JP2002055219A - Method for manufacturing color filter substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a color filter with little cutting failure and high productivity at a low cost for the material. SOLUTION: In the method for manufacturing a color filter by cutting a substrate on which pixels of red(R), green(G) and blue(B) colors are arranged, a water-soluble resin is applied to form a protective film on the inner surface of the substrate in the area to be cut, then the lines for cutting of the substrate are scribed to form cracks, the substrate is cut along the cracks, and then the water-soluble resin on the substrate is removed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method for manufacturing a color filter substrate used for a liquid crystal display device or the like.

[0002]

2. Description of the Related Art In recent years, there has been a remarkable demand for a flat display, particularly a color liquid crystal display (LCD). The color liquid crystal display uses a color filter. 2. Description of the Related Art A liquid crystal display performs color display by controlling the transmission of each light of a pixel portion constituting a color filter by electric switching of liquid crystal.

This color filter is composed of, for example, a colored layer composed of a colored pattern of red (R), green (G), and blue (B) on a glass substrate, a black matrix located at a boundary between pixels, and a protective film layer. And a transparent electrode layer. The coloring layer of such a color filter is formed by a pigment dispersion method, an electrodeposition method, an inkjet method, or the like.

On the other hand, the size of color filter substrates has been increased and the number of screens has been increased in the color filter manufacturing stage for the purpose of reducing manufacturing costs. Therefore, the necessity of cutting a color filter substrate and dividing and supplying each color filter has been increasing in recent years.

Conventionally, a glass substrate on which a color filter layer is formed in multiple faces is cut by scribing with a wheel cutter or the like on a portion to be cut in a region where the color filter layer is not formed, and then the crack is formed. It was bent at the point and cut.

However, at the time of crack formation and cutting by the above-mentioned scribe, fiber-like or powder-like glass particles are generated. A phenomenon occurs in which the glass particles are scattered and adhere to the surface of the color filter substrate. These glass particles are difficult to remove even if they are washed in a later step, and cause a reduction in the yield of the color filters.

[0007] In order to solve such a problem, a protective film made of a resin or a resin film is conventionally formed on the surface of the color filter substrate, and a cut is formed on the protective film or on the back side of the substrate. Is used to remove the protective film. Such a method is disclosed in JP-A-63-1.
No. 06702 and JP-A-63-294677.

[0008]

However, in such a conventional method, for example, when a crack is formed by scribing from the protective film, the stress for forming the crack is absorbed by the protective film. The crack amount becomes insufficient, and there is a high possibility that cutting failure such as inability to cut is caused. In addition, when scribing from the back side of the substrate on which the protective film is applied and formed on the color filter surface, although the cuttability is good, the protective film surface is inevitably damaged because the protective film surface is used as the processing adsorption surface. The surface may be damaged.

In order to solve such a problem, a method in which a protective film is not formed only at a portion to be cut by exposure and development using a photocurable resin (JP-A-7-84120),
Further, a substrate cutting method using a laser (Japanese Unexamined Patent Application Publication No. 9-3
However, all of these methods have problems in cost and safety.

An object of the present invention is to solve the above-mentioned conventional problems, and an object of the present invention is to provide a method for producing a color filter which has a low cutting cost, low material cost and high productivity.

[0011]

In order to achieve such an object, the present invention employs the following constitution. That is,
In a method for manufacturing a color filter for cutting a substrate on which pixels of red (R), green (G), and blue (B) are formed and arrayed, a water-soluble resin is applied inside a portion of the substrate surface to be cut to protect the substrate. Forming a film, then scribing the planned cutting line of the substrate, forming a crack, cutting the substrate at the crack site, and then removing the water-soluble resin on the substrate, a color filter substrate It is a manufacturing method of.

According to the method of the present invention, it is possible to obtain a sufficient amount of cracks for cutting without being affected by the protective film at the time of cutting the substrate, thereby improving the cutability of the substrate.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention relates to red (R), green (G),
The present invention relates to a method for manufacturing a color filter for cutting a substrate on which each pixel of blue (B) is formed and formed, and applying a water-soluble resin to the inside of a portion to be cut on the surface of the substrate and drying to form a protective film, Next, after forming a crack by scribing the cutting line of the substrate, the substrate is cut at the cracked portion, and if necessary, the side surface of the cut portion and each corner of the substrate are chamfered and polished, and then the substrate The configuration is such that the water-soluble resin is removed.

The method of applying the protective film in the present invention includes a roll coater, a slit die coater, a printing method, and the like. A coating process using a low-cost slit die coater is desirable because coating can be performed without waste.

Examples of the water-soluble resin that forms the protective film include gelatin, polyvinyl alcohol, and vinyl acetate. Above all, polyvinyl alcohol, which has relatively little effect on the device and the substrate and is easy to apply and process, is desirable. When applying and processing polyvinyl alcohol by a slit die coater, its viscosity is desirably in the range of 5 to 25 cps. If it is less than 5 cps, it is not preferable because the water-soluble resin spreads to an unnecessary area when applied on the substrate, that is, in this example, on the line to be cut, which affects the subsequent cutting operation. On the other hand, if it exceeds 25 cps, it is not preferable because film breakage occurs at the time of application by a slit die coater and the applicability deteriorates.

It is desirable to apply the water-soluble resin so that the thickness of the coating film is about 1 to 5 μm when dry.
However, if the coating film is too thick, the amount of the water-soluble resin used increases, and it is difficult to remove it in the subsequent washing step. Therefore, it is desirable to form the coating film as thin as possible.

Next, in order to dry the obtained coating film,
It is placed in an oven at 70 to 100 ° C. and cured for about 10 to 15 minutes to obtain a protective film.

Next, the color filter substrate on which the protective film has been obtained is cut. Since a protective film made of a water-soluble resin is already formed on the color filter layer of the color filter substrate, there is no fear of glass particles adhering. On the other hand, since the protective film is not formed on the unnecessary area including the planned cutting line, the wheel cutter can directly contact the substrate and cracks are surely caused, so the cutting operation is affected by the protective film. Can be done without.

The side surface of the cut portion of the substrate and each corner of the substrate obtained in this manner are chamfered and polished with a rotary grindstone, and then washed with water to remove the water-soluble resin on the substrate. The color filter substrate of the size can be obtained.

As described above, according to the present invention, there are provided a glass cutting method and a manufacturing method of a color filter which has few cutting defects, low material cost and high productivity.

[0021]

Embodiments of the present invention will be described below. FIG. 1 is a plan view schematically showing an embodiment of the present invention before and after cutting a color filter substrate.

First, from a glass substrate having a size of 360 × 465 mm and a thickness of 0.7 mm, a color filter substrate having a size of 320 × 400 mm (BM pattern is 360 ×
465 mm substrate).

First, polyvinyl alcohol (TPF10000, manufactured by Tokyo Ohka Kogyo Co., Ltd., solid content concentration: 16.7%) serving as a protective film is diluted 3.5 times with pure water. At this time, the viscosity of the polyvinyl alcohol is about 6 cps. Next, as shown in FIG.
The protective film 4 is formed by applying the coating only on the inside of the cutting line 3 on the surface of the substrate 1. As a coating method, a slit die coater that can easily control a coating width is used. The control of the application width is performed by changing the shim sandwiched between the bases of the slit die coater to a desired width. The control of the application range in the substrate transport direction is performed by changing the position of the sensor at the start and end of application of the water-soluble resin. Here, the shim width is adjusted to 317 mm, the length from the beginning to the end of coating is adjusted to 395 mm, and the water-soluble resin is applied only inside the cut portion.

When the coating is completed, the coating is cured in a clean oven at 80 ° C. for 15 minutes to dry the coating film.

Next, the substrate 1 on which the protective film 4 has been obtained is cut.
The scribing is performed using a wheel cutter to form cracks necessary for cutting. The protective film 4 has already been formed on the layer of the color filter 2 of the substrate 1, and there is no fear of glass particles adhering. On the other hand, since the protective film is not formed on the unnecessary area including the cutting line, the wheel cutter can directly contact the substrate and cracks are surely caused, so that the substrate break is affected by the protective film. Can be done without.

The side surface of the cut portion of the substrate thus obtained and each corner of the substrate are chamfered and polished with a rotary grindstone, and thereafter, the water-soluble resin on the substrate is removed by a washing machine to obtain a 320 × 400 mm Was obtained.

[0027]

According to the present invention, since a protective film is not applied to an unnecessary area including a line to be cut when cutting a color filter substrate, it is easy to cut the substrate such as scribe and break by a wheel cutter or the like. This can be easily performed by dividing into each color filter.

[Brief description of the drawings]

FIG. 1 is a plan view before and after cutting a color filter substrate, which briefly illustrates an embodiment of the present invention.

[Explanation of symbols]

 1: substrate (mother) 2: color filter 3: cutting line 4: protective film 5: substrate (after cutting)

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2H048 BA11 BB02 BB14 BB37 BB42 2H090 JA07 JB02 JC07 JC13 JC19 LA15 2H091 FA02Y FC16 FC24 GA01 GA16 LA07 LA12 5C094 AA08 AA42 AA43 AA46 AA48 AA49 BA43 CA19 CA13 GB

Claims (1)

[Claims] 1. A method of manufacturing a color filter for cutting a substrate on which pixels of red (R), green (G), and blue (B) are arrayed, wherein a water-soluble resin is formed on an inner surface of a portion of the substrate to be cut. To form a protective film, and then scribe a predetermined cutting line of the substrate to form a crack, cut the substrate at the crack site, and then remove the water-soluble resin on the substrate. Characteristic method for manufacturing a color filter substrate.