JP3241219B2 - Method of manufacturing image display device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flat image forming apparatus using an electron source, and more particularly to a thin image forming apparatus having a spacer inside a vacuum vessel and a method of manufacturing the same.

[0002]

2. Description of the Related Art In recent years, a light and thin so-called flat display has attracted attention as an image forming apparatus replacing a large and heavy cathode ray tube. As the flat display, a liquid crystal display (Liquid Crystal D)
However, there are still problems such as dark images and narrow viewing angles in liquid crystal display devices. As a substitute for the liquid crystal display device, there is a self-luminous type flat display that forms an image by irradiating a phosphor with an electron beam emitted from an electron source to generate fluorescent light. A self-luminous flat display using an electron source provides a brighter image and a wider viewing angle than a liquid crystal display device. However, in a flat display using an electron source, an electron beam is applied to a phosphor. In order to form an image, an electron source, a phosphor, and other components must be built in a vacuum vessel in a vacuum atmosphere of about 10 ⁻⁵ torr or less, and the vacuum vessel requires an atmospheric pressure resistant structure.

[0003] With respect to a vacuum vessel having an atmospheric pressure resistant structure, a face plate and a back plate (re
There is a structure in which a spacer is arranged between the first and second plates. Japanese Utility Model Application Laid-Open No. 58-107554 discloses a cover glass (vacuum container) in which a spacer is disposed between a front glass substrate and an anode substrate as a vacuum container for a fluorescent display tube and these are adhered using frit glass. It has been disclosed. The cover glass disclosed in Japanese Utility Model Application Laid-Open No. 58-107554 has the configuration shown in FIG. In FIG. 22, a spacer 16 is arranged between a front glass 15 and an anode substrate 11, and these are fitted to frit glasses 19a, 19a.
b, and a cover glass as a vacuum container is formed. Reference numeral 14 denotes a filament wire serving as an electron beam generating source, 13 denotes a control grid, and 12 denotes a light emitting anode section, which are formed inside a cover glass. Reference numeral 18 denotes an exhaust pipe hole for evacuating and exhausting the inside of the cover glass, and 17 denotes an exhaust pipe. In the fluorescent display tube shown in FIG. 22, the light-emitting anode portions 12 are not arranged in a matrix but are shown in only one column. Not something.

[0004] As a method of obtaining an atmospheric pressure resistant structure, either of the methods of increasing the thickness of the front plate and the back plate or providing an atmospheric pressure resistant spacer as an auxiliary member in the image forming apparatus can be considered. . When an image forming apparatus having a large area is considered, it is desirable to provide an anti-atmospheric pressure spacer in the image forming apparatus from the viewpoint of reducing the weight of the image forming apparatus.

An example in which a flat anti-atmospheric spacer is used in an image forming apparatus is disclosed in Japanese Patent Application Laid-Open No. 5-36363. Japanese Patent Application Laid-Open No. 5-36363 discloses an image forming apparatus in which a portion of a flat atmospheric pressure-resistant spacer in contact with a face plate is formed in a wedge shape and arranged at appropriate intervals to maintain an atmospheric pressure resistant structure. It has been disclosed. However, in the image forming apparatus disclosed in Japanese Patent Application Laid-Open No. 5-36363, during manufacturing, control of the accuracy and variation of spacers, and precision of undulation and the like of the front and rear plates determined through the spacers are performed. Control is required. When assembling, careful attention is required, but if care is not taken, the operation of the assembled image forming apparatus may be unstable, in addition to the situation such as damage of the phosphor or wiring by the spacer. There is also a concern that the situation will occur.

[0006]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned technical problems, and provides an image forming apparatus which has an increased degree of freedom in manufacturing an image forming apparatus and has excellent operation stability. The purpose is to provide.

Another object of the present invention is to provide an electron-emitting device (el
a rear plate provided with an electron emitting device, a front plate provided with an image forming member and arranged at a position facing the rear plate, and a back plate and the front plate. A support frame surrounding the periphery of the two and defining a space between the two, and a spacer disposed between the back plate and the front plate; and electrons emitted from the electron-emitting device. Irradiating the image forming member with an image forming member, the spacer having a length shorter than the distance between the back plate and the front plate defined by the support frame. An object of the present invention is to provide a method of manufacturing an image forming apparatus, wherein at least one end of the spacer is fixed to the back plate or the front plate using an adhesive member. Still another object of the present invention is to provide a back plate provided with an electron-emitting device, a front plate provided with an image forming member and arranged at a position facing the back plate, and the back plate and the front plate. And a support frame surrounding the peripheral edges of the two and defining the distance between the two, and a spacer disposed between the back plate and the front plate, and are emitted from the electron-emitting device. In the image forming apparatus that forms an image by irradiating the image forming member with electrons, a length of the spacer is shorter than a distance between the back plate and the front plate defined by the support frame, and The present invention provides an image forming apparatus having at least one end fixed to the back plate or the front plate using an adhesive member.

[0008]

The image forming apparatus of the present invention has the following configuration.

According to the present invention, there is provided a back plate on which electron-emitting devices are formed, a front plate on which an image forming member is formed and arranged at a position opposite to the back plate, and between the back plate and the front plate. A method for manufacturing an image display device, comprising: a support frame surrounding the periphery of the back plate and the front plate; and a spacer for supporting atmospheric pressure provided between the back plate and the front plate. A spacer having a length shorter than the distance between the back plate and the front plate defined by the support frame is used, and the spacer is bonded and fixed to the front plate (or the back plate) using a first glass frit. And a step of bonding and fixing the support frame to a front plate (or a back plate). On the other hand, the spacer and the support frame fixing position of the back plate (or the front plate) have a lower softening temperature than the first glass frit. The second glass frit, the front plate of the spacer and the support frame is fixed (or backplate)
A step of forming the spacer such that the end of the spacer does not touch the second glass frit when overlapping, a front plate (or a rear plate) to which the spacer and the support frame are fixed; 2. A method of manufacturing an image display device, comprising: laminating a back plate (or a front plate) on which two glass frit are formed, and applying heat and pressure to adhere and fix. Further, according to the present invention, a back plate on which electron-emitting devices are formed, a front plate on which an image forming member is formed and arranged at a position facing the back plate, and the back plate and the front plate, In a method for manufacturing an image display device, comprising: a support frame surrounding a peripheral edge of a back plate and the front plate; and a spacer for supporting atmospheric pressure provided between the back plate and the front plate, wherein the spacer has a length. A step of forming a first glass frit at an end thereof using a substrate shorter than a distance between the back plate and the front plate defined by the support frame, and a first glass frit at an end. Adhering and fixing the opposite end of the formed spacer to the back plate, and further adhering and fixing the support frame to the back plate; and a first glass frit at the support frame fixing position of the front plate. And softening temperature equal The second glass frit,
When overlapping the back plate on which the spacer and the support frame are fixed, forming an end of the spacer with a thickness that does not touch a front substrate or a member formed on the front substrate, And a front plate on which the second glass frit is formed, and a step of heating and bonding and fixing the rear plate on which the spacer and the support frame are fixed. In the claims and the above description of the present application, when the description of the back plate (or the front plate) and the front plate (or the back plate) is replaced with the description in parentheses, the description in the same claim and the same sentence It means replacing everything at the same time.

[0010]

The present invention will be described below with reference to the drawings.

FIG. 1 is a schematic sectional view showing an example of the image forming apparatus of the present invention. In FIG. 1, reference numeral 1 denotes a front plate on which the image forming member 5 is mounted, and 2 denotes a back plate on which the electron-emitting device group is mounted. The front plate 1 and the rear plate 2 are hermetically joined by using a support frame 3 to form an airtight container. Front panel 1
A spacer 4 is inserted between the back plate 2 and the rear plate 2 as an atmospheric pressure support member. One end of the spacer 4 is fixed to the back plate 2 via an adhesive member 8. Here, the spacer 4 is fixed to the rear plate 2 via the adhesive member 8. However, the spacer 4 may be fixed to the front plate 1 via the adhesive member 8, or both sides may be fixed via the adhesive member 8. Is also possible.

FIG. 2 is an enlarged schematic view of the side wall of the image forming apparatus shown in FIG. Here, the same parts as those shown in FIG. 1 are denoted by the same reference numerals. In FIG. 2, reference numeral 5 denotes an image forming member, which includes a glass plate, a black member called a black matrix, a phosphor, a metal back, and the like. Reference numeral 7 denotes a wiring take-out part. The wiring part of the electron-emitting device group 6 passes through the space between the support frame 3 and the back plate 2 and goes out of the hermetic container to the drive circuit via the wiring take-out part 7. It is connected.

In FIG. 2, L1 is the distance between the front plate 1 and the back plate 2 defined by the support frame 3, and L2 is the length of the spacer 4. As shown in the figure, in the present invention,
There is a relationship of L1> L2.

The gap defined by L1-L2 is filled with an adhesive member 8. Here, the space between the front plate 1 and the support frame 3, the space between the support frame 3 and the spacer 4, and the space between the support frame 3 and the back plate 2 are sealed with an adhesive. Then, the adhesive is not shown for convenience of explanation.

The distance of the gap defined by L1-L2 varies depending on the material of the adhesive member used, but when frit glass is used, it is generally 50-500.
It is preferably set to μm. More preferably 50 μm or more
Within the range of 300 μm, optimally between 50 μm and 200 μm.
It is in the range of μm.

If the gap is less than 50 μm, the adhesive strength of the frit glass may be insufficient.
In addition, when one side of the anti-atmospheric pressure spacer that is in contact with the front plate or the back plate is adhered and fixed, a gap portion is formed, which is not preferable. On the other hand, when the thickness is 500 μm or more, the frit glass may flow to an undesired part when the anti-atmospheric pressure spacer is bonded and fixed. Therefore, the thickness of the frit glass is generally 500 μm or less, but preferably 300 μm or less because the frit glass can be easily applied. Further, when the thickness is 200 μm or less, the coating is easy and the outflow of the frit glass can be suppressed as much as possible.

FIG. 3 is a schematic view of the image forming apparatus shown in FIG. 2 before sealing. Here, the same parts as those shown in FIG. 2 are denoted by the same reference numerals. FIG. 3 shows the spacer 4
FIG. 3 is a schematic diagram showing a state in which an adhesive member is disposed between the substrate and the back plate 2 and pre-baking is performed. Thereafter, by performing main firing, sealing is performed, and the image forming apparatus shown in FIG. Is obtained.

As shown in FIG. 3, it is desirable that the thickness L3 of the adhesive member applied to the back plate after the calcination be longer than the distance defined by L1-L2. The distance defined by L3− (L1−L2) is 2 in consideration of the processing accuracy of the spacer and the undulation due to the wiring step.
It is desirable that the thickness be 0 μm or more.

The shape, number, arrangement, etc. of the spacers used in the present invention are not particularly limited, and can be appropriately designed in consideration of the size of the screen, the pixel arrangement, the structure of the image forming member, and the like. Although the position where the spacer is provided is not limited, as an example, it can be on a black matrix that does not adversely affect the image.

The spacer is preferably made of a material having substantially the same thermal expansion coefficient as that of the support frame, the front plate, and the back plate.
Optimally, materials having the same coefficient of thermal expansion should be used. Specifically, it is preferable to use a material having a coefficient of thermal expansion in the range of 0.8 to 1.2. By using a material having the same coefficient of thermal expansion, it is possible to suppress the distortion of the sealed container itself even after the heating step. Specific materials include insulating materials such as glass, ceramics, and a material obtained by applying an insulating material to a metal.

Further, the spacer and the support frame may be formed separately, but may be formed into an integral structure by, for example, etching.

The adhesive member can be appropriately selected from those capable of adhering and fixing the front plate or the rear plate and the spacer, but one example is frit glass.

The frit glass has a softening temperature of 410.
C. or lower is preferable, and the color is desirably black.

As for the composition of the frit glass, it is desirable that the composition has a structure capable of obtaining a thermal expansion coefficient equivalent to that of the spacer, the support frame, the front plate, and the rear plate.

Various electron-emitting devices can be used in the image forming apparatus of the present invention. Electron emitting device (elect
As an example of the tron emitting device, a surface conduction electron-emitting device (Surface Co., Ltd.) may be used.
Negative Emitter). The surface conduction electron-emitting device utilizes a phenomenon in which electron emission occurs when a current is applied to a small-area thin film formed on a substrate in a direction substantially parallel to the surface of the thin film. The surface conduction electron-emitting device will be described with reference to FIG.
FIG. 4A is a schematic plan view of the surface conduction electron-emitting device, and FIG. 4B is a schematic cross-sectional view of the surface conduction electron-emitting device. In FIG. 4, reference numeral 2001 denotes a substrate, which corresponds to the back plate 2 shown in FIGS.

Reference numerals 2002 and 2003 denote device electrodes;
Is a conductive thin film, and 2005 is an electron emitting portion.

In the surface conduction electron-emitting device shown in FIG. 4, a voltage is applied between the device electrodes 2002 and 2003 and a current flows through the conductive thin film 2004, so that electrons are emitted from the electron-emitting portion 2005. Released. As the substrate 2001, quartz glass, glass with a low impurity content such as Na, blue plate glass, a glass substrate having SiO ₂ formed on its surface, or a ceramic substrate such as alumina can be used.
As a material for the device electrodes 2002 and 2003, a general conductive material is used.

The material forming the conductive thin film 2004 is P
d, Pt, Ru, Ag, Au, Ti, In, Cu, C
metals such as r, Fe, Zn, Sn, Ta, W, Pb, Pd
Oxide such as O, SnO ₂ , In ₂ O ₃ , PbO, Sb ₂ O ₃ , HfB ₂ , ZrB ₂ , LaB ₆ , CeB ₆ , YB
_4, GdB boride such as _{4, TiC, ZrC, HfC,} T
carbides such as aC, SiC, WC, TiN, ZrN, Hf
It can be appropriately selected from nitrides such as N, semiconductors such as Si and Ge, and carbon.

The electron emitting portion 2005 is made of a conductive thin film 2004.
Is a high-resistance crack formed in a part of the substrate, and is formed by so-called energization forming or the like.

An example of a method for manufacturing a surface conduction electron-emitting device will be described with reference to FIG. 5, the same parts as those shown in FIG. 4 are denoted by the same reference numerals as those shown in FIG. 1) After sufficiently cleaning the substrate 2001 using a detergent, pure water, an organic solvent, or the like, an element electrode material is deposited by a vacuum evaporation method, a sputtering method, or the like. Thereafter, the device electrodes 2002 and 2002 are formed on the substrate 2001 by using, for example, photolithography technology.
2003 is formed (FIG. 5A). 2) Substrate 2001 provided with device electrodes 2002 and 2003
Then, an organometallic solution is applied to form an organometallic thin film. The organic metal thin film is heated and baked, and is patterned by lift-off, etching, or the like to form a conductive thin film 2004 (FIG. 5B). 3) Subsequently, an energization process called forming is performed. When power is applied between the device electrodes 2002 and 2003 using a power supply (not shown), a portion of the conductive thin film 2004
An electron emitting portion 2005 having a changed structure is formed.
(C)). According to the energization forming, the conductive thin film 200
In 4, a portion where the structure such as destruction, deformation or alteration is locally formed is formed. The portion constitutes the electron emission section 2005. The voltage waveform of the energization forming is preferably a pulse waveform.

Next, as a back plate applicable to the present invention,
An electron source substrate incorporating a surface conduction electron-emitting device will be described. Various arrangements of the surface conduction electron-emitting devices on the electron source substrate can be adopted. Here, an example of a simple matrix type electron source substrate will be described. FIG.
FIG. 2 is a schematic view showing an example of a simple matrix type electron source substrate. In FIG. 6, 2 is an electron source substrate, 11 is an X-direction wiring, 12 is a Y-direction wiring, 2074 is a surface conduction electron-emitting device, and 2075 is a connection. The substrate used for the electron source substrate 2 is the above-mentioned glass substrate or the like, and the shape is appropriately set according to the application. The m X-directional wires 11 are DX1, D
.., DXm, and the Y-direction wiring 12 is DY.
1, DY2,... DYn.

The material, film thickness, and wiring width are appropriately set so that a substantially uniform voltage is supplied to a large number of surface conduction elements. These m X-directional wirings 11 and n Y-directional wirings 1
The matrix wirings are electrically separated from each other by an interlayer insulating layer (not shown). An interlayer insulating layer (not shown) is formed in a desired region on the entire surface or a part of the substrate 2 on which the X-directional wiring 11 is formed. The X-direction wiring 11 and the Y-direction wiring 12 are led out as external terminals.

Further, the device electrodes (not shown) of the surface conduction electron-emitting device 2074 are electrically connected to the m X-directional wires 11 and the n Y-directional wires 12 by connection 2075. The surface conduction electron-emitting device may be formed on either the substrate or the interlayer insulating layer (not shown). The X-direction wiring 11 is electrically connected to a scanning signal generating means (not shown) which is a means for applying a signal for selecting a row of the surface conduction electron-emitting devices 2074 arranged in the X direction according to an input signal. .

The Y direction wiring 12 is connected to a modulation signal generating means (not shown) for applying a modulation signal for modulating each of the rows of the surface conduction electron-emitting devices 2074 arranged in the Y direction in accordance with an input signal. Connected.

The driving voltage applied to each of the surface conduction electron-emitting devices is supplied as a difference voltage between a scanning signal and a modulation signal applied to the device.

By adopting such a configuration, individual elements can be selected and driven independently only by simple matrix wiring.

Next, an example of the image forming apparatus according to the present invention will be described with reference to FIG. FIG. 7 is a schematic perspective view of the image forming apparatus. 7, reference numeral 1 denotes a front plate on which the image forming member 5 is mounted, and the front plate 1 is a glass plate 1.
5 and an image forming member 5. The image forming member 5 is a black member 1 called a black matrix or the like.
6, a phosphor 17, and a metal back 18. Reference numeral 2 denotes a back plate, on which wires 11, 12 formed in a matrix, an interlayer insulating film (not shown), and an electron-emitting device 13 are formed.

The front plate 1 and the back plate 2 are air-tightly joined via a support frame 3 to form an airtight container. A spacer 4 is inserted between the front plate 1 and the back plate 2 as an atmospheric pressure support member. The spacer 4 uses the adhesive member 8 to form the wiring 1.
2 above. The image forming apparatus includes a wiring 12
Are applied via terminals Dox1 to Doxm corresponding to the wiring and terminals Doy1 to Doyn corresponding to the wiring 11. A scanning signal is applied to the terminals Dox1 to Doxm to sequentially drive the surface conduction electron-emitting device groups arranged in a matrix of M rows and N columns, one row at a time (N elements). To the terminals Dy1 to Dyn, a modulation signal for controlling an output electron beam of each of the surface conduction electron-emitting devices in one row selected by the scanning signal is applied.

A DC voltage is applied to a high-voltage terminal (not shown) as an accelerating voltage for applying sufficient energy to an electron beam output from the surface conduction electron-emitting device to excite the phosphor. .

In the image forming apparatus of this embodiment, a general scanning circuit usually used for a display can be used.
Input signals include PAL and SEC in addition to the NTSC system.
An AM system, a TV signal including a large number of scanning lines (for example, a high-quality TV including the MUSE system), or the like can be employed.

Hereinafter, the present invention will be described in detail with reference to specific examples. However, the present invention is not limited to these examples, and each element within the range in which the object of the present invention is achieved. It also includes replacements and design changes. (Example 1) An example in which an image forming apparatus schematically shown in FIG. 7 is manufactured will be described. In this example, the glass plate 15, the back plate 2, and the support frame 3 used were made by cutting blue sheet glass. As the anti-atmospheric pressure spacer 4, a flat plate made of polished thin glass was used.

As the image forming member 5 constituting the front plate 1, a black matrix 16 containing graphite as a main component is used, and a phosphor 17 is a three primary color phosphor.
An Al evaporated film was used as a metal back. Spacer 4
Was fixed on the wiring 12 formed on the back plate using the frit glass 8. In this example, L1-L in FIG.
The distance specified by 2 was 250 μm. A surface conduction electron-emitting device as the electron-emitting device 13 was formed on the back plate 2 by using a photolithography method. In the wiring section, a lower wiring 11, an interlayer insulating film (SiO ₂ ), and an upper wiring 12 were similarly stacked by photolithography to form a matrix wiring.

Hereinafter, the manufacture of the back plate 2 provided with the electron-emitting devices 13 will be described in detail with reference to FIGS.

FIG. 8 is a schematic diagram showing that the lower wiring 11 and the upper wiring 12 are arranged in a matrix, and the electron-emitting device 13 is provided at a position corresponding to the intersection of the two. FIG.
FIG. 9 is a schematic view showing a section taken along the line AA ′ in FIG. 9, reference numeral 2001 denotes a substrate, which corresponds to the back plate 2 in FIG. In FIG. 9, 1
Reference numeral 4 denotes an interlayer insulating film for insulating and separating the lower wiring 11 and the upper wiring 12. Reference numerals 2002 and 2003 denote a pair of device electrodes constituting a surface conduction electron-emitting device, and 2004 denotes a conductive thin film on which an electron-emitting portion is formed. 19 is a contact hole for making an electrical connection between the element electrode 2002 and the lower wiring 11. The manufacturing process of the structure shown in FIG. 9 will be described with reference to FIGS. still,
In these figures, common parts are denoted by the same reference numerals.

Step-a On a substrate 2001 in which a 0.5 μm thick silicon oxide film was formed on a cleaned blue plate glass by a sputtering method, 50 Å of Cr, 6 Å in thickness was formed by vacuum evaporation.
000 Å of Au were sequentially laminated. Next, after spin-coating and baking a photoresist (manufactured by Hoechst AZ1370) with a spinner, a photomask image is exposed and developed to form a resist pattern for the lower wiring 11, and the Au / Cr deposited film is wet-etched to form a lower pattern. The wiring 11 was formed (FIG. 10A).

Step-b Next, an interlayer insulating layer 14 made of a silicon oxide film having a thickness of 1.0 μm was deposited by RF sputtering (FIG. 10).
(B)).

Step-c A photoresist pattern for forming the contact hole 19 in the silicon oxide film 14 is formed, and the interlayer insulating layer 14 is etched using the photoresist pattern as a mask to form the contact hole 1.
9 was formed (FIG. 10C). The etching is CF
RIE (Reactive Io) using ₄ and H ₂ gas
n Etching) method.

Step-d A pattern to be a gap G between the device electrode 2002 and the device electrode is formed by using a photoresist (RD-2000N-41 manufactured by Hitachi Chemical Co., Ltd.).
0 Å of Ti and 1000 Å of Ni were sequentially deposited. The photoresist pattern was dissolved with an organic solvent, the Ni / Ti deposited film was lifted off, and the device electrodes 2002 and 2003 were formed so that the device electrode interval G was 3 μm and the device electrode width was 300 μm (FIG. 10 ( d)).

Step-e After forming a photoresist pattern of the upper wiring 12 on the device electrodes 2002 and 2003, Ti having a thickness of 50 angstroms and Au having a thickness of 5000 angstroms are sequentially deposited by vacuum evaporation, and unnecessary portions are lifted off. The portion was removed to form the upper wiring 12 (FIG. 11E).

Step-f A Cr film 2150 having a thickness of 1000 angstroms is deposited and patterned by vacuum evaporation using a mask, and organic Pd (ccp4230 manufactured by Okuno Pharmaceutical Co., Ltd.) is formed thereon.
Was spin-coated with a spinner, and then heated and baked at 300 ° C. for 10 minutes (FIG. 11F). The conductive thin film 2004 formed of fine particles containing Pd as the main element thus formed had a thickness of 100 Å and a sheet resistance of 5 × 10 4 Ω / □.

Step-g The Cr film 2150 and the baked conductive thin film 2004 were etched with an acid etchant to form a pattern (FIG. 11 (g)).

Step-h A pattern is formed such that a resist is applied to portions other than the contact hole 19, and Ti having a thickness of 50 angstroms and A having a thickness of 5000 angstroms are formed by vacuum evaporation.
u were sequentially deposited. Unnecessary portions were removed by lift-off to bury the contact holes 19 (FIG. 11H).

Through the above steps, the lower wiring 11, the interlayer insulating film 14, the upper wiring 12, and the device electrode 200 are formed on the insulating substrate 1.
2, 2003, a conductive thin film 2004 was formed.

Next, an assembling process of the present image forming apparatus will be described with reference to FIG.

An image forming member was formed on a glass plate to obtain a front plate 1.

Frit glass was applied to the front plate 1 by using a printing technique, and calcination was performed to remove the resin in the frit glass. The thickness of the calcined frit glass was 300 μm. Here, the frit glass having a softening temperature of 490 ° C. was calcined by holding it at 480 ° C. for about 10 minutes. Next, the atmospheric pressure resistant spacer 4 was positioned and fixed on the calcined frit glass.
Main heating was performed for about 0 minutes, and the main baking was performed to fix the adhesive (FIG. 12).
(A)).

The supporting frame was bonded and fixed to the front plate by the same process as described with reference to FIG. Here, a frit glass having a softening temperature of 410 ° C. is used.
The main baking was performed by heating at 450 ° C. for about 10 minutes (FIG. 12B).

A frit glass 8 was applied on the wiring of the back plate 2 provided with the electron-emitting devices by a printing technique, and calcination was performed. Here, the frit glass having a softening temperature of 410 ° C. was calcined by holding it at 400 ° C. for about 10 minutes. Here, the thickness of the applied frit glass is about 1
It was 50 μm (FIG. 12C).

The front plate 1 thus obtained was positioned and fixed on the rear plate 2. Here, the length of the atmospheric pressure resistant spacer 4 is shorter than the length of the support frame 3, and the atmospheric pressure resistant spacer 4 does not contact the frit glass preliminarily fired on the back plate 2, so that fine adjustment can be performed even after the positioning is completed. It was possible (FIG. 12 (d)).

Next, the main baking was performed by heating and holding at 450 ° C. for about 10 minutes. Since the softening temperature of the frit glass applied under the support frame 3 and the softening temperature of the frit glass applied under the atmospheric pressure resistant spacer 4 are equal to each other, they are softened at the same time when the main firing is performed. Since the thickness of the frit glass 8 becomes thinner, the anti-atmospheric pressure spacer 4 came into contact with the softened frit glass 8. Therefore, the impact between the anti-atmospheric pressure spacer 4 and the calcined frit glass (hard frit glass) 8 was mitigated (in a virtually non-existent state), and the frit glass was fired so as to surround the anti-atmospheric pressure spacer. Thus, an image forming apparatus having an anti-atmospheric pressure support structure was assembled (FIG. 12E).

After completion of the assembling process, the inside of the container constituting the image forming apparatus was evacuated from an exhaust pipe (not shown), and then the exhaust pipe was sealed so that a vacuum state could be maintained.

By making the length of the atmospheric pressure resistant spacer 4 shorter than the distance between the front plate 1 and the rear plate 2 defined by the support frame 3, the fixing of the atmospheric pressure resistant spacer 4 and the support frame 3 is performed. When the front plate 1 thus positioned is aligned with the back plate 2, damage to the electron-emitting device or the image forming member can be prevented. Further, the image forming apparatus could be manufactured without precisely controlling the variation in the height direction of the atmospheric pressure resistant spacer. No distortion of the image forming apparatus itself was observed.
The image forming apparatus of this example is excellent in impact resistance and can form a stable large-screen image for a long period of time.

In this embodiment, the combination of the front plate 1 and the back plate 2 is performed after the atmospheric pressure-resistant spacer 4 and the support frame 3 are fixed to the front plate 1 in advance, but the present invention is not limited to this. The air pressure spacer 4 and the support frame 3 may be fixed to the back plate 2 in advance, and then combined with the front plate 1. In this case, the frit glass 8 in FIG. 12 is disposed between the front plate 1 and the spacer 4. Furthermore, the atmospheric pressure resistant spacer 4 and the support frame 3 can be separately fixed to the front plate 1 and the back plate 2 in advance.

In this embodiment, the support frame 3 is formed by the front plate 1 and the rear plate 2.
Although the frit glass having the same softening temperature was used for fixing the glass, a different glass may be used. Further, crystalline frit glass may be used. (Embodiment 2) An example in which an image forming apparatus schematically shown in FIG. 13 is manufactured will be described. The image forming apparatus of this example is
As shown in FIG. 13, the two back plates 2 are
The second embodiment is different from the image forming apparatus shown in the first embodiment in that one back plate is formed by using the frit glass 81 for the reinforcing plate.

FIG. 14 is an enlarged view of the side wall of the image forming apparatus shown in FIG. The wiring portion of the electron-emitting device group 6 passes through the lower portion of the support frame 3 and goes out of the hermetic container, and is connected to the drive circuit via the wiring take-out portion 7.

In this example, the front plate 1, the rear plate 2, and the support frame 3 were obtained by cutting blue sheet glass. The anti-atmospheric pressure spacer 4 was produced by polishing thin glass. Reference numeral 5 denotes an image forming member, which was configured in the same manner as in Example 1.

In FIG. 14, L 1 is the distance between the front plate 1 and the back plate 2 defined by the support frame 3, and L 2 is the length of the atmospheric pressure resistant spacer 4. As shown in the figure, L1> L
2, the gap defined by L1-L2 is filled with frit glass 8. The gap is 250 μm
Met. As the electron-emitting device group 6, a surface conduction electron-emitting device was fabricated on the back plate 2 in the same manner as in Example 1.

In this embodiment, the front plate 1, the support frame 3, the atmospheric pressure-resistant spacer 4, and the composite back plate (the back plate 2 and the reinforcing plate 21 are integrally formed) are the same as those shown in the first embodiment. A large image forming apparatus was manufactured.

In this case, since the synthetic back plate was formed using blue plate glass having the same coefficient of thermal expansion, the occurrence of distortion such as warpage of the synthetic back plate was suppressed.

After completion of the assembling process, the inside of the container manufactured in the above process was evacuated through an exhaust pipe (not shown), and then the exhaust pipe was sealed.

By making the length of the atmospheric pressure-resistant spacer shorter than the distance between the front plate 1 and the rear plate 2 defined by the support frame 3, the front plate on which the atmospheric pressure-resistant spacer and the support frame are fixed is provided. When aligning with the back plate, it is possible to prevent damage to the electron-emitting device or the image forming member, and to manufacture the image forming apparatus without precisely controlling the variation in the height direction of the atmospheric pressure resistant spacer. Was completed.

The image forming apparatus thus obtained was able to form a stable large-screen image for a long period of time. In this example, 2
Although one back plate is connected to form one back plate, more back plates can be connected to form one back plate to increase the screen size. (Embodiment 3) An example in which an image forming apparatus schematically shown in FIG. 15 is manufactured will be described. The image forming apparatus of this example is
As shown in FIG. 15, a spacer 4 having a length shorter than the distance between the front plate 1 and the rear plate 2 defined by the support frame 3 is used, and a frit glass 82 is provided in a gap between the spacer 4 and the front plate 1. It is arranged and configured. FIG. 16 is an enlarged schematic view of the side wall portion of FIG. 16, the same parts as those in FIG. 2 are denoted by the same reference numerals as those in FIG. In this example, the distance defined by L1-L2 is 1
The gap between the front plate 1 and the spacer 4 was filled with frit glass 82. The electron-emitting device group 6, the wiring, the front plate on which the image forming member 5 was disposed, and the like were manufactured in the same manner as in Example 1.

With reference to FIG. 17, the manufacturing process of the image forming apparatus of this embodiment will be described below.

A black frit glass 82 (made by NEC Corporation: L
After applying S-0118), calcination was performed in order to remove the resin in the black frit glass. Here, the frit glass having a softening temperature of 390 ° C. was calcined by holding it at 380 ° C. for 10 minutes. The thickness of the black frit glass after the calcination (the distance from the tip of the black frit glass to the end surface of the atmospheric pressure resistant spacer) was 120 μm.
When the black member of the front plate and the anti-atmospheric pressure spacer 4 are bonded and fixed using a glass frit, it is desirable to minimize the glass frit width as much as possible in order to minimize image quality deterioration. Therefore, after the calcination, the preferable thickness for applying the frit glass so as not to damage the image forming member and to reduce the width when the front plate and the rear plate are opposed to each other and aligned is preferably 100 μm or more and 200 μm or less.

Next, the anti-atmospheric pressure spacer 4 coated with the frit glass 82 was fixed to the back plate 2 on which the electron-emitting devices, wirings and the like were formed. It was performed in the following procedure. That is, frit glass was applied on the wiring of the back plate 2 by a printing method, and calcination was performed to remove the resin in the frit glass. The frit glass is a crystalline frit glass having a softening temperature of 400 ° C. The frit glass was calcined by holding it at 390 ° C. for 10 minutes. The anti-atmospheric pressure spacer 4 was positioned and fixed on the temporarily baked frit glass, and was heated and maintained at 450 ° C. for 10 minutes, and was baked and bonded and fixed (FIG. 17A).

The support frame 3 was bonded and fixed to the back plate 2 by the same process. Here, frit glass having a softening temperature of 390 ° C. is used.
The heating was performed for 0 minutes (FIG. 17 (b)).

A frit glass 8 was applied to a position of the front plate 1 where the support frame 3 was to be attached by a printing technique, and was temporarily calcined. Here, a frit glass having a softening temperature of 390 ° C.
Preliminary calcination was performed by maintaining the temperature at 80 ° C. for 10 minutes. The thickness of the applied frit glass 8 was 400 μm (FIG. 17C).

After these steps, the support frame 3 and the spacer 4 are positioned and fixed on the back plate 2 (FIG. 17).
(D)).

Atmospheric pressure resistant spacer 4 is longer than the length of support frame 3
Since the length was short and did not contact the phosphor, fine adjustment was possible even after the positioning was completed.

The main baking was performed by maintaining the temperature at 430 ° C. for about 10 minutes. Since the softening temperatures of the frit glass 8 applied under the support frame 3 and the frit glass 82 applied under the anti-atmospheric pressure spacer are equal, they are softened at the same time during the main firing, so that the space between the back plate 2 and the support frame 3 Since the thickness of the frit glass 8 becomes thinner, the anti-atmospheric pressure spacer 4 came into contact with the softened frit glass. Atmospheric pressure resistant spacer 4
The impact between the pre-fired frit glass (hard frit glass) and the pre-fired frit glass (the hard frit glass) was reduced (virtually no state), and the frit glass 82 was fired so as to surround the anti-atmospheric pressure spacer 4.

After completion of the assembling process, the inside of the container manufactured in the above process was evacuated through an exhaust pipe (not shown), and then the exhaust pipe was sealed. Thus, an image forming apparatus having an anti-atmospheric pressure support structure was manufactured.

In this embodiment, the length of the atmospheric pressure resistant spacer is made shorter than the distance between the front plate 1 and the rear plate 2 defined by the support frame 3, and black frit glass is used. The spacer 4 was bonded and fixed. Thereby, when the back plate on which the atmospheric pressure resistant spacer and the support frame are fixed is aligned with the front plate, damage to the image forming member such as the black member can be prevented, and furthermore, the height direction of the atmospheric pressure resistant spacer can be prevented. The image forming apparatus could be manufactured without precisely controlling the variation. Example 4 An image forming apparatus schematically shown in FIG. 18 was manufactured.

In FIG. 18, reference numeral 1201 denotes a glass substrate;
Is a support frame, and 4 is an atmospheric pressure resistant spacer. Reference numeral 15 denotes a glass plate, and the image forming member 5 is formed on the inner surface of the glass plate 15 to constitute the front plate 1. The end surface of the anti-atmospheric pressure spacer 4 which is in contact with the front plate 1 is blackened.

Referring to FIGS. 18, 19 and 20,
A manufacturing process of the device of this example will be described. FIG. 19 is a schematic view of an electron source substrate constituting a back plate, and FIG.
It is a schematic diagram which shows a black stripe.

(1) After sufficiently cleaning the substrate 2001 made of glass with an organic solvent, a thickness of 1000
A plurality of element portions 3004 made of Ni of A were formed by photolithography (see FIGS. 18 and 19). Further, in order to supply power to the element portion, a wiring portion 3003 made of Ag having a thickness of 2 μm was formed by a printing method.
The wiring pattern is a parallel line pattern as shown in FIG. 18, and power is simultaneously supplied to a plurality of elements along the wiring pattern through a pair of adjacent wiring portions 3003. Further, one of the substrates 2001 is interposed via the insulating layer SiO _2.
A modulation electrode (not shown) having an electron passage hole having a diameter of 50 μm was disposed above the area of 0 μm.

(2) Next, an organic palladium-containing solution (cpp4230 manufactured by Okuno Pharmaceutical Co., Ltd.) is applied on the above-mentioned electrode, and then heated at 300 ° C. for 10 minutes to form a thin film made of fine particles of palladium oxide (PdO). Was formed. Further, patterning was performed by a dry etching method, and a conductive thin film 2004 was provided between the element portions 3004.

(3) Next, a voltage is applied between the element portions 3004, and the conductive thin film 2004 is subjected to an energizing process (referred to as forming process) to form an electron emitting portion 3005 in the element portion 3004. Was completed.

(4) Next, a method of manufacturing the front plate 1 will be described.

After cleaning the glass substrate 3009 with hydrofluoric acid or the like, a black stripe 3015 (see FIG. 20) is formed by photolithography. The material of the black stripe 3015 is mainly composed of graphite. Then, the three primary color phosphors 3013 are mixed with the resist one by one,
A color phosphor screen was produced by a slurry method commonly used in CRTs, in which coating in the form of a slurry, development and fixing at predetermined positions were repeated. The thickness of the phosphor 17 was 20 to 30 μm, and a good coating state without unevenness or peeling was obtained.

(5) Next, after performing a smoothing process on the surface of the phosphor 17 called filming, Al is uniformly formed on the inner side of the phosphor screen with a thickness of about 2000 A by a vacuum evaporation method. Thus, a metal back (not shown) was produced.

(6) Next, a method for manufacturing the atmospheric pressure resistant spacer 4 will be described. In this embodiment, a flat glass material having a height of 5 mm and a thickness of 0.2 mm was used as the atmospheric pressure resistant spacer 4. After processing the glass material into the above-mentioned shape, the end faces abutting on the front plate were aligned so as to be on the same plane, and a plurality of sheets were overlapped, and the surface was roughened by sandblasting to form a rough surface. A black paint was applied on the rough surface by a spray method to obtain a target atmospheric pressure resistant spacer.

(7) As described above, the electron-emitting device 13
The rear plate 2001 and the front plate 1 on which are formed are arranged to face each other via a plurality of atmospheric pressure resistant spacers 4 and the support frame 3,
Frit glass was applied to the joint between the front plate 1, the support frame 3, and the electron source substrate 2 and sealed by baking at 400 ° C. in the air for 10 minutes or more. The position of the anti-atmospheric pressure spacer 4 is determined on the electron source substrate 2 by a wiring member 30 in the middle of the two electron emission element rows.
20 on the front plate 1 as shown in FIG.
Black stripe 301 drawn slightly wider in
2 is abutted. Therefore, irradiation of the phosphor 17 with electrons from the electron-emitting device 13 is not prevented by the anti-atmospheric pressure spacer 4.

(8) The atmosphere in the glass envelope (comprised of the electron source substrate 2, the support frame 3, and the front plate 1) completed as described above is supplied to the vacuum pump through an exhaust pipe (not shown). And after reaching a sufficient degree of vacuum, 10E-6T
The exhaust pipe was welded by heating with a gas burner at a degree of vacuum of about orr, and the envelope was sealed.

(9) Finally, a getter process was performed to maintain the degree of vacuum after sealing. This is a process of heating a getter (not shown) disposed at a predetermined position in the image forming apparatus by a heating method such as resistance heating or high-frequency heating immediately before or immediately after sealing to form a deposited film. is there. The getter usually contains Ba or the like as a main component, and maintains the degree of vacuum by the adsorption action of the deposited film.

In the image display device of the present invention completed as described above, each of the electron-emitting devices emits electrons by applying a voltage through a terminal outside the container. The emitted electrons pass through an electron passage hole of a modulation electrode (not shown) and are accelerated by a high voltage of several kV or more applied to a metal back or a transparent electrode (not shown) through a high voltage terminal Hv, and are accelerated by the phosphor 17. Collision caused excitation and emission. At that time, by applying a voltage corresponding to the information signal to the modulation electrode through the terminal outside the container, the electron beam passing through the electron passage hole was controlled and an image was displayed.

The image forming apparatus of the present embodiment manufactured as described above has an effect of obtaining an image of good image quality without any influence even when black stripes are partially peeled off during manufacturing. Example 5 An image forming apparatus schematically shown in FIG. 21 was manufactured. The image forming apparatus shown in FIG. 21 is substantially the same as that shown in the fourth embodiment except that the arrangement of the image forming member 5 and the spacer 4 is different from that shown in the fourth embodiment.

Here, the method for manufacturing the electron-emitting device on the electron source substrate 2, the method for manufacturing the image forming member 5, and the method for sealing the envelope are the same as those in the fourth embodiment, and therefore the description is omitted.

In this example, the phosphors 17 are in a so-called delta arrangement. 19 is a matrix pattern. Reference numeral 3016 denotes a black member, which is called a black matrix in the case of a phosphor array as shown in FIG. In the case where a delta type phosphor array is used, when an interval between phosphors of the same color (this is called a dot pitch) is represented by P, an interval between phosphors of the same color in the horizontal direction of the screen is (／ 3/2) P. This has the advantage that the resolution in the horizontal direction is increased and a higher definition and higher density image can be formed.

The anti-atmospheric pressure spacer 4 in this case is not a plate-like anti-pressure spacer according to the fourth embodiment, but a column-shaped anti-atmospheric pressure spacer having a Mitsubishi-shaped cross section as shown in FIG. A thin film 3017 was deposited on a half area of the anti-atmospheric pressure spacer on the side in contact with the front plate. Further, black frit glass 8 is applied to the end surface of the anti-atmospheric pressure spacer on the side in contact with the front plate, and the constriction of the matrix pattern 19 and the protrusion of Mitsubishi of the anti-atmospheric pressure spacer coincide with each other on the black matrix. At predetermined intervals as shown
Preliminary baking at 00 ° C. fixed the anti-atmospheric pressure spacer.

The front plate 1 on which the anti-atmospheric pressure spacer 4 is fixed and the electron source substrate 2 on which the electron-emitting devices 13 are formed are sufficiently aligned with each other so that the three primary color phosphors and the electron-emitting devices correspond to each other. Then, sealing was performed via a support frame (not shown) to obtain an image forming apparatus.

In this image forming apparatus, since the atmospheric pressure resistant spacer 4 and the front plate 1 are fixed, the image forming member 5 was not damaged due to the displacement of the atmospheric pressure resistant spacer.

Further, any of the image forming apparatuses of the above embodiments could be applied to a recording apparatus by using them as light emitting sources. In this case, the recording apparatus was capable of stably obtaining a reproduced image with high definition and few image defects.

[0104]

According to the image forming apparatus of the present invention, at least one end of the spacer shorter than the distance between the back plate and the front plate defined by the support frame is fixed to the back plate or the front plate using an adhesive member. As a result, the atmospheric pressure resistance of the image forming apparatus increases and the shock resistance also increases. This allows
Operational instability due to impact can be suppressed.

According to the method of manufacturing an image forming apparatus of the present invention, by using the spacer shorter than the distance between the front plate and the back plate defined by the support frame, the spacer is not damaged in the sealing step. The spacer can be fixed by approaching the rear plate or the front plate.

Further, since a gap is formed between the spacer and the front plate or the back plate during the sealing assembly, the accuracy of the spacer and the degree of freedom of variation are increased. In addition to this, it is not necessary to precisely control the undulation of the front plate and the rear plate on which the spacers are provided, and furthermore, the step and the like due to wiring formation. Further, the front plate and the back plate can be aligned without damaging the electron-emitting device group (electron-emitting devices, device electrodes, wiring, etc.) or the image forming member by the spacer.

When a spacer is fixed on a so-called black stripe of the front plate on which the image forming member is provided by using an adhesive member, the adhesive member forms a black film (for example, a carbon black film) forming a black stripe. Penetrates inside. Thereby, the adhesion strength of the black film is increased, and film peeling or the like is suppressed.

[Brief description of the drawings]

FIG. 1 is a schematic diagram illustrating an example of an image forming apparatus of the present invention.

FIG. 2 is an enlarged schematic view of a part of FIG.

FIG. 3 is a schematic view illustrating a manufacturing process of the image forming apparatus of FIG. 2;

FIG. 4 is a schematic view showing one example of an electron-emitting device applicable to the image forming apparatus of the present invention.

FIG. 5 is a schematic view showing a manufacturing process of the electron-emitting device of FIG.

FIG. 6 is a schematic diagram showing an example of a simple matrix type electron source substrate.

FIG. 7 is a schematic diagram illustrating an example of the image forming apparatus of the present invention.

FIG. 8 is a schematic diagram showing a matrix wiring.

FIG. 9 is a schematic diagram showing a cross-sectional structure of FIG.

FIG. 10 is a schematic view showing a step of obtaining the structure shown in FIG. 9;

FIG. 11 is a schematic view showing a step of obtaining the structure shown in FIG. 9;

FIG. 12 is a schematic view illustrating a manufacturing process of the image forming apparatus of the present invention.

FIG. 13 is a schematic diagram illustrating an example of the image forming apparatus of the present invention.

FIG. 14 is an enlarged schematic view of a part of FIG.

FIG. 15 is a schematic view illustrating an example of the image forming apparatus of the present invention.

FIG. 16 is an enlarged schematic view of a part of FIG.

FIG. 17 is a schematic view illustrating a manufacturing process of the image forming apparatus of the present invention.

FIG. 18 is a schematic diagram illustrating an example of the image forming apparatus of the present invention.

FIG. 19 is an enlarged schematic view of a part of FIG. 18;

FIG. 20 is a schematic diagram showing a black stripe.

FIG. 21 is a schematic diagram illustrating an example of the image forming apparatus of the present invention.

FIG. 22 is a schematic view showing an example of a conventional flat display.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Front plate 2 Back plate 3 Support frame 4 Spacer 8 Adhesive member

──────────────────────────────────────────────────続 き Continuing on the front page (72) Tadashi Kaneko, Inventor 3-30-2 Shimomaruko, Ota-ku, Tokyo Inside Canon Inc. (72) Inventor Naoto Nakamura 3-30-2, Shimomaruko, Ota-ku, Tokyo (56) References JP-A-2-299135 (JP, A) JP-A-5-266807 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01J 31 / 12 H01J 9/24 H01J 29/87

Claims (2)

(57) [Claims] A back plate on which an electron-emitting device is formed; a front plate on which an image forming member is formed and arranged at a position facing the back plate; and a back plate between the back plate and the front plate. A method of manufacturing an image display device, comprising: a support frame surrounding a peripheral edge of a back plate and the front plate; and a spacer for supporting atmospheric pressure provided between the back plate and the front plate, wherein the spacer has a length Is shorter than the distance between the back plate and the front plate defined by the support frame, and the spacer is bonded and fixed to the front plate (or the back plate) using a first glass frit; A step of bonding and fixing the support frame to a front plate (or a rear plate); and a second lower softening temperature than the first glass frit in the spacer and the support frame fixing position of the rear plate (or the front plate). Moth A step of forming the frit with a thickness such that an end of the spacer does not touch the second glass frit when the front plate (or the back plate) to which the spacer and the support frame are fixed is overlapped; Superposing the front plate (or the rear plate) on which the spacer and the support frame are fixed, and the rear plate (or the front plate) on which the second glass frit is formed, and heating and pressing to bond and fix. Of manufacturing an image display device having the same. 2. A back plate on which electron-emitting devices are formed, a front plate on which an image forming member is formed and arranged at a position facing the back plate, and wherein the back plate is located between the back plate and the front plate. In a method for manufacturing an image display device, comprising: a support frame surrounding a peripheral edge of a back plate and the front plate; and a spacer for supporting atmospheric pressure provided between the back plate and the front plate, wherein the spacer has a length A step of forming a first glass frit at an end thereof using a substrate shorter than a distance between the back plate and the front plate defined by the support frame; and a first glass frit at an end. Adhering and fixing the opposite end of the formed spacer to the back plate, and further adhering and fixing the support frame to the back plate; and a first glass frit at the support frame fixing position of the front plate. And softening temperature equal When the second glass frit is overlapped with the back plate to which the spacer and the support frame are fixed, the thickness of the second glass frit is such that the end of the spacer does not touch the front substrate or a member formed on the front substrate. An image display apparatus comprising: a step of forming a back plate on which a spacer and a support frame are fixed; and a step of laminating a front plate on which a second glass frit is formed, and heating and bonding and fixing the back plate. Manufacturing method.