JP2002052455A - ワイヤソーの加工液溜り槽 - Google Patents
ワイヤソーの加工液溜り槽Info
- Publication number
- JP2002052455A JP2002052455A JP2000241444A JP2000241444A JP2002052455A JP 2002052455 A JP2002052455 A JP 2002052455A JP 2000241444 A JP2000241444 A JP 2000241444A JP 2000241444 A JP2000241444 A JP 2000241444A JP 2002052455 A JP2002052455 A JP 2002052455A
- Authority
- JP
- Japan
- Prior art keywords
- working fluid
- wire
- workpiece
- wire saw
- processing liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012530 fluid Substances 0.000 title claims abstract description 79
- 238000005520 cutting process Methods 0.000 claims abstract description 18
- 239000007788 liquid Substances 0.000 claims description 41
- 239000011521 glass Substances 0.000 claims description 23
- 238000003860 storage Methods 0.000 claims description 10
- 238000003754 machining Methods 0.000 description 29
- 239000000463 material Substances 0.000 description 7
- 239000006061 abrasive grain Substances 0.000 description 6
- 239000002002 slurry Substances 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 244000126211 Hericium coralloides Species 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000241444A JP2002052455A (ja) | 2000-08-09 | 2000-08-09 | ワイヤソーの加工液溜り槽 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000241444A JP2002052455A (ja) | 2000-08-09 | 2000-08-09 | ワイヤソーの加工液溜り槽 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002052455A true JP2002052455A (ja) | 2002-02-19 |
| JP2002052455A5 JP2002052455A5 (enExample) | 2004-11-11 |
Family
ID=18732628
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000241444A Pending JP2002052455A (ja) | 2000-08-09 | 2000-08-09 | ワイヤソーの加工液溜り槽 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002052455A (enExample) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007054913A (ja) * | 2005-08-24 | 2007-03-08 | Denso Corp | ワイヤソー加工装置及びワイヤソーによる加工方法 |
| JP2007301687A (ja) * | 2006-05-12 | 2007-11-22 | Naoetsu Electronics Co Ltd | ワーク切断装置 |
| KR100902626B1 (ko) | 2006-12-20 | 2009-06-15 | 실트로닉 아게 | 공작물의 쏘잉 방법 및 장치 |
| US20130043218A1 (en) * | 2011-08-19 | 2013-02-21 | Apple Inc. | Multi-wire cutting for efficient magnet machining |
-
2000
- 2000-08-09 JP JP2000241444A patent/JP2002052455A/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007054913A (ja) * | 2005-08-24 | 2007-03-08 | Denso Corp | ワイヤソー加工装置及びワイヤソーによる加工方法 |
| JP2007301687A (ja) * | 2006-05-12 | 2007-11-22 | Naoetsu Electronics Co Ltd | ワーク切断装置 |
| KR100902626B1 (ko) | 2006-12-20 | 2009-06-15 | 실트로닉 아게 | 공작물의 쏘잉 방법 및 장치 |
| US20130043218A1 (en) * | 2011-08-19 | 2013-02-21 | Apple Inc. | Multi-wire cutting for efficient magnet machining |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20051215 |
|
| A131 | Notification of reasons for refusal |
Effective date: 20051221 Free format text: JAPANESE INTERMEDIATE CODE: A131 |
|
| A02 | Decision of refusal |
Effective date: 20060412 Free format text: JAPANESE INTERMEDIATE CODE: A02 |