JP2002052642A - Laminated packaging material - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a laminated packaging material which is suitable for packaging an electronic part and the like, shows excellent electrostatic shield and gas barrier properties and can be manufactured at a low cost. SOLUTION: A laminate packaging material 1 is provided with a base film 10, a vapor deposited ceramic layer 32 formed on one major surface of the base film 10, a vapor deposited metal layer 40 formed on the vapor deposited ceramic layer 32 and a heat sealable sealant layer 60 formed on the vapor deposited metal layer 40.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminated packaging material, and more particularly to a laminated material suitable for packaging of articles which are liable to be damaged by static electricity and corroded by water vapor or oxygen, such as electronic parts such as ICs and LSIs. Related to packaging materials.

[0002]

2. Description of the Related Art It is not always required that a package for containing an article such as an electronic component such as an IC or an LSI or a magnetic recording medium is to prevent direct contact with the article. That is, it is possible to prevent the insulation breakdown of the article due to the overcurrent, to be able to visually recognize the contained article without opening the package, and to prevent dust and dust from adhering to the package by electrostatic charging. It is also desired that such a phenomenon can be prevented.

As a packaging material which is transparent and has antistatic properties and electrostatic shielding properties, for example, an antistatic coating layer is formed on one main surface of a base film, and ultra-thin aluminum is formed on the other main surface. There is an electrostatic shielding packaging material having a structure in which a vapor deposition layer and an antistatic sealant layer are sequentially laminated. According to this packaging material, a package that satisfies the above requirements can be obtained.

[0004] However, in addition to the above-mentioned performances, a packaging material used for a package housing electronic parts and the like includes a gas barrier which blocks the invasion of water vapor and oxygen from the outside air to prevent corrosion of the electronic parts and the like. Sex is further required. The above-mentioned electrostatic shielding packaging material cannot meet such requirements.

[0005] In response to such a demand, for example, an ethylene-vinyl alcohol copolymer (hereinafter referred to as EVO) is formed on one main surface of a stretched polypropylene film as a transparent gas barrier layer.
There is a method in which a gas barrier laminate provided with a layer (referred to as H) is attached to the above-mentioned electrostatic shielding packaging material.

However, the oxygen permeability of the gas barrier layer using this EVOH is 1.0 cc / m ² · day · a.
tm, and the water vapor permeability is 3.0 g / m ² · day. That is, in the gas barrier layer, both the oxygen barrier property and the water vapor barrier property are insufficient, and among them, the water vapor barrier property is particularly insufficient.

Therefore, in recent years, instead of the gas barrier layer using EVOH, an evaporated film in which a metal oxide such as aluminum oxide or silicon oxide is evaporated on one main surface of a polyethylene terephthalate film or a biaxially stretched nylon film has been used. It is getting. That is, by laminating the vapor-deposited film to the above-mentioned electrostatic shielding packaging material, a laminated packaging material having excellent electrostatic shielding properties and gas barrier properties can be obtained.

[0008]

However, the laminated packaging material obtained by laminating the vapor-deposited film and the electrostatic shielding packaging material has a problem that the production cost is high.

The present invention has been made in view of the above problems, and is suitable for use in packaging electronic parts and the like, and has excellent electrostatic shielding properties and gas barrier properties and can be manufactured at low cost. The purpose is to provide.

[0010]

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and has a base film, a ceramic vapor-deposited layer formed on one main surface of the base film, and There is provided a laminated packaging material comprising: a metal deposition layer formed on a vapor deposition layer; and a heat sealable sealant layer provided on the metal deposition layer.

[0011] The laminated packaging material of the present invention comprises a coating layer obtained by heating and drying a coating film obtained by applying a predetermined coating agent on a ceramic vapor deposition layer between a ceramic vapor deposition layer and a metal vapor deposition layer. Further, it is preferable to have it. The coating agent contains, as a solute, at least one selected from the group consisting of metal alkoxides, hydrolysis products of metal alkoxides, and tin chloride, and a water-soluble polymer. A solution containing the mixed solution as a solvent can be used.

The laminated packaging material of the present invention preferably has an antistatic property imparted to the exposed surface on the base film side or the exposed surface on the sealant layer side. Such antistatic properties
For example, use of a so-called polymer alloy type permanent antistatic resin using a hydrophilic resin as a permanent antistatic agent as a material for a base film or a sealant layer, or use antistatic in a resin as a material for a base film or a sealant layer. The composition can be provided by using a composition into which an agent has been kneaded, or by forming an antistatic coat layer on a base film or a sealant layer.

[0013] The laminated packaging material of the present invention may further have an adhesive layer between the metal deposition layer and the sealant layer. Further, a film or a film laminate may be further provided between the metal deposition layer and the sealant layer.

The laminated packaging material of the present invention is usually transparent and has an electrostatic shielding property. These properties are generally such that the thickness of the metallized layer is in the range of 50 to 150 °, the metallized layer is made light-transmitting and its surface resistance is 1.
It can be obtained by setting it to 00Ω or less.

[0015]

Embodiments of the present invention will be described below in detail with reference to the drawings. In each of the drawings, the same components are denoted by the same reference numerals, and redundant description will be omitted.

FIG. 1 is a sectional view schematically showing a laminated packaging material according to a first embodiment of the present invention. The laminated packaging material 1 shown in FIG. 1 has a base film 10, and an antistatic coat layer 20 is formed on one main surface thereof. On the back surface of the base film 10 on which the antistatic coating layer 20 is provided, a ceramic vapor deposition layer 32 and a coating layer 34 constituting the gas barrier layer 30 are sequentially laminated. On the gas barrier layer 30, an extremely thin metal deposition layer 40 is formed, and on this metal deposition layer 40,
A sealant layer 60 having antistatic properties is provided. When the laminated packaging material 1 is used for a package, the sealant layer 60 is arranged so as to be located inside the base film 10.

In the laminated packaging material 1 configured as described above, the base film 10 may be in the form of a sheet or a film. As the base film 10, a plastic film or sheet used for a general packaging material can be used, for example, a polyolefin such as polyethylene or polypropylene, a polyester such as polyethylene terephthalate or polyethylene naphthalate, or nylon-6. And nylon-
66, such as polyamide, polyvinyl chloride, polyimide,
Alternatively, a film or sheet such as a copolymer thereof may be used.

The material and thickness of the base film 10 can be appropriately selected according to the use of the laminated packaging material 1. In particular, as the substrate film 10, a polyethylene terephthalate (hereinafter referred to as PET) film, a nylon film,
And a biaxially stretched polypropylene film are preferably used. The thickness of the base film 10 is 6 to 38 μm.
m is preferable.

In this embodiment, as described above, the antistatic coat layer 20 is provided on the exposed surface of the base film 10. This antistatic coating layer 20 contains an antistatic agent such as ammonium tetrachloride. The antistatic coating layer 20 is formed by, for example, applying a solution containing an antistatic agent such as an ammonium tetrachloride solution to one main surface of the base film 10 and drying the obtained coating film. can do. By providing such an antistatic coat layer 20, it is possible to prevent dust and dirt from adhering to the laminated packaging material 1 due to electrostatic charging.

As described above, in the laminated packaging material 1, the gas barrier layer 30 is composed of the ceramic vapor deposition layer 32 and the coating layer 34. Examples of the material of the ceramic vapor deposition layer 32 include oxides such as silicon, aluminum, titanium, zirconium, and tin, nitrides, fluorides, and metal compounds such as mixtures thereof.

In general, even if the thickness of the ceramic vapor deposition layer 32 is sufficient to obtain gas barrier properties, the ceramic vapor deposition layer 32 does not become opaque. As the material of the ceramic vapor deposition layer 32, a metal oxide is preferably used from the viewpoints of economy and ease of manufacture, and in particular, a transparent metal oxide such as aluminum oxide, silicon oxide or magnesium oxide is used. It is preferred to use

The ceramic deposition layer 32 is formed, for example, by a vacuum deposition method, a sputtering method, or a plasma vapor deposition method (C
VD method) or the like. More specifically, for example, an ordinary physical vapor deposition method in which aluminum oxide, silicon oxide, or the like is heated and evaporated under reduced pressure to deposit on the base film 10 can be used. In addition, a metal such as aluminum is heated and evaporated under reduced pressure containing a small amount of oxygen and the like, and the evaporated metal is reacted with oxygen or the like before, simultaneously with, or immediately after deposition on the base film 10, whereby aluminum oxide is oxidized. A reactive vapor deposition method for depositing an object, silicon oxide, or the like can also be used. Further, a reactive gas such as siloxane is supplied as a raw material gas, and the gas is reacted on the base film 10 to deposit silicon oxide or the like.
A VD (vapor phase deposition) method or the like can also be used. The thickness of the ceramic vapor deposition layer 32 is preferably in the range of 100 ° to 800 ° from the viewpoint of the time required for film formation and gas barrier properties.

The coating layer 34 is obtained by heating and drying a coating film formed by applying a predetermined coating agent on the ceramic vapor deposition layer. When the coating layer 34 is provided, generation of cracks or the like in the ceramic vapor deposition layer 32 due to rubbing or the like can be prevented, and higher and more reliable gas barrier properties can be realized.

The coating agent used to form the coating layer 34 contains, as a solute, at least one selected from the group consisting of metal alkoxides, hydrolysis products of metal alkoxides, and tin chloride, and a water-soluble polymer. And a solution containing water or a mixture of water and an alcohol as a solvent. The coating layer 34 is formed, for example, by applying a solution obtained by dissolving a water-soluble polymer and tin chloride in water or a mixed solvent of water / alcohol onto the ceramic vapor-deposited layer 32, and heating the obtained coating film. It can be formed by drying. Alternatively, the coating layer 34 is prepared by mixing a metal alkoxide or a hydrolysis product thereof with such a solution to prepare a coating agent, applying the coating agent on the ceramic vapor-deposited layer 32, and coating the resulting coating film. It can also be formed by heating and drying.

Examples of the water-soluble polymer contained in the coating agent include water-soluble organic polymers such as polyvinyl alcohol, polyvinylpyrrolidone, starch, methylcellulose, carboxymethylcellulose, and sodium alginate. Among them, the most excellent gas barrier properties can be realized particularly when polyvinyl alcohol is used. Also,
As the water-soluble polymer to be contained in the coating agent, only one of the above-mentioned water-soluble organic polymers may be used, or a plurality of types may be mixed and used.

Examples of the metal alkoxide which can be contained in the coating agent include tetraethoxysilane [Si (OC ₂ H ₅ ) ₄ ] and triisopropoxy aluminum [Al (O-2′-C ₃ H ₇ ) _3]. And the like, and a compound represented by the general formula M (OR) _n . In the above general formula, M is Si, Ti, A
1 and metals such as Zr, where R is CH ₃ and C ₂ H ₅
And n represents the coordination number of an alkoxy group. Among these metal alkoxides, tetraethoxysilane and triisopropoxyaluminum are relatively stable in an aqueous solvent even after hydrolysis, and thus are easy to handle. In addition, these metal alkoxides can be used in combination.

Known additives such as an isocyanate compound, a silane coupling agent, a dispersant, a stabilizer, a viscosity modifier, and a colorant are added to the above-mentioned coating agent within a range that does not impair the gas barrier properties of the gas barrier layer 30. Agents can be added. For example, the isocyanate compound that can be added to the coating agent has two or more isocyanate groups (NCO groups) in the molecule. Examples of such compounds include monomers such as tolylene diisocyanate (TDI), triphenylmethane triisocyanate (TTI), and tetramethylxylene diisocyanate (TMXDI), polymers thereof, and derivatives thereof. be able to.

For the application of the coating agent, conventionally known application methods such as a dipping method, a roll coating method, a screen printing method and a spray method can be used. The thickness of the coating layer 34 thus obtained varies depending on the type of the coating agent to be used, but the thickness after drying is about 0.01 to 100 μm.
It is preferably within the range of m. In general, when the thickness of the coating layer 34 after drying exceeds 50 μm, cracks are likely to occur. Therefore, the thickness of the coating layer 34 after drying is more preferably in the range of 0.01 to 50 μm.

In the laminated packaging material 1, the metal deposition layer 40 can be formed by depositing a metal such as aluminum by a vacuum deposition method. Metal deposition layer 4
The thickness of 0 is preferably set in the range of 50 to 150 °, more preferably in the range of 50 to 100 °. Generally, when the thickness of the metal deposition layer 40 is equal to or more than the above lower limit, an excessively large pinhole is hardly formed, and the surface resistance of the metal deposition layer 40 becomes 100 Ω / □ or less.
In addition to obtaining a sufficient electrostatic shielding property, a higher gas barrier property, in particular, a water vapor barrier property can be realized. In general, when the thickness of the metal deposition layer 40 is equal to or less than the above upper limit, the metal deposition layer 40 transmits light sufficiently. Therefore, in this case, the electronic components and the like stored in the package using the laminated packaging material 1 can be visually confirmed without opening the package.

The adhesive layer 50 contains the same adhesive and anchor coat as those used in general packaging materials. When the sealant layer 60 is a film, the adhesive layer 50 may be formed by dry lamination, sandwich lamination, or the like.
It can be provided for bonding to the base film 10 provided with the above.

In the present embodiment, as the material of the sealant layer 60, a material obtained by kneading an antistatic agent into a resin having heat sealing properties is used. When the antistatic property is given to the sealant layer 60 as described above, it is possible to prevent dust and dirt from adhering to the laminated packaging material 1 due to electrostatic charging.

The resin contained in the sealant layer 60 includes, for example, polyethylene, polypropylene, and ethylene copolymer. As the antistatic agent, for example, nonionic surfactants such as glycerin fatty acid ester and polyethylene glycol fatty acid ester can be used. The amount of the antistatic agent added to the resin having heat sealability is
Usually, it is about 500 to 3000 ppm, preferably about 700 to 2000 ppm.

In the first embodiment described above, the antistatic coating layer 20 is provided on the base film 10 in order to impart antistatic properties to the exposed surface of the base film 10.
As described below, instead of providing the antistatic coat layer 20, an antistatic base film may be used.

FIG. 2 is a sectional view schematically showing a laminated packaging material according to a second embodiment of the present invention. The laminated packaging material 1 shown in FIG. 2 has an antistatic base film 10a, and on one main surface thereof, a ceramic vapor-deposited layer 32 and a coating layer 34 constituting a gas barrier layer 30 are sequentially laminated. . On the gas barrier layer 30, an extremely thin metal deposition layer 40 is formed, and on this metal deposition layer 40, an adhesive layer 5 is formed.
0, the sealant layer 60 and the antistatic coat layer 7
0 are sequentially provided. When such a structure is adopted, the manufacturing process of the laminated packaging material 1 is simplified.

As a material of the base film 10a, an antistatic resin or a material obtained by kneading an antistatic agent into the resin can be used. Examples of the antistatic resin include a polymer alloy type permanent antistatic resin such as a polymethyl methacrylate resin made of a hydrophilic resin having a polyethylene oxide chain as a conductive segment. In addition, the resin into which the antistatic agent is kneaded includes an antistatic agent having heat resistance such as a nonionic surfactant such as a glycerin fatty acid ester or a polyethylene glycol fatty acid ester, including nylon and polyethylene. Examples thereof include those kneaded in a resin at about 0.1 to 3.0%.

In the first and second embodiments, the sealant layer 60 having an antistatic property is used in order to impart an antistatic property to the exposed surface of the sealant layer 60, but the antistatic property is provided. A non-sealant layer may be used, and an antistatic coating layer may be provided on the exposed surface. Again,
It is possible to prevent dust and dust from adhering to the laminated packaging material 1 due to electrostatic charging.

In the first and second embodiments,
Known additives such as an ultraviolet absorber, a plasticizer, a lubricant, and a coloring agent can be appropriately added to the base films 10 and 10a as needed. Further, the surfaces of the base films 10, 10a are subjected to a surface modification treatment such as a corona treatment or an anchor coat treatment, and then a ceramic vapor deposition layer 32 is formed on the surface, whereby the ceramic films are deposited on the base films 10, 10a. Adhesion with the layer 32 can also be improved.

In the first and second embodiments,
A film or a film laminate may be further provided between the metal deposition layer 40 and the sealant layer 50. By appropriately selecting a film or a film laminate interposed between the metal deposition layer 40 and the sealant layer 50, the laminated packaging material 1 having various physical properties can be obtained. For example,
When a biaxially stretched nylon film or the like is interposed between the metal deposition layer 40 and the sealant layer 50, the piercing strength can be improved. In addition, "piercing strength"
This shows the resistance of the laminated packaging material 1 when an article having a sharp tip is pressed. Further, in order to improve physical properties such as heat resistance, rigidity, tensile strength, and tear strength of the laminated packaging material 1, or conversely, to impart flexibility to the laminated packaging material 1, the metal deposition layer 40 and the sealant layer A film such as a polyolefin film such as a polyethylene film or a polypropylene film, a polyester film such as a polycarbonate film, a polyamide film (nylon film), or a polyethylene terephthalate film, or a laminate thereof can be interposed between the film 50 and the film 50.

When the laminated packaging material 1 described above is used as a packaging body for packaging electronic parts and the like, it is formed in a bag shape so that the antistatic coating layer 70 is on the inside, for example. The package thus obtained may be any of a pillow packaging bag, a four-side seal bag, a three-side seal bag, a gusset-like bag, a standing pouch, and the like.

As described above, in the first and second embodiments, the ceramic vapor-deposited layer 32 and the metal vapor-deposited layer 40 are laminated, so that the gas vapor-deposited layer 32 has a higher gas barrier than originally possessed. Properties, especially water vapor barrier properties. In particular, when the coating layer 34 is interposed between the ceramic evaporation layer 32 and the metal evaporation layer 40, the ceramic evaporation layer 32 is protected by the coating layer 34 when the metal evaporation layer 40 is formed. The laminated packaging material 1 having water resistance and water resistance is obtained. For example, oxygen permeability of 2.0 cc / m ² · day · atm or less and water vapor permeability of 2.0 g / m ² · day or less can be realized, as well as 1.0 g / m ² · da.
A water vapor permeability of y or less can be realized.

According to the first and second embodiments,
If the ceramic evaporation layer 32 is transparent, the metal evaporation layer 40
By appropriately setting the film thickness, a transparent laminated packaging material 1 having excellent electrostatic shielding properties and being transparent can be obtained. Therefore, according to the package using the laminated packaging material according to the first and second embodiments, in addition to being able to prevent insulation breakdown of the article due to overcurrent, the article stored without opening the article. Are visible.

Further, in the first and second embodiments, the ceramic vapor deposition layer 32 and the metal vapor deposition layer 40 are not bonded to each other after being formed on separate films. Are sequentially formed on one main surface of the base films 10 and 10a. Therefore, in addition to being able to reduce the number of components, manufacturing on one line is possible, and manufacturing costs can be reduced.

[0043]

Embodiments of the present invention will be described below.

Example 1 The laminated packaging material 1 shown in FIG. 1 was produced by the following method. First, a polyethylene terephthalate (PET) film having a thickness of 12 μm was used as the base film 10, and a ceramic vapor-deposited layer 32 made of aluminum oxide and having a thickness of 400 ° was formed on one main surface by vacuum vapor deposition. Next, the coating liquid prepared by the following method is applied on the ceramic vapor deposition layer 32 using a bar coater, and the obtained coating film is dried at 120 ° C. for 1 minute to form a coating having a thickness of about 0.5 μm. Layer 34 was formed.

The coating liquid for the coating layer was prepared by adding 10.6 g of tetraethoxysilane [Si (OC ₂ H ₅ ) ₄ ] to which 89.6 g of 0.1N hydrochloric acid was added for 30 minutes to effect hydrolysis. 3 wt% (S
It is obtained by mixing a hydrolysis solution A (in terms of iO ₂ ) and a water / isopropyl alcohol (90/10) solution B containing polyvinyl alcohol at a concentration of 3.0 wt%.

Next, 1% by weight of ammonium tetrachloride was applied to the back of the surface of the substrate 10 on which the ceramic vapor deposition layer 32 was formed.
Was applied and dried with a coating weight of 5 g / m ² to form an antistatic coating layer 20.

Subsequently, a 50 ° -thick metal deposition layer 40 made of aluminum is formed on the coating layer 34 by a vacuum deposition method.
Was formed. Next, ADMER AD98 which is an anchor coating agent manufactured by Toyo Morton Co., Ltd.
A low-density polyethylene resin containing a nonionic surfactant at a concentration of 1500 ppm is extruded to a thickness of 50 μm and laminated through an adhesive layer 50 made of No. 0 (trade name) to form a sealant layer having an antistatic property. 60 were formed. As described above, the laminated packaging material 1 shown in FIG.
I got

The oxygen permeability and the water vapor permeability of the thus obtained laminated packaging material 1 were measured by a Mocon method. As a result, the oxygen permeability is 0.1 cc / m ² · day
Atm (30 ° C., 70% RH) and water vapor permeability was 0.5 g / m ² · day (40 ° C., 90% RH). The surface resistance of the laminated packaging material 1 is 9 × 10 ¹² Ω / □ on the exposed surface on the antistatic coat layer 20 side,
It was 8 × 10 ¹⁰ Ω / □ on the exposed surface on the sealant layer 60 side.

Next, the IC was housed inside a package formed using the laminated packaging material 1 obtained by the above method, and a storage test was performed. As a result, according to the package formed using the laminated packaging material 1, the IC was not destroyed by static electricity or the like, and no problem such as corrosion by water vapor occurred. In addition, according to the package formed using the laminated packaging material 1, the internal IC could be visually recognized without opening the IC.

Example 2 FIG. 3 is a sectional view schematically showing a laminated packaging material according to Example 2 of the present invention. In this example, FIG.
Was produced by the method described below.

First, a polyethylene terephthalate (PET) film having a thickness of 12 μm was used as the base film 10, and a film having a thickness of 400 μm was formed on one main surface thereof by vacuum evaporation.
A ceramic vapor deposition layer 32 made of aluminum oxide was formed. Next, a coating liquid having the same composition as that used in Example 1 was applied on the ceramic vapor-deposited layer 32 using a bar coater, and the obtained coating film was dried at 120 ° C. for 1 minute to obtain a thickness. A coating layer 34 of about 0.5 μm was formed.

Next, 1% by weight of ammonium tetrachloride was applied to the back of the surface of the substrate 10 on which the ceramic vapor deposition layer 32 was formed.
Was applied and dried with a coating weight of 5 g / m ² to form an antistatic coating layer 20.

Subsequently, on the coating layer 34, a metal deposition layer 4 made of aluminum and having a thickness of 100.degree.
0 was formed. Next, an adhesive layer 70 was formed on the metal deposition layer 40 by a gravure method, and a 15 μm-thick stretched nylon film 80 was laminated by a dry lamination method.

Further, on the stretched nylon film 80,
Adomer A, an anchor coating agent manufactured by Toyo Morton Co., Ltd.
A low-density polyethylene resin containing a nonionic surfactant at a concentration of 1500 ppm is extruded to a thickness of 50 μm through an adhesive layer 50 made of D980 (trade name) to form a sealant layer having an antistatic property. 6
0 was formed. As described above, the laminated packaging material 1 shown in FIG. 3 was obtained.

The oxygen permeability and the water vapor permeability of the thus obtained laminated packaging material 1 were measured by a Mocon method. As a result, the oxygen permeability is 0.1 cc / m ² · day
Atm (30 ° C., 70% RH) and water vapor permeability was 0.5 g / m ² · day (40 ° C., 90% RH).

Next, the IC was housed inside a package formed using the laminated packaging material 1 obtained by the above method, and a storage test was performed. As a result, according to the package formed using the laminated packaging material 1, the IC was not destroyed by static electricity or the like, and no problem such as corrosion by water vapor occurred. In addition, according to the package formed using the laminated packaging material 1, the internal IC could be visually recognized without opening the IC.

(Example 3) The thickness of the metal deposition layer 40 is set to 150 °
The laminated packaging material 1 shown in FIG. 1 was produced in the same manner as described in Example 1 except that The oxygen permeability and water vapor permeability of the thus obtained laminated packaging material 1 were measured by a Mocon method. As a result, the oxygen permeability was 0.1 cc / m ² · day · atm (30 ° C., 70%
RH), and the water vapor permeability is 0.4 g / m ² · day
(40 ° C., 90% RH).

Next, the IC was accommodated inside a package formed using the laminated packaging material 1 obtained by the above method, and a storage test was performed. As a result, according to the package formed using the laminated packaging material 1, the IC was not destroyed by static electricity or the like, and no problem such as corrosion by water vapor occurred. In addition, according to the package formed using the laminated packaging material 1, the internal IC could be visually recognized without opening the IC.

Example 4 A laminated packaging material 1 shown in FIG. 1 was produced in the same manner as described in Example 1 except that the metal deposition layer 40 was not provided. The oxygen permeability and water vapor permeability of the thus obtained laminated packaging material 1 were measured by a Mocon method. As a result, the oxygen permeability is 0.1 c.
c / m ² · day · atm (30 ° C., 70% RH), and the water vapor permeability is 1.0 g / m ² · day (40 ° C.,
90% RH).

Next, the IC was housed inside a package formed using the laminated packaging material 1 obtained by the above method, and a storage test was performed. As a result, it was confirmed that according to the package formed using the laminated packaging material 1, although the internal IC could be visually recognized without opening the IC, the electrostatic shielding property was insufficient. .

Example 5 FIG. 4 is a sectional view schematically showing a conventional laminated packaging material. In this example, the laminated packaging material 1 shown in FIG. 4 was produced by the method described below.

First, a polyethylene terephthalate (PET) film having a thickness of 12 μm was used as the base film 10, and a film thickness of 400 μm was formed on one main surface thereof by a vacuum evaporation method.
A ceramic vapor deposition layer 32 made of aluminum oxide was formed. Next, a coating liquid having the same composition as that used in Example 1 was applied on the ceramic vapor-deposited layer 32 using a bar coater, and the obtained coating film was dried at 120 ° C. for 1 minute to obtain a thickness. A coating layer 34 of about 0.5 μm was formed.

Next, 1% by weight of ammonium tetrachloride was added to the back of the surface of the substrate 10 on which the ceramic vapor deposition layer 32 was formed.
Was applied and dried with a coating weight of 5 g / m ² to form an antistatic coating layer 20. As described above, a first laminate 111 including the base film 10, the ceramic deposition layer 32, the coating layer 34, and the antistatic coat layer 20 was obtained.

Next, polyethylene terephthalate (P
ET) A metal vapor-deposited layer 4 made of aluminum and having a thickness of 100 °
0 was formed. As described above, the PET film 90
A second laminate 112 composed of and a metal deposition layer 40 was obtained.

The laminate 111 and the laminate 112 obtained in this manner were bonded by a dry lamination method via the adhesive layer 70 such that the covering layer 34 and the PET film 90 faced each other. Furthermore, the metal deposition layer 4
A low-density polyethylene resin containing a nonionic surfactant at a concentration of 1500 ppm through an adhesive layer 50 made of Admer AD980 (trade name) which is an anchor coating agent manufactured by Toyo Morton Co., Ltd. By extruding and laminating, a sealant layer 60 having antistatic properties was formed. As described above, the laminated packaging material 1 shown in FIG. 4 was obtained.

The oxygen permeability and the water vapor permeability of the thus obtained laminated packaging material 1 were measured by the Mocon method. As a result, the oxygen permeability was 0.3 cc / m ² · day.
Atm (30 ° C., 70% RH), and water vapor permeability was 0.8 g / m ² · day (40 ° C., 90% RH).

Next, the IC was housed inside a package formed using the laminated packaging material 1 obtained by the above method, and a storage test was performed. As a result, according to the package formed using the laminated packaging material 1, the IC was not destroyed by static electricity or the like, and no problem such as corrosion by water vapor occurred. However, in this example, as described above, the manufacturing process was complicated.

(Example 6) The laminated packaging material 1 shown in FIG. 1 was prepared in the same manner as described in Example 1 except that the thickness of the metal deposition layer 40 was changed to 100 ° without forming the coating layer 34. Produced. The oxygen permeability and water vapor permeability of the thus obtained laminated packaging material 1 were measured by a Mocon method.
As a result, the oxygen permeability was 0.5 cc / m ² · day · a.
tm (30 ° C., 70% RH), and the water vapor permeability was 1.3 g / m ² · day (40 ° C., 90% RH).

Next, the IC was accommodated inside a package formed using the laminated packaging material 1 obtained by the above method, and a storage test was performed. As a result, according to the package formed using the laminated packaging material 1, the IC was not destroyed by static electricity or the like, and no problem such as corrosion by water vapor occurred. In addition, according to the package formed using the laminated packaging material 1, the internal IC could be visually recognized without opening the IC.

(Example 7) A method similar to that described in Example 1 except that the thickness of the metal deposition layer 40 was set to 30 °,
The laminated packaging material 1 shown in FIG. 1 was produced. The oxygen permeability and water vapor permeability of the thus obtained laminated packaging material 1 were measured by a Mocon method. As a result, the oxygen permeability was 0.2 cc / m ² · day · atm (30 ° C., 70% R
H), and the water vapor transmission rate is 0.6 g / m ² · day.
(40 ° C., 90% RH).

Next, the IC was housed inside a package formed using the laminated packaging material 1 obtained by the above method, and a storage test was performed. As a result, it was confirmed that according to the package formed using the laminated packaging material 1, although the internal IC could be visually recognized without opening the IC, the electrostatic shielding property was insufficient. .

(Example 8) The thickness of the metal deposition layer 40 was set to 250 °
The laminated packaging material 1 shown in FIG. 1 was produced in the same manner as described in Example 1 except that The oxygen permeability and water vapor permeability of the thus obtained laminated packaging material 1 were measured by a Mocon method. As a result, the oxygen permeability was 0.1 cc / m ² · day · atm (30 ° C., 70%
RH), and the water vapor permeability is 0.3 g / m ² · day
(40 ° C., 90% RH).

Next, the IC was housed inside a package formed using the laminated packaging material 1 obtained by the above method, and a storage test was performed. As a result, according to the package formed using the laminated packaging material 1, although the electrostatic shielding property was sufficient, it was difficult to visually recognize the internal IC without opening it.

The above results are summarized in the following table.

[0075]

[Table 1]

A comparison between Example 1 and Example 4 shows that the metal deposition layer 4
It can be seen that 0 plays a role not only to provide an electrostatic shielding property but also to improve a gas barrier property, particularly, a water vapor barrier property. Also, as is apparent from a comparison between Example 1 and Example 2, in order to improve puncture resistance and the like,
The film 8 between the metal deposition layer 40 and the sealant layer 60
Even if 0 is interposed, the gas barrier property and the like are not adversely affected. Furthermore, as is clear from the comparison between Examples 1 and 3 and Examples 7 and 8, the thickness of the metal deposition layer 40 is 50 to 15 mm.
Within the range of 0 °, both sufficient electrostatic shielding properties and good visibility can be realized. Further, as is apparent from the comparison between Example 1 and Example 6, the provision of the coating layer 34 greatly improves the gas barrier properties.

As is clear from the comparison between Example 1 and Example 5, the laminated packaging material 1 of Example 1 has a small number of components and a small thickness of the metal vapor-deposited layer 40. And realizes a higher gas barrier property than the laminated packaging material 1. This is because the metal deposition layer 40 is replaced with the ceramic deposition layer 3.
2, the manufacturing process can be simplified, and a much higher gas barrier property can be realized as compared with the case where the film having the metal deposition layer 40 and the film having the ceramic deposition layer 32 are bonded to each other. It indicates that there is.

[0078]

As described above, in the present invention, a metal vapor deposition layer is formed on a ceramic vapor deposition layer, so that a higher gas barrier property than originally possessed by the ceramic vapor deposition layer can be obtained. . In the present invention, high electrostatic shielding properties can be realized by appropriately setting the thickness of the metal deposition layer. Further, in the present invention, since the ceramic vapor deposition layer and the metal vapor deposition layer are sequentially formed on one main surface of the base film, in addition to being able to reduce the number of constituent elements, it becomes possible to manufacture in one line. In addition, the manufacturing cost can be reduced.

That is, according to the present invention, there is provided a laminated packaging material which is suitable for use in packaging electronic parts and the like, has excellent electrostatic shielding properties and gas barrier properties, and can be produced at low cost.

[Brief description of the drawings]

FIG. 1 is a sectional view schematically showing a laminated packaging material according to a first embodiment of the present invention.

FIG. 2 is a sectional view schematically showing a laminated packaging material according to a second embodiment of the present invention.

FIG. 3 is a sectional view schematically showing a laminated packaging material according to Example 2 of the present invention.

FIG. 4 is a sectional view schematically showing a conventional laminated packaging material.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Laminated packaging material 10,10a ... Base film 20 ... Antistatic coating layer 30 ... Gas barrier layer 32 ... Ceramic vapor deposition layer 34 ... Coating layer 40 ... Metal vapor deposition layer 50,70 ... Adhesive layer 60 ... Sealant layer 80,90 ... Film 111, 112… Laminate

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) // C23C 14/06 C23C 14/06 N 14/20 14/20 A (72) Inventor Nobuhiko Imai Tokyo 1-5-1, Taito-ku, Taito-ku Letterpress Printing Co., Ltd. F-term (reference) 3E086 BA04 BA13 BA24 BB01 BB35 CA31 4F100 AA05E AA19 AB01C AB10 AD00B AH06 AH08E AK01E AK06 AK42 AR00D AR00E AT00A AT00E BA04 BA05 BA05 BA05 BA00 EH66C GB15 JB09E JD02 JG03E JL12D 4K029 AA11 AA25 BA03 BA44 BB02 BC00 BC03 BD00 CA01

Claims (7)

[Claims] 1. A base film, a ceramic deposition layer formed on one main surface of the base film, a metal deposition layer formed on the ceramic deposition layer, and a metal deposition layer provided on the metal deposition layer. A laminated packaging material comprising a heat sealable sealant layer. 2. The method according to claim 1, further comprising a coating layer obtained by heating and drying a coating film formed by applying a coating agent on the ceramic vapor deposition layer, between the ceramic vapor deposition layer and the metal vapor deposition layer, The coating agent contains, as a solute, at least one selected from the group consisting of metal alkoxides, hydrolysis products of metal alkoxides, and tin chloride, and a water-soluble polymer, and uses water or a mixture of water and an alcohol as a solvent. The laminated packaging material according to claim 1, wherein the solution is a solution containing 3. The laminated packaging material according to claim 1, wherein an antistatic property is imparted to the exposed surface on the base film side. 4. The laminated packaging material according to claim 1, wherein the exposed surface on the sealant layer side is provided with an antistatic property. 5. The method according to claim 1, further comprising an adhesive layer between the metal deposition layer and the sealant layer.
The laminated packaging material according to any one of claims 4 to 4. 6. The laminated packaging material according to claim 1, further comprising a film or a film laminate between the metal deposition layer and the sealant layer. 7. The thickness of the metal deposition layer is 50 to 150.
The laminated packaging material according to any one of claims 1 to 6, wherein the thickness is within the range of (6).