JP2002057344A5 - - Google Patents

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Publication number
JP2002057344A5
JP2002057344A5 JP2000245775A JP2000245775A JP2002057344A5 JP 2002057344 A5 JP2002057344 A5 JP 2002057344A5 JP 2000245775 A JP2000245775 A JP 2000245775A JP 2000245775 A JP2000245775 A JP 2000245775A JP 2002057344 A5 JP2002057344 A5 JP 2002057344A5
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JP
Japan
Prior art keywords
film
semiconductor film
amorphous semiconductor
insulating film
laser beam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2000245775A
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English (en)
Japanese (ja)
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JP2002057344A (ja
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Publication date
Application filed filed Critical
Priority to JP2000245775A priority Critical patent/JP2002057344A/ja
Priority claimed from JP2000245775A external-priority patent/JP2002057344A/ja
Publication of JP2002057344A publication Critical patent/JP2002057344A/ja
Publication of JP2002057344A5 publication Critical patent/JP2002057344A5/ja
Withdrawn legal-status Critical Current

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JP2000245775A 2000-08-14 2000-08-14 半導体装置の作製方法 Withdrawn JP2002057344A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000245775A JP2002057344A (ja) 2000-08-14 2000-08-14 半導体装置の作製方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000245775A JP2002057344A (ja) 2000-08-14 2000-08-14 半導体装置の作製方法

Publications (2)

Publication Number Publication Date
JP2002057344A JP2002057344A (ja) 2002-02-22
JP2002057344A5 true JP2002057344A5 (enExample) 2007-10-25

Family

ID=18736232

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000245775A Withdrawn JP2002057344A (ja) 2000-08-14 2000-08-14 半導体装置の作製方法

Country Status (1)

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JP (1) JP2002057344A (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4969024B2 (ja) * 2003-01-21 2012-07-04 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP4986415B2 (ja) * 2004-06-14 2012-07-25 株式会社半導体エネルギー研究所 半導体装置の作製方法
US7696031B2 (en) 2004-06-14 2010-04-13 Semiconductor Energy Laboratory Co., Ltd Method for manufacturing semiconductor device
US9349870B2 (en) 2013-09-29 2016-05-24 Boe Technology Group Co., Ltd Method for forming low-temperature polysilicon thin film, thin film transistor and display device
CN103489788B (zh) * 2013-09-29 2015-10-21 京东方科技集团股份有限公司 低温多晶硅薄膜的制备方法、薄膜晶体管和显示装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61166074A (ja) * 1985-01-17 1986-07-26 Fujitsu Ltd 絶縁ゲ−ト型トランジスタ及びその製造方法
JP2831006B2 (ja) * 1988-11-01 1998-12-02 ソニー株式会社 薄膜トランジスタの製造方法
JPH09260284A (ja) * 1996-03-25 1997-10-03 Sharp Corp 半導体装置の製造方法
JP4030193B2 (ja) * 1998-07-16 2008-01-09 株式会社半導体エネルギー研究所 半導体装置の作製方法

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