, and manufacturing method are appropriately set so as to withstand the potential difference at the intersection of the X-direction wiring 7a and the Y-direction wiring 7b. A scanning signal applying unit (not shown) for applying a scanning signal for selecting a row of the electron-emitting devices 5 arranged in the X direction is connected to the Y-direction wiring 7a.

On the other hand, a modulation signal generating means (not shown) for modulating each column of the electron-emitting devices 5 arranged in the Y direction according to an input signal is connected to the Y-direction wiring 7b. The driving voltage applied to each electron-emitting device is supplied as a difference voltage between a scanning signal and a modulation signal applied to the device.

In the above configuration, individual elements can be selected and driven independently using simple matrix wiring.

In addition, each of a large number of electron-emitting devices arranged in parallel is connected at both ends, a large number of rows of electron-emitting devices are arranged (referred to as a row direction), and a direction perpendicular to the wiring (column direction) is used. And a control electrode (also referred to as a grid) disposed above the electron-emitting device 5 to control and drive electrons from the electron-emitting device 5 in a ladder-like arrangement.
The present invention is not particularly limited by these arrangements.

The face plate 2 is an anode substrate in which a transparent electrode 9 and a phosphor film 10 are formed on the surface of a transparent substrate 8. It is needless to say that the substrate 8 is transparent, but preferably has the same mechanical strength and thermophysical properties as the rear plate substrate 4. When forming a large-screen display panel, blue plate glass, potassium glass, blue plate glass A glass substrate on which SiO ₂ is laminated by a liquid phase growth method, a sol-gel method, a sputtering method, or the like can be preferably used.

A high positive voltage Va is applied to the transparent electrode 9 from an external power supply (not shown). Thereby, the electron-emitting device 5
The emitted electrons are attracted to the face plate 2, accelerated and irradiated on the phosphor film 10. At this time,
If the incident electrons have sufficient energy to cause the phosphor film 10 to emit light, a bright spot can be obtained there.

In general, in a phosphor used in a CRT for a color TV, electrons are accelerated and irradiated with an acceleration voltage of several kV to several tens kV to obtain good brightness and coloration. C
Since the phosphor for RT has very high performance while being relatively inexpensive, it can be preferably used in the present invention.

As a general technique, the phosphor film 10
A thin aluminum film called a metal back (not shown) may be formed on the surface of the substrate. The purpose of providing the metal back is to improve the brightness by reflecting the light emitted from the phosphor toward the rear plate 1 side to the face plate 2 side, and to improve the brightness, and the damage due to the collision of negative ions generated in the envelope. To protect the phosphor from
It can also function as an electrode for applying an electron beam acceleration voltage. In this case, the transparent electrode 9 may not be particularly necessary. The present invention can be used in any case.

The support frame 3 is connected to the rear plate 1 and the face plate 2, and forms an envelope.
The connection between the support frame 3 and the rear plate 1 and the face plate 2 depends on the material constituting the rear plate 1, the face plate 2 and the support frame 3, but when glass is used as an example, the connection is made using a glass frit. You can wear it.

The spacer 11 and the face plate 2 and the rear plate 1 can be fixed with resin.

[0162]

EXAMPLES Hereinafter, the present invention will be described in detail with reference to specific examples, but the present invention is not limited to these examples, and each element within a range in which the object of the present invention is achieved. This also includes those in which substitutions or design changes have been made.

[Embodiment 1] The basic configuration of an image forming apparatus according to the present invention is the same as that shown in FIGS. 1 and 2, and FIG. 9 shows an overall view. 9, the same parts as those shown in FIGS. 1, 2, and 8 are denoted by the same reference numerals. In the figure, 9
1 is a metal back.

The method for manufacturing an image forming apparatus according to the present invention is as follows.
This is shown in FIGS. Hereinafter, a basic configuration and a manufacturing method of the image forming apparatus according to the present invention will be described with reference to FIGS.

FIGS. 10 and 11 show the manufacturing process in the vicinity of one electron-emitting device in an enlarged manner for the sake of simplicity. It is an example of an apparatus.

(Step-a) A 500 nm thick SiO ₂ film was formed on a cleaned blue plate glass by a sputtering method.
nm of Au are sequentially laminated, and then the photoresist (AZ13
70, manufactured by Hoechst Co.) by spin coating and baking, and then exposing and developing a photomask image to form a resist pattern of the electrode wiring (lower wiring) 7a, and Au / C
The r-deposited film is wet-etched to form a lower wiring 7a having a desired shape (FIG. 10A).

(Step-b) Next, a 1.0 μm thick SiO
_An interlayer insulating layer 83 made of _two films is deposited by an RF sputtering method (FIG. 10B).

(Step-c) A photoresist pattern for forming the contact hole 101 is formed in the SiO ₂ film deposited in the step b, and the photoresist pattern is used as a mask to form the interlayer insulating layer 83.
Is etched to form a contact hole 101.
Etching was performed using RIE (Reacti) using CF ₄ and H ₂ gas.
ve Ion Etching) method (FIG. 10 (c)).

(Step d) Thereafter, the patterns of the electrodes 6a and 6b are formed by photoresist (RD-2000N-41 manufactured by Hitachi Chemical Co., Ltd.), and a 5 nm-thick T
i, Ni of 100 nm in thickness is sequentially deposited. The photoresist pattern is dissolved with an organic solvent, and the Ni / Ti deposited film is lifted off to form electrodes 6a and 6b (FIG. 10).
(D)).

The following is shown in FIG.

(Step-e) After a photoresist pattern of the electrode wiring (upper wiring) 7b is formed on the electrodes 6a and 6b, 5 nm thick Ti and 500 nm thick Au are sequentially deposited by vacuum evaporation, and lift-off is performed. Unnecessary portions are removed to form the upper wiring 7b having a desired shape.
(E)).

(Step-f) The mask of the conductive thin film 81 of the electron-emitting device involved in this step is a mask having an opening over the electrodes 6a and 6b. It is deposited and patterned by vapor deposition, and organic Pd (ccp4230, manufactured by Okuno Pharmaceutical Co., Ltd.) is further spin-coated by a spinner,
A heating and baking treatment is performed at 0 ° C. for 10 minutes. The conductive thin film 81 formed of fine particles of Pd as the main element thus formed has a thickness of 10 nm and a sheet resistance of 5 × 1.
0 ⁴ Ω / □ and was the (Fig. 11 (f)).

(Step-g) The Cr film 111 and the baked conductive thin film 81 are etched with an acid etchant to form a desired pattern (FIG. 11G).

(Step-h) A pattern in which a resist is applied to portions other than the contact hole 101 is formed, and 5 nm thick Ti and 500 nm thick Au are formed by vacuum evaporation.
Are sequentially deposited. Unnecessary portions are removed by lift-off to bury the contact holes 101 (FIG. 11H).

The rear plate 1 is formed by the above steps.

Next, the manufacture of the spacer 11 in this embodiment will be described.

(Step-i) 1 mm (height) × 40 mm
After cleaning a small piece of glass cut and polished to (length) × 0.2 mm (width) cleanly, polybenzimidazole varnish: PBI MRSolution (manufactured by Toray Industries, Inc.)
A two-fold dilution with N, N-dimethylacetamide is spin coated. In spin coating, first, one side (1 mm × 40 mm side) is spin-coated, prebaked at 100 ° C. for 10 minutes on a hot plate, and spin-coated on the other side, and then again at 100 ° C. on a hot plate. Pre-bake for 10 minutes.

This is put in a clean oven, heated from room temperature to 200 ° C., kept at 200 ° C. for 30 minutes, then further heated to 300 ° C., kept for 1 hour, and cured. The film thickness of the polybenzimidazole resin thus obtained was about 1 μm.

(Step-j) Upper wiring 7b of rear plate 1
At the position where the upper spacer is to be arranged, PBI MRSolu
Tion is applied using a dispenser, and
Temporarily fix the spacer 11 produced in (Step-i). At this time, a jig (not shown) was used to hold the spacer 11 substantially vertically. While the spacers are temporarily fixed, pre-baking is performed at 100 ° C for 10 minutes on a hot plate, and after removing the spacer holding jig, the temperature is raised from room temperature to 200 ° C in a clean oven and held at 200 ° C for 30 minutes. After that, the temperature is further raised to 300 ° C., and the temperature is maintained for 1 hour to cure. Thereby, the spacer 11 can be fixed at a desired position on the rear plate 1.

The spacer may be arranged and fixed on the face plate 2 with an adhesive or the like.

(Step-k) As described above, the support frame 3 is arranged on the rear plate 1 on which the many spacers 11 are fixed. At this time, the joint between the rear plate 1 and the support frame 3 is coated with frit glass in advance. The face plate 2 (configured by forming the fluorescent film 10 and the metal back 91 on the inner surface of the glass substrate 8) is disposed via the support frame 3 and the spacer 11, and the joint between the face plate 2 and the support frame 3 is provided. And frit glass, PBI MR Sol
application.

[0182] The rear plate 1, the support frame 3, and the face plate 2 are bonded together,
C., held at 10 ° C. for 10 minutes, heated to 200 ° C., held at 200 ° C. for 30 minutes, then further heated to 300 ° C., held for 1 hour, further heated to 400 ° C., and baked for 10 minutes (FIG. 9).

The phosphor film 10 is made of only a phosphor in the case of monochrome, but in this embodiment, the phosphor is formed in a stripe shape, a black stripe is formed first, and the phosphor of each color is formed in the gap. Is used.
As a material of the black stripe, a material mainly containing graphite, which is generally used, is used. A slurry method was used as a method of applying the phosphor on the glass substrate 8.

The metal back 91 on the inner surface of the phosphor film 10 is provided with a smoothing treatment (usually called filming) on the inner surface of the phosphor film 10 after the phosphor film 10 is formed.
Is performed, and then, Al is vacuum-deposited.

The face plate 2 is further provided with a phosphor film 1.
In some cases, a transparent electrode is provided on the outer surface side of the phosphor film 10 in order to enhance the conductivity of the phosphor film 10. However, in the present embodiment, since the metal back 91 alone provided sufficient conductivity, it was omitted.

When the above-mentioned sealing is performed, in the case of color, the phosphors of each color must correspond to the electron-emitting devices. Therefore, sufficient alignment is performed.

The atmosphere in the glass container completed as described above is evacuated by a vacuum pump through an exhaust pipe (not shown), and after reaching a sufficient degree of vacuum, external terminals Dox1 to Doxn and Doy1 to Dox1 to Dox1 A voltage is applied between the electrodes 6a and 6b of the electron-emitting device 5 through Doym, and a crack is formed by forming the conductive thin film 81. Furthermore,
Toluene is introduced into the panel through a slow leak valve from the exhaust pipe of the panel, and all the electron-emitting devices 5 are driven under an atmosphere of 1.0 × 10 ⁻⁵ torr to perform an activation process. Here, the activation treatment is a step in which carbon is formed in the crack and the emission current (electrons) is significantly increased.
As a result, an electron emitting portion 82 is formed.

Next, the gas is evacuated to a degree of vacuum of about 10 ^-8 torr, and an exhaust pipe (not shown) is welded by heating with a gas burner to seal the envelope.

Finally, in order to maintain the degree of vacuum after sealing,
Getter processing is performed by a high frequency heating method.

In the image display device of the present embodiment completed as described above, each of the electron-emitting devices 5 has a terminal Dox outside the container.
Electrons are emitted by applying scanning signals and modulation signals from signal generating means (not shown) through 1 to Doxn and Doy 1 to Doym, respectively, and applying a high voltage Va to the metal back 91 through the high voltage terminal Hv to accelerate the electron beam. Then, an image can be displayed by colliding with the phosphor film 10 to excite and emit light.

In the image forming apparatus of this embodiment, although the high voltage Va was increased to 7 kV, no discharge or leak current was observed, and an image with high brightness and good color expression was stably obtained. Further, in the image forming apparatus of this embodiment, the spacer manufacturing process was simple, and the image forming apparatus could be configured at a relatively low cost.

[Embodiment 2] In this embodiment, (Step-h)
Until then, the same steps as in the first embodiment were performed.

(Step-i) In this embodiment, a small piece of glass cut and polished to 1 mm (height) × 40 mm (length) × 0.2 mm (width) is cleaned and then completely aromatic polyimide. Varnish: Treenice # 3000 (manufactured by Toray)
Spin-coat a two-fold dilution with N-methyl-2-pyrrolidone. For spin coating, first, one side (1 mm × 40 mm side) is spin coated, and pre-baked at 100 ° C. for 10 minutes on a hot plate.
After spin-coating the other surface, pre-baking is again performed on a hot plate at 100 ° C. for 10 minutes. Put this in a clean oven,
Then, the temperature is raised to 300 ° C. for 1 hour to cure. The thickness of the polyimide resin thus obtained is about 1 μm.
Met.

(Step-j) Upper wiring 7b of rear plate 1
At the position where the upper spacer is to be placed,
Is applied using a dispenser, and (Process-
Temporarily fix the spacer 11 produced in i). At this time, a jig (not shown) was used to hold the spacer 11 substantially vertically. With the spacers temporarily fixed, pre-bake at 100 ° C for 10 minutes on a hot plate, remove the spacer holding jig, raise the temperature from room temperature to 300 ° C in a clean oven, and hold at 300 ° C for 1 hour And cure.

Thus, the spacer 11 can be fixed at a desired position on the rear plate 1.

(Step-k) The support frame 3 is arranged on the rear plate 1 on which the many spacers 11 are fixed as described above. At this time, the joint between the rear plate 1 and the support frame 3 is coated with frit glass in advance. The face plate 2 (formed by forming the phosphor film 10 and the metal back 91 on the inner surface of the glass substrate 8) is disposed via the support frame 3 and the spacer 11. Frit glass, Treenice # 3000 in advance in the part and the joint part with the spacer 11
Respectively.

The rear plate 1, the support frame 3, and the face plate 2 are bonded together,
C. for 10 minutes, then raise the temperature to 300.degree.
Hold at 00 ° C for 1 hour, and further raise the temperature to 400 ° C,
It seals by baking for 0 minutes. At the time of sealing, in the case of color, since the phosphors of each color must correspond to the electron-emitting devices, sufficient alignment was performed.

The atmosphere in the glass container completed as described above is exhausted by a vacuum pump through an exhaust pipe, and after reaching a sufficient degree of vacuum, forming and activation are performed in the same manner as in the first embodiment. Do.

Next, after evacuation and sealing, getter processing is performed by a high-frequency heating method.

In the image display device of the present invention completed as described above, an image can be displayed by colliding an electron beam with a fluorescent film to excite and emit light, as in the first embodiment.

In the image forming apparatus of this embodiment, although the high voltage Va was increased to 7 kV, no discharge, no leak current, etc. were observed, and an image with high luminance and good color expression was stably obtained. Further, in the image forming apparatus of the present embodiment, the spacer manufacturing process was simple, and the image forming apparatus could be configured at lower cost.

Comparative Example 1 In this comparative example, (step-h)
Until then, the same steps as in the first embodiment were performed.

(Step-i) Upper wiring 7b of rear plate 1
Frit glass is applied using a dispenser to the position where the upper spacer is to be placed, and 1 mm (height) ×
A glass spacer 11 (spacer base material itself without resin coating) cut and polished to 40 mm (length) × 0.2 mm (width) is temporarily fixed. At this time, a jig (not shown) was used to hold the spacer 11 substantially vertically. With the spacers temporarily fixed, baking was performed at 400 ° C. for 10 minutes in the air.

(Step j) The support frame 3 is arranged on the rear plate 1 on which a number of spacers 11 are fixed. At this time, the joint between the rear plate 1 and the support frame 3 is coated with frit glass in advance. The face plate 2 (formed by forming the phosphor film 10 and the metal back 91 on the inner surface of the glass substrate 8) is disposed via the support frame 3 and the spacer 11. Frit glass is applied in advance to the portion and the joint with the spacer 11.

The rear plate 1, the support frame 3 and the face plate 2 are bonded together at 400 ° C. in air for 10 minutes.
Seal by baking for a minute. At the time of sealing, in the case of color, since the phosphors of each color must correspond to the electron-emitting devices, sufficient alignment was performed.

The atmosphere in the glass container completed as described above is exhausted by a vacuum pump through an exhaust pipe, and after a sufficient degree of vacuum is reached, the forming process and the activation process are performed in the same manner as in the first embodiment. Do.

Next, after exhausting and sealing, getter processing is performed by a high-frequency heating method.

In the image display device completed as described above, an image was displayed by causing an electron beam to collide with the phosphor film 10 to excite and emit light, as in Example 1.

In the image forming apparatus of this comparative example, when the high voltage Va was increased to 2.2 kV, discharge was observed near the spacer 11, and the image was evaluated by lowering the high voltage Va to 2 kV. The brightness was low and the color expression was not sufficient.

[Embodiment 3] In this embodiment, (Step-h)
Until then, the same steps as in the first embodiment were performed.

(Step-i) In this example, a cleanly washed cylindrical glass rod having a diameter of 0.2 mmφ was prepared by using a wholly aromatic polyimide varnish: Treeneth # 3000 (manufactured by Toray Industries, Inc.) with N-methyl-2-pyrrolidone. Dip coating is performed by dipping in a solution diluted 5 times and lifting up. Put the raised glass rod in a clean oven for 100
Pre-bake for 10 minutes at room temperature, then put it in a clean oven and raise the temperature from room temperature to 300 ° C.
Hold at 0 ° C. for 1 hour to cure. The thickness of the polyimide resin thus obtained was about 1 μm.

The glass rod having the surface coated with the polyimide resin was cut into a length of 1 mm to form a large number of columnar spacers 11.

(Step-j) Upper wiring 7b of rear plate 1
At the position where the upper spacer is to be placed,
Is applied using a dispenser, and (Process-
Temporarily fix the spacer 11 produced in i). At this time, a jig (not shown) was used to hold the spacer 11 substantially vertically. With the spacers temporarily fixed, pre-bake at 100 ° C for 10 minutes on a hot plate, remove the spacer holding jig, raise the temperature from room temperature to 300 ° C in a clean oven, and hold at 300 ° C for 1 hour And cure.

As a result, the spacer 11 can be fixed at a desired position on the rear plate 1.

(Step-k) The support frame 3 is disposed on the rear plate 1 on which the many spacers 11 are fixed as described above. At this time, the joint between the rear plate 1 and the support frame 3 is coated with frit glass in advance. The face plate 2 (formed by forming the phosphor film 10 and the metal back 91 on the inner surface of the glass substrate 8) is disposed via the support frame 3 and the spacer 11.
The joint between the support frame 3 and the spacer 11 and the joint between the spacer 11 are previously made of frit glass and trainee # 3000.
Respectively.

The rear plate 1, the supporting frame 3 and the face plate 2 are bonded together,
C. for 10 minutes, then raise the temperature to 300.degree.
Hold at 00 ° C for 1 hour, and further raise the temperature to 400 ° C,
It seals by baking for 0 minutes. At the time of sealing, in the case of color, since the phosphors of each color must correspond to the electron-emitting devices, sufficient alignment was performed.

The atmosphere in the glass container completed as described above was exhausted by a vacuum pump through an exhaust pipe, and after a sufficient degree of vacuum was reached, the forming process and the activation process were performed in the same manner as in Example 1. Do.

Next, after evacuating and sealing, getter processing is performed by a high-frequency heating method.

In the image display device of the present invention completed as described above, the electron beam is applied to the phosphor film 1 as in the first embodiment.
An image can be displayed by colliding with 0 and causing excitation and light emission.

In the image forming apparatus of this embodiment, although the high voltage Va was increased to 7 kV, no discharge or leak current was observed, and an image with high luminance and good color expression was stably obtained. Further, in the image forming apparatus of the present embodiment, the spacer manufacturing process was simple, and the image forming apparatus could be configured at lower cost.

Embodiment 4 In this embodiment, (Step-h)
Until then, the same steps as in the first embodiment were performed.

(Step-i) 4 mm (height) × 40 mm
After washing a small piece of glass cut and polished to (length) × 0.2 mm (width) cleanly, a wholly aromatic polyimide varnish:
Treenice # 3000 (manufactured by Toray Industries, Inc.)
-Average particle size 29 after dilution 20-fold with pyrrolidone
The carbon black (furnace black) of 18 nm is mixed with the resin concentration of Trenice # 3000 by 18 wt% to perform spin coating. In spin coating, first, one side (4 mm × 40 mm side) is spin-coated, prebaked on a hot plate at 100 ° C. for 10 minutes, and then spin-coated on the other side, and then again on a hot plate at 100 ° C. Pre-bake for 10 minutes. This is placed in a clean oven, heated from room temperature to 300 ° C., and kept at 300 ° C. for 1 hour to cure. The film thickness of the carbon-containing polyimide resin thus obtained was about 0.1 μm. When the sheet resistance Rs of the spacer surface was measured, it was 3 × 10 ⁹ Ω.

(Step-j) Upper wiring 7b of rear plate 1
Using a dispenser, a carbon powder (furnace black) having a particle size of 29 nm mixed with 30 wt% with respect to the resin concentration of Treenice # 3000 is applied using a dispenser to the position where the upper spacer is to be disposed, and is produced there by the process-i. The spacer 11 is temporarily fixed. At this time, a jig (not shown) was used to hold the spacer 11 substantially vertically. With the spacer temporarily fixed, place 1 on the hot plate.
After pre-baking at 00 ° C. for 10 minutes and removing the spacer holding jig, the pre-bake is performed in a clean oven at room temperature to 30 °
The temperature is raised to 0 ° C., and the temperature is maintained at 300 ° C. for 1 hour to cure. Thereby, the spacer 11 can be fixed at a desired position on the rear plate 1.

(Step-k) The support frame 3 is arranged on the rear plate 1 on which the many spacers 11 are fixed as described above. At this time, the joint between the rear plate 1 and the support frame 3 is coated with frit glass in advance. The face plate 2 (formed by forming the fluorescent film 10 and the metal back 91 on the inner surface of the glass substrate 8) is disposed via the support frame 3 and the spacer 11.
Frit glass, carbon powder (furnace black) having a particle size of 29 nm mixed in advance with 30 wt% with respect to the resin concentration of Trenice # 3000 are applied to the joints between the support frame 3 and the spacer 11, respectively. Keep it. The rear plate 1, the support frame 3, and the face plate 2 are bonded together,
C. for 10 minutes, then raise the temperature to 300.degree.
Hold at 00 ° C for 1 hour, and further raise the temperature to 400 ° C,
It seals by baking for 0 minutes. At the time of sealing, in the case of color, since the phosphors of each color must correspond to the electron-emitting devices, sufficient alignment was performed.

The atmosphere in the glass container completed as described above is exhausted by a vacuum pump through an exhaust pipe, and after reaching a sufficient degree of vacuum, the forming process and the activation process are performed in the same manner as in the first embodiment. Do.

Next, after exhausting and sealing, getter processing is performed by a high-frequency heating method.

In the image display device of the present invention completed as described above, the electron beam is applied to the phosphor film 1 as in the first embodiment.
An image can be displayed by colliding with 0 and causing excitation and light emission.

In the image forming apparatus of this embodiment, although the high voltage Va was increased to 15 kV, no discharge or leak current was observed, and an image with extremely high luminance and good color expression was stably obtained. In the image forming apparatus according to the present embodiment,
The spacer manufacturing process was simple, and the image forming apparatus could be configured at a relatively low cost.

[Embodiment 5] In this embodiment, (Step-h)
Until then, the same steps as in the first embodiment were performed.

(Step-i) In this example, a small piece of glass cut and polished to a size of 4 mm (height) × 40 mm (length) × 0.2 mm (width) was cleaned and then washed with a polybenzimidazole varnish. : PBI MR Solution
A product obtained by diluting (manufactured by Toray Industries, Inc.) twice with N, N-dimethylacetamide and spin-coating a mixture of natural graphite powder having a particle size of 100 nm and 20 wt% with respect to the resin concentration of PBIMR Solution.
For spin coating, first, spin coating is performed on one side (4 mm x 40 mm side), and 100 ° C on a hot plate.
After pre-baking for 10 minutes and spin-coating on the other side, 100 ° C, 1
Pre-bake for 0 minutes. This is placed in a clean oven, heated from room temperature to 200 ° C., kept at 200 ° C. for 30 minutes, then further heated to 300 ° C., kept for 1 hour, and cured. The thickness of the thus obtained graphite-containing polybenzimidazole resin was about 1 μm, and the sheet resistance Rs of the spacer surface was measured.
It was 1 × 10 ¹⁰ Ω.

(Step-j) Upper wiring 7b of rear plate 1
Using a dispenser, a mixture of natural graphite powder having a particle size of 100 nm and 30 wt% with respect to the resin concentration of PBI MR Solution is applied using a dispenser to the position where the spacer is to be disposed, and the spacer 11 formed in step-i is applied thereto. Is temporarily fixed. At this time, a jig (not shown) was used to hold the spacer 11 substantially vertically. With the spacer temporarily fixed, place 1 on the hot plate.
After pre-baking at 00 ° C. for 10 minutes and removing the spacer holding jig, the pre-baking is performed in a clean oven at room temperature to 20 ° C.
After the temperature was raised to 0 ° C and kept at 200 ° C for 30 minutes,
The temperature is raised to 00 ° C. and held for one hour to cure. As a result, the spacer 11 is placed at a desired position on the rear plate 1.
Can be fixed.

(Step-k) The support frame 3 is arranged on the rear plate 1 on which the many spacers 11 are fixed as described above. At this time, the joint between the rear plate 1 and the support frame 3 is coated with frit glass in advance. The face plate 2 (formed by forming the fluorescent film 10 and the metal back 91 on the inner surface of the glass substrate 8) is disposed via the support frame 3 and the spacer 11. And at the joint with the spacer 11,
Frit glass and natural graphite powder having a particle size of 100 nm mixed with 30 wt% with respect to the resin concentration of PBI MR Solution are applied in advance. The rear plate 1, the support frame 3, and the face plate 2, which are bonded together, are first kept in the air at 100 ° C. for 10 minutes, heated to 200 ° C., and heated at 200 ° C. for 30 minutes.
After holding for one minute, the temperature is further raised to 300 ° C., held for one hour, further raised to 400 ° C., and baked for 10 minutes for sealing. At the time of sealing, in the case of color, since the phosphors of each color must correspond to the electron-emitting devices, sufficient alignment was performed.

The atmosphere in the glass container completed as described above was evacuated by a vacuum pump through an exhaust pipe, and after a sufficient degree of vacuum was reached, the forming process and the activation process were performed in the same manner as in Example 1. Do.

Next, after performing evacuation and sealing, getter processing is performed by a high-frequency heating method.

In the image display device of the present invention completed as described above, the electron beam is applied to the phosphor film 1 as in the first embodiment.
An image can be displayed by colliding with 0 and causing excitation and light emission.

In the image forming apparatus of this embodiment, although the high voltage Va was increased to 20 kV, no discharge or leak current was observed, and an image with extremely high luminance and good color expression was stably obtained. In the image forming apparatus according to the present embodiment,
The spacer manufacturing process was simple, and the image forming apparatus could be configured at a relatively low cost.

[Comparative Example 2] In this comparative example, (step-h)
Until then, the same steps as in the first embodiment were performed.

(Step-i) Upper wiring 7b of rear plate 1
A frit glass is applied using a dispenser at a position where the upper spacer is to be arranged, and 4 mm (height) ×
A glass spacer 11 (spacer base material itself without resin coating) cut and polished to 40 mm (length) × 0.2 mm (width) is temporarily fixed. At this time, a jig (not shown) was used to hold the spacer 11 substantially vertically. With the spacers temporarily fixed, baking was performed at 400 ° C. for 10 minutes in the air.

(Step j) The support frame 3 is arranged on the rear plate 1 on which a number of spacers 11 are fixed. At this time, the joint between the rear plate 1 and the support frame 3 is coated with frit glass in advance. The face plate 2 (formed by forming the fluorescent film 10 and the metal pack 91 on the inner surface of the glass substrate 8) is disposed via the support frame 3 and the spacer 11.
The frit glass is applied in advance to the joint with the spacer 11.

The rear plate 1, the supporting frame 3 and the face plate 2 are bonded together at 400 ° C.
Seal by baking for a minute. At the time of sealing, in the case of color, since the phosphors of each color must correspond to the electron-emitting devices, sufficient alignment was performed.

The atmosphere in the glass container completed as described above is exhausted by a vacuum pump through an exhaust pipe, and after a sufficient degree of vacuum is reached, the forming process and the activation process are performed in the same manner as in Example 1. Do.

Next, after performing evacuation and sealing, getter processing is performed by a high-frequency heating method.

In the image display device completed as described above, the electron beam is made to collide with the fluorescent film in the same manner as in the first embodiment.
An image was displayed by excitation and light emission.

In the image forming apparatus of this comparative example, when the high voltage Va was increased to 8 kV, no discharge, no leak current, etc. were observed, and an image with high luminance and good color expression was obtained.
However, the image near the spacer was disturbed within a few minutes, and stable display could not be performed.

When the high voltage Va was gradually increased, discharge was observed at about 12 kV, and the image near the spacer suddenly darkened.

[Embodiment 6] In this embodiment, (Step-h)
Until then, the same steps as in the first embodiment were performed.

(Step-i) Next, a glass fiber reinforced polyimide resin (trade name: AURUM JGN3030, manufactured by Mitsui Toatsu Chemicals, Inc.) was injected into a 1 mm (height) ×
The one processed to 40 mm (length) × 0.2 mm (width) is used as a spacer 11 and placed in a clean oven.
Degassing was performed by heating at 1 ° C. for 1 hour.

(Step-j) Upper wiring 7b of rear plate 1
A wholly aromatic polyimide varnish (Trenice # 3000, manufactured by Toray Industries, Inc.) is applied to the position where the upper spacer 11 is to be disposed using a dispenser, and the spacer 11 produced in (Step-i) is temporarily fixed thereto. At this time, a jig (not shown) was used so that the spacer 11 could be held substantially vertically. With the spacer 11 temporarily fixed, pre-baking is performed at 100 ° C. for 10 minutes on a hot plate, and after removing the spacer holding jig, the temperature is raised from room temperature to 300 ° C. in a clean oven, and the temperature is increased to 300 ° C. for 1 hour. While holding, degassing was performed. As a result, the spacer 11 could be fixed at a desired position on the rear plate 1.

(Step-k) The support frame 3 was disposed on the rear plate 1 on which the many spacers 11 were fixed as described above. At this time, the joint between the rear plate 1 and the support frame 3 is coated with frit glass in advance. The face plate 2 (configured by forming the fluorescent film 10 and the metal back 91 on the inner surface of the glass substrate 8) is disposed via the support frame 3 and the spacer 11, and the joint between the face plate 2 and the support frame 3 is provided. , And at the joint with the spacer 11,
Frit glass is applied in advance. The rear plate 1, the supporting frame 3, and the face plate 2, which are bonded together, are initially held at 100 ° C. for 10 minutes in the air, then heated to 300 ° C., held at 300 ° C. for 1 hour, and further heated to 400 ° C. The temperature was raised and baked for 10 minutes to seal. At the time of sealing, in the case of color, since the phosphors of each color must correspond to the electron-emitting devices, sufficient alignment was performed.

The atmosphere in the glass container completed as described above is exhausted by a vacuum pump through an exhaust pipe, and after reaching a sufficient degree of vacuum, the forming process and the activation process are performed in the same manner as in the first embodiment. Do.

Next, after exhausting and sealing, getter processing is performed by a high-frequency heating method.

In the image display device completed as described above, an image was displayed by causing an electron beam to collide with the phosphor film 10 to excite and emit light, as in Example 1.

In the image forming apparatus of this embodiment, although the high voltage Va was increased to 7 kV, no discharge or leak current was observed, and an image with high luminance and good color expression was stably obtained.

Further, in the image forming apparatus of this embodiment, the spacer manufacturing process was simple, and the image forming apparatus could be constructed at low cost.

[Embodiment 7] In this embodiment, (Step-h)
Until then, the same steps as in the first embodiment were performed.

(Step-i) In this embodiment, a carbon fiber reinforced polyimide resin (trade name: AUR) was used as a spacer material.
UM JCN3030, manufactured by Mitsui Toatsu Chemicals Co., Ltd.) and processed into a 4 mm (height) × 40 mm (length) × 0.2 mm (width) spacer 11 by injection molding.
And This was placed in a clean oven and heated at 300 ° C. for 1 hour to perform degassing in the same manner as in Example 1.

(Step-j) Next, the spacer 11 thus manufactured was fixed on the rear plate 1 in the same manner as in the example.

(Step-k) The support frame 3 was placed on the rear plate 1 on which the many spacers 11 were fixed as described above. At this time, the joint between the rear plate 1 and the support frame 3 is coated with frit glass in advance. The face plate 2 (formed by forming the fluorescent film 10 and the metal back 41 on the inner surface of the glass substrate 8) is disposed via the support frame 3 and the spacer 11, and the joint between the face plate 2 and the support frame 3 is provided. , And at the joint with the spacer 11,
Frit glass and Treenice # 3000 are applied in advance. The rear plate 1, the support frame 3, and the face plate 2, which are bonded together, are first kept in the air at 100 ° C. for 10 minutes, and the temperature is raised to 200 ° C.
After holding at 0 ° C. for 30 minutes, the temperature was further raised to 300 ° C.
After holding for a time, the temperature was further raised to 400 ° C. and baked for 10 minutes to seal. At the time of sealing, in the case of color, since the phosphors of each color must correspond to the electron-emitting devices, sufficient alignment was performed.

The atmosphere in the glass container completed as described above was evacuated by a vacuum pump through an exhaust pipe, and after a sufficient degree of vacuum was reached, a forming process and an activation process were performed in the same manner as in Example 1. went.

Next, after evacuation and sealing, a getter treatment was performed by a high-frequency heating method.

In the image forming apparatus of the present invention completed as described above, an electron beam is applied to the phosphor film 1 as in the first embodiment.
An image can be displayed by colliding with 0 and causing excitation and light emission.

In the image forming apparatus of this embodiment, although the high voltage Va was increased to 15 kV, no discharge or leak current was observed, and an image with high luminance and good color expression was stably obtained.

In the image forming apparatus of this embodiment, the spacer manufacturing process was simple, and the image forming apparatus could be formed at low cost.

[Embodiment 8] In this embodiment, (Step-h)
Until then, the same steps as in the first embodiment were performed.

(Step-i) Next, a glass fiber reinforced polyimide resin (trade name: AURUM JGN3030, manufactured by Mitsui Toatsu Chemicals, Inc.) was injected into a 4 mm (height) ×
The one processed to 40 mm (length) × 0.2 mm (width) is used as a spacer 11 and placed in a clean oven.
Degassing was performed by heating at 1 ° C. for 1 hour. Thereafter, carbon black (furnace black) having an average particle size of 29 nm was diluted with N-methyl-2-pyrrolidone 20-fold from a wholly aromatic polyimide varnish: Torayness # 3000 (manufactured by Toray Industries, Inc.) to a resin of Torayness # 3000. Spin coating is performed by mixing 18 wt% with respect to the concentration. Spin coating is first performed on one side (4 mm x 4 mm
Surface) and spin on a hot plate for 100
Pre-bake for 10 minutes, spin-coat on the other side, and again on a hot plate for 100
Pre-bake at 10 ° C. for 10 minutes. This is placed in a clean oven and heated from room temperature to 300 ° C.
Hold at 0 ° C. for 1 hour to cure. The film thickness of the carbon-containing polyimide resin thus obtained was about 0.1 μm. When the sheet resistance Rs of the spacer surface was measured, it was 3 × 10 ⁹ Ω.

(Step-j) Upper wiring 7b of rear plate 1
Is applied using a dispenser at a position where the spacers are to be disposed, in which 30 wt% of carbon powder (furnace black) having a particle size of 29 nm is mixed with respect to the resin concentration of Trenice # 3000 using a dispenser. The spacer 11 is temporarily fixed. At this time, a jig (not shown) was used so that the spacer 11 could be held substantially vertically. With the spacers temporarily fixed, 100
After pre-baking at 10 ° C for 10 minutes and removing the spacer holding jig, in a clean oven from room temperature to 300 ° C
Then, the temperature is raised to 300 ° C. for 1 hour to cure. Thereby, the spacer 11 can be fixed at a desired position on the rear plate 1.

(Step-k) The support frame 3 was disposed on the rear plate 1 on which the many spacers 11 were fixed as described above. At this time, the joint between the rear plate 1 and the support frame 3 is coated with frit glass in advance. The face plate 2 (configured by forming the fluorescent film 10 and the metal back 91 on the inner surface of the glass substrate 8) is disposed via the support frame 3 and the spacer 11, and the joint between the face plate 2 and the support frame 3 is provided. , And at the joint with the spacer 11,
Frit glass and carbon powder (furnace black) having a particle size of 29 nm mixed with 30 wt% with respect to the resin concentration of Trenice # 3000 are applied in advance. The rear plate 1, the support frame 3, and the face plate 2 that are bonded together are first kept in the air at 100 ° C. for 10 minutes, and then heated to 300 ° C.
C. for 1 hour, and further heated to 400.degree. C., and baked for 10 minutes to seal. At the time of sealing, in the case of color, since the phosphors of each color must correspond to the electron-emitting devices, sufficient alignment was performed.

The atmosphere in the glass container completed as described above was evacuated by a vacuum pump through an exhaust pipe, and after a sufficient degree of vacuum was reached, the forming process and the activation process were performed in the same manner as in Example 1. Do.

Next, after exhausting and sealing, getter processing is performed by a high-frequency heating method.

In the image display device completed as described above, an image was displayed by causing an electron beam to collide with the phosphor film 11 to excite and emit light, as in Example 1.

In the image forming apparatus of this embodiment, although the high voltage Va was increased to 15 kV, no discharge or leak current was observed, and an image with extremely high luminance and good color expression was stably obtained. In the image forming apparatus according to the present embodiment,
The spacer manufacturing process was simple, and the image forming apparatus could be configured at a relatively low cost.

[Embodiment 9] This embodiment is an example in which a spacer having the structure shown in FIG. 5 is formed.

In this example, the same steps as in the first example were performed up to (step-h).

(Step-i) In this example, a small piece of glass cut and polished to a size of 4 mm (height) × 40 mm (length) × 0.2 mm (width) was cleanly washed and then manufactured. The spacer was immersed in a wholly aromatic polyimide varnish: Treeneth # 3000 (manufactured by Toray Industries, Inc.) diluted 5-fold with N-methyl-2-pyrrolidone and then pulled up.
Further, a pre-bake is performed at 100 ° C. for 10 minutes, and the pre-bake is put in a clean oven, heated from room temperature to 300 ° C., and held at 300 ° C. for 1 hour to cure.
Further, the temperature was kept at 520 ° C. for 30 minutes. In the spacer 11 thus obtained, the organic resin was carbonized on the spacer base material. Finally, when the sheet resistance Rs of the spacer surface was measured, it was 5 × 10 ⁹ Ω / □. Further, the spacer 11 after the completion of this step was taken out of the vacuum chamber, and its cross-sectional shape was observed. As a result, as shown in FIG. 5A, a carbon layer and a polyimide resin layer were laminated. Here, the thickness of the carbon layer was about 270 nm, and the thickness of the polyimide resin layer was 300 nm. The initial thickness of the polyimide resin was 600 nm. From this, the decrease in film thickness due to carbonization of the polyimide resin is 10%.
%. Also, by measuring the oxygen and nitrogen contained in the carbon layer by Rutherford backscattering spectroscopy,
They were 12% and 5%, respectively, and there was no significant decrease from the raw material. Further, from observation by ESCA, it was found that the raw material was a thermally decomposed polymer. Further, both end surfaces of the spacer 11 connected to the face plate and the rear plate are:
The organic resin was further carbonized by laser irradiation to form an electrical contact layer.

(Step-j) Upper wiring 7b of rear plate 1
Using a dispenser, a mixture of natural graphite powder having a particle size of 100 nm and 30 wt% with respect to the resin concentration of PBI MR Solution is applied using a dispenser to the position where the spacer is to be disposed, and the spacer 11 formed in step-i is applied thereto. Is temporarily fixed. At this time, a jig (not shown) was used to hold the spacer 11 substantially vertically. While the spacer 11 is temporarily fixed, prebaking is performed at 100 ° C. for 10 minutes on a hot plate, and after removing the spacer holding jig, the temperature is raised from room temperature to 200 ° C. in a clean oven, and the temperature is set at 200 ° C. for 30 minutes. After the holding, the temperature is further raised to 300 ° C., and the holding is performed for 1 hour to cure.
Thereby, the spacer 11 can be fixed at a desired position on the rear plate 1.

(Step-k) The support frame 3 is disposed on the rear plate 1 on which the many spacers 11 are fixed as described above. At this time, the joint between the rear plate 1 and the support frame 3 is coated with frit glass in advance. The face plate 2 (formed by forming the phosphor film 10 and the metal back 91 on the inner surface of the glass substrate 8) is disposed via the support frame 3 and the spacer 11. The frit glass and natural graphite powder having a particle size of 100 nm mixed with 30 wt% with respect to the resin concentration of the PBI MR Solution are applied to the portion and the joint portion with the spacer 11 in advance. The rear plate 1, the support frame 3, and the face plate 2 are bonded together,
C., held at 10 ° C. for 10 minutes, heated to 200 ° C., held at 200 ° C. for 30 minutes, then further heated to 300 ° C., held for 1 hour, further heated to 400 ° C., and baked for 10 minutes To seal. At the time of sealing, in the case of color, since the phosphors of each color must correspond to the electron-emitting devices, sufficient alignment was performed.

The atmosphere in the glass container completed as described above was evacuated by a vacuum pump through an exhaust pipe, and after a sufficient degree of vacuum was reached, a forming process and an activation process were performed in the same manner as in Example 1. Do.

Next, after exhausting and sealing, getter processing is performed by a high-frequency heating method.

In the image display device of the present invention completed as described above, the electron beam is applied to the phosphor film 1 as in the first embodiment.
An image can be displayed by colliding with 0 and causing excitation and light emission.

In the image forming apparatus of this embodiment, the high voltage Va was increased to 17 kV, but no discharge or leakage current other than the current value associated with the resistance value of the spacer and the anode voltage was observed. An image with good color expression was obtained stably. This is presumed to be due to the fact that carbon with low secondary electron emission efficiency was used, so that the discharge withstand voltage was increased and charging was suppressed. Further, in the image forming apparatus of this embodiment, the spacer manufacturing process was simple, and the image forming apparatus could be configured at a relatively low cost.

[Embodiment 10] In this embodiment, (Process-
Until h), the same steps as in the first embodiment were performed.

Next, the manufacture of the spacer 11 in this embodiment will be described. The structure of the spacer is such that the carbon layer 52 and the resin layer 5 are formed on the spacer base material 31 shown in FIG.
No. 1 is a spacer 11 laminated thereon. However, a glass fiber reinforced polyimide resin (trade name: A
URUM JGM3030, manufactured by Mitsui Toatsu Chemicals, Inc., by injection molding method, 4 mm (height) × 40 mm (length) ×
What processed to 0.2 mm (width) was used.

(Step-i) A glass fiber reinforced polyimide resin (trade name: AURUM JGM3030, manufactured by Mitsui Toatsu Chemicals) was injection-molded by 4 mm (height) × 40 m.
m (length) x 0.2 mm (width), spin-coated with a wholly aromatic polyimide varnish: Torayness # 3000 (manufactured by Toray Industries, Inc.) diluted twice with N-methyl-2-pyrrolidone I do. Spin coating is
First, spin-coat on one side (4 mm x 40 mm side)
After pre-baking at 100 ° C. for 10 minutes on a hot plate and spin-coating the other surface, pre-baking is performed again at 100 ° C. for 10 minutes on a hot plate. Put this in a clean oven,
The temperature is raised to 00 ° C., and the temperature is maintained at 300 ° C. for 1 hour to cure. The thickness of the polyimide resin thus obtained is about 1
μm. Further, a spacer 1 is placed in a vacuum chamber.
1 is set, and electron density is 10 ¹⁵ electrons by electron gun.
The polyimide resin laminated on the spacer 11 was evenly irradiated with an electron beam accelerated to 50 V at a rate of / cm ² . Finally, when the sheet resistance Rs of the spacer surface was measured, it was 10 ¹⁰ Ω.

Further, the spacer 11 after this step was taken out of the vacuum chamber and its cross-sectional shape was observed. As shown in FIG. 5 (b), the polyimide resin layer 51 and the carbon 52 were laminated. In this case, the carbon layer 52 had a state in which a point-like concave portion 54 was formed partially on the surface of the polyimide resin 51, and graphite fine particles 55 were dispersed.
Here, prior to the above-mentioned electron beam irradiation conditions, as a preliminary test, the effect of the density and acceleration energy of the electron beam on carbonization of the polyimide resin was examined.

According to this, it was found that changing the acceleration energy and current density of the electron beam changed the thickness of the carbon layer. That is, the thickness of the carbon layer increased when the acceleration energy or electron density of the electron beam increased, and decreased when the acceleration energy and electron density of the electron beam increased. Here, in order to obtain a high-resistance surface resistance, it was manufactured under the above-described conditions for reducing the electron density and forming conductive carbon fine particles on the outermost surface layer.

[0286] Both ends of the spacer connected to the face plate and the rear plate were further irradiated with a laser to further carbonize the organic resin to form an electrical contact layer.

(Step j) and subsequent steps were performed in the same manner as in Example 9 to complete an image forming apparatus.

In the image display device completed as described above, an image was displayed by causing an electron beam to collide with the phosphor film 10 to excite and emit light, as in Example 1.

In the image forming apparatus of this embodiment, the high voltage Va was increased to 17 kV, but no discharge or leakage current other than the current value associated with the resistance value of the spacer 11 and the anode voltage was observed, and extremely high luminance was obtained. As a result, an image with good color expression was stably obtained.

[Embodiment 11] In this embodiment, a catalytic metal is formed in a desired pattern, and a spacer having the structure shown in FIG. 7 (c) is formed selectively and partially on a carbon layer. .

In this embodiment, the same steps as in the first embodiment were performed up to (step-h).

(Step-i) In this example, a small piece of glass cut and polished to a size of 4 mm (height) × 40 mm (length) × 0.2 mm (width) was cleanly washed and then manufactured. Polybenzimidazole varnish for spacer substrate:
PBI MR Solution (Toray) to N, N
-After immersion in a two-fold dilution with dimethylacetamide, it was lifted. Further, in a heating furnace, at 100 ° C., 2
Precuring was performed for 0 minutes to remove the solvent. This step was repeated. This was placed in a clean oven in a nitrogen atmosphere, heated from room temperature to 200 ° C., kept at 200 ° C. for 30 minutes, then heated to 300 ° C., and kept for 1 hour to cure.

The nickel formate solution was applied onto the organic resin of the spacer 11 thus manufactured by the ink jet method using the ink jet head shown in FIG. 18 so as to correspond to the pitch P = 70 μm and the width q of the concave bottom surface q = 50 μm in FIG. As a result, a belt-shaped nickel metal fine particle layer was formed on both surfaces of the spacer base material 31 by applying a band shape with a width of 50 μm and further baking in a nitrogen gas at 350 ° C. for 30 minutes to decompose nickel formate.

Here, an example of an ink jet head will be described with reference to FIG. In the figure, 21 is a head main body, 22 is a heater or a piezo element for applying a signal current through external wiring, 23 is an ink flow path which is instantly heated by the heater or the piezo element 22 in the flow path, and 24 is a spacer of the spacer 11. A nozzle for discharging the nickel formate solution onto the organic resin, and 25 is an ink supply pipe having an ink tank on the upper side to supply the solution. Although the number of nozzles is not limited, a fine form can be formed by discharging a fine band-like solution to the spacer 11.

Further, it was kept at 470 ° C. for 30 minutes in an infrared heating furnace. The spacer 11 thus obtained was carbonized where nickel formate was applied, and had a configuration in which a strip-shaped carbon layer 52 and a polybenzimidazole resin layer 51 were alternately repeated at 50 μm and 20 μm, respectively. The thickness of the polybenzimidazole resin layer is about 1
0 μm and the thickness of the carbon layer was 8 μm. Also, a small amount of the polybenzimidazole resin remained between the carbon layer and the spacer substrate. When the carbon layer was observed by micro-Raman spectroscopy, mainly a graphite peak was detected.

(Step-j) The subsequent steps were performed in the same manner as in Example 9 to complete the image forming apparatus.

In the image display device completed as described above, an image was displayed by causing the electron beam to collide with the phosphor film 10 to excite and emit light, as in Example 1.

In the image forming apparatus of this embodiment, although the high voltage Va was increased to 21 kV, no discharge or leakage current was observed, and an image with extremely high luminance and good color expression was stably obtained. This is presumed to be due to the fact that the creepage distance increased due to the formation of the concavo-convex layer and the concave surface became the carbon layer, so that the secondary electron emission efficiency substantially approached 1 and the discharge breakdown voltage increased. Also, when q> P / 2, P <200 μ
m, the deviation of the beam trajectory due to charging was also suppressed. Further, in the image forming apparatus of this embodiment, the spacer manufacturing process was simple, and the image forming apparatus could be configured at a relatively low cost.

[Embodiment 12] This embodiment is an example in which a catalytic metal is formed in a desired pattern, and a spacer having the structure shown in FIG. 7B in which a carbon layer is selectively and partially formed. .

In this example, the same steps as in the first example were performed up to (step-h).

(Step-i) In this example, a small piece of glass cut and polished to a size of 4 mm (height) × 40 mm (length) × 0.2 mm (width) was cleanly washed and then manufactured. The nickel formate solution is applied to the spacer substrate as shown in FIG.
The pitch P of FIG. 6 is 70 μm and the width q of the concave bottom surface is q = 5 by the inkjet method using the inkjet head shown in FIG.
After giving a band shape with a width of 50 μm so as to correspond to 0 μm, it was baked at 350 ° C. in a nitrogen atmosphere. Next, polybenzimidazole varnish: PBI MR Soluti
on (manufactured by Toray Industries, Inc.) with N, N-dimethylacetamide
After being immersed in the dilution twice, it was raised. Furthermore,
Precuring was performed at 100 ° C. for 20 minutes in a heating furnace to remove the solvent. This step was repeated. This is put in a clean oven in a nitrogen atmosphere,
Temperature, and kept at 200 ° C for 30 minutes.
And cured for 1 hour. A nickel formate solution was applied in a strip shape with a width of 50 μm on the organic resin of the spacer thus formed on the base of the spacer so as to correspond to the applied nickel metal fine particles. After baking for minutes, the nickel formate was decomposed to form strip-shaped nickel metal fine particle layers on both surfaces of the spacer substrate 31. Further, it was kept at 470 ° C. for 30 minutes in an infrared heating furnace. The spacer 11 thus obtained was carbonized where nickel formate was applied, and had a configuration in which a strip-shaped carbon layer 52 and a polybenzimidazole resin layer 51 were alternately repeated at 50 μm and 20 μm, respectively. The thickness of the polybenzimidazole resin layer was about 10 μm, and the thickness of the carbon layer was 7 μm. Also,
There was no polybenzimidazole resin between the carbon layer 52 and the spacer substrate 31.

(Step-j) Subsequent steps were performed in the same manner as in Example 10, to complete the image forming apparatus.

In the image display device completed as described above, an image was displayed by causing an electron beam to collide with the phosphor film 10 to excite and emit light, as in Example 1.

In the image forming apparatus of this embodiment, although the high voltage Va was increased to 21 kV, no discharge or leak current was observed, and an image with very high luminance and good color expression was stably obtained. This is presumed to be due to the fact that the creepage distance increased due to the formation of the concavo-convex layer and that the concave surface became the carbon layer, so that the secondary electron emission efficiency substantially approached 1 and the discharge breakdown voltage increased.

Example 13 In this example, a catalytic metal was formed in a desired pattern, a carbon layer was selectively and partially formed, and a carbon layer was formed on the convex surface of the resin layer. 7 is an example in which a spacer having the configuration of FIG. 6 is formed.

In this embodiment, the same steps as in the eleventh embodiment were performed except for the step-i. Step-i will be described in detail.

(Step-i) In this embodiment, 4 mm (high
Cutting and grinding to length) x 40mm (length) x 0.2mm (width)
After cleaning small pieces of polished glass, nickel formate
Use the inkjet head shown in FIG. 18 for the aqueous solution
Pitch of FIG. 6 = 180 μm by ink jet method, concave surface
100 μm width so as to correspond to the bottom width q = 150 μm of
m in a band shape, and further, at 350 ° C., 30
Baking for 5 minutes to decompose nickel formate
Metallic fine particle layers were formed on both surfaces of the spacer substrate. In this way
The prepared spacer is polybenzimidazole varnish:
PBI MR Solution (Toray) to N, N
-Soak in 2x dilution with dimethylacetamide
And then raised. Further, in a heating furnace, at 100 ° C., 2
Precuring was performed for 0 minutes to remove the solvent. This process
Was repeated. This is a clean oven in a nitrogen atmosphere
And raise the temperature from room temperature to 200 ° C.
After holding for 30 minutes, raise the temperature to 300 ° C. and hold for 1 hour
It was cured and kept at 470 ° C. for 30 minutes. like this
Strip-shaped carbon layer 52 and polybenzimidazo
The resin layers 51 are alternately repeated.
The sensor in the vacuum chamber as in Example 10.
And the electron beam density of 10^Fifteenelectrons
/ Cm ^TwoIrradiates the entire spacer with an acceleration energy of 40 V
As a result, the convex polybenzimidazole resin layer 51 was formed.
The surface was thin and carbonization occurred. Also face spray
Both ends of the spacer connected to the
Pt metal was formed to serve as an electrical contact layer.

The strip-shaped carbon layer 52 and polybenzimidazole resin layer 51 thus obtained are each 80 μm thick.
The spacers alternately repeated m and 100 μm had a polybenzimidazole resin layer thickness of about 10 μm and a carbon layer thickness of 8 μm, which were almost the same as in Example 12. When the sheet resistance Rs of the spacer surface was measured, it was 5 × 10 ⁹ Ω.

(Step-j) and the following steps were performed in the same manner as in Example 9 to complete the image forming apparatus.

[0310] In the image display device completed as described above, the electron beam is made to collide with the fluorescent film in the same manner as in the first embodiment.
An image was displayed by excitation and light emission.

In the image forming apparatus of this embodiment, the high voltage Va was raised to 21 kV, but no discharge or leakage current other than the current value associated with the resistance value of the spacer and the anode voltage was observed. An image with good color expression was obtained stably. This is presumed to be due to the fact that the creepage distance increased due to the formation of the concavo-convex layer and that the concave surface became the carbon layer, so that the secondary electron emission efficiency substantially approached 1 and the discharge breakdown voltage increased.

Example 14 In this example, a catalytic metal was formed in a desired pattern, a carbon layer was selectively and partially formed, and a carbon layer was also formed on the convex surface of the resin layer. 7 is an example in which a spacer having the structure of FIG. 6 is formed.

In this example, the same steps as in the eleventh example were performed except for step-i. Step-i will be described in detail.

(Step-i) In this example, a small piece of glass cut and polished to a size of 4 mm (height) × 40 mm (length) × 0.2 mm (width) was cleaned and then washed with a nickel formate solution. In the ink-jet method using the ink-jet head shown in FIG. 18, a band is applied in a width of 50 μm so as to correspond to the pitch P = 70 μm and the width q of the bottom of the concave surface in FIG. The resultant was baked at 30 ° C. for 30 minutes to decompose nickel formate to form strip-shaped nickel metal fine particle layers on both surfaces of the spacer substrate. The spacer produced in this manner was replaced with a polybenzimidazole varnish: PBI
MR Solution (manufactured by Toray Industries, Inc.) was immersed in a two-fold dilution with N, N-dimethylacetamide, and then pulled up. Further, in a heating furnace, precure was performed at 100 ° C. for 20 minutes to remove the solvent. This step was repeated to obtain an organic resin layer of 10 μt. This is put in a clean oven in a nitrogen atmosphere.
After heating at 200 ° C. for 30 minutes, the temperature was raised to 300 ° C., and the temperature was held for 1 hour to cure, and then 470 ° C.
For 30 minutes.

A spacer in which the strip-shaped carbon layer 52 and the polybenzimidazole resin layer 51 thus obtained are alternately repeated is placed in a vacuum chamber in the same manner as in the ninth embodiment. Density 10 ¹⁸ electr
The carbon layer of the spacer was irradiated with ons / cm ^{2 at} an acceleration energy of 50V. Further, an electron beam density of 1S10
The entire surface of the spacer was irradiated with ¹⁴ electrons / cm ² and an acceleration energy of 40V. Further, both end surfaces of the spacer connected to the face plate and the rear plate were further carbonized by an organic beam by irradiation with an electron beam to form an electrical contact layer.

The strip-shaped carbon layer 52 and the polybenzimidazole resin layer 51 thus obtained were each 50 μm thick.
In the spacer 11 alternately repeated to m and 20 μm, the thickness of the polybenzimidazole resin layer was about 10 μm, and the thickness of the carbon layer was 2 μm.

Further, when the sheet resistance Rs of the spacer surface was measured, it was 6 × 10 ⁹ Ω.

[0318] The steps after (step-j) were performed in the same manner as in Example 9 to complete the image forming apparatus.

In the image display device completed as described above, an image was displayed by causing an electron beam to collide with the phosphor film 10 to excite and emit light, as in Example 1.

In the image forming apparatus of this embodiment, the high voltage Va was increased to 25 kV, but no discharge or leakage current other than the current value associated with the resistance value of the spacer and the anode voltage was observed. An image with good color expression was obtained stably. This is presumably because the creepage distance increased and the concave surface became a carbon layer, so that the secondary electron emission efficiency substantially approached 1 and the discharge breakdown voltage increased.

[Embodiment 15] In this embodiment, a field emission device which is a kind of cold cathode electron emission device was used as the electron emission device. The spacer is an image forming apparatus using a glass rod as a base material. First, FIG.
This will be described with reference to FIG. FIG.
(A) is sectional drawing. In FIG. 12, 1201 is a rear plate, 1202 is a face plate, 1203
Is a cathode, 1204 is a gate electrode, 1205 is an insulating layer between the gate electrode and the cathode, 1206 is a converging electrode, 1207 is a two-layer body of a phosphor on the face plate side 1202 and a metal back on the cathode 1203 side, and 1208 is a converging electrode 1206
, An insulating layer between the gate electrode 1204, 1209 a cathode wiring, 1211 a spacer, 1212 a spacer 1211
Reference numeral 1213 denotes an organic resin layer, 1214 denotes a carbon layer, and 1215 denotes a contact layer.

FIG. 12B is a plan view of the rear plate 1201 of FIG. In the plan view, an insulating layer 1205, a focusing electrode 1206, and an insulating layer 1208 between the gate electrode 1204 and the cathode 1203 are omitted for simplification.

The field emission element formed at the tip of the cathode 1203 is a device in which a large electric field is applied between the tip of the cathode 1203 and the gate electrode 1204, and emits electrons from the tip of the cathode 1203. The gate electrode 1204 has an electron passage port 12 so that electrons emitted from a plurality of cathodes can pass therethrough.
16 are provided. Further, the electrons passing through the gate electrode port 1216 are converged by the converging electrode 1206,
The light is accelerated by an electric field of an anode 1207 provided on a face plate 1202, and collides with a picture element of a phosphor corresponding to a cathode to perform light emission display. In addition, a plurality of gate electrodes 1
The cathode 204 and the plurality of cathode wirings 1209 are arranged in a simple matrix, and a corresponding cathode is selected by an input signal, and electrons are emitted from the selected cathode.

[0324] The size of the effective display area of the image forming apparatus is 10 inches on a diagonal with an aspect ratio of 3: 4. The gap between the rear plate 1201 and the face plate 1202 is 2.0 mm.

Next, a method for manufacturing the image forming apparatus of the present invention will be described.

[Preparation of Replate] (Step-1) The cathode, gate electrode, wiring, etc. shown in FIG. 12 were prepared by a known method using blue sheet glass as a substrate.
The cathode material was Mo.

(Step-2) Frit glass for fixing the support frame was formed at a desired position by printing.

By the above steps, the rear plate 1201
A field emission type electron-emitting device having a simple matrix wiring was formed.

[Preparation of Face Plate] (Step-3) A transparent conductor, a phosphor and a black conductor were formed on a blue glass substrate by a printing method. A smoothing treatment was performed on the inner surface of the fluorescent film, and thereafter, Al was deposited using vacuum evaporation or the like to form a metal back. Through the steps described above, phosphors of three primary colors were arranged on the face plate to form a striped phosphor.

[Preparation of Spacer] (Step-4) A glass rod of 50 μφ, 30 cm was cleanly washed, and an aqueous solution of nickel formate was applied by an ink jet method.
The pitch P of FIG. 6 is 70 μm, and the width q of the bottom of the concave surface is 50 μm.
While rotating the glass rod to correspond to m, width 50μ
m, a plurality of strips are applied, and then 350
The mixture was baked at 30 ° C. for 30 minutes to decompose nickel formate to form a strip-shaped nickel metal fine particle layer on a glass rod as a spacer substrate. The spacer thus produced was immersed in a polybenzimidazole varnish: PBI MR Solution (manufactured by Toray Industries, Inc.) diluted twice with N, N-dimethylacetamide, and then pulled up. Furthermore, in a heating furnace,
Precuring was performed at 100 ° C. for 20 minutes to remove the solvent. This step was repeated to obtain a desired thickness of the organic resin layer. This was put in a clean oven in a nitrogen atmosphere, heated from room temperature to 200 ° C., kept at 200 ° C. for 30 minutes, then heated to 300 ° C., kept for 1 hour, cured, and further heated at 470 ° C. C. for 30 minutes.

The strip-like carbon layer 52 and the polybenzimidazole resin layer 51 thus obtained are each provided with a bar-like spacer which is alternately repeated in a vacuum chamber, and the electron beam density is 10 ¹⁸ electrons / c by an electron gun.
The carbon layer of the spacer was irradiated with m ² and acceleration energy of 50V. Furthermore, the electron beam density is 10 ¹⁴ electrons by the electron gun.
The entire surface of the spacer was irradiated at an acceleration energy of 40 V / cm ² .

[0332] The band-shaped carbon layer and the polybenzimidazole resin layer thus obtained were respectively 50 µm and 20 µm thick.
The spacer 11 alternately repeated m has a thickness of the polybenzimidazole resin layer of 10 μm and a thickness of the carbon layer of
It was 2 μm.

[0333] Next, the glass rod thus created was placed 2 m away.
m. Furthermore, both end surfaces of the spacer 11 connected to the face plate 2 and the rear plate 1
Pt metal was formed to serve as an electrical contact layer.

When the sheet resistance Rs of the surface of the spacer thus prepared was measured, it was 3 × 10 ⁹ Ω.

(Step-5) Next, carbon powder (furnace black) having a particle size of 29 nm mixed at 30 wt% with respect to the resin concentration of Trenice # 3000 at a position where the spacer of the face plate is to be disposed using a dispenser. The spacer 11 formed by the process-4 is temporarily fixed thereon. At this time, a jig (not shown) was used so that the spacer could be held substantially vertically. 100 ° C. on a hot plate with the spacer 11 temporarily fixed
After pre-baking for 10 minutes and removing the spacer holding jig, the temperature is raised from room temperature to 300 ° C. in a clean oven, held at 300 ° C. for 1 hour, and cured. Thereby, the spacer 11 can be fixed at a desired position on the face plate. The support frame is bonded to the face plate on which a number of spacers are fixed as described above.

Next, the spacer 11 thus formed, the face plate 2 to which the support frame 3 is bonded, and the rear plate 1 are pressure-bonded to be sealed. At the time of sealing, in the case of color, since the phosphors of each color must correspond to the electron-emitting devices, sufficient alignment was performed.

(Step-6) The atmosphere in the container completed as described above is exhausted by a vacuum pump through an exhaust pipe (not shown), and after a sufficient degree of vacuum is reached, the atmosphere is heated at 250 ° C. for 3 hours. Baking was performed while exhausting air.

(Step-7) Next, at room temperature, the air was evacuated to a degree of vacuum of about 10 −8 torr, and an exhaust pipe (not shown) was welded by heating with a gas burner to seal the envelope. went.

Finally, in order to maintain the degree of vacuum after sealing,
Getter treatment was performed by a high-frequency heating method.

In the image display device completed as described above, the electron beam was made to collide with the fluorescent film in the same manner as in the first embodiment.
An image was displayed by excitation and light emission.

In the image forming apparatus of the present embodiment, the high voltage Va was increased to 13 kV, but no discharge or leakage current other than the current value associated with the resistance value of the spacer and the anode voltage was observed. An image with good color expression was obtained stably. This is presumed to be due to the fact that the creepage distance increased due to the formation of the concavo-convex layer and the concave surface became the carbon layer, so that the secondary electron emission efficiency substantially approached 1 and the discharge breakdown voltage increased.

[Embodiment 16] In this embodiment, Embodiment 5 and Embodiment 5 will be described.
The spacers 8 and 11 are formed by changing the shape of the spacers. The manufacturing method of each step is the same as that of each example.

In the image forming apparatus, the pixel size is
For color display having three primary colors of red, blue and green, 15
An image forming apparatus having an effective image display area of 125 mm square was created with 0 μm × 3 (R, G, B) × 450 μm. The size of the spacer substrate in this embodiment is 3 mm
(Height) × 140 mm (length) × 0.1 mm (width).

In this embodiment, the same steps as those in each embodiment are performed up to (step-i), and a description thereof will be omitted.

FIG. 1 shows the creation of the image forming apparatus after step-j.
6 will be described. FIG. 16 is a sectional view of the image forming apparatus of FIG. 161 is a spacer adhesive, 162
Is frit glass. 16, FIG. 1, 2, 8,
The same parts as those shown in FIG.
A duplicate description will be omitted. 161 is a spacer adhesive, and 162 is frit glass.

(Step-j) Rear plate 1 after (step-j-1) (step-h)
At the position where the spacers are arranged on the upper wiring 7b,
0 nm natural graphite powder was prepared using PBI MRSolu
The mixture containing 30 wt% of the ionic resin was applied using a dispenser.

(Step-j-2) The spacer 11 formed in step-i is temporarily fixed on the PBI resin 161. At this time, a jig (not shown) was used to hold the spacer 11 substantially vertically. While the spacers are temporarily fixed, pre-baking is performed at 100 ° C for 10 minutes on a hot plate, and after removing the spacer holding jig, the temperature is raised from room temperature to 200 ° C in a clean oven and held at 200 ° C for 30 minutes. After that, the temperature is further raised to 300 ° C., and the temperature is maintained for one hour to cure. Thereby, the spacer 11 can be fixed at a desired position on the rear plate 1.

(Step-k) (Step-k-1) As described above, a large number of spacers 11
The support frame 3 is arranged on the rear plate 1 to which is fixed. At this time, a frit glass 162 is applied to the joint between the rear plate 1 and the support frame 3 in advance. The face plate 2 (formed by forming the fluorescent film 10 and the metal back 91 on the inner surface of the glass substrate 8) is disposed via the support frame 3 and the spacer 11. The frit glass 162 and a natural graphite powder having a particle size of 100 nm mixed with 30 wt% with respect to the resin concentration of the PBI MR Solution are applied to the joint portion with the spacer 11 in advance.

(Step-k-2) The rear plate 1, the support frame 3, and the face plate 2 were attached to each other, first kept at 100 ° C. for 10 minutes in the air, heated to 200 ° C., and then heated to 200 ° C. After holding for 30 minutes, the temperature was further raised to 300 ° C., held for 1 hour, and further raised to 400 ° C.
It seals by baking for 10 minutes. At the time of sealing, in the case of color, since the phosphors of each color must correspond to the electron-emitting devices, sufficient alignment was performed.

The atmosphere in the glass container completed as described above was exhausted by a vacuum pump through an exhaust pipe, and after a sufficient degree of vacuum was reached, the forming process and the activation process were performed in the same manner as in Example 1. Do.

Next, after exhausting and sealing, getter processing is performed by a high-frequency heating method.

A configuration example of a driving circuit for performing television display based on an NTSC television signal in the image display device of the present invention completed as described above will be described with reference to FIG.

In FIG. 17, 171 is an image display panel, 172 is a scanning circuit, 173 is a control circuit, and 174 is a shift register. 175 is a line memory, 176 is a synchronization signal separation circuit, 177 is a modulation signal generator, and Vx and Va are DC voltage sources.

The display panel 171 has terminals Dox1 to Dox1
m, terminals Doy1 to Doyn, and a high voltage terminal Hv. Terminals Dox1 to Doxm
Has an electron source provided in the display panel, that is, M
A scanning signal is applied to sequentially drive the surface conduction electron-emitting device groups arranged in a matrix of N rows and N columns, one row at a time (N elements).

To the terminals Doy1 to Doyn, a modulation signal for controlling the output electron beam of each element of the surface conduction electron-emitting device in one row selected by the scanning signal is applied. The high-voltage terminal Hv is connected to the DC voltage source Va, for example, by one.
A DC voltage of 0 kV is supplied, which is an accelerating voltage for applying sufficient energy to the electron beam emitted from the surface conduction electron-emitting device to excite the phosphor.

The following describes the scanning circuit 172. This circuit includes M switching elements inside (in the figure, schematically shown by Sl to Sm). Each switching element selects either the output voltage of the DC voltage source Vx or 0 [V] (ground level),
It is electrically connected to the terminals Dox1 to Doxm of the display panel 171. Each of the switching elements S1 to Sm operates based on the control signal Tscan output from the control circuit 173, and can be configured by combining switching elements such as FETs, for example.

In the case of the present embodiment, the DC voltage source Vx uses a drive voltage applied to an unscanned element based on the characteristics (electron emission threshold voltage) of the surface conduction electron-emitting element. It is set so as to output a constant voltage lower than the voltage.

[0358] The control circuit 173 has a function of matching the operation of each unit so that appropriate display is performed based on an image signal input from the outside. The control circuit 173 generates control signals Tscan, Tsft and Tmry for each unit based on the synchronization signal Tsync sent from the synchronization signal separation circuit 176.

The synchronizing signal separating circuit 176 is a circuit for separating a synchronizing signal component and a luminance signal component from an NTSC television signal input from the outside, and is configured using a general frequency separating (filter) circuit or the like. it can. The synchronizing signal separated by the synchronizing signal separating circuit 176 includes a vertical synchronizing signal and a horizontal synchronizing signal.
This is shown as a sync signal. The luminance signal component of the image separated from the television signal is referred to as a DATA signal for convenience.
The DATA signal is input to the shift register 174.

The shift register 174 is for serially / parallel converting the DATA signal input serially in time series for each line of an image, and is based on a control signal Tsft sent from the control circuit 173. (Ie, the control signal Tsft is supplied to the shift register 17)
4 shift clocks. ). The data for one line of the serial / parallel-converted image (corresponding to the drive data for N electron-emitting devices) is Id1
The output signal is outputted from the shift register 174 as N parallel signals of Idn to Idn.

The line memory 175 is a storage device for storing data of one line of an image for a required time only, and stores the contents of Id1 to Idn as appropriate according to a control signal Tmry sent from the control circuit 173. The stored contents are output as I'd1 to I'dn and input to the modulation signal generator 177.

The modulation signal generator 177 outputs the image data I '
dl to I'dn are signal sources for appropriately driving and modulating each of the surface conduction electron-emitting devices in accordance with each of dl to I'dn. Applied to the emitting element.

Here, modulation was performed by the pulse width modulation method. When implementing the pulse width modulation method, the modulation signal generator 177 generates a voltage pulse having a constant peak value and modulates the width of the voltage pulse appropriately according to input data. A circuit can be used.

The shift register 174 and the line memory 17
5 can be a digital signal type or an analog signal type. This is because the serial / parallel conversion and storage of the image signal may be performed at a predetermined speed. For example, although the line memory 175 is an analog memory in this example, if it is a digital line memory, an A / D converter may be provided in a stage preceding the shift register 174 or the synchronization signal separation circuit 176.

With such a driving circuit, external terminals Dox1 to Doxm, Doy, Doy are connected to the electron-emitting devices of the display panel.
By applying a voltage through 1 to Doyn, electron emission occurs. Metal back 14 via high voltage terminal Hv
A high pressure is applied to 9 to accelerate the electron beam. The accelerated electrons collide with the fluorescent film 148 and emit light to form an image.

When an NTSC signal was input to the image forming apparatus of the present invention completed as described above, a television image was displayed in any of the image forming apparatuses. In the present embodiment, the video signal of the NTSC signal is used. However, the PAL, SECAM signal, and the Hi-Vision signal are also scanned and driven at a high voltage with a high speed.
A high-luminance image can be obtained.

In any of the image forming apparatuses of the present embodiment, no discharge or leakage current is observed until the high voltage Va is up to 10 kV. In the image forming apparatus having the same spacer as that of the eighth embodiment at 15 kV, Although some discharge occurred, in the image forming apparatus having the same spacers as in Examples 5 and 11, no discharge or leak current was observed, and an image with extremely high luminance and good color expression was stably obtained. Also, no influence of charging was observed. As described above, in the image forming apparatus of the present embodiment, the spacer manufacturing process was simple, and the image forming apparatus could be configured at a relatively low cost.

[0368]

As described above, according to the image forming apparatus of the present invention, it is possible to provide an image forming apparatus capable of holding a good image having high luminance and high color purity for a long time, and to provide a high quality flat plate type. An image forming apparatus can be provided.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram illustrating an example of an image forming apparatus of the present invention.

FIG. 2 is a cross-sectional view illustrating an example of the image forming apparatus of the present invention.

FIG. 3 is a schematic sectional view of a spacer used in the image forming apparatus of the present invention.

FIG. 4 is a sectional view of a spacer that can be used in the image forming apparatus of the present invention.

FIG. 5 is a spacer diagram used in the image forming apparatus of the present invention.

FIG. 6 is a spacer diagram used in the image forming apparatus of the present invention.

FIG. 7 is a spacer diagram used in the image forming apparatus of the present invention.

FIG. 8 is a schematic view of a surface conduction electron-emitting device that can be used in the image forming apparatus of the present invention.

FIG. 9 is a cross-sectional view of a flat-type electron beam display panel of the present invention.

FIG. 10 is a process chart for producing an electron source using the surface conduction electron-emitting device produced in the example of the present invention.

FIG. 11 is a process chart for producing an electron source using the surface conduction electron-emitting device produced in the example of the present invention.

FIG. 12A is a cross-sectional view of an image forming apparatus using a field emission device according to Embodiment 15 of the present invention. b: A plan view of a rear plate of an image forming apparatus using the field emission device according to Embodiment 15 of the present invention.

FIG. 13 is a diagram illustrating a spacer according to the present invention.

FIG. 14 is an explanatory diagram of a conventional image forming apparatus.

FIG. 15 is an explanatory diagram of a conventional image forming apparatus.

FIG. 16 is an explanatory diagram of the method for manufacturing the image forming apparatus of the present invention.

FIG. 17 is a drive block diagram as an example of the image forming apparatus of the present invention.

FIG. 18 is an external view of an ink jet type head used in the present invention.

[Explanation of symbols]

 1, 141, 1201 Rear plate 2, 142, 1202 Face plate 3, 143 Support frame or outer frame 4, 144 Electron source substrate 5, 82, 145 Electron emission element 6 Element electrode 7, 146 Wiring electrode 8, 148 Glass substrate 9 , 149 Transparent electrode 10, 150 Phosphor film 11, 151, 1211 Spacer 31, 1212 Spacer base material 32 Surface coat layer 41 Carbon particles 42 Resin 51 Resin layer 52 Carbon layer 53 Ohmic contact layer 81 Conductive thin film 83 Insulating layer 91 Metal Back 101 Contact hole 111 Cr film 161 PBI resin 162 Frit glass 171 Image display panel 172 Scanning circuit 173 Control circuit 174 Shift register 175 Line memory 176 Synchronous signal separation circuit 177 Modulation signal generator 1201 Substrate 1203 Cathode 1204 Gate electrode 1205 Insulating layer 1206 Focusing electrode 1207 Two-layer body of phosphor and metal back 1208 Insulating layer 1209 Cathode wiring 1213 Organic resin layer 1214 Carbon layer 1215 Contact layer 1216 Electron passage

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Toyoko Kobayashi 3-30-2 Shimomaruko, Ota-ku, Tokyo Within Canon Inc. (72) Inventor Tomitsu Ikeda 3-30-2 Shimomaruko, Ota-ku, Tokyo Non-corporation F term (reference) 5C028 AA10 5C032 AA01 CC10 CD05 5C036 EE09 EF01 EF06 EG02 EG50

Claims (62)

[Claims] 1. A rear plate on which an electron-emitting device is disposed, a face plate having an image forming member and disposed opposite to the rear plate, and a spacer disposed between the face plate and the rear plate Wherein the spacer has a spacer base material coated with an organic resin and carbon, and has the carbon on the surface of the spacer, and the carbon serves as a carbon layer. An image forming apparatus comprising an organic resin surface to be coated. 2. The image forming apparatus according to claim 1, wherein the carbon layer is a pyrolytic polymer of the organic resin. 3. The image forming apparatus according to claim 1, wherein the carbon layer is made of carbon fine particles arranged in dot-shaped concave portions formed on the surface of the organic resin. 4. The image forming apparatus according to claim 3, wherein the carbon fine particles are made of graphite, amorphous carbon, or a mixture thereof. 5. The image forming apparatus according to claim 1, wherein the carbon layer covers a part of an organic resin surface covering the spacer base material. 6. The image forming apparatus according to claim 5, wherein the carbon layer is formed in a belt shape. 7. The image forming apparatus according to claim 6, wherein a plurality of bands of the carbon layer are formed substantially parallel to the plate. 8. The organic resin according to claim 7, wherein the organic resin has a plurality of irregularities substantially parallel to the plate, and the band of the carbon layer is formed in a concave portion of the organic resin. An image forming apparatus according to claim 1. 9. When the pitch between the convex portions of the organic resin is P and the width of the bottom surface of the concave portion with respect to the plate plane of the band of the carbon layer is q, q ≧ P / 2. The image forming apparatus according to claim 8, wherein a relational expression is satisfied. 10. The depth t of the concave portion of the organic resin covering the spacer base material is t ≧ 0.2q (q is the width of the bottom surface of the concave portion).
The image forming apparatus according to claim 8, wherein a relational expression represented by the following expression is satisfied. 11. The image forming apparatus according to claim 8, wherein a thickness of the carbon layer formed in the concave portion is 100 nm or more. 12. The image forming apparatus according to claim 8, wherein the carbon layer contains a catalytic metal. 13. The image forming apparatus according to claim 12, wherein the catalytic metal is an iron group of Ni, Fe, and Co. 14. The image forming apparatus according to claim 8, wherein carbon fine particles are provided on the surface of the convex portion of the organic resin covering the spacer base material. 15. The image forming apparatus according to claim 14, wherein the carbon fine particles are made of carbon fine particles arranged in point-like concave portions formed on the surface of the convex portion of the organic resin. 16. The image forming apparatus according to claim 15, wherein said carbon fine particles are made of graphite, amorphous carbon, or a mixture thereof. 17. The sheet resistance of the surface of the spacer is 10
The image forming apparatus according to claim 1, wherein the resistance is ⁹ Ω / □ or more and 10 ¹² Ω / □ or less. 18. The method according to claim 18, wherein the carbon and the organic resin respectively cover the spacer base material in a band shape, and the bands are formed alternately and continuously in a direction substantially perpendicular to the plate. An image forming apparatus according to claim 8. 19. The image forming apparatus according to claim 18, wherein a thickness of the band of the organic resin covering the spacer base material is larger than a thickness of the band of carbon. 20. The image forming apparatus according to claim 19, wherein the thickness of the carbon band is 100 nm or more. 21. A plurality of carbon bands and said organic resin bands are respectively formed, and said carbon band and said organic resin band are formed substantially parallel to said plate plane. An image forming apparatus according to claim 19 or claim 20. 22. When the pitch between the bands of the organic resin is P and the width of the carbon band in the direction substantially perpendicular to the plate plane is 1, a relational expression expressed as 1 ≧ P / 2 is obtained. 22. The image forming apparatus according to claim 21, wherein the condition is satisfied. 23. The image forming apparatus according to claim 18, wherein the carbon band contains a catalytic metal. 24. The image forming apparatus according to claim 23, wherein the catalytic metal is an iron group of Ni, Fe, and Co. 25. The method according to claim 18, wherein carbon fine particles are provided on the surface of the band of the organic resin.
The image forming apparatus according to claim 1. 26. The image forming apparatus according to claim 25, wherein the carbon fine particles are carbon fine particles arranged in point-like concave portions formed on the surface of the band of the organic resin. 27. The image forming apparatus according to claim 26, wherein the carbon fine particles are made of graphite, amorphous carbon, or a mixture thereof. 28. The sheet resistance of the surface of the spacer is 10
The image forming apparatus according to any one of claims 18 to 27, wherein the resistance is ⁹ Ω / □ or more and 10 ¹² Ω / □ or less. 29. The image forming apparatus according to claim 1, wherein the organic resin is one of a polyimide resin and a polybenzimidazole resin. 30. The image forming apparatus according to claim 29, wherein the polyimide resin is a wholly aromatic polyimide. 31. The image forming apparatus according to claim 1, wherein the spacer substrate is a member made of glass. 32. The spacer base material according to claim 1, wherein at least one or more fibrous fillers of glass, alumina, boron, carbon, and ceramic whiskers are dispersed in an organic resin. Any one of
Item 10. The image forming apparatus according to item 1. 33. The image forming apparatus according to claim 32, wherein the filler is contained at 1 wt% or more and 50 wt% or less with respect to the organic resin. 34. The image forming apparatus according to claim 32, wherein the organic resin is one of a polyimide resin and a polybenzimidazole resin. 35. The image forming apparatus according to claim 34, wherein the polyimide resin is a wholly aromatic polyimide. 36. The device according to claim 1, wherein a contact layer is provided at a contact portion of the spacer on the face plate and / or the rear plate side. Image forming device. 37. The image forming apparatus according to claim 36, wherein the contact layer is the carbon. 38. The image forming apparatus according to claim 37, wherein said contact layer is electrically connected to said carbon. 39. The semiconductor device according to claim 1, wherein the spacer is bonded to an anode formed on the face plate and / or a drive wiring formed on the rear plate. An image forming apparatus according to claim 1. 40. The image forming apparatus according to claim 39, wherein the joining is performed by an adhesive member made of a resin mixed with carbon powder. 41. The image forming apparatus according to claim 1, wherein a plurality of the spacers are arranged. 42. The image forming apparatus according to claim 1, wherein the electron-emitting device is a cold cathode. 43. The cold cathode is a field emission device or a surface conduction electron emission device.
An image forming apparatus according to claim 1. 44. A rear plate on which an electron-emitting device is disposed, a face plate having an image forming member and disposed opposite to the rear plate, and disposed between the face plate and the rear plate. An image forming apparatus having a spacer, wherein the spacer is formed by coating a spacer base material with an organic resin, and the spacer base material is made of an organic resin made of glass, alumina, boron, carbon, or ceramic whiskers. An image forming apparatus comprising at least one fibrous filler dispersed therein. 45. The image forming apparatus according to claim 44, wherein the filler is contained in an amount of 1 wt% or more and 50 wt% or less with respect to the organic resin. 46. The image forming apparatus according to claim 44, wherein the organic resin is one of a polyimide resin and a polybenzimidazole resin. 47. The image forming apparatus according to claim 46, wherein the polyimide resin is a wholly aromatic polyimide. 48. A rear plate on which an electron-emitting device is disposed, a face plate having an image forming member and disposed opposite to the rear plate, and disposed between the face plate and the rear plate. An image forming apparatus comprising: a spacer; a spacer formed by coating a spacer base material with an organic resin; and the organic resin is a polybenzimidazole resin. 49. The method for manufacturing a spacer for an image forming apparatus according to claim 1, further comprising a step of applying an organic resin to the spacer base material. Manufacturing method of spacer. 50. The method of manufacturing a spacer for an image forming apparatus according to claim 49, wherein the step of applying the organic resin is performed by immersing the spacer base in a solution containing the organic resin and then applying the resin by pulling up. A method of manufacturing a spacer for an image forming apparatus. 51. The method of manufacturing a spacer for an image forming apparatus according to claim 49, wherein the step of applying the organic resin is a step of applying an organic resin having carbon powder to a spacer base material. A method of manufacturing a spacer for an image forming apparatus, comprising: 52. The method of manufacturing a spacer for an image forming apparatus according to claim 49, further comprising a step of carbonizing said organic resin. . 53. The method of manufacturing a spacer for an image forming apparatus according to claim 52, wherein the step of carbonizing the organic resin is performed by irradiating the organic resin with an electron beam. A method for manufacturing a spacer of an image forming apparatus. 54. The method of manufacturing a spacer for an image forming apparatus according to claim 52, wherein the step of carbonizing the organic resin includes the step of applying an electron beam to the organic resin in a strip shape so as to be substantially parallel to the plate. A method of manufacturing a spacer for an image forming apparatus, wherein the method is performed by irradiating. 55. The method for manufacturing a spacer of an image forming apparatus according to claim 52, wherein the step of carbonizing the organic resin is performed by heating the organic resin applied to the spacer base material. A method for manufacturing a spacer for an image forming apparatus, the method comprising: 56. The method of manufacturing a spacer for an image forming apparatus according to claim 55, wherein the step of carbonizing the organic resin is performed by heating the organic resin applied to the spacer base material by light irradiation. A method of manufacturing a spacer for an image forming apparatus, the method comprising: 57. The method of manufacturing a spacer for an image forming apparatus according to claim 49, wherein the spacer base material or the spacer base material is provided before the step of carbonizing the organic resin. A method for manufacturing a spacer for an image forming apparatus, comprising a step of partially forming a catalytic metal layer on an organic resin applied to an image forming apparatus. 58. The method of manufacturing a spacer for an image forming apparatus according to claim 57, wherein the step of forming the catalytic metal layer comprises forming the catalytic metal in a strip shape so as to be substantially parallel to the plate. A method of manufacturing a spacer for an image forming apparatus. 59. The method for manufacturing a spacer for an image forming apparatus according to claim 57, wherein the step of forming a catalytic metal layer comprises:
A method for manufacturing a spacer for an image forming apparatus, wherein the spacer is formed by applying the spacer base material or an organic resin applied to the spacer base material. 60. The method for manufacturing a spacer of an image forming apparatus according to claim 59, wherein the step of forming a catalytic metal layer comprises applying a solution containing the catalytic metal to the spacer substrate or the spacer substrate. A method for manufacturing a spacer for an image forming apparatus, wherein the spacer is formed by applying an ink onto an applied organic resin by an inkjet method. 61. The method of manufacturing a spacer for an image forming apparatus according to claim 49, wherein the organic resin at a contact portion of the spacer on the face plate and / or rear plate side is provided with an electron beam or an electron beam. A method of manufacturing a spacer for an image forming apparatus, comprising a step of irradiating light. 62. The method of claim 1, 2, 3, 5, 6, 7, 8,
49. The method of manufacturing an image forming apparatus according to any one of 18, 39, 44, and 48, wherein the spacer is joined to an anode formed on the face plate and / or a drive wiring formed on the rear plate. A method for manufacturing an image forming apparatus, comprising: